CN1477704A - 弹性导电树脂及电子装置 - Google Patents
弹性导电树脂及电子装置 Download PDFInfo
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- CN1477704A CN1477704A CNA03178433XA CN03178433A CN1477704A CN 1477704 A CN1477704 A CN 1477704A CN A03178433X A CNA03178433X A CN A03178433XA CN 03178433 A CN03178433 A CN 03178433A CN 1477704 A CN1477704 A CN 1477704A
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Abstract
本发明涉及弹性导电树脂及电子装置。本发明的弹性导电树脂含有具有橡胶状弹性的树脂,以及针状导电充填物,用Au,Ag,Ni,Cu中之一包覆该针状充填物的表层。针状充填物的芯材可以是晶须。容易制作直径小、形状纵横比大的导电充填物,能实现弹性导电树脂的微细化。既能保持树脂的高弹性,且能以少的导电充填物含有量赋与树脂良好的导电性。本发明的电子装置通过使得弹性导电体形成为凸块状,对压缩力具有大的变形能力,且具有良好的导电性,使得该弹性导电凸块与电极机械接触,在预定变形量条件下,能降低加压力,因此,能扩大凸块高度偏差的允许范围。
Description
技术领域
本发明涉及弹性导电树脂以及包含该弹性导电树脂的电子装置,能用于电子元件组装,机械接触式连接器等。
背景技术
本发明所说的弹性树脂是指弹性率低、对外力发生变形、但具有回复力的树脂,例如,硅树脂,弹性率最好为10Mpa以下。本发明所说的弹性导电树脂是指对上述弹性树脂附加高的导电性。
作为弹性导电树脂的先有技术可以列举特开平10-242616号公报中记载的技术。其不用向电路衬底(substrate)与集成电路芯片的间隙充填密封树脂,而能得到连接部的高可靠性,如图12所示,凸块形连接座2设在集成电路封装件1的下部,导电性粘接剂3连接上述凸块形连接座2和导电性弹性树脂凸块4,上述导电性弹性树脂凸块4为在集成电路中形成在无引线接合用元件的电极部的突起电极。导电性弹性树脂凸块4是将施以镀金的180~200μm的铜粉等导电性粉体(填料)混入硅树脂中形成,硅树脂与导电性粉体的混合比(体积比)为2∶1,该导电性弹性树脂凸块4吸收热变形或机械变形所引起的应力。电路衬底5设有元件安装座6,与导电性弹性树脂凸块4电连接。
另外,还可以列举特开平10-256304号公报中记载的技术,参照图13所示,具有橡胶状弹性的导电性粘接剂硬化后,在冷却同时,半导体集成电路芯片11与绝缘板12之间存在热膨胀率差,该热膨胀率差使得导电性粘接剂15中产生剪切应力。在该特开平10-256304号公报中记载的技术使得导电性粘接剂15缓和该剪切应力,不产生剥离或粘接剂层破坏,导电性粘接剂15的树脂成份不会妨害因使用硬化收缩大的密封树脂16而发生的纵方向的应力,突起电极13和衬底电极14通过导电性粘接剂15的导电粒子被压接,能得到良好的电连接。
以往,在集成电路组装中,一般进行软钎焊接合。但是,由于集成电路芯片与配线衬底的热膨胀系数差别大,温度变化场合,在连接部发生应力。因此,为了防止连接部发生断开等异常,实行用树脂加以强化。对于近年来发展很快的多针极化、大型化的封装,如上述特开平10-256304号公报中记载的技术,使用具有橡胶状弹性的导电性粘接剂连接。该技术确实能提高连接可靠性,但是,由于导电性粘接剂的功能不充分,需要通过密封树脂强化。
上述特开平10-242616号公报中记载的组装结构将弹性导电树脂形成凸块状,通过对其压接,确保电连接,但是,其是将施以镀金的铜粉混入硅类树脂中形成,为了使得与形成为区域阵列状的弹性率高的电极实现电连接,需要高的压接力,再有,若不能使得凸块高度精确地一致,则对各凸块不能施加均等的压接力,存在全电极连接稳定可靠性差的问题。
现有的弹性导电树脂在具有橡胶状弹性的硅树脂中含有球状导电粒子,或者薄片状导电充填物,为了使用球状导电粒子及薄片状导电充填物,确保高导电性,需要提高充填物配合量,由于充填物而硬化,因此,不能充分利用硅树脂的橡胶弹性特性。当通过弹性导电凸块以机械接触实现电接合场合,需要以大的重量进行压接的结构,再有,需要以高精度控制上述凸块高度的偏差。
发明内容
本发明就是为解决上述先有技术所存在的问题而提出来的,本发明的目的在于,提供对压力变形能力高、且导电性高的弹性导电树脂以及包含该弹性导电树脂的电子装置。
为此,本发明的具体课题如下:
本发明的第一课题在于,通过使用高宽比(纵横比)大的充填物,降低用于得到高导电性的充填物含有量,且高导电性树脂富有弹性。
本发明的第二课题在于,降低导电充填物的比重,防止因橡胶状弹性树脂中的充填物沉淀而引起的充填物分布不均一。
本发明的第三课题在于,提供容易更换电子元件的机械接触式的接合结构,能降低与对向电极机械接触时的加压力,同时,能扩大凸块高度偏差的允许范围。
本发明的第四课题在于,即使在与弹性导电凸块机械接触实现电连接的电极表面有氧化膜或污脏,也能确保稳定的接触电阻。
本发明的第五课题在于,通过使得凸块形状为易压缩变形的形状,能进一步扩大凸块高度偏差的允许范围。
本发明的第六课题在于,通过生产效率高的网板印刷方法,能形成具有低电阻、高弹性的凸块。
本发明的第七课题在于,提供容易处理的弹性导电凸块,以及能实现低成本的制作方法。
本发明的第八课题在于,能在低温、短时间条件下形成弹性导电凸块。
为了实现上述目的,本发明提出以下方案:
(1)一种弹性导电树脂,其特征在于,包括:
具有橡胶状弹性的树脂;
针状导电充填物,用Au,Ag,Ni,Cu中之一包覆该针状充填物的表层。
上述“针状导电充填物”具有以下特征:大致为纤维状,在树脂中形成三维网眼结构,充填物间接触。
如上所述,为针状导电充填物,用Au,Ag,Ni,Cu中之一包覆该针状充填物的表层,其形状纵横比大,因此,对树脂弹性变形的束缚力小,能保持树脂的高弹性,且能以少的导电充填物含有量赋与树脂良好的导电性,能降低导电充填物含有量。
因此,混有少量针状充填物的弹性导电树脂是富有弹性且具有稳定的良好导电性的弹性导电树脂。
(2)在上述(1)的弹性导电树脂中,上述针状充填物的芯材是晶须。
由于针状充填物的芯材是晶须,容易制作直径小、形状纵横比大的导电充填物,因此,能实现弹性导电树脂的微细化。
(3)在上述(2)的弹性导电树脂中,上述针状充填物的芯材是高分子晶须。
作为高分子晶须可以例如具有0.5μm~2.0μm范围的直径,10μm~100μm范围的长度,5~200范围的纵横比(在此为:长度/直径)。作为合适的高分子晶须的材料可以列举poly(p-oxybenzoyl)以及poly(2-oxy-6-naphthoyl)。
由于充填物的芯材使用高分子晶须,导电充填物的比重小,因此,在橡胶状弹性树脂中导电充填物分散沉淀倾向小,在弹性导电体内导电充填物分布均等。这样,不会因导电充填物分布偏所引起的体积电阻率的不稳定,能使体积电阻率稳定化。
(4)在上述(1)-(3)中任一个所述的弹性导电树脂中,上述具有橡胶状弹性的树脂是硅树脂,其具有紫外线硬化性及湿气硬化性。
因此,能缩短硬化时间,且接合时不需要加热,对于不允许加热的电子元件,也能安全、容易地形成弹性导电凸块。
(5)一种电子装置,包括:
一电子元件,至少包括一个第一电极;
一衬底,至少包括一个第二电极;
至少一个凸块,至少形成在一个第一电极上,由弹性导电树脂形成,该弹性导电树脂为上述(1)-(4)中任一项所述的弹性导电树脂;
其中,通过机械连接上述至少一个凸块和至少一个第二电极,上述至少一个第一电极和至少一个第二电极实现电连接。
(6)一种电子装置,包括:
一电子元件,至少包括一个第一电极;
一衬底,至少包括一个第二电极;
至少一个凸块,至少形成在一个第二电极上,由弹性导电树脂形成,该弹性导电树脂为上述(1)-(4)中任一项所述的弹性导电树脂;
其中,通过机械连接上述至少一个凸块和至少一个第一电极,上述至少一个第一电极和至少一个第二电极实现电连接。
(7)一种电子装置,包括:
一电子元件,至少包括一个第一电极;
一衬底,至少包括一个第二电极;
至少一个第一凸块,至少形成在一个第一电极上,至少一个第二凸块,至少形成在一个第二电极上,上述第一和第二凸块由弹性导电树脂形成,该弹性导电树脂为上述(1)-(4)中任一项所述的弹性导电树脂;
其中,通过机械连接上述至少一个第一凸块和至少一个第二凸块,上述至少一个第一电极和至少一个第二电极实现电连接。
通过使得弹性导电体形成为凸块状,对压缩力具有大的变形能力,且具有良好的导电性,使得该弹性导电凸块与电极机械接触,在预定变形量条件下,能降低加压力,因此,能扩大凸块高度偏差的允许范围。
(8)一种电子装置,包括:
一电子元件,至少包括一个第一电极;
一衬底,至少包括一个第二电极;
至少一个凸块,至少形成在一个第一电极上,由弹性导电树脂形成,该弹性导电树脂包括具有橡胶状弹性的树脂,以及四脚形氧化锌充填物,用Au,Ag,Ni,Cu中之一包覆该四脚形氧化锌充填物的表层;
其中,通过机械连接上述至少一个凸块和至少一个第二电极,上述至少一个第一电极和至少一个第二电极实现电连接。
(9)一种电子装置,包括:
一电子元件,至少包括一个第一电极;
一衬底,至少包括一个第二电极;
至少一个凸块,至少形成在一个第二电极上,由弹性导电树脂形成,该弹性导电树脂包括具有橡胶状弹性的树脂,以及四脚形氧化锌充填物,用Au,Ag,Ni,Cu中之一包覆该四脚形氧化锌充填物的表层;
其中,通过机械连接上述至少一个凸块和至少一个第一电极,上述至少一个第一电极和至少一个第二电极实现电连接。
针状导电充填物突出到弹性导电凸块表面,即使对向电极表面有氧化膜或污脏,也能可靠地使得导电充填物与对向电极表面接触,能确保接合部的稳定接触电阻。
(10)一种电子装置,包括:
一电子元件,至少包括一个第一电极;
一衬底,至少包括一个第二电极;
至少一个第一凸块,至少形成在一个第一电极上,至少一个第二凸块,至少形成在一个第二电极上,上述第一和第二凸块由弹性导电树脂形成,该弹性导电树脂包括具有橡胶状弹性的树脂,以及四脚形氧化锌充填物,用Au,Ag,Ni,Cu中之一包覆该四脚形氧化锌充填物的表层;
其中,通过机械连接上述至少一个第一凸块和至少一个第二凸块,上述至少一个第一电极和至少一个第二电极实现电连接。
(11)在上述(5)-(10)中任一个所述的电子装置中,上述凸块朝着顶端逐渐变小,凸块高宽比为0.1~1.0范围。
由于上述凸块朝着顶端逐渐变小,凸块高宽比为0.1~1.0范围,因此,接合时,对施加在弹性导电凸块上的压缩应力,具有大的变形能力。能进一步降低与电极机械接触时的加压力,能进一步扩大凸块高度偏差的允许范围。
(12)在上述(5)-(10)中任一个所述的电子装置,在上述弹性导电树脂中,具有橡胶状弹性的树脂是硅树脂,其具有紫外线硬化性及湿气硬化性。
因此,能缩短硬化时间,且接合时不需要加热,对于不允许加热的电子元件,也能使用弹性导电凸块实现电连接。
(13)一种连接元件,包括:
一弹性导电元件,由弹性导电树脂形成,该弹性导电树脂包括橡胶状弹性树脂以及针状导电充填物;
一金属箔,设于上述弹性导电元件上。
通过在包含橡胶状弹性树脂及针状导电充填物的弹性导电树脂上设置金属箔,形成连接元件,因此,能通过生产效率高的网板印刷工序及加热回流焊接工序,以低成本形成低电阻,高弹性的碗形凸块作为一个元件,能将其附设在所定结构体上。能在不能直接形成弹性导电凸块的例如三维结构体上形成弹性导电凸块。
(14)一种电子元件,用于电子装置,该电子元件包括:
至少一个电极;
至少一个凸块,至少形成在一个电极上,由弹性导电树脂形成,该弹性导电树脂为上述(1)-(4)中任一项所述的弹性导电树脂。
(15)一种衬底,用于电子装置,该衬底包括:
至少一个电极;
至少一个凸块,至少形成在一个电极上,由弹性导电树脂形成,该弹性导电树脂为上述(1)-(4)中任一项所述的弹性导电树脂。
(16)一种凸块形成方法,用于在电子元件或衬底的电极上形成凸块,该凸块形成方法包括:
在电极上网板印刷导电糊,该导电糊含有热硬化性硅树脂,稀释剂,及针状导电充填物;
以比完全硬化温度低的温度热硬化上述导电糊,使稀释剂消散;
热硬化上述导电糊,直到上述导电糊温度达到完全硬化温度。
(17)一种连接元件形成方法,该连接元件包括弹性导电元件及金属箔,上述弹性导电元件由弹性导电树脂形成,该弹性导电树脂包括橡胶状弹性树脂以及针状导电充填物,上述金属箔设于上述弹性导电元件上,该连接元件形成方法包括:
在金属箔上以预定厚度涂布弹性导电树脂;
硬化该弹性导电树脂;
切割上述已硬化的弹性导电树脂和金属箔。
附图说明
图1是表示导电充填物的配合比与弹性导电树脂的体积电阻率关系的图线;
图2是表示导电充填物的配合比与弹性导电树脂的橡胶硬度关系的图线;
图3是经放大后模式表示弹性导电凸块的接合结构的截面图;
图4是表示弹性导电凸块的反复压缩变形特性的图线;
图5是表示针状充填物配合比与弹性导电树脂的反复变形量关系的图线;
图6是表示针状充填物配合比与弹性导电树脂的接触电阻关系的图线;
图7是经放大后模式表示弹性导电凸块的正面图;
图8A表示碗状弹性导电凸块的实施例,图8B表示弹性导电凸块形成方法一例;
图9表示圆锥形弹性导电凸块的实施例;
图10表示带金属箔的弹性导电体的实施例,其中,图10A表示金属箔附着在碗形弹性导电凸块上的连接结构图,图10B表示通过湿性硬化方法形成的带金属箔的弹性导电凸块,图10C表示将图10A的结构通过焊锡连接到电极;
图11模式表示带金属箔的弹性导电体的制作方法;
图12表示以往技术一例的截面图;
图13表示以往技术另一例的截面图。
具体实施方式
下面,参照附图详细说明本发明的实施例。
第一实施例
图1表示导电充填物(filler)的配合比与弹性导电树脂的体积电阻率关系的图线,图2表示导电充填物的配合比与弹性导电树脂的橡胶硬度关系的图线。硅树脂是一种橡胶状弹性树脂,使得针状(acicular)导电充填物或薄片状(flake)导电充填物含在上述硅树脂中,构成导电性橡胶状弹性树脂,在本实施例中使用的硅树脂为加热硬化型,橡胶硬度为28,上述体积电阻率和橡胶硬度系根据日本工业标准JIS A。通过对无机化合物晶须(whisker)施以镀Ag加工,所得材料作为针状导电充填物,该针状导电充填物直径约为0.5μm,长度约为20μm。薄片状导电充填物直径约为10μm~20μm。上述针状导电充填物或薄片状导电充填物被混合,并分散在上述硅树脂中。
使得针状导电充填物混入橡胶状弹性树脂中,进行混炼,使其充分分散,如图1所示,含有针状导电充填物的橡胶状弹性树脂与含有薄片状充填物场合相比,具有高导电性。且如图2所示,能降低橡胶硬度。
在本实施例中,导电充填物的配合比为40~80wt%,更好的是,60~75wt%,这是用重量百分比表示例,说到导电充填物的配合比以重量百分比表示为好,但也可以用体积百分比表示,若用体积百分比表示,则上述范围为10~40bol%,更好的是,15~30bol%。
第二实施例
图3是经放大后模式表示弹性导电凸块的接合结构的截面图,上述导电性橡胶状弹性树脂形成凸块状,通过机械接触,形成电子元件与衬底电连接的接合结构。
该导电性橡胶状弹性树脂形成的凸块状物,如上述图1和图2所示,对压缩力的变形能力高,能确保高导电性,即使在多个形成区域阵列状的电极接合中,也能以低加重确保稳定接触,因此,能简化用于将已形成上述凸块的电子元件压接保持在衬底上的保持结构。
用该导电性橡胶状弹性树脂形成凸块直径0.5mm,凸块高0.15mm的凸块状,对一个这样的弹性导电凸块,用直径0.5mm的压头座,加重9.8~490mN,反复加重,评价其压缩变形特性及接触电阻。图4表示添加40wt%针状充填物时弹性导电凸块的反复压缩变形特性,图5表示这种场合的针状充填物混合比(wt%)与反复变形量关系。从图4和图5可知,对于反复压缩,变形量稳定,大致为弹性变形。
图6表示对于Au电极加重490mN,推压该弹性导电凸块时,接触电阻与针状充填物混合比(wt%)的关系。
从上述评价结果可知,以低加重变形,即使反复压缩,也能保持稳定的弹性变形特性,且接触电阻也较低。
关于针状导电充填物的配合比,参照上述评价结果,可以根据所要求的弹性变形量及接触电阻值适当选择。
该弹性导电凸块是机械接触式的导通部件,形成弹性导电凸块的电子元件能简单地卸下或装上。因此,能再利用电子元件。
第三实施例
图7表示弹性导电树脂形成凸块状一例,在具有橡胶状弹性的树脂中含有四脚形导电充填物。氧化锌结晶体从四面体的重心向各四顶点生长,该四脚形导电充填物31是以各种金属例如Au,Ag,Ni,Cu等包覆上述氧化锌结晶体,赋与导电性。本实施例的四脚形导电充填物31的平均针状部长约为20μm,平均针状基部直径约为1μm。将该四脚形导电充填物31混入橡胶状弹性树脂中,形成导电性弹性体,该弹性导电凸块30的表面突出无数导电充填物的针部。若使得对向电极与该弹性导电凸块30压接,该弹性导电凸块30变形,这时从弹性导电凸块30表面突出的针部在对向电极表面滑移。因此,当对向电极表面有氧化膜或附着有污脏,也能排除上述氧化膜或污脏,针部尖端能可靠地与对向电极的导电表面相接,接合部的接触电阻稳定。
第四实施例
弹性导电凸块的截面形状若为前端缓缓变小的形状,则前端变小部分相对压缩力的变形量大,因此,能增大弹性导电凸块整体的相对压缩力的变形量。这样,能进一步增大弹性导电凸块高度偏差的允许范围。
例如,在图8A所示实施例中,弹性导电凸块的截面形状可以设为碗形。但是,如图9所示,若将弹性导电树脂40b形成的弹性导电凸块的截面形状设为圆锥形状,也具有同样效果。
在此,若将弹性导电凸块的高宽比(aspect ratio,高度相对宽度之比)设为小于0.1,则不能确保弹性导电凸块的压缩变形量,不能稳定确保若干电极的电气连接;若将弹性导电凸块的高宽比设为大于1.0,则会发生弹性导电凸块的倒塌,扩大接触电阻偏差,发生导致与邻接电极接触即短路的可能性。
下面,说明用低成本形成碗形弹性导电凸块的材料及制造方法。
碗形弹性导电凸块的材料包括含有针状导电充填物的热硬化硅树脂,以及添加到该热硬化硅树脂中的稀释剂。如上所述,该针状导电充填物能使树脂具有良好的导电性,即使提高树脂配合比即降低导电性充填物配合比,也能得到良好的导电性。因此,在该热硬化硅树脂中,树脂配合比能相对高。
参照图8B,通过网板印刷方法将弹性导电树脂40a供给到电子元件42的电极41上。通过热硬化该弹性导电树脂40a,弹性导电树脂40a形成为块状,得到如图8A所示弹性导电块40。这种场合,即使弹性导电树脂40a向电极41上供给的形状不定形,由于在加热硬化时的高温环境初始,粘度变低,树脂及稀释剂的表面张力作用,也能形成碗型弹性导电凸块40。因此,通过用网板印刷方式向电极41上供给弹性导电树脂40a,能有效地形成碗型弹性导电凸块40。由于可以通过网板印刷方法大量形成弹性导电凸块,因此,成本很低。
但是,由于在弹性导电树脂中含有稀释剂,若马上升温直到完全硬化温度,使其硬化,则恐怕会产生空隙,导致高电阻化,因此,可以在初始阶段以比完全硬化温度低的温度加热,缓慢地散发稀释剂后,升温到完全硬化温度,使其硬化。
第五实施例
图10表示带金属箔的弹性导电体的实施例,其中,图10A表示金属箔附着在碗形弹性导电凸块上的连接结构图,图10B表示通过湿气硬化方法形成的带金属箔的弹性导电凸块,图10C表示将图10A的结构通过焊锡连接到电极。
如图10A所示,金属箔51附着在由弹性导电树脂50a构成的弹性导电凸块50一侧,上述弹性导电树脂50a是通过将稀释剂添加到包含针状导电充填物的热硬化硅树脂中形成。该弹性导电凸块50的材料与图8A中所示弹性导电凸块40相同。金属箔51可以是Cu箔,但是,为了降低金属箔51与弹性导电凸块50的接触电阻,最好在金属箔51的表层施以镀Au或镀Ag。
当在三维结构体(three-dimensional construction)上形成弹性导电凸块时,带金属箔51的弹性导电凸块50将起作用,尤其当难以在电极上直接供给弹性导电树脂形成弹性导电凸块时。通过将带金属箔51的弹性导电凸块50作为一连接元件52,该连接元件52可以利用焊锡或导电性粘接剂附加到三维结构体上。例如,图10C所示,上述由弹性导电凸块50和金属箔51构成的连接元件52通过焊锡54与电极55接合。该电极55与电子元件56相接合。
当在三维结构体上将已硬化的弹性导电凸块与电极连接时,已硬化的弹性导电凸块不能通过锡焊与电极接合。且已硬化的弹性导电凸块中的弹性树脂的粘接浸润性差,不能确保导电性粘接剂粘接接合的充分强度。但是,当带金属箔场合,上述问题能简单解消。
第六实施例
下面说明带金属箔的弹性导电元件(即弹性导电凸块)的形成方法。弹性导电树脂以一预定厚度涂到金属箔51上,并使其硬化。作为硬化方法可以根据橡胶状弹性树脂种类采用例如加热硬化法,湿气硬化法等合适的方法。
当形成碗形弹性导电凸块50时,弹性导电树脂50a通过网板印刷方法供给到金属箔51上。通过热硬化该在金属箔51上的弹性导电树脂50a,弹性导电树脂50a形成为如图10A所示的碗形弹性导电凸块50。或者,弹性导电树脂53a以一预定厚度涂布到金属箔51上,并通过湿气硬化法使其硬化。结果,形成如图10B所示的弹性导电凸块53。
然后,例如图11A所示,弹性导电树脂53a硬化后,用切刀60一下子切割金属箔51与弹性导电树脂53a,截断为所需要的尺寸。结果,形成由金属箔和弹性导电凸块构成的连接元件。
图11B表示另一种切割实施例,标号57表示粘接带,通过照射紫外线可以使得粘接带失去粘接力,该粘接带可以设置在金属箔51的背面侧。当截断弹性导电树脂53a,金属箔51,及粘接带时,粘接带57局部残留,即该粘接带57没有被完全切断。通过这种切割,能避免切割后的弹性导电凸块53与金属箔51的切片零散。当使用弹性导电凸块53与金属箔51的切片,供给到电极上时,可从粘接带57背面照射紫外线,能使弹性导电凸块53与金属箔51与粘接带57分离。这样,通过使用粘接带57,能大幅度提高作业性。
第七实施例
作为上述橡胶弹性树脂的一实施例,弹性导电树脂可以包括具有紫外线硬化性以及湿气硬化性的硅树脂,且包含针状充填物。该弹性导电树脂即使导电性充填物的含有量少,也能得到高导电性。这是由于本实施例的弹性导电树脂包含针状充填物,与含有薄片状充填物相比,光能进入到弹性导电树脂构成的弹性导电凸块的内层。
作为具体材料可以使用例如由Three Bond公司制的紫外线硬化性硅树脂3164作为上述弹性导电树脂。在电极上设置该弹性导电树脂后,通过照射紫外线,使其直到内部完全硬化。或者,也可以在仅仅表层硬化后,在常温常湿环境下保管,通过利用湿气硬化功能,使其完全硬化。
在上述弹性导电树脂中,至少表层附近的硬化在短期间内结束。通过使用上述弹性导电树脂,可以容易地在易受热影响的电子元件上形成弹性导电凸块。尤其,由于不需要加热,能在不能加热的电子元件上形成弹性导电凸块。
上面参照附图说明了本发明的实施例,但本发明并不局限于上述实施例。在本发明技术思想范围内可以作种种变更,它们都属于本发明的保护范围。
例如,作为针状充填物可以使用以下导电性充填物:芯材使用金属晶须,碳酸钙晶须,钛酸钾晶须等无机晶须,在该无机晶须表层包覆金属。
另外,作为橡胶状树脂,并不局限于硅树脂,只要是具有橡胶状弹性的树脂都可以使用。
在上述实施例中,弹性导电凸块供给到电子元件的电极上,但本发明并不局限于此,弹性导电凸块也可供给到衬底侧的电极上。
Claims (17)
1.一种弹性导电树脂,其特征在于,包括:
具有橡胶状弹性的树脂;
针状导电充填物,用Au,Ag,Ni,Cu中之一包覆该针状充填物的表层。
2.根据权利要求1中所述的弹性导电树脂,其特征在于,上述针状充填物的芯材是晶须。
3.根据权利要求2中所述的弹性导电树脂,其特征在于,上述针状充填物的芯材是高分子晶须。
4.根据权利要求1-3中任一个所述的弹性导电树脂,其特征在于,上述具有橡胶状弹性的树脂是硅树脂,其具有紫外线硬化性及湿气硬化性。
5.一种电子装置,包括:
一电子元件,至少包括一个第一电极;
一衬底,至少包括一个第二电极;
至少一个凸块,至少形成在一个第一电极上,由弹性导电树脂形成,该弹性导电树脂为上述权利要求1-4中任一项所述的弹性导电树脂;
其中,通过机械连接上述至少一个凸块和至少一个第二电极,上述至少一个第一电极和至少一个第二电极实现电连接。
6.一种电子装置,包括:
一电子元件,至少包括一个第一电极;
一衬底,至少包括一个第二电极;
至少一个凸块,至少形成在一个第二电极上,由弹性导电树脂形成,该弹性导电树脂为上述权利要求1-4中任一项所述的弹性导电树脂;
其中,通过机械连接上述至少一个凸块和至少一个第一电极,上述至少一个第一电极和至少一个第二电极实现电连接。
7.一种电子装置,包括:
一电子元件,至少包括一个第一电极;
一衬底,至少包括一个第二电极;
至少一个第一凸块,至少形成在一个第一电极上,至少一个第二凸块,至少形成在一个第二电极上,上述第一和第二凸块由弹性导电树脂形成,该弹性导电树脂为上述权利要求1-4中任一项所述的弹性导电树脂;
其中,通过机械连接上述至少一个第一凸块和至少一个第二凸块,上述至少一个第一电极和至少一个第二电极实现电连接。
8.一种电子装置,包括:
一电子元件,至少包括一个第一电极;
一衬底,至少包括一个第二电极;
至少一个凸块,至少形成在一个第一电极上,由弹性导电树脂形成,该弹性导电树脂包括具有橡胶状弹性的树脂,以及四脚形氧化锌充填物,用Au,Ag,Ni,Cu中之一包覆该四脚形氧化锌充填物的表层;
其中,通过机械连接上述至少一个凸块和至少一个第二电极,上述至少一个第一电极和至少一个第二电极实现电连接。
9.一种电子装置,包括:
一电子元件,至少包括一个第一电极;
一衬底,至少包括一个第二电极;
至少一个凸块,至少形成在一个第二电极上,由弹性导电树脂形成,该弹性导电树脂包括具有橡胶状弹性的树脂,以及四脚形氧化锌充填物,用Au,Ag,Ni,Cu中之一包覆该四脚形氧化锌充填物的表层;
其中,通过机械连接上述至少一个凸块和至少一个第一电极,上述至少一个第一电极和至少一个第二电极实现电连接。
10.一种电子装置,包括:
一电子元件,至少包括一个第一电极;
一衬底,至少包括一个第二电极;
至少一个第一凸块,至少形成在一个第一电极上,至少一个第二凸块,至少形成在一个第二电极上,上述第一和第二凸块由弹性导电树脂形成,该弹性导电树脂包括具有橡胶状弹性的树脂,以及四脚形氧化锌充填物,用Au,Ag,Ni,Cu中之一包覆该四脚形氧化锌充填物的表层;
其中,通过机械连接上述至少一个第一凸块和至少一个第二凸块,上述至少一个第一电极和至少一个第二电极实现电连接。
11.根据权利要求5-10中任一个所述的电子装置,其特征在于,上述凸块朝着顶端逐渐变小,凸块高宽比为0.1~1.0范围。
12.根据权利要求5-10中任一个所述的电子装置,其特征在于,在上述弹性导电树脂中,具有橡胶状弹性的树脂是硅树脂,其具有紫外线硬化性及湿气硬化性。
13.一种连接元件,包括:
一弹性导电元件,由弹性导电树脂形成,该弹性导电树脂包括橡胶状弹性树脂以及针状导电充填物;
一金属箔,设于上述弹性导电元件上。
14.一种电子元件,用于电子装置,该电子元件包括:
至少一个电极;
至少一个凸块,至少形成在一个电极上,由弹性导电树脂形成,该弹性导电树脂为上述权利要求1-4中任一项所述的弹性导电树脂。
15.一种衬底,用于电子装置,该衬底包括:
至少一个电极;
至少一个凸块,至少形成在一个电极上,由弹性导电树脂形成,该弹性导电树脂为上述权利要求1-4中任一项所述的弹性导电树脂。
16.一种凸块形成方法,用于在电子元件或衬底的电极上形成凸块,该凸块形成方法包括:
在电极上网板印刷导电糊,该导电糊含有热硬化性硅树脂,稀释剂,及针状导电充填物;
以比完全硬化温度低的温度热硬化上述导电糊,使稀释剂消散;
热硬化上述导电糊,直到上述导电糊温度达到完全硬化温度。
17.一种连接元件形成方法,该连接元件包括弹性导电元件及金属箔,上述弹性导电元件由弹性导电树脂形成,该弹性导电树脂包括橡胶状弹性树脂以及针状导电充填物,上述金属箔设于上述弹性导电元件上,该连接元件形成方法包括:
在金属箔上以预定厚度涂布弹性导电树脂;
硬化该弹性导电树脂;
切割上述已硬化的弹性导电树脂和金属箔。
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CN100541770C (zh) | 2009-09-16 |
JP2004051755A (ja) | 2004-02-19 |
US20040108133A1 (en) | 2004-06-10 |
US20070132098A1 (en) | 2007-06-14 |
US7875807B2 (en) | 2011-01-25 |
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