CN1427664A - 丝网印刷方法和丝网印刷设备 - Google Patents
丝网印刷方法和丝网印刷设备 Download PDFInfo
- Publication number
- CN1427664A CN1427664A CN02124610A CN02124610A CN1427664A CN 1427664 A CN1427664 A CN 1427664A CN 02124610 A CN02124610 A CN 02124610A CN 02124610 A CN02124610 A CN 02124610A CN 1427664 A CN1427664 A CN 1427664A
- Authority
- CN
- China
- Prior art keywords
- zone
- brushing
- printing
- mask plate
- screen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/0804—Machines for printing sheets
- B41F15/0813—Machines for printing sheets with flat screens
- B41F15/0818—Machines for printing sheets with flat screens with a stationary screen and a moving squeegee
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Screen Printers (AREA)
- Printing Methods (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP220947/1995 | 1995-08-30 | ||
JP220947/95 | 1995-08-30 | ||
JP22094795 | 1995-08-30 | ||
JP24484795 | 1995-09-22 | ||
JP244847/1995 | 1995-09-22 | ||
JP244847/95 | 1995-09-22 | ||
JP298448/1995 | 1995-10-16 | ||
JP298448/95 | 1995-11-16 | ||
JP29844895 | 1995-11-16 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN96197699A Division CN1099962C (zh) | 1995-08-30 | 1996-08-30 | 丝网印刷方法和丝网印刷设备 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1427664A true CN1427664A (zh) | 2003-07-02 |
CN1232160C CN1232160C (zh) | 2005-12-14 |
Family
ID=27330495
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN96197699A Expired - Lifetime CN1099962C (zh) | 1995-08-30 | 1996-08-30 | 丝网印刷方法和丝网印刷设备 |
CNB021243697A Expired - Lifetime CN1268182C (zh) | 1995-08-30 | 1996-08-30 | 丝网印刷方法和丝网印刷设备 |
CNB021246106A Expired - Lifetime CN1232160C (zh) | 1995-08-30 | 1996-08-30 | 丝网印刷方法和丝网印刷设备 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN96197699A Expired - Lifetime CN1099962C (zh) | 1995-08-30 | 1996-08-30 | 丝网印刷方法和丝网印刷设备 |
CNB021243697A Expired - Lifetime CN1268182C (zh) | 1995-08-30 | 1996-08-30 | 丝网印刷方法和丝网印刷设备 |
Country Status (8)
Country | Link |
---|---|
US (3) | US6237490B1 (zh) |
EP (3) | EP1448032B1 (zh) |
JP (3) | JP3471362B2 (zh) |
KR (1) | KR100301384B1 (zh) |
CN (3) | CN1099962C (zh) |
DE (1) | DE69632537T2 (zh) |
SG (2) | SG71804A1 (zh) |
WO (1) | WO1997008655A2 (zh) |
Cited By (4)
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---|---|---|---|---|
CN101452516B (zh) * | 2007-11-29 | 2010-12-01 | 英业达股份有限公司 | 条形码形成方法 |
CN103261970A (zh) * | 2010-11-30 | 2013-08-21 | 阿卢蒂克斯公司 | 晒版机 |
CN106313876A (zh) * | 2015-06-30 | 2017-01-11 | 宸鸿科技(厦门)有限公司 | 网版印刷机与网版印刷方法 |
CN107187184A (zh) * | 2017-06-21 | 2017-09-22 | 明珠家具股份有限公司 | 一种用于工件表面图案印制的丝印机 |
Families Citing this family (68)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6312123B1 (en) * | 1998-05-01 | 2001-11-06 | L&P Property Management Company | Method and apparatus for UV ink jet printing on fabric and combination printing and quilting thereby |
EP1203662B1 (en) * | 1999-07-26 | 2010-12-15 | Panasonic Corporation | Solder-paste printing device and printing method |
US6491204B1 (en) * | 1999-11-30 | 2002-12-10 | Gunter Erdmann | Stencil wiping device |
US6730170B1 (en) * | 2000-11-17 | 2004-05-04 | National Semiconductor Corporation | Encapsulant material applicator for semiconductor wafers and method of use thereof |
US6638363B2 (en) * | 2000-11-22 | 2003-10-28 | Gunter Erdmann | Method of cleaning solder paste |
JP3721982B2 (ja) * | 2000-12-04 | 2005-11-30 | 松下電器産業株式会社 | 回路形成基板の製造方法および回路形成基板の製造装置 |
US6910414B2 (en) * | 2001-10-22 | 2005-06-28 | Hallmark Cards, Incorporated | Multi-frame screen printing |
US6659328B2 (en) * | 2001-12-18 | 2003-12-09 | Xerox Corporation | Method and apparatus for deposition of solder paste for surface mount components on a printed wiring board |
US20030199220A1 (en) * | 2002-04-22 | 2003-10-23 | Dawson Durwin Glann | Nonwoven fabric having three-dimensional printed surface and method for producing the same |
US6737114B2 (en) | 2002-04-22 | 2004-05-18 | Milliken & Company | Nonwoven fabric having three-dimensional printed surface and method for producing the same |
US20040049874A1 (en) * | 2002-09-13 | 2004-03-18 | Velasquez Eric P. | Screen printing squeegee for applying solder paste |
US7320947B2 (en) * | 2002-09-16 | 2008-01-22 | Milliken & Company | Static dissipative textile and method for producing the same |
US20040051082A1 (en) | 2002-09-16 | 2004-03-18 | Child Andrew D. | Static dissipative textile and method for producing the same |
JP2004228276A (ja) * | 2003-01-22 | 2004-08-12 | D D K Ltd | 基板への接続物の接続方法 |
JP3841073B2 (ja) * | 2003-07-28 | 2006-11-01 | 松下電器産業株式会社 | スクリーン印刷装置 |
US7575778B2 (en) * | 2003-09-08 | 2009-08-18 | Embed Technology Co., Ltd. | Method of applying a polymer thick-film resistive paste for making polymer thick-film resistor having improved tolerances |
EP1558066A1 (en) * | 2004-01-21 | 2005-07-27 | Sony Ericsson Mobile Communications AB | Providing differentiated levels of solder paste on a circuit board |
US7013802B2 (en) * | 2004-02-19 | 2006-03-21 | Speedline Technologies, Inc. | Method and apparatus for simultaneous inspection and cleaning of a stencil |
JP2005231230A (ja) * | 2004-02-20 | 2005-09-02 | Matsushita Electric Ind Co Ltd | スクリーン印刷装置およびスクリーン印刷方法 |
JP4391365B2 (ja) * | 2004-09-07 | 2009-12-24 | ヤマハ発動機株式会社 | スクリーン印刷装置 |
SE527993C2 (sv) * | 2004-12-10 | 2006-08-01 | Hp Etch Ab | Lodpastastencil och förfarande för att tillverka densamma |
US20060222828A1 (en) * | 2005-04-01 | 2006-10-05 | John Boyle & Company, Inc. | Recyclable display media |
KR100761766B1 (ko) * | 2005-10-17 | 2007-09-28 | 삼성전자주식회사 | 프린팅 장치, 이의 제어방법과 이를 이용한 평판표시장치의제조방법 |
JP4700577B2 (ja) * | 2006-08-11 | 2011-06-15 | 日本メクトロン株式会社 | フレキシブルプリント配線板のスクリーン印刷方法 |
GB2446884B (en) * | 2007-02-20 | 2012-02-01 | Dtg Int Gmbh | Screen printing machine |
JP5023904B2 (ja) * | 2007-09-11 | 2012-09-12 | パナソニック株式会社 | スクリーン印刷装置 |
GB2458313B (en) * | 2008-03-13 | 2012-05-23 | Dek Int Gmbh | Print head assembly, screen printing system and method |
JP5679399B2 (ja) | 2008-11-25 | 2015-03-04 | 富士機械製造株式会社 | スクリーン印刷機および印刷ユニット |
JP5126172B2 (ja) * | 2009-07-13 | 2013-01-23 | パナソニック株式会社 | スクリーン印刷装置およびスクリーン印刷方法 |
JP5059133B2 (ja) * | 2010-01-08 | 2012-10-24 | パナソニック株式会社 | スクリーン印刷機 |
JP2013022895A (ja) | 2011-07-25 | 2013-02-04 | Panasonic Corp | スクリーン印刷装置およびスクリーン印刷方法 |
JP2013043418A (ja) * | 2011-08-26 | 2013-03-04 | Panasonic Corp | スクリーン印刷機及びスクリーン印刷方法 |
JP5189194B2 (ja) * | 2011-09-05 | 2013-04-24 | ミカドテクノス株式会社 | 真空加熱接合装置及び真空加熱接合方法 |
CN103085516A (zh) * | 2011-10-31 | 2013-05-08 | 浚鑫科技股份有限公司 | 一种用于太阳能电池丝网印刷的刮胶方法 |
US20130133193A1 (en) * | 2011-11-28 | 2013-05-30 | Mediatek Singapore Pte. Ltd. | Surface mount technology process for advanced quad flat no-lead package process and stencil used therewith |
JP5895130B2 (ja) * | 2012-10-24 | 2016-03-30 | パナソニックIpマネジメント株式会社 | スクリーン印刷機及びスクリーン印刷方法 |
DE102012220805A1 (de) * | 2012-11-14 | 2014-05-15 | Deutsche Cell Gmbh | Verfahren und Vorrichtung zum Bedrucken einer Waferoberfläche |
CN103832057A (zh) * | 2012-11-20 | 2014-06-04 | 吴江市利群纺织有限公司 | 圆网印花机的色浆供应装置 |
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- 1996-08-30 EP EP04011726A patent/EP1448032B1/en not_active Expired - Lifetime
- 1996-08-30 CN CN96197699A patent/CN1099962C/zh not_active Expired - Lifetime
- 1996-08-30 KR KR1019980701555A patent/KR100301384B1/ko not_active IP Right Cessation
- 1996-08-30 CN CNB021243697A patent/CN1268182C/zh not_active Expired - Lifetime
- 1996-08-30 JP JP51012797A patent/JP3471362B2/ja not_active Expired - Lifetime
- 1996-08-30 US US09/011,979 patent/US6237490B1/en not_active Expired - Lifetime
- 1996-08-30 SG SG1998001434A patent/SG77640A1/en unknown
- 1996-08-30 EP EP96928699A patent/EP0847682B1/en not_active Expired - Lifetime
- 1996-08-30 DE DE69632537T patent/DE69632537T2/de not_active Expired - Lifetime
- 1996-08-30 WO PCT/JP1996/002432 patent/WO1997008655A2/en active IP Right Grant
- 1996-08-30 CN CNB021246106A patent/CN1232160C/zh not_active Expired - Lifetime
- 1996-08-30 EP EP04011727.7A patent/EP1465469B1/en not_active Expired - Lifetime
-
2001
- 2001-04-11 US US09/829,998 patent/US6694875B2/en not_active Expired - Lifetime
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2002
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2003
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101452516B (zh) * | 2007-11-29 | 2010-12-01 | 英业达股份有限公司 | 条形码形成方法 |
CN103261970A (zh) * | 2010-11-30 | 2013-08-21 | 阿卢蒂克斯公司 | 晒版机 |
CN103261970B (zh) * | 2010-11-30 | 2016-03-30 | 阿卢蒂克斯公司 | 晒版机 |
CN106313876A (zh) * | 2015-06-30 | 2017-01-11 | 宸鸿科技(厦门)有限公司 | 网版印刷机与网版印刷方法 |
CN107187184A (zh) * | 2017-06-21 | 2017-09-22 | 明珠家具股份有限公司 | 一种用于工件表面图案印制的丝印机 |
Also Published As
Publication number | Publication date |
---|---|
CN1268182C (zh) | 2006-08-02 |
WO1997008655A2 (en) | 1997-03-06 |
JP3471362B2 (ja) | 2003-12-02 |
JPH11514306A (ja) | 1999-12-07 |
DE69632537D1 (de) | 2004-06-24 |
EP0847682B1 (en) | 2004-05-19 |
US6659005B2 (en) | 2003-12-09 |
CN1099962C (zh) | 2003-01-29 |
DE69632537T2 (de) | 2005-06-02 |
SG77640A1 (en) | 2001-01-16 |
JP2004001554A (ja) | 2004-01-08 |
JP3689706B2 (ja) | 2005-08-31 |
KR100301384B1 (ko) | 2001-10-29 |
US20020178943A1 (en) | 2002-12-05 |
CN1431859A (zh) | 2003-07-23 |
EP0847682A2 (en) | 1998-06-17 |
US20010017086A1 (en) | 2001-08-30 |
SG71804A1 (en) | 2000-04-18 |
CN1200186A (zh) | 1998-11-25 |
CN1232160C (zh) | 2005-12-14 |
EP1465469B1 (en) | 2014-04-09 |
KR19990044316A (ko) | 1999-06-25 |
EP1465469A3 (en) | 2008-03-26 |
WO1997008655A3 (en) | 1997-05-29 |
EP1448032B1 (en) | 2011-10-12 |
US6237490B1 (en) | 2001-05-29 |
JP2004001555A (ja) | 2004-01-08 |
EP1448032A3 (en) | 2008-03-26 |
US6694875B2 (en) | 2004-02-24 |
EP1465469A2 (en) | 2004-10-06 |
EP1448032A2 (en) | 2004-08-18 |
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