CN1383592A - 天线和采用该天线的无线装置 - Google Patents
天线和采用该天线的无线装置 Download PDFInfo
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Abstract
一种增益、可靠性、生产效率高,能够接收多个频率电波的天线以及采用该天线的无线装置。供电部一端与天线元件部电连接,另一端与无线装置高频电路电连接。由电介质材料制芯棒机械保持天线元件部。电介质材料制天线罩覆盖天线元件部以及供电部局部。而且,该天线元件部由与芯棒同心状并且呈细带形状的导电薄板所形成的大致螺旋状部和大致蛇状部构成。通过适当设定大致螺旋状部以及大致蛇状部尺寸可在多个频段中实现良好的阻抗特性。
Description
技术领域
本发明涉及一种移动通信等用的无线装置所装的天线以及采用该天线的无线装置。
背景技术
近年来,随着对移动通信用无线装置的需求急剧增加,其形态正呈现多样化。其中之一开发的是可收发多个频段电波以便由1台无线装置处理更多信息的无线装置,对此采用在多个频段中呈现良好阻抗特性的天线。
这种移动通信代表例是移动电话***,在世界各地得到广泛使用,其使用频段也因地区而不同。例如就数字式移动电话***的使用频段来说,日本Personal Digital Cellular 800(个人数字蜂窝(PDC800))中是810~960MHz,欧美的Group Special Mobile Community(分组移动共同体(GSM))中是890~960MHz,Personal Communication Network(个人通信网(PCN))中是1,710~1,880MHz,Personal Communication System(个人通信***(PCS))中是1,850~1,990MHz。作为与这种多频段对应的移动电话所用天线的天线元件,一般广泛采用将线状导体卷绕成螺旋状的螺旋式天线元件。
图12是与GSM频段890~960MHz和PCN频段1,710~1,880MHz这2个频段对应的现有天线的概略剖视图,图13和图14示出的是给出其阻抗特性的VSWR频率特性。
图12的天线8中,天线元件3用磷青铜丝制成,并且将直线部1配置于螺旋部2内侧,直线部1的上端和螺旋部2的上端相连形成为一体。供电接头6用金属制成,上部设有连接固定天线元件3的凹部4,下部形成装配到无线装置上的安装螺纹部5。天线罩7用树脂性电介质材料制成,覆盖天线元件3以及供电接头6局部。供电接头6装配到壳体上以便与移动电话机高频电路部分电连接,从而起到与2个频段对应的天线功能。
这样构成的天线8,天线元件3的直线部1与螺线部2组合在一起的电气长度在PCN频段中设定为相当于约λ/2,在GSM频段中设定为相当于约λ/4,利用天线元件3的直线部1和螺线部2的电气耦合,构成为天线元件3的阻抗特性在这两者频段中良好。
但该现有天线8中,天线元件3的阻抗特性,在各个频段中,一般求得VSWR为3以下。将磷青铜丝延展成直线状再从其前端起卷绕为螺旋形状所形成的结构中,满足该要求很困难。例如PCN频段中,天线元件3其电气长度设定为相当于约λ/2时,其阻抗特性,利用直线部1与螺线部2的电气耦合如图13所示在PCN频段(▲3和▲4之间)中VSWR可作成3以下。这时,GSM频段(▲1和▲2之间)中VSWR为3以下的范围变狭。所以,为对其改进使螺线部2直径、节距等变化来设定修正电气长度,如图14所示当GSM频段中(▲1和▲2之间)实现宽频带时,这时PCN频段中电气长度、直线部1和螺线部2之间的电气耦合也会同时变化。因此,PCN频段(▲3和▲4之间)中,VSWR变差而为4以上。因此,现有天线结构中,存在即便某一频段电波可良好收发也无法良好收发其他频段电波这种问题。
而且,该现有天线存在这样的问题,在制造天线元件3过程中,螺旋部2的直径、节距有的不均匀,有的螺旋部2变形,因而阻抗特性产生误差,无法获得所期望阻抗特性。此外,还存在为了补偿该误差造成的阻抗特性变差而在天线和移动电话机高频电路部之间设置复杂阻抗匹配电路时阻碍移动电话机降低成本这种问题。
发明概述
本发明鉴于上述现存的问题,其目的在于,提供一种可方便设定天线元件电气长度、可用1个天线元件在所期望的多个频段中获得良好的阻抗特性、通过减少阻抗特性误差而不需要阻抗匹配电路、生产效率和可靠性优异的天线,同时实现采用该天线的无线装置的低成本。
为了达到上述目的,本发明天线由收发多个频段电波的天线元件部、电连接天线元件部和无线装置高频电路的供电部、机械保持该天线元件部的电介质材料制芯棒、以及覆盖天线元件部和供电部局部的电介质材料制天线罩构成,并且由与芯棒同心状的大致螺旋状部和大致蛇状部构成该天线元件部。
本发明天线具有如下所示的多种方式。
(1)使形成芯棒的电介质材料和形成天线罩的电介质材料其比介电常数不同。
(2)将作成与芯棒大致相同直径的半圆形状以及细带形状的多个第1导体部沿芯棒端部附近起的芯棒轴向按规定间隔交替平行配置于芯棒正面和背面,用短的细带状导体薄板连接在相邻第1导体部的端部间来形成大致螺旋状部,还平行配置作成细带状的多个第2导体部,用短的细带状导体薄板连接在相邻第2导体部的端部间来形成大致蛇状部,并配置于所述大致螺旋部附近。
(3)冲裁加工导电性的金属薄板来形成天线元件部。
(4)挤压加工铜合金或金属经过导电电镀处理的导电性金属线来形成天线元件部。
(5)挤压加工导电性导体薄板经蚀刻加工所形成的规定布图来形成天线元件部。
(6)对形成规定布图的挠性电路板进行挤压加工来形成天线元件部。
(7)通过导电糊印刷来形成天线元件部。
(8)烧结导体粉来形成天线元件部。
(9)将大致螺旋状部一端与大致蛇状部一端连接,并连续配置大致螺旋状部和大致蛇状部。
(10)芯棒前端部附近具有将大致螺旋状部一端与大致蛇状部一端连接的连接点,并将大致蛇状部配置为与大致螺旋状部中心轴平行并且在其连接点折返。
(11)芯棒前端部附近具有将大致螺旋状部一端与大致蛇状部一端连接的连接点,大致蛇状部各第2导体部其中至少一部分为与大致螺旋状部基本相同直径的圆弧状,并将大致蛇状部配置为在连接点折返并且与大致螺旋状部离开,还配置为与大致螺旋状部呈同心状。
(12)与天线元件部一体形成供电部。
(13)取下覆盖天线元件部以及供电部局部的电介质材料制天线罩。
利用本发明,可提供一种可方便设定大致螺旋状部和大致蛇状部各自的电气长度或两者比例,与以往相比可在所期望多个频段中更简单地获得良好的阻抗特性,并具有宽频带、高增益、高可靠性的小型且低成本天线。
另外,装上本发明天线的无线装置和装上2个天线进行分集通信的无线装置也属于本发明范围。
附图简要说明
图1是本发明实施例1天线的局部剖视立体图。
图2是本发明实施例1天线的主视图。
图3是本发明实施例1天线的主剖视图。
图4是本发明实施例1天线的右侧剖视图。
图5是本发明实施例1天线元件的俯视图。
图6是本发明实施例1天线的VSWR频率特性图。
图7是本发明实施例2天线的主剖视图。
图8是本发明实施例2天线的右侧剖视图。
图9是本发明实施例3中装上天线的无线装置的电路图。
图10是本发明实施例4中装上天线的无线装置的电路图。
图11是本发明实施例5中装上天线的无线装置的电路图。
图12是现有天线的主要部分剖视图。
图13是现有天线一例VSWR频率特性图。
图14是现有天线一例VSWR频率特性图。
实施发明的最佳方式
下面用图1~图11说明本发明实施例。(实施例1)
图1是本发明实施例1天线的局部剖视立体图,图2是其外形图,图3是其主剖视图,图4是其右侧剖视图。图1中天线元件11如下形成。
大致螺旋状部12,通过对铜合金板等良导电性金属薄板进行冲裁以及挤压加工形成。大致蛇状部13,同样对铜合金板等良导电性金属薄板进行冲裁以及挤压加工形成。天线元件11形成为大致螺旋状部12和大致蛇状部13在各自上端部分连接、并使两者在该部分折返这种形状。供电接头14与天线元件11的大致蛇状部13其中一个终端13A(参照图3)连接固定,外周具有一螺纹部14A(参照图2),用于将该天线装配到采用该天线的无线装置上。
图1和图2中,芯棒15是介电常数约2.2的烯烃类合成橡胶树脂制,将天线元件11的大致螺旋状部12和大致蛇状部13固定为大致同心状并保持彼此处于绝缘状态,还与供电接头14密接固定。天线罩16是介电常数约2.5的烯烃类合成橡胶树脂制,使供电接头14的螺纹部14A附近露出来覆盖上述天线元件11的外周。
天线元件11的详细形状示于图3和图4。作成与芯棒15大致相等直径的半圆形以及细带形状的第1导体部17,沿芯棒15前端部附近起的轴向按规定间隔交替平行配置于芯棒15圆柱面的正面侧半圆柱面(17B)和背面侧半圆柱面(17A)。用短的细带形状导体18A和18B连接各第1导体部的一端与相邻第1导体部的一端来形成大致螺旋状部12。同样,如图3和图4所示作成与芯棒15大致相等直径的半圆形以及细带形状的第2导体部19,沿芯棒15前端部附近起的轴向按规定间隔平行配置于芯棒15圆柱面其中一个半圆柱面(19)。此外,用短的细带形状导体20A和20B连接第2导体部的一端与相邻第2导体部的一端来形成大致蛇状部13。如图4所示,大致螺旋状部12的一端开放、另一端由位于芯棒15前端部附近的连接部21与大致蛇状部13的一端连接,如图3所示该大致蛇状部13另一端13A连接固定有供电接头14。
而且,图4中大致蛇状部13的第2导体部19确定各连接部18A、18B和20A、20B的位置,以便确保处于如图3实线所示被各第1导体部17B夹住的状态以及绝缘状态,形成大致螺旋状部12和大致蛇状部13。这样组合形成天线元件11的大致螺旋状部12和大致蛇状部13的场合,连接部20A、20B为了避免与第1导体部17B接触,如图5中天线元件的俯视图所示,半圆形的第1导体部17的直径C,其尺寸比大致半圆形的第2导体部19的直径D稍小。而且,连接部20A、20B与连接部18A、18B相比稍稍离开配置。
本实施例天线如上所述构成,接着说明该天线装置的工作原理。
图1所示天线,用供电接头14外周设置的螺纹部14A固定于无线装置(未图示)的规定部位,与天线所收发电波对应的高频信号通过该供电接头14在无线装置高频电路(未图示)和天线之间传递。天线元件11利用其电气耦合设定为规定的电气长度,以便在第1频段和第2频段呈现良好的VSWR。
由天线元件11的大致旋旋状部12和大致蛇状部13所具有的电感、多个第1导体部间的杂散电容、多个第2导体部间的杂散电容、多个第1导体部与第2导体部相互间的杂散电容、芯棒15的介电常数以及天线罩16的介电常数所确定的电气长度,设定为约3λ/8~5λ/8,以便在第1频段中以良好的阻抗特性工作。同样,通过电气长度设定为约λ/2以便在第2频段中以良好的阻抗特性工作,天线元件11便能够最为高效地收发上述2个频段的电波。可用1个天线元件11与上述2个频段相对应的理由如下所述。
现有例的天线元件中,大致螺旋状部的直径、节距可与本实施例同样变化。但与大致蛇状部13相当的部分在直线状导体中只使其长度和粗细变化。而本实施例中,则可使大致蛇状部13的第2导体部其长度、宽度、数量、节距等许多参数变化。因此,可使上述各杂散电容、电感更为自由地变化。所以,通过使这些参数变化便可获得适合2个频段的电气长度。
这样,本实施例中利用电气耦合使第2导体部19的节距、直径等变化,从而使电气长度变化,以便在第2频段中以良好的阻抗特性工作。而且,可在彼此不会对其他频段、VSWR造成影响的情况下独立确定电气长度,以便随第1导体部17的节距、直径等变化,在第1频段中以良好的阻抗特性工作,并且在第2频段中以良好的阻抗特性工作。所以,如图6中天线VSWR的频率特性图所示,可在GSM频段(890~960MHz、▲1和▲2之间)和PCN频段(1,710~1,880MHz、▲3和▲4之间)获得所期望的阻抗特性,可获得宽频带高增益天线。
而且,利用多个第1导体部间的杂散电容、多个第2导体部间的杂散电容、多个第1导体部与第2导体部相互间的杂散电容、芯棒以及天线罩的介电常数等可使天线元件的有效电气长度伸长。其结果是,可用机械长度短的元件实现同样的电气长度,因而可获得小型、轻量的高可靠性天线。
此外,本实施例中,天线元件11通过对良导电性金属薄板进行冲裁以及挤压加工来形成。因此,多个第1导体部17和多个第2导体部19不容易发生节距不均匀或变形,组装容易且成本低。
另外,还能够通过切断多个第1导体部17其中一部分或预先设置的调整用延长部、或适当设定第2导体部19的导体部数量、改变形成芯棒15或天线罩16的电介质材料的介电常数,更为方便地获得所期望频段中良好的阻抗特性。而且,还可通过使第2导体部19相对于位于芯棒15圆柱面的正面侧半圆柱面的第1导体部17B仅倾斜规定角度,使大致螺旋状部12与大致蛇状部13之间电气耦合度变化,方便地在大范围内对阻抗特性进行控制。另外,连接部18A、18B和连接部20A、20B不是图3和图4所示形式,而是V字状尖出的连接部,也能获得上述效果。此外,本实施例中,天线元件11是通过对铜合金板等良导电性金属薄板进行冲裁以及挤压加工形成的,但对铜合金或金属经Cu、Ni等电镀处理后的良导电性金属丝、蚀刻导体、挠性电路板等进行挤压加工、导电糊印刷或导体粉烧结所形成的良导电性金属等,通过机械、电化学或加压加热方式形成加工来形成天线元件,也能获得上述效果。(实施例2)
图7是本发明实施例2天线装置的主剖视图,图8是右侧剖视图,对于与实施例1构成相同的组成部分注上相同标号,省略详细说明。如图7和图8所示,天线元件11与实施例1同样(参照图1),通过对铜合金板等良导电性金属薄板进行冲裁以及挤压加工,形成大致螺旋状部12和大致蛇状部13,这些大致螺旋状部12和大致蛇状部13可在芯棒24上端附近的连接部21连接。本实施例中,如图7所示,与大致蛇状部13下方端部13A连续将具有簧片状接点部22的供电端子23和天线元件11形成为一体。该接点部22设置为将天线装配到无线装置时用于与无线装置高频电路的输入输出电路布图压接(参照图8)。此外,如图7所示,供电端子23密接固定于芯棒24,并在介电常数约2.3的ABS树脂制芯棒24的下端外周部形成一可弹性形变的爪部25,用于将天线卡锁安装到无线装置上。天线罩16使芯棒24的底部和接点部22露出覆盖于天线元件11的外周。
采用本实施例,由于在实施例1的基础上还使天线元件11和供电端子23实现一体化,因而可减少所组成零件个数,使天线成本降低。(实施例3)
图9是装配了本发明实施例3天线装置的无线装置的电路图,对于与实施例1~4构成相同的组成部分注上相同标号,省略详细说明。如图9所示,天线(参照图1和图2)装配到无线装置26的绝缘性树脂制框体27上,而且,无线装置26内部,天线的供电接头14靠供电线28与开关29连接,通过开关29与第1频段用高频电路30和第2频段用高频电路31连接。
采用本实施例,不仅可将天线简单装配到无线装置26上,而且天线具有与所期望的多个频段相对应的阻抗特性,因而无线装置26的高频电路部不需要附加复杂的阻抗匹配电路,可使无线装置降低成本。(实施例4)
图10是装配了本发明实施例4天线装置的无线装置的电路图,对与实施例7和8构成相同的组成部分注上相同标号,省略详细说明。如图10所示,无线装置26框体27内的电路板(未图示)上装配有天线(图7所示天线中取下天线罩16状态的天线),同时无线装置26内部,天线的供电端子23靠供电线28与开关29连接,通过开关29与第1频段用高频电路30和第2频段用高频电路31连接。
采用本实施例,除了实施例1~3效果外,还通过将天线内置到无线装置26中,可防止无线装置26落下或受到冲击时天线损伤。而且,可使无线装置26小型化的同时可将天线简单安装到无线装置上,因而可降低无线装置26的制造成本。(实施例5)
图11是装配了本发明实施例5天线装置的无线装置的电路图,对于实施例7和8构成相同的组成部分注上相同标号,省略详细说明。如图11所示,分别将第1和第2天线(图7所示天线中取下天线罩16状态的天线)配置到无线装置26框体27内的电路板(未图示)上端部和下端部,第1和第2天线各自的供电端子23A和23B通过供电线28A和28B与开关32连接,开关32的共用端子与高频电路33连接。用高频电路33的后续电路对第1天线和第2天线的接收功率电平进行比较,可通过自动切换开关32使得接收功率大的天线与高频电路33连接,来实现分集通信。
采用本实施例,除了实施例4效果外,可通过用所期望频段中具有同等阻抗特性的多个天线,避免阻抗特性误差,因而不仅可获得具有高增益、高可靠性的分集通信方式无线装置,还可将天线简单装配到无线装置上,因而可获得低成本无线装置。
产业实用性
综上所述,按照本发明,天线元件由大致螺旋状部和大致蛇状部形成,因而可方便调整大致螺旋状部和大致蛇状部的电气长度,因而可在所期望的多个频段中简单获得良好的阻抗特性,可提供一种具有宽频带、高增益、高可靠性,小型且低成本天线。此外,通过将本天线用于无线装置,不仅使天线装配到无线装置上变得容易,而且可在所期望的多个频段中获得良好的阻抗特性,因而不需要复杂的阻抗匹配电路,可使无线装置成本降低。
Claims (28)
1.一种天线,对多个频段电波进行收发,其特征在于,包括:导电性天线元件部;
连接所述天线元件部和无线装置高频电路的供电部;
机械保持所述天线元件部的电介质材料制芯棒;
覆盖所述天线元件部和所述供电部局部的电介质材料制天线罩,
所述天线元件部包括与所述芯棒同心状的大致螺旋状部和大致蛇状部。
2.如权利要求1所述的天线,其特征在于,使形成所述芯棒的电介质材料与形成所述天线罩的电介质材料其比介电常数不同。
3.如权利要求1所述的天线,其特征在于,将作成与所述芯棒大致相同直径的半圆形状以及细带形状的第1导体部沿所述芯棒端部附近起的轴向按规定间隔交替平行配置于所述芯棒圆柱面的正面侧半圆柱面和背面侧半圆柱面,用短的细带状导体连接在相邻的所述第1导体部的端部间来形成大致螺旋状部,还平行配置作成细带状的第2导体部,用短的细带状导体连接在相邻的所述第2导体部的端部间来形成大致蛇状部,并配置于所述大致螺旋部附近。
4.如权利要求3所述的天线,其特征在于,所述第1导体部和第2导体部通过对导电性金属薄板进行冲裁加工形成。
5.如权利要求3所述的天线,其特征在于,挤压加工铜合金或金属经过导电电镀处理的导电性金属线,形成所述天线元件部。
6.如权利要求3所述的天线,其特征在于,挤压加工导电性导体薄板经蚀刻加工所形成的规定布图,形成所述天线元件部。
7.如权利要求3所述的天线,其特征在于,挤压加工形成有规定布图的挠性电路板,形成所述天线元件部。
8.如权利要求3所述的天线,其特征在于,通过导电糊印刷形成所述天线元件部。
9.如权利要求3所述的天线,其特征在于,对导体粉进行烧结形成所述天线元件部。
10.如权利要求3所述的天线,其特征在于,将所述大致螺旋状部一端与所述大致蛇状部一端连接,并连续配置所述大致螺旋状部和所述大致蛇状部。
11.如权利要求3所述的天线,其特征在于,所述芯棒前端部附近具有将所述大致螺旋状部一端与所述大致蛇状部一端连接的连接点,并将所述大致蛇状部配置为与所述大致螺旋状部中心轴平行并且在所述连接点折返。
12.如权利要求3所述的天线,其特征在于,所述芯棒前端部附近具有将所述大致螺旋状部一端与所述大致蛇状部一端连接的连接点,所述第2导体部其中至少一部分为与所述大致螺旋状部基本相同直径的圆弧状,并将所述大致蛇状部配置为在所述连接点折返并且与所述大致螺旋状部离开,还配置为与所述大致螺旋状部呈同心状。
13.如权利要求3所述的天线,其特征在于,与所述天线元件部一体形成所述供电部。
14.一种无线装置,其特征在于,装上权利要求1所述的天线,能够在多个频段中通信。
15.一种天线,对多个频段电波进行收发,其特征在于,包括:
导电性天线元件部;
连接所述天线元件部和无线装置高频电路的供电部;
机械保持所述天线元件部的电介质材料制芯棒,
所述天线元件部包括与所述芯棒同心状的大致螺旋状部和大致蛇状部。
16.如权利要求15所述的天线,其特征在于,将作成与所述芯棒大致相同直径的半圆形状以及细带形状的第1导体部沿所述芯棒端部附近起的轴向按规定间隔交替平行配置于所述芯棒圆柱面的正面侧半圆柱面和背面侧半圆柱面,用短的细带状导体连接在相邻的所述第1导体部的端部间来形成大致螺旋状部,还平行配置作成细带状的第2导体部,用短的细带状导体连接在相邻的所述第2导体部的端部间来形成大致蛇状部,并配置于所述大致螺旋部附近。
17.如权利要求15所述的天线,其特征在于,所述第1导体部和第2导体部通过对导电性金属薄板进行冲裁加工形成。
18.如权利要求15所述的天线,其特征在于,挤压加工铜合金或金属经过导电电镀处理的导电性金属线,形成所述天线元件部。
19.如权利要求15所述的天线,其特征在于,挤压加工导电性导体薄板经蚀刻加工所形成的规定布图,形成所述天线元件部。
20.如权利要求15所述的天线,其特征在于,挤压加工形成有规定布图的挠性电路板,形成所述天线元件部。
21.如权利要求15所述的天线,其特征在于,通过导电糊印刷形成所述天线元件部。
22.如权利要求15所述的天线,其特征在于,对导体粉进行烧结形成所述天线元件部。
23.如权利要求15所述的天线,其特征在于,将所述大致螺旋状部一端与所述大致蛇状部一端连接,并连续配置所述大致螺旋状部和所述大致蛇状部。
24.如权利要求15所述的天线,其特征在于,所述芯棒前端部附近具有将所述大致螺旋状部一端与所述大致蛇状部一端连接的连接点,并将所述大致蛇状部配置为与所述大致螺旋状部中心轴平行并且在所述连接点折返。
25.如权利要求15所述的天线,其特征在于,所述芯棒前端部附近具有将所述大致螺旋状部一端与所述大致蛇状部一端连接的连接点,所述第2导体部其中至少一部分为与所述大致螺旋状部基本相同直径的圆弧状,并将所述大致蛇状部配置为在所述连接点折返并且与所述大致螺旋状部离开,还配置为与所述大致螺旋状部呈同心状。
26.如权利要求15所述的天线,其特征在于,与所述天线元件部一体形成所述供电部。
27.一种无线装置,其特征在于,内置权利要求15所述的天线,能够在多个频段中通信。
28.一种无线装置,其特征在于,将多个权利要求1或权利要求15所述的天线分别安装或将它们组合安装,并在它们之间设置进行规定切换动作的开关来进行分集通信。
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- 2001-06-08 US US10/048,062 patent/US6661391B2/en not_active Expired - Fee Related
- 2001-06-08 CN CNB018016324A patent/CN1211883C/zh not_active Expired - Fee Related
- 2001-06-08 KR KR1020027001655A patent/KR100564139B1/ko not_active IP Right Cessation
- 2001-06-08 WO PCT/JP2001/004868 patent/WO2001095430A1/ja active IP Right Grant
- 2001-06-08 DE DE60109608T patent/DE60109608T2/de not_active Expired - Fee Related
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CN111033896A (zh) * | 2017-10-11 | 2020-04-17 | 株式会社友华 | 天线装置 |
CN111033896B (zh) * | 2017-10-11 | 2023-02-03 | 株式会社友华 | 天线装置 |
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WO2001095430A1 (fr) | 2001-12-13 |
US6661391B2 (en) | 2003-12-09 |
KR20020035573A (ko) | 2002-05-11 |
DE60109608D1 (de) | 2005-04-28 |
EP1291963A1 (en) | 2003-03-12 |
JP3835128B2 (ja) | 2006-10-18 |
KR100564139B1 (ko) | 2006-03-27 |
JP2001352210A (ja) | 2001-12-21 |
EP1291963B1 (en) | 2005-03-23 |
DE60109608T2 (de) | 2005-08-11 |
EP1291963A4 (en) | 2003-03-12 |
CN1211883C (zh) | 2005-07-20 |
US20020149537A1 (en) | 2002-10-17 |
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