CN1323431C - 半导体制造设备和半导体器件的制造方法 - Google Patents
半导体制造设备和半导体器件的制造方法 Download PDFInfo
- Publication number
- CN1323431C CN1323431C CNB200410029644XA CN200410029644A CN1323431C CN 1323431 C CN1323431 C CN 1323431C CN B200410029644X A CNB200410029644X A CN B200410029644XA CN 200410029644 A CN200410029644 A CN 200410029644A CN 1323431 C CN1323431 C CN 1323431C
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- Prior art keywords
- semiconductor wafer
- adherence band
- semiconductor
- peeling
- divided
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Images
Classifications
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- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
- B41J29/10—Sound-deadening devices embodied in machines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/22—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of impact or pressure on a printing material or impression-transfer material
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- H—ELECTRICITY
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- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
- H01L2221/6839—Separation by peeling using peeling wedge or knife or bar
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
- Y10S156/941—Means for delaminating semiconductive product
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/976—Temporary protective layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (25)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003085376 | 2003-03-26 | ||
JP085376/2003 | 2003-03-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1532900A CN1532900A (zh) | 2004-09-29 |
CN1323431C true CN1323431C (zh) | 2007-06-27 |
Family
ID=32821499
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200410029644XA Expired - Lifetime CN1323431C (zh) | 2003-03-26 | 2004-03-26 | 半导体制造设备和半导体器件的制造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7223319B2 (zh) |
EP (1) | EP1463094B1 (zh) |
KR (1) | KR100609790B1 (zh) |
CN (1) | CN1323431C (zh) |
MY (1) | MY138343A (zh) |
SG (1) | SG116533A1 (zh) |
TW (1) | TWI278943B (zh) |
Families Citing this family (42)
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JP4107417B2 (ja) * | 2002-10-15 | 2008-06-25 | 日東電工株式会社 | チップ状ワークの固定方法 |
JP2004273639A (ja) * | 2003-03-06 | 2004-09-30 | Shinko Electric Ind Co Ltd | 半導体装置の製造方法 |
JP2004311576A (ja) * | 2003-04-03 | 2004-11-04 | Toshiba Corp | 半導体装置の製造方法 |
JP4283596B2 (ja) * | 2003-05-29 | 2009-06-24 | 日東電工株式会社 | チップ状ワークの固定方法 |
US20090050610A1 (en) * | 2004-10-13 | 2009-02-26 | Mitsuboshi Diamond Industrial Co., Ltd. | Method and apparatus for scribing brittle material board and system for breaking brittle material board |
JP4511903B2 (ja) * | 2004-10-20 | 2010-07-28 | 株式会社ディスコ | ウエーハの分割装置 |
ATE541307T1 (de) * | 2005-02-03 | 2012-01-15 | Shinetsu Polymer Co | Befestigungsträger, herstellungsverfahren für einen befestigungsträger, verwendungsverfahren für einen befestigungsträger und substrataufnahmebehälter |
US8219584B2 (en) | 2005-12-15 | 2012-07-10 | At&T Intellectual Property I, L.P. | User access to item information |
US20070158024A1 (en) * | 2006-01-11 | 2007-07-12 | Symbol Technologies, Inc. | Methods and systems for removing multiple die(s) from a surface |
JP4841262B2 (ja) * | 2006-02-13 | 2011-12-21 | 株式会社東京精密 | ウェーハ処理装置 |
JP4666514B2 (ja) * | 2006-07-20 | 2011-04-06 | リンテック株式会社 | シート剥離装置及び剥離方法 |
JP2008041987A (ja) * | 2006-08-08 | 2008-02-21 | Tokyo Ohka Kogyo Co Ltd | サポートプレートとウェハとの剥離方法及び装置 |
US20100019365A1 (en) * | 2006-09-12 | 2010-01-28 | Nitto Denko Corporation | Dicing/die bonding film |
JP5196838B2 (ja) * | 2007-04-17 | 2013-05-15 | リンテック株式会社 | 接着剤付きチップの製造方法 |
KR100983335B1 (ko) * | 2008-04-04 | 2010-09-20 | 주식회사 에스에프에이 | 태양전지용 웨이퍼의 이송장치 |
WO2010024678A1 (en) * | 2008-09-01 | 2010-03-04 | Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno | Chip die clamping device and transfer method |
JP2010272639A (ja) * | 2009-05-20 | 2010-12-02 | Disco Abrasive Syst Ltd | 研削装置 |
JP5412214B2 (ja) * | 2009-08-31 | 2014-02-12 | 日東電工株式会社 | 保護テープ剥離方法およびその装置 |
US9919509B2 (en) * | 2011-01-07 | 2018-03-20 | Tokyo Electron Limited | Peeling device, peeling system and peeling method |
JP2012195388A (ja) * | 2011-03-15 | 2012-10-11 | Toshiba Corp | 半導体装置の製造方法及び半導体装置 |
KR20120108229A (ko) * | 2011-03-23 | 2012-10-05 | 삼성디스플레이 주식회사 | 레이저 가공용 워크 테이블 |
KR101801264B1 (ko) * | 2011-06-13 | 2017-11-27 | 삼성전자주식회사 | 반도체 제조 장치 및 이를 이용한 반도체 패키지 방법 |
JP5893887B2 (ja) * | 2011-10-11 | 2016-03-23 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
US9151546B2 (en) * | 2013-02-28 | 2015-10-06 | General Electric Company | Heat exchanger assembly |
EP2810752B1 (de) * | 2013-06-06 | 2016-03-30 | GFM GmbH | Verfahren zum Herstellen eines Zuschnitts aus einem Fasergelege |
JP6333031B2 (ja) * | 2014-04-09 | 2018-05-30 | キヤノン株式会社 | インプリント装置および物品の製造方法 |
US9472458B2 (en) * | 2014-06-04 | 2016-10-18 | Semiconductor Components Industries, Llc | Method of reducing residual contamination in singulated semiconductor die |
KR101698644B1 (ko) | 2014-08-14 | 2017-01-20 | 주식회사 엘지화학 | 패널로부터 편광 필름을 박리하기 위한 박리바, 이를 이용한 박리 장치 및 박리 방법 |
CN105904831B (zh) * | 2015-02-23 | 2019-07-26 | Agc株式会社 | 层叠体的剥离装置和剥离方法及电子器件的制造方法 |
US20160276555A1 (en) * | 2015-03-18 | 2016-09-22 | Toyoda Gosei Co., Ltd. | Light emitting device manufacturing method and light emitting device |
JP6338555B2 (ja) * | 2015-07-10 | 2018-06-06 | Towa株式会社 | 吸着機構及び吸着方法並びに製造装置及び製造方法 |
KR101673031B1 (ko) | 2015-07-31 | 2016-11-07 | 그래핀스퀘어 주식회사 | 그래핀 필름의 제조 장치 및 방법 |
CN106653956B (zh) * | 2015-11-04 | 2019-07-05 | 无锡华润华晶微电子有限公司 | 晶圆片翻膜方法、定位装置 |
DE102016106706A1 (de) * | 2016-04-12 | 2017-10-12 | Laser Imaging Systems Gmbh | Vorrichtung zum Fixieren von Objekten mittels Vakuum |
JP2017212255A (ja) * | 2016-05-23 | 2017-11-30 | 株式会社ジェイデバイス | 半導体製造装置及び製造方法 |
IT201600074454A1 (it) * | 2016-07-15 | 2018-01-15 | Spal Automotive Srl | Macchina e procedimento per rimuovere un foglio adesivo da un supporto. |
KR102243345B1 (ko) * | 2016-10-27 | 2021-04-21 | 미쓰이 가가쿠 토세로 가부시키가이샤 | 전자 장치의 제조 방법, 전자 장치 제조용 점착성 필름 및 전자 부품 시험 장치 |
KR102176972B1 (ko) * | 2017-11-10 | 2020-11-10 | 시바우라 메카트로닉스 가부시끼가이샤 | 성막 장치 및 부품 박리 장치 |
CN109786310A (zh) * | 2019-01-14 | 2019-05-21 | 东莞记忆存储科技有限公司 | 粘晶胶纸随晶粒分离的方法 |
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US20230009839A1 (en) * | 2021-07-09 | 2023-01-12 | Taiwan Semiconductor Manufacturing Company | System and method for chemical mechanical polishing pad replacement |
DE102021125237A1 (de) | 2021-09-29 | 2023-03-30 | Infineon Technologies Ag | Wafer-chuck für eine laserstrahl-waferzerteilanlage |
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- 2004-03-26 EP EP04007409.8A patent/EP1463094B1/en not_active Expired - Lifetime
- 2004-03-26 MY MYPI20041093A patent/MY138343A/en unknown
- 2004-03-26 TW TW093108416A patent/TWI278943B/zh not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
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MY138343A (en) | 2009-05-29 |
US7223319B2 (en) | 2007-05-29 |
TW200426953A (en) | 2004-12-01 |
EP1463094A3 (en) | 2006-11-02 |
CN1532900A (zh) | 2004-09-29 |
EP1463094B1 (en) | 2013-05-01 |
US20050019980A1 (en) | 2005-01-27 |
EP1463094A2 (en) | 2004-09-29 |
SG116533A1 (en) | 2005-11-28 |
KR20040084794A (ko) | 2004-10-06 |
TWI278943B (en) | 2007-04-11 |
KR100609790B1 (ko) | 2006-08-08 |
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