CN1305196A - Wafer-type thermosensitive oxide resistor - Google Patents

Wafer-type thermosensitive oxide resistor Download PDF

Info

Publication number
CN1305196A
CN1305196A CN 00133024 CN00133024A CN1305196A CN 1305196 A CN1305196 A CN 1305196A CN 00133024 CN00133024 CN 00133024 CN 00133024 A CN00133024 A CN 00133024A CN 1305196 A CN1305196 A CN 1305196A
Authority
CN
China
Prior art keywords
disk
sintering
oxide
ball milling
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 00133024
Other languages
Chinese (zh)
Inventor
妥万禄
马继才
王伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xinjiang Technical Institute of Physics and Chemistry of CAS
Original Assignee
Xinjiang Technical Institute of Physics and Chemistry of CAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xinjiang Technical Institute of Physics and Chemistry of CAS filed Critical Xinjiang Technical Institute of Physics and Chemistry of CAS
Priority to CN 00133024 priority Critical patent/CN1305196A/en
Publication of CN1305196A publication Critical patent/CN1305196A/en
Pending legal-status Critical Current

Links

Landscapes

  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Thermistors And Varistors (AREA)

Abstract

A wafer-type thermosensitive oxide resistor is prepared from cobalt oxide and manganese oxide through powder producing mechanical process including mixing by ball grinding, pre-sintering and pulverizing by ball grinding, or one of the chemical process of pyroanalyzing, co-deposition, and sol-gel process, and die pressing process. Its advantages are no need of external insulating seal, and high mechanical strength, shock resistance and stability.

Description

Wafer-type thermosensitive oxide resistor
The present invention relates to a kind of wafer-type thermosensitive oxide resistor
NTC (negative temperature coefficient) thermistor great majority are to be made by transition metal oxide.Manganese, cobalt, nickel be NTC (negative temperature coefficient) oxide thermosensitive resistor with its resistance, B value wider range, advantages such as sensitivity height are widely used in fields such as temperature detection and control, temperature-compensating, surge current inhibition.The present invention develops a kind of wafer-type thermosensitive oxide resistor material according to market conditions again simultaneously according to the advantage of NTC (negative temperature coefficient) oxide thermosensitive resistor.This thermistor is applicable to automobile, motorcycle, large-scale engineering machinery, agricultural machinery, the measurement of naval vessel equitemperature.
The object of the invention is, the thermo-sensitive material that the wafer-type thermosensitive oxide resistor of development is made up of cobalt oxide, manganese oxide, mix, give sintering, ball milling or chemical method again through ball milling: slaine thermal decomposition method, coprecipitation, sol-gel process are made powder body material, powder is pressed into disk makes; Be applicable to automobile, motorcycle, large-scale engineering machinery, agricultural machinery, the measuring disk thermistor spare of naval vessel equitemperature, its outside need not insulated enclosure, and mechanical strength height, vibration strength are good, stable and reliable for performance.
Wafer-type thermosensitive oxide resistor of the present invention, the thermo-sensitive material that this thermistor is made up of cobalt oxide, manganese oxide, through the Mechanical Method ball milling, mix, give sintering, ball milling or chemical method slaine thermal decomposition method, coprecipitation, sol-gel process are made powder again, powder is pressed into disk makes; Wherein each set of dispense ratio is: the metallic atom ratio
Cobalt: manganese=1-9: 9-1
The preparation method of wafer-type thermistor follows these steps to carry out:
A, at first cobalt oxide, manganese oxide raw material are mixed through ball milling by proportioning, 1000-1100 ℃ is given sintering, and give after the burning ball milling again and make powder body material or chemical method: slaine thermal decomposition method, coprecipitation, sol-gel process are made powder,
B and then the powder body material that makes added the granulation of 5-15% poly (vinyl alcohol) binder, the siccative after the granulation is pressed into disk parison body with tablet press machine, is sintering porcelain into through high temperature 1100-1400 ℃;
C, will be on two planes of the disk behind the sintering apply silver or nickel or aluminium conductor slurry, burning infiltration silver or nickel or aluminium conductor metal level are as two electrodes; The making of electrode layer also can plate conductor metal layer on two planes of disk with the method for chemical plating.
Embodiment 1 (metallic atom ratio)
A, at first with cobalt oxide: 1: 9 raw material of manganese oxide mix through the Mechanical Method ball milling, and 1000 ℃ are given sintering, give after the burning ball milling again and make powder body material;
B and then the powder body material that makes added 5% poly (vinyl alcohol) binder granulation, the siccative after the granulation is pressed into disk parison body with tablet press machine, is sintering porcelain into for 1150 ℃ through high temperature;
Apply silver conductive paste on c, two planes with the disk behind the sintering, burning infiltration silver conductor metal level is as two electrodes; The making of electrode layer also can plate conductor metal layer on two planes of disk with the method for chemical plating.Its B value is 3300K, 25 ℃ of 100 Ω of resistance value.
Embodiment 2 (metallic atom ratio)
A, at first with cobalt oxide: 6: 4 raw material of manganese oxide are made powder body material through chemical method slaine thermal decomposition method;
B and then the powder body material that makes added 8% poly (vinyl alcohol) binder granulation, the siccative after the granulation is pressed into disk parison body with tablet press machine, is sintering porcelain into for 1200 ℃ through high temperature;
C, with nickel coating conductor paste on two planes of the disk behind the sintering, the heating-up nickel conductor metal layer is as two electrodes; The making of electrode layer also can plate conductor metal layer on two planes of disk with the method for chemical plating.Its B value is 3600K, 25 ℃ of 210 Ω of resistance value.
Embodiment 3 (metallic atom ratio)
A, at first with cobalt oxide: 5: 5 raw material of manganese oxide are through chemical method: coprecipitation is made powder body material;
B and then the powder body material that makes added 10% poly (vinyl alcohol) binder granulation, the siccative after the granulation is pressed into disk parison body with tablet press machine, is sintering porcelain into for 1300 ℃ through high temperature;
C, with coated with aluminum conductor paste on two planes of the disk behind the sintering, burning infiltration aluminium conductor metal level is as two electrodes; The making of electrode layer also can plate conductor metal layer on two planes of disk with the method for chemical plating.Its B value is 4200K, 25 ℃ of 400 Ω of resistance value.
Embodiment 4 (metallic atom ratio)
A, at first with cobalt oxide: 9: 1 raw material of manganese oxide mix through ball milling, and 1050 ℃ are given sintering, give after the burning ball milling again and make powder body material;
B and then the powder body material that makes added 12% poly (vinyl alcohol) binder granulation, the siccative after the granulation is pressed into disk parison body with tablet press machine, is sintering porcelain into for 1250 ℃ through high temperature;
Apply silver conductive paste on c, two planes with the disk behind the sintering, burning infiltration silver conductor metal level is as two electrodes; The making of electrode layer also can plate conductor metal layer on two planes of disk with the method for chemical plating.Its B value is 4500K, 25 ℃ of 1200 Ω of resistance value.
Embodiment 5 (metallic atom ratio)
A, at first with cobalt oxide: 8: 2 raw material of manganese oxide are through chemical method: sol-gel process is made powder body material;
B and then the powder body material that makes added 15% poly (vinyl alcohol) binder granulation, the siccative after the granulation is pressed into disk parison body with tablet press machine, is sintering porcelain into for 1250 ℃ through high temperature;
C, with nickel coating conductor paste on two planes of the disk behind the sintering, the heating-up nickel conductor metal layer is as two electrodes; The making of electrode layer also can plate conductor metal layer on two planes of disk with the method for chemical plating.Its B value is 5000K, 25 ℃ of 1100 Ω of resistance value.

Claims (2)

1, a kind of wafer-type thermosensitive oxide resistor, it is characterized in that, the thermo-sensitive material that this thermistor is made up of cobalt oxide, manganese oxide, through the Mechanical Method ball milling mix, give sintering, ball milling or chemical method slaine thermal decomposition method, coprecipitation, sol-gel process are made powder again, powder is pressed into disk makes; Wherein each set of dispense ratio is: the metallic atom ratio
Cobalt: manganese=1-9: 9-1
2, the preparation method of wafer-type thermistor according to claim 1 is characterized in that, presses routine step and carries out:
A, at first cobalt oxide, manganese oxide raw material are mixed through the Mechanical Method ball milling by proportioning, 1000-1100 ℃ is given sintering, and give after the burning ball milling or chemical method again: slaine thermal decomposition method, coprecipitation, sol-gel process are made powder body material;
B and then the powder body material that makes added the granulation of 5-15% poly (vinyl alcohol) binder, the siccative after the granulation is pressed into disk parison body with tablet press machine, is sintering porcelain into through high temperature 1100-1400 ℃;
C, will be on two planes of the disk behind the sintering apply silver or nickel or aluminium conductor slurry, burning infiltration silver or nickel or aluminium conductor metal level are as two electrodes; The making of electrode layer also can plate conductor metal layer on two planes of disk with the method for chemical plating.
CN 00133024 2000-11-15 2000-11-15 Wafer-type thermosensitive oxide resistor Pending CN1305196A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 00133024 CN1305196A (en) 2000-11-15 2000-11-15 Wafer-type thermosensitive oxide resistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 00133024 CN1305196A (en) 2000-11-15 2000-11-15 Wafer-type thermosensitive oxide resistor

Publications (1)

Publication Number Publication Date
CN1305196A true CN1305196A (en) 2001-07-25

Family

ID=4595473

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 00133024 Pending CN1305196A (en) 2000-11-15 2000-11-15 Wafer-type thermosensitive oxide resistor

Country Status (1)

Country Link
CN (1) CN1305196A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108917973A (en) * 2018-08-06 2018-11-30 深圳大图科创技术开发有限公司 A kind of ultrathin type temperature sensor
CN108981820A (en) * 2018-08-06 2018-12-11 深圳明创自控技术有限公司 A kind of novel household environmental detection set
CN108999774A (en) * 2018-08-06 2018-12-14 深圳源广安智能科技有限公司 A kind of natural gas compressor remote diagnosis system
CN109041929A (en) * 2018-08-06 2018-12-21 梧州市兴能农业科技有限公司 A kind of nursery box
CN109085781A (en) * 2018-08-06 2018-12-25 深圳汇创联合自动化控制有限公司 A kind of home environment detection device
CN109113557A (en) * 2018-08-06 2019-01-01 深圳市晟达机械设计有限公司 A kind of solar automatic curtain

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108917973A (en) * 2018-08-06 2018-11-30 深圳大图科创技术开发有限公司 A kind of ultrathin type temperature sensor
CN108981820A (en) * 2018-08-06 2018-12-11 深圳明创自控技术有限公司 A kind of novel household environmental detection set
CN108999774A (en) * 2018-08-06 2018-12-14 深圳源广安智能科技有限公司 A kind of natural gas compressor remote diagnosis system
CN109041929A (en) * 2018-08-06 2018-12-21 梧州市兴能农业科技有限公司 A kind of nursery box
CN109085781A (en) * 2018-08-06 2018-12-25 深圳汇创联合自动化控制有限公司 A kind of home environment detection device
CN109113557A (en) * 2018-08-06 2019-01-01 深圳市晟达机械设计有限公司 A kind of solar automatic curtain

Similar Documents

Publication Publication Date Title
US4103274A (en) Reconstituted metal oxide varistor
JP3532926B2 (en) Resistance wiring board and method of manufacturing the same
US7018864B2 (en) Conductive paste for terminal electrodes of monolithic ceramic electronic component, method for making monolithic ceramic electronic component, and monolithic ceramic electronic component
US7067173B2 (en) Method for manufacturing laminated electronic component
CN112479681B (en) Negative temperature coefficient thermistor chip and preparation method thereof
CN1305196A (en) Wafer-type thermosensitive oxide resistor
CN1305197A (en) Wafer-type thermosensitive oxide resistor
KR102341611B1 (en) Composition for positive temperature coefficient resistor, paste for positive temperature coefficient resistor, positive temperature coefficient resistor and method for producing positive temperature coefficient resistor
CN115667169A (en) Preparation method of glass powder, silver paste and preparation method
US5562972A (en) Conductive paste and semiconductor ceramic components using the same
CA3117828C (en) Electronic paste composition, and preparation method and use of the same
CN112309607B (en) Slurry composition based on multiple subgroup elements and preparation method and application thereof
EP0974983A1 (en) Thermistor
JPH0661013A (en) Thick film positive temperature coefficient thermistor composition and manufacture thereof as well as thick film positive temperature coefficient thermistor using the composition
EP0938104A2 (en) Resistor material, resistive paste and resistor using the resistor material, and multi-layered ceramic substrate
JP7039075B2 (en) Conductive material, conductive ceramics, conductive paste, conductive material film, composite oxide manufacturing method, conductive paste manufacturing method and conductive material film manufacturing method
EP0722175B1 (en) Resistance paste and resistor comprising the material
CN102603289B (en) Ceramic composite and electronic components
KR100201160B1 (en) Resistance material composition, resistive paste, and resistor
JP7043046B2 (en) Sintering conductive materials, conductive ceramics, conductive pastes, and conductive material membranes
CN113808799A (en) Ultralow B value negative temperature thermistor assembly and preparation method thereof
KR100283450B1 (en) PROCESS OF MANUFACTURING SrTiO3 THERMISTOR SYNTHESIS WITH FRIT
CA1096051A (en) Reconstituted metal oxide varistor
CN116031033A (en) Direct-current low-residual voltage type piezoresistor and preparation method thereof
JPH07122404A (en) Thick film thermistor composition, manufacture thereof, and thick film thermistor using the composition and manufacture thereof

Legal Events

Date Code Title Description
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication