CN1297675A - 布置在膜上电子电路的定位装置 - Google Patents
布置在膜上电子电路的定位装置 Download PDFInfo
- Publication number
- CN1297675A CN1297675A CN99805123A CN99805123A CN1297675A CN 1297675 A CN1297675 A CN 1297675A CN 99805123 A CN99805123 A CN 99805123A CN 99805123 A CN99805123 A CN 99805123A CN 1297675 A CN1297675 A CN 1297675A
- Authority
- CN
- China
- Prior art keywords
- suction spindle
- chip
- arm
- bearing
- hollow shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S29/00—Metal working
- Y10S29/044—Vacuum
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Liquid Crystal (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ATA279/1998 | 1998-02-17 | ||
AT0027998A AT406536B (de) | 1998-02-17 | 1998-02-17 | Einrichtung zum positionieren von auf einer folie angeordneten elektronischen schaltungen |
AT0045398A AT406537B (de) | 1998-03-13 | 1998-03-13 | Einrichtung zum positionieren von auf einer folie angeordneten elektronischen schaltungen |
ATA453/1998 | 1998-03-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1297675A true CN1297675A (zh) | 2001-05-30 |
CN1189070C CN1189070C (zh) | 2005-02-09 |
Family
ID=25592154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB998051233A Expired - Fee Related CN1189070C (zh) | 1998-02-17 | 1999-02-12 | 布置在膜上电子电路的定位装置 |
Country Status (9)
Country | Link |
---|---|
US (1) | US6507996B1 (zh) |
EP (1) | EP1057388B1 (zh) |
JP (1) | JP2002504759A (zh) |
CN (1) | CN1189070C (zh) |
AT (1) | ATE207286T1 (zh) |
AU (1) | AU2403599A (zh) |
DE (1) | DE59900324D1 (zh) |
HK (1) | HK1037848A1 (zh) |
WO (1) | WO1999043192A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100373579C (zh) * | 2004-09-24 | 2008-03-05 | 先进自动器材有限公司 | 倒装电子元件的装置和方法 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002531845A (ja) * | 1998-12-02 | 2002-09-24 | シュランバーガー テクノロジーズ インク. | Icデバイスを反転させる装置および方法 |
JP4480840B2 (ja) * | 2000-03-23 | 2010-06-16 | パナソニック株式会社 | 部品実装装置、及び部品実装方法 |
EP1310986A1 (de) | 2001-11-08 | 2003-05-14 | F & K Delvotec Bondtechnik GmbH | Chipträgerplatten-Wechselmechanismus |
ATE371362T1 (de) | 2002-11-25 | 2007-09-15 | F & K Delvotec Bondtech Gmbh | Chipübergabestation einer bondmaschine |
DE102004007703B3 (de) * | 2004-02-16 | 2005-06-23 | Mühlbauer Ag | Vorrichtung und Verfahren zum Überprüfen und Umdrehen elektronischer Bauelemente |
CH698718B1 (de) | 2007-01-31 | 2009-10-15 | Oerlikon Assembly Equipment Ag | Vorrichtung für die Montage eines Flipchips auf einem Substrat. |
WO2009056469A1 (en) * | 2007-10-31 | 2009-05-07 | Oerlikon Assembly Equipment Ag, Steinhausen | Foil perforating needle for detaching a small die from a foil |
JP5578094B2 (ja) * | 2011-01-25 | 2014-08-27 | パナソニック株式会社 | 部品実装装置 |
CN110911317A (zh) * | 2019-12-05 | 2020-03-24 | 袁晓华 | 一种基于物联网的芯片生产误差控制方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8103573A (nl) * | 1981-07-29 | 1983-02-16 | Philips Nv | Inrichting voor het tegelijkertijd toevoeren van meerdere in banden verpakte electrische en/of electronische onderdelen aan een bepaalde positie. |
JPH0760841B2 (ja) | 1988-08-22 | 1995-06-28 | 松下電器産業株式会社 | 電子部品実装装置 |
US4980971A (en) * | 1989-12-14 | 1991-01-01 | At&T Bell Laboratories | Method and apparatus for chip placement |
DE19610294A1 (de) * | 1995-04-03 | 1996-10-10 | Rossell Ag | Einrichtung zum Positionieren und Aufbringen von elektronischen Bauteilen |
KR0175267B1 (ko) * | 1995-09-30 | 1999-04-01 | 김광호 | 회전운동을 하는 픽업 툴을 구비하는 다이 본딩 장치 |
-
1999
- 1999-02-12 AT AT99903530T patent/ATE207286T1/de not_active IP Right Cessation
- 1999-02-12 EP EP99903530A patent/EP1057388B1/de not_active Expired - Lifetime
- 1999-02-12 US US09/600,891 patent/US6507996B1/en not_active Expired - Lifetime
- 1999-02-12 WO PCT/AT1999/000037 patent/WO1999043192A1/de active IP Right Grant
- 1999-02-12 CN CNB998051233A patent/CN1189070C/zh not_active Expired - Fee Related
- 1999-02-12 AU AU24035/99A patent/AU2403599A/en not_active Abandoned
- 1999-02-12 JP JP2000533004A patent/JP2002504759A/ja not_active Withdrawn
- 1999-02-12 DE DE59900324T patent/DE59900324D1/de not_active Expired - Lifetime
-
2001
- 2001-11-20 HK HK01108169A patent/HK1037848A1/xx not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100373579C (zh) * | 2004-09-24 | 2008-03-05 | 先进自动器材有限公司 | 倒装电子元件的装置和方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2002504759A (ja) | 2002-02-12 |
ATE207286T1 (de) | 2001-11-15 |
CN1189070C (zh) | 2005-02-09 |
US6507996B1 (en) | 2003-01-21 |
WO1999043192A1 (de) | 1999-08-26 |
EP1057388A1 (de) | 2000-12-06 |
DE59900324D1 (de) | 2001-11-22 |
EP1057388B1 (de) | 2001-10-17 |
HK1037848A1 (en) | 2002-02-15 |
AU2403599A (en) | 1999-09-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: BESSIE SWISS CO., LTD. Free format text: FORMER OWNER: BESSIE AUSTRIA CO., LTD. Effective date: 20140811 Owner name: BESSIE AUSTRIA CO., LTD. Free format text: FORMER OWNER: DATACON SEMICONDUCTOR EQUIPMENT GMBH Effective date: 20140811 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20140811 Address after: Swiss Camden Patentee after: Bessie Swiss AG Address before: Austria Ladefeierde Patentee before: Bessie Austria LLC Effective date of registration: 20140811 Address after: Austria Ladefeierde Patentee after: Bessie Austria LLC Address before: Austria Ladefeierde Patentee before: Datacon Semiconductor Equipment GmbH |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050209 Termination date: 20170212 |