CN1275097C - Projection exposure equipment - Google Patents

Projection exposure equipment Download PDF

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Publication number
CN1275097C
CN1275097C CNB031372902A CN03137290A CN1275097C CN 1275097 C CN1275097 C CN 1275097C CN B031372902 A CNB031372902 A CN B031372902A CN 03137290 A CN03137290 A CN 03137290A CN 1275097 C CN1275097 C CN 1275097C
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CN
China
Prior art keywords
mark
mask
mentioned
exposure
detecting apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB031372902A
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Chinese (zh)
Other versions
CN1467569A (en
Inventor
三宫胜也
中川涉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ADITECH ENGINEERING Co Ltd
Original Assignee
ADITECH ENGINEERING Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ADITECH ENGINEERING Co Ltd filed Critical ADITECH ENGINEERING Co Ltd
Publication of CN1467569A publication Critical patent/CN1467569A/en
Application granted granted Critical
Publication of CN1275097C publication Critical patent/CN1275097C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Sustainable Development (AREA)
  • Multimedia (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

Provided is a projection aligner having the ability of highly accurate positioning. The mask mark 51 of a photomask 50 is irradiated with exposure light by an exposure lighting device 4. The image is formed in an imaging section 5 through a projection exposure lens 70, picked up by a CCD camera 2, with the data prepared and recorded in an arithmetic and control unit 11, and then used as a recorded mask mark 51'. After that, a substrate mark 61 is irradiated with infra-red light by an infra-red light emission device 3 to obtain the image of the substrate mark 61, with a positional error detected between the mask mark 51' and the substrate mark 61, and then the positioning is performed. The mask mark 51' and the substrate mark 61 are simultaneously displayed in a manner superimposed on a display device 12.

Description

Projection aligner
Technical field
The present invention relates to a kind of projection aligner.
Background technology
To be depicted in assignment graph sensitization print on the photomask by exposure device and be widely used in various fields by etch process forms figure on printed circuit board (PCB) photoetching process after the printed circuit board surface that has applied photosensitive materials such as photoresist, printed circuit board (PCB) etc. also uses exposure device manufacturing in recent years.
Projection aligner is by via optical systems such as projection exposure lens the circuitous pattern of photomask being carried out projection exposure, device with the multiplying power identical or certain type of generating writing pattern on printed circuit board (PCB) with mask, it originally was used for the manufacturing of integrated circuit, but was attempting in recent years projection aligner is used to make printed circuit board (PCB).
When exposing with exposure device, must carry out the position alignment of photomask and printed circuit board (PCB), usually on the two of photomask side and printed circuit board side, all dispose the mark that position alignment is used, position alignment mark on the photomask is projected on the printed circuit board (PCB), it is carried out instrumentation and make them consistent with position alignment mark on the printed circuit board (PCB) with CCD camera etc.At this moment, when the mark of photomask side was carried out projection, if use exposure wavelength light, then the photoresist on the printed circuit board (PCB) can sensitization, so the light of wavelength beyond the general using exposure wavelength.Usually use ultraviolet ray as exposure wavelength, and mark projection infrared ray.
Yet, in projection aligner, owing to via projection exposure lens consistent with exposure wavelength etc. the mask mark is carried out projection, the image space of mark produces skew and has and can't carry out the problem that the tram is aimed under the situation of carrying out projection with infrared ray.
For solving the above problems, the method for using correcting lens is arranged.
In addition, as No. 2629709, special permission and to specially permit the motion that the relevant integrated circuit that proposes for No. 2720873 makes disclosed, can consider the mask mark imaged on the position of separating with the exposure object thing and migrate to the exposure device of printed circuit board (PCB) with the technology that prevents the sensitization of exposure object thing.
But be to use under the situation of correcting lens, except correcting lens, also must be useful on the device of the position of control correcting lens, the problem that exists installation cost to increase.
In addition, the mask mark is being imaged under the locational situation of separation, the material that will have the imaging of making maintenance storage certain hour, for example with twilight sunset than fluorescent material of elongated etc. as imaging surface, carry out position alignment at this twilight sunset duration of existence, but, must eliminate twilight sunset last time fully in order to carry out correct position alignment, existence also needs to be used to eliminate the problems such as over head time of twilight sunset except needs are eliminated the necessary equipment of twilight sunset.
Summary of the invention
The objective of the invention is to solve above-mentioned prior art problems.
For reaching above-mentioned purpose, projection aligner of the present invention comprises: photomask, and it has described figure; Objective table, its placement are exposed the exposure object thing of this photomask pattern; Projection optical system, it can be with respect to exposure object thing this photomask pattern that dwindles or expose enlargedly, and this projection aligner is characterised in that, comprising: the mask mark, it is located on the above-mentioned photomask, uses for position alignment; The object mark, it is located on the above-mentioned exposure object thing, uses for position alignment; Mask mark lighting source, it uses the rayed aforementioned mask mark with the identical wavelength of exposure wavelength; Mask is marked as the picture body, and its above-mentioned exposure object thing that is arranged on the above-mentioned objective table is placed extraneous assigned address, via above-mentioned projection optical system will with the picture imaging of the mask mark that light shone of the identical wavelength of exposure wavelength; The mask mark detecting apparatus, it is marked as the picture of the mask mark on the body and photographs imaging in this mask, should be as datumization and storage; Object mark lighting source, it uses the above-mentioned object mark of non-exposure wavelength rayed with the exposure wavelength different wave length; The object mark detecting apparatus, it is photographed to the object mark that is shone by above-mentioned non-exposure wavelength light; Position regulator, it by the mask marker image of datumization and above-mentioned object marker image of being photographed, adjusts the position relation of above-mentioned photomask and exposure object thing according to above-mentioned.
In above-mentioned structure,, can obtain correct mask marker image because the mask mark carries out projection via projection optical system.And, therefore can not produce problems such as exposure object thing sensitization because mask is marked as and is arranged on the exposure object thing as body and places the outer appointed positions of scope.And owing to be marked as the mask marker image on the body and photograph and will store after its datumization imaging in mask by mask mark detection device, therefore, as long as the time that the mask marker image need not be kept the storage appointment is the only light time imaging that exposes in irradiation.Therefore, have need not the twilight sunset type fluorescent material etc. as the imaging body, and need not eliminate the effects such as device of twilight sunset.
If above-mentioned photomask imaging body adopts the type near above-mentioned non-exposure wavelength light wavelength development mask marker image, because available same device is photographed, so aforementioned mask mark detecting apparatus and above-mentioned object mark detecting apparatus are realized as same device.In the typical embodiment, above-mentioned non-exposure wavelength light is infrared light, and aforementioned mask is marked as to have by exposure wavelength as body and excites and send infrared light and the fluorescence member of the mask marker image of developing.
Description of drawings
Fig. 1 is the synoptic diagram of expression one embodiment of the present invention.
Fig. 2 is the general positive map of the action of expression one embodiment of the present invention.
Fig. 3 is the key diagram of the configuration status of the imaging portion 5 in the expression one embodiment of the present invention.
Fig. 4 is the mask mark 51 of expression in the one embodiment of the present invention and the key diagram of the show state of circuit board mark 61.
The reference numeral explanation
1: mark detecting apparatus; The 2:CCD camera; 3: the infrared illumination device; 4: the exposure illuminating apparatus; 5: imaging portion; 10: image processing apparatus; 11: operation control device; 12: display device; 13: driving control device; 20: camera view; 50: photomask; 51: the mask mark; 52: the photomask objective table; 60: printed circuit board (PCB); 61: the circuit board mark; 62: objective table; 63: mobile device; 65: maximum circuit board is placed scope; 70: the projection exposure lens; 71: exposure light source.
Embodiment
Below with reference to the accompanying drawings, embodiments of the present invention are described.
Fig. 1 is the projection aligner that is used to make printed circuit board (PCB), and the printed circuit board (PCB) 60 that has applied photoresist is positioned on the objective table 62, can move along XYZ and θ direction by mobile device 63.
And mobile device 63 is controlled by operation control device 11.
The photomask 50 of describing the circuit figures that should expose is provided with towards printed circuit board (PCB) 60 via projection exposure lens 70, and is supported by mask objective table 52, and its position can be adjusted.By ultraviolet exposure,, amplify or dwindle or wait doubly print on printed circuit board (PCB) 60 with the multiplying power of the appointment that projection exposure lens 70 were determined with the circuit figures from exposure light source 71.
And photomask 50 is equipped on the above-below direction with printed circuit board (PCB) 60 in Fig. 1, but is not limited to this, on the contrary also be provided with can, or photomask 50 and printed circuit board (PCB) 60 vertical stand-ups are set also can.
In addition, if printed circuit board (PCB) 60 is not removable, then photomask 50 is removable, and is also can the both removable.
On photomask 50, be provided with mask mark 51, on printed circuit board (PCB) 60, be provided with circuit board mark 61.Use this mask mark 51 to carry out position alignment with circuit board mark 61.
Have CCD camera 2, infrared illumination device 3 in the body part of mark detecting apparatus 1, and be connected with exposure illuminating apparatus 4, imaging portion 5 and image processing apparatus 10, operation control device 11, display device 12, driving control device 13.
Mark detecting apparatus 1 can move, and moves control via driving control device 13 by operation control device 11.
Mark detecting apparatus 1 can be provided with a plurality of as required, two or four of operated by rotary motion.
Moving stage 62 as shown in Figure 2, make imaging portion 5 be positioned at the below of mark detecting apparatus 1, mark detecting apparatus 1 is moved, make under the state that imaging portion 5 comes into view, exposure illuminating apparatus 4 only shines the ultraviolet ray of exposure wavelength in mask mark 51 parts, via projection exposure lens 70, make mask mark 51 image in imaging portion 5 shown in Figure 2.Exposure illuminating apparatus 4 is radiated at diameter and is about scope about 8mm.Objective table 62 is controlled by operation control device 11 with the amount of movement of mark detecting apparatus 1, and writes down its amount of movement by it.
Because the picture of mask mark 51 is by the exposure wavelength imaging therefrom, therefore projection exposure lens 70 can not take place causes problems such as offset.
The maximum circuit board that imaging portion 5 is disposed at objective table 62 is as shown in Figure 3 placed the outside of scope 65, can not make maximum circuit board place the photoresist sensitization of the printed circuit board (PCB) of placing on the scope 65 60 from the irradiation of the exposure wavelength of exposure illuminating apparatus 4.
Imaging portion 5 can use any device that develops by exposure wavelength, uses the fluorescence member in the present embodiment, is excited by exposure wavelength and sends visible or infrared light and develop.Thus, carry out the photography of mask mark 51 and the photography of circuit board mark 61 with same mark detecting apparatus 1 with CCD camera 2.
And, with the member of no twilight sunset type as the fluorescence member, thereby need not to look like cancellation element and elimination time, and can shorten man-hour.
The picture of the mask mark 51 in this imaging portion 5 is photographed by the CCD camera 2 of mark detecting apparatus 1.Should deliver to image processing apparatus 10 as data, carry out the processing of appointment, and the picture data recording of this mask mark 51 is constituted in the operation control device 11 of main body in micro computer at this.This is as data image conversion and demonstration once more in display device 12.Also can make new marker image according to the position data of mask mark 51.
In mark detecting apparatus 1, comprise the optical devices that half-mirror etc. is fit to, one side make from the ultraviolet light of projection exposure lens 70 by and be radiated in the imaging portion 5, one side is photographed by the picture of 2 pairs of imaging portions 5 of CCD camera.Therefore, the picture of mask mark 51 is photographed in 4 irradiations of exposure illuminating apparatus, needn't stay after image in imaging portion 5.
On the other hand, the circuit board mark 61 on the printed circuit board (PCB) 60 be positioned at by objective table shown in Figure 1 62 mobile mark detecting apparatus 1 below enter the visual field of mark detecting apparatus 1 after, shine by infrared ray, photograph by CCD camera 2 from infrared illumination device 3.This picture is accepted the processing of appointment in image processing apparatus 10, picture signal is sent to operation control device 11.The amount of movement of objective table 62 is stored at operation control device 11.
In operation control device 11, mobile data according to objective table 62 and mark detecting apparatus 1 carries out basic position correction, according to the data of the above-mentioned mask mark of storing 51 and the data of circuit board mark 61, its site error of instrumentation moves this objective table 62 so that this error is 0 via driving control device 13 and mobile device 63.
In addition, the data-signal of the mask mark of being stored 51 carries out image conversion and shows in display device 12, circuit board mark 61 also is shown in display device 12 simultaneously, according to the mobile data of objective table 62 with mark detecting apparatus 1, carries out after the position correction two picture registrations being shown.Can visually carry out the affirmation of both positions.Fig. 4 represents this state.
The circuit board marks 61 of being caught in the camera view 20 are that benchmark overlaps demonstration with the mask mark 51 ' of image conversion again.
The following describes action.
At first as shown in Figure 2, objective table 62 is moved make imaging portion 5 be positioned at the below of pick-up unit 1, under this state, will shine in mask mark 51 from the ultraviolet ray of exposure illuminating apparatus 4, the picture of mask mark 51 is imaged in the imaging portion 5, and this looks like to photograph with 2 pairs in CCD camera simultaneously.After photography finishes, stop irradiation from the ultraviolet light of exposure illuminating apparatus 4.
This mask mark 51 be sent to image processing apparatus 10 as data, after this accepts the processing of appointment, be recorded in operation control device 11, and in display device 12 image conversion and show once more.
Then make the invariant position of mark detecting apparatus 1, objective table 62 is moved and make the circuit board mark 61 of printed circuit board (PCB) 60 be positioned at the below of mark detecting apparatus 1, irradiation is from the infrared light of the non-exposure light of infrared illumination device 3, similarly circuit board mark 61 is photographed, send to image processing apparatus 10, operation control device 11, the site error of the mask mark 51 ' of asking for circuit board mark 61 and being stored makes objective table 62 move forward into line position and aims at so that this error is 0.This state carries out image with display device 12 and is shown as shown in Figure 4 state.
After above position alignment finishes, exposure illuminating apparatus 4 and mark detecting apparatus 1 are kept out of the way, implemented exposure by exposure light source 71.
In the structure of above explanation, because mask mark 51 similarly is by exposure light gained, the not skew that is caused by projection exposure lens 70.In addition, because imaging in the imaging portion 5 that is set in outside the maximum circuit board placement scope 65 does not have because the harmful effect that exposure light is caused printed circuit board (PCB) 60.
In addition, since the picture of mask mark 51 as the data recording of electronic signal in s operation control portion 11, therefore need not have the function of image retention, also need not be used to eliminate the equipment and the elimination time of this image, can reach the purpose of simplified equipment and rapidization of operation in imaging portion 5.
In addition, the picture of mask mark 51 can be obtained as visible or infrared light and can use same mark detecting apparatus 1 to obtain the effect such as look like of mask mark 51 and circuit board mark 61 by using fluorophor as imaging portion 5, having.
According to aforesaid projection aligner of the present invention, have and to implement high-precision position alignment and can not bring effects such as printed circuit board (PCB) harmful effect.

Claims (8)

1. projection aligner comprises: photomask, and it has described figure; Objective table, its placement are exposed the exposure object thing of this photomask pattern; Projection optical system, it can be with respect to exposure object thing this photomask pattern that dwindles or expose enlargedly,
It is characterized in that, comprising:
The mask mark, it is located on the above-mentioned photomask, uses for position alignment;
The object mark, it is located on the above-mentioned exposure object thing, uses for position alignment;
Mask mark lighting source, it uses the rayed aforementioned mask mark with the identical wavelength of exposure wavelength;
Mask is marked as the picture body, and its above-mentioned exposure object thing that is arranged on the above-mentioned objective table is placed extraneous assigned address, via above-mentioned projection optical system will with the picture imaging of the mask mark that light shone of the identical wavelength of exposure wavelength;
The mask mark detecting apparatus, it is marked as the picture of the mask mark on the body and photographs imaging in this mask, should be as datumization and storage;
Object mark lighting source, it uses the above-mentioned object mark of non-exposure wavelength rayed with the exposure wavelength different wave length;
The object mark detecting apparatus, it is photographed to the object mark that is shone by above-mentioned non-exposure wavelength light;
Position regulator, it by the mask marker image of datumization and above-mentioned object marker image of being photographed, adjusts the position relation of above-mentioned photomask and exposure object thing according to above-mentioned.
2. projection aligner as claimed in claim 1 is characterized in that:
Aforementioned mask is marked as body only using when with the light of the identical wavelength of above-mentioned exposure wavelength the aforementioned mask mark being shone, and the aforementioned mask mark is carried out imaging.
3. projection aligner as claimed in claim 2 is characterized in that:
Aforementioned mask is marked as the fluorescence member that has no twilight sunset as body.
4. projection aligner as claimed in claim 1 is characterized in that:
Aforementioned mask is marked as body and function and approaches above-mentioned non-exposure wavelength light wavelength development mask marker image.
5. projection aligner as claimed in claim 1 is characterized in that:
Above-mentioned non-exposure wavelength is infrared light only;
Aforementioned mask is marked as body and sends infrared light and development mask marker image by the exposure wavelength optical excitation.
6. as claim 4 or 5 described projection aligners, it is characterized in that:
Aforementioned mask mark detecting apparatus and above-mentioned object mark detecting apparatus are same device.
7. projection aligner as claimed in claim 1 is characterized in that:
Also comprise control device, this control device is according to the assigned address that is marked as the picture body by the detected mask mark of aforementioned mask mark detecting apparatus, aforementioned mask and by the detected object mark of above-mentioned object mark detecting apparatus, control above-mentioned position regulator, make the aforementioned mask mark position consistent with above-mentioned object mark position.
8. projection aligner as claimed in claim 1 is characterized in that, also comprises:
The image conversion device, it carries out image conversion to the mask mark that has been carried out datumization by the aforementioned mask mark detecting apparatus; And
Display device, it shows the mask mark of this image conversion and the image of above-mentioned object mark of being photographed.
CNB031372902A 2002-06-04 2003-06-04 Projection exposure equipment Expired - Fee Related CN1275097C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002162979A JP2004012598A (en) 2002-06-04 2002-06-04 Projection aligner
JP162979/2002 2002-06-04

Publications (2)

Publication Number Publication Date
CN1467569A CN1467569A (en) 2004-01-14
CN1275097C true CN1275097C (en) 2006-09-13

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KR (1) KR20040002511A (en)
CN (1) CN1275097C (en)
TW (1) TW200307858A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3880589B2 (en) * 2004-03-31 2007-02-14 キヤノン株式会社 Position measuring apparatus, exposure apparatus, and device manufacturing method
CN100428058C (en) * 2005-06-03 2008-10-22 中国科学院上海光学精密机械研究所 Odd aberration in-situ detection method for projection objective of photoetching machine
CN100451838C (en) * 2005-07-29 2009-01-14 友达光电股份有限公司 Aligning system and aligning method
JP5523207B2 (en) * 2010-06-01 2014-06-18 株式会社トプコン Exposure equipment
CN102865815B (en) * 2012-09-24 2015-01-07 上海功源电子科技有限公司 Novel positioning compensation method for PCB by single vision camera
CN108290694B (en) * 2015-10-01 2021-05-04 因特瓦克公司 Wafer plate and mask apparatus for substrate fabrication

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KR20040002511A (en) 2004-01-07
JP2004012598A (en) 2004-01-15
CN1467569A (en) 2004-01-14
TW200307858A (en) 2003-12-16

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