TW200307858A - Projection exposure device - Google Patents

Projection exposure device Download PDF

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Publication number
TW200307858A
TW200307858A TW092112104A TW92112104A TW200307858A TW 200307858 A TW200307858 A TW 200307858A TW 092112104 A TW092112104 A TW 092112104A TW 92112104 A TW92112104 A TW 92112104A TW 200307858 A TW200307858 A TW 200307858A
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TW
Taiwan
Prior art keywords
mark
mask
exposure
image
light
Prior art date
Application number
TW092112104A
Other languages
Chinese (zh)
Inventor
Katsuya Sangu
Wataru Nakagawa
Original Assignee
Adtec Eng Co Ltd
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Publication of TW200307858A publication Critical patent/TW200307858A/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

The object is to provide a projection exposure device capable of achieving a high-precision position alignment. An exposure light is irradiated onto the photomask mark 51 of the photomask 50 by an exposure light illumination device. The image is formed on the image-forming unit 5 through the projection exposure lens 70. The CCD camera 2 captures the image data and records it in the computation control device 11 as the photomask mark 51' recorded. Then, an infrared illumination device 3 is employed to irradiate the printed circuit board mark 61 by infrared light to obtain the image of the printed circuit board mark 61, so as to detect the error between the photomask mark 51' and the printed circuit board mark 61, and to perform the positional alignment. The photomask mark 51 and the printed circuit board mark 61 are overlapped and displayed on the display device 12 at the same time.

Description

200307858 五、發明說明（l) " --—-— 發明所屬之技術領域 本發明有關於一種投影曝光裝置。 先前技術 藉由曝光裝置將描繪於光罩上的指定的圖案，燒附於 塗”阻等感光材料的印刷電路板表面，之後藉由蝕刻卫 程在印刷電路板上形成圖案的曝光顯影技術法廣泛地應用 於各種領域，印刷電路板等也用近來曝光裝置製造。 投影曝光裝置係藉由經投影曝光透鏡等的光學系將光 罩的電路圖案做投影曝光，在印刷電路板上與光罩用同—· 或一定之倍率描繪圖案之類的裝置。雖然習知中用於積體 電路的製ϋ ’近年投影曝光裝置試用於製造印刷電路板。 用曝光裝置做曝光時’光罩與印刷電路板的位置必須 做對準，ϋ常配置有光罩側與印刷電路板側之二者位置對 準用的標記’將光罩上的位置對準標記投影在印刷電路板 上’將其與印刷電路板上的位置對準標記用CCD攝影機做 計測而使該等標記對準-致。此時，光罩側之標記做投影 時，用曝光波長光，由於印刷電路板上的光阻感光，用曝 光波長以外的光是普通的。通常用紫外線做曝 記投影用紅外線。 fl 然而，在投影曝光裝置中 投影曝光透鏡對光罩標記做投 下標記的成像位置產生錯位而 題。 ’由於經由配合曝光波長的 影’用紅外線做投影的狀態 有無法做正確位置對準的問200307858 V. Description of the invention (l) " ------ Technical field to which the invention belongs The invention relates to a projection exposure device. In the prior art, a predetermined pattern drawn on a photomask was exposed to an exposure device and burned onto a surface of a printed circuit board coated with a photosensitive material such as a resist. Then, an exposure and development technique was used to form a pattern on the printed circuit board by an etching process. It is widely used in various fields, and printed circuit boards are also manufactured by recent exposure devices. Projection exposure devices are used to project and expose the circuit pattern of a photomask through an optical system such as a projection exposure lens. Use the same-or a certain rate to draw patterns and other devices. Although conventionally used for the fabrication of integrated circuits, 'projection exposure devices in recent years have been used to make printed circuit boards. When using exposure devices for exposure,' masks and printing The position of the circuit board must be aligned. Usually, a mark for position alignment between the photomask side and the printed circuit board side is usually provided. The position alignment mark on the photomask is projected on the printed circuit board. The position alignment marks on the circuit board are measured with a CCD camera to make these marks aligned. At this time, when the marks on the mask side are projected, the exposure wavelength light is used to For photoresist on a printed circuit board, it is common to use light other than the exposure wavelength. Ultraviolet is usually used to record infrared light for projection. Fl However, in the projection exposure device, the projection exposure lens images the mask mark to cast the mark. There is a problem that the position is misaligned. 'Because of the shadow that matches the exposure wavelength', there is a problem that the position cannot be correctly aligned with the infrared projection.

200307858 五、發明說明（2) 為解決上述之問題，有使用修正透鏡的方法。 又’日本發明專利第262970 9號及第2720873號有關於 製造積體電路之提案，考慮使光罩標記成像於與曝光對象 物刀離的位置上防止曝光對象物感光的技術轉用至印刷 路板的曝光裝置上。 發明内容 發明欲解決 但是使 透鏡位置控 又，在 所成的橡做 光物質等作 準，但為了 光，在為此 等的問題。 本發明 解決課題之 為達成 罩，描繪電 光的曝光對 象物作可縮 上，供位置 上，供位置 之問題 用修正透鏡的狀 制之裝置成為必 分離的位置使光 一定時間保持記 為成像面’雖然 做正確的位置對 所必要之設備上 之目的係解決上 手段 上述之目的，本 路等的圖案；基 象物；投影光學 小/放大的曝光 對準用；對象物 對準用；光罩標 態下，加上修正透鏡後供修正 要’有提高裝置成本的問題。 罩標記成像的狀況中，具有使 憶的物質，例如用殘光長的螢 在該殘光存在期間做位置對 準 必須元全消除前次的殘 ’必須要有供消除之剩餘時間 述習知技術之問題。 f明之投影曝光裝置包括：光 :，搭載以該光罩之圖案作曝 ，系/以該光罩之圖案對曝光對 ，光罩標記，設於上述光罩 標記，設於上述曝光對象物 °己照明光源，用與曝光波長同200307858 V. Description of the invention (2) In order to solve the above problems, there are methods using a correction lens. Also, "Japanese Invention Patent Nos. 262970 9 and 2720873 have proposals for manufacturing integrated circuits. It is considered that the technology of preventing the exposure of the exposure object from being exposed to light by applying a mask mark image at a position away from the exposure object is transferred to the printing path. Plate on the exposure device. SUMMARY OF THE INVENTION The present invention is intended to solve the problem of controlling the position of the lens and making a light substance or the like in the formed rubber. However, for light, there is a problem such as this. The problem solved by the present invention is to achieve a hood, which can be used to draw an electro-optical exposure object to be retractable. The position and the position are fixed. The device made by correcting the shape of the lens must be separated. 'Although the purpose of doing the correct position on the necessary equipment is to solve the above-mentioned purposes, patterns of this way, etc .; base objects; projection optical small / magnified exposure alignment; object alignment; mask mark In the state, adding a correction lens for correction has a problem of increasing the cost of the device. In the case of mask marking imaging, there is a substance that makes the memory, such as the use of afterglow long fluorescent light to perform position alignment during the presence of the afterglow. The previous afterglow must be completely eliminated. The remaining time for elimination must be described. Technical issues. f Ming's projection exposure device includes: light: equipped with the pattern of the mask for exposure, system / pair of exposure pairs with the pattern of the mask, mask mark, set on the mask mark, and set on the exposure object ° Illuminated light source with the same exposure wavelength

200307858 五、發明說明（3) 一波長的光照射上述光罩梗—·— 上述基台上之上述曝光對己’光罩標記成像體，設置於 與曝光波長同一波長的光昭^搭載範圍外之指定位置，用 經由上述投影光學系統而Φ所照射出的光照標記的像， 像於光罩標記成像體的光里，光罩標記檢測裝置，對成 化後做記憶；對象物標記照日^ =像做攝影，使該像資料 長的非曝光波長光照射上述 =^用與曝光波長相異波 影；位置調整襄置ίίίί戶::f射的對象物標記做攝 述被攝影的對象物標記像，調：：：=的光罩標記像與上 位置關係。 述光罩與曝光對象物的 於上述之構造中，由於 影，可得到正確的光罩標記：罩=;投影光學系做投 置於曝光袠私7 4父井# F51 罩k °己成像體由於设 置於曝先對象物搭載範圍外指定之 象物感光等的問ϋ。更蕤由古罢7會產生曝先對 光罩椤m J 罩標記檢出裝置，對成像於 憶，二b，益將井】ί罩標記像做攝影，並使資料化後記 i光的光僅^ 像在指定時間保持記憶之必要， 光型的螢光物晳莖,, 為成像體’無須殘 ^的營先物質專，故無須該等消除裝置而具有該等之效 長顯3像體上’若用接近上述非曝光波長光的波 記像，因為可用同-裝置做攝影，故可使 裝置實施。典型的二;t對：卜己檢測裝置以同- 貝C·歪恕中，上述非曝光波長光為紅外200307858 V. Description of the invention (3) A light of a wavelength is irradiated to the above-mentioned photomask stem ----- the above-mentioned exposure on the above-mentioned abutment is masked to the imaging object, and it is set out of the light of the same wavelength as the exposure wavelength. Designate the position, mark the image with the light irradiated by Φ through the above-mentioned projection optical system, as in the light of the mask mark imaging body, the mask mark detection device, to memorize after the formation of the object; For photography, let the long non-exposure wavelength light of the image material illuminate the above = ^ Use a wave shadow different from the exposure wavelength; adjust the position to set a mark of the object that is shot by ί:: f as the mark of the object being photographed Image, tone ::: = The mask mark image is related to the upper position. In the above-mentioned structure of the photomask and the exposure object, due to the shadow, the correct photomask mark can be obtained: mask =; the projection optical system is placed in the exposure lens 7 4 father well # F51 This is due to problems such as sensitivity of images set outside of the exposure range of the first object. In addition, the ancient mask 7 will produce a mask detection device for the mask 椤 m J mask, which will be used for imaging Yu Yi, 2b, Yi Jiangjing], and the mask mark image will be photographed, and the data will be recorded after the i-light. Only the image is necessary to maintain memory at a specified time. The light-type fluorescent substance has a clear stem. It is the pioneering material of the imaging body. It does not require residues. Therefore, it does not require such elimination devices and it has such effects. If you use a wave image close to the non-exposed wavelength light in vivo, you can implement the device because you can use the same device for photography. Typical two; t pair: Bu Ji detection device with the same-Bei C. Wish, the above non-exposed wavelength light is infrared

200307858 五、發明說明（4) 光’ ^ ί由上述光罩標記成像體藉由曝光波長的激發而發 出、、工^ •並顯現出光罩標記像的螢光構件所構成。 實施方式 =下針，對本發明之實施型態根據圖面做說明。 rt认f 係供製造印刷電路板的投影曝光裝置，施加光 2 ί二移動裝置63由演算控制裝置11所控制。 透鏡7: : 5二f光電路等的圖案的光罩50係經由投影曝光 電路等的圖宏，，曝光光源71的紫外線曝光，將 放大或縮：或箄;:：〗影曝光透鏡7〇所決定以指定之倍率 " 或等幺地燒附於印刷電路板6 〇上。 下方：ΐ: ΪΓ不圖Λ光罩50與印刷電路板60係配設於上 J万上彳_並^如此限定，反 印刷電路板6G垂直直立配設亦可。门或先罩50與 又’若印刷電路板6〇 #不 動’更甚者兩者皆可移動而構成移動，則光罩5。為可移 在光罩50上設有光罩標記51， ' 印刷電路板標記61。該等光罩標記51iJ Uyo上設有 用來作位置對準。 、P刷電路板標記6 1 標記檢測裝置1具有本體部分上 線照明裝置3。還有曝光光照明 攝影機2、紅外 衣置成像部5及影像處理 第8頁 2099-5583PF(Nl).ptd 200307858 五、發明說明（5) 裝置1 〇、演算控制裝置1丨、顯示裝置丨2、與驅動控制裝置 1 3連接。 …標記檢測裝置1為可移動，經由驅動控制裝置丨3藉由 演算控制裝置11做移動控制。 標記檢測裝置1根據需要可複數個設置，二個或四 是平常的。 如第2圖所示移動基台62後使成像部5位於標記檢測裝 置1之下方。又使標記檢測裝置1移動後，在成像部5進入 2野的狀態下，曝光光照明裝置4係將曝光波長的紫外線 ^照射於光罩標記51部分，經由投影曝光透鏡7〇，使光罩 ==5 1成像於第2圖所示之成像部5。曝光光照明裝置4照 夕狡上直徑8mm程度之範圍。基台62與標記檢測裝置1 里由演算控制裝置11控制，並紀錄其移動量。 傻，得之光罩標記51之像由於藉由曝光波長而成 、曰么生投影曝光透鏡7〇位置錯位等的問題。 成像部5配置於第3圖所示之美畀 側，藉由來自曝光光 :光阻最大電路板搭載範圍65上的印刷電路機 成像部5若藉由曝光波長 ^ 施型態中用螢光構件 ‘頁像則了以使用，在該實· 紅外光後顯像。由此，波長激發而發出可見光或 標記之攝影用同—桿J 2，之攝影與印刷電路板 而且，用無殘光攝影機2實施^ 作為螢先構件’藉此而無像的消除200307858 V. Description of the invention (4) The light ′ ^ is composed of a fluorescent member that emits light from the above-mentioned mask-labeled imaging body by excitation at an exposure wavelength, and displays a mask-marked image. Implementation Mode = Lower Needle. The implementation mode of the present invention will be described with reference to the drawings. rt is a projection exposure device for manufacturing printed circuit boards. The application light 2 and the mobile device 63 are controlled by the arithmetic control device 11. Lens 7: Photomask 50 with a pattern of 5 f optical circuits and the like is exposed to ultraviolet light from the exposure light source 71 via a photo macro of a projection exposure circuit and the like, and will be enlarged or reduced: or:; It is decided to burn it on the printed circuit board 60 at a specified rate " or wait for a while. Bottom: ΐ: 不 Γ is not shown. The reticle 50 and the printed circuit board 60 are arranged on the upper surface. It is limited as such, and the reverse printed circuit board 6G may be vertically arranged. The door or the front cover 50 and "if the printed circuit board 6〇 # 不 动" or both can be moved to constitute movement, the photomask 5 is formed. The mask 50 is provided with a mask mark 51 and a printed circuit board mark 61 in order to be removable. These mask marks 51iJ Uyo are provided for positional alignment. , P brush circuit board mark 6 1 The mark detection device 1 has an on-line lighting device 3 on the body part. There are exposure light illumination camera 2, infrared clothing imaging section 5, and image processing page 8 2099-5583PF (Nl) .ptd 200307858 V. Description of the invention (5) Device 1 0, calculation control device 1 丨 display device 丨 2 Connect with the drive control device 1 3. ... The mark detection device 1 is movable, and the movement control is performed by the drive control device 3 and the arithmetic control device 11. The mark detection device 1 may be provided in plural as necessary, and two or four are usual. After moving the base 62 as shown in FIG. 2, the imaging section 5 is positioned below the mark detection device 1. After moving the mark detection device 1 and in a state where the imaging unit 5 enters two fields, the exposure light illuminating device 4 irradiates ultraviolet light ^ at the exposure wavelength to the portion of the mask mark 51, and then exposes the mask through the projection exposure lens 70. == 5 1 The image is formed on the imaging section 5 shown in FIG. 2. The exposure light illumination device 4 illuminates a range of about 8 mm in diameter. The base station 62 and the mark detection device 1 are controlled by the arithmetic control device 11 and record their movement amounts. Silly, the image of the obtained mask mark 51 is caused by the exposure wavelength, and the position of the projection projection lens 70 is misaligned. The imaging section 5 is arranged on the beautiful side shown in FIG. 3, and the exposure section: the printed circuit machine on the printed circuit board mounting range 65 with the maximum photoresistance. The imaging section 5 uses a fluorescent member if the exposure wavelength is applied. 'Page image should be used, and developed after the real infrared light. As a result, the same wavelength is used for photography that emits visible light or marks when the wavelength is excited. The rod J 2 is used for photography and printed circuit boards. Furthermore, the afterglow-free camera 2 is used as a fluorescent element.

200307858 五、發明說明（6) 裝置及消除時間’而可縮短工時 該成像部5上的光罩標記51之 之ccD攝影機2做攝影。該像資料送至景Γ像處=己壯檢罢測震置1 此做指定之處理，使光罩標記51之像二置10，在 所構成之主體的演算控制裝置u中。等像於微電腦 置12中再度影像化後顯示。又亦可根；顯示裝 資料做成新的像。 像九單& €5 1之位置 在標記檢測裝置！中包含半面鏡等適合 一面使來自投影曝光鏡7〇的紫外光通過並^衣置’ ^ 〇—面由C C D攝影機2對成像部5的像做攝影。在缺成像部5 罩杯5己5 1之像係在曝光光照明裝置4中做彡…、而，光 上的殘像不為必要。 衫’在成像部5 一方面，印刷電路板60上的印 第^圖所示之基台62的移動位於標記檢電二板=， 進入標記檢測裝置1的視野中。藉由 1的下方，而 的紅外線照射[由CCD攝影機2做攝影而工卜線照明裝置3 以影像處理裝置1 〇做指定之處理， =。邊像接受 裝置"。“62之移動量在演算控;;ί置以;J算控制 在演算控制裝川中’藉由基台62 之移動資料做基本的位置修正，根據上述铩记檢測裝置1 記5 1之資料與印刷電路板標記6丨之資料，L 3记憶之光罩標 差，經由該誤差設為〇的驅動控制裝置13 ’則其位置誤 該基台62移動。 ”移動裝置63使 又 所記憶的光罩標記51之 資料訊 唬再顯示裝置1 2中200307858 V. Description of the invention (6) Device and elimination time 'can shorten the man-hour. The ccD camera 2 of the mask mark 51 on the imaging section 5 is used for photography. The image data is sent to the scene Γ image place = the camera has been set to 1. This is the designated processing, so that the second image of the mask mark 51 is set to 10 in the calculation control unit u of the subject. Wait until the image is displayed again in the microcomputer setting 12. It can also be rooted; the display material makes a new image. Position like Nine Singles & € 5 1 in mark detection device! It includes a half mirror and the like. One side allows ultraviolet light from the projection exposure mirror 70 to pass through and is placed on the camera's side. The CC camera 2 photographs the image of the imaging unit 5. The images of the cups 5 and 51 in the lack of the imaging section 5 are made in the exposure light illuminating device 4. However, an afterimage on the light is not necessary. In the imaging section 5, on the one hand, the movement of the base 62 shown on the printed circuit board 60 shown in FIG. 2 is located on the second board of the mark detector and enters the field of view of the mark detector 1. With the infrared radiation from the bottom of 1 [photographed by the CCD camera 2 and the illumination line lighting device 3, the image processing device 10 is used for the specified processing, =. Side image acceptance device ". "The movement amount of 62 is controlled by the calculation; ίSet to; J calculation control is installed in the calculation control installed in the Chuanchuan 'to make basic position correction based on the movement data of the base station 62, according to the above-mentioned mark detection device 1 record 51 1 data and The printed circuit board is marked with the data of 6 丨, the mask deviation of L3 memory is set, and the drive control device 13 'whose error is set to 0, its position is wrong and the base 62 moves. "The moving device 63 makes the memorized The information of the mask mark 51 is displayed in the display device 12 again.

200307858 五、發明說明（7) =;ίίί! ’同時印刷電路板標記61亦顯示於顯”, 置修正上使兩影像重合後顯示。亦可 在做位 之確認。第4圖表示此狀態。 兩者位置 攝，機視野20内所捕捉的印刷電路板標記61 像化之光罩標記51，做基準重合後顯示出。 乂再影 說明動作。200307858 V. Description of the invention (7) =; ίίί! 'At the same time, the printed circuit board mark 61 is also displayed on the display.' Set the correction to make the two images overlap. It can also be confirmed in place. Figure 4 shows this state. Position the camera at both positions, and the printed circuit board mark 61 captured in the camera's field of view 20 will become the mask mark 51, which will be displayed after superimposing the reference. 乂 Zaiying will explain the action.

取初如第2圖所示，使基台62移動後使成像部5位 測裝置1的下方，於該狀態下，纟自曝光光照明裝置“： 外線照射於光罩標記51，光罩標記51之像成像於成像= 上’同時用CCD攝影機2對該像做攝影。攝影終了後，佟 來自曝光光照明裝置4的紫外光之照射。 τ & 該光罩標記5 1之像資料送至影像處理裝置丨0，於此 受指定之處理後，記錄於演算控制裝置丨丨，並於顯示裳 1 2再度影像化後顯示。 ' 接著使標記檢測裝置1之位置不動，使基台62移動，At first, as shown in FIG. 2, after the base 62 is moved, the imaging unit 5 is positioned below the measuring device 1. In this state, the self-exposure light illumination device is “exposed to the mask mark 51 and the mask mark. The 51 image is imaged on the imaging = on the same time, the image is photographed with the CCD camera 2. After the photography is finished, the ultraviolet light from the exposure light illumination device 4 is irradiated. Τ & To the image processing device 丨 0, after being subjected to the specified processing, it is recorded in the calculation control device 丨 丨 and displayed again after the display skirt 12 is imaged. 'Then the position of the mark detection device 1 is not moved, and the base 62 is moved. mobile,

而使印刷電路板60的印刷電路板標記6 1位於標記檢測裝f 1的下方，照射來自紅外線照明裝置3的非曝光光之紅外 光，同樣地對印刷電路板標記6 1做攝影後，在影像處理| 置1 〇、演算控制裝置1 1中，求取印刷電路板標記6 1與所^ 憶之光罩標記5 1 ’的位置誤差，使該誤差為〇之基台6 2移動 後做位置對準。此狀態用顯示裝置1 2做影像顯示，如第4 圖所示之狀態。 以上之位置對準終了後，使曝光光照明裝置4以及標The printed circuit board mark 6 1 of the printed circuit board 60 is positioned below the mark detection device f 1, and irradiated with infrared light from the unexposed light of the infrared illuminating device 3. Similarly, after the printed circuit board mark 6 1 is photographed, Image processing | Set 1 〇 In the calculation control device 11 1, find the position error between the printed circuit board mark 6 1 and the ^ memory mask mark 5 1 ′, and make the error 0, and then move the base 6 2 to do Positioned. In this state, the display device 12 is used for image display, as shown in FIG. 4. After the above positions are aligned, make the exposure light illumination device 4 and the target

2099-5583PF(Nl).ptd 第11頁 200307858 五、發明說明（8) 記檢測裝 以上 光所得， 定於最大 於曝光光 又， 演算控制 能’更無 備簡略化 又， 之像作為 得出光罩 果0 f1退避，由曝光光源71實施曝光。 說明之構造中，由於光罩 盔起因於机！ Q 旱& 5己51之像係藉由曝光 然起囚於投影曝光透鏡7〇 雷路柘扰#…m W錯位。又，由於在設 %路扳尨載乾圍6 5之外的 m ζη β,Ι φ α/, , 0 Λ 豕口丨5上成像，無由 Ρ刷電路板60所造成的不良影變。 由於光罩標記5 1之像傲真雷 j ^ 心文為電子矾號之資料記錄於 口 ΙΠ 1上，無須保持將影僮 項彳ϋ、& w β^ 像殘存於成像部5的功 ，、仏4除忒衫像之設備及供消去之 可達設 及工程迅速化的目的。 藉由使用作為成像部5之螢光體，以光罩標把51 可見光或紅外光而得，使用同一標記檢測裝置1 標記5 1與印刷電路板標記6丨之像並具有該等之效 發明之效果 精度之位 效果。 右藉由如上所述於本發明之投影曝光裝置，y實施尚 置對準，在具有不會帶給印刷電路板不良影響之 <1 2099-5583PF(Nl).ptd 第12頁 200307858 圖式簡單說明 明之一實施型態之示意圖。 明之一貫施型悲動作之示意圖 第1圖表不本發 第2圖表不本發2099-5583PF (Nl) .ptd Page 11 200307858 V. Description of the invention (8) Record the light obtained by the above test, set to the maximum exposure light, and the calculation control can be 'less prepared and simplified, and the image is used as the light. The cap 0 f1 is retracted, and exposure is performed by the exposure light source 71. In the illustrated construction, the helmet comes from the machine due to the mask! The Q & A image of 51 and 51 is caused by the exposure to the projection exposure lens 70 雷 路 柘 扰 #… m W is misaligned. In addition, since imaging is performed on m ζη β, 1 φ α /,, 0 Λ 之外 5, which is located outside of the circuit board, there is no adverse effect caused by the P brush circuit board 60. Since the image of the mask mark 5 1 is proud of the real j ^ j ^ electronic text number recorded on the mouth IΠ 1, there is no need to keep the function of the shadow boy item & w β ^ image remaining in the imaging section 5 , 仏 4 In addition to the equipment of the shirt and the elimination of the equipment can achieve the purpose of rapid design and engineering. It is obtained by using the phosphor as the imaging unit 5 with 51 visible light or infrared light with a mask mark, using the same mark detection device 1 mark 5 1 and the printed circuit board mark 6 丨 and having the same effective invention The effect of precision accuracy. On the right, with the projection exposure device of the present invention as described above, the y implementation is still aligned, and has a < 1 2099-5583PF (Nl) .ptd, which will not bring adverse effects to the printed circuit board, page 12, 200307858. Briefly explain the schematic diagram of one implementation type. Schematic diagram of the one-time tragic action of the Ming Dynasty

第3圖表不本获日日 — At F 態的說明圖。X之-貫施1悲中，成像部5之配置狀 第4圖表不本取日B t A. 刷電路板標記6 1之續_ 一&貝施歪悲中，光罩標記5 1與印 又*、、員不狀態的說明圖。 符號說明 1〜標S己檢測裝詈.9 rrn ^ 44W 罟· 4 Λ ^ ^ as PP ，2〜CCD攝衫機；3〜紅外線照明裝 罟.1 1噙筲狄& /置，5〜成像邻；1 0〜影像處理裝 ’· 控制凌置；12〜顯示裝置；13〜驅動控制裝 置；20〜攝影機視野；50〜光罩；51〜光罩標記；52〜光 罩基台，6 0〜印刷電路板；61〜印刷電路板標記；6 2〜基 台；63〜移動裝置；65〜最大電路板搭載範圍；7〇〜投影 曝光透鏡；71〜曝光光源。 'The third chart is not the day of the day — an explanatory diagram of the At F state. In the X-Tang Shi 1 tragedy, the configuration chart of the imaging section 5 is not taken from the current day. B t A. Brush the circuit board mark 6 1 continuation _ I & Bei Shi Wei Ting, the mask mark 5 1 and Illustrated diagram of the state of stamping *, and member. Explanation of symbols 1 ~ standard S has detection equipment. 9 rrn ^ 44W 罟 · 4 Λ ^ ^ as PP, 2 ~ CCD camera; 3 ~ infrared lighting equipment. 1 1 噙 筲 迪 & / 置, 5 ~ Imaging neighbourhood; 10 ~ image processing equipment; control unit; 12 ~ display device; 13 ~ drive control device; 20 ~ camera field of view; 50 ~ mask; 51 ~ mask mark; 52 ~ mask base, 6 0 ~ printed circuit board; 61 ~ printed circuit board mark; 6 2 ~ abutment; 63 ~ mobile device; 65 ~ maximum circuit board mounting range; 70 ~ projection exposure lens; 71 ~ exposure light source. '

2099-5583PF(Nl).ptd 第13頁2099-5583PF (Nl) .ptd Page 13

Claims (1)

200307858200307858 六、申請專利範圍 1 · 一種投影曝光裝置’包括： 光罩，描繪電路等的圖案； 曝光對象物； 物作可縮小/放 基台，放置令該光罩之圖案作曝光的 投影光學系，令該光罩之圖案對曝光對象 大的曝光； 用 光罩標記，設於上述光罩上， 對象物標記，設於上述曝光對 供位置對準用； 象物上，供位置對準 標記照 標記； 標記成 圍外之 同一波 標記檢 做攝影 物標記 照射上 物標記 物標記 調整裝 的對象 〇 申請專 无罩 上述光罩 光罩 物搭載範 曝光波長 像； 光罩 標記之像 對象 光波長光 對象 射的對象 位置 述被攝影 位置關係 2.如 照射 明光源’用與曝光波長同-波長的光 像體，設置於上述基台上之上述曝光對象 指定位置’經由上述投影光學系統而令应 長的光照射所照射出的光照標記的像成、 、 置對成像於光罩標記成像體的光罩 ’使該像資料化後做記憶； 、、、、'月光源’用與曝光波長相異波長的非曝 述對象物標記； 仏測裳置’對藉由上述非曝光波長光所昭 做攝影； …、 置#根據上述被資料化的光罩標記像與上 物標記像，調整上述光罩與曝光對象物的 利乾圍第1項所述之投影曝光裝置，其中6. Scope of patent application 1 · A projection exposure device 'includes: a mask, a pattern depicting a circuit, etc .; an exposure object; an object that can be reduced / amplified, and a projection optical system for exposing the pattern of the mask to exposure, Make the pattern of the photomask to expose the exposed object greatly; mark it with a mask and set it on the photomask, and mark the object and set it on the exposure pair for position alignment; on the image, mark the position with the alignment mark ; Mark the same wave mark outside the fence as the photographic mark to irradiate the object mark to mark the adjustment of the mounted object 〇 apply for a mask without the above mask photomask equipped with a range of exposure wavelength image; mask mark image object light wavelength light The relationship between the position of the object and the position of the object to be photographed 2. For example, if a bright light source is irradiated with a light image body with the same wavelength as the exposure wavelength, the designated position of the exposure object set on the abutment is adjusted through the projection optical system. The long light illuminates the image of the irradiated light mark, and sets the photomask on the mask mark imager to make the image data. Make memories later; 、,,,, and “Moon Light Source” are marked with non-exposed objects with wavelengths different from the exposure wavelength; The above-mentioned mask mark image and the upper object mark image are adjusted, and the projection exposure device described in item 1 of Liganwei of the mask and the exposure object is adjusted, wherein 2〇99-5583PF(Nl).ptd 第14頁 200307858 六、申請專利範圍 光罩標記成像體係用與上述曝光波長同一波長之光，僅於 照射中使上述光罩標記成像。 ^ 第2項所述之投影曝光裝置 其中 •如申請專利範圍/·，一，、. …， 上述光罩標記成像體具有無殘光的螢光構件 4 ·如申請專利範圍第1項所述之投影曝光裝置，其中 上述光罩標記成像體用接近於上述非曝光波長光的波長顯 現光罩標記像。 …5·如申請專利範圍第丨項所述之投影曝光裝置，其中 上述非曝光波長光係紅外光； *而像想藉由曝光波長光激發後發*紅外 6如申請專利範圍第4或5項所述 中上述光罩標記檢測裝置與上述 *先哀置，其 一裝置。 本物軚記檢測裝置為同 7·如申請專利範圍第丨項所述之 包括控制裝置，根據藉由上述光又衫曝光裝置，其更 的光罩標記、上述光罩標記成像*記檢測裝置所檢測出 上述對象物標記檢測裴置所檢=3定位置、以及藉由 述位置調整裝置，而使上述光罩Ί的對象物標!己，控制上 記位置一致。 位置與上述對象物標 8·如申請專利範圍第〗項 更包括·· 、 ^之投影曝光裝置，其中 影像化裝置，藉由上述 化的光罩標影像化；以及 檢測裝置，使已資料 2099.5583PF(Nl).ptd 第15員' 200307858 六、申請專利範圍 顯示裝置，顯示該影像化之光罩標記與上述被攝影之 對象物標記的影像。 liiii 2099-5583PF(Nl).ptd 第16頁〇99-5583PF (Nl) .ptd Page 14 200307858 VI. Scope of Patent Application The mask mark imaging system uses light with the same wavelength as the above exposure wavelength to image the mask mark only during irradiation. ^ The projection exposure device described in item 2 of which: • As described in the scope of the patent application / ..., the above, the mask-masked imaging body has a fluorescent member without afterglow 4; The projection exposure apparatus, wherein the mask mark imager displays a mask mark image with a wavelength close to the non-exposure wavelength light. … 5. The projection exposure device as described in item 丨 of the patent application range, wherein the above non-exposure wavelength light is infrared light; * and if it is desired to be excited by the exposure wavelength light * infrared 6 as in patent application range 4 or 5 The above-mentioned mask mark detection device described in the above item and the above-mentioned * first lament, one device. This product's mark detection device is the same as the control device described in item 7 of the scope of the patent application. According to the above-mentioned light and shirt exposure device, its mask mark, the above mask mark imaging * mark detection device. Detect the object mark detection detected by Pei Zhi = 3 fixed position, and use the position adjustment device to make the object mark of the mask 己, and control the above position to be consistent. Position and the above-mentioned object mark 8. If the scope of the patent application is the first item, it also includes a projection exposure device of ..., ^, in which the imaging device is imaged by the above-mentioned photomask mark; and the detection device is used to make the data 2099.9583 15th member of PF (Nl) .ptd '200307858 6. Patent application range display device, displaying the imaged mask mark and the image of the object to be photographed. liiii 2099-5583PF (Nl) .ptd Page 16
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JP3880589B2 (en) * 2004-03-31 2007-02-14 キヤノン株式会社 Position measuring apparatus, exposure apparatus, and device manufacturing method
CN100428058C (en) * 2005-06-03 2008-10-22 中国科学院上海光学精密机械研究所 Odd aberration in-situ detection method for projection objective of photoetching machine
CN100451838C (en) * 2005-07-29 2009-01-14 友达光电股份有限公司 Aligning system and aligning method
JP5523207B2 (en) * 2010-06-01 2014-06-18 株式会社トプコン Exposure equipment
CN102865815B (en) * 2012-09-24 2015-01-07 上海功源电子科技有限公司 Novel positioning compensation method for PCB by single vision camera
CN108290694B (en) * 2015-10-01 2021-05-04 因特瓦克公司 Wafer plate and mask apparatus for substrate fabrication

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