CN1249047A - 带有绕制天线的非接触卡的制造方法 - Google Patents
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- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
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- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
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- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
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Abstract
本发明涉及非触点传输片式卡的制造,特别涉及有或无触点的混合型卡操作的制造。为可靠和有效的设置一集成电路模块(M)和一电感传输天线(A)的方法包括制作提供连接天线区的模块,用平面环形导线制作一天线,将所说天线的端点焊到模块区上,然后制作配置有开口的塑料板(30),该开口的底部用粘接膜(34)封闭。模块和天线置于该板上,并且用粘接材料固定在护罩的底部。另一板(40)直接安装在该组件上。
Description
本发明涉及片卡(chip cards)的制造,特别涉及能够利用集成在卡中的天线进行非接触操作的卡。所谓“非接触卡”,一方面强调可以仅通过天线与外部通信,另一方面还特别强调可利用天线或利用标准的常规触点与外部进行通信的混合型卡。
期望这种卡执行各种操作,例如银行操作,电话通信,识别操作,帐户的借方记账或支出,通过将卡***读出机或将卡置于该终端的作用区域上时通过发送/接收端之间的电磁耦合(感应型原理)可进行遥控操作的所有类型的操作等。
非接触卡最好具有与普通接触型灵巧卡相同的标准尺寸。显然,这特别是对混合型卡的基本要求,并期望仅在不接触的情况下进行卡操作。
通用的标准ISO 7810规定卡长为85mm,宽为54mm和厚为0.76mm。在卡表面上明确规定的位置处,触点是齐平的。
这些标准对制造来说强加了苛刻的限制条件。具体地说,其主要限制是卡厚度非常薄,由于必须在卡中配置天线,因而相对于接触型卡来说,不接触型卡的厚度限制更苛刻。
由于天线几乎占据了卡的整个表面,因而所面临的技术问题是对卡设置天线的问题,设置集成电路模块(包括提供卡的电气功能的芯片及其触点)的问题,在模块与天线之间的连接精确度与可靠性的问题;最后,还必须考虑机械强度、可靠性和制造成本的限制。
本发明的目的是提供一种在制造卡时能够最好地解决尺寸、制造精确度、机械强度以及更一般地说的可靠性、成本和效率的不同限制的制造方法。
为实现该目的,按照本发明,提供一种制造非接触传输型片式卡的方法,其主要特征在于:制备集成电路模块和由平面绕制的导线构成的天线,将天线端固定到模块的连接区域上,将天线/模块组件暂时固定在由具有开口的塑料材料构成的板上,其中该开口可用作模块的护罩,在天线/模块组件上放置另一塑料板,连接这两块板,封闭天线和模块。
最好将粘结片粘接于第一块板上,并且在用作模块护罩的开口内将模块设置于该粘接片的粘接面上,从而有效地进行天线/模块组件的暂时固定。然后拆除粘结片。如果该卡是混合卡,那么由于它们与用作模块护罩的开口的底部齐平,因而当移开该片时,就露出接入(access)触点。
该方法简单且花费小,并且还能够可靠及精确地解决芯片模块与天线之间接触的问题:在塑料卡中固定该组件之前进行电连接。该模块被正确地放置于卡中,天线也被正确地放置于该卡中。
具有为构成模块而在其上放置集成电路的金属部分的塑料膜,实际上可分为两种类型的特例:双面印刷电路膜或用绝缘塑料膜覆盖的金属网格,但实际上,由于双面印刷电路膜能够在连接区域上完全平坦地固定天线端部,因而具有双面印刷电路膜的方案显然较好,同时另一方案需要在绝缘膜开口中固定天线端部,在这些开口周围的绝缘膜厚度会妨碍该固定操作。
在由双面印刷电路制备模块的情况下,芯片被固定于一侧(膜的前面)并通过焊接的导线将其连接到位于该侧上的金属连接区域处。天线也被焊接到在该侧的连接区域上。背面有剪切为灵巧卡的标准触点格式(对于混合型卡)的金属部分,为了在背面的外部触点与芯片的输入/输出端之间建立所需的电连接,在前面的金属部分与背面的金属部分之间配置导电通路。
通常,在将模块***卡中之前,将芯片浸没于保护树脂中。
通过热或冷叠压可连接卡的塑料材料的两块板,在两块板之间可放入树脂,该树脂用作在这两块板之间的粘结剂,并可用作使模块和天线与外界隔离的密封产物。
实际上,该制造方法包括下列步骤:
-制备可***卡中的集成电路模块,该模块包括安装于塑料膜上的集成电路芯片,该塑料膜配有金属部分,所述金属部分一方面包括提供与芯片连接的连接区域,另一方面还包括与天线连接的两个连接区域,后面的这两个区域彼此相隔预定的距离并且允许与连接芯片的连接区域电连接;
-制备用导线绕制的平面天线,该天线具有两个端部,这两个端部大体按彼此相同的预定距离设置;
-将天线的端部固定于两个相应的连接区域上;
-将天线/模块组件粘接于由塑料材料构成的板上,该板有可用作模块的护罩的开口,以便在随后的操作期间使天线/模块组件定位于该板上;
-将由塑料材料构成的另一块板置于天线/模块组件上;
-连接这两块板,封闭天线和模块。
根据下列参照附图的详细描述,将呈现本发明的其它特征和优点,其中:
图1表示由按可装入灵巧卡的格式制备的缠绕导线构成的天线;
图2以正视图、背视图和剖面图形式展示在实施例中于双面金属膜上的模块;
图3表示组装的天线/模块组件;
图4表示以提供有粘结片的卡的格式将天线/模块组件固定在塑料板上;
图5表示用以覆盖模块组件的另一块塑料板的固定;
图6表示在去除粘结片的步骤完成的卡并且准备使用。
图1中所描绘的天线A是简单平面绕制的导线10,在将该导线插进卡中的操作期间,该导线的固有刚度对能操作该天线是足够的,并保持其总体的平面形状。该天线表示能够利用电感型电磁耦合隔一定距离进行通信的电感。
可用绝缘材料包裹导线,防止在相邻匝之间的接触。无论如何,如果各匝相交(在有几匝的情况下),那么就要提供绝缘材料。可是,为了与集成电路模块电连接,导线的端部是裸露的。
考虑到电磁效率,天线的尺寸非常接近片式卡的外形尺寸,并且另一个理由是必须精确地完成在卡中设置天线的原因。
天线的端部12和14彼此相距预定距离D,并且端部12和14最好转向匝的内部,以便电子模块可放置于匝的内部,天线的周长尽可能地接近将在其中埋置该天线的灵巧卡的周长。
图2的模块M包括绝缘膜20、前面镀敷金属、背面镀敷金属,通过连接前面镀敷金属至背面镀敷金属而导通。为了清楚地图示,未按照尺寸尤其是厚度的相对比例。
按灵巧卡的标准格式将背面镀敷金属切割成触点21;当制造结束时,在灵巧卡上的这些触点是齐平的。
将芯片22焊接到前面镀敷金属的中心区域23上;被焊接的导线24连接芯片到前面镀敷金属的连接区域25(可采用其它连接方法,例如在“倒装芯片”模式中翻转芯片的情况下进行直接连接)。
为固定天线A的端部,保留两个连接区域26和27。这些区域与用作接收芯片导线的连接区域25电连接。实际上,区域26和27构成连接区域25的两个延伸部分,这些延伸部分足够远地离开固定芯片的中心区域:用保护树脂28的滴剂以覆盖芯片22,但连接区域26和27距中心区域有足够的距离,以便树脂不覆盖它们。
连接区域26和27位于膜20上,彼此相距大体相应于天线导线A端部之间的距离D的距离,以便可容易地将这些端部焊接于区域26和27上。
图3以横截面图形式表示在将天线端部焊接于区域26和27上的操作之后的天线/模块组件;它还示出由塑料材料构成的板30(可能已经为灵巧卡的格式或大体上要切割成该格式)。塑料材料可以是聚氯乙烯(PVC)或其它塑料材料。
该板构成灵巧卡主体的一部分。它有可用作模块M的护罩的开口32,该开口经过整个板厚。开口的尺寸至少等于模块M的尺寸。如果可能,可相对于模块的尺寸精确地调整这些尺寸。相对于板的规格来说,开口的位置相应于灵巧卡触点的标准化位置。
用粘结片34覆盖板的背面,使其粘结面贴在该板上。该片覆盖开口32,使其构成通过开口32在卡中形成的护罩的基底。该基底有粘性。
图4表示天线/模块组件在板30上的固定,将模块***开口32中并用粘结材料将其粘接于片34上。
在随后的可引起机械应力的操作中,腔室和粘结材料保持天线/模块组件处于精确的位置上。在此阶段可用厚树脂涂敷该组件,该树脂可加强该组件在其位置上的固定,并可用作保护天线和模块的粘结剂和密封物质。
将由塑料构成并且被切割成灵巧卡格式(除非随后确定该格式)的另一块板10贴在被这样制备的组件上面,也就是说是在与天线相同的一侧上而不是与粘结片相同的一侧上(图5)。该塑料材料可以是聚氯乙烯(PVC)等。
为了连接该板同时封闭天线/模块组件,进行冷或热层压操作。对于冷层压来说,需要***粘结树脂(可以为上述树脂)。
图5表示在该状态下在天线/模块组件的各侧上有板30和40并且在板之间用粘结树脂30浸没组件的片式卡。
最后的操作(图6)包括去除粘结片34,然后现出灵巧卡裸露的触点21。
上述的方法还可用于下列情况中,即并不是由双面金属膜制备模块,而是由切割为所需触点形状并用切割的绝缘膜覆盖同时露出芯片固定区域、芯片导线的连接区域和用于天线导线的连接区域的网格制备该模块。可是,由于绝缘膜的厚度,因而在后面所述的区域中焊接天线导线并不容易。
Claims (9)
1.一种非接触传输的灵巧卡的制造方法,其特征在于,制备集成电路模块和由平面绕制的导线构成的天线,将天线端部固定于模块的连接区域上,将天线/模块组件暂时固定于由塑料材料构成的板上,该板具有可用作模块护罩的开口,在天线/模块组件上放置塑料材料的另一块板,连接该两块板,封闭天线和模块。
2.如权利要求1所述的方法,其特征在于,将粘结片(34)粘接于第一板上,并且在用作模块护罩的开口(32)内将模块放置于该片的粘结面上,有效地进行天线模块组件的暂时固定,在连接该两块板之后拆除该粘结片。
3.如上述任一项权利要求所述的方法,其特征在于,该灵巧卡是带有接入触点(21)的混合型卡,该模块被***开口中以便触点与开口的底部齐平。
4.如权利要求3所述的方法,其特征在于,由具有前面镀敷金属和背面镀敷金属的膜制备该模块,天线连接区域(26,27)位于前面上,而灵巧卡接入的触点(21)位于背面上。
5.如权利要求1-4中之一所述的方法,其特征在于,在该模块被***卡中之前,将芯片(22)浸没于保护树脂(24)中,该保护树脂并不覆盖想要连接天线的连接区域。
6.如权利要求1-5中之一所述的方法,其特征在于,通过热或冷叠压连接该卡的两个塑料板。
7.如权利要求1-6中之一所述的方法,其特征在于,在加压第二块板之前,在天线/模块组件上淀积粘结和密封树脂(50)。
8.一种非接触传输灵巧卡的制造方法,该方法包括下列操作:
-制备可***卡中的集成电路模块(M),该模块包括安装于塑料膜(20)上的集成电路芯片(22),塑料膜(20)配有金属部分(21,25,26,27),所述金属部分一方面包括允许与芯片连接的连接区域(23,25),另一方面还包括与天线(A)连接的两个连接区域(26,27),后面的这两个区域彼此相隔预定的距离并且允许与连接芯片的连接区域电连接;
-制备平面绕制的导线构成的天线(A),该天线具有两个端部(12,14),端部(12,14)大***于彼此相同的预定距离;
-将天线的端部固定于两个相应的连接区域(26,27)上;
-将天线/模块组件粘接于由塑料材料构成的板(30)上,该板有可用作模块(M)的护罩的开口(32),以便在随后的操作期间使天线/模块组件定位于该板上;
-将由塑料材料构成的另一块板(40)置于天线/模块组件上;
-连接这两块板,封闭天线和模块。
9.如权利要求8所述的制造方法,其特征在于,该片式卡是带有接入触点(21)的混合型卡,该模块被***开口中以便触点与开口的底部齐平。
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Application Number | Priority Date | Filing Date | Title |
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FR9702145A FR2760113B1 (fr) | 1997-02-24 | 1997-02-24 | Procede de fabrication de carte sans contact a antenne bobinee |
FR97/02145 | 1997-02-24 |
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CN1249047A true CN1249047A (zh) | 2000-03-29 |
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CN98802815A Pending CN1249047A (zh) | 1997-02-24 | 1998-02-18 | 带有绕制天线的非接触卡的制造方法 |
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US (1) | US6517005B1 (zh) |
EP (1) | EP1012785B1 (zh) |
JP (2) | JP2001513230A (zh) |
KR (1) | KR20000075577A (zh) |
CN (1) | CN1249047A (zh) |
AT (1) | ATE224569T1 (zh) |
AU (1) | AU6504198A (zh) |
BR (1) | BR9807357A (zh) |
CA (1) | CA2281616A1 (zh) |
DE (1) | DE69808112T2 (zh) |
ES (1) | ES2184243T3 (zh) |
FR (1) | FR2760113B1 (zh) |
RU (1) | RU2205453C2 (zh) |
WO (1) | WO1998037512A1 (zh) |
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- 1998-02-18 CA CA002281616A patent/CA2281616A1/fr not_active Abandoned
- 1998-02-18 WO PCT/FR1998/000316 patent/WO1998037512A1/fr not_active Application Discontinuation
- 1998-02-18 ES ES98910789T patent/ES2184243T3/es not_active Expired - Lifetime
- 1998-02-18 DE DE69808112T patent/DE69808112T2/de not_active Expired - Fee Related
- 1998-02-18 RU RU99120688/09A patent/RU2205453C2/ru not_active IP Right Cessation
- 1998-02-18 JP JP53632698A patent/JP2001513230A/ja not_active Ceased
- 1998-02-18 KR KR1019997007637A patent/KR20000075577A/ko not_active Application Discontinuation
- 1998-02-18 AU AU65041/98A patent/AU6504198A/en not_active Abandoned
- 1998-02-18 EP EP98910789A patent/EP1012785B1/fr not_active Expired - Lifetime
- 1998-02-18 AT AT98910789T patent/ATE224569T1/de not_active IP Right Cessation
- 1998-02-18 BR BR9807357-5A patent/BR9807357A/pt not_active Application Discontinuation
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN100481121C (zh) * | 2002-10-11 | 2009-04-22 | 纳格雷德股份有限公司 | 具有在一个表面上可见的元件的电子组件及这种组件的制造方法 |
CN101971195B (zh) * | 2007-05-21 | 2013-12-04 | 格马尔托股份有限公司 | 包括在支承体上形成有两个末端部分的射频应答器天线的装置的制造方法及所制成的装置 |
CN105117763A (zh) * | 2015-08-14 | 2015-12-02 | 深圳市源明杰科技有限公司 | 智能卡及智能卡的制造方法 |
CN106611212A (zh) * | 2015-10-21 | 2017-05-03 | 恩智浦有限公司 | 双接口ic卡 |
CN106611212B (zh) * | 2015-10-21 | 2021-03-12 | 恩智浦有限公司 | 双接口ic卡 |
Also Published As
Publication number | Publication date |
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US6517005B1 (en) | 2003-02-11 |
RU2205453C2 (ru) | 2003-05-27 |
ES2184243T3 (es) | 2003-04-01 |
DE69808112D1 (de) | 2002-10-24 |
AU6504198A (en) | 1998-09-09 |
FR2760113B1 (fr) | 1999-06-04 |
FR2760113A1 (fr) | 1998-08-28 |
EP1012785B1 (fr) | 2002-09-18 |
WO1998037512A1 (fr) | 1998-08-27 |
DE69808112T2 (de) | 2003-05-15 |
KR20000075577A (ko) | 2000-12-15 |
EP1012785A1 (fr) | 2000-06-28 |
ATE224569T1 (de) | 2002-10-15 |
JP2001513230A (ja) | 2001-08-28 |
BR9807357A (pt) | 2000-10-10 |
JP2008234686A (ja) | 2008-10-02 |
CA2281616A1 (fr) | 1998-08-27 |
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