CN1227421A - 光学半导体器件 - Google Patents
光学半导体器件 Download PDFInfo
- Publication number
- CN1227421A CN1227421A CN99100844A CN99100844A CN1227421A CN 1227421 A CN1227421 A CN 1227421A CN 99100844 A CN99100844 A CN 99100844A CN 99100844 A CN99100844 A CN 99100844A CN 1227421 A CN1227421 A CN 1227421A
- Authority
- CN
- China
- Prior art keywords
- bare fiber
- resin
- phototypesetting
- fiber
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
- G02B6/4243—Mounting of the optical light guide into a groove
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
- G02B6/4259—Details of housings having a supporting carrier or a mounting substrate or a mounting plate of the transparent type
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4262—Details of housings characterised by the shape of the housing
- G02B6/4265—Details of housings characterised by the shape of the housing of the Butterfly or dual inline package [DIP] type
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4286—Optical modules with optical power monitoring
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4827998 | 1998-02-27 | ||
JP048279/98 | 1998-02-27 | ||
JP048279/1998 | 1998-02-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1227421A true CN1227421A (zh) | 1999-09-01 |
CN1153306C CN1153306C (zh) | 2004-06-09 |
Family
ID=12799006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB991008448A Expired - Fee Related CN1153306C (zh) | 1998-02-27 | 1999-02-25 | 光学半导体器件 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6130444A (zh) |
EP (1) | EP0939328B1 (zh) |
CN (1) | CN1153306C (zh) |
DE (1) | DE69909667T2 (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1324338C (zh) * | 2002-06-05 | 2007-07-04 | 富士胶片株式会社 | 采用塑料光纤的传送装置 |
CN101986178A (zh) * | 2009-07-28 | 2011-03-16 | Jds尤尼弗思公司 | 一种发光半导体器件 |
CN102455471A (zh) * | 2010-10-27 | 2012-05-16 | 中国科学院大连化学物理研究所 | 一种发光二极管与光电转换器件的耦合方法 |
CN107681419A (zh) * | 2017-10-16 | 2018-02-09 | 四川思创优光科技有限公司 | 增益光纤散热结构、增益光纤装置及安装方法 |
CN108681001A (zh) * | 2018-03-30 | 2018-10-19 | 昂纳信息技术(深圳)有限公司 | 一种同轴激光器及同轴激光*** |
CN112534323A (zh) * | 2018-10-12 | 2021-03-19 | 株式会社藤仓 | 光学装置及激光装置 |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1168164A (ja) * | 1997-08-26 | 1999-03-09 | Rohm Co Ltd | 双方向光通信用モジュール |
JP3684305B2 (ja) * | 1998-09-17 | 2005-08-17 | 日本オプネクスト株式会社 | 半導体レーザ結合装置および半導体受光装置 |
JP3459787B2 (ja) * | 1999-04-02 | 2003-10-27 | Nec化合物デバイス株式会社 | 光半導体モジュール及びその製造方法 |
US6467972B2 (en) * | 2000-02-29 | 2002-10-22 | Kyocera Corporation | Optical interconnection module |
US6775440B2 (en) * | 2000-04-28 | 2004-08-10 | Kyocera Corporation | Optical module and carrier for optical module |
FR2815138B1 (fr) * | 2000-10-05 | 2003-01-31 | Cit Alcatel | Structure interne a faible contrainte pour boitier optoelectrique |
US7345316B2 (en) * | 2000-10-25 | 2008-03-18 | Shipley Company, L.L.C. | Wafer level packaging for optoelectronic devices |
KR100403739B1 (ko) * | 2001-07-06 | 2003-10-30 | 삼성전자주식회사 | 광센서를 이용한 평면 도파로형 광회로 칩의 접합 장치 |
US7078671B1 (en) * | 2001-08-06 | 2006-07-18 | Shipley Company, L.L.C. | Silicon optical microbench devices and wafer-level testing thereof |
GB0201990D0 (en) * | 2002-01-29 | 2002-03-13 | Denselight Semiconductors Pte | Package casing for fibre-coupled optoeletronic device |
US7095922B2 (en) | 2002-03-26 | 2006-08-22 | Ngk Insulators, Ltd. | Lensed fiber array and production method thereof |
JP2004200399A (ja) * | 2002-12-18 | 2004-07-15 | Tdk Corp | 光モジュール及びその製造方法 |
JP2005055613A (ja) * | 2003-08-01 | 2005-03-03 | Sumitomo Electric Ind Ltd | 光モジュール |
JP2007115905A (ja) * | 2005-10-20 | 2007-05-10 | Fujifilm Corp | 撮像素子パッケージの製造装置及び撮像素子パッケージの製造方法 |
JP2008116861A (ja) * | 2006-11-08 | 2008-05-22 | Opnext Japan Inc | 光モジュール |
JP2010186090A (ja) * | 2009-02-13 | 2010-08-26 | Hitachi Ltd | 光送受信モジュール |
US9052477B2 (en) * | 2009-10-29 | 2015-06-09 | Sumitomo Electric Industries, Ltd. | Optical transceiver with inner fiber set within tray securing thermal path from electronic device to housing |
FR2962231B1 (fr) * | 2010-07-02 | 2014-10-31 | Alcatel Lucent | Procede d'alignement et de fixation d'une fibre optique couplee a un composant optoelectronique |
JP5925062B2 (ja) * | 2012-06-18 | 2016-05-25 | シチズンホールディングス株式会社 | 光モジュール及び光モジュールの製造方法 |
US8708729B2 (en) * | 2012-06-19 | 2014-04-29 | Hon Hai Precision Industry Co., Ltd. | Electrical connector assembly having independent loading mechanism facilitating interconnections for both CPU and cable |
KR20140130884A (ko) * | 2013-05-02 | 2014-11-12 | 주식회사 포스코엘이디 | 광 반도체 조명장치 |
CN111239931A (zh) * | 2018-11-01 | 2020-06-05 | 青岛海信宽带多媒体技术有限公司 | 一种光发射器的耦合方法及光发射器 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3010820C2 (de) * | 1980-03-20 | 1984-07-26 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung einer Anordnung mit einer Haltevorrichtung zur Halterung eines Lichtwellenleiters |
JPS5967678A (ja) * | 1982-10-12 | 1984-04-17 | Hitachi Ltd | 光フアイバ−付レ−ザ−ダイオ−ド装置 |
US4752109A (en) * | 1986-09-02 | 1988-06-21 | Amp Incorporated | Optoelectronics package for a semiconductor laser |
FR2623297B1 (fr) * | 1987-11-13 | 1991-09-27 | Cit Alcatel | Dispositif de couplage entre une fibre optique et un composant optoelectronique |
US5048912A (en) * | 1988-03-09 | 1991-09-17 | Fujitsu Limited | Optical fiber switching with spherical lens and method of making same |
JPH08166523A (ja) * | 1994-12-13 | 1996-06-25 | Hitachi Ltd | 光アセンブリ |
US5602955A (en) * | 1995-06-07 | 1997-02-11 | Mcdonnell Douglas Corporation | Microactuator for precisely aligning an optical fiber and an associated fabrication method |
-
1999
- 1999-02-12 US US09/249,577 patent/US6130444A/en not_active Expired - Lifetime
- 1999-02-25 EP EP99103717A patent/EP0939328B1/en not_active Expired - Lifetime
- 1999-02-25 DE DE69909667T patent/DE69909667T2/de not_active Expired - Fee Related
- 1999-02-25 CN CNB991008448A patent/CN1153306C/zh not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1324338C (zh) * | 2002-06-05 | 2007-07-04 | 富士胶片株式会社 | 采用塑料光纤的传送装置 |
CN101986178A (zh) * | 2009-07-28 | 2011-03-16 | Jds尤尼弗思公司 | 一种发光半导体器件 |
CN101986178B (zh) * | 2009-07-28 | 2015-05-13 | Jds尤尼弗思公司 | 一种发光半导体器件 |
CN102455471A (zh) * | 2010-10-27 | 2012-05-16 | 中国科学院大连化学物理研究所 | 一种发光二极管与光电转换器件的耦合方法 |
CN107681419A (zh) * | 2017-10-16 | 2018-02-09 | 四川思创优光科技有限公司 | 增益光纤散热结构、增益光纤装置及安装方法 |
CN108681001A (zh) * | 2018-03-30 | 2018-10-19 | 昂纳信息技术(深圳)有限公司 | 一种同轴激光器及同轴激光*** |
CN112534323A (zh) * | 2018-10-12 | 2021-03-19 | 株式会社藤仓 | 光学装置及激光装置 |
Also Published As
Publication number | Publication date |
---|---|
EP0939328B1 (en) | 2003-07-23 |
EP0939328A2 (en) | 1999-09-01 |
US6130444A (en) | 2000-10-10 |
CN1153306C (zh) | 2004-06-09 |
EP0939328A3 (en) | 2002-02-13 |
DE69909667T2 (de) | 2004-06-09 |
DE69909667D1 (de) | 2003-08-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: NEC COMPUND SEMICONDUCTOR DEVICES CO LTD Free format text: FORMER OWNER: NIPPON ELECTRIC CO., LTD. Effective date: 20021228 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20021228 Address after: Kanagawa, Japan Applicant after: NEC Compund semiconductor Devices Co., Ltd. Address before: Tokyo, Japan Applicant before: NEC Corp. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: NEC ELECTRONICS TAIWAN LTD. Free format text: FORMER OWNER: NEC COMPUND SEMICONDUCTOR DEVICES CO LTD Effective date: 20060512 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20060512 Address after: Kanagawa, Japan Patentee after: NEC Corp. Address before: Kanagawa, Japan Patentee before: NEC Compund semiconductor Devices Co., Ltd. |
|
C56 | Change in the name or address of the patentee |
Owner name: RENESAS ELECTRONICS CORPORATION Free format text: FORMER NAME: NEC CORP. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kanagawa, Japan Patentee after: Renesas Electronics Corporation Address before: Kanagawa, Japan Patentee before: NEC Corp. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040609 Termination date: 20140225 |