CN1225019C - 防止化学机械抛光中的凹陷和侵蚀的半导体器件制造方法 - Google Patents
防止化学机械抛光中的凹陷和侵蚀的半导体器件制造方法 Download PDFInfo
- Publication number
- CN1225019C CN1225019C CNB031064248A CN03106424A CN1225019C CN 1225019 C CN1225019 C CN 1225019C CN B031064248 A CNB031064248 A CN B031064248A CN 03106424 A CN03106424 A CN 03106424A CN 1225019 C CN1225019 C CN 1225019C
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- Prior art keywords
- dielectric film
- wiring layer
- layer
- groove
- polishing
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Links
- 238000005498 polishing Methods 0.000 title claims description 57
- 238000000034 method Methods 0.000 title claims description 42
- 239000004065 semiconductor Substances 0.000 title claims description 9
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 230000003628 erosive effect Effects 0.000 title abstract description 5
- 239000000126 substance Substances 0.000 title description 4
- 239000011810 insulating material Substances 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 239000004020 conductor Substances 0.000 claims abstract description 9
- 230000004888 barrier function Effects 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 19
- 239000000377 silicon dioxide Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 238000009792 diffusion process Methods 0.000 claims description 7
- 230000000717 retained effect Effects 0.000 claims description 7
- 230000002209 hydrophobic effect Effects 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 230000001413 cellular effect Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 157
- 239000010949 copper Substances 0.000 description 59
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 57
- 229910052802 copper Inorganic materials 0.000 description 57
- 239000011229 interlayer Substances 0.000 description 32
- 238000005260 corrosion Methods 0.000 description 21
- 230000007797 corrosion Effects 0.000 description 21
- 229910010271 silicon carbide Inorganic materials 0.000 description 14
- 229920002120 photoresistant polymer Polymers 0.000 description 13
- 230000007261 regionalization Effects 0.000 description 13
- 229910052715 tantalum Inorganic materials 0.000 description 12
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 10
- 239000012535 impurity Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- 230000002401 inhibitory effect Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000003595 mist Substances 0.000 description 3
- 238000001259 photo etching Methods 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 3
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 235000014653 Carica parviflora Nutrition 0.000 description 1
- 241000243321 Cnidaria Species 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- NCWQJOGVLLNWEO-UHFFFAOYSA-N methylsilicon Chemical compound [Si]C NCWQJOGVLLNWEO-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical group [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76807—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures
- H01L21/76808—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures involving intermediate temporary filling with material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/7684—Smoothing; Planarisation
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP166621/2002 | 2002-06-07 | ||
JP2002166621A JP4076131B2 (ja) | 2002-06-07 | 2002-06-07 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1467817A CN1467817A (zh) | 2004-01-14 |
CN1225019C true CN1225019C (zh) | 2005-10-26 |
Family
ID=29706730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031064248A Expired - Fee Related CN1225019C (zh) | 2002-06-07 | 2003-02-25 | 防止化学机械抛光中的凹陷和侵蚀的半导体器件制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6686285B2 (zh) |
JP (1) | JP4076131B2 (zh) |
KR (1) | KR100814234B1 (zh) |
CN (1) | CN1225019C (zh) |
TW (1) | TWI224536B (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004253791A (ja) * | 2003-01-29 | 2004-09-09 | Nec Electronics Corp | 絶縁膜およびそれを用いた半導体装置 |
US7217649B2 (en) * | 2003-03-14 | 2007-05-15 | Lam Research Corporation | System and method for stress free conductor removal |
JP2006165214A (ja) * | 2004-12-07 | 2006-06-22 | Sony Corp | 半導体装置およびその製造方法 |
KR100711912B1 (ko) * | 2005-12-28 | 2007-04-27 | 동부일렉트로닉스 주식회사 | 반도체 소자의 금속 배선 형성 방법 |
JP4231055B2 (ja) * | 2006-02-06 | 2009-02-25 | 株式会社東芝 | 半導体装置及びその製造方法 |
JP2007251135A (ja) * | 2006-02-18 | 2007-09-27 | Seiko Instruments Inc | 半導体装置およびその製造方法 |
JP2007294514A (ja) * | 2006-04-21 | 2007-11-08 | Renesas Technology Corp | 半導体装置 |
US8193087B2 (en) | 2006-05-18 | 2012-06-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Process for improving copper line cap formation |
JP2010171064A (ja) * | 2009-01-20 | 2010-08-05 | Panasonic Corp | 半導体装置及びその製造方法 |
JP2012064713A (ja) * | 2010-09-15 | 2012-03-29 | Toshiba Corp | 半導体装置の製造方法 |
US11862607B2 (en) * | 2021-08-16 | 2024-01-02 | Micron Technology, Inc. | Composite dielectric structures for semiconductor die assemblies and associated systems and methods |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2630588A1 (fr) * | 1988-04-22 | 1989-10-27 | Philips Nv | Procede pour realiser une configuration d'interconnexion sur un dispositif semiconducteur notamment un circuit a densite d'integration elevee |
KR100238220B1 (en) * | 1996-12-17 | 2000-01-15 | Samsung Electronics Co Ltd | Plattening method of semiconductor device |
US6140226A (en) * | 1998-01-16 | 2000-10-31 | International Business Machines Corporation | Dual damascene processing for semiconductor chip interconnects |
US6420261B2 (en) * | 1998-08-31 | 2002-07-16 | Fujitsu Limited | Semiconductor device manufacturing method |
US6150272A (en) * | 1998-11-16 | 2000-11-21 | Taiwan Semiconductor Manufacturing Company | Method for making metal plug contacts and metal lines in an insulating layer by chemical/mechanical polishing that reduces polishing-induced damage |
KR100292409B1 (ko) * | 1999-05-24 | 2001-06-01 | 윤종용 | 실리콘-메틸 결합을 함유하는 절연층을 포함하는 다층 구조의 절연막 및 그 형성방법 |
JP2001144086A (ja) * | 1999-08-31 | 2001-05-25 | Sony Corp | 埋め込み配線の形成方法、及び、基体処理装置 |
US7041599B1 (en) * | 1999-12-21 | 2006-05-09 | Applied Materials Inc. | High through-put Cu CMP with significantly reduced erosion and dishing |
US6380003B1 (en) * | 1999-12-22 | 2002-04-30 | International Business Machines Corporation | Damascene anti-fuse with slot via |
US6503827B1 (en) * | 2000-06-28 | 2003-01-07 | International Business Machines Corporation | Method of reducing planarization defects |
JP3917355B2 (ja) * | 2000-09-21 | 2007-05-23 | 株式会社東芝 | 半導体装置およびその製造方法 |
US20020064951A1 (en) * | 2000-11-30 | 2002-05-30 | Eissa Mona M. | Treatment of low-k dielectric films to enable patterning of deep submicron features |
US6432811B1 (en) * | 2000-12-20 | 2002-08-13 | Intel Corporation | Method of forming structural reinforcement of highly porous low k dielectric films by Cu diffusion barrier structures |
US6583047B2 (en) * | 2000-12-26 | 2003-06-24 | Honeywell International, Inc. | Method for eliminating reaction between photoresist and OSG |
JP4160277B2 (ja) * | 2001-06-29 | 2008-10-01 | 株式会社東芝 | 半導体装置の製造方法 |
US6562725B2 (en) * | 2001-07-05 | 2003-05-13 | Taiwan Semiconductor Manufacturing Co., Ltd | Dual damascene structure employing nitrogenated silicon carbide and non-nitrogenated silicon carbide etch stop layers |
KR100442863B1 (ko) * | 2001-08-01 | 2004-08-02 | 삼성전자주식회사 | 금속-절연체-금속 커패시터 및 다마신 배선 구조를 갖는반도체 소자의 제조 방법 |
JP4131786B2 (ja) * | 2001-09-03 | 2008-08-13 | 株式会社東芝 | 半導体装置の製造方法およびウエハ構造体 |
US6440840B1 (en) * | 2002-01-25 | 2002-08-27 | Taiwan Semiconductor Manufactoring Company | Damascene process to eliminate copper defects during chemical-mechanical polishing (CMP) for making electrical interconnections on integrated circuits |
US6531386B1 (en) * | 2002-02-08 | 2003-03-11 | Chartered Semiconductor Manufacturing Ltd. | Method to fabricate dish-free copper interconnects |
-
2002
- 2002-06-07 JP JP2002166621A patent/JP4076131B2/ja not_active Expired - Fee Related
- 2002-12-23 US US10/326,378 patent/US6686285B2/en not_active Expired - Lifetime
- 2002-12-30 TW TW091137886A patent/TWI224536B/zh not_active IP Right Cessation
-
2003
- 2003-01-06 KR KR1020030000520A patent/KR100814234B1/ko active IP Right Grant
- 2003-02-25 CN CNB031064248A patent/CN1225019C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20030228765A1 (en) | 2003-12-11 |
KR100814234B1 (ko) | 2008-03-17 |
TWI224536B (en) | 2004-12-01 |
JP4076131B2 (ja) | 2008-04-16 |
KR20030095189A (ko) | 2003-12-18 |
CN1467817A (zh) | 2004-01-14 |
JP2004014828A (ja) | 2004-01-15 |
TW200307589A (en) | 2003-12-16 |
US6686285B2 (en) | 2004-02-03 |
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