CN1206719C - 接触器、其制造方法、探针板. 及半导体器件测试插座 - Google Patents
接触器、其制造方法、探针板. 及半导体器件测试插座 Download PDFInfo
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- CN1206719C CN1206719C CNB021526818A CN02152681A CN1206719C CN 1206719 C CN1206719 C CN 1206719C CN B021526818 A CNB021526818 A CN B021526818A CN 02152681 A CN02152681 A CN 02152681A CN 1206719 C CN1206719 C CN 1206719C
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/0675—Needle-like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
- H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Geometry (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (30)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002099133A JP4054208B2 (ja) | 2002-04-01 | 2002-04-01 | コンタクタの製造方法 |
JP099133/2002 | 2002-04-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1449009A CN1449009A (zh) | 2003-10-15 |
CN1206719C true CN1206719C (zh) | 2005-06-15 |
Family
ID=28449844
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021526818A Expired - Fee Related CN1206719C (zh) | 2002-04-01 | 2002-11-29 | 接触器、其制造方法、探针板. 及半导体器件测试插座 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6767219B2 (zh) |
JP (1) | JP4054208B2 (zh) |
KR (1) | KR100911676B1 (zh) |
CN (1) | CN1206719C (zh) |
TW (1) | TW591731B (zh) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10111640A1 (de) * | 2001-03-10 | 2002-10-02 | Airbus Gmbh | Verfahren zur Ermittlung und Meldung von Überhitzungen und Feuern in einem Flugzeug |
JP2005019393A (ja) * | 2003-06-05 | 2005-01-20 | Sharp Corp | 異方性導電物、表示装置、表示装置の製造方法および導電部材 |
US7210225B2 (en) * | 2003-12-09 | 2007-05-01 | Fci Americas Technology, Inc. | Methods for controlling contact height |
US7282932B2 (en) * | 2004-03-02 | 2007-10-16 | Micron Technology, Inc. | Compliant contact pin assembly, card system and methods thereof |
US20060028220A1 (en) * | 2004-07-21 | 2006-02-09 | K&S Interconnect, Inc. | Reinforced probes for testing semiconductor devices |
US20090174423A1 (en) * | 2004-07-21 | 2009-07-09 | Klaerner Peter J | Bond Reinforcement Layer for Probe Test Cards |
JP2006088451A (ja) * | 2004-09-22 | 2006-04-06 | Rikogaku Shinkokai | 耐経年劣化特性に優れたPt基導電性被覆材料 |
US7959984B2 (en) * | 2004-12-22 | 2011-06-14 | Lam Research Corporation | Methods and arrangement for the reduction of byproduct deposition in a plasma processing system |
US20060218680A1 (en) * | 2005-03-28 | 2006-09-28 | Bailey Andrew D Iii | Apparatus for servicing a plasma processing system with a robot |
EP2078578A1 (de) * | 2008-01-10 | 2009-07-15 | Siemens Aktiengesellschaft | Belotung von Löchern, Verfahren zum Beschichten und Lotgutstäbchen |
TWI369498B (en) * | 2008-06-18 | 2012-08-01 | Star Techn Inc | Probe and probe card for integrated circiut devices using the same |
JP2012137292A (ja) * | 2009-04-08 | 2012-07-19 | Alps Electric Co Ltd | プローブカード |
KR200454194Y1 (ko) * | 2009-08-10 | 2011-06-21 | (주)엘티 | 핀 지그용 승하강 보조장치 및 이를 이용한 핀 지그 |
CN102651506A (zh) * | 2011-02-23 | 2012-08-29 | 光九实业股份有限公司 | 具有弯曲导线的导电胶体 |
EP2748599B1 (en) | 2011-08-26 | 2016-11-23 | Waters Technologies Corporation | Chromatography apparatus having diffusion bonded coupler |
KR20150022163A (ko) * | 2013-08-22 | 2015-03-04 | 삼성디스플레이 주식회사 | 플라즈마 처리 장치용 스트랩 및 이를 포함하는 플라즈마 처리 장치 |
US9257764B2 (en) * | 2014-01-16 | 2016-02-09 | International Business Machines Corporation | Low insertion force connector utilizing directional adhesion |
KR101737550B1 (ko) * | 2015-08-28 | 2017-05-18 | (주)마이크로컨텍솔루션 | 콘택트 제조 방법, 콘택트, 및 콘택트를 포함하는 소켓 |
US10998657B2 (en) | 2016-03-18 | 2021-05-04 | Apple Inc. | Precious-metal-alloy contacts |
DE202017001425U1 (de) * | 2016-03-18 | 2017-07-06 | Apple Inc. | Kontakte aus Edelmetallegierungen |
JP6814558B2 (ja) * | 2016-06-27 | 2021-01-20 | 株式会社日本マイクロニクス | 電気的接続装置及び接触子 |
KR101843322B1 (ko) | 2017-09-27 | 2018-03-29 | 조항일 | 반도체 테스트용 소켓의 컨택핀 조립장치 |
KR101954002B1 (ko) * | 2017-12-29 | 2019-03-04 | 조항일 | 반도체 테스트용 소켓의 컨택핀 조립장치 |
CN108761151B (zh) * | 2018-08-10 | 2023-10-31 | 浙江金连接科技股份有限公司 | 一种测试探针用磷青铜套筒 |
US10872866B2 (en) * | 2018-10-08 | 2020-12-22 | Advanced Semiconductor Engineering, Inc. | Semiconductor package and method of manufacturing the same |
JP7511325B2 (ja) * | 2018-12-10 | 2024-07-05 | プローブイノベーション株式会社 | 垂直プローブと垂直プローブ用治具 |
TWI688774B (zh) * | 2019-01-23 | 2020-03-21 | 中華精測科技股份有限公司 | 高速探針卡裝置及其矩形探針 |
KR102091813B1 (ko) * | 2019-03-04 | 2020-03-20 | (주)디팜스테크 | 부분 열처리된 초소형 반도체 번인 테스트 소켓용 콘택 핀 및 그 제조방법 |
CN110488208B (zh) * | 2019-08-26 | 2020-05-12 | 上海大学 | 一种基于磁力感测的形状探针并行制作微平台及制作方法 |
KR20210058641A (ko) * | 2019-11-12 | 2021-05-24 | 화인인스트루먼트 (주) | 프로브 어레이 및 그를 이용한 프로브 카드의 프로브 헤드 제조 방법 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5917707A (en) | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
US6452406B1 (en) | 1996-09-13 | 2002-09-17 | International Business Machines Corporation | Probe structure having a plurality of discrete insulated probe tips |
US6442831B1 (en) * | 1993-11-16 | 2002-09-03 | Formfactor, Inc. | Method for shaping spring elements |
JP2665171B2 (ja) * | 1994-11-29 | 1997-10-22 | 山形日本電気株式会社 | プローブカード及びその使用方法 |
-
2002
- 2002-04-01 JP JP2002099133A patent/JP4054208B2/ja not_active Expired - Fee Related
- 2002-11-11 TW TW091133071A patent/TW591731B/zh not_active IP Right Cessation
- 2002-11-13 US US10/292,839 patent/US6767219B2/en not_active Expired - Fee Related
- 2002-11-21 KR KR1020020072587A patent/KR100911676B1/ko not_active IP Right Cessation
- 2002-11-29 CN CNB021526818A patent/CN1206719C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR100911676B1 (ko) | 2009-08-10 |
JP2003294787A (ja) | 2003-10-15 |
JP4054208B2 (ja) | 2008-02-27 |
TW200305238A (en) | 2003-10-16 |
US20030186566A1 (en) | 2003-10-02 |
KR20030079658A (ko) | 2003-10-10 |
US6767219B2 (en) | 2004-07-27 |
TW591731B (en) | 2004-06-11 |
CN1449009A (zh) | 2003-10-15 |
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Effective date of registration: 20081219 Address after: Tokyo, Japan Patentee after: Fujitsu Microelectronics Ltd. Address before: Kanagawa, Japan Patentee before: Fujitsu Ltd. |
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Owner name: FUJITSU MICROELECTRONICS CO., LTD. Free format text: FORMER OWNER: FUJITSU LIMITED Effective date: 20081219 |
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Owner name: FUJITSU SEMICONDUCTOR CO., LTD. Free format text: FORMER NAME: FUJITSU MICROELECTRON CO., LTD. |
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Address after: Kanagawa Patentee after: FUJITSU MICROELECTRONICS Ltd. Address before: Kanagawa Patentee before: Fujitsu Microelectronics Ltd. |
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Address after: Kanagawa Patentee after: FUJITSU MICROELECTRONICS Ltd. Address before: Tokyo, Japan Patentee before: Fujitsu Microelectronics Ltd. |
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