CN1183430C - Quick heat conducting heat radiator module - Google Patents
Quick heat conducting heat radiator module Download PDFInfo
- Publication number
- CN1183430C CN1183430C CNB011344881A CN01134488A CN1183430C CN 1183430 C CN1183430 C CN 1183430C CN B011344881 A CNB011344881 A CN B011344881A CN 01134488 A CN01134488 A CN 01134488A CN 1183430 C CN1183430 C CN 1183430C
- Authority
- CN
- China
- Prior art keywords
- heat
- groups
- radiator
- heat radiator
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The present invention relates to a heat radiating module group with the function of rapid heat conduction, which comprises two groups of heat radiating sheets, a base, fin sheets connected to the base and more than one group of heat conducting superconductive pipes, wherein the radiating sheets are overlapped and combined, and the heat conducting superconductive pipes are connected to the positions of the radiating sheets, which are adjacent to contact heat sources and other positions which are far away from the heat sources. The heat radiating sheets are fastened and fixed by the heat conducting superconductive pipes; in addition, a heat radiating fan blows out cooling air to the heat radiating sheets respectively, and the heat radiating efficiency can be further enhanced. The present invention can be used for combining a plurality of groups of heat radiating module groups composed of the heat radiating sheets, and one or a plurality of groups of heat radiating fans are matched to blow out cooling air; thus, the heat quantity is rapidly conducted and radiated through the heat radiating module group with the function of rapid heat conduction.
Description
Technical field
But the present invention relates to a kind of heat radiation module that has from the body quick conductive, but especially a kind ofly be applicable to that the heat that computer cpu or high thermal source product are produced carries out fast, efficiently radiates heat have a heat radiation module from the body quick conductive.
Background technology
The present heat abstractor that adopted at computer cpu (CPU) or high thermal source product of industrial community, be by having the pedestal contact thermal source of the metal heat radiator of high heat transfer efficient mostly, and with heat absorption, be delivered on the fin of heat radiator, utilize fan to blow out cold air again the heat on the heat radiator distributed.
This way no doubt produces effect for the little heat that Small-sized C PU is produced, but can't be effectively and reach radiating effect fast for the more and more faster a large amount of heats that large-scale CPU produced of arithmetic speed, trace it to its cause and have a segment distance between the metal base that is heat radiator and the radiating fin end, because heat radiator has only pedestal with the position that thermal source (being CPU) contacts, so the heat that pedestal is absorbed can't be transferred to the end of radiating fin apace, and the heat that the root of radiating fin and distal portion are absorbed is inequality, the heat that is absorbed near the fin root of pedestal is many more more, the heat that fin tips absorbed away from pedestal is then few more more, so cause the limited radiating fin of area only can utilize its part to come distribute heat near metal base, therefore, the radiating efficiency of known heat abstractor can't be caught up with the fast-developing CPU operation efficiency or the radiating requirements of high thermal source product really.If there is brand-new heat abstractor can break through the shortcoming of known heat abstractor, strengthen whole radiating effect, can significantly improve the higher radiating requirements of electronic product.
Summary of the invention
But the purpose of this invention is to provide a kind of heat radiation module that has from the body quick conductive, it can be superimposed with each other two groups of heat radiator, utilize heat-transfer superconductive pipe to unroll in two groups of heat radiator, wherein one group of heat radiator contacts thermal source, make heat to be delivered to another group heat radiator at high speed via heat-transfer superconductive pipe, cooperate the radiator fan that is provided with in addition that two groups of heat radiator are blown out cold air and heat radiation simultaneously, radiating effect that can more efficient lifting heat radiator.
But another object of the present invention provides a kind of heat radiation module that has from the body quick conductive, the heat radiation module recombinant that plural groups can also be made of described two groups of heat radiator and heat-transfer superconductive pipe, and cooperate single or most groups of radiator fans that the heat radiator of majority group is blown out cold air, by this with a large amount of heat quick conductive and heat radiation.
Technical scheme of the present invention is, but this has the heat radiation module from the body quick conductive, comprising:
Two groups of heat radiator, it has pedestal and is connected fin on the pedestal;
One group of above heat-transfer superconductive pipe, this heat-transfer superconductive pipe is connected the position of this heat radiator near the contact thermal source, and the position of other stow away from heat, to use and will contact the position of the heat transferred at thermal source position to other, these two groups of heat radiator are fastened fixing by this heat-transfer superconductive pipe.
The base bottom surface of described two groups of heat radiator is equipped with plural groove, above-mentioned heat-transfer superconductive pipe is bent into U-shaped, a this U-shaped heat-transfer superconductive pipe wherein end is inserted in the groove of one group of heat radiator, the other end is inserted the groove of another group heat radiator, fin in two groups of heat radiator is corresponding to be combined into one group, can increase area of dissipation.
The fin of described two groups of heat radiator is interlaced to be combined into one group.
The base bottom surface of described two groups of heat radiator is equipped with plural groove, above-mentioned heat-transfer superconductive pipe is a dual U-shaped, two free ends of this dual U-shaped heat-transfer superconductive pipe are inserted in the groove of one group of heat radiator, do not have free-ended U-shaped heat-transfer superconductive pipe above and insert the groove of another group heat radiator, two groups of heat radiator are that fin is corresponding to be combined as one group.
But the heat radiation module that this has from the body quick conductive also comprises: a radiator fan, this radiator fan are assembled in above-mentioned two groups of sides that heat radiator is common, and cold air is blowed to fin, to reach more high efficiency radiating effect.
The heat radiation module that described heat radiator and above-mentioned heat-transfer superconductive pipe are formed can make up side by side again.
But the heat radiation module that this has from the body quick conductive also can comprise: single or most groups radiator fan.
Characteristics of the present invention and advantage comprise:
1, the present invention can be effectively and fast the heat that thermal source produced is effectively transferred on the heat radiation module.
2, the present invention can be effectively and the heat that thermal source produced is effectively loose remove fast.
3, but the present invention also can be fixed together a plurality of heat radiation module combinations that have from the body quick conductive, can effectively expand collocation at the heat energy that thermal source the produced demand of looking.
Description of drawings
Fig. 1 is the three-dimensional exploded view of the present invention with the heat-transfer superconductive pipe combination of two groups of box-shaped heat radiator and plural single U-shaped;
Fig. 2 is the state after the elements combination shown in Fig. 1, and cooperates the stereographic map behind the assembling radiator fan;
Fig. 3 is staggered involutory with the fin of two groups of heat radiator for the present invention, and cooperates the three-dimensional exploded view of the heat-transfer superconductive pipe and the combination of fans of plural single U-shaped;
Fig. 4 is the stereographic map after the elements combination shown in Fig. 3;
Fig. 5 is the embodiment three-dimensional exploded view of the present invention with two groups of dual U-shaped heat-transfer superconductive pipe and two groups of box-shaped heat radiator combinations;
Fig. 6 is the stereographic map after each elements combination shown in Fig. 5;
Stereographic map after the heat radiation module recombinant that Fig. 7 will be made of two groups of heat radiator and plural heat-transfer superconductive pipe for the present invention.
The drawing reference numeral explanation
1, heat radiator 12, groove 10, pedestal 2, heat-transfer superconductive pipe
11, fin 3, radiator fan
Embodiment
Conjunction with figs. elaborates purpose of the present invention and function.
See also shown in Figure 1, but the heat radiation module that has from the body quick conductive provided by the present invention, include two groups of heat radiator 1 and heat-transfer superconductive pipe 2, wherein heat-transfer superconductive pipe 2 adopts the metal body that can freely bend (copper for example, aluminium or other metal body), and comprise high-temperature superconductor compound-material in the inside of body with high speed heat-conductive characteristic, for example: y ba cu o compound (YBCO) superconductor, TBCCO (TBCCO) superconductor, HBCCO (HBCCO) superconductor, BSCCO (BSCCO) superconductor, or other superconductors, and can reach other material of quick conductive etc., and, spill body to prevent described superconductor with the closed at both ends of body.By described metal body be included in its inner superconductor and constitute heat-transfer superconductive pipe 2, its applied principle, be the high speed concussion and friction that produces when utilizing the interior molecule of body to be heated, allow heat energy pass with fluctuation mode Rapid Thermal, because of it conducts heat fast, thus heat-transfer superconductive pipe be called, and heat-transfer superconductive pipe is very short by the transmission time that the hot junction transfers to cold junction, therefore the temperature difference of hot junction and cold junction is very little, can reach best heat-conducting effect.Through experiment confirm, the speed of its heat transfer is about five times of copper, and is faster than the heat transfer rate of the heat radiator of generally making with aluminium extruded type.
Heat radiator 1 is generally to be used for being contacted with CPU to go up to absorb the element of the heat that produced among the present invention, it is two groups of heat radiator 1 that fin is exposed, the reason that adopts two groups of heat radiator 1 is when heat conduction during to the top heat radiator, cause two groups of heat radiator is up and down separated, heat is not understood convection current up and down, so do not have the hot reflux phenomenon.
Fig. 1 has disclosed the first embodiment of the present invention, it comprises two groups of heat radiator 1 with exposed fin 11, wherein the side of one group of heat radiator 1 is provided with plural groove 12 near the appropriate location of pedestal 10, and pedestal 10 bottom surfaces of another group heat radiator 1 also are provided with plural groove 12.Described heat-transfer superconductive pipe 2 is bent into single U-shaped shape, a wherein end of this U-shaped is inserted in the described groove 12, the other end is then inserted in the groove 12 of another group heat radiator 1, allow two groups of heat radiator 1 be fin 11 and be combined into one group accordingly, and heat-transfer superconductive pipe 2 also has the fixation (as shown in Figure 2) that fastens two groups of heat radiator 1 simultaneously.Heat radiator 1 pedestal 10 bottom surfaces that groove is set are used for contact such as thermals source such as CPU, thereby a large amount of heats can be delivered to another group heat radiator 1 via heat-transfer superconductive pipe 2, again with spread heat be delivered to each fin 11, but constitute a heat radiation module that has from the body quick conductive by described heat-transfer superconductive pipe 2 and heat radiator 1.Radiator fan 3 is assembled in the common side of two groups of heat radiator 1, cold air is blowed to fin 11, to reach more high efficiency radiating effect.
Fig. 3 has shown the second embodiment of the present invention, it comprises two groups of identical heat radiator 1, pedestal 10 bottom surfaces of this heat radiator 1 are provided with plural groove 12, the both sides that are bent into the heat-transfer superconductive pipe 2 of U-shaped are inserted respectively in the groove 12 of two heat radiator 1, allow the fin 11 of two groups of heat radiator 1 be combined into one group, and heat-transfer superconductive pipe 2 also have the fixation (as shown in Figure 4) that fastens two groups of heat radiator 1 simultaneously interlacedly.The pedestal 10 of heat radiator 1 can be used to contact thermal source, thereby a large amount of heats can be delivered to another group heat radiator 1 via heat-transfer superconductive pipe 2 from one group of heat radiator 1, and simultaneously with spread heat be delivered to each fin 11, and staggered up and down fin 11 can increase area of dissipation.3 of radiator fans are assembled in the common side of two groups of heat radiator 1, cold air are blowed to fin 11, to reach high efficiency radiating effect.
Fig. 5 has shown the third embodiment of the present invention, wherein the part of heat radiator 1 is identical with first embodiment, different is heat-transfer superconductive pipe 2, described heat-transfer superconductive pipe 2 is the shape that two groups of bendings become dual U-shaped, wherein the width of one group of heat-transfer superconductive pipe 2 is bigger, and the width of the other end is less, two free ends of the dual U-shaped of bigger one group heat-transfer superconductive pipe 2 can be inserted two grooves 12 that are positioned at the side of one group of heat radiator, and toply do not have free-ended U-shaped and also insert two grooves 12 that are positioned at the side of another group heat radiator simultaneously, in addition with auspicious two grooves 12 that are positioned at one group of heat radiator side of inserting of two freedom of the dual U-shaped of less one group heat-transfer superconductive pipe 2, do not have free-ended U-shaped above and then insert two grooves 12 (as shown in Figure 6) that are positioned at another group heat radiator side simultaneously, therefore, the heat that pedestal 10 is absorbed is except can conducting via fin 11, simultaneously also be delivered to fin 11 apace, with being heated partly of quick dispersion heat radiator 1 via heat-transfer superconductive pipe 2.Side at heat radiator 1 then is provided with radiator fan 3, and 3 pairs of fins 11 of this radiator fan blow out cold air, thereby the heat that heat radiator 1 can be absorbed is got rid of fast, efficiently.
Fig. 7 has shown the fourth embodiment of the present invention, and it can make up the heat radiation module of being made up of heat radiator 1 and heat-transfer superconductive pipe 2 more side by side, and installs radiator fans single or most groups additional, with its radiating efficiency of further lifting.
Though the present invention with the preferred embodiment explanation as above; but it is not that any those skilled in the art is not in breaking away from design of the present invention and scope in order to qualification the present invention; when can doing to change and modify, so protection scope of the present invention is as the criterion with the scope that claims were defined.
Claims (7)
- But 1, a kind of heat radiation module that has from the body quick conductive is characterized in that: comprising:Two groups of heat radiator, it has pedestal and is connected fin on the pedestal, and these two groups of heat radiator are the relatively superimposed setting of fin;One group of above heat-transfer superconductive pipe, this heat-transfer superconductive pipe is connected the position of this heat radiator near the contact thermal source, and the position of other stow away from heat, to use and will contact the position of the heat transferred at thermal source position to other, these two groups of heat radiator are fastened fixing by this heat-transfer superconductive pipe.
- But 2, the heat radiation module that has from the body quick conductive as claimed in claim 1, it is characterized in that: the base bottom surface of above-mentioned two groups of heat radiator is equipped with plural groove, above-mentioned heat-transfer superconductive pipe is bent into U-shaped, a this U-shaped heat-transfer superconductive pipe wherein end is inserted in the groove of one group of heat radiator, the other end is inserted the groove of another group heat radiator, fin in two groups of heat radiator is corresponding to be combined into one group, can increase area of dissipation.
- But 3, the heat radiation module that has from the body quick conductive as claimed in claim 2 is characterized in that: the fin of two groups of heat radiator is interlaced to be combined into one group.
- But 4, the heat radiation module that has from the body quick conductive as claimed in claim 1, it is characterized in that: the base bottom surface of above-mentioned two groups of heat radiator is equipped with plural groove, above-mentioned heat-transfer superconductive pipe is a dual U-shaped, two free ends of this dual U-shaped heat-transfer superconductive pipe are inserted in the groove of one group of heat radiator, do not have free-ended U-shaped heat-transfer superconductive pipe above and insert the groove of another group heat radiator, two groups of heat radiator are that fin is corresponding to be combined as one group.
- But 5, the heat radiation module that has from the body quick conductive as claimed in claim 1 is characterized in that: also comprise: a radiator fan, this radiator fan are assembled in above-mentioned two groups of sides that heat radiator is common, and cold air is blowed to fin.
- But 6, the heat radiation module that has from the body quick conductive as claimed in claim 1, it is characterized in that: the heat radiation module that above-mentioned heat radiator and above-mentioned heat-transfer superconductive pipe are formed can make up side by side again.
- But 7, the heat radiation module that has from the body quick conductive as claimed in claim 1 is characterized in that: also can comprise: single or most groups radiator fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011344881A CN1183430C (en) | 2001-11-05 | 2001-11-05 | Quick heat conducting heat radiator module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011344881A CN1183430C (en) | 2001-11-05 | 2001-11-05 | Quick heat conducting heat radiator module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1417660A CN1417660A (en) | 2003-05-14 |
| CN1183430C true CN1183430C (en) | 2005-01-05 |
Family
ID=4672534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011344881A Expired - Fee Related CN1183430C (en) | 2001-11-05 | 2001-11-05 | Quick heat conducting heat radiator module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1183430C (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM249410U (en) | 2003-12-26 | 2004-11-01 | Hon Hai Prec Ind Co Ltd | Heat dissipating device using heat pipe |
| US20050183849A1 (en) * | 2004-02-19 | 2005-08-25 | Ki-Tak Ko | Heat radiating apparatus |
| US7440280B2 (en) * | 2006-03-31 | 2008-10-21 | Hong Kong Applied Science & Technology Research Institute Co., Ltd | Heat exchange enhancement |
| CN100518476C (en) * | 2006-06-02 | 2009-07-22 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN102163757A (en) * | 2010-02-23 | 2011-08-24 | 通用汽车环球科技运作有限责任公司 | Combination of heat pipe and louvered fins for air-cooling of li-ion battery cell and pack |
| CN103186206A (en) * | 2011-12-28 | 2013-07-03 | 鸿富锦精密工业（深圳）有限公司 | Radiator assembly |
| CN108591088A (en) * | 2018-03-30 | 2018-09-28 | 郑州蓝奇盾网络科技有限公司 | A kind of basic computer exhaust fan |
| CN108521747A (en) * | 2018-04-02 | 2018-09-11 | 深圳三星通信技术研究有限公司 | A kind of radiator structure and Remote Radio Unit |
-
2001
- 2001-11-05 CN CNB011344881A patent/CN1183430C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1417660A (en) | 2003-05-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8464780B2 (en) | Heat sink with heat pipes and method for manufacturing the same | |
| CN1228842C (en) | Fin type heat radiator | |
| US20030019610A1 (en) | Rapidly self - heat-conductive heat - dissipating module | |
| US7251134B2 (en) | Extended fin array | |
| US6702003B2 (en) | Three-phase heat transfer structure | |
| CN1183430C (en) | Quick heat conducting heat radiator module | |
| JP2001223308A (en) | Heat sink | |
| US20090173474A1 (en) | Heat dissipating apparatus extended laterally from heat pipe | |
| CN101415312B (en) | Radiating device | |
| US6446709B1 (en) | Combination heat radiator | |
| CN100533716C (en) | Heat radiator | |
| US20040066628A1 (en) | Rapidly self-heat-conductive heat-dissipating module | |
| CN2729902Y (en) | Heat sink device | |
| US6636423B2 (en) | Composite fins for heat sinks | |
| CN100345289C (en) | Hot-piping radiator | |
| TWI686130B (en) | Cooling module | |
| CN1681113A (en) | Hot-piping radiator | |
| CN110198611B (en) | Heat sink device | |
| CN2802422Y (en) | Heat pipe radiator | |
| CN1904800A (en) | Fan-free type radiating structure | |
| CN212433673U (en) | Computer machine case with quick heat conduction structure | |
| CN215523219U (en) | Radiator in TV LED lamp area | |
| CN2667661Y (en) | Integrated radiating device | |
| CN2826921Y (en) | Perforation arrangement structure of heat pipe and heat sink | |
| CN110996629B (en) | Heat dissipation device and electronic product with same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |