CN117941482A

CN117941482A - Component mounting apparatus

Info

Publication number: CN117941482A
Application number: CN202180102399.2A
Authority: CN
Inventors: 长濑佳史郎; 伊藤恒太
Original assignee: Yamaha Motor Co Ltd
Current assignee: Yamaha Motor Co Ltd
Priority date: 2021-10-06
Filing date: 2021-10-06
Publication date: 2024-04-26
Also published as: DE112021008128T5; WO2023058169A1; JPWO2023058169A1

Abstract

The component mounting apparatus includes: a mounting execution unit that includes a mounting head that includes a suction nozzle and performs component mounting processing for mounting a component suctioned by the suction nozzle onto a substrate, and a photographing unit that acquires an image of the component suction processing; and a nozzle selection processing unit that performs a nozzle selection process for selecting a nozzle to be used for a component mounting process of a specified component in relation to the specified component from among the plurality of nozzles. A nozzle selection processing unit acquires information on the size of nozzle openings of the plurality of nozzles and information on the size of the surface to be suctioned of the specified component, determines whether a selected condition is satisfied based on the information, and selects a nozzle satisfying the selected condition from the plurality of nozzles.

Description

Component mounting apparatus

Technical Field

The present invention relates to a component mounting apparatus for producing a component mounting board by taking out a component from a component supply area, transferring the component onto a board, and mounting (mounting) the component.

Background

The component mounting device is provided with: a feeder for supplying the components; and a mounting head having a suction nozzle at a distal end for sucking the component supplied from the feeder, and for carrying the component onto the substrate and mounting the component thereon.

The suction nozzle provided in the mounting head needs to reliably and stably suction and hold the component. Therefore, a type of suction nozzle suitable for the suction process of the component is generally selected from a plurality of types (kinds) of suction nozzles having different shapes or sizes from each other, and used. In this case, one type of nozzle is selected for one component and used in many cases, but as disclosed in patent document 1, a plurality of types of nozzles are selected for one component and used appropriately.

However, the nozzle selection as described above is performed by the operator depending on his experience and intuition to infer the compatibility between the component and the nozzle. Therefore, the type selected varies depending on the operator, and a type of suction nozzle which is not necessarily suitable in relation to the component is sometimes selected. Consider that: in this case, the suction state of the suction nozzle with respect to the component tends to become unstable, and in order to compensate for the unstable suction state, the moving speed of the mounting head needs to be set to be small, and as a result, the production efficiency of the component mounting board is lowered. Therefore, there is a demand for a technique that enables selection of a nozzle suitable for a component mounting process of a component in relation to the component, even without depending on experience and intuition of an operator.

Prior art literature

Patent literature

Patent document 1: japanese patent laid-open publication No. 2007-142216

Disclosure of Invention

The invention provides a component mounting device, which can select a suction nozzle suitable for component mounting processing of a component in relation with the component even though the device does not depend on experience and intuition of an operator.

Further, a component mounting apparatus according to an aspect of the present invention includes: a mounting and executing unit including a mounting head including a suction nozzle for performing component suction processing for sucking a component supplied from a component supply area, and performing component mounting processing for mounting the component sucked by the suction nozzle on a substrate, and a photographing unit for performing image acquisition processing for acquiring a processing state image related to the component suction processing; and a nozzle selection processing unit that performs a selection process of selecting a nozzle to be used for the component mounting process of a specified component in relation to the specified component from among a plurality of nozzles, wherein the nozzle selection processing unit acquires information on a size of a nozzle opening of each of the plurality of nozzles and information on a size of a surface to be suctioned of the specified component, determines whether or not a selected condition associated with the size of the nozzle opening and the size of the surface to be suctioned is satisfied based on the information, and selects a nozzle satisfying the selected condition from among the plurality of nozzles.

Drawings

Fig. 1 is a block diagram showing a configuration of a component mounting apparatus according to the present invention.

Fig. 2 is a plan view of the device body of the component mounting device.

Fig. 3 is a front view mainly showing a head unit of the apparatus main body.

Fig. 4 is a view showing a suction nozzle attached to a mounting head provided in a head unit.

Fig. 5 is a flowchart showing control (main routine) of the nozzle selection process performed by the nozzle selection process section.

Fig. 6 is a flowchart showing control (subroutine) of the data acquisition process in the selected process.

Fig. 7 is a diagram illustrating selected conditions of the suction nozzle.

Fig. 8 is a view showing an example of a display screen displayed on the display unit when a plurality of selected candidates are present.

Fig. 9 is a flowchart showing control of the component mounting process performed by the mounting control unit.

Fig. 10 is a flowchart showing a modification of the control of the nozzle selection process.

Detailed Description

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[ Constitution of component mounting device ]

Fig. 1 is a block diagram showing a configuration of a component mounting apparatus 100 according to an embodiment of the present invention. The component mounting system 100 is a device for producing a component mounting board by mounting an electronic component (hereinafter referred to as a "component") on a board P such as a printed wiring board. The component mounting apparatus 100 includes an apparatus main body 1, a control unit 2, a communication unit 3, a display unit 4, and an operation unit 5. The device body 1 corresponds to an "attachment execution unit" of the present invention, and the operation unit 5 corresponds to a command input unit of the present invention.

The device main body 1 performs a device mounting process for mounting a device on the substrate P. The communication unit 3 is an interface for performing data communication with the management device 110 described later, and has a function of inputting and outputting various data and information to and from the management device 110. The control unit 2 controls the component mounting process performed by the apparatus main body 1 based on various data stored in the storage device 23 described later, and also controls the data communication by the communication unit 3. The display unit 4 displays various information related to the component mounting process. The operation unit 5 receives an input operation of various commands from an operator to the control unit 2. The detailed configuration of each of these parts will be described below.

Fig. 2 is a plan view of the device body 1 of the component mounting device 100, and fig. 3 is a front view of the head unit 16 mainly showing the device body 1. In fig. 2 and 3, the direction relationship is shown using XYZ orthogonal coordinates.

The apparatus main body 1 includes a base 10, a conveyor 12, a component supply unit 14, a head unit 16, and a photographing section 18. The base 10 is a mounting base for various devices provided in the apparatus main body 1. The conveyor 12 is a conveyance path of the substrate P extending in the X direction on the base 10, and includes a pair of belt conveyors 12a. The conveyor 12 carries the substrate P into a predetermined working position from outside the machine, and carries the substrate P out of the machine from the working position after the mounting operation. The position of the substrate P shown in fig. 2 is a work position. The conveyor 12 includes a gripping mechanism, not shown, and holds the substrate P in a state where the substrate P is positioned at the work position by the gripping mechanism in the component mounting process.

The component supply units 14 are regions for supplying components, and are provided on both sides of the conveyor 12 in the Y direction, respectively. The component supply unit 14 is provided with a plurality of feeders 14a, and components are supplied from the feeders 14 a. In this example, each component supply unit 14 is provided with a tape feeder that supplies components while feeding out a tape in which components (small surface mount components) are stored at predetermined intervals. Various feeders other than the tape feeder may be disposed in the component supply unit 14.

The head unit 16 performs a component mounting process of picking up a component from the feeder 14a by the component supply unit 14 and moving the component to the working position, and mounting the component on the substrate P held by the holding mechanism. As shown in fig. 3, the head unit 16 includes a plurality of mounting heads 160 each having a suction nozzle 161 at each distal end (lower end). The suction nozzle 161 is a suction nozzle capable of sucking the component supplied from the feeder 14 a. The suction nozzle 161 performs component suction processing for sucking components.

Fig. 4 shows the suction nozzles 161 mounted on the mounting heads 160 of the head unit 16 and the distal end surfaces of the suction nozzles 161, that is, the suction surfaces 162 of the components. In fig. 4, for convenience of description, only the mounting heads 160 at both ends in the X direction are denoted by symbols.

The suction surface 162 includes a surface perpendicular to the central axis of the suction nozzle 161, and a nozzle opening 162a is provided at the center thereof. The suction nozzle opening 162a is communicable with one of a negative pressure generating device, a positive pressure generating device, and the atmosphere via an electric switching valve. By supplying negative pressure to the suction nozzle 161, the suction nozzle 161 can suction and hold the component, and thereafter, by supplying positive pressure, suction and hold of the component are released. Further, an adsorption degree sensor, which is not shown, is provided in the passage between the suction nozzle 161 of each mounting head 160 and each electric switching valve. The adsorption degree sensor detects the adsorption degree of the element, specifically, the degree of negative pressure in the passage, and outputs the detected degree to the control unit 2.

The mounting head 160 can be moved forward and backward (up and down) in the Z direction and rotated about an axis (moved in the R direction), and is driven by a motor other than the drawing. That is, when picking up a component from the feeder 14a, the mounting head 160 is lowered from a predetermined retracted position to a predetermined component suction position, and the component is sucked and held by the suction nozzle 161, and thereafter, is raised to the retracted position. When mounting the component on the substrate P, the mounting head 160 is lowered from the retracted position to the component mounting position above the substrate P, and releases the component on the substrate P by releasing the suction and holding of the component. Accordingly, the device is mounted at the target mounting position set on the substrate P.

The head unit 16 is movable in at least the horizontal direction (XY direction) in the upper space between the component supply unit 14 and the substrate P at the work position based on the operation of the head unit driving mechanism 17. As shown in fig. 2 and 3, the head unit driving mechanism 17 includes: fixed rails 171 fixed to a pair of overhead frames provided on the base 10, respectively; a beam member 172 moving in the Y direction along the fixed rail 171; and an off-drawing unit support portion that moves in the X direction along the beam member 172. The head unit 16 is assembled on the unit support. The beam member 172 and the unit support member are moved by driving force of the motor, respectively. Based on the movements of these beam members 172 and the unit support members, the head unit 16 moves in the XY directions.

The photographing section 18 includes a1 st photographing section 181 and a2 nd photographing section 182. The 1 st imaging unit 181 and the 2 nd imaging unit 182 each include a camera including an imaging device such as a CMOS (Complementary metal-oxide-semiconductor) or a CCD (Charged-coupled device) and an illumination device for providing illumination for imaging, and the 1 st imaging unit 181 is provided between the element supply unit 14 and the conveyor 12 on the base 10 so as to face upward. The 1 st imaging unit 181 performs a component imaging process of imaging a component to identify the suction holding state of the suction nozzle 161 with respect to the component. After the suction nozzles 161 of the mounting heads 160 suck and hold the components from the feeders 14a, the head unit 16 passes above the 1 st imaging unit 181 when moving above the substrate P at the work position, and the 1 st imaging unit 181 captures the components sucked and held by the suction nozzles 161 from the lower side (that is, the distal end side in the axial direction of the suction nozzles 161). The image obtained as described above is an image (a processing state image concerning the component suction processing) in which, in addition to the component suction failure (the state in which no component is sucked) of the suction nozzle 161, for example, the posture and shape of the component sucked and held by the suction nozzle 161, the amount of deviation of the suction position of the component with respect to the suction nozzle 161, and the like can be confirmed. When the component is mounted on the substrate P, the movement direction and/or the movement amount of the head unit 16 is corrected based on the posture and the offset amount of the component. Accordingly, the mounting accuracy of the device to the target mounting position is ensured.

The 2 nd imaging unit 182 is disposed on the head unit 16 so as to face downward. The 2 nd imaging unit 182 images various marks attached to the upper surface of the substrate P disposed at the work position from above when the respective mounting heads 160 perform the component mounting process, and recognizes the marks. By recognizing the mark on the substrate P, the amount of positional displacement of the substrate P with respect to the origin coordinates is detected. In addition, when the nozzle selection processing described later is performed, the 2 nd imaging unit 182 images the component arranged at the component supply position of the feeder 14a provided in the component supply unit 14 from above to identify the surface to be suctioned of the component (see fig. 7), that is, the surface suctioned by the nozzle 161.

The nozzle support 6 is disposed between the conveyor 12 and the component supply unit 14 adjacent to the 1 st imaging section 181 in the X direction. The nozzle support 6 is a device that holds the nozzle 161. In the nozzle support 6, the plurality of nozzles 161 are held in a state that they can be attached to any mounting head 160 of the head unit 16. The suction nozzles 161 held by the suction nozzle holder 6 are attached to and detached from the mounting heads 160 as necessary before or during the start of the production of the component mounting board.

Returning to fig. 1, the display unit 4 includes, for example, a liquid crystal display or the like, and displays various information of the component mounting process performed by the apparatus main body 1. The display operation of the display unit 4 is controlled by the display control unit 25. The operation unit 5 includes a keyboard, a mouse, a touch panel provided on the display unit 4, or the like. The operation unit 5 receives an input operation of various commands from an operator to the control unit 2.

The control section 2 includes a CPU (Central Processing Unit (central processing unit)), a ROM (Read Only Memory) storing a control program, a RAM (Random Access Memory (random access Memory) serving as a work area of the CPU, and the like. The control unit 2 controls the operation of each component of the apparatus main body 1 by executing a control program stored in the ROM by the CPU, controls the data communication operation of the communication unit 3, and also executes various arithmetic processing. As shown in fig. 1, the control unit 2 includes, as main functional components, a mounting control unit 21, a nozzle selection processing unit 22, an image processing unit 24, a display control unit 25, and a communication control unit 26. The control unit 2 is provided with a storage device 23 such as a rewritable hard disk.

The mounting control unit 21 generally controls the operation of the component mounting process of the apparatus main body 1 based on various data stored in the storage device 23, and executes various arithmetic processing and judgment processing accompanying the control.

The storage device 23 stores various programs executed by the mounting control unit 21 and the nozzle selection processing unit 22, and various data to be referred to when executing the programs. The various data include substrate data D1 and mounting data D2.

The substrate data D1 is mainly data on the substrate P (component mounting substrate) to be produced, and includes production plan information D11 and mounting component information D12. The production plan information D11 is information indicating the type of the substrate P to be produced, the order of production of the substrates P of each type, the number of production of the substrates P of each type, and the like. The mounted component information D12 is information in which the relationship between the components mounted on the various types of substrates P, the target mounting positions (X, Y, R) of the respective components on the substrates P, and the target suction positions (X, Y) of the suction nozzles 161 at the time of performing the component suction processing of the components is registered. The target suction position is usually set at the center position of the suction surface S of the element.

The mounting data D2 is information to be referred to in various arithmetic processes and judgment processes required for control of the component mounting process of the apparatus main body 1 by the mounting control unit 21 and control of the nozzle selection process of the nozzle 161 to be described later by the nozzle selection processing unit 22. The mounting data D2 includes component information D21, nozzle information D22, nozzle matching information D23, control parameter information D24, arrangement information D25, and nozzle support frame information D26.

The element information D21 is information in which the element name indicating the type of element, the external dimension of the element, the dimension and area of the surface S to be suctioned (information on the size of the surface S to be suctioned), the thickness of the element, and the like are registered for each type of element. The nozzle information D22 is information in which, for each type of the nozzle 161, information indicating the type of the nozzle 161, the size and area of the suction surface 162 of the nozzle 161, the size and area of the nozzle opening 162a (information on the size of the nozzle opening), and the like are registered.

The nozzle matching information D23 is information in which the relationship between the component and the type of the nozzle 161 used for the component mounting process is registered. In the nozzle matching information D23, a type of the nozzle 161, that is, a type of the nozzle 161 selected by a nozzle selection process described later, is registered for each type of component.

The control parameter information D24 is information in which parameters for driving control of the head unit 16 and the mounting head 160 in the component mounting process are registered. Information on the moving speed and the acceleration/deceleration of the head unit 16 is registered as a parameter of the head unit 16 in the control parameter information D24. Further, information about the lifting speed and the acceleration/deceleration speed of the mounting head 160 at the time of adsorbing the component and at the time of mounting the component, and the component adsorbing position and the component mounting position (positions in the Z direction) are registered as parameters of the mounting head 160.

The arrangement information D25 is information in which parameters that determine the feeder 14a provided to the component supply unit 14 are registered. In the arrangement information D25, the type of the feeder 14a, an identifier for specifying the feeder 14a, the setting position of the feeder 14a in the component supply unit 14, the type of the component supplied by each feeder 14a, and the like are registered as parameters for specifying the feeder 14 a.

The nozzle holder information D26 is information in which the nozzle 161 provided in the nozzle holder 6, the installation position of the nozzle 161 in the nozzle holder 6, and the like are registered.

The nozzle selection processing unit 22 performs nozzle selection processing of selecting a nozzle 161 of a type suitable for component mounting processing of a component in relation to the component. The nozzle selection process is, for example, a process of selecting, when the mounted component information D12 includes a new component that is not registered in the nozzle matching information D23, a type of nozzle 161 suitable for the component mounting process of the component from the nozzles 161 mounted on the respective mounting heads 160 of the head unit 16 and the nozzles 161 held by the nozzle holding frame 6, and registering the selected type of nozzle 161 in the matching information D23. The nozzle selection process will be described in detail later.

The image processing unit 24 inputs the image signals output from the 1 st imaging unit 181 and the 2 nd imaging unit 182, and generates a digital image based on the image signals. The mounting control unit 21 and the nozzle selection processing unit 22 perform processing of recognizing the posture and shape of the component suctioned and held by the nozzle 161, the amount of deviation of the suction position of the component, and the like based on the image.

The display control unit 25 controls the display operation of the display unit 4. The communication control unit 26 controls data communication between the component mounting apparatus 100 and the management apparatus 110 by controlling the communication unit 3.

The management device 110 includes, for example, a personal computer connected to the component mounting device 100 in a data communication manner. The management device 110 acquires the management data DM output from the component mounting system 100, accumulates and stores the management data DM. The management data DM is a history of 1-time component mounting processing performed by the mounting head 160, and is data obtained by associating data such as a component recognition result and a shift amount of the suction position in the component mounting processing with the mounting head 160, the suction nozzle 161, the feeder 14a, and the like used in the component mounting processing. The management data DM is produced by the mounting control unit 21, and is output from the component mounting apparatus 100 to the management apparatus 110 when the production type of the substrate P is switched, for example.

[ Suction nozzle selection Process ]

Next, control of the nozzle selection process will be described based on fig. 5 and 6. Fig. 5 is a flowchart showing control (main routine) of the nozzle selection process performed by the control unit 2 (mainly, the nozzle selection process unit 22), and fig. 6 is a flowchart showing control (sub routine) of the data acquisition process in the nozzle selection process.

As described above, the nozzle selection process is a process of selecting a nozzle 161 of a type (hereinafter, the "type" may be omitted) suitable for the component mounting process of the component in relation to the component, and registering the nozzle selection process in the nozzle matching information D23. The nozzle selection process is performed automatically or based on an operation of the operation unit 5 by an operator before the type of the substrate P (component mounting substrate) is changed and the production thereof is started. The nozzle selection process is performed for each component of all types of components included in the mounted component information D12, or for each component of a part of types selected by the operator by the operation of the operation unit 5.

If the nozzle selection process shown in fig. 5 is started, the nozzle selection processing section 22 first executes the data acquisition process of the component and the nozzle 161 to be subjected to the process according to the flowchart of fig. 6 (step S1). Specifically, the nozzle selection processing unit 22 refers to the nozzle information D22, and determines whether or not there is information on the nozzle 161 attached to each mounting head 160 of the head unit 16 and the nozzle 161 held by the nozzle support frame 6 (step S31). Specifically, whether or not data of the size and the area of the suction nozzle opening 162a of the suction surface 162 is present is determined, and if yes, the process proceeds to step S33.

If there is no data on any of the nozzles 161 (no in step S31), the nozzle selection processing unit 22 drives the head unit 16, and the nozzle 161 having no data is disposed above the 2 nd imaging unit 182. Accordingly, a process of acquiring an image of the suction surface 162 of the suction nozzle 161 is performed (step S39). The nozzle selection processing unit 22 determines whether or not the nozzle opening 162a can be identified in the acquired image (step S41). In the case of no, the display control unit 25 controls the display unit 4 so that the image of the suction surface 162 acquired in step S39 is displayed together with the information for requesting the specification of the suction nozzle opening 162a (step S43). In this case, the operator can specify the nozzle opening 162a by operating the operation unit 5, and the nozzle selection processing unit 22 waits for an instruction input to specify the nozzle opening 162a, and if the instruction input is present (yes in step S45), the process proceeds to step S33. The suction nozzle opening 162a can be determined by, for example, an operator operating a tool displayed on a screen to outline a portion corresponding to the suction nozzle opening 162a on the image of the suction surface 162.

If the determination at step S41 and step S45 is yes, the nozzle selection processing unit 22 shifts the processing to step S33, reads the data of the nozzle opening 162a from the mounting data D2, or calculates the size and area of the nozzle opening 162a based on the image of the nozzle opening 162a identified at step S41 or the image of the nozzle opening 162a determined at step S45.

Next, the nozzle selection processing unit 22 refers to the component information D21, determines whether or not there is information on the target component (step S35), and more specifically, determines whether or not there is data on the size and area of the surface S to be suctioned of the target component, and if yes, shifts the process to step S37.

If there is no data (no in step S35), the nozzle selection processing unit 22 executes processing for acquiring an image of the suction surface S of the target component (step S47). Specifically, the nozzle selection processing unit 22 drives the feeder 14a for supplying the target component, positions the component at the component pickup position, and drives the head unit 16 to position the 2 nd imaging unit 182 above the component pickup position of the feeder 14 a. Accordingly, the 1 st imaging unit 181 acquires an image of the element including the surface S to be suctioned. Then, it is determined whether or not the suction surface S can be recognized in the acquired image (step S49), and if no, the display control unit 25 controls the display unit 4 so that the image of the element acquired in step S47 is displayed together with the information for requesting the determination of the suction surface S (step S51). In this case, the operator can specify the suction surface S by operating the operation unit 5, and the nozzle selection processing unit 22 waits for an instruction input to specify the suction surface S, and if the instruction input is present (yes in step S53), the process proceeds to step S37. The suction surface S can be specified by drawing the outline of the portion corresponding to the suction surface S on the image by the operator operating a tool displayed on the screen, as in the case of the suction nozzle opening 162 a.

If the determination of step S49 and step S53 is yes, the nozzle selection processing unit 22 shifts the process to step S37, reads the data of the suction surface S from the mounting data D2, or calculates the size and area of the suction surface S based on the image of the suction surface S identified in step S49 or the image of the suction surface S determined in step S53.

Returning to fig. 5, next, the nozzle selection processing unit 22 determines whether or not the nozzle 161 satisfying a predetermined selected condition is present in relation to the target component based on the size and area of the nozzle opening 162a acquired in step S33 and the size and area of the surface S to be suctioned of the component acquired in step S37 (step S3).

Fig. 7 is a schematic view for explaining the selected condition, schematically showing the component T and the suction surface 162 of the suction nozzle 161 sucking the sucked surface S. More specifically, the suction nozzles 161 (mounting heads 160) disposed at predetermined positions in the rotational direction (positions in the R direction) are schematically shown in a state of being attracted to the attracted surfaces S of the components T disposed at the component supply positions of the feeders 14a (tape feeders).

The element T is a rectangular parallelepiped element having a length Sx in the X direction and a length Sy in the Y direction in a plan view. Therefore, the entire upper surface of the element T is the adsorbed surface S. The suction nozzle 161 has an X-shaped suction nozzle opening 162a at the center of the suction surface 162 having a rectangular shape in plan view. The suction nozzle opening 162a has a dimension Ax1 in the X direction and a dimension Ay in the Y direction.

Here, the above-described selected conditions are defined by the following equations 1 to 3, assuming that the amount of displacement of the suction nozzle 161 in the X direction and the amount of displacement in the Y direction allowed during the component suction process are Mx, that the area of the suction nozzle opening 162a of the suction nozzle 161 is Ar1, that of the suction surface S of the component T is Ar2, and that the threshold values set in advance are T1 and T2 (T1 > T2).

Sx > (Ax+Mx) (formula 1)

Sy > (Ay+My) (formula 2)

T1 > (Ar 1/Ar 2) > T2 (formula 3)

The conditions (condition 1) under which the entire suction nozzle opening 162a overlaps the suction surface S of the component when the component is suctioned are defined in equations 1 and 2. By satisfying the condition 1, it can be said that the suction nozzle 161 can cause the negative pressure supplied through the suction nozzle opening 162a to act on the suction surface S without fail.

Further, the condition (condition 2) that the ratio of the area of the suction nozzle opening 162a to the area of the surface S to be suctioned of the component is within a predetermined range is defined in the formula 3. As long as condition 1 is satisfied, the size (area) of the suction nozzle opening 162a is preferably as large as possible with respect to the suction surface S. However, if the suction nozzle opening 162a is too large relative to the surface S to be suctioned, depending on the type of component, it takes time to release the suction state of the component, which may adversely affect the release of the component, whereas if it is too small, the suction holding stability of the suction nozzle 161 against the component may be lowered. That is, by satisfying the condition 3, the suction nozzle 161 can equalize the suction holding stability of the component and the release stability of the component at the time of releasing the suction holding.

In the process of step S3, the nozzle selection processing unit 22 determines whether or not each nozzle 161 satisfies the selected condition (condition 1, condition 2). In the case of no, the display control unit 25 controls the display unit 4 so as to display an error display indicating that the specification of the suction nozzle 161 is not satisfied (step S13). Whereby the control of the present flowchart ends.

On the other hand, if there is a nozzle 161 satisfying the conditions 1 and 2 (yes in step S3), the nozzle selection processing unit 22 selects the nozzle 161. In this case, the display control unit 25 controls the display unit 4 so as to display the selection screen G1 of the suction nozzle 161. The selection screen G1 is a screen in which the nozzle 161 selected in the processing of step S3 is presented to the operator as a final selection candidate, and the operator is requested to determine whether or not to register the nozzle 161 as the nozzle 161 corresponding to the target component in the nozzle matching information D23. The selection screen G1 is displayed regardless of the number of the nozzles 161 (i.e., the nozzles 161 satisfying the conditions 1 and 2) selected in the process of step S3.

For example, fig. 8 shows an example of the selection screen G1. The drawing schematically shows the selection screen G1 in the case where the number of the suction nozzles 161 selected in the process of step S3 is plural (3). The selection screen G1 includes a candidate nozzle image G11 representing the nozzle 161 as a selected candidate and a selection request image G12. The candidate nozzle image G11 is an image showing each nozzle 161 selected in the process of step S3, and the candidate nozzle image G11 includes, for example, a front image G11a and a suction surface image G11b of the nozzle 161. The selection request image G12 is an image of a character string requesting to select (designate) one of the nozzles 161 (candidate nozzle images G11) displayed on the selection screen G1. The operator can select one of the candidate nozzle images G11 displayed on the selection screen G1 by operating the operation unit 5.

Although not shown, when the number of nozzles 161 selected in the process of step S3 is one, a selection screen G1 including one candidate nozzle image G11 indicating the nozzle 161 and the selection request image G12 is displayed as the selection screen G1.

The nozzle selection processing unit 22 waits for the operator to input a selection instruction by operating the operation unit 5, and if there is an input (yes in step S7), determines whether or not the selected nozzle 161 has a usage performance (step S9). Specifically, the nozzle selection processing unit 22 refers to the nozzle matching information D23 of the mounting data D2, and refers to the past management data DM accumulated and stored in the management device 110 via the communication unit 3. And, judge: whether the nozzle 161 selected in the process of step S7 is registered in the nozzle matching information D23 in terms of the relationship with the target component; or whether the suction nozzle 161 is used for the past component mounting process of the target component and the component adsorbing process is normally ended.

If yes in step S9, the nozzle selection processing unit 22 updates the mounting data D2 (step S11). That is, the nozzle selection processing unit 22 registers the nozzle 161 selected in the processing of step S7 as the nozzle 161 corresponding to the target component in the nozzle matching information D23. Accordingly, the control of the present flowchart ends.

On the other hand, when it is determined that the selected nozzle 161 is not in use (no in step S9), the nozzle selection processing unit 22 shifts the process to step S15, and the mounting control unit 21 controls the apparatus main body 1 to execute the component suction test (step S15). The component suction test is a test in which the head unit 16 and the mounting head 160 are driven based on drive control parameters for a predetermined test, the component suction process of the target component is actually performed using the suction nozzle 161 selected in step S7, and the component photographing process is performed by the 1 st photographing section 181. The nozzle selection processing section 22 acquires the data of the degree of suction of the component by the component suction test, acquires the image of the component sucked and held by the nozzle 161, and determines whether or not a specified requirement condition is satisfied (step S17). Specifically, the nozzle selection processing unit 22 determines whether or not the suction degree is within a predetermined range, and whether or not the posture of the component sucked and held by the nozzle 161, the amount of displacement of the suction position, and the like are within an allowable range. If yes, the nozzle selection processing unit 22 shifts the process to step S11, and updates the mounting data D2. In the case where "yes" is performed in step S17, the display control unit 25 may control the display unit 4 so that the information that satisfies the above-described requirement is displayed together with the specific adsorption degree and the value of the displacement of the adsorption position.

On the other hand, when it is determined that at least one of the conditions is not satisfied in the processing of step S17 (no in step S17), the display control unit 25 controls the display unit 4 so as to display information (display mismatch) indicating that the selected nozzle 161 is not suitable and recommending the selection of another nozzle 161 together with the specific determination result (step S19).

Then, the nozzle selection processing unit 22 determines whether or not there are any candidate nozzles 161 other than the nozzle 161 selected in step S7 (step S21), and if yes, returns the processing to step S5. On the other hand, when it is determined that there is no candidate suction nozzle 161 outside this (no in step S21), the process proceeds to step S13.

[ Component mounting Process ]

Next, control of the element mounting process will be described with reference to fig. 9. Fig. 9 is a flowchart showing control of the component mounting process performed by the control unit 2 (mainly, the mounting control unit 21).

The component mounting process is performed by the mounting control unit 21 controlling each unit of the apparatus main body 1 based on the board data D1 and referring to the mounting data D2.

The mounting control section 21 first selects the suction nozzle 161 used in the component mounting process, and causes the suction nozzle 161 to be mounted from the suction nozzle support frame 6 to each mounting head 160 of the head unit 16 (step S41). In this case, the mounting control section 21 selects the suction nozzle 161 based on the component registered in the mounting component information D12 and referring to the suction nozzle matching information D23. Therefore, the suction nozzles 161 satisfying the 1 st and 2 nd conditions of the suction nozzle selection process are mounted on the respective mounting heads 160.

Next, the mounting control section 21 determines whether or not there are a plurality of the same kind of nozzles 161, that is, the nozzles 161 having the same kind of information, among the nozzles 161 mounted to the mounting head 160 (step S42). If yes, the mounting control unit 21 selects one mounting head 160 from the plurality of mounting heads 160 of the same type (step S43). Specifically, the mounting control unit 21 calculates the time required for the component mounting process of the component based on the positions of the plurality of mounting heads 160 mounted on the same type of suction nozzles 161 in the head unit 16, the arrangement information D25, and the target mounting positions (X, Y, R) of the component registered in the mounting component information D12, and selects the mounting head 160 having the shortest time (step S43).

When the process of selecting the mounting head 160 is completed, the mounting control unit 21 executes the component mounting process by controlling each unit of the apparatus main body 1 based on the mounting component information D12. In this case, the mounting control unit 21 controls the apparatus main body 1 so that the component mounting process is performed by the suction nozzle 161 selected in step S43 for the component suctioned by the suction nozzle 161 of the same type.

In the case where there are no plurality of mounting heads 160 to which the same type of suction nozzles 161 are mounted in the process of step S42, the mounting control unit 21 skips the processes of steps S42 and S43, and shifts the process to step S45.

[ Effect and the like ]

According to the above-described component mounting system 100, the following operational effects can be obtained, namely: according to the above-described component mounting system 100, before the kind of the substrate P (component mounting substrate) is changed and the production thereof is started, the selection process of the suction nozzles 161 is performed automatically or based on the operation of the operation section 5 by the operator (fig. 5 and 6). As described above, the nozzle selection process is a process of selecting the type of nozzle 161 suitable for the component mounting process of the component in relation to the component.

In this selection process, the nozzle selection process section 22 selects the type of nozzle 161 suitable for the component mounting process of the target component based on whether or not the 1 st condition (expression 1, expression 2) and the 2 nd condition (expression 3) are satisfied based on the component information D21 and the nozzle information D22 (step S3 in fig. 5). Therefore, the operator does not need to rely on his own experience and intuition to select the suction nozzle 161 appropriate for the type of component, and the selection operation of the suction nozzle 161 is automated. In addition, the difference of the kinds of the selected suction nozzles caused by different operators is also restrained.

In this case, when the information of the suction nozzle 161 does not exist in the mounting data D2 (suction nozzle information D22) stored in the storage device 23 (no in step S31 in fig. 6), the 1 st imaging unit 181 performs a process of imaging the suction surface 162 of the suction nozzle 161 (step S39). When the information of the target element does not exist in the mounting data D2 (element information D21) (no in step S35), the 2 nd imaging unit 182 executes the element imaging process of the element (step S47). Then, based on the images obtained by these processes, the size and area of the nozzle opening 162a and the size and area of the surface S to be suctioned of the target component are obtained, and it is determined whether or not the 1 st condition and the 2 nd condition are satisfied. Therefore, even in the case of adding a new nozzle 161 or using a new component that is not used, for example, the nozzle selection process can be performed without any problem. That is, it can be said that high performance of the nozzle selection process is ensured.

When the suction nozzle opening 162a cannot be recognized from the image of the suction surface 162 of the suction nozzle 161, a screen for requesting the determination of the suction nozzle opening 162a is displayed on the display unit 4 (step S43). Similarly, when the suction surface S cannot be recognized from the image of the element, a screen for requesting the determination of the suction surface S is displayed on the display unit 4 (step S51). In contrast, the operator can identify the suction nozzle opening 162a and the suction surface S by operating the operation unit 5 (steps S43 and S45). In this case, the size and the area are obtained based on the image of the suction nozzle opening 162a and the image of the suction surface S specified by the operator, and then it is determined whether or not the 1 st condition and the 2 nd condition are satisfied. Therefore, high performance of the nozzle selection process is also ensured in this regard.

In the nozzle selection process, if there are a plurality of nozzles 161 satisfying the conditions 1 and 2, the selection request image G12 is displayed on the display unit 4 together with the candidate nozzle image G11 indicating the nozzle 161 of the selected candidate (step S5). In this case, the operator can select any one of the suction nozzles 161 by operating the operation section 5 (step S7). Thus, the degree of freedom in the selection of the suction nozzle by the operator is ensured. In addition, it can be said that strictly speaking this also means that the suction nozzles selected differ from one operator to another. However, the plurality of candidate nozzles 161 satisfy the conditions 1 and 2, and are the nozzles 161 suitable for the target component in relation to the component. Therefore, the problem of the conventional nozzle variation can be eliminated without affecting the production efficiency of the component mounting substrate due to the variation.

In addition, when the nozzle 161 selected by the operator is not used (no in step S9), the component suction test is performed in which the component suction process and the image acquisition process are actually performed using the selected nozzle 161 (step S15). Then, if the suction nozzle 161 selected by the operator is not suitable in relation to the component, the content is displayed on the display unit 4 (step S19). I.e. the operator can verify whether the selected suction nozzle is suitable. Therefore, the reliability of the suction nozzle 161 finally registered in the suction nozzle matching information D23 improves.

In the component mounting system 100, the nozzle 161 selected by the selection process is registered in the nozzle matching information D23, and the mounting control section 21 executes the component mounting process based on the nozzle matching information D23. Therefore, it is possible to reduce the occurrence of component suction errors and the like due to the use of the nozzle holder 6 which is unsuitable in relation to the component. In this case, when the same type of suction nozzles 161 used for the component mounting process of the specific component are mounted on the plurality of mounting heads 160 of the head unit 16, the shortest mounting head 160 necessary for the component mounting process of the specific component is selected (step S43). Then, the selected mounting head 160 performs a component mounting process on the specific component. Therefore, according to the component mounting system 100 described above, the component mounting process of the mounting head 160 can be performed more efficiently while maintaining the stability of the component suction process of the suction nozzle 161.

[ Modification examples and the like ]

The component mounting apparatus 100 described above is an example of a preferred embodiment of the component mounting apparatus according to the present invention, and the specific configuration may be appropriately changed within a range not departing from the gist of the present invention. For example, the following configurations of (1) to (6) or the configurations in which the configurations of (1) to (6) are combined with each other are also within the scope of the present invention.

(1) As the control of the nozzle selection process, the control shown in the flowchart of fig. 10 may also be applied. The processing of the control setting steps S8a to 8C (the processing of the portion surrounded by the broken line) shown in the flowchart of fig. 10 is substituted for the processing of step S9 of fig. 5, and the processing of steps S15 to S21 is omitted. The processing contents of the other steps are basically the same as those of the flowchart of fig. 5.

In the control shown in the flowchart of fig. 10, if one nozzle 161 is selected from the plurality of candidate nozzles 161 (yes in step S7), the nozzle selection processing section 22 determines whether or not the selected nozzle 161 is a predetermined nozzle (step S8 a). That is, the nozzle selection processing section 22 refers to the nozzle matching information D23, and determines whether or not the selected nozzle 161 has been registered in the nozzle matching information D23 as the nozzle 161 corresponding to the target component. If no in the process of step S8a, the display control unit 25 controls the display unit 4 so as to display a screen for requesting reconsideration of the set parameter value of the drive system, that is, so as to display a screen for requesting reconsideration of the parameter value registered in the control parameter information D24 of the installation data D2 (step S8 b). If the operator operates the operation unit 5 to change the parameter value or maintain the predetermined parameter value (yes in step S8 c), the nozzle selection processing unit 22 updates the mounting data D2 (step S11). Specifically, the nozzle selection processing unit 22 rewrites the nozzle 161 registered in the nozzle matching information D23 to the nozzle 161 selected in step S7, and rewrites the parameter value of the control parameter information D24 to the changed parameter value when the parameter value is changed according to the operation content in step S8.

If it is determined that the nozzle 161 selected in the process of step S7 is a predetermined nozzle (yes in step S8 a), the nozzle selection processing unit 22 skips the processes of steps S8a to S11 and ends the control of the nozzle selection process of the present flowchart.

According to the control of the flowchart of fig. 10, the nozzle 161 selected by the operator in the process of step S5 is finally registered in the nozzle matching information D23 as the nozzle 161 corresponding to the target component as it is. Accordingly, since the component suction test as described above is not performed, the nozzle selection process is completed rapidly accordingly. Further, since the operator is prompted to reconsider the parameter values registered in the control parameter information D24 when the selected nozzle 161 is different from the predetermined nozzle 161, for example, when the moving speed of the head unit 16 and the mounting head 160 can be increased in the combination of the target component and the selected nozzle 161, the component mounting process of the apparatus main body 1 can be further speeded up by changing the parameter values registered in the control parameter information D24. Therefore, there is an advantage of contributing to improvement in the production efficiency of the component mounting substrate in the component mounting system 100.

(2) In the embodiment, if one nozzle 161 is selected from the plurality of candidate nozzles 161 (yes in step S7 of fig. 5), the nozzle selection processing section 22 determines whether or not the selected nozzle 161 has a usage performance. However, for example, the nozzle selection processing unit 22 may register the selected nozzle 161 directly as the nozzle 161 corresponding to the target component in the nozzle matching information D23. In this case, step S9 and steps S15 to S21 of fig. 5 are omitted.

(3) In the embodiment, the component information D21 and the nozzle information D22 of the mounting data D2 are stored in the storage device 23 of the component mounting device 100, but these information D21, D22 may be stored in the management device 110, for example. In this case, the nozzle selection processing unit 22 acquires the information D21, D22 from the management device 110 as necessary. In addition, when a plurality of component mounting apparatuses are connected to form a production line of component mounting substrates, the management apparatus 110 stores management data DM output from each of the plurality of component mounting apparatuses. In this case, regarding the processing of step S9 of fig. 5 (i.e., the judgment processing of whether or not there is a usage result), the nozzle selection processing unit 22 refers to the management data DM of the component mounting device other than the host machine in addition to the management data DM of the host machine.

(4) Specifically, in the process of step S43 in fig. 9, the mounting control unit 21 selects the mounting head 160 having the shortest time required for the component mounting process among the plurality of mounting heads 160 each having the same type of suction nozzle 161 mounted thereon, in the embodiment. However, the mounting control unit 21 may determine the distance of the movement path required for the component mounting process of each mounting head 160 (head unit 16), and select the mounting head 160 having the shortest movement distance. With this configuration, as in the embodiment, the component mounting process by the mounting head 160 can be performed more efficiently while maintaining the stability of the component suction process by the suction nozzle 161.

In addition, the mounting control unit 21 may select the suction nozzle 161 having the strongest suction force in the process of step S43. With this configuration, the stability of the component suction process by the suction nozzle 161 can be ensured at a higher level. In this case, since the suction force is substantially proportional to the size of the nozzle opening 162a, for example, the size and area of the nozzle opening 162a (information on the size of the nozzle opening) may be registered in the nozzle information D22 for each of the plurality of nozzles 161 of the same type, and the mounting control unit 21 may select the mounting head 160 having the nozzle 161 with the largest area in which the nozzle opening 162a is mounted, from the plurality of mounting heads 160, by referring to the nozzle information D22.

(5) In the embodiment, the selected condition of the suction nozzle 161 of the suction nozzle selection processing section 22 (step S3 in fig. 5) is that the 1 st condition (expression 1, expression 2) and the 2 nd condition (expression 3) described above are satisfied. But additional conditions may also be set. Condition 2 of the embodiment specifies that the ratio of the area of the suction nozzle opening 162a to the area of the surface S to be suctioned of the component is within a predetermined range. However, as long as condition 1 is satisfied, the size (area) of the suction nozzle opening 162a is preferably as large as possible with respect to the suction surface S. Therefore, condition 2 may be a condition that the ratio of the area of the suction nozzle opening 162a to the area of the surface S to be suctioned of the component is equal to or greater than a threshold value. That is, the above formula (3) may be set to (Ar 1/Ar 2) > T2.

(6) In the component mounting system 100 of the embodiment, the 2 nd imaging unit 182 that images the component suctioned and held by the suction nozzle 161 from the lower side is provided as the imaging unit 18 that performs the image acquisition process of acquiring the process state image of the component suction process of the suction nozzle 161, but the 3 rd imaging unit that images the component suctioned and held by the suction nozzle 161 from the side may be provided. In this case, in the processing (element adsorption test) in steps S15 and S17 in fig. 5, the 1 st imaging unit 181 and the 3 rd imaging unit may capture the element, and determine whether or not the adsorption state of the element identified from the image is within the allowable range.

The present invention described above is summarized as follows.

A component mounting apparatus according to an aspect of the present invention includes: a mounting and executing unit including a mounting head including a suction nozzle for performing component suction processing for sucking a component supplied from a component supply area, and performing component mounting processing for mounting the component sucked by the suction nozzle on a substrate, and a photographing unit for performing image acquisition processing for acquiring a processing state image related to the component suction processing; and a nozzle selection processing unit that performs a selection process of selecting a nozzle to be used for the component mounting process of a specified component in relation to the specified component from among a plurality of nozzles, wherein the nozzle selection processing unit acquires information on a size of a nozzle opening of each of the plurality of nozzles and information on a size of a surface to be suctioned of the specified component, determines whether or not a selected condition associated with the size of the nozzle opening and the size of the surface to be suctioned is satisfied based on the information, and selects a nozzle satisfying the selected condition from among the plurality of nozzles.

According to this component mounting apparatus, the nozzle selection processing section acquires information on the size of each nozzle opening and information on the size of the surface to be suctioned of the specified component, and selects the nozzle to be used for component mounting processing of the specified component in relation to the specified component based on whether or not a selected condition relating to the size of the nozzle opening and the size of the surface to be suctioned is satisfied. Therefore, the operator does not need to rely on his experience and intuition to select the nozzle suitable for the component, and the operation of selecting the nozzle is automated. In addition, the difference of the selected suction nozzles caused by different operators is also restrained.

In the above constitution, more specifically, the selected condition includes: condition 1 in which the entire suction nozzle opening overlaps the surface to be suctioned; and a2 nd condition that the size of the nozzle opening is equal to or larger than a specified threshold, wherein the nozzle selection processing unit determines whether the 1 st condition and the 2 nd condition are satisfied, and selects a nozzle that satisfies both conditions.

According to this configuration, in the selection process performed by the nozzle selection process section, a nozzle whose ratio of the nozzle opening portion to the surface to be suctioned of the component is as large as possible, that is, a nozzle whose suction force is as large as possible can be selected. Therefore, the suction nozzle that can more reliably and stably suction and hold the component in relation to the component can be selected.

At this time, it is preferable that: the suction nozzle selection processing unit sets a position that is offset from a target suction position of the suction target surface of the specified component by a predetermined offset amount to a state in which the suction nozzle is suctioned, and determines whether or not the condition 1 is satisfied.

According to this configuration, it is determined whether or not the 1 st condition is satisfied, taking into account the amount of deviation (allowable deviation) of the suction position of the suction nozzle. Therefore, a nozzle having high reliability can be selected in accordance with the operation of the actual component mounting process of the mounting head.

The component mounting apparatus may further include: a display unit that displays information on the component mounting process; a display control unit that, when there are a plurality of candidate nozzles each satisfying the selected condition, controls the display unit so as to display information indicating each nozzle of the plurality of candidate nozzles; and an instruction input section that inputs a selection instruction for selecting one nozzle from the plurality of candidate nozzles displayed on the display section, wherein the nozzle selection processing section selects one nozzle selected based on the input of the selection instruction from the plurality of candidate nozzles.

According to this configuration, when there are a plurality of candidate nozzles each satisfying the selected condition, information indicating each nozzle of the plurality of candidate nozzles is displayed on the display unit. The operator can select one nozzle from the plurality of candidate nozzles displayed on the display unit by the instruction input unit. Thus, the degree of freedom of the selected suction nozzle is ensured. In this case, since each of the plurality of candidate nozzles satisfies the above-described selected condition, whichever nozzle is selected can be said to be a nozzle suitable for the component mounting process of the component in relation to the component.

In this case, the method may further include: and a storage unit configured to store nozzle matching information recorded in association with the component and the nozzle used for the component mounting process, wherein the display control unit is configured to control the display unit so as to display information requiring reconsideration of a parameter value for driving control of the mounting head in the component mounting process when the nozzle selected based on the input of the selection instruction is different from the predetermined nozzle stored in the storage unit.

In this configuration, when the nozzle selected by the operator is different from the predetermined nozzle registered in the nozzle matching information, information for requesting to reconsider the parameter value for driving control of the mounting head is displayed. Therefore, the parameter value for drive control is urged to be changed to a more preferable value in relation to the selected relationship between the suction nozzle and the component.

The component mounting apparatus may further include: and a storage unit configured to store nozzle matching information recorded in association with the component and the nozzle used for the component mounting process, wherein the nozzle selection processing unit controls the mounting execution unit to execute a component adsorbing test using the selected nozzle, that is, a component adsorbing test in which the mounting head is driven based on a preset parameter value for driving control, to perform the component adsorbing process and the image acquiring process, when the nozzle selected based on the input of the selection instruction is different from a predetermined nozzle recorded in the nozzle matching information, and determines whether the selected nozzle is suitable based on a result of the component adsorbing test, and the display control unit controls the display unit to display information indicating the determination result of the nozzle selection processing unit.

According to this configuration, when the nozzle selected by the operator is different from the predetermined nozzle registered in the nozzle matching information, the component suction test actually performed for the component suction process and the image acquisition process is executed, and the result thereof is displayed on the display unit. I.e. the operator can verify whether the selected suction nozzle is suitable. Thus, the operator can rely on the selected suction nozzle.

In this case, the nozzle selection processing unit may acquire the suction degree data indicating the suction degree of the nozzle to the component in the component suction test and the processing state image related to the component suction processing, and determine that the selected nozzle is appropriate when at least one of the condition that the suction degree is within a predetermined range and the condition that the suction state of the component recognized from the processing state image is within an allowable range is satisfied.

According to this configuration, it is possible to appropriately determine whether or not the selected suction nozzle is suitable in the component suction test.

In the above-described component mounting apparatus, it may be that: the imaging unit is configured to capture an image of the nozzle opening by imaging the nozzle from a distal end side in an axial direction thereof, and the nozzle selection processing unit is configured to control the mounting control unit to cause the imaging unit to capture an image of the nozzle opening of the nozzle and acquire information on a size of the nozzle opening based on an image of the nozzle opening.

According to this configuration, even when the component mounting apparatus does not have information about the size of the nozzle opening in advance, for example, when a new nozzle is added, the nozzle selection processing section can perform the selection processing. Thus, the execution performance of the selection process performed by the nozzle selection process section is ensured.

In the above-described component mounting apparatus, it may be that: when the imaging section is defined as the 1 st imaging section, the mounting execution section further includes a2 nd imaging section movable together with the mounting head section to image the component arranged in the component supply area, and the nozzle selection processing section causes the 2 nd imaging section to image the component arranged in the component supply area by controlling the mounting control section, and acquires information on the size of the sucked surface based on the image of the component.

According to this configuration, even when the component mounting apparatus does not have information on the size of the surface to be suctioned of the component in advance, for example, when a new component is used, the nozzle selection processing section can perform the selection processing. Thus, the execution performance of the selection process performed by the nozzle selection process section is ensured.

In the above-described component mounting apparatus, it is preferable that the apparatus further includes: a storage unit configured to store nozzle matching information which is recorded in association with the component and the nozzle used for the component mounting process and which is selected by the nozzle selection process unit through the selection process; and a mounting control unit that controls the mounting execution unit so that the component mounting process of the component is performed using the suction nozzle recorded in the suction nozzle matching information, based on the component.

According to this configuration, the component mounting process is performed on the basis of the component using the nozzle recorded in the nozzle matching information. Therefore, errors in component suction processing and the like due to the use of a suction nozzle unsuitable in relation to the component can be reduced.

In this case, it is preferable that: the component mounting unit includes a head unit including a plurality of mounting heads and being movable between the component supply area and the substrate, and the mounting control unit includes a plurality of mounting heads each including a nozzle recorded in the nozzle matching information as a nozzle corresponding to a specific component in relation to the specific component, and when the plurality of mounting heads are provided in the head unit, the mounting control unit obtains a distance of a movement path of each of the mounting heads in the component mounting process of the specific component, and controls the mounting execution unit so that the component mounting process of the specific component is performed using a mounting head having a shortest distance of the movement path.

With this configuration, the component mounting process can be efficiently performed while maintaining the stability of the component suction process of the suction nozzle.

In the above component mounting apparatus, the component mounting apparatus may be: the component mounting unit includes a head unit including a plurality of mounting heads and being movable between the component supply area and the substrate, and the mounting control unit includes a plurality of mounting heads each including a nozzle recorded in the nozzle matching information as a nozzle corresponding to a specific component in relation to the specific component, and when the mounting control unit determines a processing time of each of the mounting heads required for a component mounting process of the specific component, and controls the mounting execution unit so that the component mounting process of the specific component is performed using the mounting head having the shortest processing time.

In the above component mounting apparatus, the component mounting apparatus may be: the component mounting unit includes a head unit including a plurality of mounting heads and movable between the component supply area and the substrate, and the mounting control unit acquires information on the suction force of each of the plurality of mounting heads when the plurality of mounting heads including a nozzle recorded in the nozzle matching information as a nozzle corresponding to a specific component in relation to the specific component are present in the head unit, and controls the mounting execution unit so that the component mounting process of the component is performed using the nozzle having the strongest suction force.

According to this configuration, the component mounting process can be performed while maintaining the stability of the component suction process of the suction nozzle at a higher level.

Claims

1. A component mounting apparatus characterized by comprising:

A mounting and executing unit including a mounting head including a suction nozzle for performing component suction processing for sucking a component supplied from a component supply area, and performing component mounting processing for mounting the component sucked by the suction nozzle on a substrate, and a photographing unit for performing image acquisition processing for acquiring a processing state image related to the component suction processing; and

A nozzle selection processing unit that performs a selection process of selecting a nozzle to be used for the component mounting process of a specified component in relation to the specified component from a plurality of nozzles,

The suction nozzle selection processing section acquires information on the size of the suction nozzle opening of each of the plurality of suction nozzles and information on the size of the suction surface of the specified component, determines whether or not a selected condition associated with the size of the suction nozzle opening and the size of the suction surface is satisfied based on the information, and selects a suction nozzle satisfying the selected condition from the plurality of suction nozzles.

2. The component mounting apparatus according to claim 1, wherein,

The selected conditions include: condition 1 in which the entire suction nozzle opening overlaps the surface to be suctioned; and condition 2 that the size of the nozzle opening is equal to or greater than a predetermined threshold value,

The nozzle selection processing unit determines whether or not the 1 st condition and the 2 nd condition are satisfied, and selects a nozzle satisfying both conditions.

3. The component mounting apparatus according to claim 2, wherein,

The suction nozzle selection processing unit sets a position that is offset from a target suction position of the suction target surface of the specified component by a predetermined offset amount to a state in which the suction nozzle is suctioned, and determines whether or not the condition 1 is satisfied.

4. A component mounting apparatus according to any one of claims 1 to 3, further comprising:

A display unit that displays information on the component mounting process;

A display control unit that, when there are a plurality of candidate nozzles each satisfying the selected condition, controls the display unit so as to display information indicating each nozzle of the plurality of candidate nozzles; and

A command input unit for inputting a selection command for selecting one nozzle from the plurality of candidate nozzles displayed on the display unit,

The nozzle selection processing section selects one of the plurality of candidate nozzles that is selected based on the input of the selection instruction.

5. The component mounting apparatus according to claim 4, further comprising:

a storage unit for storing nozzle matching information recorded in association with the component and the nozzle used for the component mounting process of the component,

The display control unit controls the display unit to display information that requires reconsideration of a parameter value for drive control of the mounting head in the component mounting process when the nozzle selected based on the input of the selection command is different from the predetermined nozzle stored in the storage unit.

6. The component mounting apparatus according to claim 4, further comprising:

The nozzle selection processing unit controls the mounting execution unit to execute a component suction test using the selected nozzle, that is, a component suction test in which the mounting head is driven based on a preset parameter value for drive control to perform the component suction process and the image acquisition process, when the nozzle selected based on the input of the selection instruction is different from the predetermined nozzle recorded in the nozzle matching information, and determines whether the selected nozzle is suitable based on the result of the component suction test,

The display control unit controls the display unit so as to display information indicating the determination result of the nozzle selection processing unit.

7. The component mounting apparatus according to claim 6, wherein,

The nozzle selection processing unit acquires the suction degree data indicating the suction degree of the nozzle to the component in the component suction test and the processing state image related to the component suction processing, and determines that the selected nozzle is appropriate when at least one of a condition that the suction degree is within a predetermined range and a condition that the suction state of the component identified from the processing state image is within an allowable range is satisfied.

8. The component mounting apparatus according to any one of claims 1 to 7, wherein,

The photographing part photographs the suction nozzle from the far end side along the axial direction of the suction nozzle, thereby photographing the suction nozzle opening part,

The nozzle selection processing unit causes the imaging unit to capture a nozzle opening of the nozzle by controlling the mounting control unit, and obtains information on the size of the nozzle opening based on an image of the nozzle opening.

9. The component mounting apparatus according to any one of claims 1 to 8, wherein,

When the photographing part is defined as the 1 st photographing part,

The mounting execution section further includes a2 nd photographing section movable together with the mounting head section to photograph the component arranged in the component supply area,

The nozzle selection processing unit controls the mounting control unit to cause the 2 nd imaging unit to capture an image of the component arranged in the component supply area, and acquires information on the size of the surface to be suctioned based on the image of the component.

10. The component mounting apparatus according to any one of claims 1 to 4, characterized by further comprising:

A storage unit configured to store nozzle matching information which is recorded in association with the component and the nozzle used for the component mounting process and which is selected by the nozzle selection process unit through the selection process; and

And a mounting control unit that controls the mounting execution unit so that the component mounting process of the component is performed using the nozzle recorded in the nozzle matching information, based on the component.

11. The component mounting apparatus of claim 10, wherein,

The component mounting section includes a head unit including a plurality of the mounting heads and movable between the component supply area and the substrate,

When there are a plurality of mounting heads in the head unit, each of the plurality of mounting heads having a suction nozzle corresponding to a specific component in relation to the specific component, the mounting control unit obtains a distance of a moving path of each of the mounting heads in the component mounting process of the specific component, and controls the mounting execution unit so that the component mounting process of the specific component is performed using the mounting head having the shortest distance of the moving path.

12. The component mounting apparatus of claim 10, wherein,

When there are a plurality of mounting heads in the head unit, each of the plurality of mounting heads including a nozzle corresponding to a specific component in relation to the specific component and recorded in the nozzle matching information, the mounting control unit obtains a processing time of each of the mounting heads required for component mounting processing of the specific component, and controls the mounting execution unit so that component mounting processing of the specific component is performed using the mounting head having the shortest processing time.

13. The component mounting apparatus of claim 10, wherein,

The mounting control unit acquires information on the suction force of each of the plurality of mounting heads when the plurality of mounting heads including the suction nozzle corresponding to the specific component in relation to the specific component are present in the head unit, and controls the mounting execution unit so that the component mounting process using the suction nozzle having the strongest suction force is performed.