CN117936408A - Die bonder and buffer device for die bonder - Google Patents

Die bonder and buffer device for die bonder Download PDF

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Publication number
CN117936408A
CN117936408A CN202310859945.8A CN202310859945A CN117936408A CN 117936408 A CN117936408 A CN 117936408A CN 202310859945 A CN202310859945 A CN 202310859945A CN 117936408 A CN117936408 A CN 117936408A
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CN
China
Prior art keywords
die
transfer
camera module
transfer position
bonder
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Pending
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CN202310859945.8A
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Chinese (zh)
Inventor
林文洙
金昶振
金东真
崔玹玉
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Semes Co Ltd
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Semes Co Ltd
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Publication of CN117936408A publication Critical patent/CN117936408A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

The invention discloses a die bonder and a buffer device of the die bonder. The present invention includes a rotating die table that rotates about an axis by a rotation driving unit. The rotating die table has a die support portion that supports the die. The die supporting portion is located at the first transfer position, the die inspection position, and the second transfer position in this order according to the rotation of the rotating die table. The invention also includes a die vision unit configured to capture a first side of a die that the die support portion has moved to the die inspection position and capture a second side of the die that the bonding head has picked up from the second transfer position with a single camera module.

Description

Die bonder and buffer device for die bonder
Technical Field
Embodiments of the invention relate to a die bonder for use in performing a die bonding process (die bonding process).
Background
To manufacture the semiconductor device semiconductor device, various processes, one of which is a process of assembling a package, are required. Generally, a process of assembling a package includes a dicing process (dicing process) of cutting a semiconductor wafer semiconductor wafer to individualize a plurality of dies, and a die bonding process of loading the dies obtained by the dicing process on a substrate such as a lead frame LEAD FRAME, a PCB printed circuit board, a printed circuit board, or the like. Here, the apparatus used for performing the die bonding process is a die bonder.
A die bonder as a bonding apparatus includes a die supply device and a die bonding device. The die supply device supplies a die to be mounted on the substrate to the die bonding device, which loads the die from the die supply device on the substrate. To this end, the die supply device includes a die transfer unit (DIE TRANSFER unit) that picks up and transfers the die from the pick-up position, and the die bonding device includes a bonding unit that picks up the die supplied by the die supply device to move to the bonding position and applies pressure for loading on the substrate.
The die transfer unit includes a transfer head (TRANSFER HEAD) configured to transfer the die from the pick-up position to the destination position while reciprocating between the pick-up position and the destination position by vertical and horizontal movements. In this regard, the conventional die bonder is limited in terms of shortening the time required for the die transfer step for supplying the die to the die bonding apparatus.
Visual inspection for the top or bottom of the die is performed during a series of processes that move the die from the pick-up position to the bonding position. However, such a visual inspection has been used in the conventional die bonder as a factor that complicates the transfer path of the die and delays the transfer of the die.
[ Prior Art literature ]
[ Patent literature ]
(Patent document 1) Korean patent laid-open publication No. 10-2017-0042955 (2017.04.20)
(Patent document 2) Korean patent laid-open publication No. 10-2019-0019286 (2019.02.27)
(Patent document 3) Korean patent laid-open publication No. 10-2391432 (2022.04.27)
Disclosure of Invention
Embodiments of the present invention provide a die bonder that is advantageous in terms of efficiency improvement, including an increase in the speed of the die bonding process.
The technical problems to be solved are not limited thereto, and other technical problems not mentioned will be clearly understood from the following description if a person skilled in the art is provided.
According to an embodiment of the present invention, there may be provided a buffering device of a die bonder, including: a rotary die table rotated by the rotation driving unit and having die supporting portions arranged along an outer peripheral region around a rotation center, the die supporting portions being sequentially located at a first transfer position, a die inspection position, and a second transfer position to transfer the die; and a die vision unit photographing a first face of the die, which is moved to the die inspection position by the die supporting portion, through a first photographing path directed toward, and photographing a second face of the die, which is picked up from the second transfer position by the bonding unit, through a second photographing path passing through an inside of the rotating die table.
The rotary die table may have a hollow region surrounded by the outer peripheral region, and through portions communicating with the hollow region may be provided between the die supporting portions, respectively.
It may be that the first photographing path is provided to directly photograph the first face of the die transferred to the die inspection position, and the second photographing path is provided to photograph the second face of the die picked up from the second transfer position using the hollow region and the through portion.
The die vision unit may include a first camera module and a second camera module configured to face the die inspection position around the rotating die table, the first photographing path directly incident an image on the first face of the die transferred to the die inspection position on the first camera module, the die vision unit further including: and a mirror module for reflecting an image on the second side of the die picked up from the second transfer position to the second camera module in the hollow region, the second photographing path reflecting the image on the second side to the second camera module according to the position of the through portion.
The die vision unit may further include: and a position adjustment module that moves the mirror module in a direction parallel to the die picked up from the second transfer position to adjust a position of the mirror module with respect to the die picked up from the second transfer position. The second photographing path using the mirror module may be a right angle.
The die supporting portion and the penetrating portion may be disposed at the same arrangement angle along the outer peripheral region, the rotation driving unit may rotate the rotating die table by the arrangement angle unit to move the die supporting portion by the arrangement angle unit, and the die supporting portion whose first transfer position, die inspection position, and second transfer position are set to be moved by the arrangement angle unit may be sequentially present. The die supporting portion may have three or more die supporting portions.
The rotating die table may be configured to rotate the die table by including: a rotation shaft providing the rotation center; a rotating member provided on the rotating shaft; a support member extending from the rotation member in a longitudinal direction of the rotation shaft and disposed at intervals along a periphery of the rotation center to form the outer peripheral region; and die stages provided at front end portions of each of the support members and respectively having the die support portions, the die support portions being arranged along the outer peripheral region, having the hollow region surrounded by the outer peripheral region, each of spaces formed between the die stages being the through portion.
The rotating die table may be configured such that the die supporting portion supports the die by suction. Each of the die supporting portions may be formed to have a receiving groove aligned with the die.
According to an embodiment of the present invention, there may be provided a buffering device of a die bonder, including: a rotary die table rotated by the rotation driving unit and having die supporting portions arranged along an outer peripheral region around a rotation center, the die supporting portions being sequentially located at a first transfer position, a die inspection position, and a second transfer position to transfer the die; and a die vision unit that photographs a first face of the die that is moved to the die inspection position by the die supporting portions through a first photographing path that is directed toward, photographs a second face of the die that is picked up from the second transfer position by a bonding unit through a second photographing path that passes through an inside of the rotary die table, the rotary die table having hollow regions surrounded by the peripheral regions, through portions that are respectively provided between the die supporting portions in communication with the hollow regions, the first photographing path being provided to photograph the first face of the die that is moved to the die inspection position directly, the second photographing path being provided to photograph the second face of the die that is picked up from the second transfer position by the hollow regions and the through portions, the die vision unit including a single camera module configured to direct toward the die inspection position around the rotary die table, the first photographing path providing a first face of the die that is directed toward the die inspection position, the camera module further including: and a mirror module for reflecting an image on the second side of the die picked up from the second transfer position to the camera module in the hollow region, the second photographing path reflecting the image on the second side to the camera module according to the position of the through portion. At this time, it may be that a single camera module is capable of converting a focal point to a first focal point for photographing the first side of the die transferred to the die inspection position or a second focal point for photographing the second side of the die picked up from the second transfer position.
According to an embodiment of the present invention, there may be provided a buffering device of a die bonder, including: a rotary die table rotated by a rotation driving unit, having die supporting portions arranged along an outer peripheral region around a rotation center, the die supporting portions being located at a first transfer position, a die inspection position, and a second transfer position in order to transfer the die; and a die vision unit that photographs a first surface of the die that is transferred to the die inspection position by the die supporting portion through a first photographing path that is directed toward, photographs a second surface of the die that is picked up from the second transfer position by the bonding unit through a second photographing path that passes through an inside of the rotary die table, the rotary die table having a hollow region surrounded by the outer peripheral region, through portions that are respectively provided between the die supporting portions and that communicate with the hollow region, the first photographing path being provided to directly photograph the first surface of the die that is transferred to the die inspection position, the second photographing path being provided to photograph the second surface of the die that is picked up from the second transfer position by the bonding unit, the through portions being provided to be opposed to each other with the rotation center as a center, the die inspection position being provided to be opposed to the second transfer position, the vision unit including a first camera module that is provided to directly photograph the first surface of the die that is transferred to the die inspection position, and a second camera module that is provided to the second camera module that is disposed to the second surface of the die at the second transfer position, and the through-camera module that is directed toward the second surface of the die. At this time, the die vision unit may further include: and the position adjusting module is used for enabling the first camera module and the second camera module to move in a direction parallel to the die to be photographed.
According to an embodiment of the present invention, there may be provided a die bonder including: a die transfer unit that moves the die from the pick-up position to a first transfer position; a bonding unit picking up the die from the second transfer position and loading the die on a substrate; and a buffer device between the die transfer unit and the bonding unit, the buffer device comprising: a rotary die table rotated by a rotation driving unit, having die supporting portions arranged along an outer peripheral region around a rotation center, the die supporting portions being sequentially located at the first transfer position, a die inspection position, and the second transfer position to transfer the die; and a die vision unit photographing a first face of the die, which is moved to the die inspection position by the die supporting portion, through a first photographing path directed toward, and photographing a second face of the die, which is picked up from the second transfer position by the bonding unit, through a second photographing path passing through an inside of the rotating die table.
In the die bonder according to the embodiment of the invention, the rotary die table may have a hollow region surrounded by the outer peripheral region, and through portions communicating with the hollow region may be provided between the die supporting portions, respectively.
In the die bonder according to the embodiment of the invention, it may be that the first photographing path is provided to directly photograph the first face of the die transferred to the die inspection position, and the second photographing path is provided to photograph the second face of the die picked up from the second transfer position using the hollow area and the through portion.
In the die bonder according to an embodiment of the present invention, it may be that the rotation center of the rotating die table is configured in a horizontal direction, the die transfer unit includes: a transfer head that transfers the die at the pick-up position or the first transfer position in accordance with a swinging motion centered on a horizontal axis parallel to the rotation center; and a swing driving module for providing power for the swing motion to the transfer head.
According to an embodiment of the present invention, there may be provided a die bonder including: a wafer stage for supporting a wafer with a die; a wafer stage drive unit that moves the wafer stage in a horizontal direction to selectively position the die in a pick-up position; a die transfer unit that moves the die from the pick-up position to a first transfer position; a buffer device that receives the die from the first transfer position and transfers the die to a second transfer position; and a bonding unit that picks up the die from the second transfer position and loads the die on a substrate; the buffer device includes: a rotary die table having an outer peripheral region around a horizontal axis and a hollow region surrounded by the outer peripheral region, die supporting portions arranged along the outer peripheral region and penetrating portions provided between the die supporting portions so as to communicate with the hollow region, respectively, being arranged at the same arrangement angle, the rotary die table being rotated about the horizontal axis in units of the arrangement angle, the die supporting portions and the penetrating portions being located in the first conveyance position, the die inspection position, and the second conveyance position in this order; a rotation driving unit that rotates the rotating die table by the unit of the arrangement angle; a die vision unit including a first camera module that photographs a first face of the die that is moved to the die inspection position by the die supporting portion through a first photographing path, and a second camera module that photographs a second face of the die that is picked up from the second transfer position by the bonding unit through a second photographing path, the first camera module and the second camera module being configured to face the die inspection position around the rotating die table, the first photographing path directly impinging an image of the first face of the die that is moved to the die inspection position on the first camera module, the die vision unit further comprising: and a mirror module for reflecting an image on the second side of the die picked up from the second transfer position to the second camera module in the hollow region, the second photographing path reflecting the image on the second side to the second camera module according to the position of the through portion.
The means for solving the technical problems will be more specifically and clearly understood by the embodiments, drawings, and the like described below. In addition, various solutions other than the solutions mentioned below may be additionally proposed.
According to the embodiment of the present invention, an ascending die transfer speed can be secured, and inspection can be performed with a simple structure for the upper and lower surfaces of the die without a transfer delay of the die, by which a throughput per unit hour (UPH) can be greatly improved.
According to the embodiments of the present invention, it is possible to provide a buffer device including a rotating die table that is lightweight while being compact and simple in structure and easy to manufacture.
The effects of the invention are not limited thereto, and other effects not mentioned will be clearly understood from the present specification and the attached drawings by those skilled in the art.
Drawings
Fig. 1 is a plan view conceptually showing a die bonder according to a first embodiment of the present invention.
Fig. 2 to 8 are schematic diagrams showing a structure of supplying a die to a die bonding apparatus and an operation thereof in a die bonding machine according to a first embodiment of the present invention.
Fig. 9 and 10 are a plan view and a partial sectional view seen in the B direction, respectively, showing a rotating die table of a die bonder according to a first embodiment of the present invention.
Fig. 11 is a perspective view showing the die table shown in fig. 9 and the like.
Fig. 12 is a schematic diagram showing a part of a die bonder according to a second embodiment of the present invention.
Fig. 13 is a schematic diagram showing a part of a die bonder according to a third embodiment of the present invention.
(Description of the reference numerals)
10: Wafer with a plurality of wafers
20: Bare chip
30: Substrate board
110: Wafer table
120: Bare chip ejector
130: Die transfer unit
210: Bonding unit
300: Buffer device
301: Peripheral region
302: Hollow region
303: Through part
310: Rotary shaft
320: Rotary driving module
330: Rotary frame
340: Bare chip table
341: Die support portion
350: Bare chip vision unit
351: First camera module
352: Second camera module
353: Mirror module
P21: first delivery position
P22: second transfer position
P23: die inspection position
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that a person having ordinary knowledge in the art to which the present invention pertains can easily perform the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In describing the embodiments of the present invention, in the case where a specific description of related known functions or structures is determined to be capable of unnecessarily obscuring the gist of the present invention, the specific description thereof will be omitted, and portions that serve similar functions and roles will be given the same reference numerals throughout the drawings.
At least some of the terms used in the specification are defined in consideration of functions in the specification, and thus may be changed according to users, user intention, practices, and the like. Because of this, the terminology used should be interpreted based on what is done throughout the description. In addition, in the specification, when a description is given that a certain constituent element is included, unless specifically stated to the contrary, this does not exclude other constituent elements, meaning that other constituent elements may be included. In addition, when a certain portion is said to be connected (or joined) with another portion, this includes not only the case of direct connection (or joining) but also the case of indirect connection (or joining) via another portion.
On the other hand, the size or shape of the constituent elements, the thickness of the lines, and the like in the drawings may be slightly exaggerated for the convenience of understanding.
The die bonder according to embodiments of the present invention may be used in a die bonding process to load a die on a substrate such as a leadframe, PCB, or the like. Here, the die mounted on the substrate may be respectively assigned a rank according to the operation performance or the like. In addition, these die may be mounted on the bonding region on the substrate, or may be mounted on other die already mounted on the substrate.
The structure, operation, etc. of a die bonder according to a first embodiment of the present invention are shown in fig. 1 to 11.
Referring to fig. 1, a die bonder according to a first embodiment of the present invention includes: a die supply device 100 for supplying dies 20 to be loaded on a substrate 30; die bonding apparatus 200 loads die 20 onto substrate 30 (i.e., selectively onto a bonding region on the substrate or onto other dies already loaded onto the substrate); a buffer device 300 disposed between the die supply device 100 and the die bonding device 200; and a control unit (not shown) for controlling operations of such die supply apparatus 100, die bonding apparatus 200, and buffer apparatus 300.
Referring to fig. 1,2, and the like, the die 20 may be moved from the pick-up position P1 to the bonding position P3 via the first transfer position P21, the die inspection position P23, and the second transfer position P22 in this order. The die supply apparatus 100 may transfer the die 20 from the pick-up position P1 to the first transfer position P21, and the die bonding apparatus 200 may transfer the die 20 from the second transfer position P22 to the bonding position P3. The buffer device 300 may move the die 20 from the first transfer position P21 to the second transfer position P22 via the die inspection position P23. The buffer device 300 may receive the transfer of the die 20 from the die supply device 100 at the first transfer position P21 and transfer to the die bonding device 200 at the second transfer position P22.
In this way, the multi-stage system in which the die 20 is transferred from the pick-up position P1 to the transfer positions P21, P22 and from the transfer positions P21, P22 to the bonding position P3 can ensure the ascending productivity, as compared with the direct system in which the die 20 is directly transferred from the pick-up position P1 to the bonding position P3. As the die 20 becomes thinner or larger, the time required to supply the die 20 (die pickup time using the die ejector 120 and the transfer head 131 described later) increases, so that the die supply operation speed can be greatly slowed down as compared to the die loading operation speed. The multi-stage transfer of the die 20 can prevent the reduction of productivity even in such an environment.
Referring to fig. 2 and the like, the die supply apparatus 100 includes: a wafer table 110 supporting the wafer 10; a wafer stage driving unit (not shown) that moves the wafer stage 110 in the horizontal direction (for example, X-direction and Y-direction); a die ejector 120 for selectively separating the die 20 on the wafer 10 supported by the wafer table 110 from the wafer 10; and a die transfer unit 130 that transfers the die 20 separated by the die ejector 120.
Referring to fig. 1, 2, etc., a wafer 10 includes dies 20 individualized by a dicing process performed before a die bonding process, and further includes a dicing tape 11 to which the dies 20 are attached and a wafer frame (WAFER FRAME) 12 for holding the dicing tape 11 in a ring shape. The dicing tape 11 may be held by the wafer frame 12 with an edge portion attached to the underside of the wafer frame 12. The singulated die 20 may be disposed on a central portion of the dicing tape 11.
The wafer stage 110 includes a stage base (stage base) 111 in a ring shape, a support ring (support ring) 112 standing on the stage base 111, and a wafer expander (wafer expander) 113 provided around the support ring 112. The support ring 112 is uniformly supported from below between the center portion and the edge portion of the dicing tape 11 that can be elongated. The wafer expander 113 moves the wafer frame 12 downward in the up-down direction corresponding to the vertical direction (Z direction), integrally stretches the dicing tape 11 supported by the support ring 112, and expands the space between the die 20 attached to the dicing tape 11. The effect of such a wafer expander 113 may improve the accuracy, efficiency, etc. of die separation work by the die ejector 120.
The wafer expander 113 may include frame clamps (FRAME CLAMP) that clamp or unclamp the wafer frame 12 at a plurality of positions, respectively, and a clamp lift module for moving the frame clamps in an up-down direction (Z direction). The jig elevating module may be disposed on the table base 111.
The wafer table driving unit may move the table base 111 in a horizontal direction to move the wafer table 110 to a target position. For example, the wafer stage drive unit may selectively position the die 20 on the wafer 10 supported by the wafer stage 110 at the pick-up position P1 by moving the wafer stage 110 in a horizontal direction. To this end, the die supply apparatus 100 may include a wafer vision unit (not shown) for detecting dies to be loaded on the substrate 30 among the dies 20 on the wafer 10 supported by the wafer stage 110, and the wafer stage driving unit may operate to correctly position the dies 20 to be loaded on the substrate 30 at the pick-up position P1 according to the movement of the wafer stage 110 in the horizontal direction using the detection result of the wafer vision unit.
The die ejector 120 is provided inside the wafer stage 110 and is configured to oppose the pick-up position P1 below the wafer 10 supported by the wafer stage 110. The die ejector 120 may include: a tape suction module for sucking the dicing tape 11 by vacuum; and an ejector module for pushing up the die 20 at the pick-up position P1 upward in the up-down direction by a push-up operation. In order to separate the die 20 at the pick-up position P1 from the wafer 10, the die ejector 120 pushes up the die 20 at the pick-up position P1 by the ejector module in a state where the dicing tape 11 is adsorbed to the tape adsorption module, thereby peeling the dicing tape 11 from the die 20 at the pick-up position P1.
Referring to fig. 2 to 4, the die transfer unit 130 includes a transfer head 131 for picking up the die 20 pushed up by the die ejector 120. The first transfer position P21 is located above the wafer table 110 at a height higher than the pickup position P1, spaced apart in a horizontal direction (e.g., X-direction) from the pickup position P1. The die transfer unit 130 is configured to transfer the die 20 from the pick-up position P1 to the first transfer position P21 while the transfer head 131 reciprocates between the pick-up position P1 and the first transfer position P21 by an angular swinging motion.
Specifically, the die transfer unit 130 may swing the transfer head 131 about the swing shaft 132 by further including the swing shaft 132 provided in a horizontal direction (for example, Y direction) above the pick-up position P1 and the swing driving module 133 for providing a driving force required for the swing motion to the transfer head 131. In addition, the die transfer unit 130 may further include a linear actuator 134 to move the transfer head 131 in a direction spaced apart from and approaching the swing shaft 132. For example, the transfer head 131 can be moved in the radial direction around the swing shaft 132 by the linear actuator 134.
The swing driving module 133 may include a rotating motor that rotates the swing shaft 132 in both directions. The linear actuator 134 may include a moving body that performs a linear motion, and has a first end (fixed end) provided on the swing shaft 132, and a second end (free end) that holds the moving body. The transfer head 131 may be provided at a second end (moving body) of the linear actuator 134. The transfer head 131 may pick up and hold the die 20 by suction.
In the observed die transfer unit 130, in order to transfer the die 20 from the pick-up position P1 to the first transfer position P21, the transfer head 131 located at the pick-up position P1 may pick up the die 20 on the pick-up position P1 by approaching the linear actuator 134 to the die 20 on the pick-up position P1 in a pick-up posture in which the suction front end is opposite to the pick-up position P1. At this time, the upper surface of the die 20 is sucked to the suction tip of the transfer head 131. The transfer head 131 may be lifted up by the linear actuator 134 after picking up the die 20 in order to avoid interference with the die ejector 120, and then rotated and moved to the first transfer position P21 by the swing driving module 133 so as to be located at the first transfer position P21. If the transfer head 131 is configured to transfer the die 20 from the pick-up position P1 to the first transfer position P21 by the swinging motion in this way, the transfer speed of the rising die 20 can be ensured as compared with the die transfer method of the related art using the vertical movement and the horizontal movement.
Referring to fig. 1, a wafer 10 including dies 20 singulated through a dicing process is housed in a cassette (cassette) 40. Of course, the pod 40 may be configured to accommodate a plurality of wafers 10. The die supply apparatus 100 may further include a load port (load port) 140 to load the cassette 40 and a wafer transfer unit 150 to load the wafer 10 taken out of the cassette 40 on the load port 140 on the wafer stage 110. For loading the wafer table 110 of the taken out wafer 10, the taken out wafer 10 may be moved in a horizontal direction (for example, X direction) along the wafer transfer rail 160, and the wafer table 110 may be moved toward the wafer 10 side moved along the wafer transfer rail 160 by the aforementioned wafer table driving unit (for example, Y direction).
The second conveying position P22 is higher than the first conveying position P21. The die 20 transferred from the first transfer position P21 to the second transfer position P22 is maintained in a horizontal state. Referring to fig. 1, 7, and the like, the die bonding apparatus 200 includes a bonding unit 210 that picks up the die 20 transferred to the second transfer position P22 and loads the die on the substrate 30, and a bonding stage 220 that supports the substrate 30 on the bonding position P3.
The bonding unit 210 includes a bonding head 211 that picks up the die 20 from the second transfer position P22, and a bonding head driving module for moving the bonding head 211. The bonding head driving module may be composed of a bonding head vertical driving module 212 that moves the bonding head 211 in a vertical direction and a bonding head horizontal driving module 213 that moves the bonding head 211 in a horizontal direction (for example, Y direction). The bonding head 211 of the bonding unit 210 is movable between a second transfer position P22 and a bonding position P3 spaced apart from each other in the horizontal direction (for example, the Y direction). The bonding unit 210 may move the die 20 from the second transfer position P22 to the bonding position P3 by a work of the bonding head 211 picking up the die 20 and a work of the bonding head driving module (refer to 212, 213) to move the bonding head 211 in the vertical direction and the horizontal direction, and may apply a pressure for loading the die 20 on the substrate 30 to the die 20.
The bonding head 211 may include a bonding tool (bonding tool) that picks up and holds the die 20 by suction, and a heater (heater) for heating the die 20 held by the bonding tool to a bonding temperature. The bonding head 211 may be configured to transfer heat of the heater to the die 20 through a bonding tool. The bond head vertical drive module 212 may be connected to the bond head 211 and the bond head horizontal drive module 213 may be connected to the bond head vertical drive module 212. The bonding stage 220 may heat the supported substrate 30 to a bonding temperature.
The substrate 30 is accommodated in a magazine (magazine). The substrate 30 is supplied from the first magazine 50 to the bonding position P3, and is housed in the second magazine 55 after the die 20 is loaded. The die bonding apparatus 200 may further include a substrate transfer unit 230. The substrate transfer unit 230 may transfer the substrate 30 from the first magazine 50 onto the bonding stage 220, and may transfer the substrate 30 from the bonding stage 220 to the second magazine 55. The substrate 30 can be more accurately moved along the guide of the substrate transfer rail 240 between the first magazine 50 and the second magazine 55 spaced apart from each other in the horizontal direction (for example, X-direction). The substrate transfer unit 230 may include one or more grippers (gripper) 231 that grip or release the substrate 30, and a gripper driving module 232 that moves the grippers 231 in a horizontal direction (e.g., X-direction).
Referring to fig. 2, 9, 10, etc., the buffer device 300 includes a rotating die table (refer to 310, 330, 340), a rotation driving unit 320, and a die vision unit 350. The buffer 300 may be disposed above the wafer table 110 by a mounting structure.
The rotating die table has a horizontal axis (Y direction) a parallel to the swing axis 132 as a rotation center. The rotary die table has an outer peripheral region 301 centered on the horizontal axis a and a hollow region 302 surrounded by the outer peripheral region 301, and a die supporting portion 341 and a penetrating portion 303 are provided in the outer peripheral region 301.
The outer peripheral region 301 is provided around the hollow region 302. The hollow region 302 is provided inside the outer peripheral region 301, and is constituted by an empty space. The die supporting portions 341 support the dies 20, respectively. The die supporting portions 341 are arranged along the peripheral region 301 at intervals to be spaced apart from each other. The through portions 303 are provided to communicate with the hollow regions 302 between the die supporting portions 341, respectively. The die supporting portions 341 and the penetrating portions 303 are arranged at equal intervals along the outer peripheral region 301 according to a pre-set arrangement angle (hereinafter referred to as a set angle). For example, if four die supporting portions 341 are provided, four through portions 303 are also provided, and thus the setting angle in this case is 45 degrees, and the four die supporting portions 341 and the four through portions 303 are alternately arranged at 45 degree intervals.
The rotating die table may rotate in only one direction centered on the horizontal axis a. The rotary die table is rotated by a unit of a set angle by the rotation driving unit 320. For example, if the number of die supporting portions 341 is four, and thus the number of through portions 303 is also four, the rotation driving unit 320 rotates the rotating die table in units of 45 degrees. Of course, according to such a stepwise rotation of the rotating die table, the die supporting portion 341 moves together with the through portion 303 in units of a set angle.
The die supporting portion 341 and the penetrating portion 303 can be sequentially located at the first conveying position P21 and the second conveying position P22 by a rotational movement of a set angle unit, and can be sequentially located at the die inspection position P23 in the process of moving from the first conveying position P21 to the second conveying position P22. The rotational movements of the die supporting portion 341 and the penetrating portion 303 are repeated, so that the die supporting portion 341 and the penetrating portion 303 can repeat the sequential passing process of the first conveying position P21, the die inspection position P23, and the second conveying position P22. Of course, the first transfer position P21, the die inspection position P23, and the second transfer position P22 are set to have an arrangement structure in which the die supporting portion 341 and the penetrating portion 303 can exist in order.
Such a rotary die table includes a rotary shaft 310 arranged on a horizontal axis a, a rotary member 331 provided on the rotary shaft 310, a support member 332 provided on the rotary member 331, and die tables 340 supported by the support members 332, respectively. In fig. 9, reference numeral 330 is a rotating frame, and the rotating frame 330 includes a rotating member 331 and a supporting member 332.
The rotation shaft 310 is rotated in units of a set angle by the rotation driving unit 320. The rotating member 331 may be formed to have a disk structure. The rotation driving unit 320 may be disposed at the rear (or front) of the rotation member 331, and the rotation shaft 310 may be disposed between the rotation driving unit 320 and the rotation member 331. The rotation driving unit 320 may include a rotation motor connected to the rotation shaft 310.
The support member 332 extends from the rotating member 331 in a horizontal direction (for example, Y direction) parallel to the longitudinal direction of the rotating shaft 310. The support members 332 are arranged at intervals along the circumference of the horizontal axis a so as to be spaced apart from each other to constitute the outer peripheral region 301. The support member 332 may protrude forward (or rearward) of the rotation member 331. Die tables 340 are provided at front end portions of the support members 332, respectively. The die tables 340 have die supporting portions 341, respectively. The die table 340 is arranged outside of the inside of the die supporting portion 341 toward the horizontal axis a and the opposite outside thereof.
According to such a structure of the rotary die table, it is possible to provide a rotary die table in which the die supporting portions 341 are arranged along the outer peripheral region 301, with the hollow region 302 surrounded by the outer peripheral region 301, the space formed between the die tables 340 is the through portion 303, and the die supporting portions 341 and the through portion 303 are arranged at intervals of a set angle along the outer peripheral region 301. In addition, the hollow region 302 and the through portion 303 can provide a rotary die table that is lightweight, simple in structure, and easy to manufacture.
The rotating die table is configured such that the die supporting portions 341 of the die table 340 support the dies 20 in an adsorbed manner, respectively. As shown in fig. 11, the die supporting portions 341 are formed in shapes aligned with the accommodation grooves of the die 20, respectively. The die table 340 supports the dies 20 in the accommodation grooves. As an example, the accommodating groove may be formed in a shape corresponding to the die 20 so as to be aligned with the direction of the die 20. The die table 340 is provided with one or more suction holes 342 through which the die 20 is vacuum-sucked at the bottom of each die supporting portion 341 (i.e., accommodation groove).
Referring to fig. 3, the transfer head 131 moving from the pickup position P1 to the first transfer position P21 is converted from the pickup posture to the transfer posture. The transfer head 131 may be in a vertical state (the die picked up by the transfer head is in a horizontal state) at the time of the picking up posture (refer to fig. 2), and may be in a state inclined at a predetermined angle with respect to the vertical direction (for example, a horizontal state rotated 90 degrees from the picking up posture) at the time of the transferring posture (the die picked up by the transfer head is in a vertical state). The die table 340 may receive the transfer of the die 201 from the transfer head 131 at the first transfer position P21 (refer to fig. 3), transfer the received die 20 to the second transfer position P22 by the rotational movement of the set angle unit, and transfer the transferred die 20 to the bonding head 211 at the second transfer position P22 (refer to fig. 7).
When the die table 340 is located at the first transfer position P21, the die supporting portion 341 faces the suction front end of the transfer head 131 in the transfer posture. At this time, the transfer head 131 approaches the die supporting portion 341 opposite the suction front end by the operation of the linear actuator 134, and places the die 20 transferred from the pick-up position P1 on the approaching die supporting portion 341. By this, the die 20 is accommodated in the die supporting portion 341 in an aligned state, and the lower surface (second surface) is adsorbed to the die supporting portion 341.
If the die table 340 moves to the apex of the peripheral region 301, it is located at the second transfer position P22. The die table 340 is located at the second transfer position P22, and the die supporting portion 341 is opposed to the bonding tool of the bonding head 211 located at the second transfer position P22. At this time, the bonding head 211 approaches the die supporting portion 341 opposed to the bonding tool by the bonding head vertical driving module 212, and picks up the die 20 transferred from the first transfer position P21 by the approaching die supporting portion 341. At this time, the upper surface (first surface) of the die 20 is adsorbed to the bonding tool.
The die vision unit 350 includes a first camera module 351, a second camera module 352, and a mirror module 353. The die vision unit 350 obtains an image on the upper face (first face) of the die 20 that is moved to the die inspection position P23 by the die supporting portion 341, and obtains an image on the lower face (second face) of the die 20 that is picked up from the second transfer position P22 by the bonding head 211 for visual inspection of the die 20.
The first camera module 351 and the second camera module 352 are provided around the rotating die table. The first and second camera modules 351, 352 are disposed around the rotating die table so as to face the die inspection position P23, and are fixed in position by a separate frame or the like. The die inspection position P23 is located laterally of the rotating die table, so that the first and second camera modules 351, 352 are also disposed laterally of the rotating die table.
The first and second camera modules 351 and 352 are disposed laterally of the rotary die table, and can prevent an increase in the vertical dimension of the buffer 300 and a lengthening of the die transfer path. If the camera module is disposed below the rotating die table, the up and down size of the buffer device 300 may be increased due to securing a Working Distance (WD) of the camera module, and it may be limited to dispose the rotating die table and the pick-up position P1 closely above the wafer table 110. If the buffer device 300 increases in vertical dimension and the rotating die table moves away from the pick-up position P1 in the horizontal direction, or if the difference in height between the first transfer position P21 and the pick-up position P1 increases, the die transfer path may be extended and the die transfer speed may be reduced.
The mirror module 353 is disposed in the hollow region 302, rotates about the horizontal axis a with respect to the rotating die stage, and is fixed in position by a separate frame or the like to be kept stationary. The mirror module 353 includes a mirror inclined with respect to the second transfer position P22 and the die inspection position P23, and the mirror is provided so as to reflect toward the die inspection position P23 side while reflecting an image from the second transfer position P22 side.
The first camera module 351 may be opposite to the upper face of the die 20 that is moved to the die inspection position P23 by the die supporting portion 341. In this regard, the upper surface of the die 20 transferred to the die inspection position P23 may be directly exposed to the first camera module 351. Accordingly, the die vision unit 350 can capture and obtain an image on the upper surface of the die 20 by directly incident on the first capturing path of the first camera module 351 with respect to the image on the upper surface of the die 20 transferred to the die inspection position P23.
The through portion 303 between the die supporting portions 341 may be located at the second transfer position P22 and the die inspection position P23 according to the angle of rotation of the rotating die table. In a state in which the bonding head 211 picks up the die 20 from the second transfer position P22, if the penetrating portion 303 is located at the second transfer position P22 and the die inspection position P23, an image on the lower surface of the die 20 picked up from the second transfer position P22 by the bonding head 211 may be mapped to the mirror of the mirror module 353, and the image mapped to the mirror may be reflected to the second camera module 352. In this regard, the underside of the die 20 picked up from the second transfer position P22 may be exposed to the second camera module 352 through the hollow region 302 provided with the mirror module 353 and the through portion 303 communicating therewith. Accordingly, the die vision unit 350 can capture and obtain an image on the lower surface of the die 20 by being incident on the second capturing path of the second camera module 352 through the reflection action of the mirror module 353 with respect to the lower surface image of the die 20 picked up from the second transfer position P22.
For the quality improvement of the photographed image with respect to the lower face of the die 20, the second photographing path (optical axis) photographed by the second camera module 382 with the mirror module 353 is preferably refracted at right angles as shown in fig. 8 for the lower face of the die 20 picked up by the bonding head 211.
The first photographing path for the first camera module 351 and the second photographing path for the second camera module 352 may be different in length from each other. The first camera module 351 may be maintained in a state set to a first focus that can obtain a clear image for the upper surface of the die 20 that is moved to the die inspection position P23. The second camera module 352 may remain in a state set to a second focus that can obtain a clear image for the underside of the die 20 picked up from the second transfer position P22 by the bonding head 211.
The die 20 picked up by the bonding head 211 may not map to the mirror module 353 as a whole below, depending on the size or suction position relative to the bonding tool. Thus, although not illustrated, the die vision unit 350 may further include a position adjustment module that precisely moves the mirror module 353 in a horizontal direction (for example, X-direction and Y-direction) that is a direction parallel to the die 20 picked up by the bonding head 211 to adjust the position of the mirror module 353 with respect to the die 20 picked up by the bonding head 211. According to such a position adjustment module for the mirror module 353, the positional relationship with respect to the mirror module 353 under the die 20 picked up by the bonding head 211 can be easily changed, thereby providing a more accurate image on the underside of the die 20 picked up by the bonding head 211 to the second camera module 382.
Fig. 2 shows a state in which the die ejector 120 peels the dicing tape 11 from the die 20 located at the pick-up position P1, and the transfer head 131 picks up the die 20 located at the pick-up position P1. Fig. 2 shows a state in which the rotational die table is rotated by a set angle and any one of the die tables 340 (see the first die table 340 a) is located at the first transfer position P21. As an example, when four die tables 340 and four through portions 303 are provided between them, if any one of the die tables (see the first die table 340 a) is located at the first transfer position P21, any two of the remaining three die tables are located at the die inspection position P23 and the second transfer position P22, respectively.
Fig. 3 shows a state in which the transfer head 131 moves from the pick-up position P1 to the first transfer position P21 in order to transfer the picked-up die 20 to the die table (refer to the first die table 340 a) located at the first transfer position P21.
Fig. 4 shows a state in which the transfer head 131 transfers the picked-up die 20 to the die table (refer to the first die table 340 a) located at the first transfer position P21 and returns to the pickup position P1. Fig. 4 shows a state in which the die table (see the first die table 340 a) located at the first transfer position P21 receives the transfer of the die 20 from the transfer head 131, and rotates the die table by a set angle after being supported in a suction manner. As an example, when the die table 340 positioned at the first transfer position P21 is rotated by a set angle (45 degrees) after receiving the transfer of the die 20 from the transfer head 131, if four through sections 303 are provided for each of the die table 340 and the through sections 303 therebetween, any three through sections 303 are positioned at the first transfer position P21, the die inspection position P23, and the second transfer position P22, respectively.
Fig. 5 shows a state in which the rotating die table is rotated at a set angle in the state of fig. 4, the other die table (see the second die table 340 b) is located at the first transfer position P1, and the transfer head 131 transfers the die 20 to the other die table (see the second die table 340 b) located at the first transfer position P1.
Fig. 6 shows a state in which the die table (see the first die table 340 a) that receives the conveyance of the die 20 from the conveyance head 131 is located at the die inspection position P23 as the rotational die table repeatedly rotates at a set angle, and the first camera module 351 photographs the upper surface of the die 20 that is moved to the die inspection position P23. Fig. 6 shows a state in which still another die table (see the third die table 340 c) is located at the first transfer position P1, and the transfer head 131 transfers the die 20 to still another die table (see the third die table 340 c) located at the first transfer position P1.
Fig. 7 shows a state in which the die table (see the first die table 340 a) located at the die inspection position P23 moves and is located at the second transfer position P22 as the rotating die table repeatedly rotates at a set angle, and the die 20 is transferred from the die inspection position P23 to the second transfer position P22, whereby the other die table (see the second die table 340 b) supporting the die is located at the die inspection position P23. In addition, fig. 7 shows a state in which the bonding head 211 picks up the die from the second transfer position P22. Fig. 7 shows a state in which still another die table (see fourth die table 340 d) is located at the first transfer position P1, and the transfer head 131 transfers the die 20 to still another die table (see fourth die table 340 d) located at the first transfer position P1.
Fig. 8 shows a state in which the bonding head 211 that picks up the die 20 from the die table (refer to the first die table 340 a) located at the second transfer position P22 is lifted up and the rotational die table is rotated by a set angle. At this time, the lower surface of the die 20 picked up by the bonding head 211 is exposed to the second camera module 352 through the hollow region 302 provided with the mirror module 353 and the through portion 303 communicating therewith. In addition, fig. 8 shows a state in which the mirror module 353 reflects the lower image with respect to the die 20 to the second camera module 352, and the second camera module 352 obtains the lower image with respect to the die 20 therethrough. Fig. 8 shows a state in which the transfer head 131 transfers the picked-up die 20 to the die table 340 located at the first transfer position P21 and returns to the pick-up position P1.
The above operations may be controlled by a control unit. The buffer device 300 may transfer the die 20 from the die supply device 100 to the die bonding device 200 while repeatedly performing the above operations, may temporarily store the die 20, and may obtain images for performing visual inspection on the upper and lower surfaces of the die 20.
The die table 340 of the die bonder according to the first embodiment of the present invention, which is constructed as observed, is rotated in units of a set angle in a circumferential direction centering around the horizontal axis a to be sequentially located at the first transfer position P21, the die inspection position P23, and the second transfer position P22, and thus the die 20 can be transferred from the die supply apparatus 100 to the die bonding apparatus 200 without delay, and the die 20 can be temporarily stored during this process, and thus the lifted operation speed can be secured. In addition, the die bonder according to the first embodiment of the present invention constructed as observed uses the hollow area 302 as the inner space of the rotating die table and obtains an image for visual inspection with respect to the lower face of the die 20 picked up by the bonding head 211, and therefore the increase in volume of the buffer device 300 by the die visual unit 350 can be suppressed simply and a good image can be obtained with respect to the lower face of the die 20.
The main parts of a die bonder according to a second embodiment of the present invention are shown in fig. 12. As shown in fig. 12, the die bonder according to the second embodiment of the present invention is different from the first embodiment of the present invention in that the die vision unit 350 is configured to photograph the lower surface of the die 20, etc. without a mirror module (refer to 353 of fig. 2).
For this reason, in the die bonder according to the second embodiment of the present invention, the rotating die table may be provided such that the die supporting portions 341 and the through portions 303 arranged at the same intervals along the outer peripheral region 301 according to a set angle (for example, 45 degrees) are provided as an even number, and each two of the through portions 303 constitute a pair so as to be opposed to each other centering on a horizontal axis (rotation center of the rotating die table). In addition, the second transfer position P22 and the die inspection position P23 may be disposed opposite to each other. The first camera module 354 and the second camera module 355 may be disposed around the rotating die table toward the die inspection position P23 so as to be opposite to the second transfer position P22 according to the positions of each two through portions 303 forming a pair.
Fig. 12 (a) shows a state in which the first camera module 354 directly photographs the upper surface of the die 20 transferred to the die inspection position P23 through the first photographing path, a state in which the bonding head 211 picks up the die 20 transferred to the second transfer position P22, and the like.
Fig. 12 (b) shows a state in which the bonding head 211 that picks up the die 20 from the second transfer position P22 is lifted up from the state in fig. 12 (a), the die table is rotated by a set angle, so that any two through portions 303 that are opposite to each other and constitute a pair are located at the die inspection position P23 and the second transfer position P22, respectively, and the second camera module 355 captures a state in which the lower surface of the die 20 picked up by the bonding head 22. At this time, the second camera module 355 photographs the lower surface of the die 20 without the mirror module (see 353 of fig. 2) by passing through the through portions 303 located at the die inspection position P23 and the second transfer position P22, respectively, and the second photographing path of the hollow region 302 communicating with the two through portions 303.
Depending on the size of the die 20, the suction position of the die 20 relative to the die table 340 and/or the bonding head 211, the position of the first camera module 354 and/or the second camera module 355, etc., the upper surface of the die 20 transferred to the die inspection position P23 by the die table 340 may not be entirely exposed to the first camera module 354, and the lower surface of the die 20 picked up by the bonding head 211 may not be entirely exposed to the second camera module 355. Thus, although not illustrated, the die vision unit 350 of the die bonder according to the second embodiment of the present invention may further include a position adjustment module that adjusts the positions of the first camera module 354 and the second camera module 355 with respect to the die 20 to be photographed by rapidly and precisely moving the first camera module 354 and the second camera module 355 in a horizontal direction (e.g., X-direction and Y-direction) that is a direction parallel to the die to be photographed (the die transferred to the die inspection position P23, the die picked up by the bonding head 211). According to such a position adjustment module for a camera module, the positions of the first camera module 354 and the second camera module 355 with respect to the upper and lower surfaces of the die 20 to be photographed can be quickly and easily changed, so that more accurate images with respect to the upper and lower surfaces of the die 20 to be photographed are provided to the first camera module 354 and the second camera module 355.
Fig. 12 (a) shows a state in which the first camera module 354 and the second camera module 355 are moved in order to accurately capture the upper surface of the die 20 transferred to the die inspection position P23 by the die table 340 by the first camera module 354. Fig. 12 (b) shows a state in which the first camera module 354 and the second camera module 355 are moved in order to accurately photograph the lower surface of the die 20 picked up by the bonding head 211 by the second camera module 355.
The main parts of a die bonder according to a third embodiment of the present invention are shown in fig. 13. As shown in fig. 13, the die bonder according to the third embodiment of the present invention differs from the first embodiment of the present invention only in that the die vision unit 350 is configured such that an image on the upper side and an image on the lower side of the die 20 can be obtained using a single camera module 356.
However, in the die bonder according to the third embodiment of the present invention, the camera module 356 is configured to face the upper front surface of the die 20 transferred to the die inspection position P23 around the rotating die table, and the mirror module 357 configured in the hollow area 302 is provided to map an image on the lower surface of the die 20 picked up by the bonding head 211 and reflected to the camera module 356. Of course, mirror module 357 comprises mirrors, the position of which is held stationary for rotation of the rotating die table by a separate frame or the like.
The camera module 356 is configured to be able to convert the focus to a first focus that can obtain a clear image for the upper face of the die 20 that is moved to the die inspection position P23 or a second focus that can obtain a clear image for the lower face of the die 20 that is picked up from the second transfer position P22 by the bonding head 211.
Fig. 13 (a) shows a state in which the camera module 356 directly shoots the upper surface of the die 20 transferred to the die inspection position P23 at the first focus through the first shooting path, a state in which the bonding head 211 picks up the die 20 transferred to the second transfer position P22, and the like.
Fig. 13 (b) shows a state in which the bonding head 211 that picks up the die 20 from the second transfer position P22 is lifted up from the state in fig. 13 (a), and the die table is rotated by a set angle so that any two through portions 303 are located at the die inspection position P23 and the second transfer position P22, respectively, and the camera module 356 that is shifted from the first focus to the second focus captures the lower surface of the die 20 picked up by the bonding head 211 with the mirror module 357. At this time, the camera module 356 photographs the lower surface of the die 20 by passing through the through portions 303 located at the die inspection position P23 and the second transfer position P22, respectively, and the second photographing path of the hollow region 302 communicating with the two through portions 303.
Such a die bonder according to the third embodiment of the present invention photographs the upper and lower sides of the die 20 through a single camera module 356, and thus visual inspection of the die 20 can be performed through a simpler structure.
The present invention has been described above, but the present invention is not limited to the disclosed embodiments and the accompanying drawings, and various modifications may be made by a person of ordinary skill within the scope of the technical idea of the present invention. The technical ideas described in the embodiments of the present invention may be implemented independently of each other or may be implemented in combination of two or more of them.

Claims (20)

1. A buffer device of a die bonder, comprising:
A rotary die table rotated by the rotation driving unit and having die supporting portions arranged along an outer peripheral region around a rotation center, the die supporting portions being sequentially located at a first transfer position, a die inspection position, and a second transfer position to transfer the die; and
And a die vision unit photographing a first face of the die, which is moved to the die inspection position by the die supporting portion, through a first photographing path directed toward, and photographing a second face of the die, which is picked up from the second transfer position by the bonding unit, through a second photographing path passing through an inside of the rotating die table.
2. The buffer device of a die bonder as claimed in claim 1, wherein,
The rotating die table has a hollow region surrounded by the peripheral region,
Through portions communicating with the hollow regions are provided between the die supporting portions, respectively.
3. The buffer device of a die bonder as claimed in claim 2, wherein,
The first photographing path is provided to directly photograph the first face of the die moved to the die inspection position,
The second photographing path is provided to photograph the second face of the die picked up from the second transfer position with the hollow region and the through portion.
4. The buffer device of the die bonder of claim 3,
The die vision unit includes a first camera module and a second camera module,
The first camera module and the second camera module are configured to face the die inspection position around the rotating die table,
The first photographing path directly incident an image on the first side of the die transferred to the die inspection position on the first camera module,
The die vision unit further includes: and a mirror module for reflecting an image on the second side of the die picked up from the second transfer position to the second camera module in the hollow region, the second photographing path reflecting the image on the second side to the second camera module according to the position of the through portion.
5. The buffer device of the die bonder of claim 4,
The die vision unit further includes:
and a position adjustment module that moves the mirror module in a direction parallel to the die picked up from the second transfer position to adjust a position of the mirror module with respect to the die picked up from the second transfer position.
6. The buffer device of the die bonder of claim 4,
The second photographing path using the mirror module is a right angle.
7. The buffer device of the die bonder of claim 4,
The die supporting portion and the through portion are arranged at the same arrangement angle along the peripheral region,
The rotational drive unit rotates the rotational die table by a unit of the arrangement angle and moves the die supporting portion by a unit of the arrangement angle,
The first transfer position, the die inspection position, and the second transfer position are set to be movable in units of the arrangement angle, and the die supporting portions can exist in sequence.
8. The buffer device of the die bonder of claim 7,
The die supporting portion is provided with three or more.
9. The buffer device of the die bonder of claim 3,
The die vision unit includes a single camera module configured to face the die inspection position around the rotating die table, the first photographing path directly incident an image on the first face of the die transferred to the die inspection position on the camera module,
The die vision unit further includes: and a mirror module for reflecting an image on the second side of the die picked up from the second transfer position to the camera module in the hollow region, the second photographing path reflecting the image on the second side to the camera module according to the position of the through portion.
10. The buffer device of the die bonder of claim 9,
The camera module is capable of converting a focus to a first focus for photographing the first side of the die moved to the die inspection position or a second focus for photographing the second side of the die picked up from the second transfer position.
11. The buffer device of the die bonder of claim 3,
The through portions are provided so as to be opposed to each other centering on the rotation center in a pair of each, the die inspection position is provided so as to be opposed to the second transfer position, the die vision unit includes a first camera module and a second camera module,
The first camera module and the second camera module are configured to face the die inspection position around the rotating die table,
The first photographing path directly incident an image on the first side of the die transferred to the die inspection position on the first camera module,
The second photographing path makes an image on the second face of the die picked up from the second transfer position incident on the second camera module according to positions of the penetrating portions each two of which constitute a pair.
12. The buffer device of a die bonder as claimed in claim 11,
The die vision unit further includes:
and a position adjusting module for moving the first camera module and the second camera module in a direction parallel to the die to be photographed.
13. The buffer device of a die bonder as claimed in claim 2, wherein,
The rotating die table includes:
A rotation shaft providing the rotation center; a rotating member provided on the rotating shaft; a support member extending from the rotation member in a longitudinal direction of the rotation shaft and disposed at intervals along a periphery of the rotation center to form the outer peripheral region; and a die table provided at a front end portion of each of the supporting members and having the die supporting portions, respectively,
Such that the die support portions are aligned along the peripheral region,
Having the hollow region surrounded by the peripheral region,
Each of the spaces formed between the die tables is the through portion.
14. The buffer device of a die bonder as claimed in claim 1, wherein,
The rotating die table is configured such that the die supporting portion supports the die by suction.
15. The buffer device of a die bonder of claim 14,
Each of the die support portions is formed with a receiving slot aligned with the die.
16. A die bonder, comprising:
A die transfer unit that moves the die from the pick-up position to a first transfer position; a bonding unit picking up the die from the second transfer position and loading the die on a substrate; and a buffer device between the die transfer unit and the bonding unit,
The buffer device includes:
a rotary die table rotated by a rotation driving unit and having die supporting portions arranged along an outer peripheral region around a rotation center, the die supporting portions being sequentially located at the first transfer position, a die inspection position, and the second transfer position to transfer the die; and
A die vision unit that photographs a first face of the die, which is moved to the die inspection position by the die supporting portion, through a first photographing path directed toward, and photographs a second face of the die, which is picked up from the second transfer position by the bonding unit, through a second photographing path passing through an inside of the rotating die table.
17. The die bonder of claim 16, wherein,
The rotating die table has a hollow region surrounded by the peripheral region,
Through portions communicating with the hollow regions are provided between the die supporting portions, respectively.
18. The die bonder of claim 17, wherein,
The first photographing path is provided to directly photograph the first face of the die moved to the die inspection position,
The second photographing path is provided to photograph the second face of the die picked up from the second transfer position with the hollow region and the through portion.
19. The die bonder of claim 16, wherein,
The center of rotation of the rotating die table is configured in a horizontal direction,
The die transfer unit includes:
a transfer head that transfers the die at the pick-up position or the first transfer position in accordance with a swing motion centered on a horizontal axis parallel to the rotation center; and
And the swing driving module is used for providing power for the swing motion to the conveying head.
20. A die bonder, comprising:
A wafer stage for supporting a wafer with a die; a wafer stage drive unit that moves the wafer stage in a horizontal direction to selectively position the die in a pick-up position; a die transfer unit that moves the die from the pick-up position to a first transfer position; a buffer device that receives the die from the first transfer position and transfers the die to a second transfer position; and a bonding unit that picks up the die from the second transfer position and loads the die on a substrate;
the buffer device includes:
A rotary die table having an outer peripheral region around a horizontal axis and a hollow region surrounded by the outer peripheral region, die supporting portions arranged along the outer peripheral region and penetrating portions provided between the die supporting portions so as to communicate with the hollow region, respectively, being arranged at the same arrangement angle, the rotary die table being rotated about the horizontal axis in units of the arrangement angle, the die supporting portions and the penetrating portions being located in the first conveyance position, the die inspection position, and the second conveyance position in this order;
A rotation driving unit that rotates the rotating die table by the unit of the arrangement angle;
A die vision unit including a first camera module photographing a first face of the die, which is moved to the die inspection position by the die supporting portion, through a first photographing path, and a second camera module photographing a second face of the die, which is picked up from the second transfer position by the bonding unit, through a second photographing path,
The first camera module and the second camera module are configured to face the die inspection position around the rotating die table,
The first photographing path directly incident an image on the first side of the die transferred to the die inspection position on the first camera module,
The die vision unit further includes: and a mirror module for reflecting an image on the second side of the die picked up from the second transfer position to the second camera module in the hollow region, the second photographing path reflecting the image on the second side to the second camera module according to the position of the through portion.
CN202310859945.8A 2022-10-25 2023-07-13 Die bonder and buffer device for die bonder Pending CN117936408A (en)

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KR1020220138707A KR20240057908A (en) 2022-10-25 2022-10-25 Die bonder
KR10-2022-0138707 2022-10-25

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KR20170042955A (en) 2015-10-12 2017-04-20 세메스 주식회사 Die bonding apparatus
KR102037950B1 (en) 2017-08-17 2019-10-29 세메스 주식회사 Wafer supply module and die bonding apparatus including the same
KR102391432B1 (en) 2017-10-19 2022-04-27 세메스 주식회사 Die transfer module and die bonding apparatus including the same

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