KR20170042955A - Die bonding apparatus - Google Patents

Die bonding apparatus Download PDF

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Publication number
KR20170042955A
KR20170042955A KR1020150142199A KR20150142199A KR20170042955A KR 20170042955 A KR20170042955 A KR 20170042955A KR 1020150142199 A KR1020150142199 A KR 1020150142199A KR 20150142199 A KR20150142199 A KR 20150142199A KR 20170042955 A KR20170042955 A KR 20170042955A
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South Korea
Prior art keywords
die
unit
dies
bonding
flipper
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KR1020150142199A
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Korean (ko)
Inventor
이희철
강홍구
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세메스 주식회사
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Priority to KR1020150142199A priority Critical patent/KR20170042955A/en
Publication of KR20170042955A publication Critical patent/KR20170042955A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A die bonding apparatus is disclosed. The apparatus comprises: a stage unit supporting a wafer having dies individualized through a dicing process; a die bonding unit to bond the dies on a substrate; a die transfer unit picking up the dies from the wafer, and transmitting the dies to the die bonding unit; and a stage operation unit horizontally moving the stage unit for the dies to be selectively picked up by the die transfer unit, and rotating the stage unit to control a bonding direction of the dies.

Description

Die bonding apparatus

Embodiments of the present invention relate to a die bonding apparatus. More particularly, the present invention relates to a die bonding apparatus for picking up a die from a wafer including dice individualized by a dicing process and bonding the die to a substrate such as a printed circuit board or a lead frame.

Generally, semiconductor devices can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes. The wafer on which the semiconductor devices are formed can be divided into a plurality of dies through a dicing process, and the dies can be mounted on a substrate such as a lead frame or a printed circuit board through a die bonding process.

After the dicing step is performed, the dies may be mounted on a mounting ring in the form of a circular ring through a dicing tape. An apparatus for performing the die bonding process includes a stage unit for supporting a wafer divided into a plurality of dies, a substrate transfer unit for transferring the substrate to a bonding area positioned adjacent to the stage unit, A die bonding unit for bonding on the substrate, a die eject unit for selectively separating the dies from the wafer, and the like. An example of such a die bonding apparatus is disclosed in Korean Patent Registration No. 10-0929197.

The die bonding process may be performed according to a predetermined recipe, and the recipe includes information on the number of dies bonded on the substrate, the bonding direction of the dies, the bonding position of the dies, can do.

Embodiments of the present invention are directed to a die bonding apparatus capable of adjusting the bonding direction of dies according to a bonding recipe in a die bonding process and reversing the dies.

According to embodiments of the present invention, a die bonding apparatus includes a stage unit for supporting a wafer including individualized dies through a dicing process, a die bonding unit for bonding the dies onto the substrate, A die transfer unit for picking up from the wafer and transferring the die unit to the die bonding unit; and a control unit for moving the stage unit horizontally so that the dies are selectively picked up by the die transfer unit, And a stage driving unit for rotating the stage unit.

According to the embodiments of the present invention, the stage driving unit includes a base plate for rotatably supporting the stage unit, a rotation driving unit for rotating the stage unit on the base plate, And a horizontal driving unit for driving the driving unit.

According to embodiments of the present invention, the die transfer unit comprises a flipper for picking up and inverting the dies one by one from the wafer, a die shuttle for transferring the dies to the die bonding unit, And a die transfer for picking up the dies and transporting them to the die shuttle.

According to embodiments of the present invention, the die shuttle may include vacuum chucks for supporting a plurality of dies.

According to embodiments of the present invention, the vacuum chucks may be made of a porous material.

According to embodiments of the present invention, the die shuttle and the die transfer can be respectively moved in directions perpendicular to each other.

According to embodiments of the present invention, the die transfer unit may further comprise a second die shuttle for transferring the dies to the die bonding unit, wherein the dies transfer the dies to the die shuttle The dies housed in the second die shuttle can be transferred to the die bonding unit.

According to embodiments of the present invention, the die transfer unit may further comprise a second flipper for re-inverting the dies inverted by the flipper, wherein the die transfer comprises dies transferred by the second flipper, And can be transferred to the die shuttle.

According to embodiments of the present invention, the rotation axis of the flipper and the rotation axis of the second flipper may be configured parallel to each other.

According to embodiments of the present invention, the rotation axis of the flipper and the rotation axis of the second flipper may be perpendicular to each other.

According to embodiments of the present invention, the die bonding unit includes: a plurality of bonding heads for picking up dies transferred by the die transfer unit and bonding the chips to the substrate; And a head driving unit for driving the head driving unit.

According to embodiments of the present invention, the die bonding unit may further include an under vision unit disposed below the transport path of the bonding heads and for observing the dies picked up by the bonding heads.

According to embodiments of the present invention, the bonding heads can be configured to be rotatable to adjust the bonding direction of the dies based on image information of the dice observed by the under vision unit.

According to embodiments of the present invention, the die bonding unit may further include a flux unit disposed below the conveying path of the bonding heads, the flux being received, and the head driving unit includes a die The bonding heads may be moved in a vertical direction so that the flux is provided on the lower surface of the bonding heads.

According to embodiments of the present invention, the die bonding apparatus may further include a second die bonding unit having the same configuration as the die bonding unit, and a second die transport unit having the same configuration as the die transport unit And the die bonding unit, the second die bonding unit, and the die transfer unit and the second die transfer unit may be disposed on both sides of the wafer, respectively.

According to embodiments of the present invention as described above, the die bonding apparatus includes a stage unit for supporting a wafer including a plurality of individual dies, a die bonding unit for bonding the dies on the substrate, A die transfer unit for picking up dies from the wafer and transferring the dies to the die bonding unit, and a stage driving unit for moving and rotating the stage unit in the horizontal direction. The die bonding apparatus can rotate the stage unit according to a preset recipe by using the stage driving unit, thereby freely adjusting the bonding direction of the dies.

In particular, the die transfer unit may comprise a flipper for picking up and inverting the dies from the wafer and a second flipper for re-inverting the dies inverted by the flipper. Therefore, the die bonding apparatus can sufficiently cope with both cases where the inversion of the dies is required and when the inversion of the dies is not necessary.

In addition, the die transfer unit can alternately use two die shuttles for transferring the dies, whereby the transfer speed of the dies can be sufficiently improved, and the second die bonding unit and the second die transfer unit The time required for the die bonding process can be significantly shortened.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a schematic diagram for explaining a die bonding apparatus according to an embodiment of the present invention; FIG.
Fig. 2 is a schematic sectional view for explaining the stage unit shown in Fig. 1. Fig.
3 is a schematic plan view for explaining a stage driving unit connected to the stage unit shown in Fig.
Fig. 4 is a schematic structural view for explaining the die transfer unit shown in Fig. 1. Fig.
5 is a schematic structural view for explaining another example of the die transfer unit shown in Fig.
Fig. 6 is a schematic structural view for explaining another example of the die transfer unit shown in Fig. 4; Fig.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

In the embodiments of the present invention, when one element is described as being placed on or connected to another element, the element may be disposed or connected directly to the other element, . Alternatively, if one element is described as being placed directly on another element or connected, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used in the embodiments of the present invention is used for the purpose of describing specific embodiments only, and is not intended to be limiting of the present invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Thus, changes from the shapes of the illustrations, e.g., changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the regions described in the drawings, but include deviations in the shapes, and the elements described in the drawings are entirely schematic and their shapes Is not intended to describe the exact shape of the elements and is not intended to limit the scope of the invention.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a schematic diagram for explaining a die bonding apparatus according to an embodiment of the present invention; FIG.

Referring to FIG. 1, a die bonding apparatus 100 according to an exemplary embodiment of the present invention includes a die 10, which includes individual semiconductor dies 20 via a dicing process according to a predetermined bonding recipe, And may be used to pick up the substrate 20 and bond it onto a substrate 30 such as a printed circuit board or a lead frame.

According to an embodiment of the present invention, the die bonding apparatus 100 includes a stage unit 110 for supporting the wafer 10, a die 20 for bonding the dies 20 onto the substrate 30, A die transfer unit 130 for picking up the dies 20 from the wafer 10 and transferring the dies 20 to the die bonding unit 120; And a stage driving unit 150 for rotating the stage.

Fig. 2 is a schematic sectional view for explaining the stage unit shown in Fig. 1, and Fig. 3 is a schematic plan view for explaining a stage driving unit connected to the stage unit shown in Fig.

2 and 3, the stage driving unit 150 drives the stage unit 110 horizontally so that the dies 20 are selectively picked up by the die transfer unit 130 in accordance with a predetermined bonding recipe And the stage unit 110 may be rotated to adjust the bonding direction of the dies 20 according to the bonding recipe.

On the other hand, the wafer 10 may be provided attached to the dicing tape 12. Specifically, the dies 20 may be attached to the dicing tape 12, and the dicing tape 12 may be mounted to the mount frame 14 in the form of a generally circular ring.

The stage unit 110 includes a wafer stage 112 for supporting the wafer 10 and a support ring 114 for supporting the edge of the dicing tape 12, A clamp 116 for holding the mount frame 14, and the like. Further, although not shown, the stage unit 110 may include a clamp driving unit (not shown) for moving the clamp 116 in a vertical direction.

The support ring 114 can support the dicing tape 12 between the wafer 10 and the mount frame 14. In this state, the clamp driving unit can hold the mount frame 14 The clamp 116 can be moved downward. As a result, the downward movement of the clamp 116 allows the dicing tape 12 to be stretched in its entirety, whereby the distance between the dies 20 can be sufficiently extended.

The stage driving unit 150 includes a base plate 152 for rotatably supporting the stage unit 110, a rotation driving unit 154 for rotating the stage unit 110 on the base plate 152, And a horizontal driving unit 156 for moving the base plate 152 in a horizontal direction.

For example, the rotation driving unit 154 may be configured using a motor and a power transmission mechanism, and may be disposed on the base plate 152 to rotate the wafer stage 112. At this time, a bearing 158 for rotation may be disposed between the wafer stage 112 and the base plate 152. The horizontal driving unit 156 may have a rectangular coordinate robot shape as shown in FIG. 3, and may move the base plate 152 in the X-axis direction and the Y-axis direction. However, since the configuration of the stage driving unit 150 can be variously modified, the scope of the present invention is not limited by the detailed configuration of the stage driving unit 150.

The die bonding apparatus 100 may include a die eject unit 160 for separating the dies 20 from the wafer 10 one by one. The die eject unit 160 may be disposed below the wafer 10 and may selectively disengage the dies 20 from the dicing tape 12 by raising the eject pins. At this time, the wafer stage 112 and the base plate 152 may have openings in which the die eject unit 160 is disposed, respectively, in order to separate the dies 20.

Fig. 4 is a schematic structural view for explaining the die transfer unit shown in Fig. 1. Fig.

1 and 4, the die transfer unit 130 includes a flipper 132 for picking up and inverting the dies 20 one by one from the wafer 10, A die shuttle 134 for transferring to the die bonding unit 120 and a die transfer 138 for picking up the dies 20 inverted by the flipper 132 and transferring the dies 20 to the die shuttle 134 .

Although not shown in detail, the flipper 132 may include a first vacuum picker for picking up the dies 20 and a first picker driver for operating the first vacuum picker, 138 may include a second vacuum picker for picking up the die 20 inverted by the flipper 132 and a second picker driver for moving the second vacuum picker. In particular, the first picker drive moves the first vacuum picker vertically to pick up the dies 20, and rotates the first vacuum picker to invert the picked dies 20 .

The die shuttle 134 can transfer a plurality of dies 20. For example, although not shown in detail, the die shuttle 134 may have a plurality of vacuum chucks 136 for supporting a plurality of dice 20, respectively. As an example, the vacuum chuck 136 may be made of a porous material and connected to a vacuum pump through a vacuum line.

The die transfer 138 picks up the inverted die 20 by the flipper 132 and moves the die 20 to a first position for delivering the die 20 to the die shuttle 134 . The die shuttle 134 is moved to a second position for transferring the dies 20 to the die bonding unit 120 after all of the dies 20 have been loaded on the vacuum chuck 136 .

The first picker driving unit may be configured using a motor and a power transmission mechanism, and the second picker driving unit may be a uniaxial robot or a rectangular coordinate robot. Although not shown in detail, the die shuttle 134 may be transferred by the shuttle drive unit, and a single axis robot may be used as the shuttle drive unit. For example, the die shuttle 134 and the die transfer 138 may be respectively moved in directions perpendicular to each other. That is, as shown, the die shuttle 134 may move the dies 20 in the X-axis direction and the die transfer 138 may move the dies 20 in the Y- .

According to one embodiment of the present invention, the die transfer unit 130 may include a second die shuttle 140 for transferring the dies 20 to the die bonding unit 120. In particular, while the dies 20 are received in the die shuttle 134 by the die transfer 138 in the first position, the second die shuttle 140 may be positioned in the second position And the dies 20 received in the second die shuttle 140 can be transferred to the die bonding unit 120. The time required for transferring the dies 20 can be shortened sufficiently.

Fig. 5 is a schematic structural view for explaining another example of the die transfer unit shown in Fig. 4, and Fig. 6 is a schematic structural view for explaining another example of the die transfer unit shown in Fig.

Referring to FIG. 5, the die transfer unit 130 may further include a second flipper 142 for re-inverting the dies 20 inverted by the flipper 132. In this case, the die transfer 138 can transfer the dies 20 re-inverted by the second flipper 142 to the die shuttle 134. At this time, the second flipper 142 may be configured to be substantially the same as the flipper 132.

For example, the rotation axis of the flipper 132 and the rotation axis of the second flipper 142 may be parallel to each other. In this case, the dies 20 re-inverted by the second flipper 142 may have the same arrangement angle as the arrangement angle on the dicing tape 12.

The second flipper 142 can be preferably used when it is not necessary to invert the dies 20. That is, only the flipper 132 may be used if the flipper 132 and the second flipper 142 are used when the flipper 132 and the dies 20 need to be reversed. .

Referring to FIG. 6, the rotation axis of the flipper 132 and the rotation axis of the second flipper 142 may be perpendicular to each other. In this case, the dies 20 re-inverted by the second flipper 142 may have an arrangement angle rotated by 180 ° with respect to an arbitrary vertical axis as compared with the arrangement angle on the dicing tape 12 have.

Alternatively, the rotation axis of the second flipper 142 may be inclined by 45 ° or 135 ° with respect to the rotation axis of the flipper 132. In this case, the dies 20 re-inverted by the second flipper 142 are arranged at an angle of 90 ° or 270 ° with respect to an arbitrary vertical axis as compared with the arrangement angle on the dicing tape 12 Lt; / RTI >

That is, by adjusting the angle between the rotation axis of the flipper 132 and the rotation axis of the second flipper 142 as described above, the arrangement angle of the re-inverted dies 20 can be adjusted, Can be adjusted.

1 again, the die bonding unit 120 picks up the dies 20 transferred to the second position by the die transfer unit 130 using the vacuum pressure and transfers the dies 20 A plurality of bonding heads 122 for bonding the bonding heads 122 to the substrate 30 and a head driving unit 124 for moving the bonding heads 122 in the horizontal and vertical directions. In particular, the number of bonding heads 122 may be the same as the number of dies 20 transferred by the die shuttle 134, (20) may be simultaneously or sequentially bonded on the substrate (30).

The die bonding unit 120 includes an under vision unit 126 disposed below the transport path of the bonding heads 122 and for observing the dies 20 picked up by the bonding heads 122, And a flux unit 128 disposed below the transport path of the bonding heads 122 and containing a flux.

The bonding heads 122 may adjust the bonding direction of the dies 20 based on the image information of the dies 20 viewed by the under vision unit 126, And can be configured to be rotatable. That is, the bonding heads 122 may align the dies 20 in the bonding direction according to image information of the dies 20.

The head driving unit 124 may move the bonding heads 122 in the vertical direction so that the flux is provided on the lower surface of the dies 20 picked up by the bonding heads 122. At this time, external connection terminals such as solder bumps may be provided on the lower surface of the die 20.

Also, according to an embodiment of the present invention, the die bonding apparatus 100 may include a second die bonding (not shown) having substantially the same configuration as the die bonding unit 120 to improve the bonding speed of the dies 20 Unit 170 and a second die transfer unit 180 having substantially the same configuration as the die transfer unit 130. [ As shown in the drawing, the die bonding unit 120 and the second die bonding unit 170 and the die transfer unit 130 and the second die transfer unit 180 are disposed on both sides of the wafer 10, Respectively.

Meanwhile, the die bonding apparatus 100 may include a substrate transfer unit 190 for providing the substrate 30 as a bonding area. The substrate transfer unit 190 draws the substrate 30 from a first magazine (not shown) disposed at one side of the die bonding apparatus 100 and transfers the substrate 30 to the bonding region. In the bonding region, The completed substrate 30 can be transferred to a second magazine (not shown) disposed on the other side of the die bonding apparatus 100.

As one example, although not shown in detail, the substrate transfer unit 190 may include substrate transferring rails connecting between the first magazine and the bonding area and between the bonding area and the second magazine, Grippers for gripping the grippers and a gripper driver for transporting the grippers. Also, although not shown, the bonding region may be provided with a bonding stage including a heater for heating the substrate 30 to a bonding temperature.

1, although two bonding regions prepared for two substrates 30 are used, the number of bonding regions may be variously changed, so that the scope of the present invention is not limited thereto. In addition, although one substrate transfer unit 190 is shown in the figure, a second substrate transfer unit (not shown) may be additionally used. In this case, the substrate transfer unit 190 and the second substrate transfer unit may be configured to be parallel to each other.

According to embodiments of the present invention as described above, the die bonding apparatus 100 includes a stage unit 110 for supporting a wafer 10 including a plurality of individual dies 20, A die bonding unit 120 for bonding the dies 20 onto the substrate 30 and a die transfer unit for picking up the dies 20 from the wafer 10 and transferring the dies 20 to the die bonding unit 120. [ Unit 130 and a stage driving unit 150 for moving and rotating the stage unit 130 in the horizontal direction. The die bonding apparatus 100 can rotate the stage unit 110 according to a predetermined recipe using the stage driving unit 150 and thereby freely adjust the bonding direction of the dies 20. [

In particular, the die transfer unit 130 includes a flipper 132 for picking up and inverting the dies 20 from the wafer 10 and dies 20 inverted by the flipper 132, The second flipper 142 may be provided. Therefore, the die bonding apparatus 100 can sufficiently cope with both the case where the dies 20 need to be inverted and the case where the dies 20 need not be inverted.

The die transfer unit 130 can also alternately use two die shuttles 134 and 140 for transferring the dies 20 to thereby improve the transfer rate of the dies 20 sufficiently The second die bonding unit 170 and the second die transfer unit 180 can be used to greatly shorten the time required for the die bonding process.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined in the following claims. It can be understood that.

10: wafer 12: dicing tape
14: Mount frame 20: Die
30: substrate 100: die bonding device
110: stage unit 112: wafer stage
114: Support ring 116: Clamp
120: die bonding unit 122: bonding head
124: head driving unit 126: under vision unit
128: flux unit 130: die transfer unit
132: flipper 134: die shuttle
136: vacuum chuck 138: die transfer
140: second die shuttle 142: second flipper
150: stage driving part 152: base plate
154: rotation drive part 156: horizontal drive part
158: bearing 160; Die ejection unit
170: second die bonding unit 180: second die transfer unit
190: substrate transfer unit

Claims (15)

A stage unit for supporting a wafer including individualized dies through a dicing process;
A die bonding unit for bonding the dies onto a substrate;
A die transfer unit for picking up the dies from the wafer and transferring the dies to the die bonding unit; And
And a stage driving unit for moving the stage unit in a horizontal direction so that the dies are selectively picked up by the die transfer unit and rotating the stage unit to adjust a bonding direction of the dies. The apparatus according to claim 1,
A base plate rotatably supporting the stage unit;
A rotation driving unit for rotating the stage unit on the base plate; And
And a horizontal driving unit for moving the base plate in a horizontal direction. The die transfer apparatus according to claim 1,
A flipper for picking up and inverting the dies one by one from the wafer;
A die shuttle for transferring the dies to the die bonding unit; And
And a die transfer for picking up the dies inverted by the flipper and transferring the dies to the die shuttle. 4. The die bonding apparatus according to claim 3, wherein the die shuttle has vacuum chucks for supporting a plurality of dies. The die bonding apparatus according to claim 4, wherein the vacuum chucks are made of a porous material. 4. The die bonding apparatus according to claim 3, wherein the die shuttle and the die transfer are respectively moved in directions perpendicular to each other. 4. The apparatus of claim 3, wherein the die transfer unit further comprises a second die shuttle for transferring the dies to the die bonding unit, wherein while the dies are housed in the die shuttle by the die transfer, Wherein the dies housed in the shuttle are transferred to the die bonding unit. 4. The apparatus of claim 3, wherein the die transfer unit further comprises a second flipper for re-inverting the dies inverted by the flipper, wherein the die transfer transfers dies re-inverted by the second flipper to the die shuttle Wherein the die bonding apparatus is a die bonding apparatus. The die bonding apparatus according to claim 8, wherein the rotation axis of the flipper and the rotation axis of the second flipper are parallel to each other. The die bonding apparatus according to claim 8, wherein the rotation axis of the flipper and the rotation axis of the second flipper are perpendicular to each other. The die bonding apparatus according to claim 1,
A plurality of bonding heads for picking up dies transferred by the die transfer unit and bonding to the substrate; And
And a head driving unit for moving the bonding heads in the horizontal and vertical directions. 12. The die bonding apparatus of claim 11, wherein the die bonding unit further comprises an under vision unit disposed below the transport path of the bonding heads and for observing the dies picked up by the bonding heads. 13. The die bonding apparatus of claim 12, wherein the bonding heads are configured to be rotatable to adjust a bonding direction of the dies based on image information of the dice observed by the under vision unit. 12. The method of claim 11, wherein the die bonding unit further comprises a flux unit disposed below a conveying path of the bonding heads and containing flux, And said bonding heads are moved in the vertical direction so that flux is provided. The semiconductor device according to claim 1, further comprising: a second die bonding unit having the same configuration as the die bonding unit; And
Further comprising a second die transfer unit having the same configuration as the die transfer unit,
Wherein the die bonding unit, the second die bonding unit, and the die transfer unit and the second die transfer unit are disposed on both sides of the wafer, respectively.
KR1020150142199A 2015-10-12 2015-10-12 Die bonding apparatus KR20170042955A (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190043726A (en) 2017-10-19 2019-04-29 세메스 주식회사 Die transfer module and die bonding apparatus including the same
KR20190138203A (en) * 2018-06-04 2019-12-12 한화정밀기계 주식회사 Bonding apparatus
KR20190138204A (en) * 2018-06-04 2019-12-12 한화정밀기계 주식회사 Bonding apparatus
KR20200093177A (en) 2019-01-28 2020-08-05 세메스 주식회사 Die bonding apparatus
KR20240048934A (en) 2022-10-07 2024-04-16 세메스 주식회사 Die bonder
KR20240053395A (en) 2022-10-17 2024-04-24 세메스 주식회사 Die bonder
KR20240057908A (en) 2022-10-25 2024-05-03 세메스 주식회사 Die bonder

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190043726A (en) 2017-10-19 2019-04-29 세메스 주식회사 Die transfer module and die bonding apparatus including the same
KR20190138203A (en) * 2018-06-04 2019-12-12 한화정밀기계 주식회사 Bonding apparatus
KR20190138204A (en) * 2018-06-04 2019-12-12 한화정밀기계 주식회사 Bonding apparatus
KR20200093177A (en) 2019-01-28 2020-08-05 세메스 주식회사 Die bonding apparatus
KR20240048934A (en) 2022-10-07 2024-04-16 세메스 주식회사 Die bonder
KR20240053395A (en) 2022-10-17 2024-04-24 세메스 주식회사 Die bonder
KR20240057908A (en) 2022-10-25 2024-05-03 세메스 주식회사 Die bonder

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