CN117894699B - Wafer thickness detector and detection method thereof - Google Patents
Wafer thickness detector and detection method thereof Download PDFInfo
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- CN117894699B CN117894699B CN202311654063.4A CN202311654063A CN117894699B CN 117894699 B CN117894699 B CN 117894699B CN 202311654063 A CN202311654063 A CN 202311654063A CN 117894699 B CN117894699 B CN 117894699B
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- 238000001514 detection method Methods 0.000 title claims abstract description 47
- 235000012431 wafers Nutrition 0.000 claims abstract description 59
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- 244000309464 bull Species 0.000 claims description 9
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
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- 238000012544 monitoring process Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The invention relates to a wafer thickness detector and a detection method thereof applied to the technical field of physical measurement, wherein a telescopic straight rod is adopted to connect a rotating rod with a thickness sensor, and gas is extruded into the telescopic straight rod through piston movement to change the length of the telescopic straight rod, in the detection process, the thickness sensor is driven by the rotating rod to slowly move circularly, the thickness detection of a plurality of positions of a plurality of wafers is realized through the upper sides of different wafers, a T-shaped piston rod is downwards moved for a certain distance at intervals, the circular movement radius of the telescopic straight rod is slightly extended, the positions of the upper sides of the wafers are changed, the detection of different positions of the wafers is realized, and therefore, the thickness sensor can move circularly from small to large with different radiuses through the repeated small amplitude downwards for the T-shaped piston rod, the comprehensive multipoint detection of the plurality of wafers is realized at one time, the detection efficiency is improved, and the detection accuracy is also improved.
Description
Technical Field
The invention relates to a thickness detector, in particular to a wafer thickness detector and a detection method thereof, which are applied to the technical field of physical measurement.
Background
Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, the original material of which is silicon. The high-purity polycrystalline silicon is dissolved and then doped with silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. The silicon ingot is ground, polished, and sliced to form a silicon wafer, i.e., a wafer.
In the manufacturing process of the semiconductor laser chip, the wafer is required to be ground and thinned to a certain thickness, and the wafer thickness is required to be detected for a plurality of times in the process.
The specification of Chinese patent No. 202211540994.7 discloses a device and a method for measuring the thickness of a wafer at multiple points, which are described in the following: because gear and supporting disk lower surface fixed mounting's ring gear mesh mutually, the reciprocating screw rod is when taking the pivot as center of rotation, and the gear can drive reciprocating screw rod and rotate around its center, makes reciprocating screw rod drive its external surface threaded connection's slider rotate in the spout, makes slider drive its lower surface fixed mounting's thickness sensor when following annular swivel mount rotation, can radially remove in annular swivel mount's below, makes thickness sensor can carry out the multiple spot to the wafer thickness of placing in the standing groove and detect.
The radial movement and rotation process of the thickness sensor are realized, but the radial movement is realized through the meshing of the gear and the gear ring, the gear ring rotates for a circle and drives the gear to rotate for a plurality of circles, and the thickness sensor is not rotated for a circle or for a few circles, so that the whole radial movement on the reciprocating screw is completed, and the wafer is subjected to multi-point detection, but the detection comprehensiveness is still lower, the inaccuracy of the detection result is also larger, and the efficiency is lower when the wafer is detected for one wafer at a time.
Disclosure of Invention
Aiming at the prior art, the invention aims to solve the technical problems that the radial movement and rotation processes of the thickness sensor are realized in the prior art, but the radial movement is limited greatly because the radial movement and rotation processes are linked, so that the detection comprehensiveness is still lower, and the efficiency is lower when the wafer is detected at a time.
In order to solve the problems, the invention provides a wafer thickness detector which comprises a detection table, wherein the upper end of the detection table is fixedly connected with a storage tray, the upper end of the storage tray is provided with a plurality of storage grooves which are uniformly distributed, the inside of the detection table is fixedly connected with a motor, the output end of the motor is fixedly connected with a rotating rod, the rotating rod movably penetrates through the detection table and the storage tray and extends to the upper side of the storage tray, the side end of the rotating rod is fixedly connected with a telescopic straight rod which is perpendicular to the rotating rod, one end of the telescopic straight rod, which is far away from the rotating rod, is fixedly connected with a connecting seat, one end of the connecting seat, which is far away from the rotating rod, is fixedly connected with a thickness sensor, the inside of the rotating rod is provided with an air cavity, the inside of the air cavity is vertically and slidably connected with a T-shaped piston rod, the upper end of the T-shaped piston rod movably penetrates through the upper inner wall of the air cavity and extends to the upper side of the rotating rod, and the telescopic straight rod is positioned at the lower side of the T-shaped piston rod.
As a further supplement of the application, the telescopic straight rod comprises a telescopic rod, a tension spring and a flexible sleeve which are sequentially distributed from inside to outside, the inner wall of the air cavity, which is close to the telescopic straight rod, is provided with air holes, and the air holes are positioned at the inner side of the opening of the flexible sleeve.
As a further supplement of the application, one end of the telescopic rod, the extension spring and the flexible sleeve are fixedly connected to the connecting seat, the other ends of the telescopic rod and the extension spring penetrate through the air hole and are fixedly connected with the inner wall of the air cavity, and the other end of the flexible sleeve is fixedly connected with the outer end of the rotating rod.
As a further improvement of the application, the upper side of the object placing disc is provided with a cylinder, a plurality of L-shaped rods which are uniformly distributed are fixedly connected between the side end of the cylinder and the upper end of the detection table, the inside of the cylinder is connected with a disc in a sliding way, and the rotating rod is positioned on the inner side of the cylinder and positioned on the lower side of the disc.
As a further improvement supplement of the application, the side ends of the discs are fixedly connected with a pair of side plates, the side ends of the cylinder are provided with a pair of vertical grooves, and the discs are respectively and slidably connected inside the vertical grooves.
As a further improvement supplement of the application, the side wall of the vertical groove is provided with a plurality of limit grooves which are uniformly distributed from top to bottom, and the rear end of the side plate is the same as the vertical groove width of the limit groove.
As a further improvement of the application, the upper ends of the pair of L-shaped rods are fixedly connected with hydraulic cylinders, the pair of hydraulic cylinders are respectively positioned right under the pair of side plates, the lower ends of the side plates and the upper ends of the hydraulic cylinders are fixedly connected with magnetic plates, and the upper end of one L-shaped rod with the hydraulic cylinders is also fixedly connected with a distance sensor.
A wafer thickness detector, the detection method comprising the steps of:
S1, respectively placing a plurality of wafers to be detected on a plurality of storage grooves, wherein a T-shaped piston rod is positioned at the uppermost side of an air cavity in an initial state, and a telescopic straight rod is positioned at the shortest state;
s2, electrifying the motor to drive the rotating rod to slowly rotate, and enabling the rotating rod to drive the thickness sensor to slowly rotate on the upper side of the object placing disc through the telescopic straight rod so as to simultaneously detect a plurality of wafers on the upper side of the object placing disc;
And S3, moving the T-shaped piston rod downwards for a certain distance every a period of time, so that the quantitative gas in the rotating rod enters the telescopic straight rod to enable the telescopic straight rod to extend, thereby increasing the radius of circular motion of the thickness sensor, changing the detection positions of a plurality of wafers and realizing comprehensive multipoint detection of the wafers.
In step S3, the downward movement process of the T-shaped piston rod is controlled in the following manner: the side plates are manually rotated out of the limiting grooves and moved into the vertical grooves, then the side plates are downwards moved to the position near the next limiting groove along the vertical grooves and then are rotated into the limiting grooves, the side plates are limited, in the downwards moving process of the side plates, the discs are synchronously downwards moved under the drive of the side plates, the T-shaped piston rods are downwards pressed, and the downwards moving distance of the side plates is the downwards moving distance of the T-shaped piston rods in the air cavity.
In step S3, the downward movement process of the T-shaped piston rod is controlled in the following manner: the hydraulic cylinder is electrified to drive the magnetic plate to move upwards until the magnetic plate contacts with the magnetic plate at the lower side of the side plate to suck magnetically, the magnetic plate is retracted for a certain length at intervals through the hydraulic cylinder, and the disc and the side plate can be indirectly attracted to move downwards under the action of magnetic attraction of the magnetic plate, so that the T-shaped piston rod is pressed downwards.
In summary, the telescopic straight rod is adopted to connect the rotating rod and the thickness sensor, and the gas is extruded into the telescopic straight rod through the movement of the piston to change the length of the telescopic straight rod, in the detection process, the thickness sensor is driven by the rotating rod to slowly move circularly, the thickness of a plurality of wafers is detected through the upper sides of different wafers, the T-shaped piston rod is moved downwards for a certain distance at intervals, the telescopic straight rod is stretched slightly, the distance between the thickness sensor and the rotating rod is increased, the circular movement radius of the thickness sensor is increased, in the circular movement, the positions of the upper sides of the wafers are changed, and the wafers are detected at different positions, so that the thickness sensor can perform circular movement with different radiuses from small to large through the small amplitude downwards movement of the T-shaped piston rod, the comprehensive multipoint detection of the wafers is realized at one time, the detection efficiency is improved, and the detection accuracy is also improved.
Drawings
FIG. 1 is a perspective view of the present application;
FIG. 2 is a schematic diagram of a front view of the present application;
FIG. 3 is a schematic view of the front view of a portion of the telescopic straight rod of the present application;
FIG. 4 is a schematic diagram of a front structure of the present application;
FIG. 5 is a schematic diagram of a front structure of the third embodiment of the present application;
FIG. 6 is a partial perspective view of the present application in use;
FIG. 7 is a partial perspective view of the present application in use;
FIG. 8 is a second perspective view of the present application;
FIG. 9 is a third perspective view of the present application;
FIG. 10 is a perspective view of a fourth embodiment of the present application;
FIG. 11 is a schematic diagram of a front structure of the present application;
fig. 12 is a schematic diagram of a front structure of the present application.
The reference numerals in the figures illustrate:
1 detection table, 2 storage disc, 3 bull stick, 301 air cavity, 4 thickness sensor, 5 flexible straight pole, 51 telescopic link, 52 extension spring, 53 flexible sleeve, 6 connecting seat, 7T shape piston rod, 81 disc, 82 curb plate, 9 drum, 901 perpendicular groove, 902 spacing groove, 10L shape pole, 11 pneumatic cylinder, 12 magnetic plate, 13 distance sensor.
Detailed Description
The following describes 3 embodiments of the present application in detail with reference to the accompanying drawings.
Embodiment 1:
The invention provides a wafer thickness detector, please refer to fig. 1-2, including a detection table 1, the upper end of the detection table 1 is fixedly connected with a storage tray 2, the upper end of the storage tray 2 is provided with a plurality of evenly distributed storage slots, the storage slots are used for placing wafers to be detected, the inside of the detection table 1 is fixedly connected with a motor, the output end of the motor is fixedly connected with a rotating rod 3, the rotating rod 3 movably penetrates through the detection table 1 and the storage tray 2 and extends to the upper side of the storage tray 2, the side end of the rotating rod 3 is fixedly connected with a telescopic straight rod 5 which is arranged vertically to the rotating rod 3, one end of the telescopic straight rod 5 away from the rotating rod 3 is fixedly connected with a connecting seat 6, one end of the connecting seat 6 away from the rotating rod 3 is fixedly connected with a thickness sensor 4, the rotating rod 3 is driven by the motor to slowly rotate, the thickness sensor 4 and the telescopic straight rod 5 at the side of the upper side of the storage tray 2 are used for detecting different positions of the wafers, the inside of the rotating rod 3 is provided with an air cavity 301, the inside of the air cavity 301 is vertically connected with a T-shaped straight rod 7 in a sliding manner, the upper end of the T-shaped straight rod 7 extends to the upper end of the T-shaped straight rod 7 and extends to the upper side of the T-shaped piston rod 7, and the inner side of the T-shaped piston rod extends to the upper side of the T-shaped piston rod 7.
Referring to fig. 2-3, the telescopic straight rod 5 includes a telescopic rod 51, a tension spring 52 and a flexible sleeve 53 which are distributed sequentially from inside to outside, an air hole is formed in the inner wall of the air cavity 301, which is close to the telescopic straight rod 5, and the air hole is located at the inner side of the opening of the flexible sleeve 53, so that air intercommunication between the air cavity 301 and the inside of the flexible sleeve 53 is realized, one ends of the telescopic rod 51, the tension spring 52 and the flexible sleeve 53 are fixedly connected to the connecting seat 6, the other ends of the telescopic rod 51 and the tension spring 52 penetrate through the air hole and are fixedly connected to the inner wall of the air cavity 301, and the other end of the flexible sleeve 53 is fixedly connected to the outer end of the rotating rod 3.
In the initial state, as shown in fig. 3-5, the extension spring 52 is in an original length state, the gas in the flexible sleeve 53 is extruded into the air cavity 301, so that the T-shaped piston rod 7 is positioned at the uppermost position of the air cavity 301, when the T-shaped piston rod 7 moves downwards along the air cavity 301 by external force, the gas in the air cavity 301 can be extruded into the flexible sleeve 53 through the air holes, the elasticity of the extension spring 52 is overcome, the extension rod 51 is extended in length, the extension rod 5 is kept in a linear state, and the connection function is realized between the extension rod 5 and the connection seat 6; as shown in fig. 6 and 7, the distance between the thickness sensor 4 and the rotating rod 3 is increased by the extension of the telescopic straight rod 5, and the radius of the circular motion of the thickness sensor 4 is further increased, so that the detection positions of a plurality of wafers are changed.
A wafer thickness detector, the detection method comprising the steps of:
s1, respectively placing a plurality of wafers to be detected on a plurality of storage grooves, wherein in an initial state, a T-shaped piston rod 7 is positioned at the uppermost side of an air cavity 301, and at the moment, a telescopic straight rod 5 is in a shortest state;
S2, electrifying a motor to drive a rotating rod 3 to slowly rotate, and enabling the rotating rod 3 to drive a thickness sensor 4 to slowly rotate on the upper side of a storage disc 2 through a telescopic straight rod 5, so that a plurality of wafers on the upper side of the storage disc 2 are detected simultaneously;
S3, moving the T-shaped piston rod 7 downwards for a certain distance every a period of time, enabling quantitative gas in the rotating rod 3 to enter the telescopic straight rod 5 to enable the telescopic straight rod 5 to extend (due to the fact that the rotating speed of a motor is low, the motor is not required to be closed in the process, namely the detection process is not required to be suspended), so that the radius of circular motion of the thickness sensor 4 is increased, the detection positions of a plurality of wafers are changed, and comprehensive multipoint detection of the wafers is achieved.
When the thickness sensor 4 is driven by the rotating rod 3 to slowly and circularly move, the thickness sensor passes through the upper sides of different wafers, so that the thickness detection of a plurality of positions of a plurality of wafers is realized; in step S3, the T-shaped piston rod 7 is moved downward by a certain distance at intervals, the telescopic straight rod 5 is extended by a small extent, the distance between the thickness sensor 4 and the rotating rod 3 is increased, the radius of the circular motion of the thickness sensor 4 is increased, and the position on the upper side of the wafer is changed during the circular motion, so that the wafer is detected in different positions, therefore, the thickness sensor 4 can perform circular motions with different radii from small to large by moving downward by a small extent for many times the T-shaped piston rod 7, the comprehensive multi-point detection of a plurality of wafers is realized at one time, the detection efficiency is improved, and the detection accuracy is also improved
Supplementary explanation: since the rotating rod 3 is slowly rotated in the detection process, the centrifugal force applied to the thickness sensor 4 in the rotation process is small, and the influence on the length of the telescopic straight rod 5 is negligible.
Embodiment 2:
In this embodiment, the following structure is added to keep the structure of embodiment 1 unchanged: referring to fig. 8 and 9, a cylinder 9 is disposed on the upper side of the object placing tray 2, a plurality of L-shaped rods 10 are fixedly connected between the side ends of the cylinder 9 and the upper end of the detecting table 1, a disc 81 is slidably connected inside the cylinder 9, a rotating rod 3 is located inside the cylinder 9 and located below the disc 81, a pair of side plates 82 are fixedly connected to the side ends of the disc 81, a pair of vertical grooves 901 are formed in the side ends of the cylinder 9, the pair of discs 81 are slidably connected inside the pair of vertical grooves 901, a plurality of limit grooves 902 are formed in the side walls of the vertical grooves 901 and are uniformly distributed from top to bottom, and the rear ends of the side plates 82 are identical to the vertical groove widths of the limit grooves 902.
With the above arrangement, the downward movement process of the T-shaped piston rod 7 can be controlled in step S3 as follows: manually enabling the side plate 82 to rotate out of the limit groove 902 and move into the vertical groove 901, then enabling the side plate 82 to move downwards along the vertical groove 901 to the position near the next limit groove 902, then rotating the side plate 82 into the limit groove 902, limiting the side plate 82, and in the process of moving downwards the side plate 82, enabling the disc 81 to synchronously move downwards under the driving of the side plate 82, so that the T-shaped piston rod 7 is pressed downwards, wherein the downwards moving distance of the side plate 82 is the downwards moving distance of the T-shaped piston rod 7 in the air cavity 301, and supplementing the description: the upper end of the T-shaped piston rod 7 can adopt a round head structure, so that the contact mode between the T-shaped piston rod 7 and the disc 81 is in a point contact state, the friction force between the T-shaped piston rod and the disc 81 can be reduced, and the T-shaped piston rod 7 is smoothly pressed down in the slow rotation process.
Compared with the manual control of the T-shaped piston rod 7in the embodiment 1, the control mode of the T-shaped piston rod 7 can more accurately control the single downward movement distance of the T-shaped piston rod 7, and the T-shaped piston rod 7 is not easy to move upwards accidentally in the rotation process by limiting and blocking the T-shaped piston rod 7 through the disc 81, so that the smooth proceeding of the detection process is further ensured.
Embodiment 3:
In this embodiment, the following structure is added to keep the structure of embodiment 2 unchanged: referring to fig. 10-11, the upper ends of a pair of L-shaped rods 10 are fixedly connected with hydraulic cylinders 11, a pair of hydraulic cylinders 11 are respectively located under a pair of side plates 82, the lower ends of the side plates 82 and the upper ends of the hydraulic cylinders 11 are fixedly connected with magnetic plates 12, and the upper end of one of the L-shaped rods 10 with the hydraulic cylinders 11 is fixedly connected with a distance sensor 13.
With the above arrangement, the downward movement process of the T-shaped piston rod 7 can be controlled in step S3 as follows: the hydraulic cylinder 11 is electrified to drive the magnetic plate 12 to move upwards until the magnetic plate 12 contacts with the magnetic plate 12 at the lower side of the side plate 82 to suck magnetically, the hydraulic cylinder 11 is retracted for a certain length at intervals, and the disc 81 and the side plate 82 can be indirectly attracted to move downwards under the action of magnetic attraction of the magnetic plate 12, so that the T-shaped piston rod 7 is pressed downwards.
Compared with the manual control mode of the T-shaped piston rod 7 in the embodiment 2, the full-automatic mechanical control of the T-shaped piston rod 7 is realized through the cooperation of the hydraulic cylinder 11 and the magnetic plate 12, the manpower consumption is reduced, and meanwhile, whether the side plate 82 has abnormal movement or not can be monitored in real time through the monitoring of the distance of the side plate 82 by the distance sensor 13, so that the smooth detection is effectively ensured.
The present application is not limited to the above-described embodiments, which are adopted in connection with the actual demands, and various changes made by the person skilled in the art without departing from the spirit of the present application are still within the scope of the present application.
Claims (10)
1. A wafer thickness detector, characterized by: including detecting platform (1), the upper end fixedly connected with of detecting platform (1) puts thing dish (2), the upper end of putting thing dish (2) is offered a plurality of evenly distributed and is put thing groove, the inside fixedly connected with motor of detecting platform (1), the output fixedly connected with bull stick (3) of motor, bull stick (3) activity run through detecting platform (1) and put thing dish (2) and extend to put thing dish (2) upside, the side fixedly connected with of bull stick (3) is with flexible straight-bar (5) that bull stick (3) set up perpendicularly, the one end fixedly connected with connecting seat (6) of bull stick (3) are kept away from to flexible straight-bar (5), the one end fixedly connected with thickness sensor (4) of bull stick (3) are kept away from to connecting seat (6), air cavity (301) have been seted up to the inside of bull stick (3), sliding connection has T shape piston rod (7) about the inside of air cavity (301), the upper end activity of T shape piston rod (7) runs through and extends to the upper and lower side of the straight-bar (3) of extension to the straight-bar (5).
2. A wafer thickness detector according to claim 1, wherein: the telescopic straight rod (5) comprises a telescopic rod (51), a tension spring (52) and a flexible sleeve (53) which are sequentially distributed from inside to outside, an air hole is formed in the inner wall, close to the telescopic straight rod (5), of the air cavity (301), and the air hole is located in the inner side of an opening of the flexible sleeve (53).
3. A wafer thickness detector according to claim 2, wherein: one end of the telescopic rod (51), the extension spring (52) and the flexible sleeve (53) are fixedly connected to the connecting seat (6), the other ends of the telescopic rod (51) and the extension spring (52) penetrate through the air holes and are fixedly connected to the inner wall of the air cavity (301), and the other end of the flexible sleeve (53) is fixedly connected to the outer end of the rotating rod (3).
4. A wafer thickness detector according to claim 1, wherein: the upper side of putting thing dish (2) is equipped with drum (9), fixedly connected with a plurality of evenly distributed's L shape pole (10) between the upper end of side end and detection platform (1) of drum (9), the inside sliding connection of drum (9) has disc (81), bull stick (3) are located the inboard of drum (9) and are located the downside of disc (81).
5. A wafer thickness detector according to claim 4, wherein: the side ends of the discs (81) are fixedly connected with a pair of side plates (82), a pair of vertical grooves (901) are formed in the side ends of the cylinders (9), and the discs (81) are respectively and slidably connected to the inside of the vertical grooves (901).
6. A wafer thickness detector according to claim 5, wherein: the side wall of the vertical groove (901) is provided with a plurality of limit grooves (902) which are uniformly distributed from top to bottom, and the rear end of the side plate (82) is the same as the vertical groove width of the limit grooves (902).
7. A wafer thickness detector according to claim 6, wherein: the upper ends of the pair of L-shaped rods (10) are fixedly connected with hydraulic cylinders (11), the pair of hydraulic cylinders (11) are respectively located on the right lower sides of the pair of side plates (82), the lower ends of the side plates (82) and the upper ends of the hydraulic cylinders (11) are fixedly connected with magnetic plates (12), and the upper ends of the L-shaped rods (10) with the hydraulic cylinders (11) are fixedly connected with distance sensors (13).
8. A wafer thickness detector according to claim 7, wherein: the detection method comprises the following steps:
S1, respectively placing a plurality of wafers to be detected on a plurality of storage grooves, wherein a T-shaped piston rod (7) is positioned at the uppermost side of an air cavity (301) in an initial state, and a telescopic straight rod (5) is in a shortest state;
S2, electrifying the motor to drive the rotating rod (3) to slowly rotate, and enabling the rotating rod (3) to drive the thickness sensor (4) to slowly rotate on the upper side of the object placing disc (2) through the telescopic straight rod (5), so that a plurality of wafers on the upper side of the object placing disc (2) are detected simultaneously;
s3, moving the T-shaped piston rod (7) downwards for a certain distance every a period of time, enabling quantitative gas in the rotating rod (3) to enter the telescopic straight rod (5) to enable the telescopic straight rod (5) to extend, further enabling the circular motion radius of the thickness sensor (4) to be increased, changing the detection positions of a plurality of wafers, and realizing comprehensive multi-point detection of the wafers.
9. A wafer thickness detector according to claim 8, wherein: in step S3, the downward moving process of the T-shaped piston rod (7) is controlled in the following way: the side plate (82) is manually rotated out of the limit groove (902), moved into the vertical groove (901), then the side plate (82) is downwards moved to the vicinity of the next limit groove (902) along the vertical groove (901), then the side plate is rotated into the limit groove (902), the side plate (82) is limited, in the process of downwards moving the side plate (82), the disc (81) is synchronously downwards moved under the driving of the side plate (82), the T-shaped piston rod (7) is downwards pressed, and the downwards moving distance of the side plate (82) is the downwards moving distance of the T-shaped piston rod (7) in the air cavity (301).
10. A wafer thickness detector according to claim 8, wherein: in step S3, the downward moving process of the T-shaped piston rod (7) is controlled in the following way: the hydraulic cylinder (11) is electrified to drive the magnetic plate (12) to move upwards until the magnetic plate (12) at the lower side of the side plate (82) is contacted with the magnetic plate to be magnetically attracted, the hydraulic cylinder (11) is retracted for a certain length at intervals, and the disc (81) and the side plate (82) can be indirectly attracted to move downwards under the action of magnetic attraction of the magnetic plate (12), so that the T-shaped piston rod (7) is pressed downwards.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115808145A (en) * | 2022-12-02 | 2023-03-17 | 江苏希太芯科技有限公司 | Multipoint measuring device and method for wafer thickness |
| CN116978855A (en) * | 2023-01-09 | 2023-10-31 | 邢建华 | Calibration system for multipoint measurement of thickness of copper layer of wafer |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10160420A (en) * | 1996-12-03 | 1998-06-19 | Tokyo Seimitsu Co Ltd | Instrument for measuring thickness and thickness variation of wafer |
| KR101625459B1 (en) * | 2015-02-27 | 2016-05-30 | 주식회사 케이씨텍 | Chemical mechanical polishing apparatus and method thereof |
| CN217877624U (en) * | 2022-07-01 | 2022-11-22 | 芯湛半导体设备(上海)有限公司 | Thickness detection device for wafer production |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115808145A (en) * | 2022-12-02 | 2023-03-17 | 江苏希太芯科技有限公司 | Multipoint measuring device and method for wafer thickness |
| CN116978855A (en) * | 2023-01-09 | 2023-10-31 | 邢建华 | Calibration system for multipoint measurement of thickness of copper layer of wafer |
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