CN116013799A

CN116013799A - Wafer testing device

Info

Publication number: CN116013799A
Application number: CN202211558643.9A
Authority: CN
Inventors: 蔡昱; 陈在; 江川; 张东响
Original assignee: Anhui Heavenly Electronic Polytron Technologies Inc
Current assignee: Anhui Heavenly Electronic Polytron Technologies Inc
Priority date: 2022-12-06
Filing date: 2022-12-06
Publication date: 2023-04-25

Abstract

The invention discloses a wafer testing device which comprises a workbench, a distance measuring mechanism, a thickness measuring mechanism and an adsorption mechanism, wherein the surface of the workbench is provided with vent holes and two circle center positioning plates which are arranged in a V shape; the distance measuring mechanism comprises two distance sensors which are opposite to the rotating arrangement; the thickness measuring mechanism comprises a power mechanism, a sliding block which is slidably arranged above the workbench, and a An Zhuaipan which is rotatably arranged below the sliding block, wherein the axis of horizontal movement of the sliding block is opposite to the V-shaped bisector which is formed by the two circle center locating plates below, a plurality of guide rods are arranged on the bottom surface annular array of the installation turntable, a plurality of equidistant distance sensors are connected below the guide rods through telescopic components, and the power mechanism can synchronously drive the distance between two adjacent distance sensors to change at equal intervals; the adsorption mechanism comprises an adsorption block, the top surface of which is provided with an air suction cavity and is connected with an air suction machine, and the air suction cavity can be opposite to the local vent hole.

Description

Wafer testing device

Technical Field

The invention relates to the technical field of testing devices, in particular to a wafer testing device.

Background

Wafers are the basic material for manufacturing semiconductor devices, and high purity polysilicon is pulled to form cylindrical single crystal silicon. The wafer is subjected to a series of manufacturing processes to form a very tiny circuit structure, and then subjected to cutting, packaging, testing and other procedures to form a chip, so that the chip is widely applied to various electronic equipment. In the process flow of wafer processing, the wafer edge obtained by slicing needs to be rounded so that the edge can form a certain contour shape, thereby improving the mechanical strength and the processability of the wafer, and the diameter of the wafer needs to be polished to a specific size. In the same way, the surface of the wafer is subjected to planarization treatment and certain thinning is performed, so that the thickness and the flatness of the wafer meet the requirements. Therefore, it is necessary to detect dimensional parameters such as the diameter and thickness of the wafer.

However, the prior device has the following defects on the size testing device of the wafer:

(1) The wafer needs to be positioned at the circle center in the testing process, the manual positioning precision is low, time and labor are wasted, the wafer needs to be fixed by means of the clamping device, the wafer is prevented from moving in the testing process, and the wafer is easy to wear in the clamping process;

(2) Some devices adjust the point position of a distance sensor for detecting the thickness of a wafer for many times by moving a connecting rod, on one hand, the devices are difficult to be suitable for testing wafers with various sizes; on the other hand, the distribution of the points detected by the distance sensor is uneven, so that the detection accuracy is reduced, and therefore, the efficiency of the wafer test in the prior art is low.

Disclosure of Invention

Therefore, the present invention provides a wafer testing apparatus to solve the above-mentioned drawbacks of the prior art.

A wafer testing apparatus, comprising:

the workbench is characterized in that two circle center positioning plates which are arranged in a V shape are arranged on the surface of the workbench, and a plurality of vent holes are uniformly distributed on the surface of the workbench;

the distance measuring mechanism comprises a first distance sensor and a second distance sensor which are arranged opposite to each other and can rotate in the horizontal plane along the midpoint of the connecting line of the first distance sensor and the second distance sensor, and the first distance sensor and the second distance sensor are connected with the same controller;

the thickness measuring mechanism comprises a power mechanism, a supporting plate arranged above a workbench, a sliding block horizontally and slidably arranged on the supporting plate and An Zhuaipan rotatably arranged below the sliding block, wherein the axis of horizontal movement of the sliding block is opposite to the upper and lower bisectors of the V-shaped center positioning plates below the sliding block, a plurality of guide rods are arranged on the annular array of the bottom surface of the safety turntable, a plurality of third distance sensors which are equidistantly arranged are connected below the guide rods through telescopic components, and the power mechanism can synchronously drive the distance between two adjacent third distance sensors on the same telescopic component to be equidistantly changed;

the adsorption mechanism comprises an adsorption block which is detachably adsorbed below the workbench, the top surface of the adsorption block is provided with an air suction cavity, the air suction cavity can be opposite to the partial air vent, and the air suction cavity is connected with an air suction machine through an air suction pipe.

Preferably, the height of the circle center positioning plate is smaller than the thickness of the wafer on the workbench.

Preferably, a first motor is installed at the center of the bottom surface of the workbench, a rotating arm is installed on a rotating shaft of the first motor, the rotating shaft is connected to the center of the rotating arm, a first distance sensor and a second distance sensor are connected to two ends of the rotating arm, and the first motor is connected to the controller.

Preferably, the lower part of the supporting plate horizontally rotates and installs a threaded rod, one end of the threaded rod is driven to rotate by a second motor, the second motor is connected with the controller, the sliding block is sleeved on the threaded rod through a lead screw nut, and a horizontal guide rail for providing guidance for the sliding block is arranged below the supporting plate and parallel to the threaded rod.

Preferably, the power unit is including rotating the vertical guide cylinder of installing the slider below, an Zhuaipan installs the below of vertical guide cylinder, the inside vertical slip of vertical guide cylinder is provided with the guide block, vertically install the lift cylinder on the slider, set up in the backup pad and run through the groove of stepping down of lift cylinder, the lower extreme ejector pin movable mounting of lift cylinder is in on the guide block, the hypomere lateral wall of guide block constructs the arc guide rail that contracts from top to bottom to the inboard, set up a plurality of for the guide way that provides the direction of the removal of guide bar on the carousel, the inner of guide bar is in through the leading wheel butt pressure the lateral wall of arc guide rail, the inboard of guide bar with connect through reset spring between the inboard of guide way, the both ends of flexible subassembly are connected the lateral wall of guide way with the distal end of guide bar.

Preferably, the top end of the vertical guide cylinder is mounted on the lower surface of the sliding block through a bearing.

Preferably, the telescopic assembly comprises a first connecting rod group and a second connecting rod group which is arranged in a crossing manner with the first connecting rod group, the first connecting rod group comprises a plurality of first connecting rods which are parallel to each other, the second connecting rod group comprises a plurality of second connecting rods which are parallel to each other and are arranged in a crossing manner with the first connecting rods, the crossing position of the first connecting rods and the second connecting rods is hinged, the third distance sensor is arranged at the hinging position of the first connecting rods and the second connecting rods, and the first connecting rods and the second connecting rods are connected with each other to form a parallelogram telescopic structure.

Preferably, a gear ring is arranged on the side wall of the vertical guide cylinder, a gear meshed with the gear ring is arranged on one side of the gear ring, the gear is driven to rotate by a third motor arranged on the sliding block, and the third motor is connected with the controller.

The invention has the following advantages:

according to the invention, through the cooperation among the workbench, the distance measuring mechanism, the thickness measuring mechanism and the adsorption mechanism, a wafer is firstly placed on the workbench, the straight line through which the circle center of the wafer passes is limited, and the lower part of the wafer is adsorbed through the adsorption mechanism, so that the movement of the wafer is avoided; the radius and roundness parameters of the wafer are measured through the two distance sensors which are arranged in a rotating and opposite mode, the coordinate of the circle center of the wafer is calculated, the thickness measuring mechanism is driven to move to the position right above the circle center of the wafer, the distance of the distance sensors for measuring the thickness is adjusted to adapt to the diameter of the wafer, the point positions for measuring the thickness are distributed relatively uniformly, the accuracy of the thickness measurement of the wafer is improved, and the testing efficiency of the wafer is improved on the whole.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present invention;

FIG. 2 is a schematic view of a partial cross-sectional structure of the present invention;

FIG. 3 is an enlarged schematic view of the portion A of FIG. 2 according to the present invention;

FIG. 4 is a schematic diagram of the top surface structure of the ranging mechanism according to the present invention;

fig. 5 is a schematic view of the structure of the back of the adsorption mechanism and the distance measuring mechanism of the present invention.

In the figure:

1-a workbench; 2-a ranging mechanism; 3-a controller; 4-an adsorption mechanism; 10-wafer;

101-a circle center positioning plate; 102-vent holes;

201-a first motor; 202-rotating shaft; 203-rotating arm; 204-a first distance sensor; 205-a second distance sensor; 206-a controller;

301-supporting a plate; 302-a slider; 303-lifting air cylinders; 304-a second motor; 305-a threaded rod; 306-a lead screw nut; 307-horizontal guide rails; 308-a third distance sensor; 309-guide blocks; 310-vertical guide cylinder; 311-arc-shaped guide rails; 312-guide wheels; 313-guide bar; 314-guide slots; 315-telescoping assembly; 316-a third motor; 317-gear; 318-ring gear; 319-An Zhuaipan; 320-a return spring; 321-a yielding groove; 322-bearings;

401-adsorbing blocks; 402-suction pipe; 403-aspirator.

Detailed Description

The invention is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the invention easy to understand.

As shown in fig. 1 to 5, the present invention provides a wafer testing apparatus, which includes a workbench 1, a ranging mechanism 2, a thickness measuring mechanism 3 and an adsorption mechanism 4.

Wherein, the surface of the workbench 1 is provided with two circle center positioning plates 101 which are arranged in a V shape, and the surface of the workbench 1 is also uniformly distributed with a plurality of vent holes 102;

wherein the distance measuring mechanism 2 comprises a first distance sensor 204 and a second distance sensor 205 which are arranged opposite to each other and can rotate in the horizontal plane along the midpoint of the connecting line of the two. Specific:

a first motor 201 is installed at the center of the bottom surface of the workbench 1, a rotating arm 203 is installed on a rotating shaft 202 of the first motor 201, the rotating shaft 202 is connected to the center of the rotating arm 203, a first distance sensor 204 and a second distance sensor 205 are connected to two ends of the rotating arm 203, and the first motor 201 is connected to the controller 206.

The first distance sensor 204 and the second distance sensor 205 are both connected to the same controller 206;

the height of the center positioning plate 101 is smaller than the thickness of the wafer 10 on the workbench 1. So that the center positioning plate 101 does not interfere with the measurement of the sidewall of the wafer 10 by the first distance sensor 204 and the second distance sensor 205.

The thickness measuring mechanism 3 comprises a power mechanism, a supporting plate 301 arranged above the workbench 1, a sliding block 302 horizontally and slidably arranged on the supporting plate 301, and a rotating disk 319 rotatably arranged below the sliding block 302. The axis of the horizontal movement of the sliding block 302 is opposite to the bisector of the V-shape of the two lower center positioning plates 101 vertically and parallel. So that the slider 302 can move in a diametrical direction through the center of the wafer 10. Specific:

the lower part of the supporting plate 301 is horizontally rotatably provided with a threaded rod 305, one end of the threaded rod 305 is driven to rotate by a second motor 304, the second motor 304 is connected with the controller 206, the sliding block 302 is sleeved on the threaded rod 305 by a screw nut 306, and the lower part of the supporting plate 301 is parallel to the threaded rod 305 and is provided with a horizontal guide rail 307 for guiding the sliding block 302.

The bottom surface annular array of An Zhuaipan 319 is provided with a plurality of guide bars 313, the below of guide bar 313 is connected with a plurality of equidistant third distance sensor 308 that set up through flexible subassembly 315. Specific:

the telescopic component 315 comprises a first connecting rod group and a second connecting rod group which is arranged in a crossing manner with the first connecting rod group, the first connecting rod group comprises a plurality of first connecting rods which are parallel to each other, the second connecting rod group comprises a plurality of second connecting rods which are parallel to each other and are arranged in a crossing manner with the first connecting rods, the crossing position of the first connecting rods and the second connecting rods is hinged, the third distance sensor 308 is arranged at the hinged position of the first connecting rods and the second connecting rods, and the first connecting rods and the second connecting rods are connected with each other to form a parallelogram telescopic structure.

The power mechanism can synchronously drive and install two adjacent third distance sensors 308 on the same telescopic assembly 315 to change at equal intervals. Specific:

the power mechanism comprises a vertical guide cylinder 310 rotatably mounted below the sliding block 302, and the top end of the vertical guide cylinder 310 is mounted on the lower surface of the sliding block 302 through a bearing 322. An Zhuaipan 319 are installed the below of vertical guiding tube 310, the inside vertical slip of vertical guiding tube 310 is provided with guide block 309, install the lift cylinder 303 on the slider 302 vertically, set up on the backup pad 301 and run through the groove 321 that gives way of lift cylinder 303, the lower extreme ejector pin movable mounting of lift cylinder 303 is in on the guide block 309, the hypomere lateral wall of guide block 309 constructs from top to bottom to the arc guide rail 311 of inside shrink, set up on An Zhuaipan 319 a plurality of guide slots 314 that provide the direction for the removal of guide bar 313, the inner of guide bar 313 is supported and is pressed through leading wheel 312 the lateral wall of arc guide rail 311, be connected through reset spring 320 between the inboard of guide bar 313 and the inboard of guide slot 314, the both ends of expansion and contraction assembly 315 are connected the lateral wall of guide slot 314 with the distal end of guide bar 313.

In order to make the third distance sensor 308 have more measurement points, the measurement accuracy is improved. The side wall of the vertical guide cylinder 310 is provided with a gear ring 318, one side of the gear ring 318 is provided with a gear 317 meshed with the gear ring 318, the gear 317 is driven to rotate by a third motor 316 mounted on the sliding block 302, and the third motor 316 is connected with the controller 206.

The adsorption mechanism 4 includes a detachable adsorption block 401 that is adsorbed below the workbench 1, and an air suction cavity (not shown in the figure) is disposed on the top surface of the adsorption block 401, where the air suction cavity can be opposite to the partial ventilation hole 102, and the air suction cavity is connected to an air suction machine 403 through an air suction pipe 402.

The working principle of the device of the invention is as follows:

1. and (3) feeding:

the wafer 10 is placed on the workbench 1, and the two side walls of the wafer 10 are tangent to two circle center positioning plates 101 which are arranged on the workbench 1 and are in V-shaped angles. So that the center of the circle of the wafer 10 can fall on a predetermined axis.

Then, the suction block 401 is moved to a position facing the wafer 10 above the table 1, the suction pump 403 is started, and the suction pipe 402 is used to generate negative pressure on the air vent 102 below the wafer 10 communicated with the suction cavity, thereby sucking the wafer 10 on the surface of the table 1 and avoiding random movement of the wafer 10.

2. Wafer degree detection and centering:

the first distance sensor 204 and the second distance sensor 205 are disposed opposite to each other to measure the distance between the first and second sensors and the outer side wall of the wafer 10. Then, the first motor 201 is started, the rotating shaft 202 of the first motor 201 drives the rotating arm 203 to rotate, and the first distance sensor 204 and the second distance sensor 205 mounted at two ends of the rotating arm 203 rotate along with the rotating arm 203 by a certain angle and then measure the distance between the rotating arm and the side wall of the corresponding side wafer 10 again.

The controller 206 may determine the roundness of the wafer 10, calculate the radius of the wafer 10, and calculate the center coordinates of the wafer 10 according to the values measured by the first distance sensor 204 and the second distance sensor 205.

3. And (3) detecting the thickness of the wafer:

the controller 206 then instructs the second motor 304 to operate. Since the second motor 304 drives the slider 302 to move horizontally to just above the center of the circle of the wafer 10 on the table 1. Specific:

the second motor 304 drives the threaded rod 305 to rotate, the sliding block 302 sleeved on the threaded rod 305 through the lead screw nut 306 horizontally slides under the guiding action of the horizontal guide rail 307 until the sliding block 302 slides to the position right above the circle center of the wafer 10, and the sliding block 302 stops moving. At this time, the intervals between the respective third distance sensors 308 for measuring the thickness of the wafer 10 are adjusted according to the diameter of the wafer 10. Specific:

the ejector rod of the lifting cylinder 303 is driven to descend, the guide block 309 installed at the lower end of the lifting cylinder 303 is vertically lowered under the guide of the vertical guide cylinder 310, and the arc-shaped guide rail 311 provided at the lower side wall of the guide block 309 presses the guide bar 313 connected to the guide wheel 312 at one side in the process of moving down, and the return spring 320 is in a compressed state. The guide rods 313 are extended along the guide grooves 314, the length of the telescopic assembly 315 is increased, the interval between the third distance sensors 308 equally mounted on the telescopic assembly 315 is increased, and the third distance sensor 308 located at the outermost side is opposite to the outer eave of the lower wafer 10. The distance from the surface of the underlying wafer 10 is detected by a third distance sensor 308. And the thickness of each part of the wafer 10 is calculated according to the difference between the height of the wafer and the surface of the worktable 1.

After data are collected, the third motor 316 drives the gear 317 to rotate, the gear 317 drives the vertical guide cylinder 310 where the gear 317 is meshed with the gear ring 318 to rotate, and An Zhuaipan 319 installed below the vertical guide cylinder 310 rotates by a certain angle with the center of a circle, so that the third distance sensor 308 can measure more surface thickness of the wafer 10 after rotating, and the accuracy of data collection is improved.

When the thickness measurement is completed, the lifting cylinder 303 is reset, and each third distance sensor 308 is restored to the initial contracted state by the elastic force of the reset spring 320.

According to the invention, through the cooperation among the workbench 1, the distance measuring mechanism 2, the thickness measuring mechanism 3 and the adsorbing mechanism 4, the wafer 10 is firstly placed on the workbench 1, the straight line through which the circle center of the wafer 10 passes is limited, and the lower part of the wafer 10 is adsorbed through the adsorbing mechanism 4, so that the movement of the wafer is avoided; the radius and roundness parameters of the wafer are measured through the two distance sensors which are arranged in a rotating and opposite mode, the coordinates of the circle center of the wafer are calculated, the thickness measuring mechanism 3 is driven to move to the position right above the circle center of the wafer 10, the distance of the distance sensors for measuring the thickness is adjusted to adapt to the diameter of the wafer, the point positions for measuring the thickness are distributed relatively uniformly, the accuracy of the thickness measurement of the wafer is improved, and the testing efficiency of the wafer is improved on the whole.

While the invention has been described in detail in the foregoing general description and specific examples, it will be apparent to those skilled in the art that modifications and improvements can be made thereto. Accordingly, such modifications or improvements may be made without departing from the spirit of the invention and are intended to be within the scope of the invention as claimed.

Claims

1. The wafer testing device is characterized in that: comprising

The workbench (1), the surface of the workbench (1) is provided with two circle center positioning plates (101) which are arranged in a V shape, and a plurality of vent holes (102) are uniformly distributed on the surface of the workbench (1);

the distance measuring mechanism (2) comprises a first distance sensor (204) and a second distance sensor (205) which are arranged opposite to each other and can rotate in the horizontal plane along the midpoint of the connecting line of the first distance sensor and the second distance sensor (205), and the first distance sensor (204) and the second distance sensor (205) are connected with the same controller (206);

the thickness measuring mechanism (3) comprises a power mechanism, a supporting plate (301) arranged above a workbench (1), a sliding block (302) horizontally and slidably arranged on the supporting plate (301) and a An Zhuaipan (319) rotatably arranged below the sliding block (302), wherein the axis of horizontal movement of the sliding block (302) is vertically opposite to and parallel to the bisectors of V-shaped shapes formed by two circle center positioning plates (101) below, a plurality of guide rods (313) are annularly arranged on the bottom surface of the An Zhuaipan (319), a plurality of third distance sensors (308) which are equidistantly arranged are connected below the guide rods (313) through a telescopic assembly (315), and the power mechanism can synchronously drive the spacing between two adjacent third distance sensors (308) on the same telescopic assembly (315) to be equidistantly changed;

the adsorption mechanism (4) comprises an adsorption block (401) which is detachably adsorbed below the workbench (1), an air suction cavity is formed in the top surface of the adsorption block (401), the air suction cavity can be opposite to the air vent (102), and the air suction cavity is connected with an air suction machine (403) through an air suction pipe (402).

2. The wafer test apparatus of claim 1, wherein: the height of the circle center positioning plate (101) is smaller than the thickness of the wafer (10) on the workbench (1).

3. The wafer test apparatus of claim 1, wherein: the workbench is characterized in that a first motor (201) is arranged in the center of the bottom surface of the workbench (1), a rotating arm (203) is arranged on a rotating shaft (202) of the first motor (201), the rotating shaft (202) is connected to the center of the rotating arm (203), a first distance sensor (204) and a second distance sensor (205) are connected to two ends of the rotating arm (203), and the first motor (201) is connected to the controller (206).

4. The wafer test apparatus of claim 1, wherein: the utility model discloses a motor control device for a motor vehicle, including backup pad (301), screw rod (305) are installed in the below horizontal rotation of backup pad (301), the one end of screw rod (305) is passed through second motor (304) drive and is rotated, second motor (304) are connected controller (206), slider (302) suit is in on screw rod (305) through lead screw nut (306), the below of backup pad (301) is on a parallel with screw rod (305) is provided with for slider (302) provide horizontal guide rail (307) of direction.

5. The wafer test apparatus of claim 1, wherein: the power mechanism comprises a vertical guide cylinder (310) which is rotatably arranged below a sliding block (302), an Zhuaipan (319) is arranged below the vertical guide cylinder (310), a guide block (309) is vertically arranged inside the vertical guide cylinder (310) in a sliding manner, a lifting cylinder (303) is vertically arranged on the sliding block (302), a yielding groove (321) penetrating through the lifting cylinder (303) is formed in a supporting plate (301), a lower ejector rod of the lifting cylinder (303) is movably arranged on the guide block (309), the side wall of the lower section of the guide block (309) is configured to be an arc-shaped guide rail (311) which is contracted from top to bottom to the inner side, a plurality of guide grooves (314) which are used for providing guide for the movement of the guide rod (313) are formed in the An Zhuaipan (319), the inner end of the guide rod (313) is propped against the side wall of the arc-shaped guide rail (311) through a guide wheel (312), the inner side of the guide rod (313) is connected with the two ends of the guide rod (313) through a reset spring (320), and the two ends of the guide rod (314) are connected with the side wall of the guide rod (313).

6. The wafer test apparatus of claim 5, wherein: the top end of the vertical guide cylinder (310) is arranged on the lower surface of the sliding block (302) through a bearing (322).

7. A wafer test apparatus according to claim 1 or 5, wherein: the telescopic component (315) comprises a first connecting rod group and a second connecting rod group which is arranged in a crossing manner with the first connecting rod group, the first connecting rod group comprises a plurality of first connecting rods which are parallel to each other, the second connecting rod group comprises a plurality of second connecting rods which are parallel to each other and are arranged in a crossing manner with the first connecting rods, the crossing position of the first connecting rods and the crossing position of the second connecting rods are hinged, the third distance sensor (308) is arranged at the hinging position of the first connecting rods and the second connecting rods, and the first connecting rods and the second connecting rods are connected with each other to form a parallelogram telescopic structure.

8. The wafer test apparatus of claim 5, wherein: the side wall of the vertical guide cylinder (310) is provided with a gear ring (318), one side of the gear ring (318) is provided with a gear (317) meshed with the gear ring (318), the gear (317) is driven to rotate through a third motor (316) installed on the sliding block (302), and the third motor (316) is connected with the controller (206).