CN211017041U - Positioning and edge-searching device for wafer - Google Patents
Positioning and edge-searching device for wafer Download PDFInfo
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- CN211017041U CN211017041U CN202021040932.6U CN202021040932U CN211017041U CN 211017041 U CN211017041 U CN 211017041U CN 202021040932 U CN202021040932 U CN 202021040932U CN 211017041 U CN211017041 U CN 211017041U
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Abstract
The utility model discloses a positioning and edge-searching device for wafers, which belongs to the technical field of semiconductors and solves the technical problem that the prior positioning and edge-searching device can not simultaneously realize the requirements of multiple functions of circle center positioning, edge searching, notch rotation to an appointed position and the like of the wafer, and the positioning and edge-searching device comprises a base; the detection unit comprises a first driving mechanism arranged on the base and a detection mechanism which can rotate around the central axis of the base and can stretch along the radial direction of the base; the centering unit comprises a rotating shaft which is arranged on the first driving mechanism and can rotate and a plurality of telescopic positioning structures which are arranged on the side wall of the rotating shaft at intervals; the vacuum chuck device is arranged on the rotating shaft, can rotate and can move along the axial direction of the base. The utility model discloses a limit device is sought in location can realize the location of wafer simultaneously, seek the limit, the breach position rotates the demand to a plurality of functions such as assigned position.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor, concretely relates to limit device is sought in location of wafer.
Background
A wafer (wafer) refers to a substrate (also called a "wafer") used to fabricate semiconductor transistors or integrated circuits. Since it is a crystalline material, it is called a wafer because it is circular in shape. Currently, for 8 inch (200mm), 12 inch (300mm) and even larger wafers, the semiconductor industry typically locates the wafer by Notch (Notch) to achieve edge finding of the wafer. The Notch is also called a Notch groove or a V-shaped groove, and refers to a V-shaped Notch formed on a wafer.
The wafer needs to be frequently turned over between different carrying disks and wafer boxes in the manufacturing process, and because the position of the wafer can deviate in millimeter level when the manipulator takes and places the wafer from the clamping groove of the wafer box, the wafer is moved to the carrying platform, the problems of inaccurate wafer positioning, eccentricity, unfixed notch direction and the like can be caused, and the notch direction of the wafer in the wafer box needs to be adjusted to a fixed position according to the requirements of different customers after the wafer is polished and cleaned and before the wafer is packed and delivered to the customers. Therefore, in order to meet the customer requirements and ensure the good rate of each process, the processes of circle center finding, edge finding, positioning and the like are continuously performed on the wafer. The process of aligning the wafer is to adjust the center of a circle to a designated position by a certain method, and the notch rotates to a designated direction, namely the process of aligning the wafer comprises two aligning processes of the center of the circle and the notch of the wafer.
The existing positioning edge-searching device is generally placed on a vacuum chuck, the vacuum chuck can move, the wafer is rotated and an optical instrument is combined to perform two processes of circle center positioning and edge searching of the wafer, or the two processes of circle center positioning and edge searching of the wafer can be performed separately, but the existing positioning edge-searching device generally cannot meet the requirements of multiple functions of circle center positioning, edge searching, notch rotation to an appointed position and the like of the wafer at the same time.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problems existing in the prior art, the utility model provides an edge device is sought in location of wafer. The to-be-solved technical problem of the utility model is realized through following technical scheme:
a positioning and edge-searching device for a wafer comprises:
a base;
the detection unit comprises a first driving mechanism arranged on the base and a detection mechanism which can rotate around the central axis of the base and can stretch along the radial direction of the base;
the centering unit comprises a rotating shaft which is arranged on the first driving mechanism and can rotate and a plurality of telescopic positioning structures which are arranged on the side wall of the rotating shaft at intervals;
the vacuum chuck device is arranged on the rotating shaft, and the vacuum chuck device can rotate and can move along the axial direction of the base.
In an embodiment of the present invention, the detection mechanism includes:
the connecting arm is of a hollow structure, and a first end of the connecting arm is connected with the first driving mechanism;
a first connecting piece movable in the hollow structure of the connecting arm, a first end of the first connecting piece being disposed in the hollow structure of the second end of the connecting arm;
the strut is arranged perpendicular to the first connecting piece, and the first end of the strut is connected with the second end of the first connecting piece;
the detection module is perpendicular to the support column, and the first end of the detection module is connected with the second end of the support column.
In an embodiment of the present invention, the detection module includes:
the mounting seat is arranged perpendicular to the support column and connected with the second end of the support column;
an edge-finding sensor disposed on a lower surface of the mounting base.
In an embodiment of the present invention, the detection module further includes a code reader, and the code reader is disposed on the lower surface of the mounting seat.
In one embodiment of the present invention, the device further comprises a fixed shaft and a second driving mechanism, wherein,
the fixed shaft is arranged on the first driving mechanism, the second driving mechanism is arranged on the fixed shaft and located below the rotating shaft, and the second driving mechanism drives the rotating shaft to rotate around the central axis of the rotating shaft.
In an embodiment of the present invention, the rotation shaft has a hollow structure, and the vacuum chuck device includes:
a lifting structure movable in the hollow structure of the rotating shaft, a first end of the lifting structure being disposed in the hollow structure of the rotating shaft;
the carrying platform is arranged on the lifting structure;
the air holes penetrate through the carrying platform along the axial direction of the carrying platform;
and the gaskets are arranged on the upper edges of the air holes.
In an embodiment of the present invention, the positioning structure includes:
the first end of the second connecting piece is connected with the side wall of the rotating shaft;
a third connector movable within the hollow structure of the second connector, a first end of the third connector being disposed within the hollow structure of the second end of the second connector;
a finger disposed perpendicular to the third link, a first end of the finger connected to a second end of the third link.
In one embodiment of the invention, the second end of the finger is tapered.
In an embodiment of the invention, the finger inner side wall is provided with a distance measuring sensor.
In an embodiment of the present invention, the wafer transferring device further comprises a manipulator for grabbing the wafer onto the vacuum chuck device or grabbing the wafer from the vacuum chuck device to a set position.
The utility model has the advantages that:
the utility model provides a limit device is sought in location because be provided with the detecting element that can detect the breach, can carry out the centering unit and the vacuum chuck device of fixing a position to the wafer centre of a circle, consequently can realize the location of wafer simultaneously, seek the limit, the rotatory demand to a plurality of functions such as assigned position of breach position.
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Drawings
Features, advantages and technical and industrial significance of exemplary embodiments of the present invention will be described below with reference to the accompanying drawings, wherein like reference numerals denote like elements, and in which:
fig. 1 schematically illustrates a perspective view of a positioning and edge-finding device for a wafer according to an embodiment of the present invention;
fig. 2 is a perspective view schematically illustrating a positioning and edge-finding device for a wafer in an operating state according to an embodiment of the present invention;
fig. 3 schematically shows a structural side view of a positioning and edge-finding device for a wafer in an operating state according to an embodiment of the present invention;
fig. 4 schematically shows a front view of the structure of the detection module according to an embodiment of the present invention;
figure 5 schematically illustrates a side view of a positioning structure of an embodiment of the invention;
fig. 6 schematically shows a side view of a positioning structure according to another embodiment of the present invention.
Description of reference numerals:
a base-10; a detection unit-11; a centering unit-12; vacuum chuck means-13; a wafer-14; notch-15; a fixed shaft-16; a second drive mechanism-17; a robot-18; a first drive mechanism-111; -a detection mechanism-112; a rotating shaft-121; -a positioning structure-122; a lifting structure-131; a stage-132; air holes-133; a washer-134; a connecting arm-1121; a first connector-1122; a post-1123; a detection module-1124; a second connecting member-1221; a third connector-1222; finger-1223; ranging sensor-1224; a mount-11241; edge finding sensor-11242; a code reader-11243.
Detailed Description
The present invention will be described in further detail with reference to specific examples, but the present invention is not limited thereto.
Example one
Please refer to fig. 1, fig. 2 and fig. 3, in which fig. 1 schematically illustrates a perspective view of a positioning edge finder for a wafer according to an embodiment of the present invention, fig. 2 schematically illustrates a perspective view of a positioning edge finder for a wafer in an operating state according to an embodiment of the present invention, and fig. 3 schematically illustrates a side view of a positioning edge finder for a wafer in an operating state according to an embodiment of the present invention. The embodiment of the utility model provides a positioning and edge-searching device for wafer, which comprises a base 10, a detecting unit 11, a centering unit 12 and a vacuum chuck device 13, wherein, the detecting unit 11 comprises a first driving mechanism 111 arranged on the base 10 and a detecting mechanism 112 which can rotate around the central axis of the base 10 and can stretch along the radial direction of the base 10, the detecting mechanism 112 is used for detecting the position of a notch 15 at the edge of a wafer 14 so as to realize edge-searching for the wafer 14, the centering unit 12 comprises a rotating shaft 121 which is arranged on the first driving mechanism 111 and can rotate and a plurality of telescopic positioning structures 122 which are arranged on the side wall of the rotating shaft 121 at intervals, the positioning structures 122 are used for positioning the center of the wafer 14, the vacuum chuck device 13 is arranged on the rotating shaft 121, and the vacuum chuck device 13 can rotate and can move along the axial direction of the base 10, the vacuum chuck device 13 is used for sucking the wafer 14.
Referring to fig. 1, fig. 2 and fig. 3, in the present embodiment, when positioning and edge finding are performed on the wafer 14, the wafer 14 may be placed on the vacuum chuck device 13, before the vacuum chuck device 13 does not adsorb the wafer 14, the centering unit 12 may be used to perform center positioning on the wafer 14, since the size of the wafer 14 is known, so the centering unit 12 of the present embodiment may find the center position of the wafer 14 in two different ways, the first way is to adjust all the positioning structures 122 to the area surrounded by the inner sidewalls of all the positioning structures 122 according to the diameter of the wafer 14, the size of the area is the same as the diameter of the wafer 14, since the vacuum chuck device 13 can move along the axial direction of the base 10, the wafer 14 placed on the vacuum chuck device 13 can be driven to descend by descending the vacuum chuck device 13, and when the area is descended to the area surrounded by the inner sidewalls of all the positioning structures 122, the wafer 14 can slide into the area surrounded by the positioning structure 122 and having the same diameter as the wafer 14 along the edge of the inner side wall of the positioning structure 122, because the vacuum chuck device 13 and the centering unit 12 are coaxial, the process can position the center of the circle of the wafer 14, the second is to adjust the area surrounded by the inner side walls of all the positioning structures 122 to be larger than the diameter of the wafer 14, then the wafer 14 on the vacuum chuck device 13 is lowered to the position suitable for the positioning structure 122 to position the center of the circle, because the positioning structure 122 can also extend and retract along the radial direction of the base 10, at this time, the positioning structure 122 can be retracted inward until the inner side wall of the positioning structure 122 can contact with the wafer 14, and at this time, the positioning of the center of the circle of the wafer 14 can be completed, in this embodiment, the specific structures of the vacuum chuck device 13 and the positioning structure 122, the skilled person can select it according to specific needs.
In addition, after the center of the wafer 14 is positioned by the centering unit 12 of this embodiment, the detecting unit 11 of this embodiment may be used to detect the position of the notch 15 on the edge of the wafer 14, before detecting the position of the notch 15 on the edge of the wafer 14, the vacuum chuck device 13 needs to be used to adsorb the wafer 14 with the center of the circle positioned on the vacuum chuck device 13, and then the detecting unit 11 may be used to detect the position of the notch 15 on the edge of the wafer 14, the detecting unit 11 of this embodiment may detect the position of the notch 15 on the edge of the wafer 14 in two different ways, the first way is to adjust the detecting mechanism 112 to a proper position according to the diameter of the wafer 14, and then the vacuum chuck device 13 may be rotated, and the vacuum chuck device 13 may drive the vacuum chuck device 13 to rotate through the rotation effect of the rotating shaft 121, the wafer 14 on the vacuum chuck device 13 can be driven to rotate in the rotation process of the vacuum chuck device 13, at this time, the detection unit 11 can be used to detect the position of the notch 15 on the edge of the wafer 14, when the position of the notch 15 on the edge of the wafer 14 just rotates to the position that can be detected by the detection unit 11, the detection of the position of the notch 15 on the edge of the wafer 14 is realized, the second mode is that the first driving mechanism 111 drives the detection mechanism 112 to rotate, but the wafer 14 is fixed, when the detection mechanism 112 just rotates to the position of the notch 15 on the edge of the wafer 14, the detection of the position of the notch 15 on the edge of the wafer 14 can be realized, and the second mode does not need to rotate the wafer 14, so that the phenomena that the wafer 14 is damaged and secondary pollution is caused to the wafer 14 by the vibration of the wafer 14 in the process of detecting the position of the notch 15 on the edge of the, in this way, damage to the edge and surface of the wafer 14 can be minimized, and the yield per process can be guaranteed, wherein the first driving mechanism 111 can be a rotary driving device equipped with a servo motor.
In addition, the positioning edge-searching device of this embodiment may further rotate the position of the notch 15 of the wafer 14 to a designated position, and after the center of the circle of the wafer 14 is positioned and the position of the notch 15 of the wafer 14 is detected, if the position of the notch 15 of the wafer 14 needs to be rotated to the designated position, the rotating shaft 121 may be controlled to rotate to drive the wafer 14 on the vacuum chuck device 13 to rotate, so as to control the position of the notch 15 of the wafer 14 to rotate to the designated position.
In an embodiment, referring to fig. 1, fig. 2 and fig. 3, the detecting mechanism 112 may include a connecting arm 1121 having a hollow structure, a first connecting member 1122 capable of moving within the hollow structure of the connecting arm 1121, a supporting column 1123 perpendicular to the first connecting member 1122, and a detecting module 1124 perpendicular to the supporting column 1123, wherein a first end of the connecting arm 1121 is connected to the first driving mechanism 111, a first end of the first connecting member 1122 is disposed within the hollow structure of a second end of the connecting arm 1121, a first end of the supporting column 1123 is connected to a second end of the first connecting member 1122, a first end of the detecting module 1124 is connected to a second end of the supporting column 1123, and the detecting module 1124 is configured to detect a position of a notch 15 on an edge of the wafer 14, so as to realize edge finding of the wafer 14.
In this embodiment, a first end of the connection arm 1121 is connected to the first driving mechanism 111, so that the first driving mechanism 111 can drive the connection arm 1121 to rotate around a central axis of the base 10, and when the connection arm 1121 rotates, the first connection member 1122, the pillar 1123 and the detection module 1124 can be driven to rotate by the first driving mechanism 111, so that the detection module 1124 can detect the position of the notch 15 on the edge of the wafer 14 during rotation when the wafer 14 is not moving, in this case, the second end of the connection arm 1121 is provided with a hollow structure, and the first connection member 1122 can move in the hollow structure of the connection arm 1121, so that the telescopic movement of the pillar 1123 and the detection module 1124 can be realized by the movement of the first connection member 1122 in the hollow structure of the connection arm 1121, for adjusting the position of the detection module 1124, the first connecting member 1122 may reciprocate in the hollow structure of the connecting arm 1121 by using pneumatic or hydraulic means, for example, an air cylinder may be installed in the hollow structure of the connecting arm 1121, and the first connecting member 1122 is connected to the air cylinder to drive the first connecting member 1122 to reciprocate in the hollow structure of the connecting arm 1121, so as to drive the support 1123 and the detection module 1124 to reciprocate.
Further, referring to fig. 4, the detecting module 1124 includes a mounting base 11241 and an edge finding sensor 11242 perpendicular to the support column 1123, wherein the mounting base 11241 is connected to the second end of the support column 1123, the edge finding sensor 11242 is disposed on the lower surface of the mounting base 11241, and the edge finding sensor 11242 is configured to find an edge of the wafer 14 to detect a position of the notch 15 on the edge of the wafer 14. The edge finder sensor 11242 used in this embodiment may be any of various commercially available edge finder sensors, such as those of type RA 120-C01.
Further, referring to fig. 4, the detecting module 1124 may further include a code reader 11243, the code reader 11243 is disposed on the lower surface of the mounting base 11241, the code reader 11243 is configured to read product ID (Identity document) information of the wafer 14 located at different positions near the notch 15, the code reader 11243 may be a U-type code reader, and the U-type code reader may be disposed on the periphery of the edge finding sensor 11242, so that the positioning edge finding device of this embodiment may detect the position of the notch 15 on the edge of the wafer 14 and may also read ID information of the wafer 14.
In an embodiment, referring to fig. 1, fig. 2 and fig. 3, the positioning edge finder device of the present embodiment may further include a fixed shaft 16 and a second driving mechanism 17, wherein the fixed shaft 16 is disposed on the first driving mechanism 111, the fixed shaft 16 is fixed, the second driving mechanism 17 is disposed on the fixed shaft 16 and located below the rotating shaft 121, the second driving mechanism 17 drives the rotating shaft 121 to rotate around a central axis of the rotating shaft 121, that is, the present embodiment may drive the rotating shaft 121 to rotate through the second driving mechanism 17, and the second driving mechanism 17 may be, for example, a servo motor.
In an embodiment, referring to fig. 1, fig. 2 and fig. 3, a hollow structure may be disposed on the rotating shaft 121, and the vacuum chuck device 13 includes a lifting structure 131 capable of moving in the hollow structure of the rotating shaft 121, a carrier 132, a plurality of air holes 133, and a plurality of washers 134, wherein a first end of the lifting structure 131 is disposed in the hollow structure of the rotating shaft 121, the carrier 132 is disposed on a second end of the lifting structure 131, the air holes 133 axially penetrate through the carrier 132 along the carrier 132, preferably, all the air holes 133 are disposed at intervals around a central axis of the carrier 132, and each washer 134 is disposed at an upper edge of one air hole 133.
In this embodiment, the carrier 132 is mounted on the lifting structure 131, such that the lower surface of the carrier 132 is fixedly connected to the end surface of the second end of the lifting structure 131, the lifting structure 131 is disposed in the hollow structure of the rotating shaft 121, the lifting structure 131 can move in the hollow structure of the rotating shaft 121, and the carrier 132, the air hole 133, and the gasket 134 can move along the axial direction of the rotating shaft 121 by the movement of the lifting structure 131 in the hollow structure of the rotating shaft 121, so as to achieve the lifting motion of the carrier 132, the air hole 133, and the gasket 134, the lifting structure 131 can reciprocate in the hollow structure of the rotating shaft 121 by using air pressure or hydraulic pressure, for example, an air cylinder can be mounted in the hollow structure of the rotating shaft 121, and the lifting structure 131 is connected by the air cylinder to drive the lifting structure 131 to reciprocate in the hollow structure of the rotating shaft 121, so as to drive the carrier, The back-and-forth motion of the washer 134 prevents the robot from touching the positioning structure 122 when grasping the wafer 14. The number of the air holes 133 and the gaskets 134 is one-to-one, for example, the number of the air holes 133 is 4, the number of the gaskets 134 is also 4, the lower end of each air hole 133 can be connected with a vacuum pumping device (not shown) for adsorbing the back surface of the wafer 14 on the carrier 132, the upper edge of each air hole 133 is further provided with a gasket 134, the height of the gasket 134 is slightly higher than the upper surface of the carrier 132, the gasket 134 can be made of soft rubber or the like, and the gasket 134 plays a role in buffering when adsorbing the wafer 14, so as to prevent the wafer 14 from being damaged. In addition, because the top surface of wafer 14 is spaced from edge-finding sensor 11242 after wafer 14 is attached to stage 132, edge-finding and ID information reading of wafer 14 are facilitated, so as to avoid contamination and damage to wafer 14.
In one embodiment, referring to fig. 1, 2 and 3, each positioning structure 122 may include a second connecting member 1221 having a hollow structure, a third connecting member 1222 movable in the hollow structure of the second connecting member 1221, and a finger 1223 perpendicular to the third connecting member 1222, wherein a first end of the second connecting member 1221 is connected to a sidewall of the rotation shaft 121, a first end of the third connecting member 1222 is disposed in the hollow structure of a second end of the second connecting member 1221, and a first end of the finger 1223 is connected to a second end of the third connecting member 1222.
In this embodiment, the second connection member 1221 is provided with a hollow structure, and the third connection member 1222 can move in the hollow structure of the second connection member 1221, so that the fingers 1223 can move in a radial direction of the base 10 by moving the third connection member 1222 in the hollow structure of the second connection member 1221, and after each telescopic movement, all the fingers 1223 are required to have an equal distance from the central axis of the base 10, so that the positioning structure 122 can be adapted to wafers 14 with different sizes. The positioning structures 122 of the embodiment are uniformly distributed on the periphery of the rotating shaft 121, and the telescopic length can be adjusted according to the size of the wafer 14, so that the center of the circle of the wafer 14 can be quickly and accurately positioned. Stage 132 may be raised (e.g., to a maximum height) prior to bringing the edge of wafer 14 into contact with the inner sidewalls of fingers 1223, the lower surface of stage 132 should be higher than the top ends of fingers 1223 so that the mechanism (e.g., a robot) that grasps wafer 14 does not touch the top ends of fingers 1223, and the outer sidewalls of fingers 1223 should be spaced a distance from the inner sidewalls of posts 1123 to avoid contact.
Further, the number of the positioning structures 122 that can be extended and retracted is greater than or equal to 3, so that the center of the wafer 14 can be accurately positioned when the wafer 14 falls into the area surrounded by the third connecting member 1222, and preferably, the number of the positioning structures 122 is 3 according to the three-point positioning principle.
Further, referring to fig. 5, the second ends of the fingers 1223 may be tapered to facilitate sliding the wafer 14 along the second ends of the fingers 1223 into the area surrounded by all of the fingers 1223 to make point contact with the inner sidewall of each finger 1223 to complete the positioning of the center of the wafer 14, and preferably, the second ends of the fingers 1223 may be made of a soft rubber or the like to reduce damage to the wafer 14.
Further, referring to fig. 6, the inner sidewall of the finger 1223 may further be installed with a distance measuring sensor 1224, the distance measuring sensor 1224 is configured to monitor a distance between an edge of the wafer 14 and the inner sidewall of the finger 1223 for use when a distance between the edge of the wafer 14 and the inner sidewall of the finger 1223 needs to be measured, and after the installation, the outer sidewall of the distance measuring sensor 1224 should be flush with the inner sidewall of the finger 1223 to ensure that the distance measuring sensor 1224 accurately measures the distance between the edge of the wafer 14 and the inner sidewall of the finger 1223, for example, when a circle center of the wafer 14 needs to be located, the distance between the edge of the wafer 14 and the inner sidewall of the finger 1223 may be measured by the distance measuring sensor 1224, and then the finger 1223 is moved by the distance to make the inner sidewall of the finger 1223 contact with the edge point of the wafer 14, thereby completing the circle center location of the wafer 14.
The positioning edge finder of the present embodiment may further include a controller (not shown) connected to the first driving mechanism 111, the second driving mechanism 17, the mechanism for controlling the first connecting member 1122 to move in the hollow structure of the connecting arm 1121, the mechanism for controlling the lifting mechanism 131 to move in the hollow structure of the rotating shaft 121, the mechanism for controlling the third connecting member 1222 to move in the hollow structure of the second connecting member 1221, the edge finder 11242, the code reader 11243, and the vacuum extractor, wherein the controller is further configured to control the start, stop, rotation speed, rotation direction, etc. of the first driving mechanism 111, the controller is further configured to control the start, stop, rotation speed, rotation direction, etc. of the second driving mechanism 17, the controller is further configured to control the distance and speed of movement of the first connecting member 1122, the lifting mechanism 131, and the third connecting member, and the controller is further configured to control the edge finder 11242, The code reader 11243 is started, stopped, and the like, and the controller is further configured to control the vacuum pumping device to start, stop, and vacuum pumping speed, and the like, after the circle center of the wafer 14 is located and the position of the notch 15 of the wafer 14 is detected, if the position of the notch 15 of the wafer 14 needs to be rotated to a specified position, the controller may control the second driving mechanism 17 to drive the rotating shaft 121 to rotate, so as to drive the wafer 14 on the vacuum chuck device 13 to rotate, and rotate the position of the notch 15 of the wafer 14 to the specified position, and therefore, by the control of the controller, various functional requirements such as the circle center location, the edge finding, the rotation of the notch 15 to the specified position, and the like of the wafer 14 may be conveniently.
In one embodiment, in order to realize the transfer of the wafer 14, referring to fig. 3, the positioning edge finder device of the present embodiment may further include a robot 18, where the robot 18 is configured to grab the wafer 14 onto the vacuum chuck device 13 or grab the wafer 14 from the vacuum chuck device 13 to a designated position, that is, the robot 18 is configured to pick and place the wafer 14 and move it from one position to another position, for example, the robot 18 grabs and places the cleaned wafer 14 on the stage 132 of the vacuum chuck device 13, or grabs and places the wafer 14 after the positioning edge finder is completed in a Carrier.
The utility model provides a be provided with detecting element 11, the limit device is sought in the location of centering unit 12 and vacuum chuck device 13 can realize the location of wafer 14 simultaneously, seek the limit, the demand of a plurality of functions such as breach 15 position rotations to assigned position, and should fix a position and seek limit device simple structure, can reduce the damage to wafer 14 and arouse the secondary pollution's of wafer 14 phenomenon because of the vibration, and can improve detection efficiency, in order to solve the problem that the limit device exists is sought in the location of the 14 centre of a circle of current wafer, reach the customer requirement and guarantee wafer 14's goodness rate.
The utility model provides a telescopic centering unit 12 and rotatable and flexible detecting element 11 can satisfy the centre of a circle location of different specification wafers 14 and seek the limit demand, centering unit 12 utilizes three point location's finger 1223 to realize the quick centering of wafer 14, the efficiency of wafer 14 centre of a circle location has been improved, and finger 1223's grabbing power is controllable, can avoid wafer 14 to take place damaged phenomenon because of grabbing power is too big, detecting element 11 need not remove microscope carrier 132, and can be quick seek the limit to wafer 14, detecting element 11 not only is equipped with and seeks limit sensor 11242, still be equipped with code reader 11243, not only can seek the limit to wafer 14, can also read wafer 14's ID information, with the information of conveniently traceing back wafer 14.
The utility model discloses a detecting element 11 and axis of rotation 121 all can rotate under actuating mechanism's drive alone, can realize under the condition that wafer 14 does not rotate, fix a position and seek the limit to wafer 14, satisfy different types of demand, furthest's reduction is because of the harm that the vibration that wafer 14 rotated and arouses brought.
Referring to fig. 1 to fig. 6, the present embodiment provides a method for locating and searching an edge of a wafer based on the above embodiments, where the method for locating and searching an edge of a wafer includes:
step 1, the wafer 14 is placed on the vacuum chuck device 13.
Specifically, first, the fingers 1223 of the positioning structure 122 and the detecting module 1124 of the detecting mechanism 112 may be adjusted to proper positions according to the size (e.g., diameter of 300mm) of the wafer 14 to be positioned and edge-searched, and the vacuum chuck device 13 may be adjusted to proper positions by using the lifting structure 131 so as not to touch the fingers 1223 and the detecting module 1124, and then the wafer 14 may be taken out from the wafer cassette carrier device by using the robot 18 and placed on the stage 132 of the vacuum chuck device 13.
Step 2, positioning the center of the wafer 14 by using the positioning structures 122 of the centering unit 12 according to a first center positioning manner or a second center positioning manner, wherein the first center positioning manner is to adjust all the positioning structures 122 to make the size of the area surrounded by all the positioning structures 122 equal to the size of the wafer 14 before positioning the center of the wafer 14, then lowering the vacuum chuck device 13 to slide the wafer 14 into the area surrounded by all the positioning structures 122 to complete the positioning of the center of the wafer 14, the second center positioning manner is to adjust all the positioning structures 122 to make the size of the area surrounded by all the positioning structures 122 larger than the size of the wafer 14 before positioning the center of the wafer 14, then lowering the vacuum chuck device 13 to make the wafer 14 reach a preset position, and then shrinking all the positioning structures 122 to make the size of the area surrounded by all the positioning structures 122 equal to the size of the wafer 14, to complete the positioning of the center of the wafer 14.
Specifically, if the center of the wafer 14 is located in the first center locating manner, the fingers 1223 of all the locating structures 122 need to be adjusted first to make the size of the area surrounded by all the fingers 1223 equal to the size of the wafer 14, that is, the diameter of the circular area surrounded by the inner walls of all the fingers 1223 is equal to the diameter of the wafer 14, the position of the stage 132 of the vacuum chuck device 13 is higher than the position of the fingers 1223, and then the stage 132 is lowered by lowering the lifting structure 131, during the lowering process, the side wall of the wafer 14 slides along the fingers 1223 with the tapered second ends into the area surrounded by all the fingers 1223, since the diameter of the circular area surrounded by the inner walls of all the fingers 1223 is equal to the diameter of the wafer 14, when the number of the fingers 1223 is three or more, the center of the wafer 14 can be positioned; if the center of the wafer 14 is located in the second center location manner, the fingers 1223 of all the positioning structures 122 need to be adjusted first to make the area surrounded by all the fingers 1223 larger than the size of the wafer 14, i.e. the diameter of the circular area enclosed by the inner walls of all fingers 1223 is larger than the diameter of wafer 14, then the lifting structure 131 is lowered to lower the carrier 132, so that the wafer 14 on the carrier 132 falls within the circular area surrounded by the inner walls of all the fingers 1223, and then all the fingers 1223 can be contracted to make the diameter of the circular area surrounded by the inner walls of all the fingers 1223 equal to the diameter of the wafer 14, in order to better control the contraction distance of the fingers 1223, the distance between the inner sidewall of fingers 1223 and the sidewall of wafer 14 may be measured by ranging sensors 1224 mounted on the inner sidewall of fingers 1223, and the center of wafer 14 may be positioned by the controller controlling fingers 1223 to retract the distance.
And step 3, starting the vacuum chuck device 13 to enable the wafer 14 to be adsorbed on the vacuum chuck device 13.
Specifically, the controller controls the vacuum pumping device to suck the back surface of wafer 14 onto stage 132.
And 4, detecting the position of the notch 15 on the edge of the wafer 14 by using the detection mechanism 112 of the detection unit 11 according to a first edge searching mode or a second edge searching mode, wherein the first edge searching mode is that the detection mechanism 112 is driven to rotate by using the first driving mechanism 111 so that the detection mechanism 112 detects the position of the notch 15 on the edge of the wafer 14, and the second edge searching mode is that the vacuum chuck device 13 is driven to rotate by using the rotating shaft 121 so that the detection mechanism 112 detects the position of the notch 15 on the edge of the wafer 14.
Specifically, if the position of the notch 15 on the edge of the wafer 14 is detected in the first edge finding manner, the wafer 14 on the stage 132 may be stationary, and the first driving mechanism 111 drives the detecting mechanism 112 to rotate, so that the edge finding sensor 11242 of the detecting module 1124 detects the position of the notch 15 on the edge of the wafer 14 during the rotation process above the wafer 14, so as to implement edge finding on the wafer 14, which can reduce the damage to the wafer 14 caused by the vibration of the wafer 14 during the edge finding process and reduce the phenomenon of secondary pollution to the wafer 14 caused by the introduction of nanoparticles because the wafer 14 does not need to rotate, and this way can reduce the damage to the edge and the surface of the wafer 14 to the maximum extent, and ensure the yield of each process; if the position of the notch 15 on the edge of the wafer 14 is detected by the second edge finding method, the edge finding sensor 11242 may be stationary, the second driving mechanism 17 drives the rotation shaft 121 to rotate, the rotation shaft 121 drives the wafer 14 on the carrier 132 to rotate, and the edge finding sensor 11242 may detect the position of the notch 15 on the edge of the wafer 14 during the rotation of the wafer 14, so as to realize edge finding of the wafer 14.
In addition, when the edge-finding sensor 11242 detects the position of the notch 15 of the wafer 14, a person skilled in the art may turn on the code reader 11243 as required to read the ID information of the wafer 14, and the controller may transmit the edge-finding result and the ID information of the wafer 14 to the computer.
For the notch 15 position of the wafer 14 to be rotated to the designated position, step 5 may be executed, in which:
step 5, the controller controls the rotating shaft 121 and the carrier 132 to rotate together according to the detection result of the edge-finding sensor 11242 so as to drive the notch 15 of the wafer 14 to a specified position.
And 6, adjusting the radial position of the finger 1223 by the controller, lifting the carrier 132 to a certain height, closing the vacuum extractor, taking the wafer 14 away by using the manipulator, and placing the wafer back into the wafer cassette carrying device.
The diversified functional requirements of circle center positioning, edge searching, notch 15 rotation to the designated position and the like of the wafer 14 can be completed by executing the steps 1-6, the process improves the efficiency, the customer requirements are conveniently met, the excellent rate of each process is ensured, and the quality of the wafer 14 is improved.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "height", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by one skilled in the art. The foregoing is a more detailed description of the present invention, taken in conjunction with the specific preferred embodiments thereof, and it is not intended that the invention be limited to the specific embodiments shown and described. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.
Claims (10)
1. A positioning and edge-searching device for a wafer is characterized by comprising:
a base;
the detection unit comprises a first driving mechanism arranged on the base and a detection mechanism which can rotate around the central axis of the base and can stretch along the radial direction of the base;
the centering unit comprises a rotating shaft which is arranged on the first driving mechanism and can rotate and a plurality of telescopic positioning structures which are arranged on the side wall of the rotating shaft at intervals;
the vacuum chuck device is arranged on the rotating shaft, and the vacuum chuck device can rotate and can move along the axial direction of the base.
2. The apparatus of claim 1, wherein the detecting mechanism comprises:
the connecting arm is of a hollow structure, and a first end of the connecting arm is connected with the first driving mechanism;
a first connecting piece movable in the hollow structure of the connecting arm, a first end of the first connecting piece being disposed in the hollow structure of the second end of the connecting arm;
the strut is arranged perpendicular to the first connecting piece, and the first end of the strut is connected with the second end of the first connecting piece;
the detection module is perpendicular to the support column, and the first end of the detection module is connected with the second end of the support column.
3. The apparatus as claimed in claim 2, wherein the detecting module comprises:
the mounting seat is arranged perpendicular to the support column and connected with the second end of the support column;
an edge-finding sensor disposed on a lower surface of the mounting base.
4. The wafer positioning and edge-finding device as claimed in claim 3, wherein the detecting module further comprises a code reader disposed on a lower surface of the mounting seat.
5. The wafer positioning and edge-finding device of claim 1, further comprising a fixed shaft and a second driving mechanism, wherein,
the fixed shaft is arranged on the first driving mechanism, the second driving mechanism is arranged on the fixed shaft and located below the rotating shaft, and the second driving mechanism drives the rotating shaft to rotate around the central axis of the rotating shaft.
6. The wafer positioning and edge-finding device as claimed in claim 5, wherein the rotation shaft has a hollow structure, and the vacuum chuck device comprises:
a lifting structure movable in the hollow structure of the rotating shaft, a first end of the lifting structure being disposed in the hollow structure of the rotating shaft;
the carrying platform is arranged on the lifting structure;
the air holes penetrate through the carrying platform along the axial direction of the carrying platform;
and the gaskets are arranged on the upper edges of the air holes.
7. The apparatus of claim 1, wherein the positioning structure comprises:
the first end of the second connecting piece is connected with the side wall of the rotating shaft;
a third connector movable within the hollow structure of the second connector, a first end of the third connector being disposed within the hollow structure of the second end of the second connector;
a finger disposed perpendicular to the third link, a first end of the finger connected to a second end of the third link.
8. The wafer positioning and edge finding device as claimed in claim 7, wherein the second ends of the fingers are tapered.
9. The wafer positioning and edge-finding device as claimed in claim 7, wherein the inner side wall of the finger is provided with a distance measuring sensor.
10. The apparatus of claim 1, further comprising a robot for picking the wafer onto the vacuum chuck device or picking the wafer from the vacuum chuck device to a set position.
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| CN202021040932.6U CN211017041U (en) | 2020-06-09 | 2020-06-09 | Positioning and edge-searching device for wafer |
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| CN202021040932.6U CN211017041U (en) | 2020-06-09 | 2020-06-09 | Positioning and edge-searching device for wafer |
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| CN211017041U true CN211017041U (en) | 2020-07-14 |
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| CN112466808A (en) * | 2021-02-01 | 2021-03-09 | 西安奕斯伟硅片技术有限公司 | Wafer clamping component and mechanism |
| CN114178931A (en) * | 2021-12-27 | 2022-03-15 | 江西兆驰半导体有限公司 | Chamfering positioning device and method for V-shaped NOTCH groove of sapphire wafer |
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| CN117524961B (en) * | 2023-11-23 | 2024-07-30 | 江苏京创先进电子科技有限公司 | Centering and edge searching device, centering and edge searching method and storage medium |
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| CN112466808B (en) * | 2021-02-01 | 2021-05-25 | 西安奕斯伟硅片技术有限公司 | Wafer clamping component and mechanism |
| CN112466808A (en) * | 2021-02-01 | 2021-03-09 | 西安奕斯伟硅片技术有限公司 | Wafer clamping component and mechanism |
| CN114454074B (en) * | 2021-03-03 | 2022-11-22 | 华中科技大学 | Lever-driven wafer positioning and supporting mechanism |
| CN114454074A (en) * | 2021-03-03 | 2022-05-10 | 华中科技大学 | Lever-driven wafer positioning and supporting mechanism |
| CN114188261A (en) * | 2021-10-20 | 2022-03-15 | 扬州思普尔科技有限公司 | Dustless wafer loading platform |
| CN114178931A (en) * | 2021-12-27 | 2022-03-15 | 江西兆驰半导体有限公司 | Chamfering positioning device and method for V-shaped NOTCH groove of sapphire wafer |
| CN114420527A (en) * | 2022-01-21 | 2022-04-29 | 深圳市纳设智能装备有限公司 | Sucking disc mechanism and installation device |
| CN114420527B (en) * | 2022-01-21 | 2024-03-22 | 深圳市纳设智能装备股份有限公司 | Sucking disc mechanism and installing device |
| CN115295474B (en) * | 2022-08-10 | 2023-11-21 | 苏州天准科技股份有限公司 | Wafer supporting device |
| CN115295474A (en) * | 2022-08-10 | 2022-11-04 | 苏州天准科技股份有限公司 | Wafer supporting device |
| CN115206862A (en) * | 2022-09-16 | 2022-10-18 | 杭州中欣晶圆半导体股份有限公司 | Control device and control method for solving out-of-control precision in silicon wafer handover process |
| CN117524961A (en) * | 2023-11-23 | 2024-02-06 | 江苏京创先进电子科技有限公司 | Centering and edge searching device, centering and edge searching method and storage medium |
| CN117524961B (en) * | 2023-11-23 | 2024-07-30 | 江苏京创先进电子科技有限公司 | Centering and edge searching device, centering and edge searching method and storage medium |
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