CN117799109A - Copper-plastic composite material, preparation method thereof and electronic equipment - Google Patents
Copper-plastic composite material, preparation method thereof and electronic equipment Download PDFInfo
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- CN117799109A CN117799109A CN202311792475.4A CN202311792475A CN117799109A CN 117799109 A CN117799109 A CN 117799109A CN 202311792475 A CN202311792475 A CN 202311792475A CN 117799109 A CN117799109 A CN 117799109A
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- 239000004033 plastic Substances 0.000 title claims abstract description 162
- 239000002131 composite material Substances 0.000 title claims abstract description 81
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 91
- 239000010949 copper Substances 0.000 claims abstract description 91
- 229910052802 copper Inorganic materials 0.000 claims abstract description 89
- 239000000463 material Substances 0.000 claims abstract description 86
- 239000000758 substrate Substances 0.000 claims abstract description 70
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000003754 machining Methods 0.000 claims abstract description 6
- 238000005237 degreasing agent Methods 0.000 claims description 20
- 239000013527 degreasing agent Substances 0.000 claims description 20
- 238000011282 treatment Methods 0.000 claims description 20
- 238000012545 processing Methods 0.000 claims description 19
- 238000000137 annealing Methods 0.000 claims description 18
- 238000001746 injection moulding Methods 0.000 claims description 18
- 238000005238 degreasing Methods 0.000 claims description 14
- 239000012784 inorganic fiber Substances 0.000 claims description 9
- 238000004140 cleaning Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 5
- -1 polybutylene terephthalate Polymers 0.000 claims description 5
- 229920001169 thermoplastic Polymers 0.000 claims description 5
- 239000004416 thermosoftening plastic Substances 0.000 claims description 5
- 239000003365 glass fiber Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 16
- 238000012360 testing method Methods 0.000 description 11
- 238000002347 injection Methods 0.000 description 8
- 239000007924 injection Substances 0.000 description 8
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 239000002351 wastewater Substances 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000013532 laser treatment Methods 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 239000002086 nanomaterial Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003911 water pollution Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- BQJTUDIVKSVBDU-UHFFFAOYSA-L copper;sulfuric acid;sulfate Chemical compound [Cu+2].OS(O)(=O)=O.[O-]S([O-])(=O)=O BQJTUDIVKSVBDU-UHFFFAOYSA-L 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
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- 239000000839 emulsion Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
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- 238000009413 insulation Methods 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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- 230000003647 oxidation Effects 0.000 description 1
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- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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Abstract
The application discloses a copper-plastic composite material, a preparation method thereof and electronic equipment, and relates to the technical field of copper-plastic composite materials, wherein the preparation method of the copper-plastic composite material comprises the following steps: providing a copper-based substrate; machining micro-nano-scale gully structures on the surface to be bonded of the copper-based substrate by using femtosecond laser, wherein the power of the femtosecond laser is 1-8kW, and the pulse width of the femtosecond laser is 1-15 mu s; and (3) injecting plastic materials on the surfaces to be combined, and embedding the plastic materials into the micro-nano-scale gully structure to obtain the copper-plastic composite material. The method solves the technical problem that the binding force between the copper-based substrate and the plastic material is low in the related art.
Description
Technical Field
The application relates to the technical field of copper-plastic composite materials, in particular to a copper-plastic composite material, a preparation method thereof and electronic equipment.
Background
Copper and copper alloy have excellent electric conductivity, heat conductivity, wear resistance, corrosion resistance, processability and the like, and are widely applied to the fields of manufacturing mechanical equipment, such as ships, airplanes, automobiles and the like, and the requirements for copper-plastic composite materials are less before, but in recent years, with the development of new energy automobile industry, the requirements for copper alloy and copper-plastic composite materials are increasingly obvious, such as new energy automobile connectors, batteries and the like.
However, after copper and copper alloy are compounded with plastic, the bonding force between the copper and copper alloy is smaller, the bonding compactness is weaker, and the reliability of the copper-plastic composite material is poor.
Disclosure of Invention
The main purpose of the application is to provide a copper-plastic composite material, a preparation method thereof and electronic equipment, and aims to solve the technical problem of lower binding force between a copper-based substrate and a plastic material in the related technology.
In order to achieve the above purpose, the present application provides a method for preparing a copper-plastic composite material, which includes the following steps:
providing a copper-based substrate;
machining micro-nano-scale gully structures on the surface to be bonded of the copper-based substrate by using femtosecond laser, wherein the power of the femtosecond laser is 1-8kW, and the pulse width of the femtosecond laser is 1-15 mu s;
and (3) injecting plastic materials on the surfaces to be combined, and embedding the plastic materials into the micro-nano-scale gully structure to obtain the copper-plastic composite material.
Optionally, the surface of the micro-nano-scale gully structure is provided with a micro-nano-scale villus structure, and the micro-nano-scale villus structure is embedded into the plastic material after injection molding.
Optionally, the micro-nano-scale gully structure includes a plurality of circular grooves, and the step of processing the micro-nano-scale gully structure on the surface to be bonded of the copper-based substrate using the femtosecond laser includes:
and forming a plurality of circular grooves on the surface to be bonded of the copper-based substrate by means of femto-second laser dotting.
Optionally, the technological parameters of the femto-second laser dotting include: the speed is 200-2000m/s; the frequency is 200-1200kHz; the repetition times are 1-5 times;
and/or the diameter of the circular grooves is 10-50 mu m, the depth is 0.5-15 mu m, and the distance between two adjacent circular grooves is 10-80 mu m.
Optionally, a time interval between the step of processing the micro-nano-scale ravine structure and the step of injection molding the plastic material is less than or equal to 6 hours.
Optionally, before the step of processing the micro-nano-scale gully structure on the surface to be bonded of the copper-based substrate by using the femtosecond laser, the method further comprises:
degreasing the surfaces to be combined of the copper-based substrates by using a degreasing agent, wherein the temperature of the degreasing agent is 70-80 ℃, and the degreasing time is 1.5-10min;
and cleaning the degreasing agent on the surface to be combined of the copper-based base material after degreasing treatment, and drying.
Optionally, the plastic material comprises a thermoplastic and inorganic fibers, wherein the thermoplastic comprises at least one of polyphenylene sulfide and polybutylene terephthalate, the inorganic fibers comprise glass fibers, and the mass ratio of the inorganic fibers in the plastic material is 20% -40%.
Optionally, the step of injecting plastic material on the surfaces to be combined and embedding the plastic material into the micro-nano-scale gully structure to obtain the copper-plastic composite material comprises the following steps:
preheating the copper-based substrate, wherein the temperature of the preheating is 70-90 ℃, and the time of the preheating is 20-30s;
injecting plastic material on the surfaces to be combined, and embedding the plastic material into the micro-nano-scale gully structure to obtain a composite material intermediate piece;
and (3) annealing the composite material intermediate piece to obtain the copper-plastic composite material, wherein the temperature of the annealing treatment is 140-160 ℃, and the time of the annealing treatment is 90-150min.
The application also provides a copper-plastic composite material, which is prepared by adopting the preparation method of the copper-plastic composite material.
The application also provides electronic equipment, which comprises the copper-plastic composite material.
The application provides a copper-plastic composite material, a preparation method thereof and electronic equipment, wherein the preparation method of the copper-plastic composite material comprises the following steps: providing a copper-based substrate; machining micro-nano-scale gully structures on the surface to be bonded of the copper-based substrate by using femtosecond laser, wherein the power of the femtosecond laser is 1-8kW, and the pulse width of the femtosecond laser is 1-15 mu s; and (3) injecting plastic materials on the surfaces to be combined, and embedding the plastic materials into the micro-nano-scale gully structure to obtain the copper-plastic composite material. Firstly, the micro-nano-scale gully structure can increase the contact area of the surface to be combined and the plastic material, so that the combination strength between the surface to be combined and the plastic material is improved, furthermore, compared with a surface treatment mode of chemical corrosion, the micro-nano-scale gully structure is higher in controllability of the morphology of the micro-nano-scale gully structure in a femtosecond laser processing mode, the corresponding micro-nano-scale gully structure can be processed stably according to the pre-designed morphology, the processing stability and reliability are higher, therefore, the reject ratio is lower, waste water pollution can not be generated, and the method is more environment-friendly. Therefore, the technical defect that the reliability of the copper-plastic composite material is poor due to the fact that the bonding force between copper and copper alloy and plastic is small and the bonding compactness is weak after the copper and copper alloy and plastic are compounded is overcome, the bonding force between a copper-based substrate and the plastic material can be improved more stably and reliably, and the bonding force between a copper layer and a plastic layer in the obtained copper-plastic composite material can reach more than 180 kgf.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic flow chart of a method for preparing a copper-plastic composite according to an embodiment of the present invention;
FIG. 2 is an electron microscope image of one possible implementation of micro-nano fluff structures in an embodiment of the invention;
FIG. 3 is an electron microscope image of another alternative embodiment of the micro-nano fluff structure of the comparative example of the present invention;
FIG. 4 is an electron microscope view of one possible implementation of a circular groove in an embodiment of the present invention;
FIG. 5 is a schematic view of the morphology of one possible implementation of the circular groove in an embodiment of the present invention.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, the following description will make the technical solutions of the embodiments of the present invention clear and complete. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The embodiment of the application provides a preparation method of a copper-plastic composite material, and referring to fig. 1, the preparation method of the copper-plastic composite material comprises the following steps:
step S10, providing a copper-based substrate;
in this embodiment, the copper-based material means a material containing copper in its composition, and includes pure copper and a copper alloy including at least one of brass, beryllium copper, aluminum bronze, and the like. Copper and copper alloy have excellent electric conductivity, heat conductivity, wear resistance, corrosion resistance, processability and the like, and are widely applied to the fields of manufacturing mechanical equipment, such as ships, airplanes, automobiles and the like, and the requirements for copper-plastic composite materials are less before, but in recent years, with the development of new energy automobile industry, the requirements for copper alloy and copper-plastic composite materials are increasingly obvious, such as new energy automobile connectors, batteries and the like. However, after the copper and the copper alloy are compounded with the plastic, the bonding force between the copper and the copper alloy is smaller, the bonding compactness is weaker, and the copper alloy are easy to separate in the subsequent use process, so that the reliability of the copper-plastic composite material is poorer.
Optionally, before the step of processing the micro-nano-scale gully structure on the surface to be bonded of the copper-based substrate by using the femtosecond laser, the method further comprises:
step A10, degreasing the surfaces to be combined of the copper-based substrates by using a degreasing agent, wherein the temperature of the degreasing agent is 70-80 ℃, and the degreasing time is 1.5-10min;
and step A20, cleaning the degreasing agent on the surface to be combined of the copper-based substrate after degreasing treatment, and drying.
In this embodiment, in order to reduce the influence of the residual grease on the surface of the copper-based substrate on the quality of the femtosecond laser treatment, the degreasing treatment may be performed on the copper-based substrate in advance. The degreasing agent may include at least one of an alkaline degreasing agent, an emulsion degreasing agent, a solvent degreasing agent, and the like.
As an example, the steps a10 to a20 include: a degreasing agent with a certain concentration can be prepared in advance, and the degreasing agent is used for cleaning the surface to be bonded of the copper-based substrate, wherein the temperature of the degreasing agent is 70-80 ℃, such as 70 ℃, 75 ℃, 80 ℃ and the like, and the degreasing treatment time is 1.5-10min, such as 1.5min, 5min, 8min, 10min and the like; further, the degreasing agent on the surface to be bonded of the copper-based substrate after the degreasing treatment may be washed with pure water or alcohol, and after the washing, the pure water or alcohol on the surface may be removed by drying.
S20, machining a micro-nano-scale gully structure on the surface to be bonded of the copper-based substrate by using femtosecond laser, wherein the power of the femtosecond laser is 1-8kW, and the pulse width of the femtosecond laser is 1-15 mu S;
in this embodiment, the micro-nano-scale gully structure refers to a concave structure with a specification parameter between 1 μm and 1000 μm, the specification parameter of the micro-nano-scale gully structure may include at least one of length, width, height, diameter, radius, and the like, and the shape of the micro-nano-scale gully structure may be a circle, a strip, and the like, which may be specifically determined according to actual needs, experimental test results, and the like, and the embodiment is not limited thereto.
The micro-nano-scale gully structure can increase the area of the contact surface between the surface to be bonded and the plastic material, thereby improving the bonding strength between the surface to be bonded and the plastic material. Compared with a surface treatment mode of chemical corrosion, the mode of femtosecond laser processing of the micro-nano gully structure has the advantages that firstly, the controllability of morphology of the micro-nano gully structure is higher, the corresponding micro-nano gully structure can be processed stably according to the predesigned morphology, the processing stability and reliability are higher, and therefore, the reject ratio is lower; secondly, no wastewater pollution is generated, and the method is more environment-friendly; thirdly, referring to fig. 2 and 3, micro-nano fluff structures are formed on the surfaces of micro-nano gully structures processed by femto-second laser, and the micro-nano fluff structures refer to micro-scale polymers formed by micro-nano cavities, micro-nano bulges and melted nano particles formed by photoetching and instant melting, so that the contact area between a copper-based substrate and a plastic material can be further improved, and the micro-nano fluff structures can be wrapped by the plastic material after the plastic material is injection molded, so that the micro-nano fluff structures are embedded into the plastic material, and the bonding tightness between the plastic material and the copper-based substrate is further improved; fourth, femto second laser can be in the huge power that sends in the twinkling of an eye, the copper base material of quick melting corresponding position can reduce the heat influence of copper base material through the mode of quick heating up and quick cooling down. Wherein the power of the femtosecond laser can reach 1-8kW, such as 1kW, 3kW, 5kW, 8kW, etc., and the pulse width of the femtosecond laser is 1-15 μs, such as 1 μs, 5 μs, 10 μs, 15 μs, etc. The higher laser power and pulse energy tend to increase the melting depth, in the invention, the power range of femtosecond laser is 1-8KW and the pulse width is 1-15 mu s for copper-based substrates, but excessive heat input is needed to be paid attention to, and the excessive power causes overheating melting and excessive heat influence melting on the micro-nano structure, which is unfavorable for the micro-nano structure and leads to reduced injection bonding force; lower laser power and lower energy, such as shallow etching depth morphology, and lower etching results in weaker binding force of later injection molding.
As an example, the step S20 includes: and melting partial areas on the surfaces to be bonded of the copper-based substrate in a repeatable manner by using the femtosecond laser radiation, wherein after the femtosecond laser radiation disappears, the melted areas are rapidly cooled and solidified to form a regular geometrical shape, namely a micro-nano-scale gully structure. The specific process parameters for processing the micro-nano-scale gully structure by using the femtosecond laser can be determined according to actual needs, experimental test results and the like, and the embodiment is not limited to the specific process parameters.
Optionally, the micro-nano-scale gully structure includes a plurality of circular grooves, and the step of processing the micro-nano-scale gully structure on the surface to be bonded of the copper-based substrate using the femtosecond laser includes:
and forming a plurality of circular grooves on the surface to be bonded of the copper-based substrate by means of femto-second laser dotting.
As an example, a plurality of circular grooves may be formed by performing dotting multiple times on the surface to be bonded of the copper-based substrate by means of femto-second laser dotting.
In an embodiment, referring to fig. 4 and 5, a plurality of circular grooves in a regular arrangement may be formed by performing dotting on the surface to be bonded of the copper-based substrate for a plurality of times based on a preset dotting interval in a femto-second laser dotting manner.
Optionally, the technological parameters of the femto-second laser dotting include: the speed is 200-2000m/s; the frequency is 200-1200kHz; the repetition times are 1-5 times;
and/or the diameter of the circular grooves is 10-50 mu m, the depth is 0.5-15 mu m, and the distance between two adjacent circular grooves is 10-80 mu m.
In this embodiment, the speed of the femtosecond laser dotting may be 200-2000m/s, such as 200m/s, 500m/s, 1000m/s, 1500m/s, 2000m/s, etc.; the frequency of the femtosecond laser dotting can be 200-1200kHz, such as 200kHz, 500kHz, 800kHz, 1000kHz, 1200kHz, etc.; the number of repetitions of the femtosecond laser dotting per spot may be 1-5, such as 1, 3, 5, etc.
Under the condition that the surfaces to be combined are unchanged, the smaller the diameter of the circular grooves, the larger the depth of the circular grooves, the larger the number of the circular grooves which can be processed, the larger the area of the contact surface between the plastic material and the copper-based substrate, the higher the binding force between the plastic material and the copper-based substrate, but the more difficult the plastic material to fill into the micro-nano-scale gully structure during injection molding, the higher the flowability requirement on the plastic material, the higher the flowability of the plastic material, the lower the mechanical property, the easily caused unfilled hole structure in the middle of the copper-plastic composite material, and the lower the mechanical property of the copper-plastic composite material. The diameter of the circular grooves is thus determined to be 10-50 μm, e.g. 10 μm, 30 μm, 50 μm etc., and the depth of the circular grooves is 0.5-15 μm, e.g. 0.5 μm, 1 μm, 3 μm, 5 μm, 8 μm, 10 μm, 15 μm etc.
The smaller the interval between any two adjacent circular grooves is, the more the number of the circular grooves can be processed, the larger the area of the contact surface between the plastic material and the copper-based substrate is, and the higher the binding force between the plastic material and the copper-based substrate is, but if the interval between the two adjacent circular grooves is too small, the thinner the copper-based substrate barrier between the circular grooves can also cause the mechanical property of the copper-plastic composite material to be reduced. The spacing between two adjacent said circular grooves is thus determined to be 10-80 μm and 10-80 μm, e.g. 10 μm, 30 μm, 50 μm, 80 μm etc.
And step S30, injecting plastic materials on the surfaces to be combined, and embedding the plastic materials into the micro-nano gully structure to obtain the copper-plastic composite material.
In this embodiment, the plastic material is a polymer compound material polymerized by using a monomer as a raw material through addition polymerization or polycondensation reaction, and has good insulation, waterproof property and flexibility. The plastic material may be a thermosetting plastic including at least one of a phenolic plastic, an epoxy plastic, etc., or a thermoplastic including at least one of a polyphenylene sulfide, a polybutylene terephthalate, etc. Inorganic fibers may be added to the plastic material for reinforcement purposes, and the inorganic fibers may include at least one of carbon fibers, glass fibers, and the like, and the mass ratio of the inorganic fibers in the plastic material is 20% -40%, for example, 20%, 30%, 40%, and the like.
As an example, the step S30 includes: and injecting plastic materials into the surfaces to be combined through injection molding equipment, so that the plastic materials are embedded into the micro-nano-scale gully structure, and the copper-plastic composite material is obtained after solidification, wherein the copper-plastic composite material comprises a copper-based substrate layer and at least one plastic layer compounded on the surface to be combined of the copper-based substrate layer.
Optionally, a time interval between the step of processing the micro-nano-scale ravine structure and the step of injection molding the plastic material is less than or equal to 6 hours.
In this embodiment, in the actual production process, the process of processing the micro-nano-scale ravine structure on the surface to be bonded of the copper-based substrate and the process of injection molding the plastic material on the surface to be bonded may not be sequentially performed, for example, it may be that the workshop a is responsible for processing the micro-nano-scale ravine structure on the surface to be bonded of the copper-based substrate, the workshop B is responsible for injection molding the plastic material on the surface to be bonded, after the workshop a processes a batch of samples, the processed samples with the micro-nano-scale ravine structure are sent to the workshop B, and the plastic material is injected on the surface to be bonded of the processed samples with the micro-nano-scale ravine structure by the workshop B. However, after the micro-nano-scale gully structure is processed, the standing time is less than or equal to 6 hours, and the bonding force between the plastic material and the copper-based substrate is not obviously changed, but if the plastic is subjected to injection molding after the standing time exceeds 6 hours, the bonding force between the plastic material and the copper-based substrate is obviously reduced probably due to oxidation and the like on the surface of the copper-based substrate. Therefore, the time interval between the step of processing the micro-nano-scale ravine structure and the step of injection molding the plastic material is determined to be less than or equal to 6 hours.
Optionally, the step of injecting plastic material on the surfaces to be combined and embedding the plastic material into the micro-nano-scale gully structure to obtain the copper-plastic composite material comprises the following steps:
step S31, preheating the copper-based substrate, wherein the temperature of the preheating is 70-90 ℃, and the time of the preheating is 20-30S;
step S32, plastic materials are injected on the surfaces to be combined, and the plastic materials are embedded into the micro-nano gully structure, so that a composite material intermediate piece is obtained;
and step S33, annealing the composite material intermediate piece to obtain the copper-plastic composite material, wherein the temperature of the annealing treatment is 140-160 ℃, and the time of the annealing treatment is 90-150min.
In this embodiment, it should be noted that, before injection molding, the copper-based substrate may be preheated to reduce the temperature difference between the copper-based substrate and the plastic material, so as to avoid the situation that the plastic material is rapidly cooled after contacting with the copper-based substrate, and the fluidity is reduced, so that the plastic material cannot completely fill the micro-nano-scale gully structure.
After injection molding, annealing treatment can be performed, so that the stress of the plastic material after injection molding is eliminated, and the risk that the plastic deforms and cracks or the copper-based substrate is separated from the plastic in the later use process is reduced.
As an example, the steps S31 to S33 include: the copper-based substrate may be placed in an injection mold, the injection mold is heated to a preheating temperature and maintained for a certain period of time, and heat is transferred to the copper-based substrate through the injection mold, so that the preheating treatment of the copper-based substrate is achieved, wherein the preheating treatment is performed at a temperature of 70-90 ℃, such as 70 ℃, 80 ℃,90 ℃, etc., and the preheating treatment is performed for a period of 20-30s, such as 20s, 25s, 30s, etc. And then, injecting plastic materials into the injection mold through injection equipment, so that the plastic materials cover the surfaces to be combined and are embedded into the micro-nano-scale gully structure, and curing to obtain the composite material intermediate. Furthermore, the temperature of the injection mold can be adjusted to the annealing temperature, the annealing treatment is carried out on the composite material intermediate piece, and the copper-plastic composite material is obtained after demoulding; the composite material intermediate piece can also be put into an oven or other annealing devices after being demolded, and the copper-plastic composite material is obtained after being kept for a certain time at the annealing temperature, wherein the annealing treatment temperature is 140-160 ℃, such as 140-150 ℃, 160 ℃, and the like, and the annealing treatment time is 90-150min,90min, 120min, 150min, and the like.
In this embodiment, the preparation method of the copper-plastic composite material includes the following steps: providing a copper-based substrate; machining micro-nano-scale gully structures on the surface to be bonded of the copper-based substrate by using femtosecond laser, wherein the power of the femtosecond laser is 1-8kW, and the pulse width of the femtosecond laser is 1-15 mu s; and (3) injecting plastic materials on the surfaces to be combined, and embedding the plastic materials into the micro-nano-scale gully structure to obtain the copper-plastic composite material. Firstly, the micro-nano-scale gully structure can increase the contact area of the surface to be combined and the plastic material, so that the combination strength between the surface to be combined and the plastic material is improved, furthermore, compared with a surface treatment mode of chemical corrosion, the micro-nano-scale gully structure is higher in controllability of the morphology of the micro-nano-scale gully structure in a femtosecond laser processing mode, the corresponding micro-nano-scale gully structure can be processed stably according to the pre-designed morphology, the processing stability and reliability are higher, therefore, the reject ratio is lower, waste water pollution can not be generated, and the method is more environment-friendly. Therefore, the technical defect that the reliability of the copper-plastic composite material is poor due to the fact that the bonding force between copper and copper alloy and plastic is small and the bonding compactness is weak after the copper and copper alloy and plastic are compounded is overcome, the bonding force between a copper-based substrate and the plastic material can be improved more stably and reliably, and the bonding force between a copper layer and a plastic layer in the obtained copper-plastic composite material can reach more than 180 kgf.
Further, the invention also provides a copper-plastic composite material, which is prepared by adopting the preparation method of the copper-plastic composite material.
The copper-plastic composite material provided by the invention is prepared by adopting the preparation method of the copper-plastic composite material, and solves the technical problem of lower binding force between a copper-based substrate and a plastic material in the related technology. Compared with the prior art, the beneficial effects of the copper-plastic composite material provided by the embodiment of the invention are the same as those of the preparation method of the copper-plastic composite material provided by the embodiment, and other technical characteristics of the copper-plastic composite material are the same as those disclosed by the method of the embodiment, so that the description is omitted.
Further, the invention also provides electronic equipment, which comprises the copper-plastic composite material.
In one implementation, the electronic device may be a head mounted display device, a smart wearable device, or the like, such as VR/AR glasses, VR/AR helmets, or the like.
In one embodiment, at least part of the exterior and/or structural parts of the electronic device are made of the copper-plastic composite material as described above.
The electronic equipment solves the technical problem that the binding force between the copper-based substrate and the plastic material is low in the related technology. Compared with the prior art, the beneficial effects of the electronic equipment provided by the embodiment of the invention are the same as those of the composite material of the embodiment, and are not repeated here.
The present invention will be described in detail with reference to specific examples and comparative examples. It is to be understood that the following description is exemplary only and is not intended to limit the invention in any way.
Examples
1. The copper-based substrate is H62 brass, and the plastic material is 70% polybutylene terephthalate and 30% glass fiber;
2. degreasing: cleaning greasy dirt on the surface of the copper-based substrate by adopting an alkaline degreasing agent, cleaning the degreasing agent by using clean water, and drying, wherein the concentration of the alkaline degreasing agent is 1wt%, the temperature is 75 ℃, and the degreasing treatment time is 5min;
3. femto second laser dotting: and dotting the surfaces to be combined by using a femtosecond laser with the power of 8KW, wherein the power ratio is 50%, the dotting interval is 45 mu m, the femtosecond laser speed is 800m/s, the frequency is 20kHz, the pulse width is 10 mu s, the repetition number is 2 times, circular grooves with the diameter of 10 mu m and the depth of 5.5+/-1 mu m are formed, and the interval between two adjacent circular grooves is 45 mu m.
4. Injection molding: preheating the copper-based substrate at 80 ℃ for 20s, injecting plastic materials on the surface to be combined of the copper-based substrate, and annealing for 2h at 150 ℃ after injection molding to obtain the copper-plastic composite material.
Comparative example
The copper-based substrate of the same material as in example 1 was subjected to dc electrochemical corrosion using a commercially available sulfuric acid-copper sulfate electrolyte to obtain a copper-based substrate having micro-nano holes on the surface, and subjected to injection molding and stress relief annealing as in the femtosecond laser treatment, and then subjected to drawing force and water resistance test.
The copper-plastic composite materials obtained in the above examples and comparative examples were subjected to a pullout force test and a water resistance test. The examples were subjected to five Ping Laba force tests, and the results were 176.25kgf, 189.37kgf, 183.11kgf, 179.85kgf, 186.20kgf, respectively, and the air tightness test passed 15 m waterproof test; the comparative examples were subjected to five drawing force tests, and as a result, 148.95kgf, 142.3kgf, 152.85kgf, 128.75kgf, 146.34kgf, respectively, and the air tightness test passed the 10-meter waterproof test. Therefore, the binding force between the copper-based substrate and the plastic material can be effectively improved, and the prepared copper-plastic composite material has good waterproof and airtight performances.
The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the scope of the claims, and all equivalent structures or equivalent flow modifications made by the specification of the present application, or direct or indirect application in other relevant technical fields are included in the scope of the claims.
Claims (10)
1. The preparation method of the copper-plastic composite material is characterized by comprising the following steps of:
providing a copper-based substrate;
machining micro-nano-scale gully structures on the surface to be bonded of the copper-based substrate by using femtosecond laser, wherein the power of the femtosecond laser is 1-8kW, and the pulse width of the femtosecond laser is 1-15 mu s;
and (3) injecting plastic materials on the surfaces to be combined, and embedding the plastic materials into the micro-nano-scale gully structure to obtain the copper-plastic composite material.
2. The method for preparing a copper-plastic composite material according to claim 1, wherein the surface of the micro-nano-scale gully structure is provided with a micro-nano-scale villus structure, and the micro-nano-scale villus structure is embedded into the plastic material after injection molding.
3. The method of producing a copper plastic composite as claimed in claim 1, wherein the micro-nano-scale ravine structure comprises a plurality of circular grooves, and the step of processing the micro-nano-scale ravine structure on the surface to be bonded of the copper-based substrate using the femtosecond laser comprises:
and forming a plurality of circular grooves on the surface to be bonded of the copper-based substrate by means of femto-second laser dotting.
4. The method for preparing the copper-plastic composite according to claim 3, wherein the technological parameters of the femtosecond laser dotting include: the speed is 200-2000m/s; the frequency is 200-1200kHz; the repetition times are 1-5 times;
and/or the diameter of the circular grooves is 10-50 mu m, the depth is 0.5-15 mu m, and the distance between two adjacent circular grooves is 10-80 mu m.
5. The method of producing a copper plastic composite as claimed in claim 1, wherein a time interval between the step of processing the micro-nano-scale ravine structure and the step of injection molding the plastic material is less than or equal to 6 hours.
6. The method for preparing a copper-plastic composite according to claim 1, wherein the step of processing micro-nano-scale gully structures on the surface to be bonded of the copper-based substrate by using a femtosecond laser further comprises:
degreasing the surfaces to be combined of the copper-based substrates by using a degreasing agent, wherein the temperature of the degreasing agent is 70-80 ℃, and the degreasing time is 1.5-10min;
and cleaning the degreasing agent on the surface to be combined of the copper-based base material after degreasing treatment, and drying.
7. The method of producing a copper-plastic composite according to claim 1, wherein the plastic material comprises a thermoplastic and inorganic fibers, wherein the thermoplastic comprises at least one of polyphenylene sulfide and polybutylene terephthalate, the inorganic fibers comprise glass fibers, and the mass ratio of the inorganic fibers in the plastic material is 20% -40%.
8. The method of manufacturing a copper-plastic composite according to claim 1, wherein the step of injecting plastic material into the surface to be bonded and embedding the plastic material into the micro-nano-scale gully structure to obtain the copper-plastic composite comprises:
preheating the copper-based substrate, wherein the temperature of the preheating is 70-90 ℃, and the time of the preheating is 20-30s;
injecting plastic material on the surfaces to be combined, and embedding the plastic material into the micro-nano-scale gully structure to obtain a composite material intermediate piece;
and (3) annealing the composite material intermediate piece to obtain the copper-plastic composite material, wherein the temperature of the annealing treatment is 140-160 ℃, and the time of the annealing treatment is 90-150min.
9. A copper-plastic composite material, characterized in that the copper-plastic composite material is prepared by the preparation method of the copper-plastic composite material according to any one of claims 1-8.
10. An electronic device comprising the copper-plastic composite of claim 9.
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