CN117656272A - 硅棒切割***的切割装置及硅棒切割*** - Google Patents
硅棒切割***的切割装置及硅棒切割*** Download PDFInfo
- Publication number
- CN117656272A CN117656272A CN202311728156.7A CN202311728156A CN117656272A CN 117656272 A CN117656272 A CN 117656272A CN 202311728156 A CN202311728156 A CN 202311728156A CN 117656272 A CN117656272 A CN 117656272A
- Authority
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- Prior art keywords
- cutting
- silicon rod
- edge
- skin
- edge skin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 510
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 396
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 396
- 239000010703 silicon Substances 0.000 title claims abstract description 396
- 230000007246 mechanism Effects 0.000 claims abstract description 187
- 238000007667 floating Methods 0.000 claims abstract description 47
- 239000010985 leather Substances 0.000 claims description 91
- 210000000078 claw Anatomy 0.000 claims description 44
- 238000001514 detection method Methods 0.000 claims description 33
- 238000005452 bending Methods 0.000 claims description 21
- 229910003460 diamond Inorganic materials 0.000 claims description 21
- 239000010432 diamond Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 21
- 230000008569 process Effects 0.000 claims description 20
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 description 55
- 238000012546 transfer Methods 0.000 description 48
- 238000007599 discharging Methods 0.000 description 32
- 239000007921 spray Substances 0.000 description 25
- 238000012545 processing Methods 0.000 description 17
- 239000000463 material Substances 0.000 description 14
- 230000001360 synchronised effect Effects 0.000 description 13
- 230000007704 transition Effects 0.000 description 13
- 230000000903 blocking effect Effects 0.000 description 11
- 230000002441 reversible effect Effects 0.000 description 11
- 239000003638 chemical reducing agent Substances 0.000 description 10
- 239000013078 crystal Substances 0.000 description 8
- 238000006073 displacement reaction Methods 0.000 description 8
- 238000005507 spraying Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 239000003921 oil Substances 0.000 description 7
- 238000003860 storage Methods 0.000 description 6
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 208000010727 head pressing Diseases 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 239000002173 cutting fluid Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000010485 coping Effects 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 239000010720 hydraulic oil Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202311728156.7A CN117656272A (zh) | 2021-11-01 | 2021-11-01 | 硅棒切割***的切割装置及硅棒切割*** |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111284174.1A CN114589824B (zh) | 2021-11-01 | 2021-11-01 | 硅棒切割***的切割装置及硅棒切割*** |
CN202311728156.7A CN117656272A (zh) | 2021-11-01 | 2021-11-01 | 硅棒切割***的切割装置及硅棒切割*** |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111284174.1A Division CN114589824B (zh) | 2021-11-01 | 2021-11-01 | 硅棒切割***的切割装置及硅棒切割*** |
Publications (1)
Publication Number | Publication Date |
---|---|
CN117656272A true CN117656272A (zh) | 2024-03-08 |
Family
ID=81804096
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202311728156.7A Pending CN117656272A (zh) | 2021-11-01 | 2021-11-01 | 硅棒切割***的切割装置及硅棒切割*** |
CN202111284174.1A Active CN114589824B (zh) | 2021-11-01 | 2021-11-01 | 硅棒切割***的切割装置及硅棒切割*** |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111284174.1A Active CN114589824B (zh) | 2021-11-01 | 2021-11-01 | 硅棒切割***的切割装置及硅棒切割*** |
Country Status (2)
Country | Link |
---|---|
CN (2) | CN117656272A (fr) |
WO (1) | WO2023072126A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117656272A (zh) * | 2021-11-01 | 2024-03-08 | 青岛高测科技股份有限公司 | 硅棒切割***的切割装置及硅棒切割*** |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE346249B (fr) * | 1971-02-24 | 1972-07-03 | Ytong Ab | |
JPH05318460A (ja) * | 1992-05-25 | 1993-12-03 | Tokyo Seimitsu Co Ltd | 半導体ウエハのスライシング方法 |
JPH06155451A (ja) * | 1992-11-26 | 1994-06-03 | Sumitomo Sitix Corp | 内周刃による被切断材表面形状の推定方法とその推定装置 |
JPH0675621U (ja) * | 1993-04-08 | 1994-10-25 | 株式会社アマダ | 切断機の切曲り検出装置 |
JPH10100138A (ja) * | 1996-09-30 | 1998-04-21 | Tokyo Seimitsu Co Ltd | 半導体ウエハのスライシング方法 |
JP3961119B2 (ja) * | 1998-06-23 | 2007-08-22 | 株式会社アマダ | 鋸盤の切曲り検出方法及びその装置、並びに鋸盤の制御方法及びその装置 |
US6582166B1 (en) * | 1999-10-22 | 2003-06-24 | Gerber Scientific Products, Inc. | Method of compensating for cutter deflection |
DE102008051673B4 (de) * | 2008-10-15 | 2014-04-03 | Siltronic Ag | Verfahren zum gleichzeitigen Auftrennen eines Verbundstabs aus Silicium in eine Vielzahl von Scheiben |
CN102049818B (zh) * | 2009-10-28 | 2013-09-11 | 上海日进机床有限公司 | 晶体硅锭的切割方法 |
ITMI20120277A1 (it) * | 2012-02-24 | 2013-08-25 | Danieli Off Mecc | Metodo di controllo di impianto di produzione a due fili |
JP6260567B2 (ja) * | 2015-03-26 | 2018-01-17 | Jfeスチール株式会社 | 鋸断順序決定方法および形鋼の製造方法 |
DE102016211883B4 (de) * | 2016-06-30 | 2018-02-08 | Siltronic Ag | Verfahren und Vorrichtung zur Wiederaufnahme des Drahtsägeprozesses eines Werkstückes nach einer unplanmäßigen Unterbrechung |
CN206066729U (zh) * | 2016-10-14 | 2017-04-05 | 上海日进机床有限公司 | 硅棒开方设备 |
JP6222393B1 (ja) * | 2017-03-21 | 2017-11-01 | 信越半導体株式会社 | インゴットの切断方法 |
CN107633555B (zh) * | 2017-09-15 | 2019-12-17 | 中国地质大学(武汉) | 基于空间扫描的曲面集相互切割方法及*** |
CN208148231U (zh) * | 2018-02-09 | 2018-11-27 | 天通日进精密技术有限公司 | 硅棒多线切割设备和硅棒转运*** |
CN110126107B (zh) * | 2018-02-09 | 2024-02-23 | 天通日进精密技术有限公司 | 硅棒转换装置、硅棒开方设备及硅棒开方方法 |
DE112018007560B4 (de) * | 2018-06-12 | 2023-10-19 | Mitsubishi Electric Corporation | Drahterodiermaschine und Geradheitsberechnungsverfahren |
CN109129947B (zh) * | 2018-09-03 | 2023-08-08 | 天通日进精密技术有限公司 | 硅棒开方设备、硅棒开方方法及边皮卸载装置 |
CN209381175U (zh) * | 2018-09-30 | 2019-09-13 | 福州天瑞线锯科技有限公司 | 一种晶硅棒环形线锯切割机 |
CN111844490A (zh) * | 2019-04-30 | 2020-10-30 | 天通日进精密技术有限公司 | 多工位开方设备及其切割方法 |
CN110076628B (zh) * | 2019-06-19 | 2020-09-11 | 湖南工学院 | 一种补偿精加工变槽宽螺纹误差的方法 |
CN112297256A (zh) * | 2019-07-30 | 2021-02-02 | 内蒙古中环光伏材料有限公司 | 一种大尺寸单晶圆棒切割装置和切割方法 |
CN112297263A (zh) * | 2019-08-02 | 2021-02-02 | 天通日进精密技术有限公司 | 硅棒切磨一体机及硅棒切磨方法 |
WO2021027326A1 (fr) * | 2019-08-14 | 2021-02-18 | 天通日进精密技术有限公司 | Appareillage de coupe de barreau de silicium |
CN211762660U (zh) * | 2020-02-26 | 2020-10-27 | 青岛高测科技股份有限公司 | 一种用于硅棒开方的辅助夹紧及下边皮旋转装置 |
CN211762658U (zh) * | 2020-02-26 | 2020-10-27 | 青岛高测科技股份有限公司 | 一种新式的单晶硅双棒双工位开方机 |
CN212498398U (zh) * | 2020-03-30 | 2021-02-09 | 天通日进精密技术有限公司 | 硅棒开方机 |
CN111619026B (zh) * | 2020-06-12 | 2024-07-23 | 大连连城数控机器股份有限公司 | 双硅棒金刚线开方机 |
CN212578936U (zh) * | 2020-06-15 | 2021-02-23 | 天通日进精密技术有限公司 | 应用于硅棒开方设备的边皮卸料装置及硅棒开方设备 |
CN111912379A (zh) * | 2020-07-24 | 2020-11-10 | 福建晶安光电有限公司 | 晶圆被加工面加工质量及切割表面切割质量的检验方法 |
CN112192769B (zh) * | 2020-09-24 | 2024-06-28 | 福州天瑞线锯科技有限公司 | 一种开方机硅晶棒料夹持装置 |
CN213796561U (zh) * | 2020-11-17 | 2021-07-27 | 苏州市渤华科技研发有限公司 | 一种工业机器人用夹紧装置 |
CN117656272A (zh) * | 2021-11-01 | 2024-03-08 | 青岛高测科技股份有限公司 | 硅棒切割***的切割装置及硅棒切割*** |
CN114012916A (zh) * | 2021-11-01 | 2022-02-08 | 青岛高测科技股份有限公司 | 硅棒切割***的切割装置及硅棒切割*** |
-
2021
- 2021-11-01 CN CN202311728156.7A patent/CN117656272A/zh active Pending
- 2021-11-01 CN CN202111284174.1A patent/CN114589824B/zh active Active
-
2022
- 2022-10-26 WO PCT/CN2022/127598 patent/WO2023072126A1/fr unknown
Also Published As
Publication number | Publication date |
---|---|
WO2023072126A1 (fr) | 2023-05-04 |
CN114589824B (zh) | 2024-02-02 |
CN114589824A (zh) | 2022-06-07 |
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