CN117656272A - 硅棒切割的切割装置及硅棒切割 - Google Patents

硅棒切割***的切割装置及硅棒切割*** Download PDF

Info

Publication number: CN117656272A
Authority: CN; China
Prior art keywords: cutting; silicon rod; edge; skin; edge skin
Prior art date: 2021-11-01
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

CN202311728156.7A

Other languages

English (en)

Chinese (zh)

Inventor

刘克村

孙鹏

郭世锋

戴鑫辉

周聪

杨国栋

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Qingdao Gaoce Technology Co Ltd

Original Assignee

Qingdao Gaoce Technology Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2021-11-01

Filing date

2021-11-01

Publication date

2024-03-08

2021-11-01 Application filed by Qingdao Gaoce Technology Co Ltd filed Critical Qingdao Gaoce Technology Co Ltd

2021-11-01 Priority to CN202311728156.7A priority Critical patent/CN117656272A/zh

2024-03-08 Publication of CN117656272A publication Critical patent/CN117656272A/zh

Status Pending legal-status Critical Current

Links

238000005520 cutting process Methods 0.000 title claims abstract description 510
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 396
229910052710 silicon Inorganic materials 0.000 title claims abstract description 396
239000010703 silicon Substances 0.000 title claims abstract description 396
230000007246 mechanism Effects 0.000 claims abstract description 187
238000007667 floating Methods 0.000 claims abstract description 47
239000010985 leather Substances 0.000 claims description 91
210000000078 claw Anatomy 0.000 claims description 44
238000001514 detection method Methods 0.000 claims description 33
238000005452 bending Methods 0.000 claims description 21
229910003460 diamond Inorganic materials 0.000 claims description 21
239000010432 diamond Substances 0.000 claims description 21
238000000034 method Methods 0.000 claims description 21
230000008569 process Effects 0.000 claims description 20
230000002093 peripheral effect Effects 0.000 claims description 9
238000003825 pressing Methods 0.000 claims description 4
238000004140 cleaning Methods 0.000 description 55
238000012546 transfer Methods 0.000 description 48
238000007599 discharging Methods 0.000 description 32
239000007921 spray Substances 0.000 description 25
238000012545 processing Methods 0.000 description 17
239000000463 material Substances 0.000 description 14
230000001360 synchronised effect Effects 0.000 description 13
230000007704 transition Effects 0.000 description 13
230000000903 blocking effect Effects 0.000 description 11
230000002441 reversible effect Effects 0.000 description 11
239000003638 chemical reducing agent Substances 0.000 description 10
239000013078 crystal Substances 0.000 description 8
238000006073 displacement reaction Methods 0.000 description 8
238000005507 spraying Methods 0.000 description 8
238000010586 diagram Methods 0.000 description 7
239000007788 liquid Substances 0.000 description 7
238000005259 measurement Methods 0.000 description 7
239000003921 oil Substances 0.000 description 7
238000003860 storage Methods 0.000 description 6
230000000712 assembly Effects 0.000 description 4
238000000429 assembly Methods 0.000 description 4
238000005516 engineering process Methods 0.000 description 4
208000010727 head pressing Diseases 0.000 description 4
230000009471 action Effects 0.000 description 3
239000000523 sample Substances 0.000 description 3
239000002173 cutting fluid Substances 0.000 description 2
230000006378 damage Effects 0.000 description 2
230000000694 effects Effects 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
238000010248 power generation Methods 0.000 description 2
230000009467 reduction Effects 0.000 description 2
235000012431 wafers Nutrition 0.000 description 2
229910000831 Steel Inorganic materials 0.000 description 1
208000027418 Wounds and injury Diseases 0.000 description 1
238000013459 approach Methods 0.000 description 1
230000009286 beneficial effect Effects 0.000 description 1
238000001816 cooling Methods 0.000 description 1
230000010485 coping Effects 0.000 description 1
229910021419 crystalline silicon Inorganic materials 0.000 description 1
239000010720 hydraulic oil Substances 0.000 description 1
208000014674 injury Diseases 0.000 description 1
230000002452 interceptive effect Effects 0.000 description 1
238000012423 maintenance Methods 0.000 description 1
229910052594 sapphire Inorganic materials 0.000 description 1
239000010980 sapphire Substances 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1
239000010959 steel Substances 0.000 description 1
239000002699 waste material Substances 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Processing Of Stones Or Stones Resemblance Materials (AREA)

CN202311728156.7A 2021-11-01 2021-11-01 硅棒切割***的切割装置及硅棒切割*** Pending CN117656272A (zh)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
CN202311728156.7A CN117656272A (zh)	2021-11-01	2021-11-01	硅棒切割*的切割装置及硅棒切割*

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
CN202111284174.1A CN114589824B (zh)	2021-11-01	2021-11-01	硅棒切割*的切割装置及硅棒切割*
CN202311728156.7A CN117656272A (zh)	2021-11-01	2021-11-01	硅棒切割*的切割装置及硅棒切割*

Related Parent Applications (1)

Application Number	Title	Priority Date	Filing Date
CN202111284174.1A Division CN114589824B (zh)	2021-11-01	2021-11-01	硅棒切割*的切割装置及硅棒切割*

Publications (1)

Publication Number	Publication Date
CN117656272A true CN117656272A (zh)	2024-03-08

Family

ID=81804096

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
CN202311728156.7A Pending CN117656272A (zh)	2021-11-01	2021-11-01	硅棒切割*的切割装置及硅棒切割*
CN202111284174.1A Active CN114589824B (zh)	2021-11-01	2021-11-01	硅棒切割*的切割装置及硅棒切割*

Family Applications After (1)

Application Number	Title	Priority Date	Filing Date
CN202111284174.1A Active CN114589824B (zh)	2021-11-01	2021-11-01	硅棒切割*的切割装置及硅棒切割*

Country Status (2)

Country	Link
CN (2)	CN117656272A (fr)
WO (1)	WO2023072126A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN117656272A (zh) *	2021-11-01	2024-03-08	青岛高测科技股份有限公司	硅棒切割*的切割装置及硅棒切割*

Family Cites Families (35)

* Cited by examiner, † Cited by third party
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SE346249B (fr) *	1971-02-24	1972-07-03	Ytong Ab
JPH05318460A (ja) *	1992-05-25	1993-12-03	Tokyo Seimitsu Co Ltd	半導体ウエハのスライシング方法
JPH06155451A (ja) *	1992-11-26	1994-06-03	Sumitomo Sitix Corp	内周刃による被切断材表面形状の推定方法とその推定装置
JPH0675621U (ja) *	1993-04-08	1994-10-25	株式会社アマダ	切断機の切曲り検出装置
JPH10100138A (ja) *	1996-09-30	1998-04-21	Tokyo Seimitsu Co Ltd	半導体ウエハのスライシング方法
JP3961119B2 (ja) *	1998-06-23	2007-08-22	株式会社アマダ	鋸盤の切曲り検出方法及びその装置、並びに鋸盤の制御方法及びその装置
US6582166B1 (en) *	1999-10-22	2003-06-24	Gerber Scientific Products, Inc.	Method of compensating for cutter deflection
DE102008051673B4 (de) *	2008-10-15	2014-04-03	Siltronic Ag	Verfahren zum gleichzeitigen Auftrennen eines Verbundstabs aus Silicium in eine Vielzahl von Scheiben
CN102049818B (zh) *	2009-10-28	2013-09-11	上海日进机床有限公司	晶体硅锭的切割方法
ITMI20120277A1 (it) *	2012-02-24	2013-08-25	Danieli Off Mecc	Metodo di controllo di impianto di produzione a due fili
JP6260567B2 (ja) *	2015-03-26	2018-01-17	Ｊｆｅスチール株式会社	鋸断順序決定方法および形鋼の製造方法
DE102016211883B4 (de) *	2016-06-30	2018-02-08	Siltronic Ag	Verfahren und Vorrichtung zur Wiederaufnahme des Drahtsägeprozesses eines Werkstückes nach einer unplanmäßigen Unterbrechung
CN206066729U (zh) *	2016-10-14	2017-04-05	上海日进机床有限公司	硅棒开方设备
JP6222393B1 (ja) *	2017-03-21	2017-11-01	信越半導体株式会社	インゴットの切断方法
CN107633555B (zh) *	2017-09-15	2019-12-17	中国地质大学（武汉）	基于空间扫描的曲面集相互切割方法及***
CN208148231U (zh) *	2018-02-09	2018-11-27	天通日进精密技术有限公司	硅棒多线切割设备和硅棒转运***
CN110126107B (zh) *	2018-02-09	2024-02-23	天通日进精密技术有限公司	硅棒转换装置、硅棒开方设备及硅棒开方方法
DE112018007560B4 (de) *	2018-06-12	2023-10-19	Mitsubishi Electric Corporation	Drahterodiermaschine und Geradheitsberechnungsverfahren
CN109129947B (zh) *	2018-09-03	2023-08-08	天通日进精密技术有限公司	硅棒开方设备、硅棒开方方法及边皮卸载装置
CN209381175U (zh) *	2018-09-30	2019-09-13	福州天瑞线锯科技有限公司	一种晶硅棒环形线锯切割机
CN111844490A (zh) *	2019-04-30	2020-10-30	天通日进精密技术有限公司	多工位开方设备及其切割方法
CN110076628B (zh) *	2019-06-19	2020-09-11	湖南工学院	一种补偿精加工变槽宽螺纹误差的方法
CN112297256A (zh) *	2019-07-30	2021-02-02	内蒙古中环光伏材料有限公司	一种大尺寸单晶圆棒切割装置和切割方法
CN112297263A (zh) *	2019-08-02	2021-02-02	天通日进精密技术有限公司	硅棒切磨一体机及硅棒切磨方法
WO2021027326A1 (fr) *	2019-08-14	2021-02-18	天通日进精密技术有限公司	Appareillage de coupe de barreau de silicium
CN211762660U (zh) *	2020-02-26	2020-10-27	青岛高测科技股份有限公司	一种用于硅棒开方的辅助夹紧及下边皮旋转装置
CN211762658U (zh) *	2020-02-26	2020-10-27	青岛高测科技股份有限公司	一种新式的单晶硅双棒双工位开方机
CN212498398U (zh) *	2020-03-30	2021-02-09	天通日进精密技术有限公司	硅棒开方机
CN111619026B (zh) *	2020-06-12	2024-07-23	大连连城数控机器股份有限公司	双硅棒金刚线开方机
CN212578936U (zh) *	2020-06-15	2021-02-23	天通日进精密技术有限公司	应用于硅棒开方设备的边皮卸料装置及硅棒开方设备
CN111912379A (zh) *	2020-07-24	2020-11-10	福建晶安光电有限公司	晶圆被加工面加工质量及切割表面切割质量的检验方法
CN112192769B (zh) *	2020-09-24	2024-06-28	福州天瑞线锯科技有限公司	一种开方机硅晶棒料夹持装置
CN213796561U (zh) *	2020-11-17	2021-07-27	苏州市渤华科技研发有限公司	一种工业机器人用夹紧装置
CN117656272A (zh) *	2021-11-01	2024-03-08	青岛高测科技股份有限公司	硅棒切割*的切割装置及硅棒切割*
CN114012916A (zh) *	2021-11-01	2022-02-08	青岛高测科技股份有限公司	硅棒切割*的切割装置及硅棒切割*

2021
- 2021-11-01 CN CN202311728156.7A patent/CN117656272A/zh active Pending
- 2021-11-01 CN CN202111284174.1A patent/CN114589824B/zh active Active
2022
- 2022-10-26 WO PCT/CN2022/127598 patent/WO2023072126A1/fr unknown

Also Published As

Publication number	Publication date
WO2023072126A1 (fr)	2023-05-04
CN114589824B (zh)	2024-02-02
CN114589824A (zh)	2022-06-07

Legal Events

Date	Code	Title
2024-03-08	PB01	Publication
2024-03-08	PB01	Publication
2024-03-26	SE01	Entry into force of request for substantive examination
2024-03-26	SE01	Entry into force of request for substantive examination

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CN117656272A - 硅棒切割***的切割装置及硅棒切割*** - Google Patents