CN117644074A - Mask cleaning method, device, terminal equipment and storage medium - Google Patents
Mask cleaning method, device, terminal equipment and storage medium Download PDFInfo
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- CN117644074A CN117644074A CN202410123621.2A CN202410123621A CN117644074A CN 117644074 A CN117644074 A CN 117644074A CN 202410123621 A CN202410123621 A CN 202410123621A CN 117644074 A CN117644074 A CN 117644074A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 617
- 238000000034 method Methods 0.000 title claims abstract description 106
- 238000003860 storage Methods 0.000 title claims abstract description 14
- 238000005507 spraying Methods 0.000 claims abstract description 105
- 238000001514 detection method Methods 0.000 claims abstract description 66
- 230000003287 optical effect Effects 0.000 claims abstract description 31
- 238000007689 inspection Methods 0.000 claims abstract description 30
- 239000000243 solution Substances 0.000 claims description 177
- 239000005416 organic matter Substances 0.000 claims description 47
- 239000013618 particulate matter Substances 0.000 claims description 41
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 40
- 238000004458 analytical method Methods 0.000 claims description 37
- 239000008367 deionised water Substances 0.000 claims description 36
- 229910021641 deionized water Inorganic materials 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 25
- 238000007405 data analysis Methods 0.000 claims description 15
- 230000002159 abnormal effect Effects 0.000 claims description 11
- 239000007921 spray Substances 0.000 claims description 8
- 238000010790 dilution Methods 0.000 claims description 7
- 239000012895 dilution Substances 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 10
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 238000002242 deionisation method Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000012498 ultrapure water Substances 0.000 description 4
- 229910001868 water Inorganic materials 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 239000000306 component Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000005342 ion exchange Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000010327 methods by industry Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000003908 quality control method Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910021642 ultra pure water Inorganic materials 0.000 description 2
- 238000005411 Van der Waals force Methods 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000013212 metal-organic material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- -1 organic matters Substances 0.000 description 1
- 239000002957 persistent organic pollutant Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
- G05B19/05—Programmable logic controllers, e.g. simulating logic interconnections of signals according to ladder diagrams or function charts
- G05B19/054—Input/output
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention discloses a mask plate cleaning method, a device, terminal equipment and a storage medium, wherein the method comprises the following steps: performing dirt detection on the mask plate through the optical inspection system to obtain a detection result; generating a cleaning flow according to the detection result, and acquiring cleaning parameters according to the cleaning flow; inputting the cleaning parameters into the logic controller, controlling the mask plate tray to rotate through the logic controller, and controlling the spraying device to clean the mask plate to obtain a cleaning result. The invention solves the problem that the mask is not cleaned cleanly due to no corresponding cleaning flow and cleaning parameters in the process of cleaning the mask, and improves the efficiency of cleaning the mask.
Description
Technical Field
The present invention relates to the field of reticle technologies, and in particular, to a method and apparatus for cleaning a reticle, a terminal device, and a storage medium.
Background
The full-automatic cleaning equipment enables the mask plate to be subjected to a further cleaning process after exposure treatment, development, etching and demolding processes are completed, and aims to remove impurities such as organic matters and particles on the surface of the mask plate in the process engineering, and the cleanliness of the surface of the mask plate can be further improved after the mask plate is cleaned by the cleaning equipment.
However, in the existing cleaning process, the cleaning process is not clean because the solution and the parameters of the rotating motor of the equipment during cleaning are not controlled in the cleaning process.
Therefore, the invention provides a mask plate cleaning method, which aims to solve the problem that the mask plate is not cleaned cleanly due to the fact that no corresponding cleaning flow and cleaning parameters are used for cleaning the mask plate.
The foregoing is provided merely for the purpose of facilitating understanding of the technical solutions of the present invention and is not intended to represent an admission that the foregoing is prior art.
Disclosure of Invention
The invention mainly aims to provide a mask plate cleaning method, a device, terminal equipment and a storage medium, and aims to solve the technical problem that cleaning is not clean because no corresponding cleaning flow and cleaning parameters are used for cleaning the mask plate.
In order to achieve the above object, the present invention provides a reticle cleaning method applied to a cleaning apparatus including an optical inspection system, a logic controller, a spraying device, and a reticle tray, comprising the steps of:
performing dirt detection on the mask plate through the optical inspection system to obtain a detection result;
Generating a cleaning flow according to the detection result, and acquiring cleaning parameters according to the cleaning flow;
inputting the cleaning parameters into the logic controller, controlling the mask plate tray to rotate through the logic controller, and controlling the spraying device to clean the mask plate to obtain a cleaning result.
Optionally, the step of generating a cleaning flow according to the detection result and acquiring the cleaning parameter according to the cleaning flow includes:
analyzing the detection result to obtain organic matter information and particulate matter information;
carrying out data analysis according to a preset solution analysis result and the organic matter information to obtain organic matter cleaning solution information and a first rotation parameter;
carrying out data analysis according to the solution analysis result and the particulate matter information to obtain particulate matter cleaning solution information and a second rotation parameter;
generating a flow according to the organic matter cleaning solution information, the first rotation parameters, the particulate matter cleaning solution information and the second rotation parameters, and obtaining a cleaning flow;
and carrying out parameter configuration on the cleaning flow according to the parameter format of the logic controller to obtain cleaning parameters.
Optionally, the step of performing data analysis according to a preset solution analysis result and the organic matter information to obtain organic matter cleaning solution information and a first rotation parameter further includes:
performing material identification on the mask plate to obtain material information of the mask plate;
and carrying out cleaning solution analysis according to the material information of the mask plate to obtain a solution analysis result.
Optionally, the step of controlling, by the logic controller, the reticle tray to rotate and controlling the spraying device to clean the reticle, and obtaining a cleaning result includes:
reading the cleaning parameters through the logic controller to obtain organic cleaning solution information, particulate cleaning solution information, a first rotation parameter and a second rotation parameter;
according to the organic matter cleaning solution information and the first rotation parameter, cleaning the mask plate through the spraying device to obtain a first cleaning result;
according to the first cleaning result, the particulate matter cleaning solution information and the second rotation parameter, cleaning the mask plate through the spraying device to obtain a second cleaning result;
And carrying out summarized analysis on the first cleaning result and the second cleaning result to obtain the cleaning result.
Optionally, the step of cleaning the mask plate by the spraying device according to the organic cleaning solution information and the first rotation parameter to obtain a first cleaning result includes:
according to the organic matter cleaning solution information, spraying a first cleaning solution corresponding to the organic matter cleaning solution information to the mask plate through the spraying device, and controlling the mask plate tray to rotate according to the first rotation parameter to obtain a third cleaning result;
detecting the third cleaning result to obtain first legacy information of the first cleaning solution;
and according to the first legacy information, acquiring first spraying information of the cold deionized water and the hot deionized water, and according to the first spraying information, spraying the cold deionized water and the hot deionized water to the mask plate through the spraying device for dilution cleaning, so as to acquire a first cleaning result.
Optionally, the step of cleaning the mask plate by the spraying device according to the first cleaning result, the particulate matter cleaning solution information and the second rotation parameter to obtain a second cleaning result includes:
According to the first cleaning result and the particulate matter cleaning solution information, spraying a second cleaning solution corresponding to the particulate matter cleaning solution information to the mask plate through the spraying device, and controlling the mask plate tray to rotate according to the second rotation parameter to obtain a fourth cleaning result;
detecting the fourth cleaning result to obtain second legacy information of the second cleaning solution;
and according to the second legacy information, acquiring second spraying information of the cold deionized water, and according to the second spraying information, spraying the cold deionized water to the mask plate through the spraying device to dilute and clean the mask plate, so as to acquire a second cleaning result.
Optionally, the step of inputting the cleaning parameter into the logic controller, controlling the reticle tray to rotate by the logic controller, and controlling the spraying device to clean the reticle, and after the step of obtaining the cleaning result, further includes:
the mask plate is cleaned and detected through the optical inspection system, and the cleaning degree is obtained;
according to a preset cleaning threshold value, carrying out threshold analysis on the cleaning degree;
If the cleaning degree exceeds the cleaning threshold, generating notification information according to the cleaning degree and a cleaning result and sending the notification information to a corresponding user;
if the cleaning degree does not exceed the cleaning threshold, generating abnormal alarm information according to the cleaning degree and the cleaning result and sending the abnormal alarm information to a corresponding user.
The embodiment of the invention also provides a mask plate cleaning device, which comprises:
the detection module is used for carrying out dirt detection on the mask plate through the optical inspection system to obtain a detection result;
the parameter acquisition module is used for generating a cleaning flow according to the detection result and acquiring cleaning parameters according to the cleaning flow;
and the cleaning module is used for inputting the cleaning parameters into the logic controller, controlling the mask plate tray to rotate through the logic controller, and controlling the spraying device to clean the mask plate to obtain a cleaning result.
The embodiment of the invention also provides a terminal device which comprises a memory, a processor and a mask cleaning program stored in the memory and capable of running on the processor, wherein the mask cleaning program is executed by the processor to realize the steps of the mask cleaning method.
The embodiment of the invention also provides a computer readable storage medium, wherein the computer readable storage medium stores a mask cleaning program, and the mask cleaning program realizes the steps of the mask cleaning method when being executed by a processor.
The embodiment of the invention provides a mask cleaning method, a device, terminal equipment and a storage medium, wherein the mask is subjected to dirt detection through the optical inspection system, and a detection result is obtained; generating a cleaning flow according to the detection result, and acquiring cleaning parameters according to the cleaning flow; inputting the cleaning parameters into the logic controller, controlling the mask plate tray to rotate through the logic controller, and controlling the spraying device to clean the mask plate to obtain a cleaning result. Therefore, the mask plate is subjected to dirt detection through the cleaning equipment to obtain a detection result, a corresponding cleaning flow and cleaning parameters are obtained aiming at the detection result, the mask plate is cleaned based on the cleaning flow and the cleaning parameters, the cleaning result is obtained, the mask plate is cleaned, the problem that the mask plate is not cleaned cleanly due to the fact that the mask plate is not cleaned by the corresponding cleaning flow and the cleaning parameters is solved, and the mask plate cleaning efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of functional modules of a terminal device to which a reticle cleaning device of the present invention belongs;
FIG. 2 is a flow chart of an exemplary embodiment of a reticle cleaning method of the present invention;
FIG. 3 is a schematic diagram of a reticle cleaning method of the present invention involving a reticle and a cleaning apparatus;
FIG. 4 is a cross-sectional view of a reticle cleaning apparatus of the present invention;
FIG. 5 is a schematic diagram of a reticle cleaning method of the present invention involving an original cleaning mode;
FIG. 6 is a schematic diagram of an overall cleaning process of the reticle cleaning method of the present invention;
FIG. 7 is a schematic diagram of a reticle cleaning method of the present invention involving the logic control of an overall cleaning process;
FIG. 8 is a flow chart of another exemplary embodiment of a reticle cleaning method of the present invention;
FIG. 9 is a schematic diagram of a reticle cleaning method of the present invention involving obtaining a first cleaning result;
FIG. 10 is a schematic diagram of a reticle cleaning method of the present invention involving obtaining a second cleaning result;
the achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
The main solutions of the embodiments of the present invention are: analyzing the detection result to obtain organic matter information and particulate matter information; carrying out data analysis according to a preset solution analysis result and the organic matter information to obtain organic matter cleaning solution information and a first rotation parameter; carrying out data analysis according to the solution analysis result and the particulate matter information to obtain particulate matter cleaning solution information and a second rotation parameter; generating a flow according to the organic matter cleaning solution information, the first rotation parameters, the particulate matter cleaning solution information and the second rotation parameters, and obtaining a cleaning flow; and carrying out parameter configuration on the cleaning flow according to the parameter format of the logic controller to obtain cleaning parameters. Performing material identification on the mask plate to obtain material information of the mask plate; and carrying out cleaning solution analysis according to the material information of the mask plate to obtain a solution analysis result. Reading the cleaning parameters through the logic controller to obtain organic cleaning solution information, particulate cleaning solution information, a first rotation parameter and a second rotation parameter; according to the organic matter cleaning solution information and the first rotation parameter, cleaning the mask plate through the spraying device to obtain a first cleaning result; according to the first cleaning result, the particulate matter cleaning solution information and the second rotation parameter, cleaning the mask plate through the spraying device to obtain a second cleaning result; and carrying out summarized analysis on the first cleaning result and the second cleaning result to obtain the cleaning result. According to the organic matter cleaning solution information, spraying a first cleaning solution corresponding to the organic matter cleaning solution information to the mask plate through the spraying device, and controlling the mask plate tray to rotate according to the first rotation parameter to obtain a third cleaning result; detecting the third cleaning result to obtain first legacy information of the first cleaning solution; and according to the first legacy information, acquiring first spraying information of the cold deionized water and the hot deionized water, and according to the first spraying information, spraying the cold deionized water and the hot deionized water to the mask plate through the spraying device for dilution cleaning, so as to acquire a first cleaning result. According to the first cleaning result and the particulate matter cleaning solution information, spraying a second cleaning solution corresponding to the particulate matter cleaning solution information to the mask plate through the spraying device, and controlling the mask plate tray to rotate according to the second rotation parameter to obtain a fourth cleaning result; detecting the fourth cleaning result to obtain second legacy information of the second cleaning solution; and according to the second legacy information, acquiring second spraying information of the cold deionized water, and according to the second spraying information, spraying the cold deionized water to the mask plate through the spraying device to dilute and clean the mask plate, so as to acquire a second cleaning result. The mask plate is cleaned and detected through the optical inspection system, and the cleaning degree is obtained; according to a preset cleaning threshold value, carrying out threshold analysis on the cleaning degree; if the cleaning degree exceeds the cleaning threshold, generating notification information according to the cleaning degree and a cleaning result and sending the notification information to a corresponding user; if the cleaning degree does not exceed the cleaning threshold, generating abnormal alarm information according to the cleaning degree and the cleaning result and sending the abnormal alarm information to a corresponding user. Therefore, the problem that the mask is not cleaned cleanly due to the fact that no corresponding cleaning flow and cleaning parameters are adopted in the mask cleaning process is solved, the mask is cleaned, and the mask cleaning efficiency is improved. Based on the scheme of the invention, the mask plate cleaning method is designed from the problem that the mask plate is not cleaned cleanly due to the fact that a corresponding cleaning flow and a corresponding cleaning parameter are not available in the mask plate cleaning process in the actual process of cleaning the mask plate, the effectiveness of the mask plate cleaning method is verified when the mask plate is cleaned, and finally the mask plate cleaning efficiency is obviously improved through the mask plate cleaning method.
Technical terms related to the embodiment of the invention:
and (3) masking plate: an optical mold composed of a metal layer film with information such as graphics and characters recorded on the surface and a high-purity fused quartz or other transparent material substrate is widely used in microelectronic processing or semiconductor production exposure processes.
AOI: AOI is an abbreviation of automatic optical inspection (Automated Optical Inspection), is an automatic detection method realized by utilizing a computer vision technology, is mainly used for detection and quality control in the manufacturing process of electronic components such as a PCB (printed Circuit Board), an LCD (liquid Crystal display) panel and the like, an AOI system is used for collecting images of objects to be detected through a camera or a scanner, and then the images are processed and analyzed by using an image processing and analyzing algorithm to judge whether the objects to be detected are qualified or not or find defects and faults in the objects to be detected.
SPM solution: the volume fraction of the dilute sulfuric acid is 98 percent and the hydrogen peroxide is 30 percent according to the following formula of 4:1, and has extremely strong oxidizing ability at a certain temperature.
Cold DI: cold DI (Cold DI) is commonly referred to as a cooled ion exchange (deionizing) system, also known as a cooling water Deionization (Cooling Water Deionization) system, which is used to treat impurities and ions in industrial cooling water to provide high purity cooling water.
Thermal DI: thermal DI may refer to a thermal regenerative ion exchange (Deionization) system, also known as a Hot water Deionization (Hot Water Deionization) system, which is used to treat impurities and ions in high temperature water to provide high purity Hot water.
SC1: the SC1 solution is a chemical cleaning solution used in the semiconductor process, SC1 represents "Standard Clean 1", also called Standard cleaning 1 solution, the SC1 solution is mainly formed by mixing high-purity water (usually deionized water) and ammonia water (NH 3) with lower concentration, the typical ratio is 1:1 by volume, a small amount of hydrogen peroxide (H2O 2) can be added to enhance the cleaning effect, and the SC1 solution is mainly used for removing organic and inorganic impurities on the silicon surface in the semiconductor manufacturing process and can effectively remove organic matters, oxides and metal residues deposited on a silicon wafer so as to realize surface cleaning.
The embodiment of the invention considers that when the mask is cleaned in the related technology, the mask is cleaned by a uniform speed cleaning method in the cleaning process in the existing cleaning technology, and the corresponding cleaning solution selecting method is not available, so that the condition of unclean cleaning exists, and the problem of unclean cleaning exists in the mode.
Therefore, in the embodiment of the invention, the problem that the mask is not clean because the mask is cleaned in the actual process without a corresponding cleaning flow and the rotation parameters during the mask cleaning are adjusted by the cleaning parameters is solved, the effectiveness of the mask cleaning method is verified when the mask is cleaned, and finally the efficiency of the mask cleaning by the method is obviously improved.
Specifically, referring to fig. 1, fig. 1 is a schematic diagram of a functional board of a terminal device to which the reticle cleaning device of the present invention belongs. The reticle cleaning device may be independent of the device of the terminal apparatus that is capable of reticle cleaning, and may be carried on the terminal apparatus in the form of hardware or software. The terminal equipment can be intelligent mobile equipment with a data processing function such as a mobile phone and a tablet personal computer, and can also be fixed terminal equipment or a server with a data processing function.
In this embodiment, the terminal device to which the reticle cleaning device belongs at least includes an output module 110, a processor 120, a memory 130, and a communication module 140.
The memory 130 stores an operating system and a mask cleaning program, and the mask cleaning device can perform dirt detection on the mask through the optical inspection system to obtain a detection result; generating a cleaning flow according to the detection result, and acquiring cleaning parameters according to the cleaning flow; inputting the cleaning parameters into the logic controller, controlling the mask plate tray to rotate through the logic controller, and controlling the spraying device to clean the mask plate to obtain a cleaning result. Performing a reticle cleaning by the reticle cleaning program, and storing the information such as a cleaning result in the memory 130; the output module 110 may be a display screen or the like. The communication module 140 may include a WIFI module, a mobile communication module, a bluetooth module, and the like, and communicates with an external device or a server through the communication module 140.
Wherein the reticle cleaning program in memory 130 when executed by the processor performs the steps of:
performing dirt detection on the mask plate through the optical inspection system to obtain a detection result;
Generating a cleaning flow according to the detection result, and acquiring cleaning parameters according to the cleaning flow;
inputting the cleaning parameters into the logic controller, controlling the mask plate tray to rotate through the logic controller, and controlling the spraying device to clean the mask plate to obtain a cleaning result.
Further, the reticle cleaning program in the memory 130 when executed by the processor also performs the steps of:
analyzing the detection result to obtain organic matter information and particulate matter information;
carrying out data analysis according to a preset solution analysis result and the organic matter information to obtain organic matter cleaning solution information and a first rotation parameter;
carrying out data analysis according to the solution analysis result and the particulate matter information to obtain particulate matter cleaning solution information and a second rotation parameter;
generating a flow according to the organic matter cleaning solution information, the first rotation parameters, the particulate matter cleaning solution information and the second rotation parameters, and obtaining a cleaning flow;
and carrying out parameter configuration on the cleaning flow according to the parameter format of the logic controller to obtain cleaning parameters.
Further, the reticle cleaning program in the memory 130 when executed by the processor also performs the steps of:
performing material identification on the mask plate to obtain material information of the mask plate;
and carrying out cleaning solution analysis according to the material information of the mask plate to obtain a solution analysis result.
Further, the reticle cleaning program in the memory 130 when executed by the processor also performs the steps of:
reading the cleaning parameters through the logic controller to obtain organic cleaning solution information, particulate cleaning solution information, a first rotation parameter and a second rotation parameter;
according to the organic matter cleaning solution information and the first rotation parameter, cleaning the mask plate through the spraying device to obtain a first cleaning result;
according to the first cleaning result, the particulate matter cleaning solution information and the second rotation parameter, cleaning the mask plate through the spraying device to obtain a second cleaning result;
and carrying out summarized analysis on the first cleaning result and the second cleaning result to obtain the cleaning result.
Further, the reticle cleaning program in the memory 130 when executed by the processor also performs the steps of:
According to the organic matter cleaning solution information, spraying a first cleaning solution corresponding to the organic matter cleaning solution information to the mask plate through the spraying device, and controlling the mask plate tray to rotate according to the first rotation parameter to obtain a third cleaning result;
detecting the third cleaning result to obtain first legacy information of the first cleaning solution;
and according to the first legacy information, acquiring first spraying information of the cold deionized water and the hot deionized water, and according to the first spraying information, spraying the cold deionized water and the hot deionized water to the mask plate through the spraying device for dilution cleaning, so as to acquire a first cleaning result.
Further, the reticle cleaning program in the memory 130 when executed by the processor also performs the steps of:
according to the first cleaning result and the particulate matter cleaning solution information, spraying a second cleaning solution corresponding to the particulate matter cleaning solution information to the mask plate through the spraying device, and controlling the mask plate tray to rotate according to the second rotation parameter to obtain a fourth cleaning result;
detecting the fourth cleaning result to obtain second legacy information of the second cleaning solution;
And according to the second legacy information, acquiring second spraying information of the cold deionized water, and according to the second spraying information, spraying the cold deionized water to the mask plate through the spraying device to dilute and clean the mask plate, so as to acquire a second cleaning result.
Further, the reticle cleaning program in the memory 130 when executed by the processor also performs the steps of:
the mask plate is cleaned and detected through the optical inspection system, and the cleaning degree is obtained;
according to a preset cleaning threshold value, carrying out threshold analysis on the cleaning degree;
if the cleaning degree exceeds the cleaning threshold, generating notification information according to the cleaning degree and a cleaning result and sending the notification information to a corresponding user;
if the cleaning degree does not exceed the cleaning threshold, generating abnormal alarm information according to the cleaning degree and the cleaning result and sending the abnormal alarm information to a corresponding user.
According to the technical scheme, the optical inspection system is used for detecting dirt on the mask plate to obtain a detection result; generating a cleaning flow according to the detection result, and acquiring cleaning parameters according to the cleaning flow; the cleaning parameters are input into the logic controller, the mask tray is controlled to rotate through the logic controller, the spraying device is controlled to clean the mask, and the cleaning result is obtained, so that the problem that the mask is not cleaned cleanly due to the fact that no corresponding cleaning flow and cleaning parameters are used for cleaning the mask can be solved. Based on the scheme of the invention, the mask plate cleaning method is designed from the problem that the mask plate is not cleaned cleanly due to the fact that a corresponding cleaning flow and a corresponding cleaning parameter are not available in the mask plate cleaning process in the actual process of cleaning the mask plate, the effectiveness of the mask plate cleaning method is verified when the mask plate is cleaned, and finally the mask plate cleaning efficiency is obviously improved through the mask plate cleaning method.
The method embodiments of the present invention are presented based on the above-described terminal device architecture but not limited to the above-described framework.
Referring to fig. 2, fig. 2 is a schematic flow chart of an exemplary embodiment of a reticle cleaning method according to the present invention. The mask cleaning method comprises the following steps:
step S01, performing dirt detection on the mask plate through the optical inspection system to obtain a detection result;
the main body of the method of this embodiment may be a reticle cleaning device, or may be a reticle cleaning terminal or server, and this embodiment uses the reticle cleaning device as an example, and the reticle cleaning device may be integrated on a terminal device having a data processing function.
It should be understood that the mask plate needs to be cleaned after the exposure process, development, etching and demolding processes are completed, in order to remove impurities such as organic matters, particles and the like on the surface of the mask plate in the process engineering, the cleanliness of the surface of the mask plate is further improved through the cleaning of cleaning equipment, but the conventional cleaning process is used for cleaning in a uniform motion mode because no corresponding cleaning flow and cleaning parameters exist in the cleaning process, and the condition of uncleanness in the cleaning mode exists.
Before the cleaning equipment of the embodiment cleans the mask, an optical inspection system is adopted to carry out dirt detection on the mask to obtain a detection result, namely the dirt condition of the mask, wherein the optical inspection system refers to AOI, namely the abbreviation of automatic optical inspection (Automated Optical Inspection), is an automatic detection method realized by utilizing a computer vision technology, and is mainly used for detection and quality control in the manufacturing process of electronic components such as a PCB (printed Circuit Board), an LCD (liquid Crystal display) panel and the like.
Step S02, generating a cleaning flow according to the detection result, and acquiring cleaning parameters according to the cleaning flow;
after the inspection by the optical inspection system, at least organic matter dirt condition, particulate matter dirt condition and the like of the mask plate are detected, and corresponding solvent selection, proportioning and corresponding cleaning flow generation can be performed based on the specific dirt condition, so that flow acquisition is performed according to the detection result, and a cleaning flow aiming at the dirt condition of the current mask plate is obtained;
However, it should be clear that after the cleaning process is generated, the specific mask cleaning operation needs to be performed by the corresponding logic controller, so that the parameter configuration is performed according to the cleaning process, and the corresponding cleaning parameters are obtained for the logic controller to read and operate.
And S03, inputting the cleaning parameters into the logic controller, controlling the mask plate tray to rotate through the logic controller, and controlling the spraying device to clean the mask plate to obtain a cleaning result.
After the corresponding cleaning parameters are obtained, the cleaning parameters are input into a Logic Controller, wherein the Logic Controller (Logic Controller) is equipment for controlling and managing an industrial automation system, is a core component part in the automation system, is used for executing Logic operation, judging the state of input signals and outputting corresponding control signals according to preset rules and programs, and is a PLC (Programmable Logic Controller ) which has the characteristics of programmability, flexibility, reliability and easy maintenance;
the logic controller selects a corresponding cleaning solvent according to the received cleaning parameters, sprays the mask plate through the spraying device, and simultaneously controls the rotating motor to drive the mask plate tray to rotate, so that the mask plate is sprayed more uniformly, and after the mask plate is sprayed uniformly, the rotating frequency of the rotating motor is controlled, so that stains attached to the surface of the mask plate are removed more effectively by utilizing centrifugal force, inertia and the like.
As shown in fig. 3, fig. 3 is a top view of the cleaning apparatus when the reticle is loaded, and fig. 3 is a front view of the cleaning apparatus, where the specific configuration is as follows: 1, a mask plate, 2, a rotary tray supporting device, 3, an inner cavity cleaning spray head, 4, an inner cavity, 5, an outer cavity, 6, an outer cavity cleaning spray head, 7, an ultrapure water cleaning spray head (cold), 8, an ultrapure water cleaning spray head (hot), 9, a waste discharge pipe and 10, a lifting device, and further, the cleaning equipment of the embodiment is shown in fig. 4, and fig. 4 is a cross-sectional view of the cleaning equipment.
Because the detection result includes organic dirt and particulate dirt, the step S02 includes the steps of generating a cleaning flow according to the detection result and acquiring the cleaning parameter according to the cleaning flow, where the cleaning parameter can be generated specifically at this time:
step S021, analyzing the detection result to obtain organic matter information and particulate matter information;
step S024, carrying out data analysis according to a preset solution analysis result and the organic matter information to obtain organic matter cleaning solution information and a first rotation parameter;
step S025, carrying out data analysis according to the solution analysis result and the particulate matter information to obtain particulate matter cleaning solution information and a second rotation parameter;
Step S026, carrying out process generation according to the organic matter cleaning solution information, the first rotation parameters, the particulate matter cleaning solution information and the second rotation parameters to obtain a cleaning process;
and step S027, carrying out parameter configuration on the cleaning flow according to the parameter format of the logic controller to obtain cleaning parameters.
Analyzing the detection result to obtain organic matter information and particulate matter information on the mask, wherein the organic matter dirt and the particulate matter dirt generated when the mask passes through different procedures are different, so that the mask is cleaned more accurately and resources are not wasted, and the detection result is analyzed to obtain specific solution and solution quantity which need to be used and centrifugal force (namely corresponding rotation parameters) which need to be obtained;
according to the pre-acquired solution analysis result and the organic matter information, data analysis is carried out to obtain proportioning information and required quantity of the organic matter cleaning solution, and besides, the rotation parameters of the corresponding rotating motor are also obtained and are used for determining how much centrifugal force is generated;
in addition to considering the condition of organic contamination, it should be noted that particulate contamination may also exist on the mask, so that data analysis is performed according to the solution analysis result and the particulate information to obtain particulate cleaning solution information and a second rotation parameter;
After the corresponding cleaning solution information and the rotation parameters are obtained, the cleaning process can be analyzed to obtain the cleaning process which is specifically carried out by the cleaning equipment;
because the logic controllers use different parameter logic, the cleaning flow needs to be subjected to parameter configuration to obtain cleaning configuration, and the cleaning configuration is sent to the logic controllers to be read and operated;
in the present embodiment, the organic dirt and the particulate dirt are mainly aimed at, but the specific cleaning process should be understood to include, but not limited to, specific determination according to the actual operation scenario and the detection result.
More specifically, since the mask is made of multiple materials, a certain limitation and a certain proportion are required to be performed on the cleaning solution, so step S024 is performed to perform data analysis according to a preset solution analysis result and the organic matter information, and the step of obtaining the organic matter cleaning solution information and the first rotation parameter further includes:
step S022, carrying out material identification on the mask plate to obtain material information of the mask plate;
and step S023, carrying out cleaning solution analysis according to the material information of the mask plate to obtain a solution analysis result.
Identifying the material of the mask plate to be cleaned to obtain material information of the mask plate, wherein the material of the mask plate comprises but is not limited to quartz material, glass material, metal material, organic material and the like, and a cleaning solution to be considered corresponding to the material needs to be determined so as not to damage the mask plate;
after the material information of the mask is obtained, the cleaning solution can be analyzed according to the material information to obtain a solution analysis result, and it should be noted that the mask in the application is exemplified by quartz material.
Specifically, as shown in fig. 5, fig. 5 is a schematic diagram of an original cleaning mode in the original mask cleaning process, the cleaning process is generally divided into a cleaning section and a spin-drying section, and the corresponding flow is as follows: SPM solution cleaning, cold DI and hot DI cleaning, SC1 solution cleaning and cold DI cleaning, and the spin-drying section mainly spin-dries the cleaning solution and mainly comprises spin-cleaning solution, drying and the like;
as shown in fig. 6, fig. 6 is a schematic diagram of an overall cleaning procedure of the mask cleaning method according to the present invention, in which the solution adopted in the present embodiment includes an SPM solution (which is prepared by mixing dilute sulfuric acid with a volume fraction of 98% and hydrogen peroxide with a volume fraction of 30% according to a ratio of 4:1, and has extremely strong oxidizing ability at a certain temperature), a cold DI solution and a hot DI solution, the SC1 solution is used for removing particulate dirt of the mask, the SC1 solution is a chemical cleaning solution used in a semiconductor process, SC1 represents "Standard Clean 1", also referred to as a Standard cleaning 1 solution, the SC1 solution is mainly prepared by mixing high-purity water (usually deionized water) and relatively low-concentration ammonia water (NH 3), and a typical ratio is a volume ratio of 1:1, and sometimes a small amount of hydrogen peroxide (H2O 2) may be added to enhance the cleaning effect, and the SC1 solution is mainly used for removing organic and inorganic impurities on the silicon surface in the semiconductor manufacturing process, and can effectively remove organic matters, oxides and metal residues deposited on the surface to Clean the silicon wafer, so as to implement the cold DI solution;
In the figure, the information can be obtained that the rotation speed of the rotating motor is not constant in the process of cleaning different solutions, namely, the rotation speed of the rotating motor for driving the mask tray to rotate is variable, the generated centrifugal force can better clean dirt of the mask, and the specific rotation speed control is determined according to the dirt information;
in this embodiment, as shown in fig. 7, after the detection result is obtained, the PC, that is, the cleaning device, inputs the program parameters (detection result), reads the program parameters, processes and outputs the program signals, and sends the program signals to the PLC controller, and the PLC controller controls the rotating motor to execute the parameter configuration corresponding to the program, so as to clean the mask.
According to the technical scheme, the optical inspection system is used for detecting dirt on the mask plate to obtain a detection result; generating a cleaning flow according to the detection result, and acquiring cleaning parameters according to the cleaning flow; inputting the cleaning parameters into the logic controller, controlling the mask plate tray to rotate through the logic controller, and controlling the spraying device to clean the mask plate to obtain a cleaning result. Therefore, the mask plate is subjected to dirt detection through the cleaning equipment to obtain a detection result, a corresponding cleaning flow and cleaning parameters are obtained aiming at the detection result, the mask plate is cleaned based on the cleaning flow and the cleaning parameters, the cleaning result is obtained, the mask plate is cleaned, the problem that the mask plate is not cleaned cleanly due to the fact that the mask plate is not cleaned by the corresponding cleaning flow and the cleaning parameters is solved, and the mask plate cleaning efficiency is improved.
Referring to fig. 8, fig. 8 is a flow chart illustrating another exemplary embodiment of a reticle cleaning method according to the present invention.
Based on the embodiment shown in fig. 2, the step S03 of controlling, by the logic controller, the reticle tray to rotate and controlling the spraying device to clean the reticle, and the step of obtaining the cleaning result includes:
step S031, reading the cleaning parameters through the logic controller to obtain organic cleaning solution information, particulate cleaning solution information, a first rotation parameter and a second rotation parameter;
step S032, cleaning the mask plate through the spraying device according to the organic cleaning solution information and the first rotation parameter to obtain a first cleaning result;
step S033, cleaning the mask plate by the spraying device according to the first cleaning result, the particulate matter cleaning solution information and the second rotation parameter, to obtain a second cleaning result;
and step S034, performing summary analysis on the first cleaning result and the second cleaning result to obtain a cleaning result.
The mask plate in this embodiment is made of quartz, and the specific process of cleaning the mask plate is as follows:
After the logic controller receives the cleaning parameters, reading the cleaning parameters to obtain organic cleaning solution information, particulate cleaning solution information, a first rotation parameter and a second rotation parameter;
after specific solution information and rotation parameters are obtained, the method also comprises a corresponding operation flow and logic, so that organic matter dirt is removed firstly, namely, a rotating motor is controlled to drive a mask plate tray to rotate by using the organic matter solution information and the first rotation parameters, and a spraying device is controlled to clean the mask plate to obtain a first cleaning result;
after the organic matter dirt is removed, the particle dirt of the mask plate is required to be removed, at the moment, the rotating motor is controlled to drive the mask plate tray to rotate by using the particle solution information and the second rotating parameter, and the spraying device is controlled to clean the mask plate, so that a second cleaning result is obtained;
after the first cleaning result and the second cleaning result are obtained, they are collectively analyzed to obtain the cleaning result, and it should be understood that, in order to avoid carryover of the organic cleaning solution and the particulate cleaning solution, the embodiment also uses cold DI and hot DI solutions to clean, and records the cleaning processes and the cleaning results of the multiple solutions, so that backtracking can be performed when a problem occurs.
Specifically, in the step S032, according to the organic cleaning solution information and the first rotation parameter, the step of cleaning the mask plate by the spraying device to obtain a first cleaning result includes:
step S0321, according to the organic cleaning solution information, spraying a first cleaning solution corresponding to the organic cleaning solution information to the mask plate through the spraying device, and controlling the mask plate tray to rotate according to the first rotation parameter to obtain a third cleaning result;
step S0322, detecting the third cleaning result to obtain first legacy information of the first cleaning solution;
step S0323, according to the first legacy information, obtaining first spraying information of the cold deionized water and the hot deionized water, and according to the first spraying information, spraying the cold deionized water and the hot deionized water to the mask plate through the spraying device for dilution cleaning, and obtaining a first cleaning result.
The main function of the cleaning solution for organic matters in the embodiment is SPM solution, the main function of the cleaning stage for SPM is to remove the organic matters (such as photoresist, residual photoresist on the prized film, grease, etc.), the most difficult to remove in the actual cleaning process is the glue remained after the prized film, by changing the uniform motion in the original SPM cleaning process, as shown in fig. 9, when the solution begins to spray, the SPM solution is quickly and uniformly covered on the surface of the mask plate through quick acceleration and deceleration, on the other hand, the rotating speed is properly reduced after the covering, so that the SPM solution fully reacts with the organic matters on the surface of the mask plate, and the like repeatedly for a plurality of times, finally, the organic pollutants on the surface of the mask plate are removed through the centrifugal force and inertia which are generated before in a short time through quick acceleration and deceleration, according to the AOI result, the effect of non-uniform cleaning is obviously improved compared with the traditional uniform cleaning in comparison with the non-uniform cleaning mode, and the dirty quantity is reduced by 24% compared with the original cleaning mode;
Then, in order to avoid the SPM solution remained on the mask, the obtained cleaning result is detected to obtain the remained information of the SPM solution, and the spraying information of the cold deionized water (cold DI) and the hot deionized water (hot DI) is obtained according to the remained information of the SPM solution, wherein the spraying information comprises the consumption, the use sequence and the like of the cold deionized water and the hot deionized water;
finally, diluting and cleaning the mask plate according to the obtained spraying information to obtain a cleaning result of organic dirt.
More specifically, in step S033, according to the first cleaning result, the particulate matter cleaning solution information, and the second rotation parameter, the step of cleaning the mask plate by the spraying device, and obtaining the second cleaning result includes:
step S0331, according to the first cleaning result and the particulate matter cleaning solution information, spraying a second cleaning solution corresponding to the particulate matter cleaning solution information to the mask plate through the spraying device, and according to the second rotation parameter, controlling the mask plate tray to rotate, so as to obtain a fourth cleaning result;
step S0332, detecting the fourth cleaning result to obtain second legacy information of the second cleaning solution;
Step S0333, according to the second legacy information, obtaining second spraying information of the cold deionized water, and according to the second spraying information, spraying the cold deionized water to the mask plate by the spraying device to perform dilution cleaning, thereby obtaining a second cleaning result.
For cleaning particulate matters, the particles are generally adsorbed on the surface of the mask plate through Van der Waals force adsorption, electrostatic charge adsorption, capillary adsorption and other actions, chemical bonding is generally difficult to remove, the SC1 solution is quickly and uniformly covered on the surface of the mask plate through quick acceleration and deceleration when the solution begins to spray as shown in fig. 10 by changing the uniform motion in the original SC1 cleaning process, on the other hand, the rotating speed is properly reduced after the solution is covered, the particles on the surface of the mask plate are fully reacted with the SC1 solution, the steps are repeated for a plurality of times, finally, the particulate pollutants on the surface of the mask plate are removed through larger centrifugal force and inertia generated before quick acceleration and deceleration in a short time, and an AOI result shows that compared with the traditional uniform cleaning mode, the effect of the non-uniform cleaning is obviously improved, and the dirt quantity is reduced by 33% compared with the original cleaning mode;
For the SC1 solution, this embodiment also provides a removal method, that is, a cold DI cleaning stage, which only performs dilution cleaning on the residual SC1 solution, mainly removes nh4+ ions remaining on the surface of the reticle, because the nh4+ ions form haze (haze) during the subsequent use process of returning to the factory, thereby affecting the service life of the reticle.
After the cleaning result is obtained, the cleaning degree of the result and the mask plate can be traced back, so based on the embodiment shown in the above 2, the step S03 of inputting the cleaning parameter into the logic controller, controlling the mask plate tray to rotate by the logic controller, and controlling the spraying device to clean the mask plate, and the step of obtaining the cleaning result further includes:
step S04, cleaning and detecting the mask plate through the optical inspection system to obtain the cleaning degree;
step S05, carrying out threshold analysis on the cleaning degree according to a preset cleaning threshold;
step S06, if the cleaning degree exceeds the cleaning threshold, generating notification information according to the cleaning degree and the cleaning result and sending the notification information to the corresponding user;
And S07, if the cleaning degree does not exceed the cleaning threshold, generating abnormal alarm information according to the cleaning degree and the cleaning result and sending the abnormal alarm information to a corresponding user.
After the cleaning is finished, detecting the mask plate again through an optical inspection system, wherein the obtained result is the cleaning degree of the mask plate, namely whether organic dirt and particulate dirt exist on the mask plate;
it cannot be ignored that due to the use of the mask, some abrasion and dirt are unavoidable, different cleaning thresholds are provided for masks with different use durations, the cleaning thresholds are used for comparison with the cleaning degree, when the cleaning degree exceeds the cleaning threshold, the current mask is proved to be in accordance with the use standard, and at the moment, the cleaning result and the cleaning degree are sent to corresponding users for notification;
when the cleaning degree does not exceed the cleaning threshold value, the fact that the mask possibly cannot be cleaned or worn and dirty degree exceeds the use standard is indicated, and abnormal warning information is generated at the moment and sent to a corresponding user for warning.
According to the scheme, the logic controller is used for reading the cleaning parameters to obtain the organic cleaning solution information, the particulate cleaning solution information, the first rotation parameters and the second rotation parameters; according to the organic matter cleaning solution information and the first rotation parameter, cleaning the mask plate through the spraying device to obtain a first cleaning result; according to the first cleaning result, the particulate matter cleaning solution information and the second rotation parameter, cleaning the mask plate through the spraying device to obtain a second cleaning result; and carrying out summarized analysis on the first cleaning result and the second cleaning result to obtain the cleaning result. Therefore, the mask plate is cleaned based on the acquired cleaning parameters, so that the mask plate is cleaned, the problem that the mask plate is not cleaned cleanly due to the fact that no corresponding cleaning flow and cleaning parameters are adopted for cleaning the mask plate is solved, and the mask plate cleaning efficiency is improved.
In addition, an embodiment of the present invention further provides a reticle cleaning device, where the reticle cleaning device includes:
the detection module is used for carrying out dirt detection on the mask plate through the optical inspection system to obtain a detection result;
the parameter acquisition module is used for generating a cleaning flow according to the detection result and acquiring cleaning parameters according to the cleaning flow;
and the cleaning module is used for inputting the cleaning parameters into the logic controller, controlling the mask plate tray to rotate through the logic controller, and controlling the spraying device to clean the mask plate to obtain a cleaning result.
In addition, the embodiment of the invention also provides a terminal device, which comprises a memory, a processor and a mask cleaning program stored on the memory and capable of running on the processor, wherein the mask cleaning program realizes the steps of the mask cleaning method when being executed by the processor.
Because the mask cleaning program is executed by the processor, all the technical schemes of all the embodiments are adopted, and therefore, the mask cleaning program has at least all the beneficial effects brought by all the technical schemes of all the embodiments, and the description is omitted herein.
In addition, the embodiment of the invention also provides a computer readable storage medium, wherein the computer readable storage medium stores a mask cleaning program, and the mask cleaning program realizes the steps of the mask cleaning method when being executed by a processor.
Because the mask cleaning program is executed by the processor, all the technical schemes of all the embodiments are adopted, and therefore, the mask cleaning program has at least all the beneficial effects brought by all the technical schemes of all the embodiments, and the description is omitted herein.
Compared with the prior art, the method, the device, the terminal equipment and the storage medium for cleaning the mask provided by the embodiment of the invention have the advantages that the optical inspection system is used for detecting dirt of the mask to obtain a detection result; generating a cleaning flow according to the detection result, and acquiring cleaning parameters according to the cleaning flow; inputting the cleaning parameters into the logic controller, controlling the mask plate tray to rotate through the logic controller, and controlling the spraying device to clean the mask plate to obtain a cleaning result. Therefore, the problem that the mask is not cleaned cleanly due to the fact that no corresponding cleaning flow and cleaning parameters are adopted in the mask cleaning process is solved, the mask is cleaned, and the mask cleaning efficiency is improved. Based on the scheme of the invention, the mask plate cleaning method is designed from the problem that the mask plate is not cleaned cleanly due to the fact that a corresponding cleaning flow and a corresponding cleaning parameter are not available in the mask plate cleaning process in the actual process of cleaning the mask plate, the effectiveness of the mask plate cleaning method is verified when the mask plate is cleaned, and finally the mask plate cleaning efficiency is obviously improved through the mask plate cleaning method.
Compared with the prior art, the embodiment of the invention has the following advantages:
1. the rotating speed is controlled in real time by changing the parameters of the rotating motor in the cleaning process, so that stains attached to the surface of the mask plate can be effectively reduced.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.
The foregoing embodiment numbers of the present invention are merely for the purpose of description, and do not represent the advantages or disadvantages of the embodiments.
From the above description of the embodiments, it will be clear to those skilled in the art that the above-described embodiment method may be implemented by means of software plus a necessary general hardware platform, but of course may also be implemented by means of hardware, but in many cases the former is a preferred embodiment. Based on such understanding, the technical solution of the present invention may be embodied essentially or in a part contributing to the prior art in the form of a software product stored in a storage medium (e.g. ROM/RAM, magnetic disk, optical disk) as above, comprising instructions for causing a terminal device (which may be a mobile phone, a computer, a server, a controlled terminal, or a network device, etc.) to perform the method of each embodiment of the present invention.
The foregoing description is only of the preferred embodiments of the present invention, and is not intended to limit the scope of the invention, but rather is intended to cover any equivalents of the structures or equivalent processes disclosed herein or in the alternative, which may be employed directly or indirectly in other related arts.
Claims (10)
1. A reticle cleaning method, wherein the reticle cleaning method is applied to a cleaning apparatus including an optical inspection system, a logic controller, a spraying device, and a reticle tray, comprising the steps of:
performing dirt detection on the mask plate through the optical inspection system to obtain a detection result;
generating a cleaning flow according to the detection result, and acquiring cleaning parameters according to the cleaning flow;
inputting the cleaning parameters into the logic controller, controlling the mask plate tray to rotate through the logic controller, and controlling the spraying device to clean the mask plate to obtain a cleaning result.
2. The reticle cleaning method according to claim 1, wherein the step of generating a cleaning flow according to the detection result and acquiring cleaning parameters according to the cleaning flow comprises:
Analyzing the detection result to obtain organic matter information and particulate matter information;
carrying out data analysis according to a preset solution analysis result and the organic matter information to obtain organic matter cleaning solution information and a first rotation parameter;
carrying out data analysis according to the solution analysis result and the particulate matter information to obtain particulate matter cleaning solution information and a second rotation parameter;
generating a flow according to the organic matter cleaning solution information, the first rotation parameters, the particulate matter cleaning solution information and the second rotation parameters, and obtaining a cleaning flow;
and carrying out parameter configuration on the cleaning flow according to the parameter format of the logic controller to obtain cleaning parameters.
3. The method according to claim 2, wherein the step of performing data analysis according to the preset solution analysis result and the organic matter information to obtain the organic matter cleaning solution information and the first rotation parameter further comprises:
performing material identification on the mask plate to obtain material information of the mask plate;
and carrying out cleaning solution analysis according to the material information of the mask plate to obtain a solution analysis result.
4. The reticle cleaning method of claim 2, wherein the step of controlling the reticle tray to rotate and controlling the spraying device to clean the reticle by the logic controller to obtain the cleaning result comprises:
reading the cleaning parameters through the logic controller to obtain organic cleaning solution information, particulate cleaning solution information, a first rotation parameter and a second rotation parameter;
according to the organic matter cleaning solution information and the first rotation parameter, cleaning the mask plate through the spraying device to obtain a first cleaning result;
according to the first cleaning result, the particulate matter cleaning solution information and the second rotation parameter, cleaning the mask plate through the spraying device to obtain a second cleaning result;
and carrying out summarized analysis on the first cleaning result and the second cleaning result to obtain the cleaning result.
5. The method according to claim 4, wherein the step of cleaning the reticle by the spraying device according to the organic cleaning solution information and the first rotation parameter to obtain a first cleaning result comprises:
According to the organic matter cleaning solution information, spraying a first cleaning solution corresponding to the organic matter cleaning solution information to the mask plate through the spraying device, and controlling the mask plate tray to rotate according to the first rotation parameter to obtain a third cleaning result;
detecting the third cleaning result to obtain first legacy information of the first cleaning solution;
and according to the first legacy information, acquiring first spraying information of the cold deionized water and the hot deionized water, and according to the first spraying information, spraying the cold deionized water and the hot deionized water to the mask plate through the spraying device for dilution cleaning, so as to acquire a first cleaning result.
6. The method according to claim 4, wherein the step of cleaning the reticle by the spraying device according to the first cleaning result, the particulate cleaning solution information, and the second rotation parameter to obtain a second cleaning result includes:
according to the first cleaning result and the particulate matter cleaning solution information, spraying a second cleaning solution corresponding to the particulate matter cleaning solution information to the mask plate through the spraying device, and controlling the mask plate tray to rotate according to the second rotation parameter to obtain a fourth cleaning result;
Detecting the fourth cleaning result to obtain second legacy information of the second cleaning solution;
and according to the second legacy information, acquiring second spraying information of the cold deionized water, and according to the second spraying information, spraying the cold deionized water to the mask plate through the spraying device to dilute and clean the mask plate, so as to acquire a second cleaning result.
7. The method for cleaning a reticle according to claim 1, wherein the step of inputting the cleaning parameters into the logic controller, controlling the reticle tray to rotate by the logic controller, and controlling the spraying device to clean the reticle, and further comprises the steps of:
the mask plate is cleaned and detected through the optical inspection system, and the cleaning degree is obtained;
according to a preset cleaning threshold value, carrying out threshold analysis on the cleaning degree;
if the cleaning degree exceeds the cleaning threshold, generating notification information according to the cleaning degree and a cleaning result and sending the notification information to a corresponding user;
if the cleaning degree does not exceed the cleaning threshold, generating abnormal alarm information according to the cleaning degree and the cleaning result and sending the abnormal alarm information to a corresponding user.
8. A reticle cleaning device, wherein the reticle cleaning device is applied to a cleaning apparatus comprising an optical inspection system, a logic controller, a spray device, and a reticle tray, comprising:
the detection module is used for carrying out dirt detection on the mask plate through the optical inspection system to obtain a detection result;
the parameter acquisition module is used for generating a cleaning flow according to the detection result and acquiring cleaning parameters according to the cleaning flow;
and the cleaning module is used for inputting the cleaning parameters into the logic controller, controlling the mask plate tray to rotate through the logic controller, and controlling the spraying device to clean the mask plate to obtain a cleaning result.
9. A terminal device comprising a memory, a processor and a reticle cleaning program stored on the memory and operable on the processor, the reticle cleaning program when executed by the processor performing the steps of the reticle cleaning method according to any one of claims 1 to 7.
10. A computer readable storage medium, wherein a reticle cleaning program is stored on the computer readable storage medium, which reticle cleaning program, when executed by a processor, implements the steps of the reticle cleaning method according to any one of claims 1 to 7.
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| 胡必杰: "《医院感染防控用品使用指引》", 31 May 2014, 上海科学技术出版社, pages: 66 - 67 * |
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