CN117479700A - Display panel, preparation method of display panel and display device - Google Patents
Display panel, preparation method of display panel and display device Download PDFInfo
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- CN117479700A CN117479700A CN202311015745.0A CN202311015745A CN117479700A CN 117479700 A CN117479700 A CN 117479700A CN 202311015745 A CN202311015745 A CN 202311015745A CN 117479700 A CN117479700 A CN 117479700A
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- 238000002360 preparation method Methods 0.000 title abstract description 7
- 238000002161 passivation Methods 0.000 claims abstract description 156
- 238000000034 method Methods 0.000 claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 238000005530 etching Methods 0.000 claims abstract description 37
- 238000000059 patterning Methods 0.000 claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 2
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium oxide Inorganic materials O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 claims description 2
- PVADDRMAFCOOPC-UHFFFAOYSA-N oxogermanium Chemical compound [Ge]=O PVADDRMAFCOOPC-UHFFFAOYSA-N 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 15
- 241001391944 Commicarpus scandens Species 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 285
- 230000008093 supporting effect Effects 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- ZPZCREMGFMRIRR-UHFFFAOYSA-N molybdenum titanium Chemical compound [Ti].[Mo] ZPZCREMGFMRIRR-UHFFFAOYSA-N 0.000 description 1
- DFIYWQBRYUCBMH-UHFFFAOYSA-N oxogermane Chemical compound [GeH2]=O DFIYWQBRYUCBMH-UHFFFAOYSA-N 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
- H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The application provides a display panel, a preparation method of the display panel and a display device; the display panel includes a substrate; a first passivation layer located on one side of the substrate and having a first etching rate V 1 The method comprises the steps of carrying out a first treatment on the surface of the A second passivation layer disposed on a side of the first passivation layer facing away from the substrate, the second passivation layer having a second etching rate V 2 The method comprises the steps of carrying out a first treatment on the surface of the The method meets the following conditions: v (V) 2 <V 1 The method comprises the steps of carrying out a first treatment on the surface of the The application is realized by arranging a first passivation layer and a second passivation layer with different etching speeds, and the first etching speed V 1 Is greater than the second etching speed V 2 An undercut first contact hole may be formed by patterning the first passivation layer and the second passivation layer, formedThe cathode layer is not easy to break at the first contact hole and is in good contact with the first connection part, so that on one hand, the impedance of the cathode layer is reduced, and the IR Drop of the display panel is reduced; on the other hand, the outside vapor can be prevented from invading the luminous area of the display panel, and the packaging effectiveness of the display panel is improved.
Description
Technical Field
The present disclosure relates to the field of display, and in particular, to a display panel, a method for manufacturing the display panel, and a display device.
Background
Currently, in order to solve the problem of IR Drop of a large-sized organic light emitting diode (Organic Light Emitting Diode, OLED) back plate, a cathode layer is generally connected to a supplementary electrode through a via hole, so as to reduce the impedance of the large-sized cathode layer. And the cathode layer is easy to break at the position of the through hole, so that external water vapor invades the light-emitting area of the display panel, and the display panel packaging is invalid.
Disclosure of Invention
The application provides a display panel, a preparation method of the display panel and a display device, which ensure the continuity of a cathode layer in a first contact hole and prevent external vapor from invading a light-emitting area of the display panel, thereby improving the packaging effectiveness of the display panel.
The application provides a display panel, including:
a substrate;
a first passivation layer located on one side of the substrate, the first passivation layer having a first etching rate V 1 ；
A second passivation layer arranged on one side of the first passivation layer facing away from the substrate, the second passivation layer having a second etching rate V 2 ；
The method meets the following conditions: v (V) 2 <V 1 。
In some embodiments, the first passivation layer is provided with a first through hole, the second passivation layer is provided with a second through hole, and the first through hole and the second through hole are communicated; the first through hole has a first aperture D 1 The second through hole has a second aperture D 2 The method comprises the steps of carrying out a first treatment on the surface of the The method meets the following conditions: d (D) 2 <D 1 。
In some embodiments, a projected area of the first via covers a projected area of the second via in a first direction of the display panel.
In some embodiments, the first through hole has a first hole wall; the display panel is provided with a second direction crossing the first direction, the extending direction of the first hole wall and the second direction of the display panel are provided with an angle theta, and the angle theta is satisfied: θ is more than or equal to 110 degrees and less than or equal to 160 degrees.
In some embodiments, the first via has a height H along a first direction of the display panel; the first through hole also has a third aperture D 3 The method comprises the steps of carrying out a first treatment on the surface of the The method meets the following conditions: d (D) 2 <D 3 <D 1 ，(D 1 -D 2 )/2＝(D 3 -D 2 )/2+H/tan(180-θ)。
In some embodiments, the first through hole and the second through hole are connected to form a first contact hole, and the display panel further includes a first connection portion exposed from the first contact hole; the display panel further comprises an anode layer, a light-emitting layer and a cathode layer which are stacked; the cathode layer is connected with the first connecting part through the first contact hole, and the cathode layer covers the first through hole.
In some embodiments, the material of the first passivation layer includes one or more of silicon nitride, silicon oxide, silicon oxynitride, and indium zinc oxide; the second passivation layer comprises one or more of titanium oxide, aluminum oxide and germanium oxide;
and/or, along a first direction of the display panel, the first passivation layer has a first thickness M, satisfying:the second passivation layer has a second thickness N that satisfies: />
Correspondingly, the application also provides a preparation method of the display panel, which comprises the following steps:
providing a substrate;
forming a first passivation layer on one side of the substrate, the first passivation layer having a first etching rate V 1 ；
Forming a second passivation layer on a side of the first passivation layer facing away from the substrate, the second passivation layer having a second etching rate V 2 The method comprises the following steps: v (V) 2 <V 1 。
In some embodiments, before forming the first passivation layer on one side of the substrate, further comprising:
a connection portion is formed on one side of the substrate.
In some embodiments, after forming a second passivation layer on a side of the first passivation layer facing away from the substrate, further comprising:
patterning the second passivation layer to form a second through hole;
patterning the first passivation layer to form a first via having a first aperture D 1 The second through hole has a second aperture D 2 The method comprises the steps of carrying out a first treatment on the surface of the The method meets the following conditions: d (D) 2 <D 1 。
In some embodiments, a projected area of the first via covers a projected area of the second via in a first direction of the display panel.
In some embodiments, the first through hole has a first hole wall; the display panel is provided with a second direction crossing the first direction, the extending direction of the first hole wall and the second direction of the display panel are provided with an angle theta, and the angle theta is satisfied: θ is more than or equal to 110 degrees and less than or equal to 160 degrees.
In some embodiments, the first via has a height H along a first direction of the display panel; the first through hole also has a third aperture D 3 The method comprises the steps of carrying out a first treatment on the surface of the The method meets the following conditions: d (D) 2 <D 3 <D 1 ，(D 1 -D 2 )/2＝(D 3 -D 2 )/2+H/tan(180-θ)。
In some embodiments, after patterning the second passivation layer, further comprising:
the first through hole and the second through hole are connected to form a first contact hole, and an anode layer, a light-emitting layer and a cathode layer are sequentially formed on one side surface, away from the substrate, of the second passivation layer; the cathode layer is connected with the first connecting part through the first contact hole, and the cathode layer covers the first through hole.
Correspondingly, the application also provides a display device which comprises the display panel.
The application provides a display panel, a preparation method of the display panel and a display device; the display panel includes a substrate; a first passivation layer positioned on the baseA side surface of the board, the first passivation layer has a first etching rate V 1 The method comprises the steps of carrying out a first treatment on the surface of the A second passivation layer disposed on a side of the first passivation layer facing away from the substrate, the second passivation layer having a second etching rate V 2 The method comprises the steps of carrying out a first treatment on the surface of the The method meets the following conditions: v (V) 2 <V 1 The method comprises the steps of carrying out a first treatment on the surface of the The display panel and the display device provided by the application have different etching speeds due to the first passivation layer and the second passivation layer, and the first etching speed V 1 Is greater than the second etching speed V 2 When the first passivation layer and the second passivation layer are etched, the etched and eaten part of the first passivation layer is larger than the etched and eaten part of the second passivation layer, the part, which is not etched and eaten, of the second passivation layer has a supporting effect on the formed cathode layer, namely a first undercut contact hole is formed, and when the cathode layer is formed in the first contact hole, on one hand, the cathode layer can be prevented from being disconnected in the first contact hole, the continuity of the cathode layer is ensured, and external water vapor can be prevented from invading a light-emitting area of the display panel, so that the packaging effectiveness of the display panel is improved; on the other hand, the first contact hole exposes the first connection part, so that the cathode layer and the first connection part are fully contacted through the first contact hole, the first connection part is used as a supplementary electrode of the cathode layer, and the impedance of the cathode layer can be reduced through the connection of the cathode layer and the first connection part, and further IR Drop of the display panel is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a display panel provided in the present application;
FIG. 2 is a cross-sectional view taken along line A-B in FIG. 1;
FIG. 3 is an enlarged view of a portion of region C of FIG. 2;
fig. 4 is a flowchart of a first method for manufacturing a display panel provided in the present application;
FIG. 5 is a flowchart of a second method for manufacturing a display panel according to the present disclosure;
fig. 6 is a schematic structural diagram of a first step in a method for manufacturing a display panel provided in the present application;
fig. 7 is a schematic structural diagram of a second step in the manufacturing method of the display panel provided in the present application;
fig. 8 is a schematic structural diagram of a third step in the method for manufacturing a display panel provided in the present application.
In the drawings, the components represented by the respective reference numerals are as follows:
100. a substrate; 101. a substrate; 102. a buffer layer; 103. an interlayer insulating layer; 10. a thin film transistor; 11. a light shielding layer; 12. an active layer; 13. a gate insulating layer; 14. a gate layer; 15. a drain electrode; 16. a source electrode; 17. a first plate; 18. a second polar plate; 21. a first passivation layer; 22. a second passivation layer; 23. a first contact hole; 231. a first through hole; 2311. a first aperture wall; 232. a second through hole; 24. a second contact hole; 25. a third contact hole; 31. a first connection portion; 32. a second connecting portion; 41. an anode layer; 42. a light emitting layer; 43. a cathode layer; 51. a planarization layer; 52. a pixel definition layer.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
The terms "first," "second," "third," "fourth," and the like herein do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The terms of directions such as up, down, left, and right are referred to in this application only with reference to the attached drawings. Therefore, the use of numerical, directional and positional relationship terms is intended to illustrate and understand the present application, and is not intended to limit the present application. In the drawings, like structural elements are denoted by like reference numerals.
The embodiment of the application provides a display panel, a preparation method of the display panel and a display device, and the application will be described in detail with reference to specific embodiments.
As shown in fig. 1 to 8, a display panel includes a substrate 100, a first passivation layer 21, and a second passivation layer 22; the first passivation layer 21 is disposed on one side of the substrate 100, and the first passivation layer 21 has a first etching rate V 1 The method comprises the steps of carrying out a first treatment on the surface of the The second passivation layer 22 is disposed on a side of the first passivation layer 21 facing away from the substrate 100, and the second passivation layer 22 has a second etching rate V 2 The method comprises the steps of carrying out a first treatment on the surface of the The method meets the following conditions: v (V) 2 <V 1 。
Specifically, the substrate 100 is an array substrate, and includes a substrate 101 and a thin film transistor 10. The thin film transistor 10 is located on one side of the substrate 101. The thin film transistor 10 includes a light shielding layer 11, an active layer 12, a gate insulating layer 13, a gate layer 14, a drain electrode 15, and a source electrode 16. The light shielding layer 11 is located on one side of the substrate 101. The buffer layer 102 covers the light shielding layer 11. The active layer 12, the gate insulating layer 13, and the gate layer 14 are stacked on one side of the buffer layer 102 facing away from the substrate 101. The interlayer insulating layer 103 covers the buffer layer 102, the active layer 12, the gate insulating layer 13, and the gate layer 14. The active layer 12 includes a channel region and a non-channel region. Drain 15 is connected to the non-channel region. The source electrode 16 is connected to the non-channel region and the light shielding layer 11. The first passivation layer 21 covers the interlayer insulating layer 103, the drain electrode 15, and the source electrode 16.
In some embodiments, 3< V1/V2<500. In particular, V1/V2 may be in the range of one or any two of 5, 50, 100, 200, 300, 400, 450, it being worth noting that the values of V1/V2 are given by way of example only, as long as they fall within the range 3< V1/V2<500, all falling within the scope of protection of the present application.
The display panel comprises a first passivation layer 21 and a second passivation layer 22 with different etching rates, and a first etching rate V 1 Is greater than the second etching speed V 2 After patterning the first passivation layer 21 and the second passivation layer 22, an undercut first contact hole 23 may be formed, and a cathode layer 43 may be formed on the first contact holeA contact hole 23 is not easy to break, can be completely isolated from the outside, and can prevent outside vapor from invading into a light-emitting area of the display panel, thereby improving the packaging effectiveness of the display panel.
In some embodiments, the first passivation layer 21 is provided with a first through hole 231, the second passivation layer 22 is provided with a second through hole 232, and the first through hole 231 and the second through hole 232 are communicated; the first through hole 231 has a first aperture D 1 The second through hole 232 has a second aperture D 2 The method comprises the steps of carrying out a first treatment on the surface of the The method meets the following conditions: d (D) 2 <D 1 。
Specifically, the first contact hole 23 is formed by connecting the first through hole 231 and the second through hole 232.
It will be appreciated that the first aperture D 1 Is the maximum aperture of the first through hole 231. Second aperture D 2 Is the smallest aperture of the second via 232.
In some embodiments, the projected area of the first through hole 231 covers the projected area of the second through hole 232 along the first direction Z of the display panel.
Specifically, the projected area of the first through hole 231 covers the projected area of the second through hole 232, that is, the maximum aperture of the first through hole 231 is greater than or equal to the maximum aperture of the second through hole 232.
It will be appreciated that since the first passivation layer 21 and the second passivation layer 22 have different etching rates, and the first etching rate V 1 Is greater than the second etching speed V 2 When the first passivation layer 21 and the second passivation layer 22 are etched, the etched-away portion of the first passivation layer 21 is larger than the etched-away portion of the second passivation layer 22, i.e., the first aperture D of the first through hole 231 1 A second aperture D larger than the second through hole 232 2 . At this time, the part of the second passivation layer 22 which is not etched away has a supporting effect on the formed cathode layer 43, when the cathode layer 43 is formed in the first contact hole 23, on one hand, the cathode layer 43 can be prevented from being disconnected in the first contact hole 23, the continuity of the cathode layer 43 is ensured, and the outside moisture can be prevented from entering the light-emitting area of the display panel, so that the packaging effectiveness of the display panel is improved; on the other hand, the first contact hole 23 exposes the first connection portion 31 such that the cathodeThe layer 43 is sufficiently contacted with the first connection portion 31 through the first contact hole 23, and the first connection portion 31 serves as a supplementary electrode of the cathode layer 43, and the impedance of the cathode layer 43 can be reduced by connecting the cathode layer 43 with the first connection portion 31, thereby reducing IR Drop of the display panel.
In some embodiments, the first through hole 231 has a first hole wall 2311; the display panel has a second direction X intersecting the first direction Z, and the extending direction of the first hole wall 2311 has an angle θ with the second direction X of the display panel, which satisfies: θ is more than or equal to 110 degrees and less than or equal to 160 degrees.
Specifically, θ may be in a range of one or any two of 110 °, 120 °, 130 °, 140 °, 150 °, 160 °, and it is worth noting that the value of θ is given only by way of example, and falls within the scope of the present application as long as it is in a range of 110 ° D160 °.
It is understood that the first direction Z is the thickness direction of the display panel. The second direction X is the row direction of the display panel. The third direction Y is a column direction of the display panel.
According to the display panel provided by the application, the extending direction of the first hole wall 2311 and the second direction X of the display panel are provided with the angle theta, and the part, which is not etched and eaten, in the second passivation layer 22 has a supporting effect on the formed cathode layer 43 by controlling the angle theta to be more than or equal to 110 degrees and less than or equal to 160 degrees, and when the cathode layer 43 is formed in the first contact hole 23, on one hand, the cathode layer 43 can be prevented from being disconnected in the first contact hole 23, the continuity of the cathode layer 43 is ensured, and external water vapor can be prevented from invading a light-emitting area of the display panel, so that the packaging effectiveness of the display panel is improved; on the other hand, the cathode layer 43 is brought into sufficient contact with the first connection portion 31, and the cathode layer 43 is connected to the first connection portion 31, whereby the resistance of the cathode layer 43 can be reduced, and the IR Drop of the display panel can be reduced.
In some embodiments, the first through hole 231 has a height H along the first direction Z of the display panel; the first through hole 231 further has a third aperture D 3 The method comprises the steps of carrying out a first treatment on the surface of the The method meets the following conditions: d (D) 2 <D 3 <D 1 ，(D 1 -D 2 )/2＝(D 3 -D 2 )/2+H/tan(180-θ)。
It will be appreciated that the third aperture D 3 A minimum aperture for the first through hole 231; the present application is directed to controlling D 2 <D 3 <D 1 ，(D 1 -D 2 )/2＝(D 3 -D 2 ) and/2+H/tan (180- θ), wherein D is half of the difference between D3 and D2, the length of the portion of the second passivation layer 22 that is not etched away in the second direction X of the display panel is W, W is half of the difference between D1 and D2, and the value of H is less than or equal to the thickness M of the first passivation layer 21, that is Thus, by calculation, the length W of the portion of the second passivation layer 22 that is not etched away satisfies: />The part of the second passivation layer 22 which is not etched and eaten is guaranteed to have a supporting effect on the formed cathode layer 43, when the cathode layer 43 is formed in the first contact hole 23, on one hand, the cathode layer 43 can be prevented from being disconnected in the first contact hole 23, the continuity of the cathode layer 43 is guaranteed, external water vapor can be prevented from entering a light-emitting area of the display panel, and therefore the packaging effectiveness of the display panel is improved; on the other hand, the first contact hole 23 exposes the first connection portion 31, so that the cathode layer 43 and the first connection portion 31 are sufficiently contacted through the first contact hole 23, the first connection portion 31 serves as a supplementary electrode of the cathode layer 43, and the first connection portion 31 is connected through the cathode layer 43, so that the impedance of the cathode layer 43 can be reduced, and further, the IR Drop of the display panel can be reduced.
In some embodiments, D 3 And D 2 Half of the difference is d, satisfying:
specifically, d may be It is worth noting that this d is given by way of example only, provided that at +.>Within the scope of the application.
It will be appreciated that, since D is half the difference between D3 and D2,the value of H is smaller than or equal to the thickness M of the first passivation layer 21, i.e. +.>110 DEG- θ.ltoreq.160 DEG, W is half the difference between D1 and D2, so W=d+H/tan (180- θ), and it is known from calculation that the length W of the portion of the second passivation layer 22 that is not etched and eaten satisfies:the part of the second passivation layer 22 which is not etched and eaten is guaranteed to have a supporting effect on the formed cathode layer 43, when the cathode layer 43 is formed in the first contact hole 23, on one hand, the cathode layer 43 can be prevented from being disconnected in the first contact hole 23, the continuity of the cathode layer 43 is guaranteed, external water vapor can be prevented from entering a light-emitting area of the display panel, and therefore the packaging effectiveness of the display panel is improved; on the other hand, the first contact hole 23 exposes the first connection portion 31, so that the cathode layer 43 and the first connection portion 31 are sufficiently contacted through the first contact hole 23, the first connection portion 31 serves as a supplementary electrode of the cathode layer 43, and the first connection portion 31 is connected through the cathode layer 43, so that the impedance of the cathode layer 43 can be reduced, and further, the IR Drop of the display panel can be reduced.
In some embodiments, the first and second through holes 231 and 232 are connected to form the first contact hole 23; the display panel further includes a first connection portion 31, the first contact hole 23 exposing the first connection portion 31, and an anode layer 41, a light emitting layer 42, and a cathode layer 43 stacked; the cathode layer 43 is connected to the first connection portion 31 through the first contact hole 23, and the cathode layer 43 covers the first through hole 231.
Specifically, the first connection portion 31, the drain electrode 15, and the source electrode 16 may be fabricated in the same process by using one photomask. Anode layer 41 may be a conductive layer or a stack of conductive layers.
It is understood that the regions where the anode layer 41, the light emitting layer 42, and the cathode layer 43 are located are light emitting regions of the display panel.
It will be appreciated that the first connection portion 31 serves as a supplementary electrode of the cathode layer 43, so that the continuity of the cathode layer 43 in the first contact hole 23 can be ensured, thereby reducing the impedance of the cathode layer 43.
According to the display panel provided by the application, the cathode layer 43 is connected with the first connecting part 31 through the first contact hole 23, so that the continuity of the cathode layer 43 in the first contact hole 23 can be ensured, the impedance of the cathode layer 43 is reduced, and the IR Drop of the display panel is reduced; by covering the first through hole 231 of the first contact hole 23 with the cathode layer 43, intrusion of external moisture into the light emitting region of the display panel can be blocked, thereby improving the packaging efficiency of the display panel.
In some embodiments, the first passivation layer 21 and the second passivation layer 22 are further provided with a second contact hole 24 and a third contact hole 25 therein. The second contact hole 24 exposes the source electrode 16. The third contact hole 25 exposes the second connection portion 32.
Specifically, the first connection portion 31, the second connection portion 32, the drain electrode 15, and the source electrode 16 are prepared in the same process by using one photomask.
In some embodiments, the display panel further includes a planarization layer 51 and a pixel definition layer 52. The planarization layer 51 is located on a side of the second passivation layer 22 facing away from the first passivation layer 21. The pixel defining layer 52 is located on a side of the planarization layer 51 facing away from the second passivation layer 22. A first via (not shown) is formed in the planarization layer 51. The first via hole corresponds to the second contact hole 24 and exposes the source electrode 16. The anode layer 41 is connected to the source electrode 16 through the first and second contact holes 24. A second via (not shown) is formed in the pixel defining layer 52. The second via exposes the anode layer 41.
In some embodiments, the material of the first passivation layer 21 includes silicon nitride (SiN X ) Silicon oxide (SiO) X ) Silicon oxynitride (SiON) X ) One or more of Indium Zinc Oxide (IZO); the second passivation layer 22 includes one or more of titanium oxide (TiO), aluminum oxide (AlO), germanium oxide (GeO);
specifically, the first passivation layer 21 and the second passivation layer 22 are etched using the same etching solution.
In some embodiments, the material of the first passivation layer 21 may further include one or two of molybdenum-titanium alloy and molybdenum metal; the second passivation layer 22 includes one or both of a C-series organic photoresist and a Si-series organic photoresist. It is understood that the second passivation layer 22 may also be other organic photoresist materials.
When the material of the second passivation layer 22 is an organic photoresist, two etching solutions may be used to etch the first passivation layer 21 and the second passivation layer 22; specifically, the organic photoresist is used as Mask to etch the second passivation layer 22, and then the remaining second passivation layer 22 is used as Mask to etch the first passivation layer 21.
And/or, along the first direction Z of the display panel, the first passivation layer 21 has a first thickness M, satisfying:the second passivation layer 22 has a second thickness N that satisfies: />
Specifically, the thickness M of the first passivation layer 21 may be
In the range of one or both of the compositions, it is worth noting that the thickness M of the first passivation layer 21 is given only by way of example, as long as it is within +.>Within the scope of the application.
Specifically, the thickness N of the second passivation layer 22 may be In the range of one or both of the compositions, it is worth noting that the thickness N of the second passivation layer 22 is given by way of example only, as long as it is within +.>Within the scope of the application.
In some embodiments, the substrate 100 further includes a first plate 17 and a second plate 18. The first plate 17 is located on one side of the substrate 101. The first plate 17 and the light shielding layer 11 are prepared in the same process by using a photomask. The second plate 18 is located on a side of the buffer layer 102 facing away from the substrate 101. The second plate 18 is fabricated in the same process as the active layer 12 by using a photomask. The first plate 17 and the second plate 18 constitute the capacitance of the display panel.
It will be appreciated that the first and second plates 17, 18 form the capacitance of the display panel, which may improve the performance of the display panel.
As shown in fig. 4 to 8, the present application further provides a method for manufacturing a display panel, including:
step S10: providing a substrate 100;
step S20: a first passivation layer 21 is formed on one side of the substrate 100, the first passivation layer 21 having a first etching rate V 1 ；
Step S30: a second passivation layer 22 is formed on a side of the first passivation layer 21 facing away from the substrate 100, the second passivation layer 22 having a second etching rate V 2 The method comprises the following steps: v (V) 2 <V 1 。
Specifically, the substrate 100 is an array substrate. The array substrate is configured as a conventional arrangement in the art, and will not be described herein.
In some embodiments, before forming the first passivation layer 21 on one side of the substrate 100, further comprising:
step S40: the connection portion 31 is formed on one side of the substrate 100.
Specifically, the thin film transistor 10 includes a drain electrode 15 and a source electrode 16. The first connection portion 31, the drain electrode 15 and the source electrode 16 are prepared in the same process by using one photomask.
The first connection portion 31 serves as a supplementary electrode of the cathode layer 43, and the cathode layer 43 is connected to the first connection portion 31, whereby the resistance of the cathode layer 43 can be reduced, and the IR Drop of the display panel can be reduced.
In some embodiments, after forming the second passivation layer 22 on a side of the first passivation layer 21 facing away from the substrate 100, the method further includes:
step S50: patterning the second passivation layer 22 to form a second via 232;
step S60: patterning the first passivation layer 21 to form a first via 231, the first via 231 having a first aperture D 1 The second through hole 232 has a second aperture D 2 The method comprises the steps of carrying out a first treatment on the surface of the The method meets the following conditions: d (D) 2 <D 1 。
Specifically, the first contact hole 23 is formed by connecting the first through hole 231 and the second through hole 232.
It will be appreciated that the first aperture D 1 Is the maximum aperture of the first through hole 231. Second aperture D 2 Is the smallest aperture of the second via 232.
In some embodiments, the projected area of the first through hole 231 covers the projected area of the second through hole 232 along the first direction Z of the display panel.
Specifically, the projected area of the first through hole 231 covers the projected area of the second through hole 232, that is, the maximum aperture of the first through hole 231 is greater than or equal to the maximum aperture of the second through hole 232.
It will be appreciated that since the first passivation layer 21 and the second passivation layer 22 have different etching rates, when the first passivation layer 21 and the second passivation layer 22 are etched, the etched-away portion of the first passivation layer 21 is larger than the etched-away portion of the second passivation layer 22, that is, the first aperture D1 of the first through hole 231 is larger than the second aperture D2 of the second through hole 232. At this time, the part of the second passivation layer 22 which is not etched and eaten has a supporting effect on the formed cathode layer 43, so that on one hand, the cathode layer 43 can be prevented from being disconnected in the first contact hole 23, the continuity of the cathode layer 43 is ensured, and the outside moisture can be prevented from invading the light-emitting area of the display panel, thereby improving the packaging effectiveness of the display panel; on the other hand, the first contact hole 23 exposes the first connection portion 31, so that the cathode layer 43 and the first connection portion 31 are sufficiently contacted through the first contact hole 23, the first connection portion 31 serves as a supplementary electrode of the cathode layer 43, and the first connection portion 31 is connected through the cathode layer 43, so that the impedance of the cathode layer 43 can be reduced, and further, the IR Drop of the display panel can be reduced.
In some embodiments, the first through hole 231 has a first hole wall 2311; the display panel has a second direction X intersecting the first direction Z, and the extending direction of the first hole wall 2311 has an angle θ with the second direction X of the display panel, which satisfies: θ is more than or equal to 110 degrees and less than or equal to 160 degrees.
According to the display panel provided by the application, the extending direction of the first hole wall 2311 of the first through hole 231 and the second direction X of the display panel are provided with the angle theta, and the parts, which are not etched and eaten, in the second passivation layer 22 are ensured to have supporting effects on the formed cathode layer 43 by controlling the angle theta to be more than or equal to 110 DEG and less than or equal to 160 DEG, and when the cathode layer 43 is formed in the first contact hole 23, on one hand, the cathode layer 43 can be prevented from being disconnected in the first contact hole 23, the continuity of the cathode layer 43 is ensured, and external water vapor can be prevented from invading a light-emitting area of the display panel, so that the packaging effectiveness of the display panel is improved; on the other hand, the first contact hole 23 exposes the first connection portion 31, so that the cathode layer 43 and the first connection portion 31 are sufficiently contacted through the first contact hole 23, the first connection portion 31 serves as a supplementary electrode of the cathode layer 43, and the first connection portion 31 is connected through the cathode layer 43, so that the impedance of the cathode layer 43 can be reduced, and further, the IR Drop of the display panel can be reduced.
In some embodiments, the first through hole 231 has a height H along the first direction Z of the display panel; the first through hole 231 further has a third aperture D 3 The method comprises the steps of carrying out a first treatment on the surface of the The method meets the following conditions: d (D) 2 <D 3 <D 1 ，(D 1 -D 2 )/2＝(D 3 -D 2 )/2+H/tan(180-θ)。
It will be appreciated that the third aperture D 3 A minimum aperture for the first through hole 231; the present application is directed to controlling D 2 <D 3 <D 1 ，(D 1 -D 2 )/2＝(D 3 -D 2 ) The ratio of/2+H/tan (180-theta) ensures that the part of the second passivation layer 22 which is not etched away has a supporting effect on the formed cathode layer 43, and when the cathode layer 43 is formed in the first contact hole 23, on one hand, the cathode layer 43 can be prevented from being disconnected in the first contact hole 23, the continuity of the cathode layer 43 is ensured, and the outside water vapor can be prevented from entering the light-emitting area of the display panel, so that the packaging effectiveness of the display panel is improved; on the other hand, the first contact hole 23 exposes the first connection portion 31, so that the cathode layer 43 is sufficiently contacted with the first connection portion 31 through the first contact hole 23, and the resistance of the cathode layer 43 can be reduced by connecting the cathode layer 43 with the first connection portion 31, thereby reducing IR Drop of the display panel.
In some embodiments, after the patterning of the second passivation layer 22, it further includes:
step S70: the first contact hole 23 is formed by connecting the first through hole 231 and the second through hole 232, and the anode layer 41, the light emitting layer 42 and the cathode layer 43 are sequentially formed on one side surface of the second passivation layer 22, which is away from the substrate 100; the cathode layer 43 is connected to the first connection portion 31 through the first contact hole 23, and the cathode layer 43 covers the first through hole 231.
The display panel provided by the application has different etching speeds due to the first passivation layer 21 and the second passivation layer 22, and the first etching speed V 1 Is greater than the second etching speed V 2 When the first passivation layer 21 and the second passivation layer 22 are etched, the etched and consumed part of the first passivation layer 21 is larger than the etched and consumed part of the second passivation layer 22, and the part of the second passivation layer 22 which is not etched and consumed has a supporting effect on the formed cathode layer 43, when the cathode layer 43 is formed in the first contact hole 23, on one hand, the cathode layer 43 can be prevented from being disconnected in the first contact hole 23, the continuity of the cathode layer 43 is ensured, and the outside water vapor can be prevented from entering the light-emitting area of the display panel, so that the packaging effectiveness of the display panel is improved; on the other hand, the first contact hole 23 exposes the first connection portion 31, so that the cathode layer 43 and the first connection portion 31 are sufficiently contacted through the first contact hole 23, the first connection portion 31 serves as a supplementary electrode of the cathode layer 43, and the first connection portion 31 is connected through the cathode layer 43, so that the impedance of the cathode layer 43 can be reduced, and further, the IR Drop of the display panel can be reduced.
Correspondingly, the application also provides a display device which comprises the display panel.
In the display device provided by the application, the first passivation layer 21 and the second passivation layer 22 have different etching speeds, and the first etching speed V 1 Is greater than the second etching speed V 2 When the first passivation layer 21 and the second passivation layer 22 are etched, the etched and consumed part of the first passivation layer 21 is larger than the etched and consumed part of the second passivation layer 22, and the part of the second passivation layer 22 which is not etched and consumed has a supporting effect on the formed cathode layer 43, when the cathode layer 43 is formed in the first contact hole 23, on one hand, the cathode layer 43 can be prevented from being disconnected in the first contact hole 23, the continuity of the cathode layer 43 is ensured, and the outside water vapor can be prevented from entering the light-emitting area of the display panel, so that the packaging effectiveness of the display panel is improved; on the other hand, the first contact hole 23 exposes the first connection portion 31 so that the cathode layer 43 and the first connection portion 31 are sufficiently contacted by the first contact hole 23, and the first connection portion 31 serves as a supplementary electrode of the cathode layer 43 and is connected by the cathode layer 43The first connection portion 31 is connected to reduce the resistance of the cathode layer 43, thereby reducing IR Drop of the display panel.
In summary, although the detailed description of the embodiments of the present application is given above, the above embodiments are not intended to limit the present application, and those skilled in the art will appreciate that: the technical scheme described in the foregoing embodiments can be modified or some of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.
Claims (15)
1. A display panel, comprising:
a substrate (100);
a first passivation layer (21) located on one side of the substrate (100), the first passivation layer (21) having a first etching rate V 1 ；
A second passivation layer (22) on a side of the first passivation layer (21) facing away from the substrate (100), the second passivation layer (22) having a second etching rate V 2 ；
The method meets the following conditions: v (V) 2 <V 1 。
2. The display panel according to claim 1, wherein the first passivation layer (21) is provided with a first through hole (231), the second passivation layer (22) is provided with a second through hole (232), and the first through hole (231) and the second through hole (232) are communicated; the first through hole (231) has a first aperture D 1 The second through hole (232) has a second aperture D 2 The method comprises the steps of carrying out a first treatment on the surface of the The method meets the following conditions: d (D) 2 <D 1 。
3. A display panel according to claim 2, characterized in that the projected area of the first through hole (231) covers the projected area of the second through hole (232) in the first direction (Z) of the display panel.
4. A display panel according to claim 3, wherein the first through hole (231) has a first hole wall (2311); the display panel has a second direction (X) intersecting the first direction (Z), and the extending direction of the first hole wall (2311) has an angle θ with the second direction (X) of the display panel, satisfying: θ is more than or equal to 110 degrees and less than or equal to 160 degrees.
5. The display panel according to claim 4, wherein the first through hole (231) has a height H in a first direction (Z) of the display panel; the first through hole (231) also has a third aperture D 3 The method comprises the steps of carrying out a first treatment on the surface of the The method meets the following conditions: d (D) 2 <D 3 <D 1 ，(D 1 -D 2 )/2＝(D 3 -D 2 )/2+H/tan(180-θ)。
6. The display panel according to claim 2, wherein the first through hole (231) and the second through hole (232) are connected to form a first contact hole (23), the display panel further comprising a first connection portion (31), the first contact hole (23) exposing the first connection portion (31); the display panel further comprises an anode layer (41), a light-emitting layer (42) and a cathode layer (43) which are stacked; the cathode layer (43) is connected to the first connection portion (31) through the first contact hole (23), and the cathode layer (43) covers the first through hole (231).
7. The display panel according to claim 1, wherein the material of the first passivation layer (21) comprises one or more of silicon nitride, silicon oxide, silicon oxynitride, indium zinc oxide; the second passivation layer (22) comprises one or more of titanium oxide, aluminum oxide, germanium oxide;
and/or, along a first direction (Z) of the display panel, the first passivation layer (21) has a first thickness M, satisfying:the second passivation layer (22) has a second thickness N that satisfies: />
8. A method for manufacturing a display panel, comprising:
providing a substrate (100);
forming a first passivation layer (21) on one side of the substrate (100), the first passivation layer (21) having a first etching rate V 1 ；
Forming a second passivation layer (22) on a side of the first passivation layer (21) facing away from the substrate (100), the second passivation layer (22) having a second etching rate V 2 The method comprises the following steps: v (V) 2 <V 1 。
9. The method of manufacturing a display panel according to claim 8, further comprising, before forming the first passivation layer (21) on one side of the substrate (100):
a connection portion (31) is formed on one side of the substrate (100).
10. The method of manufacturing a display panel according to claim 9, characterized in that after forming a second passivation layer (22) on a side of the first passivation layer (21) facing away from the substrate (100), further comprising:
patterning the second passivation layer (22) to form a second via (232);
patterning the first passivation layer (21) to form a first via (231), the first via (231) having a first aperture D 1 The second through hole (232) has a second aperture D 2 The method comprises the steps of carrying out a first treatment on the surface of the The method meets the following conditions: d (D) 2 <D 1 。
11. The method of manufacturing a display panel according to claim 10, characterized in that the projected area of the first through hole (231) covers the projected area of the second through hole (232) in the first direction (Z) of the display panel.
12. The method of manufacturing a display panel according to claim 11, wherein the first through hole (231) has a first hole wall (2311); the display panel has a second direction (X) intersecting the first direction (Z), and the extending direction of the first hole wall (2311) has an angle θ with the second direction (X) of the display panel, satisfying: θ is more than or equal to 110 degrees and less than or equal to 160 degrees.
13. The method of manufacturing a display panel according to claim 10, wherein the first through hole (231) has a height H in a first direction (Z) of the display panel; the first through hole (231) also has a third aperture D 3 The method comprises the steps of carrying out a first treatment on the surface of the The method meets the following conditions: d (D) 2 <D 3 <D 1 ，(D 1 -D 2 )/2＝(D 3 -D 2 )/2+H/tan(180-θ)。
14. The method of manufacturing a display panel according to claim 10, further comprising, after patterning the second passivation layer (22):
the first through hole (231) and the second through hole (232) are connected to form a first contact hole (23), and an anode layer (41), a light-emitting layer (42) and a cathode layer (43) are sequentially formed on one side surface, away from the substrate (100), of the second passivation layer (22); the cathode layer (43) is connected to the first connection portion (31) through the first contact hole (23), and the cathode layer (43) covers the first through hole (231).
15. A display device comprising the display panel according to any one of claims 1-6.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311015745.0A CN117479700A (en) | 2023-08-11 | 2023-08-11 | Display panel, preparation method of display panel and display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311015745.0A CN117479700A (en) | 2023-08-11 | 2023-08-11 | Display panel, preparation method of display panel and display device |
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| CN202311015745.0A Pending CN117479700A (en) | 2023-08-11 | 2023-08-11 | Display panel, preparation method of display panel and display device |
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