CN117476537A - Wafer fixing device and detection equipment - Google Patents
Wafer fixing device and detection equipment Download PDFInfo
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- CN117476537A CN117476537A CN202311200189.4A CN202311200189A CN117476537A CN 117476537 A CN117476537 A CN 117476537A CN 202311200189 A CN202311200189 A CN 202311200189A CN 117476537 A CN117476537 A CN 117476537A
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- fixed column
- briquetting
- compression spring
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- 238000001514 detection method Methods 0.000 title claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 claims abstract description 30
- 230000000087 stabilizing effect Effects 0.000 claims abstract description 25
- 238000003825 pressing Methods 0.000 claims description 62
- 230000006835 compression Effects 0.000 claims description 25
- 238000007906 compression Methods 0.000 claims description 25
- 238000006073 displacement reaction Methods 0.000 claims description 11
- 230000004438 eyesight Effects 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000004140 cleaning Methods 0.000 abstract description 28
- 230000000007 visual effect Effects 0.000 abstract description 7
- 238000011010 flushing procedure Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000007921 spray Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 198
- 239000007788 liquid Substances 0.000 description 11
- 239000000126 substance Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 238000011179 visual inspection Methods 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 210000003437 trachea Anatomy 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Chemical & Material Sciences (AREA)
- Pathology (AREA)
- Immunology (AREA)
- General Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of wafer production, in particular to a wafer fixing device and detection equipment, which comprises a bearing table, a wafer, a stabilizing component and a power component; a stable component is fixedly arranged on the bearing table, and a wafer is placed on the stable component; a power assembly is fixedly arranged in the bearing table; the detection equipment comprises a metal sheet, a contact, a visual sensor and a control unit; the invention solves the problems that the wafer cannot be kept horizontal and is easy to incline in the sliding process due to the downward sliding of the wafer caused by the pressure of spray flushing in the process of cleaning the wafer by the conventional wafer fixing device, and realizes that the wafer cannot slide and incline when the wafer is cleaned.
Description
Technical Field
The invention relates to the technical field of wafer production, in particular to a wafer fixing device and detection equipment.
Background
In the wafer manufacturing process, after the wafer cleaning link is finished, the wafer cleaning condition needs to be detected by utilizing visual detection equipment, so that the phenomenon that pollutants remain on the surface of the wafer to influence subsequent processing is avoided. In the cleaning process, the wafer is clamped and fixed on the bearing table by a plurality of uniformly arranged fixing columns, the bearing table drives the wafer to rotate at a high speed, chemical medicines are sprayed downwards above the wafer, the wafer is further cleaned, after the cleaning is finished, the detection equipment detects the surface of the wafer through the vision sensor, and because the vision sensor shoots when the wafer sample is detected when the wafer sample is horizontally placed, the wafer is usually required to be kept in a horizontal state after the cleaning is finished, so that a more accurate detection result is obtained. If the wafer is inclined, the vertical projection of the wafer is changed from a circular shape to an oval shape, so that detection is affected, and meanwhile, the inclined wafer also reflects light sources around the vision sensor to cause glare interference.
When front surface cleaning of the wafer is carried out, a step type support is arranged on common cleaning equipment so as to prevent the wafer from sliding downwards in the process of being sprayed. However, when cleaning the back surface of the wafer, only the back surface of the wafer is usually required to be contacted with chemical cleaning liquid, and the front chip structure should not be contacted with chemical liquid and a hard surface, so the used fixing column is a cylindrical fixing column without steps, the wafer is easy to slide downwards due to the pressure of spraying and flushing in the cleaning process, the wafer cannot be kept horizontal in the sliding process, and the wafer is easy to incline to influence the detection. To solve the problem, the existing treatment method is to increase the clamping force of the fixing column and the friction force between the fixing column and the wafer, so that the problem of sliding down and tilting in the wafer cleaning process cannot be well solved.
For this purpose, a wafer fixing device and a detecting apparatus are provided.
Disclosure of Invention
The invention aims to solve the technical problems that: in the existing wafer fixing device, during the process of cleaning the wafer, the wafer is easy to slide downwards due to the pressure of spraying and flushing, the wafer cannot be kept horizontal during the sliding process, the wafer is easy to incline, and the accuracy of the detection result is affected.
In order to achieve the above purpose, the present invention provides the following technical solutions: a wafer fixing device comprises a bearing table, a wafer, a stabilizing component and a power component; the wafer is fixed by the fixing component, and the wafer is fixed by the fixing component through radial movement and the radial displacement and axial inclination of the wafer are limited by the fixing component; the power assembly is fixedly arranged in the bearing table and is used for clamping and fixing the wafer by driving the stabilizing assembly to move radially through the pneumatic drive.
In order to ensure that the wafer can be kept horizontal in the cleaning process, the wafer needs to be fixed on the bearing table through the stabilizing component, and the wafer is fixed through the power component control stabilizing component, so that the wafer is prevented from sliding downwards and tilting, the wafer is chamfered in the processing process, the wafer edge is prevented from being broken, the damage caused by thermal stress is prevented, meanwhile, the flatness of an epitaxial layer and photoresist at the wafer edge can be increased, the main effect of the stabilizing component is to assist in supporting the wafer chamfer by utilizing parts, the wafer is prevented from falling, meanwhile, the wafer is prevented from tilting excessively by utilizing parts to contact the wafer chamfer, and the inclined wafer is prevented from misjudgment of visual detection results.
The stabilizing component comprises a fixed column, an upper sleeve, a lower sleeve, an upper pressing block, a lower pressing block, a pressure spring and a compression spring; the top movable mounting of fixed column has the sleeve, and the bottom movable mounting of fixed column has the sleeve down, go up briquetting slidable mounting in the bottom of last telescopic, lower briquetting slidable mounting is at telescopic top down, and the top joint of going up the briquetting has pressure spring, pressure spring joint is between last sleeve and last briquetting, and pressure spring is located the fixed column outside, and lower briquetting bottom joint is at there is compression spring, just compression spring is located down between sleeve and the briquetting, and compression spring is located the outside of fixed column.
In the process of wafer cleaning, the wafer will rotate at a high speed on the fixed column, the wafer can be firmly fixed through the upper sleeve and the lower sleeve, because the upper sleeve and the lower sleeve are respectively relatively movable with the upper pressing block and the lower pressing block, and a pressure spring and a compression spring are arranged between the upper sleeve and the upper pressing block and between the lower sleeve and the lower pressing block, so that the wafer can not be blocked rigidly in the falling process, the pressure spring and the compression spring can provide buffering and unloading effects for the wafer, the wafer chamfer is prevented from being subjected to excessive external force, the wafer damage is caused, meanwhile, the lower pressing block on the lower sleeve can be used as a reference of the positioning position for placing the wafer, when the wafer is cleaned at the back and is manually placed, the wafer is easy to incline in the placing process because of no step structure on the fixed column, and the inclined state of the wafer can be aggravated in the high-speed rotation cleaning, and the problem that the wafer is inclined in the manual placing process can be greatly slowed down after the lower pressing block on the lower sleeve is used as the reference position.
The axis of fixed column is provided with the tangent plane, just the width value of tangent plane is 2/3 of fixed column diameter value, is provided with the scale strip on the tangent plane on the fixed column, and the bottom of fixed column is provided with circular boss, and the centre of a circle inside of fixed column is provided with the metal pipe, the length value of metal pipe equals the length value of fixed column.
Because at the during operation, go up sleeve and lower sleeve and wafer together high-speed rotation, in order to guarantee upper sleeve and lower telescopic stability, then be provided with the tangent plane at the fixed column axis, the tangent plane is mutually supported with upper sleeve and lower sleeve, upper sleeve and lower sleeve have been avoided taking place to rotate, and the width of tangent plane is the 2/3 of fixed column diameter this is for better increase upper sleeve and lower telescopic stability, make things convenient for compression spring and compression spring's fixed mounting simultaneously, when the tangent plane width is too big, will not install compression spring of compression spring, the spare part on every fixed column all is located same height during the installation, can set up the benchmark structure and make all lower sleeves keep on same level, so set up circular boss in the fixed column bottom, as lower sleeve's installation benchmark, in order to guarantee that lower sleeve is in same level, and be provided with the scale strip on the tangent plane on the fixed column, because upper sleeve is located wafer top, can be according to the thickness adjustment upper sleeve's of wafer, and then adjust the height of briquetting, in order to satisfy the washing demand of thicker wafer of thickness. The scale strips are arranged on the tangential plane, so that operators can conveniently and accurately position the heights of the upper sleeves, the upper sleeves are guaranteed to be mounted at the same height, and the detection precision of the metal sheet and the contact is guaranteed. Meanwhile, in order to increase the stability of the upper sleeve, a metal round tube is arranged inside the center of the circle of the fixed column, and because a plurality of parts are required to be installed on the fixed column, the fixed column is required to be subjected to strength increasing treatment, the metal round tube is added in the center of the fixed column, and meanwhile, the inside of the metal round tube can be used for accommodating wires.
The top outside of going up the telescopic is provided with the gyro wheel, goes up the inside arc piece that is provided with of sleeve, the length value of arc piece equals the length value of last telescopic, and the arc piece mutually support with the tangent plane on the fixed column, telescopic inside is provided with the arc piece down, the length value of arc piece equals the length value of lower telescopic, and the arc piece mutually support with the tangent plane on the fixed column.
When adjusting the telescopic height, rotate earlier and go up the knob for go up the sleeve and become flexible, then reciprocate again, if directly remove last sleeve, can hardly accomplish comparatively accurate location, go up the knob and go up the sleeve and still can take place the skew when screwing up moreover, set up the gyro wheel on last sleeve, gyro wheel and tangent plane contact have increased the friction between last sleeve and the fixed column, the probability that goes up the sleeve and take place the skew when reducing the bolt and screw up. Simultaneously, when adjusting the telescopic height, the telescopic height in accessible roll gyro wheel control, can accomplish to adjust more accurately and fix a position, the operating personnel of also being convenient for sets up all upper sleeve in the position of same height, the inside arc piece that is provided with of upper sleeve and lower sleeve is then in order to mutually support with the tangent plane on the fixed column, for guarantee upper sleeve and lower sleeve can not take place to rotate, guarantee its stability, the length of arc piece equals upper sleeve's length and the length of arc piece equals lower telescopic length all in order to increase upper sleeve and lower sleeve's stability performance on the fixed column, prevent when wasing the wafer, take place to rotate, thereby lead to wafer gliding or slope.
The circular hole is formed in the upper sleeve, the upper knob is installed in the circular hole in a rotating mode, the upper knob is located below the roller, the diameter value of the circular hole is 1/2 of the width value of the upper section of the fixed column, the circular hole is formed in the lower sleeve, the lower knob is installed in the circular hole in a rotating mode, and the diameter value of the circular hole is 1/2 of the width value of the upper section of the fixed column.
When cleaning the wafer, need place the wafer on the fixed column, and fix the wafer through last sleeve and lower sleeve, because last sleeve and lower sleeve all can slide on the fixed column, then need go up the knob on the sleeve and lower knob on the lower sleeve will go up sleeve and lower sleeve and adjust fixedly, adjust the distance between upper sleeve and the lower sleeve according to the thickness of wafer, thereby make the wafer can be more firm, prevent in the follow-up testing process, the wafer from taking place to slide down or slope, and round hole and circular hole are then be used for installing knob and lower knob, and the diameter of round hole is 1/2 of the tangent plane width on the fixed column and the diameter of circular hole is 1/2 of the tangent plane width on the fixed column then in order to guarantee that the inboard end of knob and lower knob can be contacted each other with the tangent plane of fixed column completely, with the frictional force between the increase two, thereby the steadiness to upper sleeve and lower sleeve more.
The bottom of the upper pressing block and the top of the lower pressing block are respectively provided with a conical inclined surface, the conical inclined surfaces are provided with annular grooves, the included angle between the axis of the annular grooves and the axis of the lower pressing block is 10-15 degrees, and the part of the annular grooves, which is far away from the wafer, is lower than the part which is contacted with the wafer.
When the wafer is in the high-speed rotatory in-process, thereby because the clamping strength is less than and sprays down pressure and lead to down when moving, and the conical inclined plane can provide holding power for the wafer, slow down or prevent the wafer to continue to drop, in the cleaning process, chemical liquid can be stained with on last sleeve, lower sleeve, go up briquetting and lower briquetting, so should set up corresponding structure, the chemical liquid that is stained with on the part easily flows down, keep away from the wafer when flowing down simultaneously, so set up the annular groove of slope on last briquetting and lower briquetting, simultaneously, the contact terminal surface of last briquetting and lower briquetting is also slope, and the terminal surface of slope is all to keeping away from wafer direction downward sloping, in wafer rotation process, the chemical liquid can receive the influence of centripetal force, to keeping away from the direction diffusion departure of wafer, in this process, partial chemical liquid can be blocked by last briquetting and lower briquetting, be stained with above, after being provided with the slope terminal surface, chemical liquid can flow in the direction of annular groove, the outside direction removes, avoid gathering the liquid on the annular groove. Considering that the flow guiding effect of the annular groove is not obvious when the angle is smaller than 10 degrees, and the processing of the annular groove is difficult when the angle is larger than 15 degrees, the inclination angle is set between 10 degrees and 15 degrees.
The power component comprises an air pump, an air pipe and a telescopic pipe, wherein the air pump is fixedly arranged in the bearing table, one end of the air pipe is fixedly arranged on the air pump, the other end of the air pipe is fixedly arranged on one end of the telescopic pipe, the other end of the telescopic pipe is fixedly arranged on the side surface of the bottom of the fixed column, and the telescopic length of the telescopic pipe is equal to the moving distance of the fixed column.
In order to enable the fixing columns to clamp and fix the wafer, the air pump inside the power assembly is required to generate larger air pressure, the telescopic pipes are enabled to stretch through the air pressure, the fixing columns are driven to move, in order to ensure that the tensile force borne by each fixing column is the same, the unused air pipes are required to be communicated with the telescopic pipes, the telescopic pipes can be enabled to move simultaneously, different fixing columns are enabled to move simultaneously, the wafer is clamped and fixed, the stretching length of the telescopic pipes is equal to the moving distance of the fixing columns, the telescopic pipes are enabled to have a certain displacement, and therefore wafers with different sizes are applicable, and the wafer with different sizes can be clamped and fixed.
The utility model discloses a bearing platform, including the plummer, the centre of a circle is crossed at the top of plummer, the rectangle recess has been seted up to the plummer inside, circular recess has been seted up to the centre of a circle position all around to the rectangle recess, four arc through-holes have been radially seted up respectively to the top of plummer, the arc through-hole is located circular recess top, and link up each other with circular recess, and the length value of arc through-hole equals the length value of circular recess, and the length value of arc through-hole is 3/4 of plummer diameter value.
The plummer is then used for bearing whole firm subassembly and power component and wafer, in order to guarantee to fix the wafer, then need the operation through the inside power component drive firm subassembly of plummer, and the rectangle recess of seting up in plummer is then used for installing pneumatics, the circular recess of seting up all around is then for installing flexible pipe, flexible pipe can stretch out and draw back in circular recess, and drive the fixed column and remove, thereby fix the wafer, the length of arc through-hole equals the length of circular recess then in order to guarantee that the fixed column has sufficient displacement, the length of arc through-hole is 3/4 of plummer diameter, when guaranteeing that the fixed column has sufficient displacement, and can adjust according to the size of different wafer sizes.
A detection apparatus comprising a metal sheet, a contact, a visual sensor and a control unit; the metal sheet is fixedly arranged on the bottom inner wall of the upper sleeve and the top inner wall of the lower sleeve, the contact is fixedly arranged on the outer side of the top of the upper pressing block and the outer side of the bottom of the lower pressing block, the contact is positioned on a connecting line of the circle centers of the upper pressing block and the lower pressing block and the circle center of the wafer, the metal sheet is connected with the contact through an electric wire, the electric wire is positioned inside the metal circular tube, and the vision sensor is fixedly arranged above the wafer.
The wafer is inclined, and the upper pressing block and the lower pressing block are touched, and the upper pressing block or the lower pressing block is extruded to shrink and move, so that whether the wafer slides down or inclines is detected. When the upper pressing block and the lower pressing block are not subjected to external force, the metal sheet is contacted with the contact to form a circuit path; when the upper pressing block and the lower pressing block are subjected to external force of the wafer and then shrink and move, the contact is far away from the metal sheet, so that a circuit is broken, a control unit receives breaking signals after the circuit is shorted, and whether the wafer slides downwards or inclines is judged according to the quantity and the combination condition of the breaking signals. When all the circuit signals in the upper sleeve, the lower sleeve, the upper pressing block and the lower pressing block are open circuits, the wafer can be judged to slide downwards, when the circuit signals in one upper sleeve, the lower sleeve, the upper pressing block and the lower pressing block are open circuits, and the circuit signals formed by the lower sleeve and the lower pressing block which are opposite to each other and positioned on the upper sleeve are also in an open circuit state, the wafer can be judged to incline, the control unit alarms and records according to the judgment result, and feeds back the judgment result to an operator.
In an ideal state, when the lower pressing block is subjected to the external force of the wafer, the whole lower pressing block moves downwards, and the contact can be smoothly separated from the metal sheet, but because the upper pressing block and the lower pressing block are sleeved on the fixed column and slide relative to the fixed column, a gap exists between the upper pressing block and the fixed column; meanwhile, when the diameter of the wafer is smaller, the lifting amplitude of the two sides of the wafer is smaller after the wafer is inclined, which may not be enough to enable the plane where the contact points are located to be completely separated from the metal sheet, and the situation that the contact points are still contacted with the metal sheet after the wafer is inclined and the upper pressing block and the lower pressing block are pressed is possibly caused, so that the contact points are arranged on one side close to the wafer, the circle centers of the wafer are connected with the circle centers of the upper pressing block and the lower pressing block, and the contact points are positioned on the connection line and are close to the wafer; the possibility of detection errors caused by contact position setting is reduced, and the detection sensitivity is improved.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the bearing table is provided with the stabilizing component and the power component, and the axial displacement and the radial displacement of the wafer are limited by the mutual matching of the stabilizing component and the power component, so that the wafer can be supported in an auxiliary manner under the condition that the wafer is not contacted with a front chip of the wafer when the wafer is cleaned, the wafer is prevented from sliding downwards when the back of the wafer is cleaned, the wafer is prevented from sliding downwards or inclining when the wafer is cleaned, the cleaning effect of the wafer is improved, and the accuracy of visual detection is also improved.
2. According to the invention, the stable component and the power component are arranged on the bearing table, and the detection equipment and the stable component are mutually matched, so that when the wafer is cleaned, the wafer is limited and fixed through the stable component, meanwhile, the wafer can be detected through the detection equipment, and the circuit is broken according to the stress condition of the wafer, and whether the wafer slides down or tilts is judged according to the number and the combination condition of the broken signals, so that the effect of monitoring the rotation condition of the wafer in real time is achieved.
3. According to the invention, the power assembly and the stabilizing assembly are arranged on the bearing table, and the power assembly and the stabilizing assembly are mutually matched, so that the power assembly can drive the stabilizing assembly to move through the air and simultaneously move radially inwards or radially outwards, and the wafer is fixed, the force on the four sides of the wafer with the same magnitude is ensured, and the cleaning effect of the wafer and the accuracy of subsequent visual detection are further improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is an enlarged schematic view of portion A of FIG. 1;
FIG. 3 is a schematic diagram of the overall structure of the present invention;
FIG. 4 is an enlarged schematic view of portion B of FIG. 3;
FIG. 5 is an enlarged schematic view of portion C of FIG. 4;
FIG. 6 is a schematic view of the lower sleeve and lower press block of the present invention;
FIG. 7 is an enlarged schematic view of portion D of FIG. 6;
FIG. 8 is a top view of the present invention;
FIG. 9 is a schematic view of the contact locations of the present invention;
FIG. 10 is a schematic view of the inclination of the annular groove according to the present invention;
FIG. 11 is a cross-sectional view of the lower sleeve of the present invention;
FIG. 12 is a cross-sectional view of an upper sleeve of the present invention;
fig. 13 is a cross-sectional view of a carrier of the present invention.
In the figure: 1. a carrying platform; 11. rectangular grooves; 12. a circular groove; 13. an arc-shaped through hole; 2. a wafer; 3. a stabilizing assembly; 31. fixing the column; 311. cutting into sections; 312. a scale bar; 313. a circular boss; 314. a metal round tube; 32. an upper sleeve; 321. a roller; 322. an arc-shaped block; 323. a round hole; 324. a knob is arranged; 33. a lower sleeve; 331. an arc block; 332. a circular hole; 333. a lower knob; 34. pressing into blocks; 35. pressing the block; 36. a pressure spring; 37. a compression spring; 4. a power assembly; 41. an air pump; 42. an air pipe; 43. a telescopic tube; 5. conical inclined plane; 6. an annular groove; 7. a metal sheet; 8. and a contact.
Detailed Description
In order to better understand the above technical solutions, the following detailed description will refer to the accompanying drawings and specific embodiments.
As shown in fig. 1 and 13, the present invention provides a wafer fixing device and a detecting apparatus, and the technical scheme is as follows: the wafer fixing device comprises a bearing table 1, a wafer 2, a stabilizing component 3 and a power component 4; the wafer 2 is fixed by the fixing component 3, the wafer 2 is placed on the fixing component 3, the fixing component 3 moves radially, and the fixing component 3 limits radial displacement and axial inclination of the wafer 2; the power assembly 4 is fixedly arranged in the bearing table 1, and the power assembly 4 radially moves through the pneumatic driving stabilizing assembly 3 to clamp and fix the wafer 2.
When rinsing wafer 2, at first need prevent the wafer 2 on the firm subassembly 3 top on plummer 1, then start through power component 4, power component 4 will power transfer to on the firm subassembly 3, drive the radial removal of firm subassembly 3, thereby fix the wafer 2 of firm subassembly 3 top, restrict radial removal and the axis removal of wafer 2, thereby guaranteed wafer 2 in carrying out abluent in-process, wafer 2 can not take place the condition of gliding and slope, improved wafer 2's cleaning efficiency greatly, the while also improves the accuracy of follow-up through visual inspection.
As shown in fig. 2 to 12, the stabilizing assembly 3 includes a fixing column 31, an upper sleeve 32, a lower sleeve 33, an upper pressing block 34, a lower pressing block 35, a pressure spring 36, and a compression spring 37; the top movable mounting of fixed column 31 has sleeve 32, and the bottom movable mounting of fixed column 31 has sleeve 33 down, go up briquetting 34 slidable mounting in the bottom of sleeve 32 down, briquetting 35 slidable mounting is at the top of sleeve 33 down, goes up briquetting 34 top joint and has compression spring 36, compression spring 36 joint is between sleeve 32 and last briquetting 34, and compression spring 36 is located the fixed column 31 outside, and the bottom joint of briquetting 35 has compression spring 37 down, just compression spring 37 joint is between sleeve 33 and briquetting 35 down, and compression spring 37 is located the outside of fixed column 31.
When the wafer 2 is fixed, firstly, the wafer 2 needs to be placed on the fixed column 31, and the wafer 2 is placed horizontally by taking the conical inclined surface 5 on the lower pressing block 35 on the fixed column 31 as a reference, after the wafer 2 is placed, the height of the upper sleeve 32 needs to be adjusted to be at a proper height due to initial use, the upper sleeve 32 drives the upper pressing block 34 to slide downwards on the fixed column 31, after the upper pressing block 34 contacts with the edge of the wafer 2, the upper sleeve 32 will not move, the upper sleeve 32 is fixed on the fixed column 31, and the fixed column 31 moves radially inwards at the same time, so that the wafer 2 is clamped radially, and the radial displacement and the axial displacement of the wafer 2 are limited, and the wafer 2 is prevented from sliding downwards or tilting in the process of cleaning the wafer 2.
As shown in fig. 2 to 12, the axis of the fixing column 31 is provided with a tangential plane 311, the width of the tangential plane 311 is 2/3 of the diameter of the fixing column 31, the tangential plane 311 on the fixing column 31 is provided with a scale bar 312, the bottom of the fixing column 31 is provided with a circular boss 313, the inside of the center of the circle of the fixing column 31 is provided with a metal circular tube 314, and the length of the metal circular tube 314 is equal to the length of the fixing column 31.
In the process of cleaning the wafer 2, the wafer 2 is first placed on the fixing column 31 manually, the height of the upper sleeve 32 is manually adjusted according to the scale bar 312 on the fixing column 31, and the metal round tube 314 is used for enhancing the supporting strength of the fixing column 31.
As shown in fig. 2, 3, 4, 9, 10, 11 and 12, the roller 321 is disposed at the outer side of the top of the upper sleeve 32, an arc block 322 is disposed inside the upper sleeve 32, the length value of the arc block 322 is equal to the length value of the upper sleeve 32, the arc block 322 is matched with the tangential surface 311 on the fixed column 31, an arc block 331 is disposed inside the lower sleeve 33, the length value of the arc block 331 is equal to the length value of the lower sleeve 33, and the arc block 331 is matched with the tangential surface 311 on the fixed column 31.
When the height of the upper sleeve 32 is adjusted, the roller 321 is manually rotated by a human, and the roller 321 rotates on the tangential surface 311 of the fixed column 31, so that the upper sleeve 32 is driven to slide up and down on the fixed column 31, and the upper sleeve 32 is adjusted to a proper height.
As shown in fig. 2, 3, 4, 6, 8, 9, 10, 11 and 12, a circular hole 323 is formed in the upper sleeve 32, an upper knob 324 is rotatably mounted in the circular hole 323, the upper knob 324 is located below the roller 321, the diameter of the circular hole 323 is 1/2 of the width of the upper section 311 of the fixed column 31, a circular hole 332 is formed in the lower sleeve 33, a lower knob 333 is rotatably mounted in the circular hole 332, and the diameter of the circular hole 332 is 1/2 of the width of the upper section 311 of the fixed column 31.
In adjusting the upper and lower sleeves 32, 33, it is necessary to fix the upper and lower sleeves 32, 33 inside the fixed column 31 by rotating the upper and lower knobs 324, 324 on the upper and lower sleeves 32, 33 and moving the upper and lower knobs 324, 333 radially inward by the rotation so as to be in contact with the tangential surface 311 of the fixed column 31, and applying a pressure from the tangential surface 311 of the fixed column 31.
As shown in fig. 2, 3, 4, 6, 8, 9 and 10, conical inclined surfaces 5 are respectively arranged at the bottom of the upper pressing block 34 and the top of the lower pressing block 35, an annular groove 6 is arranged on the conical inclined surfaces 5, an included angle between the axis of the annular groove 6 and the axis of the lower pressing block 35 is 10 ° -15 °, and a part of the annular groove 6 away from the wafer 2 is lower than a part contacting the wafer 2.
When the wafer 2 is cleaned, the wafer 2 is firstly required to be horizontally placed on the fixing column 31, and the chamfer on the edge of the wafer 2 is mutually contacted with the conical inclined surface 5, so that the wafer 2 can be ensured to be on the horizontal plane, in the cleaning process, the liquid after the cleaning can flow downwards along with the annular groove 6, and the liquid flows from the annular groove 6 contacting with the part of the wafer 2 to the annular groove 6 far away from the part of the wafer 2, so that the liquid after the cleaning is prevented from accumulating on the annular groove 6.
As shown in fig. 13, the power assembly 4 includes an air pump 41, an air pipe 42 and a telescopic pipe 43, the air pump 41 is fixedly installed inside the carrying platform 1, one end of the air pipe 42 is fixedly installed on the air pump 41, the other end of the air pipe 42 is fixedly installed on one end of the telescopic pipe 43, the other end of the telescopic pipe 43 is fixedly installed on the bottom side surface of the fixed column 31, and the telescopic length of the telescopic pipe 43 is equal to the moving distance of the fixed column 31.
When fixing wafer 2, through the air pump 41 on power component 4, air pump 41 starts, with inside the gas filling pipe 42, the inside gas of gas pipe 42 will flow to four flexible pipe 43 inside, when the inside atmospheric pressure of flexible pipe 43 increases, flexible pipe 43 will stretch out, thereby drive the radial outside removal of fixed column 31, when the inside atmospheric pressure of flexible pipe 43 reduces, will drive the radial inside removal of fixed column 31, thereby press from both sides the tight fixing of wafer 2 on fixed column 31, make wafer 2 can not take place radial movement, thereby prevent wafer 2 at abluent in-process, because the pressure is too big and lead to wafer 2 radial displacement.
As shown in fig. 2, 3 and 13, the rectangular groove 11 is formed in the carrying platform 1, the circular groove 12 is formed in the central position around the rectangular groove 11, four arc through holes 13 are radially formed in the top of the carrying platform 1 at positions passing through the center of the circle, the arc through holes 13 are located above the circular groove 12 and are communicated with the circular groove 12, the length of the arc through holes 13 is equal to the length of the circular groove 12, and the length value of the arc through holes 13 is 3/4 of the diameter value of the carrying platform 1.
When cleaning the wafer 2, the wafer 2 is fixed above the bearing table 1 through the mutual matching of the power component 4 and the stabilizing component 3, and then the telescopic tube 43 on the power component 4 slides in the circular groove 12 on the bearing table 1 in a telescopic way, so that the stabilizing group is driven to move radially, and the wafer 2 is clamped and fixed.
As shown in fig. 5, 7 and 9, a detecting apparatus includes a metal sheet 7, a contact 8, a visual sensor and a control unit; the metal sheet 7 is fixedly arranged on the bottom inner wall of the upper sleeve 32 and the top inner wall of the lower sleeve 33, the contact 8 is fixedly arranged on the outer side of the top of the upper pressing block 34 and the outer side of the bottom of the lower pressing block 35, the contact 8 is positioned on a connecting line of the circle centers of the upper pressing block 34 and the lower pressing block 35 and the circle center of the wafer 2, the metal sheet 7 is connected with the contact 8 through an electric wire, the electric wire is positioned inside the metal round tube 314, and the vision sensor is fixedly arranged above the wafer 2.
When the wafer 2 is placed through manual operation, the pressing block 35 cannot be extruded in the placing process, otherwise, misjudgment of detection of the metal sheet 7 and the contact 8 is caused, and when the carrying platform 1 rotates after the placement is finished, if the electric signals formed by the metal sheet 7 and the contact 8 have the disconnection condition, the rotation condition of the wafer 2 can be judged according to the conditions of all groups of electric signals. And judging whether the wafer 2 slides down or tilts according to the number and the combination condition of the breaking signals.
In the whole working process, when the invention is used for cleaning the back of the wafer 2 for the first time, an operator fixes the wafer 2 above the bearing table 1 through the fixing column 31, and the conical inclined surface 5 of the pressing block 35 can be used as a reference when the wafer 2 is placed, so that the wafer 2 is kept horizontal, but in the process, the pressing block 35 cannot be extruded, otherwise, the detection of the metal sheet 7 and the contact 8 is misjudged; after the wafer 2 is fixed, because it is first use, need go up sleeve 32 and highly adjust, go up sleeve 32 and be connected with fixed column 31 through last knob 324, rotate the knob 324 during the regulation for go up sleeve 32 and take place not hard up, then through the gyro wheel 321 that sets up on last sleeve 32, adjust last sleeve 32 to suitable height, then screw up the knob 324 again, because all be equipped with on every fixed column 31 and go up sleeve 32, so need pass through the scale strip 312 on the tangent plane 311 on the fixed column 31 in proper order and adjust the height of last sleeve 32. In addition, since the upper sleeve 32 and the lower sleeve 33 are required to rotate together with the wafer 2, in order to ensure the stability of the upper sleeve 32 and the lower sleeve 33, the tangent plane 311 is arranged on the fixing column 31, and simultaneously the upper sleeve 32 and the lower sleeve 33 can slide on the tangent plane 311 of the fixing column 31, so that the rotation of the upper sleeve 32 and the lower sleeve 33 is avoided, and in addition, according to the scales on the tangent plane 311 on the fixing column 31, when the height of the upper sleeve 32 is adjusted, the positions of the scales where other upper sleeves 32 are positioned can be simultaneously compared, and each upper sleeve 32 is ensured to be arranged at the same height.
When placing wafer 2, fixed column 31 is driven by air pump 41 on power component 4, air pump 41 fills the inside of trachea 42, and flow into flexible pipe 43 through the inside of trachea 42, because the inside atmospheric pressure of flexible pipe 43 increases, will drive flexible pipe 43 and flexible pipe 43 drives fixed column 31 radial outside and remove, when air pump 41 draws air from trachea 42, the atmospheric pressure of flexible pipe 43 inside will reduce, thereby make flexible pipe 43 shrink, and drive fixed column 31 radial inside and remove, carry out the clamp fixation with wafer 2 on the fixed column 31, therefore, when installing sleeve 32, need to leave the dodging distance to wafer 2, avoid wafer 2 card on the conical inclined plane 5 of briquetting 35 when fixed column 31 shrink, dodging distance can be determined according to actual operating mode, but should not exceed 1mm, otherwise can influence the testing result of sheetmetal 7 and contact 8, the smaller the more accurate operation is also needed when placing wafer 2 to the theory dodging distance is higher. If the thinner wafer 2 is cleaned, and when the wafer 2 is placed, the wafer 2 is not well controlled in a horizontal state, an auxiliary checking fixture should be designed to place the wafer 2, the checking fixture is placed on the bearing table 1, the top surface of the checking fixture is consistent with the height of the lower pressing block 35, after the wafer 2 is placed on the checking fixture, an operator operates the fixing column 31 to shrink and clamp the wafer 2 towards the center, then the checking fixture is pulled out from the side surface, the bearing table 1 is started again, and the wafer 2 is cleaned.
When the carrying table 1 rotates, if the electrical signals formed by the metal sheet 7 and the contact 8 are broken, the rotation condition of the wafer 2 can be judged according to the condition of each group of electrical signals. And judging whether the wafer 2 slides down or tilts according to the number and the combination condition of the breaking signals. When all the circuit signals in the upper sleeve 32, the lower sleeve 33, the upper pressing block 34 and the lower pressing block 35 are open circuits, the wafer 2 can be judged to slide downwards, when the circuit signals in one of the upper sleeve 32, the lower sleeve 33, the upper pressing block 34 and the lower pressing block 35 are open circuits, and the circuit signals formed by the lower sleeve 33 and the lower pressing block 35 which are opposite to the upper sleeve 32 are also open circuits, the wafer 2 can be judged to incline, the control unit alarms and records according to the judgment result and feeds back to an operator, when the batch incline problem occurs, the operator can select the selective examination wafer 2 to carry out visual inspection again, and meanwhile, overhaul and adjustment are carried out on equipment in time, so that the inclination of the wafer 2 is prevented from influencing the visual inspection again, and the accuracy of the visual inspection is fully ensured.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (9)
1. The wafer fixing device comprises a bearing table (1), a wafer (2), a stabilizing component (3) and a power component (4); the method is characterized in that: the wafer stabilizing device is characterized in that a stabilizing component (3) is fixedly arranged on the bearing table (1), a wafer (2) is placed on the stabilizing component (3), the stabilizing component (3) limits radial displacement and axial inclination of the wafer (2) through radial movement, and the wafer (2) is stabilized; the wafer clamping device is characterized in that a power assembly (4) is fixedly arranged in the bearing table (1), and the power assembly (4) radially moves through a pneumatic driving stabilizing assembly (3) to clamp and fix the wafer (2).
2. A wafer holding apparatus according to claim 1, wherein: the stabilizing component (3) comprises a fixing column (31), an upper sleeve (32), a lower sleeve (33), an upper pressing block (34), a lower pressing block (35), a pressure spring (36) and a compression spring (37); the top movable mounting of fixed column (31) has sleeve (32), and the bottom movable mounting of fixed column (31) has sleeve (33) down, go up briquetting (34) slidable mounting in the bottom of sleeve (32), lower briquetting (35) slidable mounting is at the top of sleeve (33) down, and the top joint of going up briquetting (34) has compression spring (36), compression spring (36) joint is between sleeve (32) and last briquetting (34), and compression spring (36) are located the fixed column (31) outside, and the bottom fixed mounting of briquetting (35) has compression spring (37) down, just compression spring (37) joint is between sleeve (33) and briquetting (35) down, and compression spring (37) are located the outside of fixed column (31).
3. A wafer holding apparatus according to claim 2, wherein: the axis of fixed column (31) is provided with tangent plane (311), just the width value of tangent plane (311) is 2/3 of fixed column (31) diameter value, is provided with scale strip (312) on tangent plane (311) on fixed column (31), and the bottom of fixed column (31) is provided with circular boss (313), and the centre of a circle inside of fixed column (31) is provided with metal pipe (314), the length value of metal pipe (314) equals the length value of fixed column (31).
4. A wafer holding apparatus according to claim 2, wherein: the top outside of going up sleeve (32) is provided with gyro wheel (321), and the inside of going up sleeve (32) is provided with arc piece (322), the length value of arc piece (322) equals the length value of last sleeve (32), and arc piece (322) mutually support with tangent plane (311) on fixed column (31), the inside of lower sleeve (33) is provided with arc piece (331), the length value of arc piece (331) equals the length value of lower sleeve (33), and arc piece (331) mutually support with tangent plane (311) on fixed column (31).
5. A wafer holding apparatus according to claim 2, wherein: round holes (323) are formed in the upper sleeve (32), the upper knob (324) is installed in the round holes (323) in a rotating mode, the upper knob (324) is located below the idler wheels (321), the diameter value of the round holes (323) is 1/2 of the width value of the upper tangent plane (311) of the fixed column (31), round holes (332) are formed in the lower sleeve (33), the lower knob (333) is installed in the round holes (332) in a rotating mode, and the diameter value of the round holes (332) is 1/2 of the width value of the upper tangent plane (311) of the fixed column (31).
6. A wafer holding apparatus according to claim 2, wherein: the bottom of last briquetting (34) and the top of lower briquetting (35) are provided with circular cone inclined plane (5) respectively, be provided with annular groove (6) on circular cone inclined plane (5), the contained angle between the axle center of annular groove (6) and the axle center of lower briquetting (35) is 10 ~ 15, and the part that annular groove (6) kept away from wafer (2) is less than the part that contacts wafer (2).
7. A wafer holding apparatus according to claim 1, wherein: the power assembly (4) comprises an air pump (41), an air pipe (42) and a telescopic pipe (43), wherein the air pump (41) is fixedly installed inside the bearing table (1), one end of the air pipe (42) is fixedly installed on the air pump (41), the other end of the air pipe (42) is fixedly installed on one end of the telescopic pipe (43), the other end of the telescopic pipe (43) is fixedly installed on the side face of the bottom of the fixed column (31), and the telescopic length of the telescopic pipe (43) is equal to the moving distance of the fixed column (31).
8. A wafer holding apparatus according to claim 1, wherein: rectangular grooves (11) are formed in the carrying table (1), round grooves (12) are formed in the peripheral center positions of the rectangular grooves (11), four arc-shaped through holes (13) are formed in the positions, passing through the center of the circle, of the top of the carrying table (1) in the radial direction, the arc-shaped through holes (13) are located above the round grooves (12) and are communicated with the round grooves (12), the length value of the arc-shaped through holes (13) is equal to that of the round grooves (12), and the length value of the arc-shaped through holes (13) is 3/4 of the diameter value of the carrying table (1).
9. A detection device according to any one of claims 1 to 8, characterized in that the detection device comprises a metal sheet (7), contacts (8), a vision sensor and a control unit; the utility model discloses a wafer, including metal sheet (7), contact (8), upper briquetting (34), lower briquetting (35), metal sheet (7) fixed mounting is at the bottom inner wall of upper sleeve (32) and the top inner wall of lower sleeve (33), contact (8) fixed mounting is at the top outside of upper briquetting (34) and the bottom outside of lower briquetting (35), and contact (8) are located the line at the centre of a circle of upper briquetting (34) and lower briquetting (35) and wafer (2) centre of a circle, metal sheet (7) and contact (8) pass through wire connection, and the electric wire is located inside metal pipe (314), vision sensor fixed mounting is in wafer (2) top.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311200189.4A CN117476537A (en) | 2023-09-16 | 2023-09-16 | Wafer fixing device and detection equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN118010755A (en) * | 2024-04-10 | 2024-05-10 | 湖南中钢智能装备有限公司 | Excavator counter weight welding seam detects frock |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN118010755A (en) * | 2024-04-10 | 2024-05-10 | 湖南中钢智能装备有限公司 | Excavator counter weight welding seam detects frock |
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