CN114755467A

CN114755467A - Supporting structure for semiconductor detection

Info

Publication number: CN114755467A
Application number: CN202210398601.7A
Authority: CN
Inventors: 刘宏星
Original assignee: Individual
Current assignee: Individual
Priority date: 2022-04-16
Filing date: 2022-04-16
Publication date: 2022-07-15

Abstract

The invention discloses a supporting structure for semiconductor detection, which relates to the field of semiconductors and comprises a bottom plate, wherein a fixed disc is installed on the top side of the bottom plate through a plurality of first telescopic rods, a plurality of sliding holes are formed in the fixed disc, ejection units are installed in the sliding holes in a sliding mode, the top sides of the ejection units are located on the same plane, and a positioning rod is installed on the top side of the fixed disc through an adjusting mechanism. According to the semiconductor detection device, the tops of the ejection units are located on the same plane to form a supporting plane for supporting a semiconductor to be detected, when the semiconductor is detected, the tip end of the metal rod tightly presses the semiconductor, pressure is transmitted to the sliding column through the supporting column, a proper elastic force value is set for the elastic unit, and when the pressure is too large, the sliding column overcomes the elastic force of the elastic unit to slide downwards, so that the distance between the semiconductor and the tip end of the metal rod is increased, the pressure of the metal rod on the semiconductor is reduced, the semiconductor is protected, and the semiconductor is prevented from being damaged.

Description

Supporting structure for semiconductor detection

Technical Field

The invention relates to the field of semiconductors, in particular to a supporting structure for semiconductor detection.

Background

The semiconductor is an indispensable important part in electronic equipment, and various detections are performed during processing and using processes to determine whether the semiconductor is suitable for further device processing, such as sheet resistance measurement.

In the prior art, when a thin metal rod is used for measuring sheet resistance, the distance between the metal rod and each semiconductor is different due to the influences of a plurality of factors such as manufacturing errors and installation errors of the semiconductors, when the tip of the metal rod is pressed on the semiconductor, poor contact is easily caused due to too small pressure, the measured value is inaccurate, and the semiconductor is easily damaged due to too large pressure, so that certain influence is brought to the measurement work.

Disclosure of Invention

The present application aims to provide a supporting structure for semiconductor inspection, so as to solve the problem that when the thin metal rod is used for measuring the sheet resistance, the distance between the metal rod and each semiconductor is different due to the influence of many factors such as the manufacturing error and the installation error of the semiconductor, when the tip of the metal rod is pressed on the semiconductor, the contact is poor due to too small pressure, the measurement value is inaccurate, and the semiconductor is damaged due to too large pressure, so that the measurement work is influenced to a certain extent.

In order to achieve the above purpose, the present application provides the following technical solutions: a supporting structure for semiconductor detection comprises a bottom plate, wherein a fixed disc is installed on the top side of the bottom plate through a plurality of first telescopic rods, a plurality of sliding holes are formed in the fixed disc, ejection units are installed in the sliding holes in a sliding mode, the top sides of the ejection units are located on the same plane, a positioning rod is installed on the top side of the fixed disc through an adjusting mechanism, a plurality of material moving rods are installed on the top side of the fixed disc through a lifting mechanism, and the positioning rod and the ejection rods are located in gaps among the ejection units; the bullet top unit includes the traveller, traveller slidable mounting correspond in the slide opening, the traveller with install elastic element between the fixed disk, the support column is installed to the top spiro union of traveller, fine-tuning is installed to the bottom of traveller, and is a plurality of the top side of support column all is equipped with fixed unit.

Further, through bottom plate fixed stay structure, the top of a plurality of bullet top units is located the coplanar and forms a supporting plane, a semiconductor for supporting and waiting to detect, the place height of fixed disk can be adjusted to first telescopic link, use with the semiconductor that adapts to different thickness, carry out semiconductor detection time measuring, fix a position the semiconductor through the locating lever, and make the pointed end of metal rod compress tightly the semiconductor, pressure transmits the traveller through the support column, set up suitable elasticity value to the elastic element, when pressure is too big, the elasticity that the elastic element was overcome to the traveller slides down, make the distance increase of semiconductor and the pointed end of metal rod, reduce the pressure that the metal rod produced to the semiconductor, thereby protect the semiconductor, avoid impaired, support column and traveller threaded connection, be convenient for carry out quick dismouting to the support column, be convenient for maintain or change.

Preferably, the adjusting mechanism comprises a sliding block, a guide rail is installed on the top side of the fixed disc, the guide rail is located on a straight line where the radius of the fixed disc is located, the sliding block is installed on the guide rail in a sliding mode, the positioning rod is installed on the top side of the sliding block, and an operation unit enabling the sliding block to slide is installed on the sliding block.

Furthermore, the sliding block is moved through the operation unit, slides on the guide rail along the radial direction, and drives the positioning rod to move, so that the distance between the positioning rod and the center of the fixed disc is adjusted, the semiconductor positioning device is suitable for semiconductors of different sizes, and rapid positioning is carried out.

Preferably, the operation unit includes accommodate the lead screw, the guide rail is close to the one end in the fixed disk centre of a circle installs the fixed block, accommodate the lead screw one end is rotated and is installed one side of fixed block, and operating handle is installed to the other end, set up threaded hole on the slider, accommodate the lead screw with the threaded hole phase-match.

Furthermore, the adjusting screw rod is rotated on the fixed block through the operating handle, and in the rotating process, the adjusting screw rod drives the sliding block to slide so as to adjust the position.

Preferably, the lifting mechanism comprises a second telescopic rod, the bottom end of the second telescopic rod is installed on the top side of the fixed disc, one side of the material moving rod is installed on the top end of the second telescopic rod through a driving unit, and a friction layer is installed on the top side of the material moving rod.

Further, through the adjustable height that moves the place of material pole of the lift of second telescopic link, when carrying out normal detection, move material pole and semiconductor phase separation, detect the completion back, move the material pole and rise and with the semiconductor contact, under drive unit's effect, move the material pole and move to one side, drive the semiconductor and move to one side, the frictional layer can be made for the rubber material, can increase the frictional force that moves between material pole and the semiconductor, the semiconductor of being convenient for removes, is convenient for get into next process.

Preferably, the drive unit includes the motor, it all rotates through the pivot to be located both ends position department and installs the connecting rod to move one side of material pole, one of them the one end of connecting rod cup joints to be installed on the output shaft of motor, another the one end of connecting rod is rotated and is installed the fixing base, the fixing base with the bottom of motor is all installed and is corresponded the top side of second telescopic link.

Furthermore, the connecting rods are fixedly connected with an output shaft of the motor, the motor rotates to drive the connecting rods to rotate, the two connecting rods, the material moving rod and the fixed disc form a four-bar mechanism, one of the connecting rods rotates to drive the material moving rod to rotate in a reciprocating mode, the connecting rods are in contact with the semiconductor in the rotating process, and the semiconductor is moved to one side along the trend.

Preferably, the elastic unit comprises a spring, the spring is sleeved on the sliding column, a flange ring is installed on the outer side wall of the sliding column, one end of the spring is installed on the bottom side of the flange ring, and the other end of the spring is hidden on the top side of the fixed disc.

Further, through the setting of spring, when the spring received pressure, the spring shrink, and the traveller moves down, and when pressure reduced, the spring resets, makes the traveller reset.

Preferably, a plurality of sliding sleeves are installed on the bottom side of the fixed disc, the sliding sleeves correspond to the sliding holes one by one, and the outer side wall of the sliding column is matched with the inner side wall of the sliding sleeve.

Further, through the setting of sliding sleeve, the effective sliding contact face of the lateral wall of traveller increases, makes the gliding more stable of traveller, prevents that the traveller from taking place to deflect when sliding and causing the jamming, and it can influence the pressure that the metal rod point end produced the semiconductor not smoothly to slide.

Preferably, the fine adjustment mechanism comprises a nut, a thread section is installed at the bottom end of the sliding column and penetrates through the sliding sleeve, the nut is installed on the thread section in a threaded manner, and the top side of the nut is matched with the bottom side of the sliding sleeve.

Furthermore, partial length of the threaded section is located in the sliding sleeve, the protruding length of the threaded section is changed by rotating the nut, and then the distance between the supporting column and the fixed disc is adjusted, so that the position of the top end of the supporting column is finely adjusted, and the top ends of the supporting columns are aligned.

Preferably, the fixing unit comprises a base, the base is installed on the top side of the supporting column, the base, the supporting column, the thread section and the sliding column are all provided with center holes which are communicated with each other, the bottom end of the thread section is communicated with an air bag through a flexible air guide unit, and the bottom side of the air bag is communicated with an exhaust tube.

Further, the base is used for supporting the semiconductor, the top surface of the base is attached to the bottom surface of the semiconductor, the air bag is pumped through the exhaust tube, negative pressure is formed in the air bag, and therefore the center hole in the base forms adsorption force on the semiconductor through the negative pressure, and the semiconductor and the base are kept together more stably.

Preferably, the flexible air guide unit comprises a hose, one end of the hose is connected to the bottom end of the threaded section and communicated with the corresponding central hole, and the bottom end of the hose is communicated with the air bag.

Furthermore, through the setting of hose, when the traveller moves down, the hose takes place to warp, makes the screw thread section can automatic downstream to prevent that the hose from withstanding the screw thread section, stopping the traveller and sliding down, cause the semiconductor to receive the too big damage that causes of pressure.

In conclusion, the technical effects and advantages of the invention are as follows:

1. according to the semiconductor detection device, the top parts of the ejection units are located on the same plane to form a supporting plane for supporting a semiconductor to be detected, when the semiconductor is detected, the tip end of the metal rod tightly presses the semiconductor, pressure is transmitted to the sliding column through the supporting column, a proper elastic force value is set for the elastic unit, and when the pressure is too large, the sliding column overcomes the elastic force of the elastic unit to slide downwards, so that the distance between the semiconductor and the tip end of the metal rod is increased, the pressure of the metal rod on the semiconductor is reduced, the semiconductor is protected, and the semiconductor is prevented from being damaged.

2. In the invention, the adjusting screw rod is rotated on the fixed block through the operating handle, the adjusting screw rod drives the sliding block to slide in the rotating process, the sliding block slides on the guide rail along the radial direction to drive the positioning rod to move, so that the distance between the positioning rod and the center of the fixed disc is adjusted to adapt to semiconductors of different sizes, and the semiconductors are quickly positioned.

3. According to the semiconductor detection device, the height of the material moving rod can be adjusted through the lifting of the second telescopic rod, the material moving rod is separated from a semiconductor during normal detection, the material moving rod is lifted and is in contact with the semiconductor after detection is finished, the material moving rod moves to one side under the action of the driving unit to drive the semiconductor to move to one side, the friction layer can be made of rubber, the friction force between the material moving rod and the semiconductor can be increased, the semiconductor can be moved conveniently, and the next process can be conveniently carried out.

4. According to the invention, through the arrangement of the sliding sleeve, the effective sliding contact surface of the outer side wall of the sliding column is increased, so that the sliding of the sliding column is more stable, the sliding of the sliding column is prevented from being blocked due to deflection when the sliding column slides, the pressure of the tip of the metal rod on a semiconductor is influenced due to unsmooth sliding, the nut is rotated, the protruding length of the thread section is changed, the distance between the supporting column and the fixed disc is further adjusted, the position of the top end of the supporting column is finely adjusted, and the top ends of the supporting columns are aligned.

5. According to the semiconductor device, the top surface of the base is attached to the bottom surface of the semiconductor, the air bag is exhausted through the exhaust pipe, negative pressure is formed in the air bag, so that the central hole in the base forms adsorption force on the semiconductor through the negative pressure, the semiconductor and the base are kept together more stably, when the sliding column moves downwards, the hose deforms, the threaded section can automatically move downwards, and therefore the hose is prevented from propping against the threaded section, the sliding column is prevented from sliding downwards, and the semiconductor is damaged due to overlarge pressure.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a top view of the present invention;

FIG. 3 is a cross-sectional view of the present invention;

FIG. 4 is a schematic partial perspective view of a lead screw region of the present invention;

FIG. 5 is a schematic view of a partial three-dimensional structure of a material moving rod region according to the present invention;

FIG. 6 is a partial cutaway view of the material transfer bar area of the present invention;

FIG. 7 is a schematic perspective view of the pop-up unit of the present invention;

fig. 8 is a perspective view illustrating a structure of a pop-up unit in accordance with the present invention.

In the figure: 1. a base plate; 2. a first telescopic rod; 3. fixing the disc; 4. a support pillar; 5. an air bag; 6. positioning a rod; 7. a friction layer; 8. a base; 9. adjusting the screw rod; 10. an exhaust pipe; 11. a hose; 12. a sliding sleeve; 13. a traveler; 14. a spring; 15. a slider; 16. a guide rail; 17. a fixed block; 18. an operating handle; 19. a second telescopic rod; 20. a fixed seat; 21. a material moving rod; 22. a motor; 23. a rotating shaft; 24. a connecting rod; 25. a slide hole; 26. a flange ring; 27. a nut; 28. a threaded segment; 29. a central bore.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example (b): referring to fig. 1-8, a supporting structure for semiconductor inspection is shown, which includes a bottom plate 1, a fixed plate 3 is installed on a top side of the bottom plate 1 through a plurality of first telescopic rods 2, a plurality of sliding holes 25 are formed in the fixed plate 3, ejection units are installed in the plurality of sliding holes 25 in a sliding manner, top sides of the plurality of ejection units are located on the same plane, a positioning rod 6 is installed on the top side of the fixed plate 3 through an adjusting mechanism, a plurality of material moving rods 21 are installed on the top side of the fixed plate 3 through a lifting mechanism, and the positioning rod 6 and the plurality of material moving rods 21 are located at gaps of the plurality of ejection units; the ejection unit comprises a sliding column 13, the sliding column 13 is slidably mounted in a corresponding sliding hole 25, an elastic unit is mounted between the sliding column 13 and the fixed disc 3, the supporting columns 4 are mounted at the top ends of the sliding column 13 in a threaded manner, the fine adjustment mechanism is mounted at the bottom ends of the sliding column 13, and the top sides of the supporting columns 4 are respectively provided with a fixing unit.

Based on the above mechanism, the supporting structure is fixed by the bottom plate 1, the tops of a plurality of ejection units are positioned on the same plane to form a supporting plane, used for supporting the semiconductor to be detected, the first telescopic rod 2 can adjust the height of the fixed disc 3 to adapt to the use of semiconductors with different thicknesses, the semiconductor is positioned by the positioning rod 6, the tip end of the metal rod is pressed tightly against the semiconductor, the pressure is transmitted to the sliding column 13 through the supporting column 4, the elastic unit is set with proper elastic value, when the pressure is too large, the sliding column 13 overcomes the elastic force of the elastic unit to slide downwards, the distance between the semiconductor and the tip of the metal rod is increased, the pressure generated by the metal rod to the semiconductor is reduced, thereby protect the semiconductor, avoid impaired, support column 4 and traveller 13 screwed connection are convenient for carry out quick assembly disassembly to support column 4, are convenient for maintain or change.

As shown in fig. 4, the adjusting mechanism includes a sliding block 15, a guide rail 16 is installed on the top side of the fixed disk 3, the guide rail 16 is located on a straight line where the radius of the fixed disk 3 is located, the sliding block 15 is slidably installed on the guide rail 16, the positioning rod 6 is installed on the top side of the sliding block 15, and an operation unit for sliding the sliding block 15 is installed on the sliding block 15.

The operating unit moves the sliding block 15, and the sliding block 15 slides on the guide rail 16 along the radial direction to drive the positioning rod 6 to move, so that the distance between the positioning rod 6 and the center of the fixed disc 3 is adjusted to adapt to semiconductors of different sizes and perform quick positioning.

As shown in fig. 4, the operation unit includes an adjusting screw 9, a fixing block 17 is installed at one end of the guide rail 16 close to the center of the fixed disk 3, one end of the adjusting screw 9 is rotatably installed at one side of the fixing block 17, an operation handle 18 is installed at the other end, a threaded hole is formed in the slider 15, and the adjusting screw 9 is matched with the threaded hole.

The adjusting screw rod 9 is rotated on the fixed block 17 through the operating handle 18, and in the rotating process, the adjusting screw rod 9 drives the sliding block 15 to slide so as to adjust the position.

As shown in fig. 5 and 6, the lifting mechanism comprises a second telescopic rod 19, the bottom end of the second telescopic rod 19 is installed on the top side of the fixed tray 3, one side of the material moving rod 21 is installed on the top end of the second telescopic rod 19 through the driving unit, and the top side of the material moving rod 21 is installed with the friction layer 7.

Through the adjustable height that moves the position of material pole 21 of the lift of second telescopic link 19, when carrying out normal detection, move material pole 21 and semiconductor phase separation, detect the completion back, move material pole 21 and rise and with the semiconductor contact, under drive unit's effect, move material pole 21 to one side removal, drive the semiconductor and move to one side, frictional layer 7 can be made for the rubber material, can increase the frictional force that moves between material pole 21 and the semiconductor, the semiconductor of being convenient for removes, be convenient for get into next process.

As shown in fig. 5, the driving unit includes a motor 22, two connecting rods 24 are rotatably mounted at positions at two ends of one side of the material moving rod 21 through a rotating shaft 23, one end of one of the connecting rods 24 is sleeved and mounted on an output shaft of the motor 22, one end of the other connecting rod 24 is rotatably mounted with a fixing seat 20, and the bottom ends of the fixing seat 20 and the motor 22 are mounted on the top side of the corresponding second telescopic rod 19.

The connecting rods 24 are fixedly connected with an output shaft of the motor 22, the motor 22 rotates to drive the connecting rods 24 to rotate, the two connecting rods 24, the material moving rod 21 and the fixed disc 3 form a four-bar mechanism, one of the connecting rods 24 rotates to drive the material moving rod 21 to rotate in a reciprocating mode, the connecting rods contact with a semiconductor in the rotating process, and the semiconductor moves to one side along the trend.

As shown in fig. 3, 7 and 8, the elastic unit comprises a spring 14, the spring 14 is sleeved on the sliding column 13, a flange ring 26 is installed on the outer side wall of the sliding column 13, one end of the spring 14 is installed on the bottom side of the flange ring 26, and the other end is hidden and rotated on the top side of the fixed disk 3.

By the arrangement of the spring 14, when the spring 14 is under pressure, the spring 14 contracts and the spool 13 moves downward, and when the pressure is reduced, the spring 14 is reset to reset the spool 13.

As shown in fig. 3, 7 and 8, a plurality of sliding sleeves 12 are installed on the bottom side of the fixed tray 3, the sliding sleeves 12 correspond to the sliding holes 25 one by one, and the outer side wall of the sliding column 13 is matched with the inner side wall of the sliding sleeve 12.

Through the setting of sliding sleeve 12, the effective sliding contact face of the lateral wall of traveller 13 increases, makes the gliding more stable of traveller 13, prevents that the traveller 13 from taking place to deflect when sliding and causing the jamming, and the slip is not smooth can influence the pressure that the metal rod point end produced the semiconductor.

As shown in fig. 7 and 8, the fine adjustment mechanism comprises a nut 27, a threaded section 28 is installed at the bottom end of the sliding column 13, the threaded section 28 penetrates through the sliding sleeve 12, the nut 27 is installed on the threaded section 28 in a threaded manner, the top side of the nut 27 is matched with the bottom side of the sliding sleeve 12, and the threaded section 28 is partially located in the sliding sleeve 12.

By rotating the nut 27, the protruding length of the threaded section 28 is changed, and the distance from the supporting column 4 to the fixed disk 3 is adjusted, so that the position of the top end of the supporting column 4 is finely adjusted, and the top ends of the supporting columns 4 are aligned.

As shown in fig. 3 and 8, the fixing unit includes a base 8, the base 8 is installed on the top side of the supporting column 4, the base 8, the supporting column 4, the threaded section 28 and the sliding column 13 are all provided with center holes 29 which are communicated with each other, the bottom end of the threaded section 28 is communicated with the air bag 5 through a flexible air guide unit, the bottom side of the air bag 5 is communicated with the air exhaust pipe 10, the base 8 is used for supporting a semiconductor, and the top surface of the base 8 is attached to the bottom surface of the semiconductor.

When the air bag 5 is evacuated through the evacuation tube 10, negative pressure is formed in the air bag 5, so that the central hole 29 in the base 8 exerts an adsorption force on the semiconductor by the negative pressure, and the semiconductor and the base 8 are more stably held together.

As shown in fig. 3 and 7, the flexible air guide unit includes a hose 11, one end of the hose 11 is connected to the bottom end of the threaded section 28 and communicates with the corresponding central hole 29, and the bottom end of the hose 11 communicates with the airbag 5.

Through the arrangement of the hose 11, when the sliding column 13 moves downwards, the hose 11 deforms, so that the threaded section 28 can automatically move downwards, the hose 11 is prevented from abutting against the threaded section 28, the sliding column 13 is prevented from sliding downwards, and the semiconductor is damaged due to overlarge pressure.

The working principle of the invention is as follows:

the supporting structure is fixed through the bottom plate 1, the tops of the plurality of ejection units are located on the same plane to form a supporting plane for supporting a semiconductor to be detected, the first telescopic rod 2 can adjust the height of the fixed disc 3 to adapt to the use of semiconductors with different thicknesses, when the semiconductor detection is carried out, the semiconductor is positioned through the positioning rod 6, the tip of the metal rod is enabled to tightly press the semiconductor, the pressure is transmitted to the sliding column 13 through the supporting column 4, the elastic unit is set with a proper elastic force value, when the pressure is too large, the sliding column 13 overcomes the elastic force of the elastic unit to slide downwards, the distance between the semiconductor and the tip of the metal rod is increased, the pressure generated by the metal rod on the semiconductor is reduced, the semiconductor is protected and prevented from being damaged, the supporting column 4 is in threaded connection with the sliding column 13, the supporting column 4 is convenient to be quickly disassembled and assembled, and maintained or replaced; the height of the material moving rod 21 can be adjusted through the lifting of the second telescopic rod 19, when normal detection is carried out, the material moving rod 21 is separated from a semiconductor, after the detection is finished, the material moving rod 21 is lifted and is in contact with the semiconductor, the motor 22 rotates to drive the connecting rods 24 to rotate, the two connecting rods 24, the material moving rod 21 and the fixed disk 3 form a four-bar mechanism, one of the connecting rods 24 rotates to drive the material moving rod 21 to rotate in a reciprocating mode, the material moving rod is in contact with the semiconductor in the rotating process, the semiconductor is moved to one side along the trend, the friction layer 7 can be made of rubber materials, the friction force between the material moving rod 21 and the semiconductor can be increased, the semiconductor can be moved conveniently, and the next procedure can be conveniently carried out.

The adjusting screw rod 9 is rotated on the fixed block 17 through the operating handle 18, in the rotating process, the adjusting screw rod 9 drives the sliding block 15 to slide, the sliding block 15 slides on the guide rail 16 along the radial direction to drive the positioning rod 6 to move, so that the distance between the positioning rod 6 and the circle center of the fixed disc 3 is adjusted to adapt to semiconductors of different sizes, the rapid positioning is carried out, through the arrangement of the sliding sleeve 12, the effective sliding contact surface of the outer side wall of the sliding column 13 is increased, the sliding of the sliding column 13 is more stable, the sliding column 13 is prevented from deflecting to cause clamping stagnation when sliding, the pressure of the tip of the metal rod on the semiconductor can be influenced due to unsmooth sliding, the protruding length of the threaded section 28 is changed through the rotating nut 27, the distance between the supporting column 4 and the fixed disc 3 is further adjusted, the position of the top end of the supporting column 4 is finely adjusted, the top ends of the supporting columns 4 are leveled, the top surface of the base 8 is attached to the bottom surface of the semiconductor, the air bag 5 is pumped through the air pumping pipe 10, negative pressure is formed in the air bag 5, so that the central hole 29 in the base 8 forms adsorption force on a semiconductor through the negative pressure, the semiconductor and the base 8 are kept together more stably, the hose 11 is arranged, when the sliding column 13 moves downwards, the hose 11 deforms, the threaded section 28 can automatically move downwards, the hose 11 is prevented from propping against the threaded section 28, the sliding column 13 is prevented from sliding downwards, and the semiconductor is damaged due to overlarge pressure.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. A supporting structure for semiconductor detection comprises a bottom plate (1), and is characterized in that: the top side of the bottom plate (1) is provided with a fixed plate (3) through a plurality of first telescopic rods (2), the fixed plate (3) is provided with a plurality of sliding holes (25), ejection units are slidably arranged in the sliding holes (25), the top sides of the ejection units are located on the same plane, the top side of the fixed plate (3) is provided with a positioning rod (6) through an adjusting mechanism, the top side of the fixed plate (3) is provided with a plurality of material moving rods (21) through a lifting mechanism, and the positioning rod (6) and the material moving rods (21) are located in gaps of the ejection units; the bullet top unit includes traveller (13), traveller (13) slidable mounting correspond in slide opening (25), traveller (13) with install the elastic component between fixed disk (3), support column (4) are installed to the top spiro union of traveller (13), fine-tuning is installed to the bottom of traveller (13), and is a plurality of the top side of support column (4) all is equipped with fixed unit.

2. The support structure for semiconductor inspection according to claim 1, wherein: adjustment mechanism includes slider (15), guide rail (16) are installed to the top side of fixed disk (3), guide rail (16) are located on the straight line at fixed disk (3) radius place, slider (15) slidable mounting be in on guide rail (16), locating lever (6) are installed the top side of slider (15), install on slider (15) and make slider (15) gliding operating unit.

3. The support structure for semiconductor inspection according to claim 2, wherein: the operation unit includes accommodate the lead screw (9), guide rail (16) are close to fixed disk (3) one end in the centre of a circle installs fixed block (17), the one end of accommodate the lead screw (9) is rotated and is installed one side of fixed block (17), and operating handle (18) are installed to the other end, set up threaded hole on slider (15), accommodate the lead screw (9) with the screw hole phase-match.

4. The support structure for semiconductor inspection according to claim 1, wherein: elevating system includes second telescopic link (19), install the bottom of second telescopic link (19) the top side of fixed disk (3), it installs through drive unit to move one side of material pole (21) the top of second telescopic link (19), move the top side of material pole (21) and install frictional layer (7).

5. The support structure for semiconductor inspection according to claim 4, wherein: the drive unit includes motor (22), it all rotates through pivot (23) to be located both ends position department and installs connecting rod (24) to move one side of material pole (21), one of them the one end of connecting rod (24) is cup jointed to be installed on the output shaft of motor (22), another the one end of connecting rod (24) is rotated and is installed fixing base (20), fixing base (20) with the bottom of motor (22) is all installed and is corresponded the top side of second telescopic link (19).

6. The support structure for semiconductor inspection according to claim 1, wherein: the elastic unit comprises a spring (14), the spring (14) is installed on the sliding column (13) in a sleeved mode, a flange ring (26) is installed on the outer side wall of the sliding column (13), one end of the spring (14) is installed on the bottom side of the flange ring (26), and the other end of the spring is hidden and rotated on the top side of the fixed disc (3).

7. The support structure for semiconductor inspection according to claim 1, wherein: a plurality of sliding sleeves (12) are installed on the bottom side of the fixed disc (3), the sliding sleeves (12) correspond to the sliding holes (25) in a one-to-one mode, and the outer side wall of the sliding column (13) is matched with the inner side wall of the sliding sleeves (12).

8. The supporting structure for semiconductor inspection according to claim 7, wherein: the fine adjustment mechanism comprises a nut (27), a thread section (28) is installed at the bottom end of the sliding column (13), the thread section (28) penetrates through the sliding sleeve (12), the nut (27) is installed on the thread section (28) in a threaded mode, and the top side of the nut (27) is matched with the bottom side of the sliding sleeve (12).

9. The support structure for semiconductor inspection according to claim 1, wherein: the fixing unit comprises a base (8), the base (8) is installed on the top side of the supporting column (4), center holes (29) which are communicated with each other are formed in the base (8), the supporting column (4), the thread section (28) and the sliding column (13), the bottom end of the thread section (28) is communicated with the air bag (5) through the flexible air guide unit, and the bottom side of the air bag (5) is communicated with the air exhaust pipe (10).

10. The supporting structure for semiconductor inspection according to claim 9, wherein: the flexible air guide unit comprises a hose (11), one end of the hose (11) is connected to the bottom end of the threaded section (28) and communicated with the corresponding central hole (29), and the bottom end of the hose (11) is communicated with the air bag (5).