CN117373935A - Packaging method and packaging body - Google Patents
Packaging method and packaging body Download PDFInfo
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- CN117373935A CN117373935A CN202311426675.8A CN202311426675A CN117373935A CN 117373935 A CN117373935 A CN 117373935A CN 202311426675 A CN202311426675 A CN 202311426675A CN 117373935 A CN117373935 A CN 117373935A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 74
- 238000000034 method Methods 0.000 title claims abstract description 45
- 239000002184 metal Substances 0.000 claims abstract description 131
- 229910052751 metal Inorganic materials 0.000 claims abstract description 131
- 239000000853 adhesive Substances 0.000 claims abstract description 58
- 230000001070 adhesive effect Effects 0.000 claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 238000004519 manufacturing process Methods 0.000 claims abstract description 34
- 238000001465 metallisation Methods 0.000 claims abstract description 23
- 239000004033 plastic Substances 0.000 claims description 48
- 229920003023 plastic Polymers 0.000 claims description 48
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 238000009713 electroplating Methods 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 8
- 230000008021 deposition Effects 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 5
- 230000008054 signal transmission Effects 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 238000005538 encapsulation Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 4
- 238000003475 lamination Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- GSDQYSSLIKJJOG-UHFFFAOYSA-N 4-chloro-2-(3-chloroanilino)benzoic acid Chemical compound OC(=O)C1=CC=C(Cl)C=C1NC1=CC=CC(Cl)=C1 GSDQYSSLIKJJOG-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
- H01L23/5283—Cross-sectional geometry
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The application discloses a packaging method and a packaging body, comprising the following steps: manufacturing a frame, respectively positioning a first component and a second component in a first accommodating groove and a second accommodating groove through an adhesive plate, and removing the adhesive plate; wherein, a first metal layer is formed on one surface of the adhesive plate; manufacturing a first metalized hole and a second metalized hole; and forming a second metal layer on one surface of the first metallization hole, wherein the pin on the first surface of the first component and the pin on the second surface of the second component opposite to the first surface are conducted through the first metallization hole, the second metal layer, the second metallization hole and the conductive substrate. Compared with the traditional lead interconnection scheme, the electric appliance connection path is shorter, the signal transmission efficiency is improved, the internal resistance is smaller, and the heat dissipation of packaged products is facilitated; on the other hand, the components do not need to be mounted through the conductive base island during packaging, so that the size limitation of the base island is avoided, and the packaging of the large-size components can be compatible.
Description
Technical Field
The present disclosure relates to the field of device packaging technology, and in particular, to a packaging method and a package.
Background
Packaging means that a plurality of components which are electrically connected with each other are packaged together through a plastic package layer, and circuit pins are led out of the plastic package layer so as to be connected with other devices. The package plays roles in mounting, fixing, sealing, protecting components, enhancing electrothermal performance and the like.
The electrical connection of components in the package body can influence the signal transmission efficiency of the packaged product, the electrical connection can also influence the internal resistance of the packaged product, and the larger the internal resistance is, the more serious the heating of the packaged product is, so that the heat dissipation of the packaged product is not facilitated; on the other hand, the existing package needs to mount the components on the conductive base island, is limited by the size of the conductive base island, and is difficult to be compatible with the package of the components with large size.
Therefore, the electrical connection of components in the packaged product is improved, so that the packaged product has higher signal transmission efficiency, reduces the internal resistance of the package, can be compatible with the package of the components with large size, and is a development trend of the packaged product.
Disclosure of Invention
The technical problem that this application mainly solves is to provide a packaging method and encapsulation body to improve the signal transmission efficiency of encapsulation product, reduce its encapsulation internal resistance, can compatible large-scale components and parts's encapsulation simultaneously.
In order to solve the above technical problems, a first technical solution adopted in the present application is to provide a packaging method and a packaging body, where the packaging method includes: manufacturing a frame, wherein the frame comprises a conductive substrate and an adhesive plate which can be peeled and laminated, and at least a first accommodating groove and a second accommodating groove are formed in the conductive substrate; acquiring at least a first component and a second component, and respectively positioning the first component and the second component in the first accommodating groove and the second accommodating groove through an adhesive carrier plate; performing plastic packaging treatment to form a plastic packaging body so as to fix the first component and the second component, and removing the adhesive plate; wherein, a first metal layer is formed on one surface of the adhesive plate; manufacturing a first metallization hole on the plastic package body corresponding to the pin area of the first component and the pin area of the second component, and manufacturing a second metallization hole on the conductive substrate area between the first component and the second component; and forming a second metal layer on one surface of the first metallized hole, wherein the pin on the first surface of the first component and the pin on the second surface of the second component opposite to the first surface are conducted through the first metallized hole, the second metal layer, the second metallized hole and the conductive substrate.
In one possible embodiment, the step of fabricating the frame specifically includes: the conductive substrate is a metal plate, at least a first through groove and a second through groove are formed in the metal plate, and an adhesive plate is adhered to one surface of the metal plate; or, the conductive substrate is a double-sided copper-clad plate, at least the first through groove and the second through groove are formed in the double-sided copper-clad plate, and the first through groove and the second through groove are subjected to groove wall metallization treatment so as to conduct copper layers on two sides of the double-sided copper-clad plate, and an adhesive plate is adhered to one side of the double-sided copper-clad plate.
In one possible implementation manner, the step of removing the adhesive plate has a first metal layer formed on one surface thereof, specifically including: one surface of the obtained first component and one surface of the second component are manufactured with metal media, and one surface of the metal media of the first component and one surface of the metal media of the second component are positioned in a groove; after the adhesive plate is removed, the metal medium forms the first metal layer; or the first component and the second component are directly positioned in the groove, and after the adhesive plate is removed, a pattern is formed on one surface of the adhesive plate to form the first metal layer.
In one possible implementation manner, the step of the plastic packaging treatment specifically includes: and plastic packaging is carried out on one surface of the frame, and the plastic packaging body fills the first accommodating groove and the second accommodating groove and covers one surface of the frame, which is opposite to the adhesive plate.
In one possible embodiment, the steps of making the first metallized hole, making the second metallized hole and forming the second metal layer specifically include: manufacturing a first blind hole corresponding to a pin area of the first component and a pin area of the second component on the plastic package body on one surface, which is opposite to the first metal layer, and manufacturing a second blind hole in the conductive substrate area between the first component and the second component; and carrying out copper deposition and electroplating treatment to metalize the first blind holes and the second blind holes and form the second metal layer.
In one possible implementation manner, the step of the plastic packaging treatment specifically includes: and filling the first accommodating groove and the second accommodating groove with the plastic package body and covering two sides of the frame. In one possible embodiment, the steps of making the first metallized hole, making the second metallized hole and forming the second metal layer specifically include: respectively manufacturing first blind holes on the plastic package body positioned on two sides of the frame and corresponding to the pin areas of the first component and the second component, and manufacturing second blind holes on two sides of the conductive substrate area between the first component and the second component; and carrying out copper deposition and electroplating treatment to metalize the first blind holes and the second blind holes, and forming the second metal layer on both sides of the frame.
In one possible embodiment, the method further comprises: and manufacturing a solder mask layer on one surface of the second metal layer.
In one possible implementation manner, the first accommodating grooves and the second accommodating grooves are formed into a plurality of groups, and each group of the first accommodating grooves and the second accommodating grooves are adjacently arranged; the packaging method further comprises the following steps: and cutting the plate to obtain single packaged products, wherein the first component and the second component are packaged in each packaged product.
In order to solve the above technical problems, a second technical solution adopted in the present application is to provide a package body, which is manufactured by the above-described packaging method.
The beneficial effects of this application are: unlike the prior art, the application provides a packaging method and a packaging body, wherein the packaging method comprises the following steps: manufacturing a frame, wherein the frame comprises a conductive substrate and adhesive plates which are arranged in a strippable lamination manner, and at least a first accommodating groove and a second accommodating groove are formed in the conductive substrate; acquiring at least a first component and a second component, respectively positioning the first component and the second component in a first accommodating groove and a second accommodating groove through an adhesive carrier plate, performing plastic packaging treatment to form a plastic package body, and removing the adhesive plate; wherein, a first metal layer is formed on one surface of the adhesive plate; manufacturing first metallized holes on the plastic package body corresponding to the pin areas of the first component and the second component, and manufacturing second metallized holes on the conductive substrate area between the first component and the second component; and forming a second metal layer on one surface of the first metallization hole, wherein the pin on the first surface of the first component and the pin on the second surface of the second component opposite to the first surface are conducted through the first metallization hole, the second metal layer, the second metallization hole and the conductive substrate. According to the packaging method, the conductive frame for positioning the components is used as a transmission medium, and the metal hole copper and the metal layer are formed to enable pins on two sides of the two components to be interconnected.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic flow chart of a first embodiment of the encapsulation method of the present application;
FIG. 2 is a schematic diagram of a half-bridge circuit corresponding to the packaging method of FIG. 1;
FIG. 3a is a schematic view of the structure of the S11 rear plate;
FIG. 3b is a schematic view of the structure of the S12 rear plate;
FIG. 3c is a schematic view of the structure of the S13 rear plate;
FIG. 3d is a schematic view of the structure of the S14 rear plate;
FIG. 3e is a schematic view of the structure of the S15 rear plate;
FIG. 3f is a schematic view of the S16 rear panel structure;
FIG. 4 is a schematic flow chart of a second embodiment of the encapsulation method of the present application;
FIG. 5a is a schematic view of the structure of the S21 rear plate;
FIG. 5b is a schematic view of the structure of the S22 rear panel;
FIG. 5c is a schematic view of the structure of the S23 rear plate;
FIG. 5d is a schematic view of the structure of the S24 rear plate;
FIG. 5e is a schematic view of the structure of the S25 rear panel;
FIG. 5f is a schematic view of the structure of the S26 rear panel;
wherein 110/210, a frame; 111/211, conductive substrate; 112/212, adhesive sheet; 121/221, first component; 122/222, a second component; 123/223, a metal medium; 131/231, plastic package; 141/241, a first metal layer; 142/242, a second metal layer; 151/251, first metallized holes; 152/252, second metallized holes; 132/232, solder mask; v, a fixed voltage source; out, output terminal.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
The terminology used in the embodiments of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, the "plurality" generally includes at least two, but does not exclude the case of at least one.
It should be understood that the term "and/or" as used herein is merely one relationship describing the association of the associated objects, meaning that there may be three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.
It should be understood that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.
Packaging products are continuously developed towards higher transmission efficiency and smaller internal packaging resistance, and the traditional packaging mode cannot meet the development requirements of higher transmission efficiency and smaller internal packaging resistance.
Based on the above problems, the application provides a packaging method and a packaging body, wherein metallized holes are manufactured in a frame area between components, pins on two sides of the components are interconnected by using the frame, the metallized holes and a metal layer, so that the signal transmission efficiency is improved, and the internal resistance of packaging is reduced.
The following describes a packaging method and a packaging body provided by the application in detail with reference to the drawings and embodiments.
The application provides a packaging method. Referring to fig. 1 to 2, fig. 1 is a schematic flow chart of a first embodiment of a packaging method of the present application; fig. 2 is a schematic diagram of a half-bridge circuit corresponding to the packaging method of fig. 1. In a specific embodiment, the packaging method of the present application includes:
s11: and manufacturing a frame, wherein the frame comprises a conductive substrate and an adhesive plate which is arranged in a strippable lamination manner, and at least a first accommodating groove and a second accommodating groove are formed in the conductive substrate.
Referring to fig. 3a in combination, fig. 3a is a schematic view of the structure of the S11 rear plate.
Specifically, the adhesive plate 112 is used for temporarily positioning and carrying components, the first accommodating groove and the second accommodating groove are specifically through grooves, and the first accommodating groove and the second accommodating groove can be formed by cutting with a milling cutter and forming with a laser grooving energy, which is not limited in particular. The number of the grooves is not particularly limited, in this embodiment, only two first accommodating grooves and two second accommodating grooves are schematically shown, and in some other embodiments, three, four, and other numbers of first accommodating grooves and second accommodating grooves can be formed on the conductive substrate 111, which is not particularly limited.
Further, the adhesive sheet 112 may be a sheet having an adhesive film such as a polyester film, a polyethylene film, or a polypropylene film attached to the surface thereof.
Further, in one embodiment, the step of fabricating the frame 110 includes: the conductive substrate 111 is a metal plate, at least a first through groove and a second through groove are formed on the metal plate, and an adhesive plate 112 is adhered to one surface of the metal plate. Wherein, the step of adhering the adhesive sheet 112 on one side of the metal sheet may include: the adhesive plate 112 is adhered to any surface of the metal plate, so that the adhesive plate 112 covers the opening of one surface of the first through groove and the opening of one surface of the second through groove, and the adhesive plate 112 can position the components in the groove.
In some other embodiments, the conductive substrate 111 can also be a double-sided copper-clad plate, and the step of fabricating the frame 110 can further include: and manufacturing a double-sided copper-clad plate, forming at least a first through groove and a second through groove on the double-sided copper-clad plate, carrying out groove wall metallization treatment on the first through groove and the second through groove to conduct copper layers on two sides of the double-sided copper-clad plate, and adhering an adhesive plate 112 on one side of the double-sided copper-clad plate. The dielectric layer can be obtained by manufacturing the double-sided copper-clad plate, and the copper layers are laminated on the two sides of the dielectric layer, or the copper layers are manufactured on the two sides of the dielectric layer through copper deposition and electroplating. The pins on different sides of the first component 121 and the second component 122 are further conducted by the conductive substrate 111 between the two components, so when the conductive substrate 111 is a double-sided copper-clad plate, after the first through groove and the second through groove are formed on the double-sided copper-clad plate, the first through groove and the second through groove are further required to be subjected to groove wall metallization, and the step of groove wall metallization can be copper deposition or electroplating, which is not particularly limited.
S12: and acquiring at least a first component and a second component, and respectively positioning the first component and the second component in the first accommodating groove and the second accommodating groove through the adhesive carrier plate.
Referring to fig. 3b in combination, fig. 3b is a schematic view of the structure of the S12 rear panel.
Specifically, the present embodiment is a package of a half-bridge circuit structure, and the first component 121 is specifically a first mos transistor, and the second component 122 is specifically a second mos transistor. The thickness of the conductive substrate 111 is designed to be at least 100 microns depending on the size of the mos transistor. Such as 100 microns, 110 microns, 130 microns, 150 microns, etc., without limitation in particular. In some other embodiments, the first component 121 and the second component 122 may be other components, and the thickness of the conductive substrate 111 may be adjusted according to the dimensions of the first component 121 and the second component 122, which is not limited in particular.
S13: performing plastic packaging treatment to form a plastic packaging body so as to fix the first component and the second component, and removing the adhesive plate; wherein, the first metal layer is formed on one surface of the adhesive removing plate.
Referring to fig. 3c in combination, fig. 3c is a schematic view of the structure of the S13 rear plate.
The plastic package material may include one or more of epoxy resin, polyimide, bismaleimide triazine and ceramic matrix. The specific material is not limited herein. The plastic package aims to fix the components in the groove and protect the components.
In this embodiment, S13 specifically includes: the plastic package is performed on one surface of the frame 110, and the plastic package body 131 fills the first accommodating groove and the second accommodating groove and covers one surface of the frame 110, which is opposite to the adhesive plate 112.
Wherein a first metal layer 141 is formed on one surface of the adhesive removing plate 112. The first metal layer 141 is used for leading out pins on one sides of the first component 121 and the second component 122. In this embodiment, the first component 121 and the second component 122 are directly positioned in the groove, and after the adhesive plate 112 is removed, a pattern is formed on one surface of the adhesive plate 112 to form the first metal layer 141. Specifically, the patterning step may be to compress the photosensitive film, expose the pattern, develop, and etch the pattern, and then electroplate the pattern to form the first metal layer 141.
In some other embodiments, the metal medium 123 is formed on one surface of the first component 121 and the second component 122 obtained in step S12, the metal medium 123 of the first component 121 and the second component 122 is positioned in the groove, and after the adhesive plate 112 is removed, the metal medium 123 forms the first metal layer 141. Specifically, in this embodiment, the metal medium 123 is manufactured on one surface of the first component 121 and the second component 122 in advance, so that after the first component 121 and the second component 122 are positioned in the grooves, the metal medium 123 directly forms the first metal layer 141 on one surface of the first component 121 and the second component 122 with the conductive substrate 111, and the first metal layer 141 is not required to be formed by performing pattern manufacturing after positioning the components, so that the step of pattern manufacturing is omitted, and the flow is simplified, wherein the metal medium 123 can be connected on one surface of the components through silver paste, conductive adhesive, and the like. In this embodiment, the first metal layer 141 does not need to be patterned on the first surface of the component, so in some embodiments, after the first surface of the first component 121 and the second surface of the second component 122 are positioned in the groove, the step of removing the adhesive plate 112 may be omitted, so that the adhesive plate 112 may support the packaged product and improve the strength.
On the other hand, in the present embodiment, the accommodating groove is formed on the frame 110, the component is positioned by using the accommodating groove, and the first metal layer is formed on one surface of the component, so that the limitation of the size of the base island to the size of the packaged component when the component is mounted by the base island is avoided, and the packaging method of the present embodiment can be compatible with the packaging of the large-size component.
S14: manufacturing first metallized holes on the plastic package body corresponding to the pin areas of the first component and the second component, and manufacturing second metallized holes on the conductive substrate area between the first component and the second component; and forming a second metal layer on one surface of the first metallization hole, wherein the pin on the first surface of the first component and the pin on the second surface of the second component opposite to the first surface are conducted through the first metallization hole, the second metal layer, the second metallization hole and the conductive substrate.
Referring to fig. 3d in combination, fig. 3d is a schematic view of the structure of the sheet material after S14.
The purpose of the first metallized hole 151 is to lead out the pins of the first component 121 and the second component 122 onto the second metal layer 142, and the purpose of the second metallized hole 152 is to conduct the second metal layer 142 with the conductive substrate 111, so that the pins on the first surface of the first component 121 and the pins on the second surface of the second component 122 opposite to the first surface can conduct through the first metal layer 141, the second metal layer 142, the second metallized hole 152 and the conductive substrate 111. Compared with the scheme of lead interconnection, the conduction mode has the advantages that the conduction path is shorter, so that the signal transmission efficiency can be improved, the conduction section of the metal layer, the metallization hole and the conductive substrate 111 is larger than that of lead connection, the resistance of the conduction path is smaller, the generated heat of the packaged product is smaller, and the heat dissipation of the packaged product is improved.
In the present embodiment, a first blind via is formed in the molding compound 131 on the surface facing away from the first metal layer 141 in correspondence with the pin regions of the first component 121 and the second component 122, and a second blind via is formed in the region of the conductive substrate 111 between the first component 121 and the second component 122. Copper deposition and electroplating are performed to metallize the first blind via and the second blind via, and form a second metal layer 142.
In this embodiment, the first component 121 and the second component 122 are specifically a first mos transistor and a second mos transistor, the first mos transistor forms a first switching circuit, the second mos transistor forms a second switching circuit, the first switching circuit Lu Chuanlian is connected in series to the second switching circuit, the other end of the second switching circuit is grounded, the source terminal of the first mos transistor is connected to the drain terminal of the second mos transistor to realize a first switching circuit Lu Chuanlian, and the source terminal of the first mos transistor and the drain terminal of the second mos transistor are also connected to the output terminal out of the half bridge circuit. In addition, one or more passive devices may be included in the half-bridge circuit, which in this embodiment also includes passive devices such as resistors, passive diodes. The first switch circuit and the second switch circuit are respectively provided with a waveform generator which plays a role in driving. The half-bridge circuit may be configured as a power converter, e.g., AC to AC, AC to DC, DC to DC. The power conversion is achieved by cycling the first switching circuit and the second switching circuit between on and off states. Wherein the waveform generator is configured to cycle the first switching circuit and the second switching circuit between on and off states.
S15: and manufacturing a solder mask layer on one side of the second metal layer.
Referring to fig. 3e in combination, fig. 3e is a schematic view of the structure of the rear plate in S15.
In this embodiment, the pins on both sides of the first component 121 and the second component 122 are led out to the first metal layer 141, the first metal layer 141 forms a pad layer, and the first metal layer 141 of the packaged product is connected to a load. The solder mask layer 132 serves as an insulating protection layer, and in some embodiments, a plastic sealing layer is formed on one side of the second metal layer 142 before the solder mask layer 132 is formed, so as to further serve as an insulating protection layer.
S16: and cutting the plate to obtain single packaged products, wherein the first component and the second component are packaged in each packaged product.
Referring to fig. 3f in combination, fig. 3f is a schematic view of the structure of the S16 rear panel.
Specifically, the conductive substrate 111 is provided with a plurality of first accommodating grooves and a plurality of second accommodating grooves, and the first components 121 and the second components 122 of the plurality of packaged products are packaged at the same time, so that after a motherboard plate is obtained, the plate is cut, and then a plurality of single packaged products can be obtained.
Compared with the prior art, the packaging method has the advantages that the conductive frame 110 for positioning the components is used as a transmission medium, and the metal hole copper and the metal layer are formed to enable pins on two sides of the two components to be interconnected. On the other hand, by forming a groove on the frame 110 to position the component, the problem that the size of the base island limits the packaging of the large-sized component when the base island is used to position the component is avoided.
Referring to fig. 4, fig. 4 is a flow chart of a second embodiment of the encapsulation method of the present application. In another embodiment, the packaging method of the present application includes:
s21: and manufacturing a frame, wherein the frame comprises a conductive substrate and an adhesive plate which is arranged in a strippable lamination manner, and at least a first accommodating groove and a second accommodating groove are formed in the conductive substrate.
In this step, please refer to S11, and details are not described here.
S22: and acquiring at least a first component and a second component, and respectively positioning the first component and the second component in the first accommodating groove and the second accommodating groove through the adhesive carrier plate.
Specifically, the present embodiment is a package of a half-bridge circuit structure, the first component 221 is specifically a first mos transistor, and the second component 222 is specifically a second mos transistor. The thickness of the conductive substrate 211 is designed to be at least 100 microns, depending on the size of the mos transistor. Such as 100 microns, 110 microns, 130 microns, 150 microns, etc., without limitation in particular. In some other embodiments, the first component 221 and the second component 222 may be other components, and the thickness of the conductive substrate 211 may be adjusted according to the dimensions of the first component 221 and the second component 222, which is not limited in particular.
S23: and performing plastic packaging, namely filling the plastic packaging body into the first accommodating groove and the second accommodating groove, covering the two sides of the frame, removing the adhesive plate during plastic packaging, and forming a first metal layer on one side of the adhesive plate.
Specifically, unlike the first embodiment, in this embodiment, during the plastic packaging, the adhesive plate 212 is removed at the same time, so that the plastic packaging body 231 fills the first accommodating groove and the second accommodating groove and covers both sides of the frame 210, and the purpose of this step is to form the plastic packaging body 231 on one side of the first metal layer 241 of the plate material, so that the metalized holes can be subsequently formed on one side of the first metal layer 241 to manufacture the second metal layer 242 on both sides of the plate material.
The plastic package material may include one or more of epoxy resins, polyimides, bismaleimide triazines and ceramic bases. The specific material is not limited herein. The plastic package aims to fix the components in the groove and protect the components.
In addition, in the present embodiment, the metal medium 223 is formed on one surface of the first component 221 and the second component 222, one surface of the metal medium 223 of the first component 221 and the second component 222 is positioned in the groove, the adhesive plate 212 is removed, the metal medium 223 forms the first metal layer 241, the plastic package 231 is formed, and the plastic package 231 covers the first metal layer 241 and the other surface of the plate. In other embodiments, the obtained first component 221 and second component 222 may not be formed with the metal medium 223, and after the first component 221 and second component 222 are directly positioned in the groove, the adhesive plate 212 is removed, and then a first metal layer 241 is formed by patterning on one surface of the adhesive plate 212. The patterning may be performed by pressing a photosensitive film, exposing the pattern, developing, etching, and then electroplating to form the first metal layer 241. After forming the first metal layer 241, plastic packaging is performed, so that the plastic package 231 covers the first metal layer 241 and a surface of the plate facing away from the first metal layer 241.
S24: respectively manufacturing first blind holes on the plastic package bodies positioned on two sides of the frame and corresponding to pin areas of the first component and the second component, and manufacturing second blind holes on two sides of a conductive substrate area between the first component and the second component; copper deposition and electroplating treatment are carried out to metalize the first blind hole and the second blind hole, and a second metal layer is formed on both sides of the frame; the pins on the first surface of the first component and the pins on the second surface of the second component opposite to the first surface are conducted through the first metallized holes, the second metal layer, the second metallized holes and the conductive substrate.
Unlike the first embodiment, in this embodiment, the molding body 231 covers two sides of the board, the molding body 231 fabricated on two sides of the component is fabricated with the first metallized holes 251, so that pins on two sides of the component are led out to the second metal layers 242 fabricated on two sides of the first component 221 and the second component 222, the purpose of fabricating the second metallized holes 252 on two sides is to make the two second metal layers 242 and the conductive substrate 211 conduct, so that pins on one side of the component back to the first metal layers 241 are led out to the second metal layers 242 fabricated on one side of the first metal layers 241 through the first metallized holes 251, the second metal layers 242, the second metallized holes 252 and the conductive substrate 211, the pins on two sides of the component are led out to the second metal layers 242 fabricated on one side of the first metal layers 241, unlike the first embodiment of the application, pins on two sides of the component are led out to the first metal layers 241, the first metal layers 241 are exposed bonding pads are connected to the first metal layers, the number of the bonding pads is not directly formed on one side of the first metal layers 242, and the number of bonding pads are not directly formed on the other than the first metal layers, the bonding pads are directly formed on two sides of the first metal layers 242, the bonding pads are not directly formed on the two sides of the first metal layers, and the bonding pads are directly formed on the two sides of the first metal layers, the bonding pads are directly formed on the first metal layers, and the bonding pads are not directly connected to the metal layers, and the bonding pads are directly formed, so as to meet the requirement of connecting pins on two sides of the component to the exposed bonding pad layer.
S25: and manufacturing a solder mask layer on the second metal layer on the surface opposite to the first metal layer.
Specifically, the second metal layer 242 is formed on both sides of the first component 221 and the second component 222, the second metal layer 242 facing the first metal layer 241 forms a pad layer, the second metal layer 242 facing away from the first metal layer 241 is used as an intermediate layer to lead out pins of the component, the solder mask layer 232 is formed on the second metal layer 242 serving as the intermediate layer to play a role in insulation protection, and in some embodiments, a plastic sealing layer is formed on one side of the second metal layer 242 before the solder mask layer 232 is formed to play a role in insulation protection.
S26: and cutting the plate to obtain single packaged products, wherein the first component and the second component are packaged in each packaged product.
Specifically, the conductive substrate 211 is provided with a plurality of first accommodating grooves and a plurality of second accommodating grooves, and the first components 221 and the second components 222 of the plurality of packaged products are packaged at the same time, so that after a motherboard plate is obtained, the plate is cut, and then a plurality of single packaged products can be obtained.
Compared with the traditional lead interconnection scheme, the electrical appliance connection path is shorter, the signal transmission efficiency is improved, the internal resistance is smaller, and the heat dissipation of the packaged product is facilitated.
Correspondingly, the application also provides a packaging body which is manufactured by packaging the packaging method described in any embodiment.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent principles of the present invention or direct or indirect application in other related arts are included in the scope of the present invention.
Claims (10)
1. A method of packaging, comprising:
manufacturing a frame, wherein the frame comprises a conductive substrate and an adhesive plate which can be peeled and laminated, and at least a first accommodating groove and a second accommodating groove are formed in the conductive substrate;
acquiring at least a first component and a second component, and respectively positioning the first component and the second component in the first accommodating groove and the second accommodating groove through an adhesive carrier plate;
performing plastic packaging treatment to form a plastic packaging body so as to fix the first component and the second component, and removing the adhesive plate; wherein, a first metal layer is formed on one surface of the adhesive plate;
manufacturing a first metallization hole on the plastic package body corresponding to the pin area of the first component and the pin area of the second component, and manufacturing a second metallization hole on the conductive substrate area between the first component and the second component; and forming a second metal layer on one surface of the first metallized hole, wherein the pin on the first surface of the first component and the pin on the second surface of the second component opposite to the first surface are conducted through the first metallized hole, the second metal layer, the second metallized hole and the conductive substrate.
2. The packaging method according to claim 1, wherein the step of fabricating the frame specifically comprises:
the conductive substrate is a metal plate, at least a first through groove and a second through groove are formed in the metal plate, and an adhesive plate is adhered to one surface of the metal plate;
or, the conductive substrate is a double-sided copper-clad plate, at least the first through groove and the second through groove are formed in the double-sided copper-clad plate, and the first through groove and the second through groove are subjected to groove wall metallization treatment so as to conduct copper layers on two sides of the double-sided copper-clad plate, and an adhesive plate is adhered to one side of the double-sided copper-clad plate.
3. The packaging method according to claim 1, wherein the step of removing the adhesive plate has a first metal layer formed on one side thereof, specifically comprising:
one surface of the obtained first component and one surface of the second component are manufactured with metal media, and one surface of the metal media of the first component and one surface of the metal media of the second component are positioned in a groove; after the adhesive plate is removed, the metal medium forms the first metal layer;
or the first component and the second component are directly positioned in the groove, and after the adhesive plate is removed, a pattern is formed on one surface of the adhesive plate to form the first metal layer.
4. The packaging method according to claim 1, wherein the step of plastic packaging treatment specifically comprises:
and plastic packaging is carried out on one surface of the frame, and the plastic packaging body fills the first accommodating groove and the second accommodating groove and covers one surface of the frame, which is opposite to the adhesive plate.
5. The method of claim 4, wherein the steps of forming a first metallization via, forming a second metallization via, and forming a second metal layer comprise:
manufacturing a first blind hole corresponding to a pin area of the first component and a pin area of the second component on the plastic package body on one surface, which is opposite to the first metal layer, and manufacturing a second blind hole in the conductive substrate area between the first component and the second component;
and carrying out copper deposition and electroplating treatment to metalize the first blind holes and the second blind holes and form the second metal layer.
6. The packaging method according to claim 1, wherein the step of plastic packaging treatment specifically comprises:
and filling the first accommodating groove and the second accommodating groove with the plastic package body and covering two sides of the frame.
7. The method of claim 6, wherein the steps of forming a first metallization via, forming a second metallization via, and forming a second metal layer comprise:
respectively manufacturing first blind holes on the plastic package body positioned on two sides of the frame and corresponding to the pin areas of the first component and the second component, and manufacturing second blind holes on two sides of the conductive substrate area between the first component and the second component;
and carrying out copper deposition and electroplating treatment to metalize the first blind holes and the second blind holes, and forming the second metal layer on both sides of the frame.
8. The packaging method of claim 1, further comprising:
and manufacturing a solder mask layer on one surface of the second metal layer.
9. The packaging method of claim 1, wherein the packaging method comprises the steps of,
the first accommodating grooves and the second accommodating grooves are formed into a plurality of groups, and each group of the first accommodating grooves and the second accommodating grooves are adjacently arranged;
the packaging method further comprises the following steps:
and cutting the plate to obtain single packaged products, wherein the first component and the second component are packaged in each packaged product.
10. A package, characterized in that it is manufactured by the packaging method according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311426675.8A CN117373935A (en) | 2023-10-30 | 2023-10-30 | Packaging method and packaging body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311426675.8A CN117373935A (en) | 2023-10-30 | 2023-10-30 | Packaging method and packaging body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117373935A true CN117373935A (en) | 2024-01-09 |
Family
ID=89394450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311426675.8A Pending CN117373935A (en) | 2023-10-30 | 2023-10-30 | Packaging method and packaging body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117373935A (en) |
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2023
- 2023-10-30 CN CN202311426675.8A patent/CN117373935A/en active Pending
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