CN116931695A - Computing equipment - Google Patents

Abstract

The embodiment of the application discloses a computing device. The computing equipment comprises a heat radiation assembly, wherein the heat radiation assembly comprises an air guide piece, a rear side air inlet and a front side air outlet, the air guide piece is arranged at the periphery of a rear device and is used for forming a backflow air channel of second heat radiation air flow flowing from back to front, and the air guide piece and the side wall of the case form a downstream air channel for the first heat radiation air flow to pass through; the rear side air inlet is communicated with the external environment of the case, and the front side air outlet is arranged on the body at the adjacent side of the air guide piece and the downstream air duct. The first cooling airflow generated by the starting of the first fan enters the downstream air duct with the small through flow cross section size, so that the airflow velocity in the downstream air duct beside the air guide piece is improved, meanwhile, the pressure in the downstream air duct is relatively reduced, air on the side of the backflow air duct is sucked out, a second cooling airflow flowing backwards and forwards is formed in the backflow air duct, and the air with relatively low external environment is used for cooling a rear device, so that the cooling effect can be effectively improved.

Description

Computing equipment

Technical Field

Embodiments of the present application relate to the field of servers, and in particular, to a computing device.

Background

With the development of servers toward high power, high integration and ultra-large scale, the heat flux density of high performance chips, integrated circuit elements and the like is increasing, and for servers adopting air cooling heat dissipation, the overall heat dissipation capacity of an air cooling heat dissipation system needs to be correspondingly improved.

Based on the heat dissipation air flow formed by the system fan, the heat generated by each component is taken away by sequentially passing through the internal components from front to back, and the heat is gradually accumulated along the flow direction of the heat dissipation air flow. When the heat dissipation airflow reaches the rear device positioned on the downstream side in the flow direction, the temperature is relatively high, and the heat dissipation airflow generally does not have heat dissipation capability or has weaker heat dissipation capability any more, so that the heat dissipation requirement of the rear device cannot be met.

Disclosure of Invention

The embodiment of the application provides a computing device, which can provide good heat dissipation for a rear device by optimizing a heat dissipation structure.

A first aspect of an embodiment of the present application provides a computing device, including a chassis, a first fan, a power device, and a heat dissipation assembly, where the first fan and the power device are disposed in the chassis, and the first fan is configured to form a first heat dissipation airflow flowing from front to back in the chassis; the power device at least comprises a central processing unit and a rear device, wherein the rear device is arranged at the rear side of the central processing unit; the heat dissipation component comprises an air guide piece, a rear air inlet and a front air outlet, wherein the air guide piece is arranged on the periphery of the rear device and at least surrounds the front side and two sides of the rear device so as to form a backflow air channel of second heat dissipation air flow flowing from back to front; meanwhile, the air guide piece and the side wall of the case are arranged at intervals to form a downstream air channel for the first heat dissipation air flow to pass through, the upstream air channel for the first heat dissipation air flow to pass through is positioned at the front side of the downstream air channel and is communicated with the downstream air channel, and the through flow cross section size of the downstream air channel is smaller than that of the upstream air channel for the first heat dissipation air flow; the rear side air inlet is communicated with the external environment of the case, and the front side air outlet is arranged on the body on the adjacent side of the air guide piece and the downstream air duct.

The first heat dissipation air flow generated by the starting of the first fan can sequentially flow through the upstream air channel at the front side of the air guide piece and the downstream air channel at the side of the air guide piece based on the blocking of the air guide piece, namely, the air flow velocity in the downstream air channel at the side of the air guide piece can be improved by entering the downstream air channel with the small through-flow cross-section through the upstream air channel with the large through-flow cross-section; meanwhile, based on the improvement of the flow velocity, the pressure in the downstream air channel is relatively reduced, the air on the side of the backflow air channel can be sucked out through the front air outlet, low-temperature air in the external environment is supplemented into the backflow air channel through the rear air inlet, so that second heat dissipation air flow flowing from back to front is formed in the backflow air channel, and after the low-temperature air contacts with a rear device for heat exchange, the hot air enters the downstream air channel to be converged with the first heat dissipation air flow and is discharged out of the case. Compared with hot air from the front side of the chassis, the rear side air inlet generally has lower temperature, and the embodiment utilizes air with relatively lower external environment to dissipate heat for the rear device on the whole, so that the heat dissipation effect of the rear device can be effectively improved.

The computing device may be a server, and the post device may be a post hard disk module, or may be a power device of a Riser module disposed at a rear side of the chassis waiting for heat dissipation.

In practical application, the flow areas of the rear air inlet and the front air outlet can be determined according to the relation parameters such as the working temperature of the rear device.

In other practical applications, the openings of the rear air inlet and the front air outlet may be fixed or adjustable as required. For the rear side air inlet and the front side air outlet with the adjustable opening sizes, the baffle plate sliding relative to the corresponding opening can be configured, the actual flow area of the rear side air inlet or the front side air outlet can be changed through the sliding movement of the baffle plate, the flow resistance of the second heat dissipation air flow can be reasonably controlled, and the sufficient cold air flow can flow through the backflow air duct to meet the heat dissipation requirement of the internal rear device of the air conditioner, so that the air conditioner has better adaptability.

Based on the first aspect, the embodiment of the present application further provides a first implementation manner of the first aspect: the heat dissipation assembly further comprises a second fan, and the second fan is arranged in the downstream air duct beside the air guide piece. Therefore, the second fan is started, the air flow speed in the downstream air duct can be further improved, the pressure in the downstream air duct can be further reduced, a large pressure difference can be rapidly formed between the downstream air duct and the backflow air duct, the flow speed and the flow quantity of the second heat dissipation air flow in the backflow air duct are correspondingly increased, and the heat dissipation efficiency is effectively improved.

For example, the second fan may be disposed at an empty power slot in the chassis.

Based on the first aspect, or the first implementation manner of the first aspect, the embodiment of the present application further provides a second implementation manner of the first aspect: a first air guide part is arranged in the downstream air duct and comprises a first air guide surface which is obliquely arranged; and along the flow direction of the first heat dissipation air flow, the rear end of the first air guide surface is far away from the air guide piece relative to the front end of the first air guide surface so as to guide the air flow discharged by the downstream air channel to a direction far away from the rear side air inlet. By the arrangement, hot waste air is effectively prevented from entering the backflow air duct, and interference of the hot air to the rear device is reduced.

The first air guiding surface may be a plane, or may be an air guiding surface of other shapes, such as, but not limited to, an arc surface having the same air guiding tendency.

In practical application, the first air guiding part can be of a first air guiding plate structure, and the first air guiding surface is the plate surface of the first air guiding plate, namely, is formed on the first air guiding plate which is obliquely arranged. Specifically, along the flow direction of the first heat dissipation airflow, the first air guiding surface may be fixedly disposed at the rear end side of the air guiding member, and the outer end of the first air guiding surface is far away from the air guiding member relative to the inner end thereof, so as to guide the airflow exiting the chassis to a direction far away from the rear side air inlet of the return air duct.

In other practical applications, the first air guiding portion may have a block structure with a first air guiding surface.

Based on the first aspect, or the first implementation manner of the first aspect, or the second implementation manner of the first aspect, the embodiment of the present application further provides a third implementation manner of the first aspect: the front side of the air guide piece is provided with a second air guide part, and the second air guide part comprises a second air guide surface which is obliquely arranged; and along the flowing direction of the first radiating airflow, the second air guide surface is arranged in a gradually-shrinking manner so as to guide the airflow in the upstream air channel into the downstream air channel beside the air guide piece. By the arrangement, the first heat-dissipating air flow in the upstream air channel can be converged into the downstream air channel, the pressure difference can be quickly responded and established, the second heat-dissipating air flow is formed in the backflow air channel, and the heat-dissipating efficiency is improved.

The second wind guiding surface may be a plane, or may be a wind guiding surface of another shape, for example, but not limited to, a cambered surface having the same wind guiding tendency.

In practical application, the second air guiding part may be a second air guiding plate structure, and the second air guiding surface is a plate surface of the second air guiding plate, that is, formed on the second air guiding plate which is obliquely arranged. Specifically, along the flow direction of the first heat dissipation air flow, the second air guide surface is fixedly arranged on the front side of the air guide piece in a tapered manner and is used for guiding the air flow in the upstream air channel into the downstream air channel.

In other practical applications, the second air guiding portion may have a block structure with a second air guiding surface, and in addition, but not limited to, a triangular air guiding block, where the second air guiding surface is a side surface of the triangular air guiding block.

Based on the first aspect, or the first implementation manner of the first aspect, the second implementation manner of the first aspect, or the third implementation manner of the first aspect, the embodiment of the present application further provides a fourth implementation manner of the first aspect: the front air outlet is arranged at the front end side of the body at the adjacent side of the air guide piece and the downstream air duct. Therefore, based on the air guide piece, a relatively long flow path of the second heat dissipation air flow can be obtained, so that the second heat dissipation air flow in the backflow air duct fully collides with the rear hard disk for heat exchange, and the actual heat exchange efficiency is improved.

Based on the fourth implementation manner of the first aspect, the embodiment of the present application further provides a fifth implementation manner of the first aspect: the rear air inlet is arranged on the rear body of the air guide piece or on the rear side wall plate of the chassis. Therefore, the flow path of the second heat dissipation airflow can be further lengthened, so that the heat exchange efficiency of the outside environment sucked air and the rear device is integrally improved.

In practical applications, the rear air inlet may also be formed in an upper wall of the chassis.

Based on the first aspect, or the first implementation manner of the first aspect, the second implementation manner of the first aspect, or the third implementation manner of the first aspect, the fourth implementation manner of the first aspect, or the fifth implementation manner of the first aspect, the present embodiment further provides a sixth implementation manner of the second aspect: a plurality of rear devices are arranged in a backflow air duct formed by the air guide piece; the plurality of post devices may be the same device or may be different devices.

For example, the plurality of rear devices may be different devices, for example, a rear hard disk module, a Riser module, etc. may be simultaneously disposed in a return air duct formed by one air guiding member, and may specifically be determined according to different product designs.

Drawings

FIG. 1 is a schematic diagram of a typical server internal architecture;

FIG. 2 is a schematic diagram of a server arrangement according to an embodiment of the present application;

FIG. 3 is an enlarged partial schematic view of the server post device heat sink assembly shown in FIG. 2;

FIG. 4 is a schematic view of two characteristic nodes forming a second heat sink airflow within the return duct of the heat sink assembly of FIG. 3, respectively;

FIG. 5 is a schematic diagram of another heat dissipation assembly for a post-device of a server according to an embodiment of the present application;

FIG. 6 is a schematic diagram of a heat dissipation assembly for a post-server device according to an embodiment of the present application;

fig. 7 is a schematic diagram of another heat dissipation assembly for a rear device of a server according to an embodiment of the present application;

fig. 8 is a schematic diagram of a heat dissipation assembly for a rear device of a server according to an embodiment of the present application.

Detailed Description

The embodiment of the application provides a server, which is used for realizing effective heat dissipation of a rear device by establishing a return air duct and improving the overall heat dissipation capacity of an air-cooled heat dissipation system.

Air-cooled heat dissipation is one of the common heat dissipation modes in a server, and a system fan is utilized to rotate to generate heat dissipation airflow, so that hot air is discharged from the inside of the server, and external fresh air is introduced. Referring to fig. 1, a schematic diagram of an internal structure of a typical server is shown. Based on the heat dissipation air flow formed by the system fan 60', heat generated by each component is taken away by passing through the internal components from front to back, such as, but not limited to, the front hard disk module 50', the CPU30', the memory 40' and the rear device 20'.

As shown in fig. 1, the rear device 20' is disposed in a rear side position area of the server 100', and the rear device 20' is located on a downstream side of the flow direction of the heat dissipation air flow in the flow direction of the heat dissipation air flow (arrow in the figure). Here, the post-device 20' is a power device to be cooled, and may specifically include different post-IO (input/output) modules, for example, but not limited to, a post-hard disk module or a Riser module.

In this configuration, after external cool air is introduced into the front of the server casing 10', heat is absorbed by heat exchange with heat source components such as heat generating devices or heat sinks, and then the hot air is discharged from the rear of the casing 10'.

With the gradual accumulation of heat, the temperature of the heat dissipation air flow reaching the rear device 20' is relatively high, and the heat dissipation capability is usually not provided or is weak, for example, the working temperature of the rear hard disk module is 35 ℃, and when the temperature of the hot air reaching the rear hard disk module is close to 35 ℃, the actual utilization rate is too low, so that the heat dissipation requirement of the rear hard disk module cannot be met.

Based on this, the embodiment of the present application provides a server, and the corresponding heat dissipation component is described in detail with the rear hard disk 20 in the rear device as the heat dissipation processing object. Referring to fig. 2 and fig. 3 together, fig. 2 is a schematic layout diagram of a server according to an embodiment of the present application, and fig. 3 is an enlarged schematic partial view of a heat dissipation assembly of a rear device of the server shown in fig. 2.

The server 100 includes a chassis 10, and power devices such as a CPU30, a memory 40, a front hard disk module 50, a first fan 60, and a rear device disposed in the chassis 10. The server 100 uses the first fan 60 as a main power component, and generates a first heat dissipation airflow from front to back, and the flow direction of the first heat dissipation airflow is shown by a solid arrow in the figure. The first fan 60 may be a system fan. The azimuth words "front" and "rear" herein mean that, in the flow direction of the first heat radiation air flow, "front" is an azimuth relatively located on the upstream side, and "rear" is an azimuth relatively located on the downstream side.

Wherein, the rear devices such as the rear hard disk 20 are arranged at the rear side of the CPU30 and at the rear side area of the chassis 10, the present embodiment is provided with a heat dissipating component for the rear hard disk 20, which is used to form a return air duct for the second heat dissipating airflow from the rear to the front, and thereby provide heat dissipation for the rear hard disk 20. The flow direction of the second heat dissipation air flow is shown by a dotted arrow in the figure.

The heat dissipation assembly includes an air guide 70, a rear air inlet 71 and a front air outlet 72, as shown in fig. 2 and 3, the air guide 70 is disposed at the periphery of the rear hard disk 20 and at least surrounds the front side and two sides of the rear hard disk 20 to form a backflow air channel a for dissipating heat of the rear hard disk 20; the rear side air inlet 71 is positioned at the upstream side of the return air duct a along the flow direction of the second heat radiation air flow, and the rear side air inlet 71 is communicated with the external environment of the case 10 so as to suck the low-temperature air of the external environment and contact and exchange heat with the rear hard disk 20 positioned in the air guide member 70; accordingly, the front side air outlet 72 is located at the downstream side of the return air duct a to discharge the heat exchanged hot air out of the air guide 70.

Meanwhile, the air guide member 70 is arranged at intervals with the side wall of the case 10 beside the air guide member to form a downstream air channel B2 of the first heat dissipation air flow, and the downstream air channel B2 is communicated with an upstream air channel B1 positioned at the upstream side of the downstream air channel B2; meanwhile, based on the space occupation of the air guide 70 at the rear side of the chassis 10, the through-flow cross-sectional size of the downstream air duct B2 is smaller than that of the upstream air duct B1. In this way, the first heat dissipation airflow may sequentially flow through the upstream air duct B1 at the front side of the air guide 70 and the downstream air duct B2 at the side of the air guide 70, and be discharged out of the chassis 10. In this embodiment, the front air outlet 72 is opened on the side body of the air guide 70 adjacent to the downstream air duct B2, so that the hot air exhausted from the air guide 70 is converged with the first heat dissipation air flow in the downstream air duct B2 and exhausted out of the chassis 10.

It will be appreciated that the space and components in the space that form the upstream air duct B1 may be determined according to the overall design of the actual product in a specific implementation, and embodiments of the present application are not limited thereto.

In operation, the first heat-dissipating air flow enters the downstream air duct B2 having the small through-flow cross-sectional dimension via the upstream air duct B1 having the large through-flow cross-sectional dimension based on the blockage formed by the air guide 70. The flow rate of the first heat radiation air flow in the downstream air duct B2 located beside the air guide 70 is increased based on the decrease in the through-flow cross-sectional size on the flow path thereof, and the pressure in the downstream air duct B2 is relatively decreased based on the increase in the flow rate, whereby the second heat radiation air flow can be formed in the return air duct a.

The principle of forming the second heat dissipation air flow in the return air duct a according to the present embodiment will be briefly described with reference to fig. 4, and fig. 4 shows two characteristic nodes for forming the second heat dissipation air flow in the return air duct based on the first heat dissipation air flow, respectively.

Fig. 4 (a) shows a characteristic node representing an initial operation time of the server air-cooled heat dissipation system. When the first fan is started, the flow speed of the first heat dissipation air flow entering the downstream air channel B2 is improved based on the structural characteristics that the size of the through flow section of the downstream air channel B2 is smaller than that of the through flow section of the upstream air channel B1 as shown by solid arrows in the figure.

Thus, as the velocity increases in the fluid flow, the downstream air path B2 pressure decreases and the return air path a communicates with the external environment, thereby creating a pressure differential between the downstream air path B2 and the return air path a.

The characteristic nodes characterizing the formation of the second heat sink airflow are shown in fig. 4 (b). Based on the pressure difference between the downstream air duct B2 and the return air duct a, the air in the return air duct a can be sucked into the downstream air duct B2 through the front side air outlet 72, and at the same time, the low-temperature air of the external environment is fed into the return air duct a through the rear side air inlet 71. It should be understood that "low temperature air" herein refers to air having a relatively low temperature, and not specifically a specific temperature value, drawn in from the external environment relative to the temperature of the air as the first heat sink airflow flows to the downstream region of the rear device.

In the steady-state flow stage, a second heat dissipation airflow, indicated by a dashed arrow in fig. 3, is formed from the back to the front, so as to dissipate heat for the rear hard disk 20, and the hot air after completing heat exchange enters the downstream air duct B2 and merges with the first heat dissipation airflow, and is discharged out of the chassis 10.

Compared with the way of cooling the rear device by the front-to-rear first cooling airflow as described in fig. 1, the first cooling airflow is hot air when flowing to the downstream area of the rear device, but the embodiment can provide low-temperature air sucked from the external environment to cool the rear hard disk 20, and the rear air intake has a lower temperature compared with the hot air from the front side of the chassis, so that the cooling performance is reliable and stable. That is, the present solution can block the influence of hot air (first heat dissipation airflow), and simultaneously realize the heat dissipation of the rear hard disk 20 through relatively low-temperature air, so that the problem that the hot air based on the first heat dissipation airflow cannot provide effective heat dissipation for the rear device can be avoided.

For the air guide 70 forming the return air duct a, different structural implementation manners may be adopted, for example, but not limited to, the body of the air guide 70 may only include a body portion enclosed on the front side and both sides of the rear hard disk 20, and form the return air duct with a top plate and a bottom plate of the chassis, or a single plate (not shown in the drawing) disposed at the bottom of the rear hard disk 20. In a specific implementation, the basic outline of the air guide 70 is not limited to the rectangle shown in the figure, and may be configured to protrude inwards to form an arc (not shown in the figure) according to the arrangement and orientation relationship of components inside the server, so as to avoid generating larger wind resistance. In other specific implementations, the bodies at two sides of the air guide 70 may be formed by adopting plate structures that are configured independently, or may also have the function of constructing and forming the air guide 70 by using adjacent structural entities, and the rear body of the air guide 70 may be configured independently, or may also be formed by using a rear sidewall plate of the chassis 10, so long as the backflow air duct forming the second heat dissipation air flow can be enclosed.

In one possible implementation, the body of the air guide 70 may also include a top enclosure portion, which forms the return air duct with the chassis bottom wall or a single plate disposed at the bottom of the rear device. In addition, the body of the air guide 70 may further include a top enclosure portion and a bottom enclosure portion, and the return air duct is formed by the self-structure of the air guide 70.

Optionally, in order to lengthen the flow path of the second heat dissipation air flow to the maximum extent, as shown in fig. 3, a front air outlet 72 of the embodiment may be provided at the front end side of the side body of the air guide 70, so that the second heat dissipation air flow in the return air duct a exchanges heat with the rear hard disk 20 sufficiently, and the actual heat exchange efficiency is improved; accordingly, the rear air inlet 71 may be formed on the rear body of the air guide 70 and/or the rear sidewall of the chassis 10, so as to integrally improve the heat exchange efficiency between the air sucked from the external environment and the rear hard disk 20.

Of course, in other specific implementations, the rear air inlet 71 may also be formed on a wall plate above the chassis 10 (not shown in the drawing), and the low-temperature air of the external environment can be sucked into the return air duct a to form a second heat dissipation airflow for dissipating heat of the rear hard disk 20.

For the implementation where the rear air inlet 71 is formed in the upper wall of the chassis 10, alternatively, the rear air inlet 71 may be formed in the rear end side of the upper wall of the chassis 10, and the flow path of the second heat dissipation air flow may be lengthened as well.

It should be noted that, for the downstream air duct B2 located beside the air guiding member 70, other functional components of the server, such as, but not limited to, a power module or a board device, may be generally configured. In a specific implementation, the downstream air duct B2 may be divided into two air ducts along the flow direction of the first heat dissipation air flow, please refer to fig. 5, which is a schematic diagram of another heat dissipation assembly of a rear device of a server according to an embodiment of the present application. To clearly illustrate the differences and associations of this embodiment with the example depicted in fig. 3, the same functional constitution and structure are shown with the same reference numerals.

As shown in fig. 5, a board device 80a is disposed in the downstream air duct B2 of the present embodiment, and two air ducts are partitioned by the board device 80 a: and similarly, based on the structural characteristics that the sum of the through-flow cross-sectional dimensions of the first air channel B21 and the second air channel B22 is smaller than that of the upstream air channel B1, the air flow entering the downstream air channel B2 is accelerated, the pressure of the downstream air channel B2 is also reduced, and the air in the backflow air channel A can be sucked into the downstream air channel B through the front air outlet 72, so that a second heat dissipation air flow flowing from back to front is formed.

In the above two embodiments, the side body of the air guide 70 adjacent to the downstream duct B2 has a straight plate shape, and in a specific implementation, the first air guide plate portion may be provided at the rear end portion of the side body. Referring to fig. 6, a schematic diagram of a heat dissipation assembly for a rear device of a server according to an embodiment of the application is shown. To clearly illustrate the differences and connections of this embodiment from the examples described in fig. 3 and 5, the same functional constitution and structure are shown with the same reference numerals.

As shown in fig. 6, a first air guide portion including a first air guide surface 73B provided obliquely is provided in the downstream duct B2 of the present embodiment. Along the flow direction of the first heat dissipation air flow, the first air guiding surface 73b is fixedly arranged at the rear end side of the air guiding piece 70, and the rear end of the first air guiding surface 73b is far away from the air guiding piece 70 relative to the front end of the first air guiding surface so as to guide the air flow discharged out of the chassis 10 to the direction far away from the rear side air inlet 71 of the return air duct A, so that hot waste air is effectively prevented from entering the heat to be dissipated in the return air duct A, and the interference of the hot air on rear devices is reduced.

In a specific implementation, the first air guiding portion may be a first air guiding plate structure, and the first air guiding surface 73b is a plate surface of the first air guiding plate, that is, formed on the first air guiding plate that is obliquely arranged, or the first air guiding portion may be a block structure with the first air guiding surface, and a suitable structural implementation manner needs to be selected according to a specific server design and requirements, so as to achieve an optimal heat dissipation effect.

In other specific implementations, the first air guiding surface 73B of the first air guiding portion may be another air guiding surface, as long as the hot waste air discharged from the downstream air duct B2 can be far away from the rear air inlet 71, for example, but not limited to, the first air guiding surface 73B may be an arc surface with the same air guiding trend. The embodiments of the present application are not limited.

Alternatively, in order to achieve rapid convergence of the first heat radiation air flow to the downstream air duct B2, a second air guide may be provided at the front side of the air guide 70. Fig. 7 is a schematic diagram of another heat dissipation assembly for a rear device of a server according to an embodiment of the present application. To clearly illustrate the differences and connections of this embodiment with the examples described in fig. 3, 5 and 6, the same functional constitution and structure are shown with the same reference numerals.

As shown in fig. 7, a second air guiding portion is provided on the front side of the air guiding member 70 in the present embodiment, and the second air guiding portion includes a second air guiding surface 74c that is disposed obliquely, and the second air guiding surface 74c is fixedly disposed on the front side of the air guiding member 70 in a gradually shrinking manner along the flow direction of the first heat dissipation air flow, so as to guide the air flow in the upstream air duct B1 into the downstream air duct B2. That is, the downstream end of the second air guiding surface 74c is connected to the front end of the downstream air duct B2, so that the first heat dissipating air flow in the upstream air duct B1 can be converged into the downstream air duct B2, the pressure difference can be quickly responded and established, and the second heat dissipating air flow is formed in the return air duct a, so that the heat dissipating efficiency is improved.

In a specific implementation, the second air guiding portion may be a second air guiding plate structure, and the second air guiding surface 74c is a plate surface of the second air guiding plate, that is, formed on the second air guiding plate that is obliquely arranged, or the second air guiding portion may be a block structure with a second air guiding surface, for example, but not limited to, a triangular air guiding block shown by a line in the figure, and the second air guiding surface may be a side surface of the triangular air guiding block; in other implementations, the second air guiding surface 74c of the second air guiding portion may also take other shapes, for example, but not limited to, the second air guiding surface 74c may be an arc surface with the same air guiding trend. The embodiments of the present application are not limited.

In the foregoing embodiment, based on the first heat radiation air flow generated by the activation of the first fan 60, the flow rate in the downstream air duct B2 is increased, so that the pressure in the downstream air duct B2 is relatively reduced, thereby sucking out the air on the return air duct a side to form the second heat radiation air flow for heat radiation of the rear hard disk 20. In other embodiments, to further increase the effect of the increase in the flow rate in the downstream air duct B2, a second fan may be disposed in the downstream air duct B2. Referring to fig. 8, a schematic diagram of a heat dissipation assembly for a rear device of a server according to an embodiment of the application is shown. To clearly illustrate the differences and connections of this embodiment with the examples described in fig. 3, 5, 6 and 7, the same functional constitution and structure are shown with the same reference numerals.

As shown in fig. 8, a second fan 90d is disposed in the downstream air duct B2 in the present embodiment, after the second fan 90d is started, the airflow speed in the downstream air duct B2 can be further increased, and on this basis, the pressure in the downstream air duct B2 is further reduced, so that a larger pressure difference is rapidly formed between the downstream air duct B2 and the return air duct a, and the flow rate of the second heat dissipation airflow formed in the return air duct a are correspondingly increased, so that the heat dissipation efficiency can be effectively improved. Meanwhile, based on the configuration of the second fan 90d, the back pressure of the system can be reduced, the ventilation of the whole system is enhanced, and the heat dissipation effect of the system is further improved.

In a specific implementation, the configuration of the second fan 90d may be added to the embodiments described in fig. 3, 5, 6 and 7, and in particular, the second fan 90d may be disposed at an empty power slot in the chassis, which can also effectively improve the airflow speed in the downstream air duct B2 and improve the heat dissipation efficiency. Compared with the implementation mode that the direct blowing fan is arranged on the front side of the rear device, the scheme forms second heat dissipation air flow based on the pressure difference between the downstream air duct B2 and the backflow air duct A beside the rear hard disk 20, can avoid influencing the index of the hard disk IOPS (Input/Output Operations Per Second, the number of times of performing read-write operation per second), effectively avoids the fan-out opening facing the rear IO module, and strong air flow, vibration of the fan and noise influence the performance of the rear IO module.

In other specific implementations, the auxiliary system cooling fan can jointly control the flow of the cooling air flow through the on/off operation and the fan rotation speed control of the second fan 90d, so that the accurate regulation and control of the overall cooling capacity are realized. That is, the rotation speed of the second fan 90d can be reasonably adjusted according to the actual heat dissipation requirement and the temperature variation to provide a sufficient cooling effect and avoid unnecessary increase of noise and energy consumption.

In addition, in the foregoing embodiments, the first fans 60 are disposed between the CPU30 and the front hard disk module 50, and the first fans 60 are used as power components to form the first heat dissipation airflow. In a specific implementation, the first fan 60 may also be disposed on the downstream side of the CPU30, or the first fan 60 may include a front side first fan disposed between the CPU30 and the front hard disk module 50 and a middle first fan disposed on the downstream side of the CPU 30. The determination may be specifically determined according to the overall design requirement of the server, and the embodiment of the application is not limited.

The heat dissipation assembly described in the foregoing embodiments may be widely applied in high-density application scenarios, such as but not limited to, supercomputers, HPCs (High Performance Computing, high-performance computer clusters), densely-computing servers, and the like. It can be appreciated that, in the server described in the embodiment of the present application, as shown in fig. 2, different types of post devices may be included in the rear side area of the chassis 10, and in a specific implementation, the heat dissipation assembly may be configured according to the working temperature of the corresponding post device, so as to reasonably consider the overall heat dissipation performance of the air-cooled heat dissipation system.

In a specific implementation, the heat dissipation component of the server post device may be configured corresponding to a post device, such as, but not limited to, a set of post hard disks; the heat dissipation assembly can also be configured corresponding to a plurality of rear devices, that is, a plurality of rear devices can be arranged in a return air duct formed by the air guide piece, wherein the rear devices are the same devices, for example, the rear devices can be all rear hard disks, the rear devices can also be different devices, for example, a rear hard disk module, a Riser module and the like can be arranged in the return air duct formed by the air guide piece, and the rear hard disk module, the Riser module and the like can be specifically determined according to different product designs.

It should be understood that other functions of the server form a core point of the present application, and those skilled in the art can implement the present application based on the prior art, so that the description thereof will not be repeated herein.

The foregoing is merely a preferred embodiment of the present application and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present application, which are intended to be comprehended within the scope of the present application.

Claims (11)

1. A computing device, comprising a chassis, a first fan, a power device and a heat dissipation assembly, wherein the first fan and the power device are arranged in the chassis, the first fan is used for forming a first heat dissipation airflow flowing from front to back in the chassis, the power device at least comprises a central processor and a rear device, and the rear device is arranged at the rear side of the central processor;

the heat dissipation assembly comprises an air guide piece, a rear air inlet and a front air outlet, wherein the air guide piece is arranged on the periphery of the rear device and at least surrounds the front side and two sides of the rear device so as to form a backflow air channel of second heat dissipation air flow flowing from back to front; the air guide piece is arranged at intervals with the side wall of the case to form a downstream air channel for the first heat dissipation air flow to pass through, and the upstream air channel of the first heat dissipation air flow is positioned at the front side of the downstream air channel and is communicated with the downstream air channel; the through-flow cross section size of the downstream air duct is smaller than that of the upstream air duct of the first radiating airflow;

the rear side air inlet is communicated with the external environment of the case, and the front side air outlet is arranged on the body on the adjacent side of the air guide piece and the downstream air duct.

2. The computing device of claim 1, wherein the heat dissipation assembly further comprises a second fan disposed within the downstream air duct.

3. The computing device of claim 1 or 2, wherein a first air guide is disposed within the downstream duct, the first air guide comprising a first air guide surface disposed obliquely; and along the flowing direction of the first heat dissipation air flow, the rear end of the first air guide surface is far away from the air guide piece relative to the front end of the first air guide surface so as to guide the air flow discharged by the downstream air channel to be far away from the rear side air inlet.

4. The computing device of claim 3, wherein the second air guide is a first air guide plate, a plate body of the first air guide plate is obliquely arranged, and the first air guide surface is a plate surface of the first air guide plate.

5. The computing device of any one of claims 1-4, wherein the air guide front side is provided with a second air guide portion comprising a second air guide surface disposed obliquely; and along the flowing direction of the first radiating airflow, the second air guide surface is arranged in a gradually-shrinking manner so as to guide the airflow in the upstream air channel into the downstream air channel.

6. The computing device of claim 5, wherein the second air guide is a second air guide plate, a plate body of the second air guide plate is obliquely arranged, and the second air guide surface is a plate surface of the second air guide plate.

7. The computing device of claim 5, wherein the second wind-guiding portion is a triangular wind-guiding block and the second wind-guiding surface is a side of the triangular wind-guiding block.

8. The computing device of any one of claims 1 to 7, wherein the front side air outlet is open at a body front end side of the air guide adjacent to the downstream air duct.

9. The computing device of claim 8, wherein the rear air intake is open on a rear body of the air guide, or on a rear side wall panel of the chassis, or on an upper wall panel of the chassis.

10. The computing device of any one of claims 1 to 9, wherein a plurality of the rear devices are disposed within a return duct formed by the air guide.

11. The computing device of any of claims 1 to 10, wherein the computing device is a server.