CN114442764B

CN114442764B - Heat radiation system of portable electronic device

Info

Publication number: CN114442764B
Application number: CN202011215580.8A
Authority: CN
Inventors: 陈宗廷; 廖文能; 谢铮玟; 林育民; 陈伟今; 林光华; 王俊杰; 郭书豪
Original assignee: Acer Inc
Current assignee: Acer Inc
Priority date: 2020-11-04
Filing date: 2020-11-04
Publication date: 2023-08-01
Anticipated expiration: 2040-11-04
Also published as: CN114442764A

Abstract

The invention provides a heat dissipation system of a portable electronic device, which comprises a machine body, at least one fan and at least one spacer. At least one heat source of the portable electronic device is configured in the body. The fan is a centrifugal fan and is arranged in the machine body, and the fan is provided with at least one air inlet positioned in the axial direction and at least one air outlet positioned in the radial direction. The partition piece is arranged on at least one of the machine body or the fan to form layered air flow in the machine body along the axial direction, and the layered air flow flows into the fan through the air inlet and flows out of the fan through the air outlet respectively.

Description

Heat radiation system of portable electronic device

Technical Field

The present disclosure relates to heat dissipation systems, and particularly to a heat dissipation system for a portable electronic device.

Background

The current electronic industry is rapidly developing, and the performance of electronic components is continuously improved, and the heat generated by the electronic components is also greater along with the faster instruction period, so that in a portable electronic device, such as a notebook computer, the portable electronic device needs to discharge the air in the portable electronic device through a centrifugal fan, thereby reducing the internal temperature of the device.

Furthermore, in order to meet the current trend of devices toward light, thin, short, small and high performance, the heat dissipation components in the portable electronic device are also required to be miniaturized, so that the situation of insufficient heat dissipation efficiency is often faced.

Meanwhile, the existing fan is often provided with only one air outlet, the heat dissipation efficiency is limited, and on the premise of not increasing the number of the fans, the fan can adopt the design of two air outlets, but under the condition that the fan is not provided with the corresponding design airflow paths, the fan can not exert the effect, besides the heat dissipation capacity, the heat dissipation path conflict is easily generated in the device, or the excessive thermal impedance is caused in the device, so that the situation that heat accumulation cannot dissipate out of the portable electronic device is caused. For example, without a corresponding heat dissipation airflow path, heat that would otherwise be expelled from the device may be drawn into the device by the fan again.

Disclosure of Invention

The invention is directed to a heat dissipation system of a portable electronic device, which forms layered airflow in a machine body to improve heat dissipation efficiency.

According to an embodiment of the invention, a heat dissipation system of a portable electronic device includes a body, at least one fan, and at least one spacer. At least one heat source of the portable electronic device is configured in the body. The fan is a centrifugal fan and is arranged in the machine body, and the fan is provided with at least one air inlet positioned in the axial direction and at least one air outlet positioned in the radial direction. The partition piece is arranged on at least one of the machine body or the fan to form layered air flow in the machine body along the axial direction, and the layered air flow flows into the fan through the air inlet and flows out of the fan through the air outlet respectively.

Based on the above, the heat dissipation system of the portable electronic device forms a layered airflow along the axial direction in the body through the spacer disposed on the centrifugal fan or the body, so as to ensure that the heat dissipation airflow paths generated by the fan do not collide, so as to effectively avoid the possibility that the heat generated by the heat source is absorbed by the fan again, thereby providing an improved countermeasure to the heat accumulation situation generated by the collision of the heat dissipation paths in the existing body.

Drawings

FIG. 1 is a schematic diagram of a portable electronic device according to a first embodiment of the invention;

FIG. 2A is an exploded view of a heat dissipating system according to a first embodiment of the present invention;

FIG. 2B is a top view of the heat dissipation system of FIG. 2A;

FIG. 2C is a cross-sectional view of the heat dissipation system of FIG. 2B;

FIG. 3A is an exploded view of a heat dissipating system according to a second embodiment of the present invention;

FIG. 3B is a schematic diagram showing the upper housing of FIG. 3A from a different perspective;

FIG. 3C is a top view of the heat dissipation system of FIG. 3A;

FIG. 3D is a partial cross-sectional view of the heat dissipation system of FIG. 3C;

FIG. 4A is an exploded view of a heat dissipating system according to a third embodiment of the present invention;

FIG. 4B is a top view of the heat dissipation system of FIG. 4A;

FIG. 4C is a partial cross-sectional view of the heat dissipation system of FIG. 4B;

FIG. 5A is an exploded view of a heat dissipating system according to a third embodiment of the present invention;

fig. 5B is a top view of the heat dissipation system of fig. 5A. The method comprises the steps of carrying out a first treatment on the surface of the

FIG. 5C is a partial cross-sectional view of the heat dissipation system of FIG. 5B;

fig. 6 is a schematic diagram of a heat dissipation system according to other embodiments of the present invention.

Detailed Description

Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.

Fig. 1 is a schematic diagram of a portable electronic device according to a first embodiment of the invention. Fig. 2A is an exploded view of a heat dissipating system according to a first embodiment of the present invention. Fig. 2B is a top view of the heat dissipation system of fig. 2A. The embodiment also provides rectangular coordinates X-Y-Z to facilitate component identification. Referring to fig. 1 to 2B, in the present embodiment, the heat dissipation system 100 is suitable for the portable electronic device 10 (such as a notebook computer), and the heat dissipation system 100 includes a body 110, at least one fan 120, and at least one spacer 170. At least one heat source of the portable electronic device 10 is disposed in the body 110. The present embodiment shows two heat sources 11, 12, such as a CPU and a GPU. The fan 120 is a centrifugal fan, and is disposed in the body 110. The fan 120 has at least one air inlet located in an axial direction (according to fig. 2A, the fan 120 has an air inlet N1) and at least one air outlet located in a radial direction (according to fig. 2A, the fan 120 has a second air outlet N3 and a first air outlet N4). The spacer 170 is disposed on at least one of the machine body 110 or the fan 120 to form a layered air flow in the machine body 110 along the axial direction, wherein the layered air flow flows into the fan 120 through the air inlet N1 and flows out of the fan 120 through the air outlets (i.e., the second air outlet N3 and the first air outlet N4). The axial direction of the fan 120 is the Z-axis direction of the rectangular coordinates X-Y-Z.

Fig. 2C is a cross-sectional view of the heat dissipation system of fig. 2B. Referring to fig. 2A to 2C, further, the body 110 includes an upper housing 111 and a lower housing 112, and the upper housing 111 has a (hole-shaped) opening 111a corresponding to the air inlet N1 of the fan. Accordingly, air in the environment outside the body 110 can flow into the fan 120 through the opening 111a and the air inlet N1.

In this embodiment, the heat dissipation system 100 further includes a circuit board 180, the spacer 170 includes a first spacer 171 disposed at a portion of the periphery of the fan 120 and a second spacer 172 disposed at an inner wall of the body 110, and the first spacer 171, the second spacer 172, the body 110, the fan 120 and the circuit board 180 form an inflow channel (inflow channel) C1, and the inflow channel C1 is connected to the air inlet N1. The first spacer 171 is a buffer material, such as foam, and has flexibility and elasticity so as to be abutted against the upper housing 111, so that the space of the air inlet N1 in the machine body 110 is vertically separated from the space (along the Z axis) of the heat sources 11, 12 in the machine body 110. In other words, the front projection of the inflow channel C1 on the Z axis and the front projection of the air outlet (N3, N4) on the Z axis are offset from each other, so that the space where the air inlet N1 is located is not affected by the heat generated by the heat sources 11, 12, that is, the air inlet N1 can only suck the air of the external environment through the opening 111a of the body 110, so that the cool air sucked by the fan 120 is ensured, and the heat dissipation action is effectively performed on the heat sources 11, 12 when the cool air is blown out from the air outlet.

Specifically, in the present embodiment, the inflow channel C1 and the first air outlet N4 facing into the body 110 are located on the same side (i.e. the same radial direction) of the fan 120. Referring to fig. 2A, further, the first spacer 171 forms a notch 1711 on the fan 120, and the notch 1711 and the first air outlet N4 are located on the same side (i.e. the same radial direction) of the fan 120. In the embodiment, the second air outlet N3 of the fan 120 faces the outside of the machine body 110, the first air outlet N4 faces the inside of the machine body 110, and the second air outlet N3 and the first air outlet N4 have different opening sizes along the Z-axis direction. In this embodiment, the opening size of the first air outlet N4 along the axial direction is smaller than the opening size of the second air outlet N3 along the axial direction. However, in other embodiments, the second air outlet N3 and the first air outlet N4 may have the same opening size along the axial direction, which is not limited thereto.

In the present embodiment, the second partition 172 includes three second sub-partitions 1721, 1722, 1723 surrounding a portion of the opening 111a to collect the air flow sucked from the opening 111a, and the second sub-partition 1722 is connected to the second sub-partition 1721 and extends to the first partition 171 to smoothly guide the air flow sucked from the opening 111a to the air inlet N1. In the present embodiment, the distance between the two second sub-spacers 1722, 1723 corresponds to the width of the notch 1711.

Specifically, the first air outlet N4 facing the inside of the machine body 110 has a first sub-air outlet N41 and a second sub-air outlet N42, and an opening size of the first sub-air outlet N41 along the Z-axis is smaller than an opening size of the second sub-air outlet N42 along the Z-axis. In this embodiment, the fan 120 further has a side wall 124 axially located along the Z-axis between the first sub-air outlet N41 and the inflow channel C1. In other words, the orthographic projections of the side wall 124, the first sub-air outlet N41 and the inflow channel C1 on the Z axis are adjacent to each other. The bottom of the sidewall 124 abuts against the circuit board 180. The advantage of this design is that the circuit board 180 and the side wall 124 can achieve the effect of separating the notch 1711 from the first sub-air outlet N41, so that the air blown out from the first sub-air outlet N41 cannot be easily sucked by the fan 120 through the notch 1711 and the air inlet N1. In addition, the lower housing 112 of the present embodiment has no opening, and can achieve a back-beautifying effect, so that the portable electronic device 10 can achieve a better visual effect.

Referring to fig. 2B and fig. 2C again, in general, the body 110 of the present embodiment has at least one opening, and the air flow generated by the fan 120 flows out from the air outlet, and after radiating the heat sources 11, 12 or the related heat radiating members, flows out of the body 110 from the opening. In detail, the fan 120 of the present embodiment is operated to suck cool air of the external environment of the body 110, i.e., air flow F1 as shown in the drawing, from the air inlet N1. Furthermore, as shown in fig. 2A, 2B and 2C, the body 110 has a plurality of openings 111C and 111d, and the portable electronic device 10 further includes a battery 14, the heat dissipation system 100 further has a heat conducting member 130 and a heat dissipation member 140, and the heat sources 11 and 12 are disposed on the lower surface of the circuit board 180, wherein, as shown in fig. 2A and 2B, the heat conducting member 130 is, for example, a heat pipe, the heat dissipation member 140 is, for example, a heat dissipation fin (only shown in the drawing for simplicity of the embodiment), and the heat conducting member 130 is in thermal contact between the heat sources 11 and 12 and the heat dissipation member 140 so as to transfer the heat generated by the heat sources 11 and 12 to the heat dissipation member 140. In addition, since the fan 120 has the first air outlet N4 and the second air outlet N3, the airflows F3 and F4 generated by the fan 120 flow out from the second air outlet N3 and the first air outlet N4, respectively, the heat dissipation member 140 is located between the second air outlet N3 and the opening 111c, wherein the airflows F3 flowing out from the second air outlet N3 flow out of the body 110 from the opening 111c through the heat dissipation member 140, and the airflows F4 flowing out from the first air outlet N4 flow out of the body 110 from the opening 111d after passing through the heat sources 11 and 12.

In this way, the cool air sucked into the fan 120 can flow out from the first air outlet N4 and the second air outlet N3 respectively, wherein the cool air (air flow F4) flowing out from the first air outlet N4 can directly blow and dissipate heat to the heat sources 11 and 12 in the machine body 110, and then blow out of the machine body 110 through the opening 111d of the machine body 110, and the cool air (air flow F3) flowing out from the second air outlet N3 can blow and dissipate heat to the heat dissipation member 140, and then blow out of the machine body 110 through the opening 111c of the machine body 110. In other words, the heat generated by the heat sources 11 and 12 can be dissipated through the above two non-conflicting paths, which can significantly improve the heat dissipation efficiency of the heat dissipation system 100.

Fig. 3A is an exploded view of a heat dissipating system according to a second embodiment of the present invention. Fig. 3B is a schematic view illustrating the upper case of fig. 3A at a different viewing angle. Fig. 3C is a top view of the heat dissipation system of fig. 3A. In the embodiment shown in fig. 3A to 3C, the position of the opening 111b1 is significantly different from that of the openings 111C, 111d, that is, the opening 111b1 for sucking the cool air from the external environment is far away from the openings 111C, 111d for discharging the air flow, so that the air blown out by the openings 111C, 111d is not easily sucked by the fan 120 through the opening 111b 1. In addition, in the present embodiment, the two air outlets N3, N4' of the fan 120B have the same opening size along the Z-axis direction.

Fig. 3D is a partial cross-sectional view of the heat dissipation system of fig. 3C. Referring to fig. 3A to 3D, in this embodiment, the spacer 170B includes a first spacer 171B disposed at a portion of the periphery of the fan 120B and at least one second spacer 172B (two are shown) disposed on the inner wall of the body 110B. In the present embodiment, two second spacers 172B are respectively located at two sides of the opening 111B1 to collect the air flow sucked from the opening 111B1, and the two second spacers 172B extend to the first spacer 171B to smoothly guide the air flow sucked from the opening 111B1 to the air inlet N1. In the present embodiment, the distance between the two second spacers 172B corresponds to the width of the notch 1711B. The first and second spacers 171B and 172B, the body 110B and the fan 120B form an inflow channel C2, and the inflow channel C2 is connected to the air inlet N1.

Specifically, the inflow channel C2 and the first air outlet N4' facing the inside of the body 110 are located at two opposite sides of the fan 120B. The first partition 171B forms a notch 1711B on the outer surface of the fan 120B, and the notch 1711B and the first air outlet N4' are located on different sides of the fan 120B.

In general, the fan 120B of the present embodiment is operated to draw in cool air of the environment outside the body 110, i.e., air flow F1' as shown in the drawing, from the air inlet N1. Cold air of the environment outside the body 110, i.e., air flow F2' as shown in the drawing, is sucked through the opening 111b 1. Furthermore, since the fan 120B has the first air outlet N4' and the second air outlet N3, the airflows F3', F4' generated by the fan 120 respectively flow out of the second air outlet N3 and the first air outlet N4', wherein the airflows F3' flowing out of the second air outlet N3 flow out of the body 110 through the opening 111c by the heat sink 140, and the airflows F4' flowing out of the first air outlet N4' flow out of the body 110 through the openings 111d after passing through the heat sources 11, 12.

Fig. 4A is an exploded view of a heat dissipating system according to a third embodiment of the present invention. Fig. 4B is a top view of the heat dissipation system of fig. 4A. Fig. 4C is a partial cross-sectional view of the heat dissipation system of fig. 4B. In the embodiment shown in fig. 4A to fig. 4C, the circuit board 180C is disposed in the body 110C and is looped around at least a portion of the fan 120C to layer the inner space of the body 110C, and the first air outlet N4″ is located at one layer. For example, the first air outlet N4″ is located on the circuit board 180C, and the heat sources 11, 12 are located under the circuit board 180C. In other words, the spacer of the present embodiment is the circuit board 180C.

In the present embodiment, the fan 120C further has another air inlet N2 opposite to the air inlet N1, and the air inlet N1 and the air inlet N2 are located on opposite sides of the fan 120C along the Z-axis. Further, the lower housing 112C of the body 110C has a (grid-shaped) opening 112C1 to correspond to the air inlet N2. Accordingly, air in the environment outside the body 110C can flow into the fan 120C through the openings 111C1 and 112C1 and the air inlets N1 and N2.

In the present embodiment, the fan 120C is axially abutted against the lower housing 112C of the machine body 110C along the Z axis. The heat dissipation system 100C of the portable electronic device 10 includes a first spacer 171C disposed along the periphery of the fan 120C and abutting between the fan 120C and the body 110C. The first partition 171C is, for example, foam, and has flexibility and elasticity, so that the space in the body 110C where the air inlets N1 and N2 are located is isolated from the space in the body 110 where the heat sources 11 and 12 are located, so that the heat generated by the heat sources 11 and 12 does not affect the space where the air inlets N1 and N2 are located, that is, the air inlets N1 and N2 can only suck the air in the external environment through the openings 111C1 and 112C1 of the body 110C, the cool air sucked by the fan 120C is ensured, and the effective heat dissipation action on the heat sources 11 and 12 is facilitated when the cool air is blown out from the second air outlet N3 and the first air outlet N4″. Here, the air inlets N1, N2 of the fan 120C are coaxially disposed, and as shown in fig. 4A, the buffer 171C is disposed along the structural periphery of the fan 120 to form a closed contour.

In the present embodiment, the heat dissipation system 100C of the portable electronic device 10C further includes heat dissipation fins 140. The fan 120C is looped by the circuit board 180C except for the air outlet N3 facing the outside of the body 110C, the heat dissipation fins 140 are disposed in the body 110C and face the air outlet N3 facing the outside of the body 110C, the heat dissipation fins 140 and the circuit board 180C form a closed contour, and the fan 120C is disposed in the closed contour to divide the inside of the body 110C into two layers of spaces.

In general, the fan 120C of the present embodiment operates to draw in cool air from the air inlets N1, N2 to the environment outside the body 110C, i.e., the air flow F1 "as shown in the drawings. Furthermore, since the fan 120C has the first air outlet N4 "and the second air outlet N3, the airflows F2" and F3 "generated by the fan 120C flow out of the first air outlet N4" and the second air outlet N3, respectively, and the heat dissipation member 140 is located between the second air outlet N3 and the opening 111C, wherein the airflows F2 "flowing out of the second air outlet N3 flow out of the body 110C through the opening 111C by the heat dissipation member 140, and the airflows F3" flowing out of the first air outlet N4 "flow out of the body 110C through the openings 111d after passing through the heat sources 11 and 12.

Fig. 5A is an exploded view of a heat dissipating system according to a third embodiment of the present invention. Fig. 5B is a top view of the heat dissipation system of fig. 5A. Fig. 5C is a partial cross-sectional view of the heat dissipation system of fig. 5B. Unlike the lower housing 112C shown in fig. 4A to 4C, which has the (grid-shaped) opening 112C1, in the embodiment shown in fig. 5A to 5C, the circuit board 180C is layered in the inner space of the body 110D, and the first air outlet N4″ is located at one layer, that is, above the circuit board 180C. The opening 112D1 of the lower housing 112D is located at another layer without the first air outlet N4", that is, below the circuit board 180C.

In general, the fan 120D of the present embodiment is operated to draw in cool air from the air inlet N1 to the environment outside the body 110C, i.e., the air flow F1' "as shown in the drawing. Cold air of the environment outside the body 110D, i.e., air flow F2' "as shown in the drawing, is inhaled through the opening 112D 1. Furthermore, since the fan 120C has the first air outlet N4″ and the second air outlet N3, the airflows F3 '", F4'" generated by the fan 120C flow out of the first air outlet N4″ and the second air outlet N3, respectively, and the heat sink 140 is located between the second air outlet N3 and the opening 111C, wherein the airflows F3 '"flowing out of the second air outlet N3 flow out of the body 110D through the opening 111C by the heat sink 140, and the airflows F4'" flowing out of the first air outlet flow out of the body 110D through the openings 111D after passing through the heat sources 11, 12.

Fig. 6 is a schematic diagram of a heat dissipation system according to other embodiments of the present invention. Note that in the embodiment shown in fig. 6, the illustration of the body is omitted to more clearly illustrate the structure of the inside thereof. In the embodiment shown in fig. 6, the heat sources 11, 12 and the heat conducting member 130 may be disposed on the upper surface of the circuit board 180C, that is, the heat sources 11, 12, the heat conducting member 130 and the first air outlet N4 "are disposed on the same layer, so that the first air outlet N4" is beneficial to effectively dissipate heat from the heat sources 11, 12.

In summary, the heat dissipation system of the portable electronic device forms a layered airflow in the machine body along the axial direction by the centrifugal fan matching with the corresponding spacer, so as to ensure that the airflow sucked into the fan does not collide with the heat dissipation airflow path generated by the fan, and effectively avoid the possibility that the heat generated by the heat source is sucked by the fan again, thereby providing an improved diversified countermeasure for the heat accumulation situation generated by the collision of the heat dissipation path in the existing machine body.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.

Claims

1. A heat dissipation system for a portable electronic device, comprising:

the portable electronic device comprises a body, at least one heat source of the portable electronic device is arranged in the body;

at least one fan, which is a centrifugal fan and is arranged in the machine body, wherein the fan is provided with at least one air inlet positioned in the axial direction and at least one air outlet positioned in the radial direction; and

the at least one spacer is configured on at least one of the machine body or the fan so as to form layered air flow in the machine body along the axial direction, the layered air flow respectively flows into the fan through the air inlet and flows out of the fan through the air outlet, the at least one spacer comprises a first spacer configured on the periphery of the fan part and a second spacer configured on the inner wall of the machine body, the first spacer, the second spacer, the machine body and the fan form an inflow channel, the inflow channel is connected with the air inlet, the first spacer forms a notch on the outer surface of the fan, the notch and the air outlet are positioned on different sides of the fan, the fan is provided with two air outlets positioned in different radial directions, one air outlet faces towards the outside of the machine body, the other air outlet faces towards the inside of the machine body, and the two air outlets have the same opening size along the axial direction.

2. The heat dissipating system of claim 1, wherein the inflow channel and the air outlet are located on opposite sides of the fan.

3. The heat dissipating system of claim 1, wherein the front projection of the inflow channel in the axial direction and the front projection of the air outlet in the axial direction are offset from each other.

4. A heat dissipation system for a portable electronic device, comprising:

at least one fan, which is a centrifugal fan and is arranged in the machine body, wherein the fan is provided with at least one air inlet positioned in the axial direction and at least one air outlet positioned in the radial direction;

at least one spacer arranged on at least one of the machine body or the fan to form a layered air flow in the machine body along the axial direction, wherein the layered air flow flows into the fan through the air inlet and flows out of the fan through the air outlet respectively;

the circuit board, at least one spacer includes dispose in the first spacer of fan part periphery and dispose in the second spacer of organism inner wall, first spacer the second spacer the organism, the fan with the circuit board forms an inflow passageway, inflow passageway connects the air inlet, first spacer is in form the breach on the fan, the breach with the air outlet is located the same side of fan, the fan has two air outlets that are located different radial, and one of them air outlet is towards outside the organism, another air outlet is towards in the organism, just two air outlets have different opening sizes along the axial.

5. The heat dissipating system of claim 4, wherein the inlet channel and the outlet are located on the same side of the fan.

6. The heat dissipating system of claim 4, wherein the fan has two outlets located in different radial directions, one of the outlets facing the outside of the housing and the other outlet facing the inside of the housing, and the two outlets have the same opening size along the axial direction.

7. The heat dissipating system of claim 6, wherein the air outlet and the inflow channel facing the inside of the housing are located on the same side of the fan.

8. The heat dissipating system of claim 6, wherein the air outlet facing the inside of the housing has a first sub-air outlet and a second sub-air outlet, and the opening size of the first sub-air outlet in the axial direction is smaller than the opening size of the second sub-air outlet.

9. The heat dissipating system of claim 8, wherein the fan further comprises a sidewall disposed between the first sub-air outlet and the inflow channel along the axial direction.

10. A heat dissipation system for a portable electronic device, comprising:

at least one spacer arranged on at least one of the machine body or the fan to form a layered air flow in the machine body along the axial direction, the layered air flow respectively flowing into the fan through the air inlet and flowing out of the fan through the air outlet,

the spacer is a circuit board, is arranged in the machine body and is annularly connected with at least part of the fan so as to layer the internal space of the machine body, the air outlet is positioned at one layer,

the heat dissipation system of the portable electronic device further comprises another spacer, the spacer is arranged along the periphery of the fan and is abutted between the fan and the machine body, the fan is provided with two air outlets which are positioned in different radial directions, one air outlet faces towards the outside of the machine body, the other air outlet faces towards the inside of the machine body and is positioned at one layer, and the rest parts of the fan except the air outlets which face towards the outside of the machine body are all connected by the circuit board in a ring mode.

11. The heat dissipating system of claim 10, wherein the fan is abutted to the body along the axial direction.

12. The heat dissipating system of claim 10, further comprising heat dissipating fins disposed in the housing and facing the air outlet outside the housing, wherein the heat dissipating fins and the circuit board form a closed contour, and the fan is disposed in the closed contour.

13. The heat dissipating system of claim 10, wherein the other layer of the inner space of the body does not have the air outlet, and the body further has a plurality of openings located in the other layer.