CN221261620U

CN221261620U - Heat radiation system and all-in-one

Info

Publication number: CN221261620U
Application number: CN202323242486.3U
Authority: CN
Inventors: 卢永革; 唐永强; 陈小明
Original assignee: Shenzhen Zhilai Education Technology Co ltd
Current assignee: Shenzhen Zhilai Education Technology Co ltd
Priority date: 2023-11-30
Filing date: 2023-11-30
Publication date: 2024-07-02
Anticipated expiration: 2033-11-30

Abstract

The application provides a heat radiation system and an integrated machine. The heat conduction component is fixedly connected with the main board module and is abutted with a main heat generation source of the main board module; the main board fan is fixedly connected with the heat conduction member, and the air inlet of the main board fan is opposite to the cold air inlet of the main board; the heat conduction component is provided with an air inlet which is abutted against an air outlet of the main board fan, and an air outlet which is abutted against a main board hot air outlet; the display card fan is arranged on the display card module, an air inlet of the display card fan is opposite to a cold air inlet of the display card, and an air outlet path formed by an air outlet of the display card fan sequentially passes through a main heating source of the display card module and a hot air outlet of the display card; the air duct cover covers the main heating sources of the display card fan and the display card module, the air inlet of the air duct cover is used as the air inlet of the display card fan, and the air outlet of the air duct cover is abutted to the hot air outlet of the display card. According to the application, the temperature of the main board module can be effectively reduced through the main board fan and the heat conduction member, and the temperature of the display card module can be effectively reduced through the display card fan and the air duct cover, so that the heat dissipation capacity of the integrated machine is improved.

Description

Heat radiation system and all-in-one

Technical Field

The application relates to the field of computer terminals, in particular to a heat dissipation system and an all-in-one machine.

Background

The integrated machine is a novel computer integrating a display module, a main board module, a display card module, a storage module, a power module and the like together, and forms a computer which is small in size and convenient to carry through the high integration of internal elements. However, the volume of the chassis of the integrated machine is limited by usability, and the conventional heat dissipation system cannot be used, so that manufacturers generally select low-power hardware devices to reduce the heat productivity of the hardware, but this also affects the performance of the integrated machine, such as the operation speed and the maximum operation capability.

With the development of Virtual Reality (VR), there has been a demand for applying Virtual Reality to all-in-one machines. However, because the virtual reality has a high requirement on hardware performance and the integrated machine adopts a low-power hardware device, the hardware is in a high-performance operation state when the integrated machine performs 3D display, so that the heat productivity is excessive. In addition, the integrated machine cannot use the traditional heat dissipation system, so that heat generated by hardware cannot be effectively discharged, and the operation and even the service life of the hardware can be influenced over time.

In the related art, a plurality of heat dissipation holes are formed in a housing to enhance the heat dissipation capability of an integrated machine, for example, an integrated machine provided in chinese patent CN219658112U, please refer to fig. 1, in which a plurality of strip-shaped heat dissipation holes are formed in the housing (number 16 in fig. 1). However, such a technical solution affects the structural strength of the housing, and the heat dissipation capacity is limited. Therefore, it is highly desirable to provide a heat dissipation system capable of effectively enhancing the heat dissipation capability of an integrated machine.

Disclosure of utility model

Therefore, the application provides the heat dissipation system and the integrated machine, and the heat dissipation system can effectively improve the heat dissipation capacity of the integrated machine.

In a first aspect, the application provides a heat dissipation system, which is applied to an integrated machine, wherein the integrated machine comprises a shell, a main board module and a display card module, wherein the main board module and the display card module are arranged in an inner cavity of the shell, and the shell is provided with a main board cold air inlet, a main board hot air outlet, a display card cold air inlet and a display card hot air outlet;

The heat dissipation system comprises a main board fan, a heat conduction member, a display card fan and an air duct cover;

The heat conduction member is fixedly connected with the main board module and is abutted against a main heat generation source of the main board module; the main board fan is fixedly connected with the heat conduction member, and an air inlet of the main board fan is opposite to the main board cold air inlet; the heat conducting member is provided with an air inlet and an air outlet, the air inlet of the heat conducting member is abutted against the air outlet of the main board fan, and the air outlet of the heat conducting member is abutted against the main board hot air outlet;

The display card fan is arranged on the display card module, an air inlet of the display card fan is opposite to the display card cold air inlet, and an air outlet path formed by an air outlet of the display card fan sequentially passes through a main heating source of the display card module and the display card hot air outlet; the air duct cover is covered with the main heating source of the display card fan and the display card module, the air duct cover is provided with an air inlet and an air outlet, the air inlet of the air duct cover is used as the air inlet of the display card fan, and the air outlet of the air duct cover is abutted to the display card hot air outlet.

In the heat dissipation system provided by the application, the heat conduction member comprises a heat conduction plate, an abutting piece and a radiator;

The heat conducting plate is fixedly connected with the main board module; the abutting piece is clamped between the heat conducting plate and a main heat generating source of the main board module; the main board fan and the radiator are arranged on the heat conducting plate;

the radiator is provided with an air inlet and an air outlet, the air inlet of the radiator is abutted against the air outlet of the main board fan, and the air outlet of the radiator is abutted against the main board hot air outlet.

In the heat dissipation system provided by the application, a plurality of heat dissipation fins are arranged in the heat dissipation device, and are arranged in parallel and uniformly; and a channel formed between two adjacent radiating fins is parallel to the air outlet path of the main board fan.

In the heat dissipation system provided by the application, the shell is provided with a plurality of heat dissipation holes; and/or the main board hot air outlet is arranged on the upper side wall of the shell, and the display card hot air outlet is arranged on the lower side wall of the shell.

In the heat dissipation system provided by the application, a part of the plurality of heat dissipation holes are adjacently arranged at the display card hot air outlet; the air duct cover is provided with an air suction port close to the air outlet;

The heat dissipation system further comprises a display card air suction fan, an air inlet of the display card air suction fan is abutted against an air suction inlet of the air duct cover, and an air outlet of the display card air suction fan is opposite to a part, adjacent to the display card hot air outlet, of the plurality of heat dissipation holes.

In the heat dissipation system provided by the application, the display card module is also provided with the heat collecting piece, and the heat collecting piece is arranged between the main heat generating source of the display card module and the air suction inlet of the air duct cover.

In the heat dissipation system provided by the application, the air outlet intensity of the main board fan is larger than that of the display card fan;

The heat dissipation system further comprises an auxiliary air pipe; the auxiliary air pipe is characterized in that the air inlet is arranged at the air outlet of the main board fan, and the air outlet is arranged at the air inlet of the display card fan.

In the heat dissipation system provided by the application, the air outlet of the auxiliary air pipe faces to the middle part of the back surface of the blade of the graphics card fan, and the back surface of the blade of the graphics card fan refers to the surface facing to the rotation direction when the blade rotates.

In the heat dissipation system provided by the application, the heat dissipation system further comprises an air inlet cover; the air inlet cover is clamped between the air duct cover and the display card cold air inlet;

The air inlet cover is provided with a through hole, and the through hole is used for arranging the auxiliary air pipe.

In a second aspect, the present application provides an all-in-one machine, including a heat dissipation system as set forth in any one of the first aspects.

In the technical scheme provided by the application, the heat generated by the main heating source of the main board module can be conducted to the heat conducting component, so that the heat is directly blown out of the shell by the main board fan, and the temperature of the main board module can be effectively reduced. On the other hand, the display card fan can directly blow out the heat generated by the main heating source of the display card module outside the shell, so that the temperature of the display card module can be effectively reduced. Therefore, the application can effectively improve the heat dissipation capacity of the integrated machine.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of an integrated machine provided by chinese patent CN 219658112U;

FIG. 2 is an exploded view of an embodiment of an integrated machine;

FIG. 3 is a schematic diagram of a heat dissipation system according to an embodiment of the present application;

FIG. 4 is an exploded view of a motherboard module according to an embodiment of the present application;

FIG. 5 is an exploded view of a display card module according to an embodiment of the present application;

FIG. 6 is a schematic cross-sectional view of a heat sink according to an embodiment of the application;

FIG. 7 is a schematic view of a structure of a housing according to an embodiment of the present application;

FIG. 8 is a schematic diagram of another embodiment of a heat dissipation system according to the present application;

fig. 9 is an enlarged schematic view of the structure of the portion a in fig. 8.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

The flow diagrams depicted in the figures are merely illustrative and not necessarily all of the elements and operations/steps are included or performed in the order described. For example, some operations/steps may be further divided, combined, or partially combined, so that the order of actual execution may be changed according to actual situations.

It is to be understood that the terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should also be understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.

Referring to fig. 2 to 9, an integrated machine provided in an embodiment of the application may include a heat dissipation system 100, a housing 200, a motherboard module 300, and a graphics card module 400. The main board module 300 and the display card module 400 are disposed in the inner cavity of the housing 200, and in short, the main board module 300 and the display card module 400 are disposed inside the housing 200. Illustratively, the motherboard module 300 may be connected to the graphics module 400 through a graphics slot. Illustratively, the motherboard module 300 and the graphics card module 400 may be mounted on a mounting board in an all-in-one machine. The main board cold air inlet 210, the main board hot air outlet 220, the display card cold air inlet 230 and the display card hot air outlet 240 are arranged on the shell 200. Illustratively, the motherboard cold air inlet 210 and the graphics card cold air inlet 230 may each be composed of a plurality of heat dissipation holes. For example, the motherboard hot air outlet 220 and the graphics card hot air outlet 240 may each be an open design, and the specific shape may be set according to the heat dissipation system 100. It should be noted that, when the integrated machine performs 3D display, the main heat generation is generated by the motherboard module 300 and the graphics card module 400, so the heat dissipation system 100 in the embodiment of the application mainly aims at heat dissipation of the two modules.

In some embodiments, as shown in fig. 3, the heat dissipation system 100 may include a main board fan 110, a heat conductive member 120, a graphic card fan 130, and an air duct cover 140.

Specifically, as shown in fig. 4, the heat conducting member 120 is fixedly connected to the motherboard module 300 and abuts against a main heat source 310 of the motherboard module 300, where the main heat source 310 refers to a component with the largest heat generation amount on the motherboard module 300, and this component is typically a central processing unit (Central Processing Unit, CPU) of the motherboard module 300. It is understood that the heat conductive member 120 has a function of conducting heat, and thus heat generated from the main heat generating source 310 can be conducted to the heat conductive member 120.

The main board fan 110 is fixedly connected with the heat conductive member 120, and an air inlet of the main board fan 110 is opposite to the main board cold air inlet 210, so that external cold air can enter the main board fan 110 from the main board cold air inlet 210. Illustratively, the main board fan 110 may be a turbo fan. The heat conducting member 120 is provided with an air inlet and an air outlet, the air inlet of the heat conducting member 120 is abutted against the air outlet of the main board fan 110, and the air outlet of the heat conducting member 120 is abutted against the main board hot air outlet 220. Therefore, the cold air blown out by the main board fan 110 directly enters the air inlet of the heat conducting member 120, and is blown from the air inlet to the air outlet to become hot air, so that heat in the heat conducting member 120 is taken away; in addition, since the air outlet abuts against the main board hot air outlet 220, the hot air is directly discharged out of the housing 200 (i.e. out of the integrated machine), so that heat is not remained in the inner cavity of the housing 200.

Specifically, the graphics fan 130 is disposed on the graphics module 400, and an air inlet of the graphics fan 130 faces the graphics air inlet 230, so that external cold air can enter the graphics fan 130 from the graphics air inlet 230. Illustratively, the graphics fan 130 may be a turbo fan. The air outlet path formed by the air outlet of the graphic card fan 130 sequentially passes through the main heat source 410 of the graphic card module 400 and the graphic card hot air outlet 240, that is, the air blown out by the graphic card fan 130 sequentially passes through the main heat source 410 and the graphic card hot air outlet 240, wherein, as shown in fig. 5, the main heat source 410 refers to the component with the largest heat productivity on the graphic card module 400, and this component is usually the graphics processor (Graphics Processing Unit, GPU) of the graphic card module 400.

The air duct cover 140 covers the display card fan 130 and the main heat source 410 of the display card module 400, and in short, the display card fan 130 and the main heat source 410 are covered by the air duct cover 140. The air duct cover 140 is provided with an air inlet and an air outlet, the air inlet of the air duct cover 140 is used as the air inlet of the graphics card fan 130, and the air outlet of the air duct cover 140 is abutted against the graphics card hot air outlet 240, so that cold air blown out by the graphics card fan 130 is directly discharged out of the casing 200 (i.e. out of the integrated machine) from the air outlet of the air duct cover 140 after being taken away by the main heat generating source 410 to become hot air, so that heat cannot remain in the inner cavity of the casing 200. Illustratively, the air inlet of the air duct cover 140 may be provided according to the shape of the graphic card fan.

In this way, on the one hand, the heat generated by the main heat source 310 of the motherboard module 300 can be conducted to the heat conducting member 120, so that the motherboard fan 110 directly blows the heat out of the housing 200, thereby effectively reducing the temperature of the motherboard module 300. On the other hand, the graphics card fan 130 can directly blow the heat generated by the main heat source 410 of the graphics card module 400 out of the housing 200, so that the temperature of the graphics card module 400 can be effectively reduced. Therefore, the embodiment of the application can effectively improve the heat radiation capacity of the integrated machine; in addition, the heat dissipation holes are not required to be arranged on the shell like the related art, and the structural strength of the shell is not affected.

In some embodiments, as shown in fig. 4, the heat conductive member 120 may include a heat conductive plate 121, an abutment 122, and a heat sink 123. In the embodiment of the application, the heat conducting plate 121, the abutting piece 122 and the heat sink 123 all have good heat conducting capability.

Specifically, the heat conductive plate 121 is fixedly connected to the main board module 300, for example, by screws, and is fixed to the main board module 300. The abutting piece 122 is sandwiched between the heat-conducting plate 121 and the main heat-generating source 310 of the motherboard module 300, and the motherboard fan 110 and the heat sink 123 are disposed on the heat-conducting plate 121. Therefore, the heat generated by the main heat source 310 is conducted to the contact 122, then to the heat conducting plate 121, and finally to the heat sink 123. The radiator 123 is provided with an air inlet and an air outlet, the air inlet of the radiator 123 is abutted against the air outlet of the main board fan 110, and the air outlet of the radiator 123 is abutted against the main board hot air outlet 220. Therefore, the heat conducted to the heat sink 123 is directly blown out of the integrated machine by the motherboard fan 110, so as to effectively reduce the temperature of the motherboard module 300. In some embodiments, fig. 6 is a cross-sectional view of the heat sink 123, in which a plurality of heat sinks 1231 are disposed in the heat sink 123, the plurality of heat sinks 1231 are disposed in parallel and uniformly, that is, the inside of the heat sink 123 is divided into a plurality of channels by the plurality of heat sinks 1231 disposed in parallel and uniformly. The channels formed between two adjacent cooling fins 1231 are parallel to the air outlet path of the main board fan 110, so that heat can be better blown out of the integrated machine.

In some embodiments, as shown in fig. 2 and 7, the main board hot air outlet 220 is provided at an upper side wall of the case 200, and the graphic card hot air outlet 240 is provided at a lower side wall of the case 200, that is, heat of the main board module 300 is discharged from above and heat of the graphic card module 400 is discharged from below. In some embodiments, as shown in fig. 2, the housing 200 is provided with a plurality of heat dissipation holes 250, for example, provided at a lower sidewall of the housing 200, for heat dissipation of other modules.

In some embodiments, as shown in fig. 2, a portion of the plurality of heat dissipation apertures 250 are disposed adjacent to the graphics card hot air outlet 240, e.g., above the graphics card hot air outlet 240. As shown in fig. 5, the duct cover 140 is provided with an air suction port near the air outlet. The heat dissipation system 100 may further include a graphics air suction fan 150, an air inlet of the graphics air suction fan 150 is abutted against an air suction opening of the air duct cover 140, and an air outlet of the graphics air suction fan 150 is opposite to a portion of the plurality of heat dissipation holes 250, which is adjacent to the graphics hot air outlet 240. Specifically, the display card fan 130 disposed inside thereof has a limited volume due to the limitation of the volume of the display card, resulting in a limited blowing capability of the display card fan 130. For this reason, in order to better remove the heat in the air duct cover 140, the graphic card air suction fan 150 is provided to suck the heat in the air duct cover 140 out of the case. Illustratively, the graphics card induced draft fan 150 may be a turbo fan.

In some embodiments, as shown in fig. 5, the display card module 400 is further provided with a heat collector 420, and heat generated by the main heat source 410 is transferred to the circuit board of the display card module 400, and of course, heat generated by other heat sources of the display card module 400 is also transferred to the circuit board, so that the heat collector 420 is provided to transfer heat on the circuit board to the heat collector 420. Since the main heat source 410 generates the largest amount of heat, the heat collector 420 is disposed between the main heat source 410 of the graphics card module 400 and the inlet scoop of the duct cover 140, so that the heat dissipation of the two heat sources can be well balanced, and the effect of uniform temperature can be achieved.

In some embodiments, the air-out intensity of the motherboard fan 110 is greater than the air-out intensity of the graphics card fan 130, i.e., the motherboard fan 110 is more powerful. In general, the volume of the motherboard module 300 is significantly larger than that of the graphics card module 400, so the volume of the motherboard fan 110 is also significantly larger than that of the graphics card fan 130, and thus the air-out intensity of the motherboard fan 110 is significantly larger than that of the graphics card fan 130. Based on this, as shown in fig. 8, the heat dissipation system 100 further includes an auxiliary air duct 160, an air inlet of the auxiliary air duct 160 is disposed at an air outlet of the main board fan 110, and an air outlet of the auxiliary air duct 160 is disposed at an air inlet of the graphics card fan 130. Specifically, when the integrated machine is performing 3D display, the graphics card module 400 generates a large amount of heat because it is always in a high-performance operation state to be responsible for image processing. At this time, the air-out of the graphics fan 130 may be not strong enough, and the normal operation of the graphics module 400 may be affected for a long time. Therefore, the auxiliary air duct 160 is provided in the embodiment of the present application to guide a small portion of the cold air blown out by the main board fan 110 to the air inlet of the graphics card fan 130, so as to increase the air intake of the graphics card fan 130, enhance the heat dissipation capability of the graphics card module 300, and improve the reliability.

In some embodiments, as shown in fig. 9, the air outlet of the auxiliary air duct 160 faces the middle of the back surface of the blade of the graphics fan 130, and the back surface of the blade of the graphics fan 130 refers to the surface facing the rotation direction when the blade rotates. For example, the graphics fan 130 rotates counterclockwise in the drawing, the side indicated by the arrow in the drawing is the back of the blade, and the wind from the auxiliary wind pipe 160 blows toward the middle of the back of the blade. In this way, in addition to increasing the air intake of the graphics card fan 130, it also serves to assist in blade rotation. In addition, the blade usually has the phenomenon of dust accumulation after long use, which affects the air-out strength of the graphics card fan 130, so the arrangement mode in the embodiment of the application can effectively clean the dust accumulated on the blade because the blade is blown by the air-out of the auxiliary air pipe 160. In some embodiments, as shown in fig. 9, the heat dissipation system 100 further includes an air intake cover 170, and the air intake cover 170 is sandwiched between the air duct cover 140 and the graphics card cold air inlet 230, and in particular, the air intake cover 170 is provided with a through hole for providing the auxiliary air duct 160.

While the application has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the application. Therefore, the protection scope of the application is subject to the protection scope of the claims.

Claims

1. The heat dissipation system is characterized by being applied to an integrated machine, wherein the integrated machine comprises a shell, a main board module and a display card module, wherein the main board module and the display card module are arranged in an inner cavity of the shell, and a main board cold air inlet, a main board hot air outlet, a display card cold air inlet and a display card hot air outlet are formed in the shell;

2. The heat dissipation system of claim 1, wherein the thermally conductive member comprises a thermally conductive plate, an abutment, and a heat sink;

3. The heat dissipating system of claim 2, wherein a plurality of heat sinks are disposed within the heat sink, the plurality of heat sinks being disposed in parallel and uniformly; and a channel formed between two adjacent radiating fins is parallel to the air outlet path of the main board fan.

4. The heat dissipation system of claim 1, wherein the housing is provided with a plurality of heat dissipation apertures; and/or the main board hot air outlet is arranged on the upper side wall of the shell, and the display card hot air outlet is arranged on the lower side wall of the shell.

5. The heat dissipation system of claim 4, wherein a portion of the plurality of heat dissipation holes are disposed adjacent to the graphics card hot air outlet; the air duct cover is provided with an air suction port close to the air outlet;

6. The heat dissipation system of claim 5, wherein the graphics module is further provided with a heat collector, the heat collector being disposed between a primary heat source of the graphics module and an intake of the duct cover.

7. The heat dissipation system of any one of claims 1-6, wherein an air out intensity of the motherboard fan is greater than an air out intensity of the graphics fan;

8. The heat dissipating system of claim 7, wherein the air outlet of the auxiliary air duct is directed toward a middle of a back surface of the blade of the graphics fan, and the back surface of the blade of the graphics fan is a surface facing a rotation direction when the blade rotates.

9. The heat dissipation system of claim 7, further comprising an air intake shroud; the air inlet cover is clamped between the air duct cover and the display card cold air inlet;

10. An all-in-one machine comprising a heat dissipation system as claimed in any one of claims 1-9.