CN116904957B - Magnetron sputtering and electron beam composite coating device - Google Patents
Magnetron sputtering and electron beam composite coating device Download PDFInfo
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- CN116904957B CN116904957B CN202311180204.3A CN202311180204A CN116904957B CN 116904957 B CN116904957 B CN 116904957B CN 202311180204 A CN202311180204 A CN 202311180204A CN 116904957 B CN116904957 B CN 116904957B
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- 238000000576 coating method Methods 0.000 title claims abstract description 65
- 239000011248 coating agent Substances 0.000 title claims abstract description 63
- 238000001755 magnetron sputter deposition Methods 0.000 title claims abstract description 41
- 238000010894 electron beam technology Methods 0.000 title claims abstract description 25
- 239000002131 composite material Substances 0.000 title claims abstract description 24
- 238000001704 evaporation Methods 0.000 claims abstract description 25
- 230000007246 mechanism Effects 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims abstract description 17
- 239000013077 target material Substances 0.000 claims description 53
- 238000001816 cooling Methods 0.000 claims description 39
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 28
- 230000017525 heat dissipation Effects 0.000 claims description 24
- 230000008020 evaporation Effects 0.000 claims description 19
- 238000010521 absorption reaction Methods 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 10
- 238000004804 winding Methods 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 4
- 239000007888 film coating Substances 0.000 abstract description 11
- 238000009501 film coating Methods 0.000 abstract description 11
- 238000012545 processing Methods 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000001771 vacuum deposition Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 112
- 239000000463 material Substances 0.000 description 19
- 230000000694 effects Effects 0.000 description 16
- 238000007747 plating Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 239000007789 gas Substances 0.000 description 12
- 239000002344 surface layer Substances 0.000 description 12
- 230000008569 process Effects 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 239000002699 waste material Substances 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000003763 carbonization Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000005086 pumping Methods 0.000 description 4
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- 230000003213 activating effect Effects 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 210000005056 cell body Anatomy 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000000165 glow discharge ionisation Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
- C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
- C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses a magnetron sputtering and electron beam composite coating device, which belongs to the technical field of vacuum coating equipment and comprises a vacuum cavity, wherein a conveying assembly, an evaporating chamber and a coating assembly are arranged in the vacuum cavity; the evaporating chamber is arranged at the bottom of the vacuum cavity and is provided with a rotatable target base for placing a target; the film coating component comprises a magnetron sputtering mechanism and an electron gun, wherein the magnetron sputtering mechanism is arranged in the middle of the vacuum cavity and is used for forming a metal film on the surface of the flexible base film; the electron gun is arranged opposite to the target base and is used for bombarding the target to volatilize and deposit the target on the surface of the metal film. The invention has simple structure and low equipment cost, adopts the cooperation of the electron beam coating and the magnetron sputtering technology, improves the temperature resistance of the flexible base film, reduces the stress of the flexible base film, can reduce the heat generated in the processing technology, and has higher coating efficiency and higher yield.
Description
Technical Field
The invention belongs to the technical field of vacuum coating equipment, and particularly relates to a magnetron sputtering and electron beam composite coating device.
Background
At present, the film plating of the flexible material is generally single-sided film plating by adopting a single mode such as evaporation film plating or sputtering film plating. The evaporation coating is to heat and gasify the coating material in vacuum state to deposit and form film, and the coating speed is high and the efficiency is high. The sputtering coating is to bombard the target material by glow discharge ionization gas to sputter material particles so as to form a film layer, and the film layer has good stability and uniformity and compact film layer. But adopts a single electron beam evaporation coating, the generated temperature is higher, and the problems of carbonization, wrinkling and the like of a base film are easily caused. If a single magnetron sputtering process is adopted, the plating rate is slower, the production efficiency is low, the cost is high, and the current requirement of the lithium battery composite current collector cannot be met.
The invention application with the application number of WO2003100111A1 relates to a method and equipment for producing porous metal by using a composite physical vapor deposition technology, and any two or three methods of vapor deposition, sputtering or ion plating are combined together to have good performance. The coating is uniform, and is suitable for high-speed PVD equipment and high-speed electrodeposition equipment. The equipment comprises a winding chamber, a winding roller, a measuring roller, a magnetron sputtering chamber, a magnetron target, an arc evaporation chamber, an arc evaporation target, a separator, a cooling water jacket, a special processing chamber, a guide roller, a release chamber, a demolding roller and auxiliary components thereof, as well as a magnetron embedded target and a water-cooling separator of an electroplating chamber matched with the whole equipment. The invention overcomes the defect that the prior art only adopts a single technology, and has good technical characteristics.
However, as in most of the existing coating equipment, the temperature is high in the processing process, and generated heat is easy to cause carbonization of a base film, generation of wrinkles and the like, so that the product yield is affected.
Disclosure of Invention
The invention aims to provide a magnetron sputtering and electron beam composite coating device with a simple structure, which can improve the temperature resistance of a flexible base film, reduce material stress, avoid carbonization or wrinkling of the flexible base film caused by overhigh temperature in the coating process, improve the coating efficiency and ensure the product yield.
The technical scheme adopted by the invention for achieving the purpose is as follows:
The magnetron sputtering and electron beam composite coating device comprises a vacuum cavity, wherein a conveying component for conveying a flexible base film, an evaporation chamber for accommodating a target material and a coating component for coating the surface of the flexible base film are arranged in the vacuum cavity;
The evaporating chamber is arranged at the bottom of the vacuum cavity and is provided with a rotatable target base, and the target base is used for placing target materials, such as metal copper, metal aluminum or other alloys;
the film coating component comprises a magnetron sputtering mechanism and an electron gun, wherein the magnetron sputtering mechanism is arranged in a film coating area in the middle of the vacuum cavity and is used for activating the surface of the flexible base film and forming a metal film on the surface of the flexible base film; the electron gun is arranged at two sides of the inside of the vacuum cavity, the emission direction of the electron gun is opposite to the target base, and the electron gun is used for bombarding the target material to volatilize the target material, and the target material can be deposited on the surface of the metal film on the surface layer of the flexible base film after volatilization.
Further, the evaporation chamber is provided with a crucible, which is located below the target base.
According to one embodiment of the invention, the conveying assembly comprises an unreeling roller, a wind-up roller and a cold roller, wherein a plurality of guide rollers are arranged on the conveying path of the flexible base film, the flexible base film is unreeled through the unreeling roller, and is finally reeled by the wind-up roller after being redirected through the plurality of guide rollers and the two cold rollers. The two cold rolls are arranged in the film plating area.
Further, two chill rolls are disposed in the transfer assembly. The evaporating chamber is provided with two crucibles, and the two crucibles are arranged corresponding to the two cold rolls of the coating area. Correspondingly, the coating component comprises two electron guns which are symmetrically arranged at two sides of the vacuum cavity, and the emitting ends of the two electron guns are in one-to-one correspondence with the target material bases on the two crucibles. In this way, the flexible base film is redirected by the guide rollers and the two cold rollers, so that the two side surfaces on the flexible base film are respectively opposite to the target bases above the two crucibles. Therefore, the upper surface and the lower surface of the flexible base film can be coated by matching the magnetron sputtering mechanism and the electron gun.
The vacuum cavity is matched with the air extracting pump and used for vacuumizing the vacuum cavity, and the vacuum cavity provides a proper processing environment for coating films, is convenient for the installation of the conveying component, the fixation of the ion source and the like. The flexible base film is conveyed to the coating area through the conveying assembly, and the upper surface and the lower surface of the flexible base film are respectively opposite to the two crucibles of the evaporation chamber through the arrangement of the conveying assembly. The two electron guns are arranged on the two sides of the vacuum cavity left and right and correspond to the target material bases above the two crucibles in the evaporating chamber.
When the flexible base film coating device is used, the conveying assembly is started first, so that the flexible base film reaches the coating area. Then, the vacuum pumping is used for carrying out vacuumizing treatment on the inside of the vacuum cavity, after the vacuum degree reaches the required standard, for example, 1 multiplied by 10 -3 Pa, a magnetron sputtering mechanism is started, argon is introduced into the inside of the vacuum cavity, the vacuum degree is maintained to be 0.5Pa, glow discharge is started under the action of the magnetron sputtering mechanism, the surface of the flexible base film is activated, and then, the material corresponding to the target material is sputtered and deposited on the surface of the base film, so that a metal film is formed. And then, the flexible base film is conveyed by the conveying component, so that the flexible base film with the metal film formed on the surface reaches the position of the coating area opposite to the crucible. And starting an electron gun, wherein the electron gun generates a large amount of energy to be accumulated on a target material base, and evaporating the surface layer of the target material, so that the evaporated target material is deposited on the surface layer of the metal film of the flexible material. After the thickness of the film reaches the requirement, the electron gun is closed, the magnetron sputtering mechanism is closed, the transmission of the flexible base film is stopped, and the film coating is finished.
By adopting the technical scheme, the magnetron sputtering mechanism and the electron gun are matched to realize one-step preparation of the lithium battery composite copper foil or the composite aluminum foil, and compared with a processing technology of independently utilizing the electron gun to coat films, the temperature resistance of the flexible base film is improved, so that the flexible base film can bear the temperature of high-power electron beam films; compared with the single use of magnetron sputtering coating, the equipment cost is low and the coating efficiency is higher. Moreover, the composite coating device is used, the rotatable target material base is used for placing the target material, and the electron gun is used for bombarding the surface on the target material, so that the target material is evaporated in a small range, and the heat generated in the deposition process is less compared with molten copper liquid contained in a large-area crucible, thereby being beneficial to reducing the damage to the flexible base film.
According to one embodiment of the invention, the evaporation chamber is provided with a crucible, which is located below the target base; the side wall of the crucible is internally provided with a cooling pipe which is spirally and circumferentially arranged; the inner wall of the crucible is provided with a first groove body which is vertically arranged and a second groove body which is arranged in a surrounding manner.
Therefore, a water-cooling heat exchange area is formed below the target base by utilizing the crucible, so that when the electron gun acts on and rotates the surface layer of the target, the temperature of the local area of the surface layer of the target is increased and evaporated; because the water cooling pipe is arranged in the crucible, the temperature of the local area of the crucible is low, and the target material can be rapidly cooled along with the rotation of the target material base.
The first groove body and the second groove body are arranged in the crucible, so that the surface area can be enlarged, and the heat exchange efficiency between the internal water cooling pipe and the external gas of the crucible is improved. Utilize the cooperation of first cell body and second cell body, make the inside gas of crucible be in lower temperature all the time, and then guarantee that the target material can cool down in the short time, and then prevent the inside high temperature of vacuum cavity, reduce the damage to flexible basal membrane.
According to one embodiment of the invention, the crucible is of a barrel-type structure; the outside cover of crucible is equipped with first gear, and the outer fringe meshing of first gear is connected the second gear, and the second gear links to each other with driving motor's output shaft. Thus, the crucible can be driven to rotate by the driving motor.
Further, the crucible rotates about an axis in the vertical direction; the target base rotates around the axis in the horizontal direction.
Further, the water inlet end and the water outlet end of the cooling pipe are matched with a rotary joint, and the rotary joint is arranged below the crucible.
Therefore, the rotating crucible is utilized to promote the gas above the crucible to form rotational flow, so that the target material bombarded by the electron gun is promoted to move towards the coating area, on one hand, the coating efficiency is improved, the coating effect is ensured, on the other hand, the utilization rate of the target material is improved, and the material waste is avoided. And, form the gas whirl in the below of target base, can improve the heat exchange efficiency to the target through the gas flow.
In addition, the inner wall of the crucible is provided with a vertical first groove body and an annular second groove body, and the sputtering range of the target material is limited. Because the target material base rotates, the target material generated after the part is bombarded by the electron gun falls, the first groove body and the second groove body can be used for accommodating and intercepting the part of target material, and the part of target material is prevented from diffusing to the outer space of the crucible again due to the rotation of the crucible, so that the combination effect of the target material and the flexible base film is controlled, the part of target material is prevented from rising again to influence the local density of the target material in the film coating area, and the roughness of the film coating film layer is reduced. And moreover, the target can be accommodated and intercepted by utilizing the first groove body and the second groove body, so that the waste of materials caused by splashing of the target to a non-target area can be avoided, and the collection and cleaning of the materials are also facilitated.
According to one embodiment of the invention, the middle part of the target base is provided with a rotating shaft, and the rotating shaft is matched with the driving motor and is used for driving the target base to rotate.
An annular heat dissipation cavity is arranged in the target base, and the heat dissipation cavity is arranged around the rotating shaft; the heat exchange piece is arranged in the heat dissipation cavity, the heat absorption end of the heat exchange piece is used for being attached to the inner wall of the target base, and the heat dissipation end of the heat exchange piece is provided with the water cooling pipe.
Therefore, a cold water structure is arranged in the target base, and the effect of rapid heat dissipation is achieved by utilizing the heat dissipation piece, so that heat in the region matched with the electron beam on the surface layer of the target can be absorbed by the heat exchange piece and rapidly transferred to the direction of the rotating shaft, and the temperature is reduced by utilizing the water cooling pipe in the process, so that the stability of the whole temperature of the target is maintained, and the influence of the overhigh temperature near the target or the target base on the flexible base film and the like is avoided.
Further, the inside configuration of pivot has the connection cavity, and the water inlet end and the play water end of water-cooled tube all are located the inside of connection cavity to be linked together with external water cooling system through the connecting pipe.
Further, the heat exchange piece comprises a plurality of heat absorption sheets distributed around the circumference of the rotating shaft in an array mode, the heat absorption ends of the heat absorption sheets are far away from the rotating shaft and are attached to the inner wall of the heat dissipation cavity, a plurality of grooves are formed in one ends, close to the rotating shaft, of the heat absorption sheets, and the water cooling pipes are spirally embedded in the grooves.
So, the heat transfer piece passes through the heat absorption piece, or the cooperation of heat absorption base member and heat dissipation lamellar body, not only can improve heat exchange efficiency, reaches the effect of quick cooling, can also improve target base spatial structure's stability to guarantee that target base rotational speed is even, thereby guarantee the bombardment angle of electron beam when it cooperates with the electron gun, thereby improve the route stability of the target of evaporation, guarantee the stability of coating film effect.
According to one embodiment of the invention, the guide roller cooperates with the auxiliary support; the auxiliary support piece comprises an auxiliary roll shaft and a support frame, wherein the two auxiliary roll shafts are symmetrically arranged at the top of the support frame, are arranged in parallel with the guide roll and are attached to the guide roll.
The auxiliary assembly is connected with the below of support frame, and auxiliary assembly's top links to each other with the support frame, and auxiliary assembly is used for providing elastic support for the support frame.
According to one embodiment of the invention, the auxiliary assembly comprises an auxiliary plate and a supporting base plate, wherein a hinged connecting rod is arranged above the auxiliary plate, and one end of the hinged connecting rod, which is far away from the auxiliary plate, is in spherical hinge connection with the supporting frame.
The auxiliary plate is connected with the supporting base plate through a connecting rod and a spring column, and one end of the connecting rod is connected with one end of the spring column.
Further, the supporting substrate is fixedly connected with the inner wall of the vacuum cavity.
Further, a guide post is arranged between the auxiliary plate and the support substrate, the auxiliary plate is sleeved outside the guide post, and the auxiliary plate can reciprocate along the axis of the guide post.
From this, set up auxiliary support piece in the side of each guide roller, the axis parallel arrangement of two auxiliary roller shafts and the guide roller of auxiliary support piece, auxiliary roller shaft is tangent with the guide roller to along with guide roller synchronous rotary motion, so the vibration energy of guide roller can be absorbed by auxiliary roller shaft at flexible base film conveying in-process, and auxiliary roller shaft articulates with auxiliary assembly through the support frame of its below, and the elastic support power consumption vibration energy of usable auxiliary assembly. In addition, the elastic supporting force of the auxiliary assembly enables the auxiliary roller to provide upward elastic supporting force for the guide roller, so that the guide roller is ensured to be in close contact with the flexible base film, the flexible base film is ensured to be in a tensioning state, the flexible base film is prevented from being wrinkled, and the film coating effect is ensured.
In addition, through setting up the contact of auxiliary roller and guide roller, can be with the heat dispersion on the guide roller to on the auxiliary roller, with reduction guide roller heat, help cooling down the flexible base film of guide roller, thereby prevent flexible base film deformation. In addition, the contact of the auxiliary roller shaft and the surface of the guide roller is beneficial to removing sundries on the surface of the guide roller through friction, and the damage or wrinkling of the film contacted with the guide roller caused by the uneven surface of the guide roller is avoided.
In particular, because the two auxiliary roll shafts are symmetrically arranged on two sides of the guide roll and the middle part of the support frame is in spherical hinge joint with an auxiliary assembly, the support frame can freely adjust the angle to enable the auxiliary roll shaft to be attached to the side face of the guide roll, so that bending problems possibly occurring in long-term use of the guide roll can be avoided, and coaxiality of the guide roll is ensured.
The auxiliary assembly is arranged, the deformation of the spring column and the hinging angle of the hinging rod can be used for adjusting the connection angle and the matching state among the supporting frame, the auxiliary roller shaft and the guide roller in a certain range, so that special states such as clamping, scram and the like in the flexible base film conveying process can be handled, buffering is realized, and the flexible base film is always in a tensioning state.
Compared with the prior art, the invention has the following beneficial effects:
1. The evaporation chamber is provided with a rotatable target base, and electron beams emitted by the electron gun bombard the rotating target to evaporate the target, so that molten copper liquid contained in the large-area crucible is replaced, less heat is generated, and damage to the flexible base film is reduced;
2. A rotatable crucible is arranged below the target base, and gas above the rotatable crucible is promoted to form rotational flow by utilizing the rotatable crucible, so that the movement of the target knocked out by the electron gun towards a coating area is promoted, on one hand, the coating efficiency is improved, the coating effect is ensured, on the other hand, the utilization rate of the target is improved, and the waste of materials is avoided; the cooling pipe is arranged in the side wall of the crucible, and a water-cooling heat exchange area is formed below the target base, so that the target can be cooled rapidly; the inner wall of the crucible is provided with the first groove body vertically arranged and the second groove body circumferentially arranged, so that the heat exchange efficiency between the internal water cooling pipe and the external air of the crucible can be improved, the target material can be accommodated and intercepted, the waste of the material caused by the splashing of the target material to a non-target area can be avoided, and the collection and cleaning of the material are also facilitated;
3. The annular heat dissipation cavity is arranged in the target base, and the heat exchange piece is arranged in the annular heat dissipation cavity, so that the heat exchange efficiency can be improved, the effect of rapid cooling can be achieved, the stability of the space structure of the target base can be improved, the path stability of the evaporated target is improved, and the stability of the film coating effect is ensured;
4. The guide roller is matched with the auxiliary supporting piece, vibration energy generated in the operation process of the guide roller is absorbed and consumed by utilizing the matching of the auxiliary roller shaft and the auxiliary assembly, the close contact between the guide roller and the flexible base film is ensured, the flexible base film is ensured to be in a tensioning state, the flexible base film is prevented from being wrinkled, the bending problem possibly occurring when the guide roller is used for a long time is avoided, and the coaxiality of the guide roller is ensured.
Therefore, the magnetron sputtering and electron beam composite coating device can improve the temperature resistance of the flexible base film, reduce the material stress, avoid carbonization or wrinkling of the flexible base film caused by overhigh temperature in the coating process, improve the coating efficiency and ensure the product yield.
Drawings
FIG. 1 is a schematic view showing the overall structure of a magnetron sputtering and electron beam composite plating apparatus according to embodiment 1 of the invention;
FIG. 2 is a schematic view of an assembled structure of the crucible shown in FIG. 1;
FIG. 3 is a schematic view showing the internal structure of the crucible shown in FIG. 2;
FIG. 4 is a schematic view of the internal structure of the target base shown in FIG. 1;
FIG. 5 is an enlarged partial schematic view of portion A of FIG. 4;
Fig. 6 is a schematic diagram showing the fitting structure of the guide roller according to embodiment 2 of the present invention;
fig. 7 is a schematic structural view of the auxiliary assembly shown in fig. 6.
Reference numerals: a vacuum chamber 10; a magnetron sputtering mechanism 11; an electron gun 12; an unreeling roller 21; a wind-up roll 22; a chill roll 23; a guide roller 24; a flexible base film 25; an evaporation chamber 30; a crucible 31; a first tank 32; a second groove 33; a first gear 34; a second gear 35; a cooling tube 36; a target base 40; a rotation shaft 41; a connecting cavity 42; a heat dissipation chamber 43; a heat absorbing sheet 44; slotting 45; a water-cooled tube 46; an auxiliary roller shaft 51; a support frame 52; an auxiliary component 53; an auxiliary plate 54; a support substrate 55; a connecting rod 56; a spring post 57; and a guide post 58.
Detailed Description
The technical scheme of the invention is further described in detail below with reference to the detailed description and the accompanying drawings. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Example 1
Fig. 1 to 5 schematically show a magnetron sputtering and electron beam composite coating device according to an embodiment of the invention. As shown in the figure, the apparatus includes a vacuum chamber 10, inside which a transfer assembly for transferring a flexible base film 25, an evaporation chamber 30 for accommodating a target, and a plating assembly for plating a surface of the flexible base film 25 are provided. The flexible base film 25 may be PET, PP, PI, or the like.
Wherein, the middle part of the vacuum cavity 10 is a coating area. The conveying assembly comprises an unreeling roller 21, a reeling roller 22 and two cooling rollers 23, wherein the two cooling rollers 23 are arranged in the coating area. A plurality of guide rollers 24 are further disposed on the conveyance path of the flexible base film 25, and the flexible base film 25 is unwound by the unwinding roller 21, redirected by the plurality of guide rollers 24 and the two cooling rollers 23, and finally wound up by the winding roller 22. The cooling roller 23 is provided with a cooling passage therein, and is capable of introducing a cooling medium for cooling the flexible base film 25.
The evaporation chamber 30 is disposed at the bottom of the vacuum chamber 10, the evaporation chamber 30 is provided with two crucibles 31, a rotatable target base 40 is disposed above the crucibles 31, and the target base 40 is used for placing target materials, such as metallic copper, metallic aluminum, or other alloys. The two target bases 40 are disposed corresponding to the two chill rolls 23 in the coating area.
The coating assembly comprises a magnetron sputtering mechanism 11 and an electron gun 12, wherein the magnetron sputtering mechanism 11 is arranged in a coating area in the middle of the vacuum cavity 10 and is used for activating the surface of a part of the flexible base film 25 wound on the surface of the cold roller 23 and forming a metal film on the surface of the flexible base film; the two electron guns 12 are symmetrically arranged at two sides of the vacuum cavity 10, and the emission directions of the two electron guns 12 are opposite to the target base 40 above the two crucibles 31, so as to bombard the target material to volatilize, and the target material can be deposited on the surface of the metal film on the surface layer of the flexible base film 25 after volatilization.
In this way, the flexible base film 25 is redirected via the plurality of guide rollers 24 and the two chill rolls 23 such that the two sides on the flexible base film 25 are respectively opposite the target susceptors 40 above the two crucibles 31. Thus, the magnetron sputtering mechanism 11 and the electron gun 12 are matched to realize the coating treatment of the upper and lower surfaces of the flexible base film 25.
The vacuum cavity 10 is matched with the air pumping, and is used for vacuumizing the vacuum cavity 10, and the vacuum cavity 10 provides a proper processing environment for coating, so that the installation of a conveying assembly, the fixation of an ion source and the like are facilitated. In addition, the vacuum chamber 10 is further provided with a molecular pump, which includes a mechanical pump, a Roots pump, and a cryopump, and is used for maintaining the pressure in the vacuum chamber 10 to meet the plating requirements.
When in use, the main steps are as follows:
First, the flexible base film 25 is fixed and conveyed. A roll of flexible base film 25 of PET material 4-6 μm thick is moved, put on a take-up reel and fixed, and the flexible base film 25 is pulled and wound around a corresponding guide roller 24, chill roller 23, etc. and fixed on the take-up reel. The transfer assembly is actuated to bring the flexible base film 25 to the coating zone. The target material is copper material.
Then, the vacuum chamber 10 is subjected to a vacuum-pumping process. And vacuumizing the inside of the vacuum cavity 10 by using an air pumping pump, and introducing cooling water into the cold roller 23 after the vacuum degree reaches the required pressure of 1 multiplied by 10 -3 Pa, wherein the surface temperature of the cold roller 23 is controlled to be-30 ℃ to-20 ℃. The magnetron sputtering mechanism 11 was started, argon gas was introduced into the vacuum chamber 10, and the vacuum degree was maintained at 0.5Pa.
Then, a thin film is sputtered on the surface layer of the flexible base film 25 by the magnetron sputtering mechanism 11. The glow discharge is started under the action of the magnetron sputtering mechanism 11, the surface of the flexible base film 25 is activated, and then the material corresponding to the target material is sputtered and deposited on the surface of the base film, so that a metal film with a certain structure and composition and certain performance is formed. Thereafter, the transfer assembly transfers the flexible base film 25 so that the flexible base film 25, on which the metal thin film is formed, reaches a position of the coating region opposite to the crucible 31.
The electron gun 12 is started, the working pressure is 5 multiplied by 10 -2 Pa, the power supply power is set to 40kw, the electron gun 12 generates a large amount of electrons, the electron beams are gathered under the action of the magnetic lens, the spot beams are focused on the surface of the target material on the target material base 40, the large amount of electrons bombard the target material to melt, after reaching a certain evaporation point, the surface of the target material melts to become liquid, then becomes gaseous to volatilize, and the evaporated target material is solidified and deposited on the surface layer of the metal film on the surface of the flexible base film 25 to form the required copper film with the thickness of 1 mu m.
After the thickness of the film reaches the requirement, the electron gun 12 is closed, the magnetron sputtering mechanism 11 is closed, the transmission of the flexible base film 25 is stopped, and the film coating is finished.
By adopting the technical scheme, the magnetron sputtering mechanism 11 and the electron gun 12 are matched to realize one-step preparation of the lithium battery composite copper foil or the composite aluminum foil, and compared with a processing technology of independently utilizing the electron gun 12 to coat films, the temperature resistance of the flexible base film 25 is improved, so that the flexible base film can bear the temperature of high-power electron beam films; compared with the single use of magnetron sputtering coating, the equipment cost is low and the coating efficiency is higher. In addition, the composite coating device is used, the rotatable target material base 40 is used for placing the target material, and the electron gun 12 is used for bombarding the surface on the target material, so that the target material is evaporated in a smaller range, and less heat is generated in the deposition process compared with molten copper liquid contained in a large-area crucible, thereby being beneficial to reducing the damage to the flexible base film 25.
Specifically, the crucible 31 has a barrel-type structure; the outside cover of crucible 31 is equipped with first gear 34, and the outer fringe meshing of first gear 34 is connected second gear 35, and second gear 35 links to each other with driving motor's output shaft. In this way, the crucible 31 can be driven to rotate by the driving motor. The side wall of the crucible 31 is internally provided with a cooling pipe 36, the water inlet end and the water outlet end of the cooling pipe 36 are matched with a rotary joint, and the rotary joint is arranged below the crucible 31. The cooling pipe 36 is spirally and circumferentially arranged in the side wall of the crucible 31, the water pressure of the cooling water introduced into the cooling pipe 36 is 0.1Mpa-0.5Mpa, the flow is 10L/s-20L/s, and the temperature is 20-25 ℃. Further, the inner wall of the crucible 31 is provided with a first tank 32 disposed vertically and a second tank 33 disposed circumferentially.
When the electron gun 12 acts on the surface layer of the rotating target, the temperature of a local area of the surface layer of the target is increased and evaporated; along with the rotation of the target base 40, the region with higher temperature gradually approaches the crucible 31 below, and the temperature of the local region of the crucible 31 is low due to the water cooling pipe 46 arranged inside the crucible 31, so that the target can be rapidly cooled.
The first groove 32 and the second groove 33 are arranged in the crucible 31, so that the surface area can be enlarged, and the heat exchange efficiency between the internal water cooling pipe 46 and the external air of the crucible 31 is improved. Because the target material is matched with the rotating target material base 40, the time that the high-temperature area on the target material is close to the crucible 31 in the film plating process is short, and the gas in the crucible 31 is always at a lower temperature by utilizing the matching of the first groove body 32 and the second groove body 33, so that the target material can be cooled in a short time, the temperature in the vacuum cavity 10 is prevented from being too high, and the damage to the flexible base film 25 is reduced.
The crucible 31 rotates around the axis in the vertical direction; the target base 40 rotates about a horizontal axis. The rotating crucible 31 is utilized to promote the gas above the crucible to form rotational flow so as to help promote the target material bombarded by the electron gun 12 to move towards the coating area, so that on one hand, the coating efficiency is improved, the coating effect is ensured, on the other hand, the utilization rate of the target material is improved, and the waste of materials is avoided. In addition, a gas swirling flow is formed under the target base 40, and the heat exchange efficiency with respect to the target can be improved by the gas flow.
In addition, the inner wall of the crucible 31 is provided with the first vertical groove 32 and the second annular groove 33, which are also helpful to limit the sputtering range of the target material. Due to the rotation of the target base 40, the target generated after the bombardment of the target base by the electron gun 12 falls, the first groove body 32 and the second groove body 33 can accommodate and intercept the target, and prevent the target from diffusing to the external space of the crucible 31 again due to the rotation of the crucible 31, thereby being beneficial to controlling the combination effect of the target and the flexible base film 25, avoiding the local density of the target in the film plating area from being influenced by the upward lifting of the target, and reducing the roughness of the film plating layer. Moreover, the first groove body 32 and the second groove body 33 can be used for accommodating and intercepting the target, so that the waste of materials caused by splashing of the target to a non-target area can be avoided, and the collection and cleaning of the materials are facilitated.
A rotating shaft 41 is arranged in the middle of the target base 40, and the rotating shaft 41 is matched with a driving motor and is used for driving the target base 40 to rotate.
An annular heat dissipation cavity 43 is arranged in the target base 40, and the heat dissipation cavity 43 is arranged around the rotating shaft 41; the heat exchange member is disposed in the heat dissipation chamber 43, and the heat absorption end of the heat exchange member is used for being attached to the inner wall of the target base 40, and the water cooling tube 46 is disposed at the heat dissipation end of the heat exchange member.
Therefore, a cold water structure is arranged in the target base 40, and a rapid heat dissipation effect is achieved by utilizing the heat dissipation member, so that heat in the region matched with the electron beam on the surface layer of the target can be absorbed by the heat exchange member and rapidly transferred to the direction of the rotating shaft 41, and the temperature is reduced by utilizing the water cooling pipe 46 in the process, so that the stability of the whole temperature of the target is maintained, and the influence on the flexible base film 25 and the like due to overhigh temperature near the target or the target base 40 is avoided.
The heat exchange member comprises a plurality of heat absorption sheets 44 distributed around the circumference of the rotating shaft 41 in an array manner, the heat absorption ends of the heat absorption sheets 44 are far away from the rotating shaft 41 and are attached to the inner wall of the heat dissipation cavity 43, a plurality of grooves 45 are formed in one end, close to the rotating shaft 41, of the heat absorption sheets 44, and the water cooling pipes 46 are spirally embedded in the grooves 45.
The heat exchange efficiency can be improved through the arrangement of the heat absorption sheet 44, the effect of rapid cooling is achieved, and the stability of the space structure of the target base 40 can be improved, so that the rotating speed of the target base 40 is ensured to be uniform, the bombardment angle of electron beams is ensured when the electron gun 12 is matched with the target base, the path stability of the evaporated target is improved, and the stability of the film coating effect is ensured.
In addition, a connecting cavity 42 is disposed in the rotating shaft 41, and the water inlet end and the water outlet end of the water cooling pipe 46 are both disposed in the connecting cavity 42 and are communicated with an external water cooling system through connecting pipes.
In other embodiments, the heat absorbing end of the heat exchange member includes a cylindrical heat absorbing substrate, the heat dissipating end of the heat exchange member includes a heat dissipating sheet disposed inside the heat absorbing substrate, the heat dissipating sheet is disposed around the outside of the rotating shaft 41, and the heat dissipating sheet is spiral, and an outer edge of the heat dissipating sheet is disposed in a fitting manner with an inner wall of the heat dissipating substrate; the water cooling pipe 46 is attached to the surface of the fin.
In other embodiments, one end of the rotating shaft 41 may be further configured with a fan, and the fan is disposed outside the target base 40. In this way, the fan can be used to increase the flow of the air flow nearby and adjust the flow direction of the air flow during the rotation of the target base 40, so as to improve the heat dissipation effect and promote the evaporated target to move towards the coating area.
Example 2
Fig. 6 to 7 schematically show the configuration of the guide roller 24 of the magnetron sputtering and electron beam composite plating device according to another embodiment of the invention, which is different from example 1 in that:
the guide roller 24 cooperates with the auxiliary support; the auxiliary support comprises an auxiliary roll shaft 51 and a support frame 52, wherein the two auxiliary roll shafts 51 are symmetrically arranged at the top of the support frame 52, and the two auxiliary roll shafts 51 are arranged in parallel with the guide roll 24 and are attached to the guide roll 24.
An auxiliary component 53 is connected to the lower part of the supporting frame 52, the top of the auxiliary component 53 is connected to the supporting frame 52, and the auxiliary component 53 is used for providing elastic support for the supporting frame 52. The auxiliary assembly 53 includes an auxiliary plate 54 and a support base plate 55, and a hinge link is disposed above the auxiliary plate 54, and one end of the hinge link, which is remote from the auxiliary plate 54, is spherically hinged to the support frame 52.
The auxiliary plate 54 is connected to the support substrate 55 through a connection rod 56 and a spring post 57, and one end of the connection rod 56 is connected to one end of the spring post 57. The support substrate 55 may be fixedly coupled with the inner wall of the vacuum chamber 10. A guide post 58 is disposed between the auxiliary plate 54 and the support substrate 55, the auxiliary plate 54 is fitted over the guide post 58, and the auxiliary plate 54 is movable back and forth along the axis of the guide post 58.
Thereby, an auxiliary support is arranged at the side of each guide roller 24, two auxiliary roller shafts 51 of the auxiliary support and the axis of the guide roller 24 are arranged in parallel, the auxiliary roller shafts 51 are tangential to the guide roller 24 and synchronously rotate along with the guide roller 24, so that the vibration energy of the guide roller 24 can be absorbed by the auxiliary roller shafts 51 in the process of conveying the flexible base film 25, and the auxiliary roller shafts 51 are hinged with the auxiliary assembly 53 through the support frame 52 below the auxiliary roller shafts, and the vibration energy can be consumed by utilizing the elastic supporting force of the auxiliary assembly 53. In addition, the elastic supporting force of the auxiliary component 53 enables the auxiliary roller shaft 51 to provide an upward elastic supporting force for the guide roller 24, so that the guide roller 24 is ensured to be in close contact with the flexible base film 25, the flexible base film 25 is ensured to be in a tensioning state, the flexible base film 25 is prevented from being wrinkled, and the coating effect is ensured.
In addition, the heat on the guide roller 24 can be dispersed to the auxiliary roller shaft 51 by providing the contact between the auxiliary roller shaft 51 and the guide roller 24, so as to reduce the heat of the guide roller 24, and help to cool the flexible base film 25 passing through the guide roller 24, thereby preventing the flexible base film 25 from deforming. In addition, the contact of the auxiliary roller shaft 51 with the surface of the guide roller 24 helps to remove foreign matters on the surface of the guide roller 24 by friction, and avoids breakage or wrinkling of the film in contact with the surface of the guide roller 24 due to uneven surface.
In particular, since the two auxiliary roll shafts 51 are symmetrically disposed at both sides of the guide roll 24, and the middle part of the supporting frame 52 is spherically hinged with the auxiliary assembly 53, the supporting frame 52 can freely adjust the angle to make the auxiliary roll shafts 51 attach to the side of the guide roll 24, so that bending problems possibly occurring in long-term use of the guide roll 24 can be avoided, and coaxiality of the guide roll 24 is ensured.
The auxiliary assembly 53 is arranged, and the connection angle and the matching state among the support frame 52, the auxiliary roller shaft 51 and the guide roller 24 can be adjusted within a certain range through the deformation of the spring column 57 and the hinging angle of the hinging rod, so that special states such as blocking, scram and the like in the conveying process of the flexible base film 25 can be dealt with, buffering is realized, and the flexible base film 25 is ensured to be in a tensioning state all the time.
Conventional operations in the operation steps of the present invention are well known to those skilled in the art, and are not described herein.
While the foregoing embodiments have been described in detail in connection with the embodiments of the invention, it should be understood that the foregoing embodiments are merely illustrative of the invention and are not intended to limit the invention, and any modifications, additions, substitutions and the like made within the principles of the invention are intended to be included within the scope of the invention.
Claims (6)
1. The magnetron sputtering and electron beam composite coating device comprises a vacuum cavity (10), a transmission component, an evaporation chamber (30) and a coating component are arranged in the vacuum cavity, the transmission component is used for transmitting a flexible base film (25), and is characterized in that,
The evaporation chamber (30) is arranged at the bottom of the vacuum cavity (10), the evaporation chamber (30) is provided with a rotatable target base (40), and the target base (40) is used for placing a target;
The coating assembly comprises a magnetron sputtering mechanism (11) and an electron gun (12), wherein the magnetron sputtering mechanism (11) is arranged in the middle of the vacuum cavity (10) and is used for forming a metal film on the surface of the flexible base film (25); the electron gun (12) is arranged opposite to the target base (40) and is used for bombarding target materials to volatilize and deposit on the surface of the metal film;
The evaporation chamber (30) is provided with a crucible (31), and the crucible (31) is positioned below the target base (40);
A cooling pipe (36) is arranged in the side wall of the crucible (31); the inner wall of the crucible (31) is provided with a first groove body (32) which is vertically arranged and a second groove body (33) which is circumferentially arranged; the crucible (31) is of a barrel-shaped structure; the crucible (31) rotates around the axis in the vertical direction, and the target base (40) rotates around the axis in the horizontal direction;
A rotating shaft (41) is arranged in the middle of the target base (40) and used for driving the target base (40) to rotate; an annular heat dissipation cavity (43) is arranged in the target base (40), and the heat dissipation cavity (43) is arranged around the rotating shaft (41); a heat exchange piece is arranged in the heat dissipation cavity (43), the heat absorption end of the heat exchange piece is used for being attached to the inner wall of the target base (40), and a water cooling pipe (46) is arranged at the heat dissipation end of the heat exchange piece;
The heat exchange piece comprises a plurality of heat absorption sheets (44) distributed around the circumference of the rotating shaft (41) in a circumferential array mode, the heat absorption ends of the heat absorption sheets (44) are far away from the rotating shaft (41) and are attached to the inner wall of the heat dissipation cavity (43), a plurality of grooves (45) are formed in one ends, close to the rotating shaft (41), of the heat absorption sheets (44), and the water cooling pipes (46) are spirally embedded in the grooves (45).
2. The magnetron sputtering and electron beam composite coating device according to claim 1, wherein,
The conveying assembly comprises an unreeling roller (21), a winding roller (22) and a cold roller (23), wherein a plurality of guide rollers (24) are arranged on a conveying path of a flexible base film (25), the flexible base film (25) is unreeled through the unreeling roller (21), and is wound by the winding roller (22) after being redirected through the guide rollers (24) and the two cold rollers (23).
3. The magnetron sputtering and electron beam composite coating device according to claim 1, wherein,
The outside cover of crucible (31) is equipped with first gear (34), the outer fringe meshing of first gear (34) is connected second gear (35), second gear (35) links to each other with driving motor's output shaft.
4. The magnetron sputtering and electron beam composite coating device according to claim 1, wherein,
The rotating shaft (41) is matched with the driving motor.
5. The magnetron sputtering and electron beam composite coating device according to claim 2, wherein,
The guide roller (24) is matched with the auxiliary supporting piece;
The auxiliary support piece comprises an auxiliary roll shaft (51) and a support frame (52), wherein the two auxiliary roll shafts (51) are symmetrically arranged at the top of the support frame (52), and the two auxiliary roll shafts (51) are arranged in parallel with the guide roll (24) and are attached to the guide roll (24);
An auxiliary assembly (53) is connected to the lower portion of the supporting frame (52), the top of the auxiliary assembly (53) is connected with the supporting frame (52), and the auxiliary assembly (53) is used for providing elastic support for the supporting frame (52).
6. The magnetron sputtering and electron beam composite coating device according to claim 5, wherein,
The auxiliary assembly (53) comprises an auxiliary plate (54) and a supporting base plate (55), a hinged connecting rod is arranged above the auxiliary plate (54), and one end of the hinged connecting rod, which is far away from the auxiliary plate (54), is in spherical hinge connection with the supporting frame (52);
The auxiliary plate (54) is connected with the supporting substrate (55) through a connecting rod (56) and a spring column (57), and one end of the connecting rod (56) is connected with one end of the spring column (57).
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Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11296854A (en) * | 1998-04-10 | 1999-10-29 | Victor Co Of Japan Ltd | Manufacturing device of magnetic recording medium |
| KR20070003344A (en) * | 2005-07-01 | 2007-01-05 | 주식회사 에스에프에이 | A sputtering source |
| KR20080099418A (en) * | 2007-05-09 | 2008-11-13 | (주)맥스필름 | The deposition method of metal thin film on polymer substrate by magnetron roll sputtering |
| CN101812667A (en) * | 2010-04-19 | 2010-08-25 | 中国南玻集团股份有限公司 | Magnetron sputtering plating film cathode device |
| CN209338641U (en) * | 2018-11-05 | 2019-09-03 | 常州市迈瑞廷涂层科技有限公司 | Vacuum coating equipment rapid cooling electric arc target cooling body |
| CN212610876U (en) * | 2020-04-24 | 2021-02-26 | 肇庆市科润真空设备有限公司 | Winding type optical film coating device based on magnetron sputtering and electron gun evaporation |
| CN112899627A (en) * | 2021-01-16 | 2021-06-04 | 重庆电子工程职业学院 | Target mounting structure, magnetron sputtering equipment and magnetron sputtering method |
| CN213803968U (en) * | 2020-12-16 | 2021-07-27 | 涿州有融新材料科技有限公司 | Sputtering target material self-circulation cooling device |
| CN214496458U (en) * | 2021-03-19 | 2021-10-26 | 埃频(上海)仪器科技有限公司 | Electron beam evaporation coating system |
| CN216972662U (en) * | 2021-12-13 | 2022-07-15 | 兰州交通大学 | Cooling device for magnetron sputtering area |
| CN114953414A (en) * | 2022-04-14 | 2022-08-30 | 辽宁兴胜防水材料科技发展有限公司 | High-efficient tectorial membrane device of modified asphalt waterproofing membrane processing |
| CN115584473A (en) * | 2022-11-02 | 2023-01-10 | 广东振华科技股份有限公司 | Double-sided electron beam evaporation winding coating device and using method thereof |
-
2023
- 2023-09-13 CN CN202311180204.3A patent/CN116904957B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11296854A (en) * | 1998-04-10 | 1999-10-29 | Victor Co Of Japan Ltd | Manufacturing device of magnetic recording medium |
| KR20070003344A (en) * | 2005-07-01 | 2007-01-05 | 주식회사 에스에프에이 | A sputtering source |
| KR20080099418A (en) * | 2007-05-09 | 2008-11-13 | (주)맥스필름 | The deposition method of metal thin film on polymer substrate by magnetron roll sputtering |
| CN101812667A (en) * | 2010-04-19 | 2010-08-25 | 中国南玻集团股份有限公司 | Magnetron sputtering plating film cathode device |
| CN209338641U (en) * | 2018-11-05 | 2019-09-03 | 常州市迈瑞廷涂层科技有限公司 | Vacuum coating equipment rapid cooling electric arc target cooling body |
| CN212610876U (en) * | 2020-04-24 | 2021-02-26 | 肇庆市科润真空设备有限公司 | Winding type optical film coating device based on magnetron sputtering and electron gun evaporation |
| CN213803968U (en) * | 2020-12-16 | 2021-07-27 | 涿州有融新材料科技有限公司 | Sputtering target material self-circulation cooling device |
| CN112899627A (en) * | 2021-01-16 | 2021-06-04 | 重庆电子工程职业学院 | Target mounting structure, magnetron sputtering equipment and magnetron sputtering method |
| CN214496458U (en) * | 2021-03-19 | 2021-10-26 | 埃频(上海)仪器科技有限公司 | Electron beam evaporation coating system |
| CN216972662U (en) * | 2021-12-13 | 2022-07-15 | 兰州交通大学 | Cooling device for magnetron sputtering area |
| CN114953414A (en) * | 2022-04-14 | 2022-08-30 | 辽宁兴胜防水材料科技发展有限公司 | High-efficient tectorial membrane device of modified asphalt waterproofing membrane processing |
| CN115584473A (en) * | 2022-11-02 | 2023-01-10 | 广东振华科技股份有限公司 | Double-sided electron beam evaporation winding coating device and using method thereof |
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|---|---|
| CN116904957A (en) | 2023-10-20 |
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