CN105671508B - A kind of roll-to-roll magnetic control sputtering vacuum coating device - Google Patents
A kind of roll-to-roll magnetic control sputtering vacuum coating device Download PDFInfo
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- CN105671508B CN105671508B CN201610196820.1A CN201610196820A CN105671508B CN 105671508 B CN105671508 B CN 105671508B CN 201610196820 A CN201610196820 A CN 201610196820A CN 105671508 B CN105671508 B CN 105671508B
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- roll
- invagination
- magnetic control
- substrate
- sputter cathode
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
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- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
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- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses a kind of roll-to-roll magnetic control sputtering vacuum coating devices, it include: vacuum chamber, let off roll, chill roll, wind-up roll, locating support are disposed in vacuum chamber, and locating support is height-adjustable concave shaped type bracket, comprising: supporting mechanism and invagination mechanism；Wherein, supporting mechanism can arbitrarily adjust the distance of invagination mechanism and chill roll, and then arbitrarily change target-substrate distance；Multiple sputter cathodes are provided on the invagination face for mechanism of invaginating, respective sputtering target material is provided on each sputter cathode；Sputtering target material in each sputter cathode can be same or different.Sputter cathode is built in vacuum chamber by the present invention, and height-adjustable concave shaped type bracket has been used to adjust the distance of invagination mechanism and chill roll, be conducive to find out the best plated film distance of the substrate to be coated on sputtering target material and chill roll, it is greatly improved deposition rate, improves sputter coating efficiency and coating quality.
Description
Technical field
This application involves vacuum winding coating technique field more particularly to a kind of roll-to-roll magnetic control sputtering vacuum coating dresses
It sets.
Background technique
With advances in technology with the demand in market, plated film flexible web material is rapidly developed, and has also pushed plated film skill
The fast development of art and coating machine.
Vacuum winding coating technique is exactly by the methods of thermal evaporation or magnetron sputtering in vacuum chamber in coiled strip substrate
Surface prepares the technology of one layer or film of the multilayer with certain function, mainly has the characteristics that following: coating material
For flexible parent metal, can wind；Continuous coating can be carried out, i.e., plated film is carried out continuously within a duty cycle；In addition, plated film
Environment be high vacuum environment.
Substrate is being unreeled in wrapup procedure, and surface is coated with film.The structure of plated film is located between the retractable volume of substrate,
Its working principle can be in thermal resistance evaporation, induction evaporation mode, electron beam evaporation, magnetron sputtering either other vacuum coating methods
Any one.
By taking magnetron sputtering technique as an example, in the building materials in China, decoration, optics, the reinforcing of work grinding tool, integrated circuit etc.
Field is used widely, and is the important technical of each field film preparation.Its worked principle is: work of the electronics in electric field
It is flown to lower acceleration and is collided with sputter gas argon gas during substrate, ionize out a large amount of argon ion and electronics, electronics is flown to
Base film constantly collides with ar atmo in the process, generates more ar atmos and electronics；Work of the argon ion in electric field
Target is bombarded with lower acceleration, sputters a large amount of target atom, the target atom (or molecule) being in neutrality is deposited on base film
Surface filming.
Recently as the widespread demand to flexible substrates Coating Materials and magnetron sputtering technique itself on flexible parent metal
Rapid development, various high-performance optical films are coated with success in large area flexible substrate.
Since flexible parent metal has, continuous production is simple, be easy transport, can conveniently cut into arbitrary shape, flexible package
Etc. advantages be always magnetron sputtering technique development an important directions.
In to cathodic sputtering film formation device, roll-to-roll magnetic control sputtering vacuum coating equipment can be bright with continuous production with it
The aobvious efficiency for improving film forming.Nevertheless, roll-to-roll magnetic control sputtering vacuum coating equipment at present on the market is still universal
It is lower in the presence of plating membrane efficiency, and institute's plated film firmness is lower, and this is difficult to meet society to high quality plated film flexible material increasingly
The demand of growth.This is because it is many such as warm to influence coating process process factor in magnetic-controlled sputtering coating equipment field
Degree, plated film air pressure, plated film time and target and substrate distance (also known as target-substrate distance) etc..The size of target-substrate distance will affect film layer
Deposition rate, membrane uniformity, quality and base material deposited temperature of film layer etc..
Sputter cathode, is usually directly placed at the inner cavity of vacuum sputtering room by traditional winding magnetic control sputtering filming equipment
On wall.Although internal chamber wall is larger, enough spaces can be provided so that more sputter cathode is arranged, due to takeup type magnetic control
The volume of the sputtering chamber of sputtering coating equipment is often very big, and apart from far, this is just made for internal chamber wall and the substrate that is wound in chilling roller
It is very big at distance between sputtering target material and substrate (target-substrate distance), and usually cannot also be adjusted, therefore be unfavorable for mentioning
The quality of high sputtering yield and control sputter coating, and then will affect film quality and plating membrane efficiency.
Summary of the invention
Invention provides a kind of roll-to-roll magnetic control sputtering vacuum coating devices, to solve existing filming equipment film layer matter
Measure technical problem bad, that plated film is inefficient.
In order to solve the above technical problems, the present invention provides a kind of roll-to-roll magnetic control sputtering vacuum coating devices, comprising:
Vacuum chamber is disposed with let off roll, chill roll, wind-up roll in the vacuum chamber, and the chill roll is in
Lower section between the let off roll, the wind-up roll；
Locating support is arranged in the chamber bottom and is in the lower section of the chill roll；
The locating support is height-adjustable concave shaped type bracket, comprising: supporting mechanism and invagination mechanism；
The supporting mechanism can arbitrarily adjust the distance of the invagination mechanism and the chill roll；
The invagination face of the invagination mechanism and the periphery of the chill roll are corresponding；On the invagination face of the invagination mechanism
Multiple sputter cathodes are provided with, respective sputtering target material is provided on each sputter cathode.
Preferably, the supporting mechanism includes: mobile platform, adjustment structure；
The bottom of the vacuum chamber is arranged in the mobile platform, and can be mobile in the chamber bottom；
The adjustment structure between the invagination mechanism and the mobile platform, for adjust the invagination mechanism and
The distance of the chill roll.
Preferably, the range of the target-substrate distance is: 50mm~150mm.
Preferably, it is provided with isolation board in the vacuum chamber, the vacuum chamber is divided into the first evacuated chamber and
Two evacuated chambers；
Wherein, the let off roll, the wind-up roll are provided in first evacuated chamber；Wherein, the let off roll and
The reversing roller in one group of direction for changing substrate to be coated is also respectively arranged in the wind-up roll；
The locating support and the chill roll are provided in second evacuated chamber；
The opening passed through for the substrate to be coated is provided on the isolation board.
Preferably, it is provided with ion bombardment device in first evacuated chamber, for handling the substrate to be coated
Surface.
Preferably, the invagination mechanism is in hollow type；
The inside of the invagination mechanism is at least provided with cooling pipe, gas pipeline；Wherein, the cooling pipe is set to
Below each sputter cathode, the gas pipeline is arranged between each sputter cathode；
First intake and the second intake are set on the wall of the vacuum chamber；
Coolant liquid is introduced into the cooling duct using first intake；
The gas pipeline is introduced reaction gases into using second intake.
Preferably, the multiple sputter cathode can be monorail sputter cathode and/or two-orbit sputter cathode.
Preferably, the maximum number of the two-orbit sputter cathode is 4.
Preferably, the invagination plane materiel matter of the invagination mechanism is metal.
Preferably, baffle is provided between each sputtering target material.
One or more technical solution through the invention, the invention has the advantages that advantage:
In embodiments of the present invention, a kind of roll-to-roll magnetic control sputtering vacuum coating device is disclosed, which includes: vacuum
Chamber is disposed with let off roll, chill roll, wind-up roll in vacuum chamber, in addition, locating support, is arranged at vacuum chamber bottom
Portion and the lower section for being in chill roll, and locating support is height-adjustable concave shaped type bracket, comprising: supporting mechanism and invagination machine
Structure；Wherein, supporting mechanism can arbitrarily adjust the distance of invagination mechanism and chill roll, and then arbitrarily change target-substrate distance；Invagination mechanism
Invagination face and chill roll periphery it is corresponding；Multiple sputter cathodes, each sputtering are provided on the invagination face for mechanism of invaginating
Respective sputtering target material is provided on cathode；Sputtering target material in each sputter cathode can be same or different.It can be seen that
Sputter cathode is built in vacuum chamber by the present invention, and has used height-adjustable concave shaped type bracket adjustment invagination mechanism
With the distance of chill roll, be conducive to find out the best plated film distance of the substrate to be coated on sputtering target material and chill roll, it can be big
It is big to improve deposition rate, improve sputter coating efficiency and coating quality.
Further, by adjusting the position of locating support, the distance between each target and substrate to be coated can be made to protect
It holds unanimously, to improve the uniformity of plated film.
Further, multiple sputter cathodes, each settable corresponding sputtering of sputter cathode are provided on locating support
Target can plate the membrane material of multilayer different function in substrate surface to be coated simultaneously.
Further, it introduces reaction gases into mouth to be set to inside locating support, it is ensured that sputtering workspace partial pressure
Stablize, be conducive to improve sputter coating efficiency and improve the uniformity of plated film.
Further, the setting of two-orbit sputter cathode improves the space utilization rate in vacuum chamber, while improving big
The utilization rate of area target and the service life for increasing large-area target.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of roll-to-roll magnetic control sputtering vacuum coating device in the embodiment of the present invention.
Description of symbols: let off roll 1, reversing roller 2, wind-up roll 3, chill roll 4, ion bombardment device 5, isolation board 6, first
Evacuated chamber 7, the second evacuated chamber 8, invagination mechanism 9, mobile platform 10, adjustable nut 11, threaded support bar 12, sputter cathode
13, baffle 14, vacuum pumping opening 15, entrance 16, reaction gas introduce pipe 17.
Specific embodiment
In order to make the application the technical staff in the technical field be more clearly understood that the application, with reference to the accompanying drawing,
Technical scheme is described in detail by specific embodiment.
Referring to Fig. 1, in embodiments of the present invention, a kind of roll-to-roll magnetic control sputtering vacuum coating device is provided.
As shown in Figure 1, device provided by the invention includes: vacuum chamber, let off roll 1, chill roll 4, wind-up roll 3.
Vacuum chamber is mainly used as plated film work, and let off roll 1, chill roll 4, wind-up roll 3 are in the inside of vacuum chamber.
The pollution to substrate to be coated is sputtered in order to prevent, and the embodiment of the present invention is divided vacuum chamber using isolation board 6
For two parts.For the ease of distinguishing, the two chambers isolated are respectively designated as the first evacuated chamber 7 and second by the present invention
Evacuated chamber 8.The separating ratio present invention of vacuum chamber with no restrictions, can according to the actual situation depending on.
In embodiments of the present invention, let off roll 1, wind-up roll 3, reversing roller 2 are set in the first evacuated chamber 7；Depending on
Position bracket and chill roll 4 are arranged in the second evacuated chamber 8.
In addition, let off roll 1 and wind-up roll 3 are in the true two sides for controlling chamber, and cold for the whole interior of vacuum chamber
But roller 4 is in the lower section between let off roll 1 and wind-up roll 3, and let off roll 1, wind-up roll 3 are respectively and the distance phase of chill roll 4
Closely, compact-sized so that chill roll 4, let off roll 1, wind-up roll 3 are substantially at three vertex of isosceles triangle, be conducive to close
Reason utilizes space.In addition, being respectively arranged one group of direction of motion for changing substrate to be coated in let off roll 1 and wind-up roll 3
Reversing roller 2.Certainly, isolation board 6 is passed through for the ease of substrate to be coated and reach chill roll 4, be additionally provided on isolation board 6
The opening passed through for substrate to be coated.Specifically, the mounting means of substrate to be coated are as follows: be arranged substrate to be coated
In on let off roll 1, reversing roller 2, chill roll 4 are then bypassed as shown in Figure 1, is then attached on wind-up roll 3, when installation
It is noted that passing through the opening of isolation board 6 in corresponding position.
Rotation using let off roll 1, chill roll 4, wind-up roll 3 can be such that substrate to be coated moves back and forth, and reversing roller 2 is then
It can change the coiling direction of substrate to be coated.
In addition, its cleannes and adhesive force are improved in order to carry out cleaning polishing to substrate surface to be coated, it is true first
Be additionally provided with ion bombardment device 5 in empty cell 7 and be used to handle the surface of the substrate to be coated, for example, for clean polishing to
The substrate of plated film.
Certainly, ion bombardment device 5 specifically can be set on isolation board 6, and in let off roll 1 and its reversing roller 2 it
Between.
Locating support is arranged in chamber bottom and is in the lower section of chill roll 4.Since vacuum chamber has been divided into two
A chamber, therefore, the specific location of locating support are in the second evacuated chamber 8.
In addition, being provided with vacuum pumping opening 15 in the second evacuated chamber 8.It is true that vacuum pumping opening 15 can arbitrarily be arranged in second
Any position of empty cell 8.Certainly, optimum position is located at the bottom of vacuum chamber.
And the structure about locating support, it is specially height-adjustable concave shaped type bracket.
Locating support mainly includes two parts: supporting mechanism and invagination mechanism 9.
Supporting mechanism includes: mobile platform 10, regulating mechanism.
Supporting mechanism can arbitrarily adjust the distance of invagination mechanism 9 and chill roll 4, and then can arbitrarily change target-substrate distance, this hair
Bright target-substrate distance refers at a distance from substrate to be coated that the sputtering target material on sputter cathode 13 is wound on chill roll 4.Target
The range of cardinal distance is: 50mm~150mm.
The bottom of vacuum chamber is arranged in mobile platform 10, and can be mobile in chamber bottom.As a kind of optional
Two parallel sliding tracks can be fixedly installed in chamber bottom in structure, and being arranged below mobile platform 10 can slide along guide rail
Sliding block, mutual cooperation move back and forth mobile platform 10 in chamber bottom.Certainly, there are also other knots in practical applications
Structure can meet the requirement that mobile platform 10 moves back and forth in chamber bottom, and the application with no restrictions, can satisfy herein
Each class formation for stating requirement all should belong within the protection scope of the application.
Adjustment structure is located between invagination mechanism and mobile platform, and specifically, adjustment structure is primarily used in adjusting
The height of mechanism is fallen into, and then adjusts the distance of invagination mechanism and chill roll, and then changes target-substrate distance.
In the present invention, adjustment structure can there are many forms of adjusting.In an alternative embodiment, adjustment structure includes
Threaded support bar 12, adjustable nut 11.
On a mobile platform 10, the other end of threaded support bar 12 is inserted into invagination mechanism for one end setting of threaded support bar 12
9 inside；11 sets of adjustable nut in threaded support bar 12 and between invagination mechanism 9 and mobile platform 10.
When needing to adjust the height of invagination mechanism 9, invagination mechanism 9 and chill roll 4 are adjusted using threaded support bar 12
Distance, using 11 locking screw support rod 12 of adjustable nut, with the height of fixed invagination mechanism 9.Due to locating support can more than
Under, move left and right, therefore can according to different sputtering target materials, substrate to be coated and other conditions, adjust target-substrate distance, seek
Optimal coating process condition.By adjusting the position of locating support, can make each sputtering target material on the chill roll 4 to
The distance between substrate of plated film adjusts in the range of requiring, to improve the uniformity of institute's plated film.
And for invagination mechanism 9, it is the most important structure member of plated film.
In order to more be bonded the shape of chill roll 4, the invagination face of invagination mechanism 9 and the periphery of chill roll 4 are corresponding.It is interior
The invagination face for falling into mechanism 9 is made of the surface that different angle is presented in multiple and horizontal plane, is formed to chill roll 4 parcel-like.
Certainly, the number present invention in the invagination face for mechanism 9 of invaginating does not do stringent limitation.The number in invagination face is more, then
The closer and concentric arc-shaped of chill roll 4.
As a kind of optional embodiment, in order to prevent in sputtering process falling for sputtering material and pollute internal stent,
Except installation sputter cathode 13 and installation reaction gas introduce the part of pipe 17, the other parts in the invagination face of invagination mechanism 9 are all
It is covered using metal class plate, such as metal plate (such as iron plate), alloy sheets (such as stainless steel).The invagination for mechanism 9 of invaginating
Face is actually one piece of metal plate for being bent into multiple surfaces, and each surface is both provided with opening and is used to install sputter cathode 13.
Multiple sputter cathodes 13 (i.e. at least two sputter cathodes 13) are provided on the invagination face for mechanism 9 of invaginating.And it is each
Respective sputtering target material is provided on sputter cathode 13；Sputtering target material in each sputter cathode 13 can be same or different,
Different sputtering target materials can plate different films on substrate to be coated, therefore structure of the invention can be disposably to be plated
Multilayer film is plated on the substrate of film, the number of plies of plated film is determined by sputtering target material.
In addition, multiple sputter cathodes 13 on the invagination face of invagination mechanism 9 can be monorail sputter cathode and/or double track
Road sputter cathode.
That is: the sputter cathode 13 on the invagination face for mechanism 9 of invaginating can be entirely monorail sputter cathode, can also be whole
It is two-orbit sputter cathode.Certainly, the sputter cathode 13 on the invagination face for mechanism 9 of invaginating can also include that monorail sputters simultaneously
Cathode and two-orbit sputter cathode.Sputter cathode 13 is mainly used to install sputtering target material.It can only on each monorail sputter cathode
One sputtering target material is set, and two same or different sputtering target materials can be set on two-orbit sputter cathode.
It should be noted that in order to be more reasonably utilized space, if the sputter cathode 13 on the invagination face of invagination mechanism 9
When being provided with two-orbit sputter cathode, the number of two-orbit sputter cathode is arranged between 1~4, i.e., minimum setting 1, most
More settings 4.
It is a kind of structure that the invagination mechanism 9 of the invention enumerated is likely to occur below continuing with reference to Fig. 1.Wherein, it invaginates
Mechanism 9 is provided with 5 invagination faces, is respectively as follows: left side, invagination bottom surface, right side.Left-hand door contains two sides, each
Side is provided with a sputter cathode 13, and invagination bottom surface is provided with a sputter cathode 13, and right side also contains two sides,
It is respectively arranged with a sputter cathode 13.Wherein, left side, be arranged on right side is all monorail sputter cathode, and install
There is respective sputtering target material.And bottom surface of invaginating is provided with two-orbit sputter cathode, is provided with two sputtering target materials.Setting is double
Track sputter cathode can greatly increase the utilization rate and service life of large-area target, reduce coating cost, improve
Plating membrane efficiency.
Each sputter cathode 13 cooperates substrate to be coated to move back and forth plating thickness in addition to that can place identical sputtering target material
Outside film, different sputtering target materials can be also placed on each sputter cathode 13, so that the film of different function is realized while plating, and it is every
Baffle 14 is provided between a sputtering target material, for preventing the pollution between each sputtering target material.
For structure compared to traditional ' target is set on vacuum wall ', this design of the invention is very big
The distance (i.e. target-substrate distance) for reducing the substrate to be coated on sputtering target material and chill roll 4 in degree, makes target-substrate distance in 50mm
It is adjustable in~150mm, to meet different sputtering operations.The reduction of target-substrate distance can increase the deposition during magnetron sputtering plating
Rate, this just largely improves plating membrane efficiency and coating quality.
And since the invagination mechanism 9 of locating support is actually hollow type mechanism, in the inside of invagination mechanism 9, also
It is provided with other component, rationally to utilize space.
In the inside of invagination mechanism 9, at least provided with cooling pipe, gas pipeline.In addition to this, in order to rationally using empty
Between, power supply line can be also placed in the inside of invagination mechanism 9.
Cooling pipe is set to each 13 lower section of sputter cathode, cools down for being passed through coolant liquid to sputter cathode 13.
Cooling water can be used in coolant liquid, naturally it is also possible to other are used, mainly cooling sputter cathode 13, therefore cooling pipe is set
It is placed in each 13 lower section of sputter cathode, coolant liquid can be made to be passed through cathode chamber, it is noted herein that sputter cathode
The magnet steel being arranged in 13 does not immerse in coolant liquid.
Gas pipeline be arranged between each sputter cathode 13, and extend invagination mechanism 9 invagination face into vacuum chamber,
In order to distinguish the gas pipeline inside invagination mechanism 9, it is referred to as anti-that the present invention may extend to this part of the gas pipeline in vacuum chamber
Answer gas inlet tube 17, be provided on pipe many small openings can outlet, it may be other that gas, which is argon gas, reactive sputtering according to
Differential responses gas and it is different.In order to make stable gas pressure in vacuum chamber, it is evenly distributed with instead in the invagination face of invagination mechanism 9
Answer gas inlet tube 17, such as the invagination face of invagination mechanism 9 is symmetrically distributed with reaction gas and introduces pipe 17, reaction gas is from invagination
The invagination face of mechanism 9 introduces, and the gap by relatively narrower between locating support and vacuum chamber flows into vacuum chamber lower part.Uniformly divide
The reaction gas of cloth, which introduces pipe 17, can make the gas pressure for sputtering workspace more stable very uniform, to improve plating membrane efficiency
And coating quality.
The embodiment of the present invention all draws cooling water, electricity, gas first with the intake 16 (flange) being located on vacuum wall
Enter in locating support, realizes the connection of cooling water circulation, device power supply and gas pipeline.Intake can be one, simultaneously
Cooling water, electricity, gas are all introduced into locating support.It is, of course, also possible to multiple entrances be arranged, respectively by cooling water, electricity, gas
All it is introduced into locating support.For example, the first intake and the second intake are arranged on the wall of vacuum chamber.
Coolant liquid is introduced into cooling duct using the first intake on the wall that vacuum chamber is arranged in, is existed using setting
The second intake on the wall of vacuum chamber introduces reaction gases into gas pipeline.
It is the specific structure of roll-to-roll magnetic control sputtering film plating device of the present invention above, the structure is described below
The process of plated film.
Technique requirement: plating silverskin on PE substrate (polyethylene substrate), and the sputtering target material used is silver-colored target.
1, vacuum chamber is opened, winding roller arrangement is exited into sputtering working chamber, by PE substrate wound on working roll (let off roll
1, chill roll 4, reversing roller 2, wind-up roll 3) on, and tensing opens it sufficiently.
2, sputtering target material is placed, sputtering target material is placed on corresponding sputter cathode 13.
3, according to sputtering target material and plated film needs, target-substrate distance is adjusted, and (up and down, left and right is moved by adjusting locating support
It is dynamic), it is consistent each target at a distance from the PE substrate on chill roll 4.
4, vacuum chamber is closed, winding roller arrangement is promoted into sputtering working chamber, is vacuumized and is reached using mechanical pump and molecular pump
To 10-4torr。
5, it is filled with reaction gas using gas pipeline, adjusting air-flow size is 260sccm, and detection gas pressure is stable at 10
~30Pa reaches gas pressure required for build-up of luminance.
6, magnetron sputtering power supply is opened, recirculated cooling water is passed through, adjusting sets each target sputtering power as greater than 5~7KW.
7, winding PE substrate walking is started simultaneously at, speed 700mm/min carries out sputter coating.
8, sputter coating is completed, pass hull closure.
One or more embodiment through the invention, the invention has the advantages that advantage:
In embodiments of the present invention, a kind of roll-to-roll magnetic control sputtering vacuum coating device is disclosed, which includes: vacuum
Chamber is disposed with let off roll, chill roll, wind-up roll in vacuum chamber, in addition, locating support, is arranged at vacuum chamber bottom
Portion and the lower section for being in chill roll, and locating support is height-adjustable concave shaped type bracket, comprising: supporting mechanism and invagination machine
Structure；Wherein, supporting mechanism can arbitrarily adjust the distance of invagination mechanism and chill roll；The circle in the invagination face and chill roll of mechanism of invaginating
Circumferential surface is corresponding；Multiple sputter cathodes are provided on the invagination face for mechanism of invaginating, respective splash is provided on each sputter cathode
It shoots at the target material；Sputtering target material in each sputter cathode can be same or different.It can be seen that the present invention will be built in sputter cathode
In vacuum chamber, and height-adjustable concave shaped type bracket has been used to adjust the distance of invagination mechanism and chill roll, had
Conducive to the best plated film distance for the substrate to be coated found out on sputtering target material and chill roll, it is greatly improved deposition rate, is mentioned
High sputter coating efficiency and coating quality.
Further, by adjusting the position of locating support, the distance between each target and substrate to be coated can be made to protect
It holds unanimously, to improve the uniformity of plated film.
Further, multiple sputter cathodes, each settable corresponding sputtering of sputter cathode are provided on locating support
Target can plate the membrane material of multilayer different function in substrate surface to be coated simultaneously.
Further, it introduces reaction gases into mouth to be set to inside locating support, it is ensured that sputtering workspace partial pressure
Stablize, be conducive to improve sputter coating efficiency and improve the uniformity of plated film.
Further, the setting of two-orbit sputter cathode improves the space utilization rate in vacuum chamber, while improving big
The utilization rate of area target and the service life for increasing large-area target.
Although the preferred embodiment of the application has been described, but one of ordinary skilled in the art once knows substantially
Creative concept, then additional changes and modifications may be made to these embodiments.It is wrapped so the following claims are intended to be interpreted as
It includes preferred embodiment and falls into all change and modification of the application range.
Obviously, those skilled in the art can carry out various modification and variations without departing from the essence of the application to the application
Mind and range.In this way, if these modifications and variations of the application belong to the range of the claim of this application and its equivalent technologies
Within, then the application is also intended to include these modifications and variations.
Claims (9)
1. a kind of roll-to-roll magnetic control sputtering vacuum coating device characterized by comprising vacuum chamber, in the vacuum chamber
It is disposed with let off roll, chill roll, wind-up roll, the chill roll is in the lower section between the let off roll, the wind-up roll；
Locating support is arranged in the chamber bottom and is in the lower section of the chill roll；
The locating support is height-adjustable concave shaped type bracket, comprising: supporting mechanism and invagination mechanism；
The supporting mechanism can arbitrarily adjust the distance of the invagination mechanism and the chill roll；
The invagination face of the invagination mechanism and the periphery of the chill roll are corresponding；It is arranged on the invagination face of the invagination mechanism
There are multiple sputter cathodes, the multiple sputter cathode is monorail sputter cathode and/or two-orbit sputter cathode, each sputtering yin
It is provided with respective sputtering target material on extremely, and two different sputtering target materials are set on the two-orbit sputter cathode.
2. a kind of roll-to-roll magnetic control sputtering vacuum coating device as described in claim 1, which is characterized in that
The supporting mechanism includes: mobile platform, adjustment structure；
The bottom of the vacuum chamber is arranged in the mobile platform, and can be mobile in the chamber bottom；
The adjustment structure is between the invagination mechanism and the mobile platform, for adjusting the invagination mechanism and described
The distance of chill roll.
3. a kind of roll-to-roll magnetic control sputtering vacuum coating device as described in claim 1, which is characterized in that the range of target-substrate distance
It is: 50mm~150mm.
4. a kind of roll-to-roll magnetic control sputtering vacuum coating device as described in claim 1, which is characterized in that the vacuum chamber
It is inside provided with isolation board, the vacuum chamber is divided into the first evacuated chamber and the second evacuated chamber；
Wherein, the let off roll, the wind-up roll are provided in first evacuated chamber；Wherein, the let off roll and described
The reversing roller of one group of direction of motion for changing substrate to be coated is also respectively arranged in wind-up roll；
The locating support and the chill roll are provided in second evacuated chamber；
The opening passed through for the substrate to be coated is provided on the isolation board.
5. a kind of roll-to-roll magnetic control sputtering vacuum coating device as claimed in claim 4, which is characterized in that first vacuum
Ion bombardment device is provided in cell, for handling the surface of the substrate to be coated.
6. a kind of roll-to-roll magnetic control sputtering vacuum coating device as described in claim 1, which is characterized in that the invagination mechanism
In hollow type；
The inside of the invagination mechanism is at least provided with cooling pipe, gas pipeline；Wherein, the cooling pipe is set to each
Below sputter cathode, the gas pipeline is arranged between each sputter cathode；
First intake and the second intake are set on the wall of the vacuum chamber；
Coolant liquid is introduced into the cooling duct using first intake；
The gas pipeline is introduced reaction gases into using second intake.
7. a kind of roll-to-roll magnetic control sputtering vacuum coating device as described in claim 1, which is characterized in that the two-orbit splashes
The maximum number for penetrating cathode is 4.
8. a kind of roll-to-roll magnetic control sputtering vacuum coating device as described in claim 1, which is characterized in that
The invagination plane materiel matter of the invagination mechanism is metal.
9. a kind of roll-to-roll magnetic control sputtering vacuum coating device as described in claim 1, which is characterized in that
Baffle is provided between each sputtering target material.
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| CN105671508B true CN105671508B (en) | 2019-04-30 |
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| CN109112475A (en) * | 2018-10-22 | 2019-01-01 | 广东振华科技股份有限公司 | A kind of high attachment aluminothermy evaporation winding film plating equipment and its film plating process |
| CN113862632B (en) * | 2021-09-24 | 2023-06-30 | 北京北方华创真空技术有限公司 | Vacuum chamber of flexible coating equipment |
| CN115613001A (en) * | 2022-10-26 | 2023-01-17 | 四川旭虹光电科技有限公司 | Coated cylinder and use method thereof |
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| KR20040043046A (en) * | 2002-11-15 | 2004-05-22 | 삼성전자주식회사 | Magnetron sputtering apparatus and method thereof |
| CN104775102B (en) * | 2015-05-04 | 2017-07-14 | 上海产业技术研究院 | The vacuum coating system that volume to volume magnetic control sputtering cathode is combined with column multi-arc source |
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