CN116855321A - Swelling liquid for processing residues on inner wall of through hole of epoxy resin circuit board, application and processing method - Google Patents

Swelling liquid for processing residues on inner wall of through hole of epoxy resin circuit board, application and processing method Download PDF

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Publication number
CN116855321A
CN116855321A CN202310825151.XA CN202310825151A CN116855321A CN 116855321 A CN116855321 A CN 116855321A CN 202310825151 A CN202310825151 A CN 202310825151A CN 116855321 A CN116855321 A CN 116855321A
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CN
China
Prior art keywords
hole
wall
circuit board
residues
epoxy resin
Prior art date
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Pending
Application number
CN202310825151.XA
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Chinese (zh)
Inventor
张进武
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Shenzhen Zhongcollier Technology Co ltd
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Shenzhen Zhongcollier Technology Co ltd
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Priority to CN202310825151.XA priority Critical patent/CN116855321A/en
Publication of CN116855321A publication Critical patent/CN116855321A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/39—Organic or inorganic per-compounds
    • C11D3/3947—Liquid compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/261—Alcohols; Phenols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/263—Ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/267—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3281—Heterocyclic compounds

Abstract

The invention discloses a swelling solution for treating residues on the inner wall of a through hole of an epoxy resin circuit board, application and a treatment method, belonging to the technical field of manufacturing of printed circuit boards, and comprising a swelling agent, 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and water. The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board can oxidize and decompose the hole wall resin so as to break the polymer chains of the hole wall resin, weaken the acting force between the resin residues and the hole wall and between the resin polymers, and improve the swelling capacity of the swelling agent to the resin residues, thus the residues in the circuit board hole can be removed only by using water washing, and the adhesion strength of the copper plating layer on the inner wall of the hole is greatly improved.

Description

Swelling liquid for processing residues on inner wall of through hole of epoxy resin circuit board, application and processing method
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a swelling liquid for processing residues on the inner wall of a through hole of an epoxy resin circuit board, application and a processing method.
Background
Non-conductive substrates are coated or plated in a number of industrial and application fields with a continuous metal coating, a patterned metal coating, at least one of a discontinuous metal coating or a discontinuous plating to form a composite substrate of a resin sheet laminated or clad with a thin metal foil, wherein the non-conductive resin sheet is sandwiched between two metal faces and the surface of the composite substrate is required to be drilled prior to use in the manufacture of printed circuit boards in electrical or electronic applications. In the drilling process, the metal cladding and the resin layer are usually penetrated, after drilling is completed, the resin surface after drilling is coated with metal, and particularly for the connection of the multilayer circuit board layer and the layer, the prior process of coating the metal is realized by carrying out electroless copper plating and electroplating copper on the inside of the hole after drilling.
Resin residues are often generated on the inner wall of holes in the hole making work of the resin-containing material. When the through hole is drilled through the double-sided or multi-layer circuit board, resin stains are left in the holes and on the conductive surfaces of the holes, wherein the resin stains are mainly caused by the fact that the used temperature exceeds the decomposition temperature of resin components during the drilling process, in addition, the drill bit rotates at a high speed during the drilling process, and simultaneously generates a large amount of heat by friction with a hole wall base material, so that the resin cut by the drill bit is melted and attached to the hole wall of the through hole, and the resin melted and adsorbed on the hole wall needs to be thoroughly cleaned before the through hole is metallized in order to ensure the electric conductivity between metal separated in the subsequent metallization process and the inner layer circuit of the printed circuit board and the bonding force between the metal and the hole wall.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide the swelling liquid for the residue treatment of the inner wall of the through hole of the circuit board, which has good swelling performance, and the adhesion strength of a copper plating layer on the inner wall of the hole is greatly improved.
The second object of the present invention is to provide a use of a swelling liquid for the through-hole inner wall residue treatment of an epoxy resin wiring board, which is suitable for any one of the through-hole inner wall residue swelling treatment of an epoxy resin wiring board with low TG, the through-hole inner wall residue swelling treatment of an epoxy resin wiring board with medium TG, or the through-hole inner wall residue swelling treatment of a resin epoxy resin wiring board with high TG.
The third object of the present invention is to provide a method for removing residues in through holes of a circuit board, which is simple in steps, can remove resin residues in through holes of a circuit board instead of a permanganate method, and can form a coarser resin surface after removing the resin residues in the through holes of the circuit board, wherein the coarser resin surface is helpful for improving adhesion of copper deposited later on the through holes.
One of the purposes of the invention is realized by adopting the following technical scheme:
a swelling liquid for processing residues on the inner wall of a through hole of a circuit board comprises a swelling agent, 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and water.
Further, the swelling agent is one of ethylene glycol monobutyl ether, methyl pyrrolidone, butyrolactone and diethylene glycol diethyl ether; the swelling liquid contains 10-600 g of the swelling agent, 20-50 g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Further, the swelling agent comprises one selected from 50-500 g ethylene glycol monobutyl ether, 50-500 g methyl pyrrolidone, 20-500 g butyrolactone or 50-500 g diethylene glycol diethyl ether per liter of the swelling liquid.
Further, the swelling agent is prepared from the following components in percentage by mass: 1 and 1, the mass ratio of the mixed solution of diethylene glycol monobutyl ether and 1, 4-butanediol is 1:1, the mass ratio of the mixed solution of ethylene glycol monobutyl ether and diethylene glycol is 1:1 and ethylene glycol is 1:1 and hexanediol.
Further, each liter of the swelling liquid contains one of 10 to 600g of mixed liquid of diethylene glycol monobutyl ether and 1, 4-butanediol, 10 to 600g of mixed liquid of ethylene glycol monobutyl ether and diethylene glycol, 10 to 600g of mixed liquid of tetrahydrofuran derivative and ethylene glycol, and 10 to 600g of mixed liquid of diethylene glycol diethyl ether and hexanediol.
Further, each liter of the swelling liquid contains one selected from 50-500 g of mixed liquid of diethylene glycol monobutyl ether and 1, 4-butanediol, 50-500 g of mixed liquid of ethylene glycol monobutyl ether and diethylene glycol, 50-500 g of mixed liquid of tetrahydrofuran derivative and ethylene glycol, and 50-500 g of mixed liquid of diethylene glycol diethyl ether and hexanediol.
Further, the swelling liquid is suitable for any one of swelling treatment of residues on the inner wall of the through hole of the epoxy resin circuit board with low TG, swelling treatment of residues on the inner wall of the through hole of the epoxy resin circuit board with medium TG or swelling treatment of residues on the inner wall of the through hole of the epoxy resin circuit board with high TG.
The second purpose of the invention is realized by adopting the following technical scheme:
the invention provides application of a swelling liquid for processing residues on the inner wall of a through hole of an epoxy resin circuit board, which is suitable for any one of swelling processing of residues on the inner wall of the through hole of the epoxy resin circuit board with low TG, swelling processing of residues on the inner wall of the through hole of the epoxy resin circuit board with medium TG or swelling processing of residues on the inner wall of the through hole of the epoxy resin circuit board with high TG.
The third purpose of the invention is realized by adopting the following technical scheme:
the invention provides a method for removing residues in a through hole of a circuit board, firstly placing the epoxy resin circuit board after drilling a through hole in swelling liquid for treating residues on the inner wall of the through hole of the epoxy resin circuit board, keeping the temperature at 60-70 ℃ for 5-10 minutes, and expanding the residues in the through hole; and then washing with water to remove residues in the circuit board holes.
Further, the temperature was kept at 65℃for 7 minutes to expand the residue in the via hole.
Compared with the prior art, the invention has the beneficial effects that:
(1) The swelling liquid for the residue treatment of the inner wall of the through hole of the circuit board provided by the invention has the advantages that 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane in the swelling liquid for the residue treatment of the inner wall of the through hole of the circuit board is used as a peroxy organic matter, so that the hole wall resin can be oxidized and decomposed, the polymer chains of the hole wall resin are broken, the acting force between the resin residue and the hole wall and between the resin polymers is weakened, the swelling capacity of the swelling agent on the resin residue is improved, the residue of the inner wall of the through hole of the circuit board can be removed only by using water washing, and the adhesion strength of a copper plating layer on the inner wall of the hole is greatly improved.
(2) The method for removing the residues in the through holes of the circuit board is simple in steps, can replace a permanganate method to remove the resin residues in the through holes of the circuit board, and can lead to a coarser resin surface after removing the resin residues in the through holes of the circuit board, and the coarser resin surface is beneficial to improving the adhesion of the copper deposited subsequently on the through holes.
Detailed Description
The present invention will be further described with reference to specific embodiments, and it should be noted that, on the premise of no conflict, new embodiments may be formed by any combination of the embodiments or technical features described below.
Example 1
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 10g of ethylene glycol monobutyl ether, 20g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 2
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 200g of ethylene glycol monobutyl ether, 25g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 3
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 300g of ethylene glycol monobutyl ether, 30g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 4
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 400g of ethylene glycol monobutyl ether, 40g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 5
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 600g of ethylene glycol monobutyl ether, 50g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 6
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 10g of methyl pyrrolidone, 20g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water per liter of the swelling liquid.
Example 7
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 200g of methyl pyrrolidone, 25g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 8
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 300g of methyl pyrrolidone, 30g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 9
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 400g of methyl pyrrolidone, 40g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 10
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 600g of methyl pyrrolidone, 50g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 11
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 10g of butyrolactone, 20g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water in each liter of the swelling liquid.
Example 12
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 200g of butyrolactone, 25g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water in each liter of the swelling liquid.
Example 13
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 300g of butyrolactone, 30g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water in each liter of the swelling liquid.
Example 14
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 400g of butyrolactone, 40g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water in each liter of the swelling liquid.
Example 15
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 600g of butyrolactone, 50g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water in each liter of the swelling liquid.
Example 16
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 10g of diethylene glycol diethyl ether, 20g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 17
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 200g of diethylene glycol diethyl ether, 25g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 18
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 300g of diethylene glycol diethyl ether, 30g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 19
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 400g of diethylene glycol diethyl ether, 40g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 20
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 600g of diethylene glycol diethyl ether, 50g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 21
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 5g of ethylene glycol monobutyl ether, 5g of 1, 4-butanediol, 20g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 22
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 100g of ethylene glycol monobutyl ether, 100g of 1, 4-butanediol, 25g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 23
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 150g of ethylene glycol monobutyl ether, 150g of 1, 4-butanediol, 30g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 24
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 200g of ethylene glycol monobutyl ether, 200g of 1, 4-butanediol, 40g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 25
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 300g of ethylene glycol monobutyl ether, 300g of 1, 4-butanediol, 50g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 26
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 5g of ethylene glycol monobutyl ether, 5g of diethylene glycol, 20g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 27
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 100g of ethylene glycol monobutyl ether, 100g of diethylene glycol, 25g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 28
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 150g of ethylene glycol monobutyl ether, 150g of diethylene glycol, 30g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 29
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 200g of ethylene glycol monobutyl ether, 200g of diethylene glycol, 40g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 30
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 300g of ethylene glycol monobutyl ether, 300g of diethylene glycol, 50g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 31
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 5g of tetrahydrofuran derivatives, 5g of ethylene glycol, 20g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 32
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 100g of tetrahydrofuran derivatives, 100g of ethylene glycol, 25g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 33
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 150g of tetrahydrofuran derivatives, 150g of ethylene glycol, 30g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 34
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 200g of tetrahydrofuran derivatives, 200g of ethylene glycol, 40g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 35
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 300g of tetrahydrofuran derivatives, 300g of ethylene glycol, 50g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 36
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 5g of diethylene glycol diethyl ether, 5g of hexanediol, 20g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 37
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 100g of diethylene glycol diethyl ether, 100g of hexanediol, 25g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 38
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 150g of diethylene glycol diethyl ether, 150g of hexanediol, 30g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 39
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 200g of diethylene glycol diethyl ether, 200g of hexanediol, 40g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 40
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the embodiment comprises 300g of diethylene glycol diethyl ether, 300g of hexanediol, 50g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
Example 41
The method for removing residues in the through hole of the circuit board provided by the embodiment comprises the following steps: firstly, placing the epoxy resin circuit board after drilling the through holes in swelling liquid for treating residues on the inner walls of the through holes of the epoxy resin circuit board, which is provided in embodiments 1-40, and keeping the temperature at 65 ℃ for 7 minutes to expand the residues in the through holes; and then washing with water to remove residues in the through holes of the circuit board.
Comparative example 1
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the comparative example comprises 200g of ethylene glycol monobutyl ether per liter of swelling liquid and the balance of water.
Comparative example 2
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the comparative example comprises 300g of ethylene glycol monobutyl ether per liter of swelling liquid and the balance of water.
Comparative example 3
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the comparative example comprises 400g of ethylene glycol monobutyl ether per liter of swelling liquid and the balance of water.
Comparative example 4
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the comparative example comprises 200g of methyl pyrrolidone per liter of the swelling liquid and the balance of water.
Comparative example 5
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the comparative example comprises 300g of methyl pyrrolidone per liter of the swelling liquid and the balance of water.
Comparative example 6
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the comparative example comprises 400g of methyl pyrrolidone per liter of the swelling liquid and the balance of water.
Comparative example 7
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the comparative example comprises 200g of butyrolactone per liter of the swelling liquid and the balance of water.
Comparative example 8
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the comparative example comprises 300g of butyrolactone per liter of the swelling liquid and the balance of water.
Comparative example 9
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the comparative example comprises 400g of butyrolactone per liter of the swelling liquid and the balance of water.
Comparative example 10
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the comparative example comprises 200g of diethylene glycol diethyl ether per liter of swelling liquid and the balance of water.
Comparative example 11
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the comparative example comprises 300g of diethylene glycol diethyl ether per liter of swelling liquid and the balance of water.
Comparative example 12
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the comparative example comprises 400g of diethylene glycol diethyl ether per liter of the swelling liquid and the balance of water.
Comparative example 13
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the comparative example comprises 100g of ethylene glycol monobutyl ether, 100g of 1, 4-butanediol and the balance of water.
Comparative example 14
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the comparative example comprises 150g of ethylene glycol monobutyl ether, 150g of 1, 4-butanediol and the balance of water.
Comparative example 15
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the comparative example comprises 200g of ethylene glycol monobutyl ether, 200g of 1, 4-butanediol and the balance of water.
Comparative example 16
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the comparative example comprises 100g of methyl pyrrolidone, 100g of diethylene glycol and the balance of water per liter of the swelling liquid.
Comparative example 17
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the comparative example comprises 150g of methyl pyrrolidone, 150g of diethylene glycol and the balance of water per liter of the swelling liquid.
Comparative example 18
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the comparative example comprises 200g of methyl pyrrolidone, 200g of diethylene glycol and the balance of water per liter of the swelling liquid.
Comparative example 19
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board comprises 100g of tetrahydrofuran derivatives, 100g of hexanediol and the balance of water.
Comparative example 20
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board comprises 150g of tetrahydrofuran derivatives, 150g of hexanediol and the balance of water.
Comparative example 21
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board comprises 200g of tetrahydrofuran derivative, 200g of hexanediol and the balance of water.
Comparative example 22
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the comparative example comprises 100g of diethylene glycol diethyl ether, 100g of hexanediol and the balance of water.
Comparative example 23
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the comparative example comprises 150g of diethylene glycol diethyl ether, 150g of hexanediol and the balance of water per liter of swelling liquid.
Comparative example 24
The swelling liquid for the treatment of the residues on the inner wall of the through hole of the epoxy resin circuit board provided by the comparative example comprises 200g of diethylene glycol diethyl ether, 200g of hexanediol and the balance of water.
As used throughout this specification, the abbreviations given below have the following meanings unless the context clearly indicates otherwise: g = gram; mg = milligrams; ml = milliliter; l=l; cm = cm; m=m; mm = millimeter; μm = micrometers; min=min; ppm = parts per million; c = degrees celsius; m = moles; g/L = g/L; v = volume; wt% = weight percent; DI = deionized; tg = glass transition temperature.
The swelling liquids of examples 2 to 4, examples 7 to 9, examples 12 to 14 and examples 17 to 19, respectively, were selected and compared with those of comparative examples 1 to 24, respectively, to determine the comparative effects, and the results are shown in Table 1. For these examples, the following procedure was used for the effect determination:
a. taking a cut common Tg FR-4 substrate (5 cm multiplied by 5 cm), and polishing the periphery by using sand paper;
b. cleaning, and baking in an oven at 120+ -5deg.C for 15min;
c. taking out, placing into a dryer, cooling to room temperature, weighing and marking as W1 (accurate to 0.1 mg);
d. the plate was taken out after one pass through the desmear procedure described in example 41;
e. cleaning, and baking in an oven at 120+ -5deg.C for 15min;
f. taking out, placing into a dryer, cooling to room temperature, weighing and marking as W2 (accurate to 0.1 mg);
and (3) calculating: removal rate (mg/cm) 2 )＝(w1-w2)/(2s)
Wherein: s is the substrate area (length. Times. Width)
The removal rate is generally required: 0.15-0.45mg/cm 2
TABLE 1
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As can be seen from comparative examples 1 to 12 in Table 1, the swelling solutions ethylene glycol monobutyl ether, methyl pyrrolidone, diethylene glycol diethyl ether and butyrolactone have poor stain removal effect, and residues in the holes of the circuit board can be seen after the washing; as can be seen from comparative examples 13 to 24, although the two-component swelling agent has a better stain removing effect than the swelling solution, the residues in the circuit board holes can be seen after washing with water, while examples 2 to 4, examples 7 to 9, examples 12 to 14, examples 17 to 19 have a good stain removing effect, the residues in the circuit board holes can not be seen after washing with water, the weight of the removed residues can reach more than 0.6g, and the resin residues in the circuit board holes can be effectively removed without carrying out the process of removing the resin residues in the circuit board holes with permanganate after washing with water.
In summary, compared with other solvents, the swelling agent provided by the invention can form a rougher resin surface more easily, and the rougher resin surface is more beneficial to improving the adhesion of copper deposited on the through holes, so that the quality of the printed circuit board can be effectively improved due to good adhesion.
The above embodiments are only preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, but any insubstantial changes and substitutions made by those skilled in the art on the basis of the present invention are intended to be within the scope of the present invention as claimed.

Claims (9)

1. A swelling solution for processing residues on the inner wall of a through hole of an epoxy resin circuit board is characterized by comprising a swelling agent, 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and water.
2. The swelling solution for processing residues on the inner wall of a through hole of an epoxy resin circuit board according to claim 1, wherein the swelling agent is one of ethylene glycol monobutyl ether, methyl pyrrolidone, butyrolactone and diethylene glycol diethyl ether; the swelling liquid contains 10-600 g of the swelling agent, 20-50 g of 2, 5-dimethyl-2, 5-bis- (tert-butyl peroxide) hexane and the balance of water.
3. The swelling solution for the residue treatment of the inner wall of the through hole of the epoxy resin circuit board according to claim 2, wherein the swelling agent comprises one selected from the group consisting of 50 to 500g of ethylene glycol monobutyl ether, 50 to 500g of methyl pyrrolidone, 20 to 500g of butyrolactone and 50 to 500g of diethylene glycol diethyl ether per liter of the swelling solution.
4. The swelling solution for the residue treatment of the inner wall of the through hole of the epoxy resin circuit board according to claim 2, wherein the swelling agent is prepared from the following components in percentage by mass: 1 and 1, the mass ratio of the mixed solution of diethylene glycol monobutyl ether and 1, 4-butanediol is 1:1, the mass ratio of the mixed solution of ethylene glycol monobutyl ether and diethylene glycol is 1:1 and ethylene glycol is 1:1 and hexanediol.
5. The swelling liquid for the residue treatment of the inner wall of the through hole of the epoxy resin circuit board according to claim 4, wherein each liter of the swelling liquid contains one selected from the group consisting of 10-600 g of a mixture of diethylene glycol monobutyl ether and 1, 4-butanediol, 10-600 g of a mixture of ethylene glycol monobutyl ether and diethylene glycol, 10-600 g of a mixture of tetrahydrofuran derivative and ethylene glycol, and 10-600 g of a mixture of diethylene glycol diethyl ether and hexanediol.
6. The swelling liquid for the residue treatment of the inner wall of the through hole of the epoxy resin circuit board according to claim 5, wherein each liter of the swelling liquid contains one selected from the group consisting of 50-500 g of a mixture of diethylene glycol monobutyl ether and 1, 4-butanediol, 50-500 g of a mixture of ethylene glycol monobutyl ether and diethylene glycol, 50-500 g of a mixture of tetrahydrofuran derivative and ethylene glycol, and 50-500 g of a mixture of diethylene glycol diethyl ether and hexanediol.
7. The use of a swelling liquid for the through-hole inner wall residue treatment of an epoxy resin wiring board according to any one of claims 1 to 6, wherein the swelling liquid is suitable for any one of the through-hole inner wall residue swelling treatment of an epoxy resin wiring board of low TG, the through-hole inner wall residue swelling treatment of an epoxy resin wiring board of medium TG, or the through-hole inner wall residue swelling treatment of an epoxy resin wiring board of high TG.
8. The method for removing the residues on the inner wall of the through hole of the circuit board is characterized by comprising the following steps: firstly, placing the epoxy resin circuit board after drilling the through holes in the swelling liquid for treating residues on the inner walls of the through holes of the epoxy resin circuit board according to any one of claims 1-6, and keeping the temperature at 60-70 ℃ for 5-10 minutes to expand the residues in the through holes; and then washing with water to remove residues in the circuit board holes.
9. The method for removing residues from an inner wall of a via hole of a circuit board according to claim 8, wherein the temperature is maintained at 65 ℃ for 7 minutes to swell the residues in the via hole.
CN202310825151.XA 2023-07-06 2023-07-06 Swelling liquid for processing residues on inner wall of through hole of epoxy resin circuit board, application and processing method Pending CN116855321A (en)

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