JPH07142870A - Manufacture of multilayer printed wiring board - Google Patents
Manufacture of multilayer printed wiring boardInfo
- Publication number
- JPH07142870A JPH07142870A JP30993693A JP30993693A JPH07142870A JP H07142870 A JPH07142870 A JP H07142870A JP 30993693 A JP30993693 A JP 30993693A JP 30993693 A JP30993693 A JP 30993693A JP H07142870 A JPH07142870 A JP H07142870A
- Authority
- JP
- Japan
- Prior art keywords
- multilayer printed
- wiring board
- printed wiring
- drilling
- boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Drilling And Boring (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ドリル加工時に発生す
る加工粉の排出を容易にし、内層銅箔と基材との剥離お
よびハローイングの発生を抑制する多層プリント配線板
の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer printed wiring board which facilitates discharge of machining powder generated during drilling and suppresses peeling of an inner copper foil from a substrate and haloing.
【０００２】[0002]
【従来の技術】電子機器等の高度化、多様化、高信頼性
に伴って多層プリント配線板の需要が増加している。多
層プリント配線板は、1 枚以上の内層回路板、プリプレ
グ、銅箔等の外層導電層からなる多層プリント基板に回
路形成したものである。2. Description of the Related Art Demand for multilayer printed wiring boards is increasing with the sophistication, diversification and high reliability of electronic devices and the like. A multilayer printed wiring board is one in which a circuit is formed on a multilayer printed board composed of one or more inner layer circuit boards, prepregs, and outer conductive layers such as copper foil.
【０００３】多層プリント基板の製造において最も重要
なことは、内層回路板とプリプレグ（樹脂）との接着を
良くすることである。この接着を良くする方法として、
内層回路板の回路パターン表面に銅酸化物層を形成する
ことが行われている。即ち、図１に示したように、まず
内層回路板２の回路パターン２a 上に銅酸化物層３を形
成し、その上下にプリプレグ４を介在させ外層導電層５
を重ねて成形することにより多層化し、多層化したプリ
ント基板１をドリル加工してスルーホール６を明ける。
図１に示したスルーホール６の内面には、塩酸を含むメ
ッキ液によってスルーホールメッキを施して内層銅箔２
a 、外層導電層５間に電気的な接続がされる。The most important thing in manufacturing a multilayer printed circuit board is to improve the adhesion between the inner layer circuit board and the prepreg (resin). As a method to improve this adhesion,
A copper oxide layer is formed on the surface of a circuit pattern of an inner layer circuit board. That is, as shown in FIG. 1, first, the copper oxide layer 3 is formed on the circuit pattern 2a of the inner layer circuit board 2, and the prepreg 4 is interposed above and below the copper oxide layer 3 to form the outer conductive layer 5
Are laminated to form a multilayer, and the multilayer printed circuit board 1 is drilled to open the through holes 6.
The inner surface of the through hole 6 shown in FIG. 1 is subjected to through hole plating with a plating solution containing hydrochloric acid to form an inner layer copper foil 2
a, Electrical connection is made between the outer conductive layers 5.
【０００４】多層プリント配線板は、高密度化に伴い小
径スルーホールが増えハローイングという問題がでてき
た。ハローイングとは、図２に示したように基板１をス
ルーホールメッキのためにメッキ液に浸漬すると、スル
ーホール６の内壁に現れた内層銅箔２a の断面にメッキ
液中の塩酸が浸透し、特にプリプレグ４と接着している
銅酸化物層３を溶解して隙間７ができ、この結果半田耐
熱性が低下する現象である。また、ハローイングは、ド
リル条件やスルーホールメッキ条件にも原因があると考
えられており、特にドリル加工時に内層表面と基材間に
微細なクラックが発生することが主原因と考えられてい
る。ドリル加工では、通常 1.6mm厚さの基板を 2〜3 枚
重ねて 1度に穴を明けているが、微細なクラックの発生
を低減するため、基板を重ねずに 1枚毎に穴を明け
る。ドリルをステップ送りにし、加工粉を排出しなが
ら穴を明ける。回転数／ドリル送りの比を高くし加工
粉の排出性を高くするという方法が試みられているが、
いずれも作業能率を低下させる欠点があり好ましくな
い。In the multilayer printed wiring board, there has been a problem of haloing due to an increase in small-diameter through holes as the density is increased. As shown in FIG. 2, when the substrate 1 is immersed in a plating solution for through-hole plating as shown in FIG. 2, the hydrochloric acid in the plating solution penetrates into the cross section of the inner copper foil 2a appearing on the inner wall of the through hole 6. In particular, this is a phenomenon in which the copper oxide layer 3 adhered to the prepreg 4 is melted to form the gap 7, and as a result, the solder heat resistance is lowered. It is also considered that haloing is caused by drilling conditions and through-hole plating conditions, and in particular, it is mainly thought that fine cracks are generated between the inner layer surface and the base material during drilling. . In the drilling process, usually 2 to 3 boards with a thickness of 1.6 mm are stacked and holes are made at once, but in order to reduce the occurrence of minute cracks, holes are made one by one without stacking boards. . Step the drill and drill holes while discharging the processed powder. Attempts have been made to increase the ratio of rotation speed / drill feed to improve the discharge efficiency of processed powder.
All of them are not preferable because they have a drawback of lowering work efficiency.
【０００５】[0005]
【発明が解決しようとする課題】本発明は、上記の欠点
を解消するためになされたもので、作業能率を低下させ
ずにハローイングを抑制したドリル加工性を行うことに
よって、安定性に優れた信頼性の高い多層プリント配線
板を提供しようとするものである。SUMMARY OF THE INVENTION The present invention has been made to solve the above drawbacks and is excellent in stability by performing drilling workability with suppressed haloing without lowering work efficiency. It is intended to provide a reliable multilayer printed wiring board.
【０００６】[0006]
【課題を解決するための手段】本発明者は、上記の目的
を達成しようと鋭意研究を重ねた結果、ドリル加工時に
基板と基板の間に多孔質の中空部分のあるあて板を介在
させて、加工粉を収容するスペースを設けることによっ
て、上記の目的を達成できることを見いだし、本発明を
完成したものである。As a result of intensive studies to achieve the above-mentioned object, the present inventor has found that a substrate having a porous hollow portion is interposed between substrates during drilling. The inventors have found that the above object can be achieved by providing a space for containing the processed powder, and have completed the present invention.
【０００７】即ち、本発明は、少なくとも内層回路板、
プリプレグ層および外層導電層を有する多層プリント基
板に、ドリル加工を行い層間に導通するスルーホールを
形成し、外層に回路パターンを形成する多層プリント配
線板の製造方法において、上記基板を複数枚重ね、各基
板間に厚さ50〜500 μm の多孔質あて板を介在させてド
リル加工することを特徴とする多層プント配線板の製造
方法である。That is, the present invention provides at least an inner layer circuit board,
In a multilayer printed circuit board having a prepreg layer and an outer conductive layer, a through hole is formed by drilling to conduct between layers, in a method for manufacturing a multilayer printed wiring board in which a circuit pattern is formed in the outer layer, a plurality of the substrates are stacked, A method for manufacturing a multilayer punt wiring board, characterized in that a porous contact plate having a thickness of 50 to 500 μm is interposed between the respective substrates and drilling is performed.
【０００８】以下、本発明を詳細に説明する。The present invention will be described in detail below.
【０００９】本発明に用いる内層回路板としては、通常
使用されるものであればよく、特に制限されるものでは
ない。通常、ガラス布基材エポキシ、ガラス布基材ポリ
イミド等の両面銅張積層板等が使用される。この銅箔表
面には、ＵＶ硬化性樹脂を用いたフィルム法等常用の方
法で回路パターンを形成する。形成された回路パターン
には酸化銅層を形成させるが、その方法としては、Ｎa
Ｃl Ｏ4 、Ｎa ＯＨ、Ｎa 2 ＰＯ4 ・２Ｈ2 Ｏの水溶液
に浸漬する等、通常の黒化処理と呼ばれる酸化処理であ
ればよく、特に限定されるものではない。The inner layer circuit board used in the present invention is not particularly limited as long as it is a commonly used one. Usually, a double-sided copper clad laminate such as glass cloth base material epoxy or glass cloth base material polyimide is used. A circuit pattern is formed on the surface of the copper foil by a conventional method such as a film method using a UV curable resin. A copper oxide layer is formed on the formed circuit pattern.
There is no particular limitation as long as it is an oxidation treatment called a normal blackening treatment, such as immersion in an aqueous solution of Cl O 4 , Na OH, Na 2 PO 4 .2H 2 O.
【００１０】本発明に用いるプリプレグとしては、通常
多層プリント基板用として使用されているものであれば
いかなるものでもよく、特に限定されるものではない。The prepreg used in the present invention may be of any type as long as it is generally used for a multilayer printed circuit board, and is not particularly limited.
【００１１】また、本発明に用いる外層導電層として
は、銅箔等の金属箔等が使用され、アディティブ法等に
より形成されたものでもよく、特に限定されるものでは
ない。As the outer conductive layer used in the present invention, a metal foil such as a copper foil is used, and it may be formed by an additive method or the like, and is not particularly limited.
【００１２】こうして得られた内層回路板、プリプレ
グ、銅箔等を積層成形一体にして多層プリント基板を製
造することができる。The thus obtained inner layer circuit board, prepreg, copper foil, etc. can be laminated and integrated into a multilayer printed circuit board.
【００１３】本発明に用いるあて板としては、厚さが50
〜500 μm のものであることが望ましく、そして、多
孔質で中空部分が多いこと、表面が平滑であること、
ドリルを著しく摩耗させない材質であること（プラス
チック等）、硬く凹みにくいこと、放熱性のよいこ
と、耐熱性があること等のものであればよい。具体的
なあて板としてアルミニウム、あるいは高耐熱プラスチ
ックからなり、図３に示したように、中空部分１１を有
した多孔質あて板１０である。あて板の厚さが50μm 未
満では、ドリル加工時の加工粉を十分排出処理させるこ
とができず、また500 μm を超えると作業性に劣り好ま
しくない。The thickness of the contact plate used in the present invention is 50
~ 500 μm is desirable, and it is porous and has many hollow parts, smooth surface,
Any material that does not significantly wear the drill (plastic or the like), hard and difficult to dent, good heat dissipation, and heat resistant may be used. As a specific contact plate, the porous contact plate 10 is made of aluminum or high heat resistant plastic and has a hollow portion 11 as shown in FIG. If the thickness of the contact plate is less than 50 μm, it is not possible to sufficiently discharge the machining powder during drilling, and if it exceeds 500 μm, the workability is poor and it is not preferable.
【００１４】前述のように製造した多層プリント基板を
複数枚重ね、各基板間にこの多孔質あて板を介在させて
ドリル加工し、スルーホールメッキを施し外層導電層に
回路形成して多層プリント配線板を製造することができ
る。A plurality of multi-layer printed wiring boards produced by stacking the multi-layer printed wiring boards produced as described above, drilling with the porous contact plate interposed between the respective substrates, through-hole plating and forming a circuit on the outer conductive layer are provided. Plates can be manufactured.
【００１５】[0015]
【作用】本発明は、ドリル加工時に多孔質の中空部分
（隙間）を有したあて板を用いることによって、作業能
率を低下させることなく、ハローイング発生を抑制し安
定した多層プリント配線板を製造することができる。即
ち、多層プリント基板を複数枚重ね、各基板間にあて板
を介在させてドリル加工する。発生する加工粉を各基板
間の多孔質あて板に存在する隙間に収容させることによ
って、内層表面と基材間に加工粉が排出される時に発生
する微細なクラックがなくなり、その結果ハローイング
も抑制することができる。また、微細なクラックの発生
を心配することなく、複数枚の基板を同時にドリル加工
することができるため作業能率を低下させることはな
い。According to the present invention, by using a contact plate having a porous hollow portion (gap) during drilling, it is possible to suppress the occurrence of haloing and produce a stable multilayer printed wiring board without lowering work efficiency. can do. That is, a plurality of multi-layer printed circuit boards are stacked, and a drilling process is performed with a contact plate interposed between the respective substrates. By accommodating the generated powder in the gap that exists in the porous contact plate between each substrate, fine cracks generated when the processed powder is discharged between the inner layer surface and the base material are eliminated, and as a result, haloing also occurs. Can be suppressed. In addition, since a plurality of substrates can be drilled at the same time without worrying about the generation of fine cracks, work efficiency is not reduced.
【００１６】[0016]
【実施例】次に本発明を実施例によって具体的に説明す
るが、本発明はこれらの実施例によって限定されるもの
ではない。EXAMPLES The present invention will now be specifically described with reference to examples, but the present invention is not limited to these examples.
【００１７】実施例１ 次の各工程を経て多層プリント配線板を製造した。 (1) ガラス布基材エポキシ樹脂両面銅張積層板を内層回
路板用とし、銅箔表面にＵＶ硬化性樹脂を利用し回路パ
ターンを形成した。 (2) 次にこの回路形成した銅張積層板を次の水溶液に 5
分間浸漬して酸化銅層を形成した。 Ｎa Ｃl Ｏ4 40 g／l Ｎa ＯＨ 150 g／l Ｎa 2 ＰＯ4 ・２Ｈ2 Ｏ 5 g／l 処理温度 90 ℃ 十分水洗した後乾燥させ、105 ℃で30分間ベーキングを
行って内層回路板とした。 (3) こうして得られた内層回路板を用いて、エポキシ樹
脂を含浸したプリプレグを介して銅箔を重ね、170 ℃，
25 kgf／cm2 で90分間、加熱加圧一体に成形して多層プ
リント基板を製造した。 (4) この基板を 3枚重ね、各基板間に厚さ300 μm のア
ルミニウム製の多孔質あて板（図３に示したもの）を介
在させて次の条件でドリル加工した。 ドリル 東芝タンガロイ社製 ＰＨ−０４０ 回転数 72,000 rpm。 送り速度 1.4 m／分 ヒット数 3,000穴 (5) 常法によりスルーホールメッキを施し、次いで外層
導電層に回路形成して多層プリント配線板を製造した。Example 1 A multilayer printed wiring board was manufactured through the following steps. (1) A glass cloth-based epoxy resin double-sided copper clad laminate was used for an inner layer circuit board, and a circuit pattern was formed on the copper foil surface using a UV curable resin. (2) Next, the circuit-formed copper clad laminate was immersed in the following aqueous solution.
The copper oxide layer was formed by immersion for a minute. Na Cl O 4 40 g / l Na OH 150 g / l Na 2 PO 4 .2H 2 O 5 g / l Treatment temperature 90 ° C. After sufficiently washing with water, drying and baking at 105 ° C. for 30 minutes to form the inner circuit board. did. (3) Using the inner-layer circuit board thus obtained, copper foils are laminated through a prepreg impregnated with an epoxy resin, and 170 ° C,
A multilayer printed circuit board was manufactured by integrally molding under heat and pressure at 25 kgf / cm 2 for 90 minutes. (4) Three of these substrates were stacked, and a porous working plate (shown in FIG. 3) made of aluminum having a thickness of 300 μm was interposed between the substrates and drilled under the following conditions. Drill Toshiba Tungaloy PH-040 rpm 72,000 rpm. Feed rate 1.4 m / min Number of hits 3,000 holes (5) Through-hole plating was performed by a conventional method, and then a circuit was formed on the outer conductive layer to manufacture a multilayer printed wiring board.
【００１８】実施例２ 実施例１において、(4) の工程で厚さ 300μm のアルミ
ニウム製の多孔質あて板の替わりに、厚さ 100μm のア
ルミニウム製の多孔質あて板を用いた以外は全て実施例
１と同一にして多層プリント配線板を製造した。Example 2 All steps were carried out in the same manner as in Example 1 except that a porous contact plate made of aluminum having a thickness of 100 μm was used in place of the porous contact plate made of aluminum having a thickness of 300 μm in the step (4). A multilayer printed wiring board was manufactured in the same manner as in Example 1.
【００１９】比較例１ 実施例において、(4) の工程で厚さ 300μm のアルミニ
ウム製の多孔質あて板を使用せず、それ以外は実施例１
と同様にして多層プリント配線板を製造した。Comparative Example 1 In the Example, the porous contact plate made of aluminum and having a thickness of 300 μm was not used in the step (4), and otherwise the Example 1
A multilayer printed wiring board was manufactured in the same manner as in.
【００２０】比較例２ 実施例において、(4) の工程で厚さ 300μm のアルミニ
ウム製の多孔質あて板の替わりに、厚さ 300μm のベー
ク板を用いた以外は実施例１と同様にして多層プリント
配線板を製造した。Comparative Example 2 A multilayer structure was obtained in the same manner as in Example 1 except that a bake plate having a thickness of 300 μm was used in place of the aluminum-made porous contact plate having a thickness of 300 μm in the step (4). A printed wiring board was manufactured.
【００２１】実施例１〜２および比較例１〜２におい
て、(4) の工程の後のドリル加工した基板について、4
規定の塩酸に 5分間浸漬し、ハローイング発生の試験を
行ったのでその結果を表１に示したｔ＠、本発明の多層
プリント配線板は優れた特性を示し、本発明の効果を確
認することができた。In Examples 1 and 2 and Comparative Examples 1 and 2, the drilled substrate after the step (4) was
A test for haloing occurrence was conducted by immersing in normal hydrochloric acid for 5 minutes, and the results are shown in Table 1. t @, the multilayer printed wiring board of the present invention shows excellent characteristics, and confirms the effect of the present invention. I was able to.
【００２２】[0022]
【表１】 [Table 1]
【００２３】[0023]
【発明の効果】以上の説明および表１から明らかなよう
に、本発明の多層プリント配線板は、作業能率を低下さ
せることなく、ハローイングを低下させ、安定した信頼
性の高いものとすることができた。As is apparent from the above description and Table 1, the multilayer printed wiring board of the present invention has a low haloing and a stable and high reliability without lowering work efficiency. I was able to.
【図１】図１は、本発明に関連する多層プリント基板の
層構成を説明する断面図である。FIG. 1 is a cross-sectional view illustrating a layer structure of a multilayer printed circuit board related to the present invention.
【図２】図２は、本発明の課題であるハローイング現象
を説明する断面図である。FIG. 2 is a cross-sectional view illustrating the haloing phenomenon that is the subject of the present invention.
【図３】図３は、本発明に用いる多孔質あて板の斜視図
である。FIG. 3 is a perspective view of a porous backing plate used in the present invention.
１ 多層プリント基板 ２ 内層回路板 ２a 内層銅箔 ３ 銅酸化物層 ４ プリプレグ ５ 外層導電層 ６ スルーホール ７ 隙間 １０ 多孔質あて板 １１ 中空部分 1 Multilayer Printed Circuit Board 2 Inner Layer Circuit Board 2a Inner Layer Copper Foil 3 Copper Oxide Layer 4 Prepreg 5 Outer Conductive Layer 6 Through Hole 7 Gap 10 Porous Contact Plate 11 Hollow Part
Claims (1)
よび外層導電層を有する多層プリント基板に、ドリル加
工を行い層間に導通するスルーホールを形成し、外層に
回路パターンを形成する多層プリント配線板の製造方法
において、上記基板を複数枚重ね、各基板間に厚さ50〜
500 μm の多孔質あて板を介在させてドリル加工するこ
とを特徴とする多層プント配線板の製造方法。1. A method for manufacturing a multilayer printed wiring board, comprising: forming a through hole for conducting between layers by drilling a multilayer printed board having at least an inner circuit board, a prepreg layer and an outer conductive layer, and forming a circuit pattern on the outer layer. In the method, a plurality of the above substrates are stacked, and a thickness of 50 ~
A method for manufacturing a multilayer punt wiring board, characterized by drilling with a porous contact plate of 500 μm interposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30993693A JPH07142870A (en) | 1993-11-16 | 1993-11-16 | Manufacture of multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30993693A JPH07142870A (en) | 1993-11-16 | 1993-11-16 | Manufacture of multilayer printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07142870A true JPH07142870A (en) | 1995-06-02 |
Family
ID=17999136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30993693A Pending JPH07142870A (en) | 1993-11-16 | 1993-11-16 | Manufacture of multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07142870A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004108332A1 (en) * | 2003-06-06 | 2004-12-16 | Sumitomo Electric Industries, Ltd. | Drilled porous resin base material, and method of manufacturing porous resin base material with conductive drilled inner wall surface |
| CN100398238C (en) * | 2003-06-06 | 2008-07-02 | 住友电气工业株式会社 | Drilled porous resin base material, and method of manufacturing porous resin base material with conductive drilled inner wall surface |
-
1993
- 1993-11-16 JP JP30993693A patent/JPH07142870A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004108332A1 (en) * | 2003-06-06 | 2004-12-16 | Sumitomo Electric Industries, Ltd. | Drilled porous resin base material, and method of manufacturing porous resin base material with conductive drilled inner wall surface |
| CN100398238C (en) * | 2003-06-06 | 2008-07-02 | 住友电气工业株式会社 | Drilled porous resin base material, and method of manufacturing porous resin base material with conductive drilled inner wall surface |
| US8147911B2 (en) | 2003-06-06 | 2012-04-03 | Sumitomo Electric Industries, Ltd. | Perforated porous resin base material and production process of porous resin base with inner wall surfaces of perforations made conductive. |
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