CN1165591C - 导电粘接剂、安装结构体、液晶装置、电子设备及其制造方法 - Google Patents
导电粘接剂、安装结构体、液晶装置、电子设备及其制造方法 Download PDFInfo
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- CN1165591C CN1165591C CNB991243706A CN99124370A CN1165591C CN 1165591 C CN1165591 C CN 1165591C CN B991243706 A CNB991243706 A CN B991243706A CN 99124370 A CN99124370 A CN 99124370A CN 1165591 C CN1165591 C CN 1165591C
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- electrically conducting
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- conducting adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
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- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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- H05K3/341—Surface mounted components
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Organic Chemistry (AREA)
- Wire Bonding (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Liquid Crystal (AREA)
- Die Bonding (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33421298 | 1998-11-25 | ||
JP334212/1998 | 1998-11-25 | ||
JP30403499A JP3660175B2 (ja) | 1998-11-25 | 1999-10-26 | 実装構造体及び液晶装置の製造方法 |
JP304034/1999 | 1999-10-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1254744A CN1254744A (zh) | 2000-05-31 |
CN1165591C true CN1165591C (zh) | 2004-09-08 |
Family
ID=26563756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB991243706A Expired - Lifetime CN1165591C (zh) | 1998-11-25 | 1999-11-24 | 导电粘接剂、安装结构体、液晶装置、电子设备及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6356333B1 (zh) |
JP (1) | JP3660175B2 (zh) |
KR (1) | KR100581243B1 (zh) |
CN (1) | CN1165591C (zh) |
TW (1) | TW507001B (zh) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6377464B1 (en) * | 1999-01-29 | 2002-04-23 | Conexant Systems, Inc. | Multiple chip module with integrated RF capabilities |
TW487896B (en) * | 2000-02-24 | 2002-05-21 | Seiko Epson Corp | Mounting structure for semiconductor device, electro-optical device, and electronic apparatus |
US6614499B1 (en) * | 2000-08-16 | 2003-09-02 | Eastman Kodak Company | Electrically addressable display system with alignment reference features and process for forming same |
JP3767474B2 (ja) * | 2001-01-15 | 2006-04-19 | セイコーエプソン株式会社 | 表示装置及びその製造方法 |
JP3711873B2 (ja) * | 2001-02-19 | 2005-11-02 | ソニーケミカル株式会社 | バンプレスicチップの製造方法 |
JP2002299810A (ja) * | 2001-04-02 | 2002-10-11 | Matsushita Electric Ind Co Ltd | 電子部品の実装方法 |
JP3603890B2 (ja) * | 2002-03-06 | 2004-12-22 | セイコーエプソン株式会社 | 電子デバイス及びその製造方法並びに電子機器 |
WO2003098338A1 (fr) * | 2002-05-22 | 2003-11-27 | Sharp Kabushiki Kaisha | Materiau de transfert commun, ecran a cristaux liquides, procede de fabrication d'ecran a cristaux liquides |
US6933221B1 (en) * | 2002-06-24 | 2005-08-23 | Micron Technology, Inc. | Method for underfilling semiconductor components using no flow underfill |
JP3722137B2 (ja) * | 2002-08-21 | 2005-11-30 | セイコーエプソン株式会社 | 半導体装置の実装方法、半導体装置の実装構造、電気光学装置、電気光学装置の製造方法及び電子機器 |
JP2004145129A (ja) * | 2002-10-25 | 2004-05-20 | Advanced Display Inc | 表示装置およびその製造方法ならびに表示装置の製造装置 |
WO2005004286A2 (en) * | 2003-07-02 | 2005-01-13 | Integral Technologies, Inc. | Low cost and versatile resistors manufactured from conductive loaded resin-based materials |
CN1317752C (zh) * | 2004-08-30 | 2007-05-23 | 友达光电股份有限公司 | 侦测各向异性导电胶导电粒子变形量的方法和结构 |
US7935892B2 (en) * | 2005-04-14 | 2011-05-03 | Panasonic Corporation | Electronic circuit device and method for manufacturing same |
JP4123251B2 (ja) * | 2005-07-07 | 2008-07-23 | セイコーエプソン株式会社 | 半導体装置製造用基板、半導体装置の製造方法 |
WO2008102476A1 (ja) * | 2007-02-22 | 2008-08-28 | Sharp Kabushiki Kaisha | 電子回路装置、その製造方法及び表示装置 |
WO2010093035A1 (ja) * | 2009-02-16 | 2010-08-19 | 株式会社村田製作所 | 導電性樹脂組成物、それを用いた電子部品の製造方法、接合方法、接合構造、および電子部品 |
KR20120092600A (ko) * | 2009-09-30 | 2012-08-21 | 스미또모 베이크라이트 가부시키가이샤 | 도전 접속 재료, 단자간 접속 방법 및 접속 단자의 제조 방법 |
JP5134111B2 (ja) * | 2011-05-20 | 2013-01-30 | 住友電気工業株式会社 | 接続方法、接続構造および電子機器 |
TWI467718B (zh) | 2011-12-30 | 2015-01-01 | Ind Tech Res Inst | 凸塊結構以及電子封裝接點結構及其製造方法 |
CN105339768B (zh) * | 2013-06-25 | 2018-09-04 | 日本特殊陶业株式会社 | 爆震传感器 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62244142A (ja) * | 1986-04-16 | 1987-10-24 | Matsushita Electric Ind Co Ltd | 半導体素子の電気的接続方法 |
JPH01100993A (ja) * | 1987-10-14 | 1989-04-19 | Oki Electric Ind Co Ltd | 混成集積回路の製造方法 |
US5502889A (en) * | 1988-06-10 | 1996-04-02 | Sheldahl, Inc. | Method for electrically and mechanically connecting at least two conductive layers |
JPH0442547A (ja) * | 1990-06-08 | 1992-02-13 | Sharp Corp | プリント基板への部品搭載方法 |
JPH0682749A (ja) * | 1992-09-01 | 1994-03-25 | Seiko Epson Corp | チップ実装方法、並びにチップ実装構造及びそれを用いた電気光学装置及び電子印字装置 |
JPH06196513A (ja) * | 1992-12-22 | 1994-07-15 | Hitachi Chem Co Ltd | 接着剤および半導体装置 |
US5727310A (en) * | 1993-01-08 | 1998-03-17 | Sheldahl, Inc. | Method of manufacturing a multilayer electronic circuit |
JP3519100B2 (ja) * | 1993-04-02 | 2004-04-12 | サンスター技研株式会社 | 異方導電性接着剤組成物 |
JP3103956B2 (ja) * | 1993-06-03 | 2000-10-30 | ソニーケミカル株式会社 | 異方性導電膜 |
JP3159841B2 (ja) * | 1993-08-26 | 2001-04-23 | ポリプラスチックス株式会社 | レーザーによる回路形成方法及び導電回路形成部品 |
JP3648741B2 (ja) * | 1994-09-16 | 2005-05-18 | セイコーエプソン株式会社 | 液晶表示装置,その実装構造,及び電子機器 |
EP0747434B1 (en) * | 1995-06-06 | 2000-08-16 | Nisshinbo Industries, Inc. | Epoxy resin composition and adhesive based thereon |
US5861661A (en) * | 1995-12-27 | 1999-01-19 | Industrial Technology Research Institute | Composite bump tape automated bonded structure |
TW392179B (en) * | 1996-02-08 | 2000-06-01 | Asahi Chemical Ind | Anisotropic conductive composition |
MY128095A (en) * | 1996-04-03 | 2007-01-31 | Matsushita Electric Ind Co Ltd | Electronic part and method for manufacturing the same |
JP3328157B2 (ja) * | 1997-03-06 | 2002-09-24 | シャープ株式会社 | 液晶表示装置 |
JPH1178317A (ja) * | 1997-09-10 | 1999-03-23 | Hitachi Chem Co Ltd | Icカード |
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- 1999-10-26 JP JP30403499A patent/JP3660175B2/ja not_active Expired - Lifetime
- 1999-11-08 TW TW088119487A patent/TW507001B/zh not_active IP Right Cessation
- 1999-11-23 US US09/448,552 patent/US6356333B1/en not_active Expired - Lifetime
- 1999-11-24 CN CNB991243706A patent/CN1165591C/zh not_active Expired - Lifetime
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TW507001B (en) | 2002-10-21 |
KR20000035680A (ko) | 2000-06-26 |
JP2000219864A (ja) | 2000-08-08 |
KR100581243B1 (ko) | 2006-05-22 |
US6356333B1 (en) | 2002-03-12 |
CN1254744A (zh) | 2000-05-31 |
JP3660175B2 (ja) | 2005-06-15 |
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