CN116438669A - Cover member, package, and glass substrate - Google Patents
Cover member, package, and glass substrate Download PDFInfo
- Publication number
- CN116438669A CN116438669A CN202180074006.1A CN202180074006A CN116438669A CN 116438669 A CN116438669 A CN 116438669A CN 202180074006 A CN202180074006 A CN 202180074006A CN 116438669 A CN116438669 A CN 116438669A
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- cover member
- base
- thickness
- package
- protruding
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- 239000011521 glass Substances 0.000 title claims description 56
- 239000000758 substrate Substances 0.000 title claims description 33
- 229910052751 metal Inorganic materials 0.000 claims description 75
- 239000002184 metal Substances 0.000 claims description 75
- 238000004519 manufacturing process Methods 0.000 claims description 26
- 230000003746 surface roughness Effects 0.000 claims description 19
- 239000010410 layer Substances 0.000 description 55
- 238000000034 method Methods 0.000 description 31
- 239000005357 flat glass Substances 0.000 description 27
- 238000002834 transmittance Methods 0.000 description 26
- 239000000463 material Substances 0.000 description 23
- 238000010438 heat treatment Methods 0.000 description 21
- 230000000052 comparative effect Effects 0.000 description 20
- 238000003825 pressing Methods 0.000 description 16
- 238000000465 moulding Methods 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 8
- 238000001816 cooling Methods 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 7
- 238000005304 joining Methods 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000005388 borosilicate glass Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910000449 hafnium oxide Inorganic materials 0.000 description 4
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- 229910001128 Sn alloy Inorganic materials 0.000 description 3
- 239000005354 aluminosilicate glass Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000007733 ion plating Methods 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 230000002040 relaxant effect Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- 229910018068 Li 2 O Inorganic materials 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910000927 Ge alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- CNLWCVNCHLKFHK-UHFFFAOYSA-N aluminum;lithium;dioxido(oxo)silane Chemical compound [Li+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O CNLWCVNCHLKFHK-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910000500 β-quartz Inorganic materials 0.000 description 1
- 229910052644 β-spodumene Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The cover member (4) is provided with a plate-shaped frame (7) and a protruding portion (8) protruding from the frame (7). The protruding part (8) is provided with a base part (10) and a top part (12). The thickness of the top portion (12) is thinner than the thickness of the base portion (10).
Description
Technical Field
The present invention relates to a cover member for a package, a package having the cover member, and a glass substrate for forming the cover member.
Background
For example, patent document 1 discloses a package including: a base (substrate) on which a light emitting element (LED element) is mounted; a dome-shaped cover member (light-transmitting cover) fixed to the base so as to cover the light-emitting element; and an adhesive member that joins the base body and the cover member. In this package, the cover member is formed in a dome shape, so that a space for accommodating the light emitting element between the cover member and the base is ensured.
Prior art literature
Patent literature
Patent document 1: japanese patent application laid-open No. 2011-66169
Disclosure of Invention
Problems to be solved by the invention
In the conventional package, in order to improve the transmittance of the cover member, it is preferable to make the thickness as thin as possible. However, if the thickness of the cover member is too small, the strength thereof is lowered, and the cover member may be damaged.
Accordingly, the technical object of the present invention is to improve the transmittance of the cover member and ensure the strength.
Means for solving the problems
The present invention is a cover member for use in a package including a light emitting element and made of glass, the cover member including a plate-shaped frame portion and a protruding portion protruding from the frame portion, the protruding portion including a base portion and a top portion, the top portion having a thickness smaller than a thickness of the base portion.
According to this configuration, the thickness of the top portion of the protruding portion of the cover member is made thinner than the thickness of the base portion, whereby the transmittance of the protruding portion can be improved. Further, the thickness of the base portion of the protruding portion is thicker than the thickness of the top portion, so that the strength of the base portion can be made higher than the top portion. Thus, both improvement of the transmittance of the cover member and securing of the strength can be achieved.
In the above cover member, it is preferable that a ratio (Tmin/Tmax) of a thickness (Tmin) of the top portion to a thickness (Tmax) of the base portion is 0.08 or more and 0.9 or less. When the value of the ratio (Tmin/Tmax) is more than 0.9, the transmittance of the top becomes small, and when it is less than 0.08, the strength of the glass of the top cannot be ensured. Therefore, the improvement of the transmittance of the cover member and the securing of the strength of the top cannot be achieved at the same time.
In the lid member of the present invention, it is preferable that the protruding portion has an inner surface and an outer surface, and the surface roughness Ra of the inner surface is 1nm or less. By setting the upper limit of the surface roughness Ra of the inner surface to 1nm or less, diffuse reflection of light emitted from the light-emitting element inside the package on the inner surface of the glass can be suppressed, and a decrease in transmittance can be suppressed. Further, the surface roughness Ra of the outer surface is preferably 1nm or less. By defining the upper limit of the surface roughness Ra of the outer surface as described above, diffuse reflection of light emitted from the light-emitting element inside the package on the outer surface of the glass can be suppressed, and a decrease in transmittance can be suppressed. If the surface roughness Ra of the inner surface and the outer surface is 0.01nm or more, diffuse reflection of light emitted from the light-emitting element inside the package on the inner surface and the outer surface of the glass may affect the transmittance, and the surface roughness is not required to be smaller because the processing of the glass surface is costly.
The cover member of the present invention may further include a curved connecting portion connecting the base portion and the frame portion. This can improve the strength of the portion between the base portion and the frame portion of the protruding portion of the cover member as much as possible.
Preferably, the connecting portion has a first curved surface and a second curved surface connecting the base portion and the frame portion, the first curved surface has a radius of curvature of 0.5mm or more and 5mm or less, and the second curved surface has a radius of curvature of 0.5mm or more and 5mm or less.
Preferably, the frame portion has a first main surface and a second main surface, and a metal layer is formed on the first main surface. When the joining material is formed on the lid member, the metal layer is used, so that the joining material is well fitted to the metal layer, and as a result, the lid member and the base body can be joined.
A buffer film may be formed between the first main surface of the frame portion and the metal layer. By using this buffer film, residual stress generated inside the lid member due to the difference in thermal expansion coefficients between the lid member and the joining material can be relaxed in a state where the lid member and the base are joined, and breakage of the lid member due to the residual stress can be suppressed.
In the metal layer, a joint may be formed at a portion opposite to a portion in contact with the buffer film. By sandwiching the joint portion, the lid member and the base body can be joined in an airtight manner.
The package of the present invention includes the base body for supporting the light emitting element and the cover member described above, and can achieve both improvement in transmittance of the cover member and ensuring of strength.
The present invention is a glass substrate for use in a package including a light-emitting element and for manufacturing a cover member, the glass substrate including a plate-shaped frame portion and a plurality of protruding portions protruding from the frame portion, the protruding portions including a base portion and a top portion, the top portion having a thickness smaller than a thickness of the base portion.
According to this configuration, the thickness of the top portion of the protruding portion is made thinner than the thickness of the base portion, whereby the transmittance of the protruding portion can be improved. Further, the thickness of the base portion of the protruding portion is thicker than the thickness of the top portion, so that the strength of the base portion can be made higher than the top portion. Thus, both improvement in transmittance and securing of strength of the cover member manufactured from the glass substrate can be achieved.
Effects of the invention
According to the present invention, both improvement of the transmittance of the cover member and securing of the strength can be achieved.
Drawings
Fig. 1 is a perspective view of a package.
Fig. 2 is a cross-sectional view of the package.
Fig. 3 is a cross-sectional view of the substrate.
Fig. 4 is a top view of the substrate.
Fig. 5 is a cross-sectional view of the cover member.
Fig. 6 is a bottom view of the cover member.
Fig. 7 is a sectional view showing a preparation step of the method for manufacturing the package.
Fig. 8 is a sectional view showing a preparation step of the method for manufacturing the package.
Fig. 9 is a cross-sectional view showing a bonding step of the method for manufacturing the package.
Fig. 10 is a cross-sectional view showing a bonding step of the method for manufacturing the package.
Fig. 11 is a cross-sectional view showing a glass substrate used for manufacturing a cover member for a package.
Fig. 12 is a cross-sectional view showing other examples of the cover member.
Fig. 13 is a plan view showing another example of the cover member.
Fig. 14 is a plan view showing another example of the cover member.
Fig. 15 is a cross-sectional view showing another example of a preparation process of the method for manufacturing the package.
Fig. 16 is a cross-sectional view showing another example of the package.
Fig. 17 is a cross-sectional view showing another example of the package.
Fig. 18 is a side view of the breaking strength tester showing the package.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig. 1 to 17 show an embodiment of a cover member, a package, and a glass substrate of the present invention.
As shown in fig. 1 and 2, the package 1 includes: a base body 2; a light emitting element 3 supported by the base 2; a cover member 4 covering the base 2 and the light emitting element 3; and a sealing portion 5 for hermetically joining the base body 2 and the cover member 4.
Fig. 3 and 4 show the base body 2 before the cover member 4 is joined. The base body 2 has: a first main surface 2a for supporting the light emitting element 3; a second main surface 2b located on the opposite side of the first main surface 2 a; and a metal layer 6 formed on the first main surface 2a.
Examples of the material of the substrate 2 include ceramics such as aluminum nitride, aluminum oxide, silicon carbide, and silicon nitride, glass ceramics obtained by mixing and sintering these ceramics with glass powder, alloys such as fe—ni—co alloy, cu—w alloy, and Kovar (registered trademark).
As shown in fig. 4, the metal layer 6 has a frame shape surrounding the light emitting element 3. The metal layer 6 has a quadrangular shape, but is not limited to this shape. The metal layer 6 may be formed in a circular shape so as to surround the light emitting element 3, for example.
The metal layer 6 includes three layers, i.e., a base layer, an intermediate layer, and a surface layer, in this order from the first main surface 2a side. Examples of the metal used for the underlayer include Cr, ta, W, ti, mo, ni, pt. Examples of the metal used in the intermediate layer include Ni, pt, and Pd. Examples of the metal used in the surface layer include Au, sn, ag, ni, pt. The metal used for the metal layer 6 may be a single body or an alloy.
Examples of the method for forming the metal layer 6 on the first main surface 2a of the substrate 2 include sputtering, vacuum vapor deposition using ion assist or ion plating, and film forming methods such as CVD.
The light emitting element 3 is fixed to the first main surface 2a of the base 2. In the present embodiment, the package 1 using an ultraviolet irradiation LED as the light emitting element 3 is illustrated, but the light emitting element 3 of the present invention is not limited to the present embodiment, and an infrared LED or a visible LED can be used.
Fig. 5 and 6 show the cover member 4 before being joined to the base body 2. The cover member 4 is manufactured by forming a part of the sheet glass. The glass used for the cover member 4 is preferably alkali-free glass, borosilicate glass, aluminosilicate glass, quartz glass, or crystallized glass. The alkali-free glass, borosilicate glass, and aluminosilicate glass can provide both high transmittance and high processability during molding. In addition, in the case of quartz glass, it is possible to have significantly high transmittance in the ultraviolet range while maintaining workability at the time of molding. In addition, the crystalline glass can achieve both high transmittance and high breaking strength.
In the case where the glass is borosilicate glass, aluminosilicate glass, or alkali-free glass, it is preferable that SiO is contained in mass% as the glass composition 2 ：50～75％、Al 2 O 3 ：1～25％、B 2 O 3 ：0～30％、Li 2 O+Na 2 O+K 2 O：0～20％、MgO+CaO+SrO+BaO: 0-20%. The glass composition falls within the above-mentioned composition range, and falls within these glass systems.
In the case of crystallized glass, it is preferable that SiO is contained in mass% as the glass composition 2 ：60～80％、Al 2 O 3 ：3～30％、Li 2 O+Na 2 O+K 2 O: 1-20%, mgO+CaO+SrO+BaO:5 to 20% by weight of a glass which is a low thermal expansion crystalline glass in which beta quartz solid solution or beta spodumene is precipitated as crystals from the inside of the glass. Here, low thermal expansion means that the value of the thermal expansion coefficient is 10X 10 in the temperature range of 30 to 300 DEG C -7 ～20×10 -7 /℃。
As shown in fig. 2 and 5, the cover member 4 includes a plate-shaped frame portion 7, a dome-shaped protruding portion 8 protruding from the frame portion 7, and a connecting portion 9 connecting the frame portion 7 and the protruding portion 8.
The frame 7 has a certain thickness, for example, but is not limited to this configuration. The thickness of the frame 7 is, for example, 0.2mm or more and 2mm or less. The frame 7 has a first main surface 7a and a second main surface 7b located opposite to the first main surface 7a. The surface roughness (arithmetic average roughness) Ra of the first main surface 7a is preferably 1nm or less, more preferably 0.5nm or less, and further preferably 0.3nm or less. The surface roughness Ra of the second main surface 7b is preferably 1nm or less, more preferably 0.5nm or less, and still more preferably 0.3nm or less.
The protruding portion 8 is used to form a housing space for the light emitting element 3 together with the first main surface 2a of the base 2. The protruding portion 8 is formed at the central position of the frame portion 7, but is not limited to this configuration. The protruding portion 8 has an inner surface 8a having a concave curved surface and an outer surface 8b having a convex curved surface. The protruding portion 8 includes a base portion 10, a middle portion 11, and a top portion 12. The base 10 is integrally formed with the connecting portion 9. The intermediate portion 11 is located between the base portion 10 and the top portion 12. When a straight line (hereinafter referred to as a "third line") L3 having an angle of 5 ° with respect to the second line L2 is drawn from the intersection point P, which is the intersection point between the normal line (hereinafter referred to as a "first line") L1 drawn to the top 12 and the straight line (hereinafter referred to as a "second line") L2 drawn along the second main surface 7b of the frame 7, the base 10 is a portion where the third line L3 intersects the protruding portion 8.
The outer diameter D of the protruding portion 8 (base portion 10) is, for example, 2mm or more and 150mm or less. The height H of the protruding portion 8 (the distance from the second main surface 7b of the frame portion 7 to the top 12) is, for example, 0.5mm or more and 80mm or less. As shown in fig. 5, the thickness of the protruding portion 8 becomes gradually thinner as it goes from the base portion 10 toward the top portion 12. Thus, the thickness Tmin of the top 12 is thinner than the thickness Tmax of the base 10.
The thickness Tmax of the base 10 is, for example, 0.19mm or more and 1.9mm or less. The thickness Tmin of the top 12 is, for example, 0.15mm or more and 1.0mm or less. The ratio Tmin/Tmax of the thickness Tmax of the base 10 to the thickness Tmin of the top 12 is preferably 0.08 or more and 0.9 or less, more preferably 0.1 or more and 0.8 or less, and still more preferably 0.2 or more and 0.5 or less.
The inner surface 8a and the outer surface 8b are formed as curved surfaces continuous from the base 10 to the top 12. The surface roughness Ra of the inner surface 8a is preferably 1nm or less, more preferably 0.5nm or less, and still more preferably 0.3nm or less. The surface roughness Ra of the outer surface 8b is preferably 1nm or less, more preferably 0.5nm or less, and still more preferably 0.3nm or less.
As shown in fig. 2 and 5, the connecting portion 9 has a curved shape for connecting the base portion 10 and the frame portion 7. The connecting portion 9 has a first curved surface 9a connecting the first main surface 7a of the frame portion 7 with the inner surface 8a of the protruding portion 8, and a second curved surface 9b connecting the outer surface 8b of the protruding portion 8 with the second main surface 7b of the frame portion 7.
The radius of curvature of the first curved surface 9a is larger than the radius of curvature of the second curved surface 9b. The radius of curvature of the first curved surface 9a is preferably 0.5mm or more and 5mm or less, more preferably 1mm or more and 4mm or less. The radius of curvature of the second curved surface 9b is preferably 0.5mm or more and 5mm or less, more preferably 1mm or more and 4mm or less. The surface roughness Ra of the first curved surface 9a is preferably 1nm or less, more preferably 0.5nm or less, and still more preferably 0.3nm or less. The surface roughness Ra of the second curved surface 9b is preferably 1nm or less, more preferably 0.5nm or less, and still more preferably 0.3nm or less.
As shown in fig. 2, 5 and 6, a buffer film 13, a metal layer 14 and a joint portion 15 are formed on the first main surface 7a of the frame portion 7. The lid member 4 has the flat plate-like frame portion 7, and thus can secure a large area (area) for forming the buffer film 13, the metal layer 14, and the joint portion 15 on the first main surface 7a. Further, since the cover member 4 has the flat plate-shaped frame portion 7, the frame portion 7 can be gripped by a gripping tool or the like in the process of manufacturing the package 1 without being in contact with the protruding portion 8 or the base portion 10 affecting the optical characteristics thereof. This can improve the handleability in the manufacturing process of the package 1 and improve the manufacturing efficiency of the package 1.
The buffer film 13 is used to alleviate stress generated in the frame portion 7 of the lid member 4 when the base 2 and the lid member 4 are joined by the joining portion 15. The buffer film 13 is made of an oxide film.
The Young's modulus of the oxide constituting the buffer film 13 is preferably 250GPa or less, more preferably 200GPa or less, further preferably 150GPa or less, particularly preferably 100GPa or less. When the upper limit is defined in this way, the cushioning property of the cushioning film 13 can be improved, and an effect of relaxing the stress caused by the difference in the thermal expansion coefficients of the joint portion 15 and the cover member 4 (frame portion 7) can be obtained. The thermal expansion coefficient of the frame portion 7 is smaller than that of the joint portion 15. The thermal expansion coefficient of the frame 7 is smaller than that of the base 2.
As shown in fig. 5 and 6, the buffer film 13 is formed on the first main surface 7a of the frame portion 7 of the cover member 4. As shown in fig. 6, the buffer film 13 has a frame shape. The buffer film 13 is formed in a quadrangular shape, but the shape is not limited to this shape, and may be a circular shape or other shapes. The buffer film 13 has, for example, a film of silicon oxide (SiO) alternately included as a first film 2 ) Hafnium oxide film (HfO 2 ) Is a multilayer film structure of (a). The material of the buffer film 13 is not limited to this embodiment.
The thickness of the buffer film 13 is preferably 0.1 μm or more and 1 μm or less, more preferably 0.2 μm or more and 0.8 μm or less. When the lower limit is defined in this way, the cushioning property of the cushioning film 13 can be further improved, and an effect of relaxing the stress caused by the difference in the thermal expansion coefficients of the joint portion 15 and the cover member 4 (frame portion 7) can be obtained. In addition, if the upper limit is defined in this way, the manufacturing cost of the buffer film 13 can be reduced.
In the case where the light emitting element 3 is an LED for ultraviolet irradiation, the buffer film 13 also functions as an antireflection film for preventing reflection of ultraviolet rays. That is, the buffer film 13 has a multilayer structure in which low refractive index layers (silicon oxide films in this embodiment) and high refractive index layers (hafnium oxide films in this embodiment) are alternately stacked. The transmittance of ultraviolet rays (wavelength 280 nm) of the buffer film 13 is preferably 90% or more.
As shown in fig. 5 and 6, the metal layer 14 is formed so as to overlap with the buffer film 13. As shown in fig. 6, the metal layer 14 has a quadrangular frame shape so as to correspond to the shape of the metal layer 6 of the base 2. The shape of the metal layer 14 is not limited to this embodiment. The metal layer 14 may also have a circular shape and various other frame shapes. The metal layer 14 includes three layers, i.e., a base layer, an intermediate layer, and a surface layer, in this order from the buffer film 13 side. By making the width of the metal layer 14 narrower than the width of the buffer film 13, the influence of stress due to the difference in thermal expansion coefficients between the joint portion 15 and the cover member 4 can be reduced.
Examples of the metal used for the underlayer include Cr, ta, W, ti, mo, ni, pt. When Cr is used for the underlayer, the Young's modulus of the underlayer is 279GPa. Examples of the metal used in the intermediate layer include Ni, pt, and Pd. Examples of the metal used in the surface layer include Au, sn, ag, ni, pt. The metal used in the metal layer 14 may be a single body or an alloy.
As shown in fig. 5 and 6, the joint 15 is formed in a layered shape overlapping the metal layer 14. As shown in fig. 5, the joint portion 15 is in contact with a portion of the metal layer 14 opposite to a portion in contact with the buffer film 13. As shown in fig. 6, the joint portion 15 has a quadrangular frame shape so as to correspond to the shapes of the buffer film 13 and the metal layer 14. The shape of the joint 15 is not limited to the present embodiment, and may be circular or various other frame shapes.
The joint 15 is made of a metal-based joint material. As the metal-based bonding material, a bonding material commercially available as a solder or a brazing filler metal can be used. Examples of the metal-based bonding material include au—sn alloy, pb—sn alloy, au—ge alloy, and sn—ni alloy. By making the width of the joint 15 narrower than the width of the buffer film 13, the influence of stress due to the difference in thermal expansion coefficients between the joint 15 and the cover member 4 can be reduced. In this embodiment, a case will be described in which an au—sn alloy is used as a metal-based bonding material.
For example, in the case where the joint 15 is formed on the first main surface 7a of the frame 7 by using the screen printing method, the first main surface 7a is formed in a flat surface shape, and thus the degree of freedom in the width and position of the joint 15 formed on the first main surface 7a can be increased.
The seal portion 5 is formed by integrally joining the metal layer 6 of the base body 2 and the metal layer 14 of the lid member 4 by the joining portion 15.
Next, a method of manufacturing the package 1 will be described. The method comprises the following steps: a preparation step of preparing the base body 2 and the cover member 4; and a bonding step of bonding the base body 2 and the cover member 4.
In the preparation step, after the metal layer 6 is formed on the first main surface 2a of the base 2, the light emitting element 3 is mounted on the first main surface 2a.
In the preparation step, after the cover member 4 is manufactured by forming the protruding portion 8 on the sheet glass, the buffer film 13, the metal layer 14, and the joint portion 15 are formed on the first main surface 7a side of the frame portion 7.
Hereinafter, a method of forming the protruding portion 8 in the cover member 4 (a method of manufacturing the cover member 4) will be described with reference to fig. 7 and 8.
Fig. 7 shows a manufacturing apparatus of the cover member 4. The manufacturing apparatus 16 includes: a support table 17 for supporting the glass GS; a mask member 18 disposed so as to overlap the plate glass GS supported by the support table 17; and a heating source 19 that thermally deforms a portion of the sheet glass GS so as to shape the protruding portion 8 of the cover member 4. The manufacturing apparatus 16 further includes: a pressing member 20 that presses the support table 17 and the mask member 18 in a direction to approach each other; and an external force generating device 21 for applying an external force to a portion of the sheet glass GS.
The support base 17 has: a support 17a for supporting the glass GS; and a space portion 17b having an opening surrounded by the support portion 17a and allowing thermal deformation of a part of the sheet glass GS. The support portion 17a of the support table 17 has a support surface for supporting the main surface of the glass GS. The opening of the present embodiment has a circular opening edge E1, but may have a triangular opening edge, a polygonal opening edge such as a quadrangular opening edge, or an elliptical opening edge such as an elliptical opening edge.
The space 17b of the support base 17 may be formed by a through hole or a recess having an inner bottom. The space 17b of the support base 17 is configured to form the entirety of the protruding portion 8 of the cover member 4 in a non-contact state. Examples of the material constituting the support base 17 include metal and ceramic.
The configuration is not limited to the above configuration, and a lower receiving jig for receiving the sheet glass GS may be provided in the space 17b in order to form the shape of the cover member 4 with high accuracy. The lower bearing clamp is made of metal and ceramic. As described above, the entirety of the protruding portion 8 of the cover member 4 is preferably molded in a non-contact state, but by improving the quality of the surface of the lower receiving jig that is in contact with the sheet glass GS (reducing the surface roughness and surface waviness), the cover member 4 can be molded with high accuracy even when the lower receiving jig is used.
As shown in fig. 7, the mask member 18 has a through hole 18a. The through hole 18a of the mask member 18 of the present embodiment has a circular inner peripheral edge E2, but may have a triangular shape, a polygonal shape such as a quadrangular shape, or an elliptical shape.
The support table 17 and the mask member 18 are configured such that at least a part of the inner peripheral edge E2 of the through hole 18a of the mask member 18 is disposed inside the opening edge E1 of the support table 17. Specifically, the support base 17 and the mask member 18 are configured such that the entirety of the inner peripheral edge E2 of the through hole 18a of the mask member 18 is disposed at a position inside the opening edge E1 of the support base 17.
When the opening area of the opening of the support base 17 is set to 100%, the cross-sectional area of the through hole 18a of the mask member 18 is preferably 95% or less, and more preferably 80%. At least a part of the inner peripheral edge E2 of the through hole 18a of the mask member 18 is preferably disposed at a position 1mm or more inside the opening edge E1 of the support base 17, and more preferably at a position 3mm or more inside.
The mask member 18 is preferably made of a material having a thermal conductivity of 1[W/(m·k) or less at 600 ℃. As a material constituting the mask member 18, for example, ceramic is preferable. The thickness of the mask member 18 is preferably 1mm or more. The mask member 18 of the present embodiment has an overall outer shape covering the outer periphery of the cover glass GS.
The heating source 19 is configured to heat the plate glass GS from the mask member 18 side. The heating source 19 of the present embodiment is a burner that emits a flame FL toward the sheet glass GS. By using a burner, the sheet glass GS can be softened relatively quickly. The heating system of the heating source 19 may be, for example, resistance heating or laser heating. The heating source 19 is constituted by combining heating sources of different heating systems.
The pressing member 20 presses the mask member 18 toward the support table 17, for example. Examples of the pressing mechanism that presses the pressing member 20 include a fluid cylinder, a linear actuator, and the like. The pressing member 20 may be configured to press the support table 17 against the fixed mask member 18.
As the external force generating device 21, for example, an exhaust device can be used. The exhaust device exhausts the gas existing in the space 17b of the support table 17, thereby setting the space 17b of the support table 17 to a negative pressure. As a result, a part of the sheet glass GS is sucked into the space 17b of the support base 17, and thermal deformation of a part of the sheet glass GS can be promoted. As the exhaust device, for example, a pump using a venturi mechanism is preferable.
The external force generating device 21 is not limited to the exhaust device, and may be a high-pressure gas generating device that ejects high-pressure gas from the mask member 18 side toward a part of the sheet glass GS. Thereby, a part of the sheet glass GS is pressurized toward the space 17b of the support table 17, and thermal deformation of a part of the sheet glass GS can be promoted. In addition, a pump and a high-pressure gas generating device may be used simultaneously to promote thermal deformation of a part of the sheet glass GS.
The method of manufacturing the cover member 4 by the manufacturing apparatus 16 having the above-described structure includes a forming step of thermally deforming a part of the sheet glass GS.
As shown in fig. 7 and 8, in the molding step, first, the mask member 18 is placed on the sheet glass GS supported by the support table 17. In this case, the support base 17 and the mask member 18 are disposed at least partially inside the inner peripheral edge E2 of the through hole 18a of the mask member 18 at a position inside the opening edge E1 of the support base 17. Thereafter, the pressing member 20 presses the support table 17 and the mask member 18 in a direction to approach each other. This can suppress the positional displacement of the plate glass GS sandwiched between the support table 17 and the mask member 18.
Next, in the molding step, the glass GS is heated from the mask member 18 side by the heating source 19. Thereby, a part of the sheet glass GS is thermally deformed, thereby forming the protruding portion 8.
In the above-described molding step, the opening edge E1 of the support base 17 can be covered with the mask member 18. Thereby, the connecting portion 9 of the cover member 4 can be formed by thermal deformation of the plate glass GS along the inner peripheral edge E2 of the through hole 18a of the mask member 18. That is, the connecting portion 9 of the cover member 4 is formed without contacting the support base 17. Through this molding step, the lid member 4 having the frame portion 7, the protruding portion 8, and the connecting portion 9 is formed.
In addition to the above, the method of forming the protruding portion 8 in the cover member 4 (the method of manufacturing the cover member 4) may be a method of placing the sheet glass GS on a metal or ceramic mold having a concave portion and hot-pressing the sheet glass GS using a metal or ceramic mold having a convex portion fitted in the concave portion. The heating temperature in the hot pressing is preferably not lower than the yield point of the sheet glass GS, and more preferably not lower than the softening point of the sheet glass GS.
When the molding process is completed, the buffer film 13, the metal layer 14, and the joint portion 15 are sequentially formed on the first main surface 7 of the frame portion 7.
First, a silicon oxide film and a hafnium oxide film are alternately laminated on the first main surface 7a of the frame 7, thereby forming the buffer film 13. Examples of the method for forming the buffer film 13 include a sputtering method, a vacuum deposition method using ion assist or ion plating, and a film formation method of CVD method.
Next, the metal layer 14 is formed so as to overlap with the buffer film 13. Examples of the method for forming the metal layer 14 include a sputtering method, a vacuum deposition method using ion assist or ion plating, and a film formation method using CVD.
Thereafter, the joint portion 15 is formed so as to overlap with the metal layer 14. The joint 15 has a step (coating step) of coating a metal-based joint material, for example, in the form of a paste, on the metal layer 14. Specific examples of the coating step include a printing method using a mask (screen printing method) and a coating method using a dispenser.
The bonding portion 15 is not limited to the above-described method, and for example, a molded body of a metal bonding material formed into a predetermined frame shape may be disposed so as to overlap the metal layer 14 of the first main surface 7a of the frame 7.
When the metal-based bonding material of the bonding portion 15 is applied to the first main surface 7a of the frame portion 7, a heat treatment process for fixing the metal-based bonding material to the metal layer 14 of the first main surface 7a is performed. The heat treatment step includes a heating step and a cooling step.
In the heating step, the lid member 4 is heated using a heating device such as a reflow oven, so that the metal-based joining material can be melted. The heating step may be performed, for example, in a state where nitrogen gas is filled into the furnace. In the heating step, the cover member 4 is heated to a temperature of 300 ℃ or higher.
In the cooling step, the metal-based joining material melted on the first main surface 7a of the frame portion 7 is cooled and solidified. The cooling step preferably includes annealing at a temperature maintained in a temperature range of 150 ℃ to 300 ℃ for a period of 2 minutes to 30 minutes. In the cooling step, a stress is generated in the lid member 4 due to a difference in thermal expansion coefficient between the frame portion 7 and the joint portion 15, but the buffer film 13 can alleviate the stress.
As shown in fig. 9, in the bonding step, the lid member 4 is overlapped with the base 2. Specifically, the first main surface 7a of the frame portion 7 of the cover member 4 is opposed to the base 2, and the joint portion 15 is brought into contact with the metal layer 6 formed on the first main surface 2a of the base 2.
Next, as shown in fig. 10, the pressing member 22 is placed on the frame portion 7 of the cover member 4. The pressing member 22 has a weight 23 and a support member 24 that supports the weight 23. As the counterweight 23 and the support member 24, for example, a metal or ceramic member is used.
The support member 24 has a first support portion 24a that supports the counterweight 23, and a second support portion 24b that supports the first support portion 24 a.
The first support portion 24a has a support surface (upper surface) on which the counterweight 23 is placed. The second support portion 24b includes a plurality of rod-like members. The second support portion 24b protrudes downward from the lower surface of the first support portion 24 a.
The second support portion 24b has a contact portion 25 that contacts the frame portion 7 of the cover member 4. The contact portion 25 is formed in a tip shape. The contact portion 25 contacts the second main surface 7b of the frame 7 so as to correspond to the position of the buffer film 13 of the frame 7.
The pressing member 22 contacts the frame portion 7 via the contact portions 25 of the plurality of second support portions 24b, and presses the cover member 4 in a self-standing state on the cover member 4. By pressing the cover member 4 with the pressing member 22, the joint portion 15 formed in the frame portion 7 of the cover member 4 can be brought into close contact with the metal layer 6 formed on the first main surface 2a of the base 2.
Then, the metal layer 6 and the joint portion 15 are heated in a state of being pressed against each other (heating step). Thereby, the metal-based joining material of the joining portion 15 is in a molten state. In this heating step, the tip-shaped contact portion 25 of the second support portion 24b is in contact with the frame portion 7 of the cover member 4, so that the contact area of the contact portion 25 with the frame portion 7 can be made as small as possible. This can minimize heat transfer from the frame 7 to the second support portion 24b of the pressing member 22.
Thereafter, the molten metal-based joining material is cooled to solidify the material (cooling step). In the cooling step, stress is generated in the frame portion 7 due to a difference in thermal expansion coefficient between the base body 2 and the frame portion 7 of the lid member 4. In this case, the buffer film 13 is deformed to alleviate the stress. This can reduce breakage of the frame 7.
When the cooling step is completed, a sealing portion 5 is formed in which the metal layer 6 of the base body 2 and the metal layer 14 of the lid member 4 are integrally joined together at a joint portion 15. Through the above, the package 1 maintaining the airtightness is completed.
Fig. 11 shows an example of a glass substrate for manufacturing the cover member 4. The glass substrate G includes a frame 7 and a plurality of protruding portions 8 protruding from the frame 7. Each of the protruding portions 8 has the same structure as the protruding portion 8 of the cover member 4 in the above-described embodiment. Each of the protruding portions 8 is formed by thermally deforming a plurality of portions of the large sheet glass GS by the above-described manufacturing apparatus 16. When the glass substrate G is cut along the cutting line CL, a plurality of cover members including the protruding portion 8 and the frame portion 7 can be efficiently manufactured.
Fig. 12 shows other examples of the cover member. In this example, the cover member 4 includes a frame portion 7, a plurality of protruding portions 8 protruding from the frame portion 7, and a buffer film 13, a metal layer 14, and a joint portion 15 formed on the first main surface 7a of the frame portion 7. Each constituent element of the cover member 4 has the same structure as the cover member 4 in the above-described embodiment. When the plurality of light emitting elements 3 are mounted on the base 2, the cover member 4 can seal the light emitting elements 3 individually by the plurality of protruding portions 8, the buffer films 13, and the like.
Fig. 13 and 14 are plan views showing other examples of the cover member. In this example, the cover member 4 has a plurality of projections 8 arranged in a plurality of rows and columns. The cover member 4 shown in fig. 13 has a plurality of protruding portions 8 configured in a circular shape in plan view. On the other hand, the cover member 4 shown in fig. 14 has a plurality of protruding portions 8 configured in a quadrangular shape in plan view. In the case of the lid member 4 having the plurality of projections 8 arranged in a plurality of rows and a plurality of columns, a scribe line is formed on the smooth surface between the adjacent projections 8, and the lid member 4 is cut along the scribe line, or the lid member is cut by a blade cutting method or a laser ablation method, whereby a plurality of lid members can be obtained, and a lid member having an arbitrary shape can be obtained.
Fig. 15 shows another example of a method for manufacturing a cover member (a preparation step in a method for manufacturing a package). In this example, a step of forming the joint portion 15 on the glass substrate G on which the buffer film 13 and the metal layer 14 are formed is shown. Specifically, a case will be described in which the glass substrate G is fixed to the supporting device 26 when the joint 15 is formed by the screen printing method.
The support device 26 includes a support plate 27 that supports the glass substrate G, and a suction table 29 that supports the support plate 27.
The support plate 27 is configured to be detachable from the suction table 29. The support plate 27 has an opening 28 into which the protruding portion 8 of the glass substrate G can be inserted and the connecting portion 9. The support plate 27 can support only the frame portion 7 of the glass substrate G without contacting the protruding portion 8 and the connecting portion 9 by inserting the protruding portion 8 and the connecting portion 9 into the opening 28 in a state where the protruding portion 8 of the glass substrate G is oriented downward.
The suction table 29 includes a support portion 30 for supporting the support plate 27, and a suction port 31 for fixing the glass substrate G to the support plate 27. The support portion 30 has a support surface 30a for supporting the peripheral edge portion of the support plate 27.
The suction table 29 has a space 29a between the support plate 27 supported by the support portion 30 and the suction port 31. The suction port 31 is connected to a suction device (exhaust device) such as a pump (not shown).
The suction table 29 discharges the gas existing in the space 29a from the suction port 31 in a state where the support plate 27 on which the glass substrate G is mounted is supported by the support portion 30, and thereby the space 29a is set to a negative pressure. Thereby, the glass substrate G is sucked to the space 29a side through the opening 28 of the support plate 27, and is fixed to the support plate 27. Thereafter, a paste-like metal-based joining material of the joining portion 15 was applied by screen printing so as to overlap the metal layer 14 of the glass substrate G.
As described above, the glass substrate G is supported by the support device 26, and the joint 15 can be formed with high accuracy.
Fig. 16 shows other examples of the package. The package 1 in this example includes a base 2 on which a plurality of light emitting elements 3 are mounted, and a cover member 4 illustrated in fig. 12. The cover member 4 seals the light emitting elements 3 mounted on the base 2 individually by the plurality of protruding portions 8 and the sealing portion 5.
Fig. 17 shows other examples of the package. The structure of the cover member 4 in the package 1 in this example is different from the examples of fig. 1 and 2. The cover member 4 has antireflection films 32a and 32b covering the entire surfaces of the inner surfaces (the first main surface 7a of the frame portion 7, the inner surface 8a of the protruding portion 8, and the first curved surface 9a of the connecting portion 9) and the outer surfaces (the second main surface 7b of the frame portion 7, the outer surface 8b of the protruding portion 8, and the second curved surface 9b of the connecting portion 9). The antireflection films 32a, 32b include a first antireflection film 32a covering the inner surface of the cover member 4 and a second antireflection film 32b covering the outer surface of the cover member 4.
The antireflection films 32a and 32b are formed by various methods such as a film forming method such as a sputtering method or a vacuum deposition method, or a spray coating method.
Each of the antireflection films 32a, 32 has, for example, a film of silicon oxide (SiO 2 ) Hafnium oxide film (HfO 2 ) Is a multilayer film structure of (a). The thickness of each of the antireflection films 32a and 32b is preferably 0.1 μm or more and 1 μm or less, more preferably 0.2 μm or more and 0.8 μm or less.
A part of the first antireflection film 32a functions as a buffer film 13 for relaxing stress caused by the difference in thermal expansion coefficient between the frame portion 7 and the joint portion 15. In other words, the first antireflection film 32a is a film integrally provided with the buffer film 13 of the package 1 illustrated in fig. 1 and 2.
In the package 1 of the present example, the light extraction efficiency of the light emitting element 3 can be improved as much as possible by the antireflection films 32a and 32b formed on the inner surface and the outer surface of the cover member 4.
According to the package 1 (the cover member 4) and the glass substrate G of the present embodiment described above, the thickness Tmin of the top 12 of the protruding portion 8 of the cover member 4 is made thinner than the thickness Tmax of the base 10, so that the transmittance thereof can be improved. Further, by making the thickness Tmax of the base portion 10 of the protruding portion 8 thicker than the thickness Tmin of the top portion 12, the strength of the cover member 4 at the protruding portion 8 can be improved. Thus, according to the present invention, both the improvement of the transmittance of the cover member 4 and the securing of the strength can be achieved.
In addition to the above, in the cover member 4 of the present embodiment, the frame portion 7 and the protruding portion 8 are connected by the connecting portion 9 having a curved shape, whereby the strength of the cover member 4 at the connecting portion 9 can be improved. Further, since the protruding portion 8 of the cover member 4 is formed so as not to contact with any of the support table 17 and the mask member 18 of the manufacturing apparatus 16, the surface roughness Ra of the inner surface 8a and the outer surface 8b can be made as small as possible. Similarly, the surface roughness Ra of the first curved surface 9a and the second curved surface 9b of the connecting portion 9 of the cover member 4 can be made as small as possible by non-contact molding. Therefore, the cover member 4 can be made high in transmittance and hardly damaged.
The present invention is not limited to the configuration of the above embodiment, and is not limited to the above-described operational effects. The present invention can be variously modified within a range not departing from the gist of the present invention.
Examples
Hereinafter, an embodiment of the present invention will be described, but the present invention is not limited to this embodiment.
In order to confirm the effect of the cover member of the present invention, the present inventors produced the cover members of example 1 and comparative examples 1 and 2 having a shape in which the outer diameter of the protruding portion is 50mm and the height of the protruding portion is 25mm, and the cover members of example 2 and comparative examples 3 and 4 having a shape in which the outer diameter of the protruding portion is 10mm and the height of the protruding portion is 5mm, and conducted experiments of the respective examples. The glasses used in the test were all SiO in mass% 2 ：70％、B 2 O 3 ：20％、Al 2 O 3 ：5％、CaO：1％、BaO：1％、Na 2 O：2％、K 2 O:1% borosilicate glass.
The cover members of examples 1 to 3 were manufactured by the manufacturing method of the above embodiment, and the thickness of the top portion of the protruding portion was made thinner than the thickness of the base portion. On the other hand, the cover members of comparative examples 1 to 4 were formed by heating and press-molding the glass substrate, and had a protruding portion having a constant thickness from the base portion to the top portion. Specifically, the thickness of the protruding portion of the cover member of comparative example 1 is the same as the thickness of the base portion of the protruding portion of the cover member of example 1. In addition, the thickness of the protruding portion of the cover member of comparative example 2 was the same as the thickness of the top portion of the protruding portion of the cover member of example 1. The thickness of the protruding portion of the cover member of comparative example 3 is the same as the thickness of the base portion of the protruding portion of the cover member of example 2. In addition, the thickness of the protruding portion of the cover member of comparative example 4 was the same as the thickness of the top portion of the protruding portion of the cover member of example 2.
Regarding examples 1 to 3 and comparative examples 1 to 4, the transmittance of light having a wavelength of 250nm at the top of the cover member was measured using a spectrophotometer. The breaking strength of the base portions of the lid members of examples 1 and 2 and comparative examples 1 to 4 was measured using a breaking strength tester.
Fig. 18 shows an outline of the failure strength tester. The breaking strength tester 33 has a support table 35 that supports the cover member 4, and a pressing member 34 that presses the base 10 of the cover member 4. In the breaking strength test, the base 10 of the protruding portion 8 of the lid member 4 was pressed by the pressing member 34 in a state where the lid member 4 was supported by the support table 35, and the breaking strength (pressing force of the pressing member 34) was measured. In each example, a failure strength test was performed using 20 cap members, and the average value thereof was set to be 50MPa or more in the case of example 1 and comparative examples 1 and 2, and to be "good" in the case of example 2 and comparative examples 3 and 4, and to be "poor" in the case of less than the reference value.
The dimensions and test results of the main parts of the cover members in examples 1 to 3 and comparative examples 1 to 4 are shown in table 1. In table 1, the evaluation results of the breaking strength are indicated by "o" and "x" for failure.
TABLE 1
| Example 1 | Comparative example 1 | Comparative example 2 | Example 2 | Comparative example 3 | Comparative example 4 | Example 3 | |
| Outer diameter (mm) of protruding part | 50 | 50 | 50 | 10 | 10 | 10 | 2.4 |
| Height (mm) of protruding |
25 | 25 | 25 | 5 | 5 | 5 | 1 |
| The thickness tmax (mm) of the base | 1.3 | 1.3 | 0.42 | 0.3 | 0.3 | 0.25 | 0.07 |
| Thickness of top Tmin (mm) | 0.42 | 1.3 | 0.42 | 0.25 | 0.3 | 0.25 | 0.01 |
| Ratio (Tmin/Tmax) | 0.3 | 1.0 | 1.0 | 0.8 | 1.0 | 1.0 | 0.1 |
| Surface roughness Ra (nm) of the inner surface of the protruding portion | 0.12 | 1.5 | 1.3 | 0.12 | 1.5 | 1.3 | 0.10 |
| Surface roughness Ra (nm) of the outer surface of the protruding portion | 0.12 | 1.5 | 1.3 | 0.12 | 1.5 | 1.3 | 0.10 |
| Transmittance of light at the top at wavelength 250nm (%) | 89.69 | 85.75 | 89.25 | 90.39 | 89.68 | 89.89 | 94.23 |
| Evaluation of breaking Strength | ○ | ○ | × | O | ○ | × | - |
As shown in table 1, the cover member of the package of example 1 has higher transmittance than the cover member of the package of comparative example 1, and has superior strength to the cover member of the package of comparative example 2. The lid member of the package of example 2 has higher transmittance than the lid member of the package of comparative example 3, and has higher strength than the lid member of the package of comparative example 4. In addition, the cover member of the package of example 3 exhibited high transmittance. From the above results, it is shown that the package of the present invention can achieve both improvement in transmittance and securing of strength.
Description of the reference numerals
1. Package body
3. Light-emitting element
4 cover member
7 frame part
7a first major face
7b second major face
8 protruding part
8a inner surface
8b outer surface
9 connecting part
9a first curved surface
9b second curved surface
10 base
12 top part
13 buffer film
14 Metal layer
15 joint portion
G glass substrate
Thickness of base of Tmax protrusion
Thickness of the top of the Tmin protrusion.
Claims (11)
1. A cover member used in a package including a light emitting element and made of glass,
the cover member may be characterized in that,
the cover member includes a plate-shaped frame portion and a protruding portion protruding from the frame portion,
the protruding portion is provided with a base portion and a top portion,
the top portion has a thickness less than a thickness of the base portion.
2. The cover member of claim 1, wherein,
the ratio (Tmin/Tmax) of the thickness (Tmin) of the top portion to the thickness (Tmax) of the base portion is 0.08 to 0.9.
3. The cover member according to claim 1 or 2, wherein,
the projection has an inner surface and an outer surface,
the surface roughness Ra of the inner surface is 1nm or less.
4. The cover member according to any one of claims 1 to 3, wherein,
the projection has an inner surface and an outer surface,
the surface roughness Ra of the outer surface is 1nm or less.
5. The cover member according to any one of claims 1 to 4, wherein,
the cover member includes a curved connecting portion connecting the base portion and the frame portion.
6. The cover member according to claim 5, wherein,
the connecting part is provided with a first curved surface and a second curved surface which connect the base part and the frame part,
the first curved surface has a radius of curvature of 0.5mm or more and 5mm or less,
the radius of curvature of the second curved surface is 0.5mm or more and 5mm or less.
7. The cover member according to any one of claims 1 to 6, wherein,
the frame has a first major face and a second major face,
a metal layer is formed on the first main surface.
8. The cover member of claim 7, wherein,
a buffer film is formed between the first main surface of the frame portion and the metal layer.
9. The cover member of claim 8, wherein,
a junction is formed in the metal layer at a location opposite to a location where the buffer film contacts.
10. A package body is characterized in that,
the package includes a base body for supporting the light emitting element, and the cover member according to any one of claims 1 to 9.
11. A glass substrate for use in a package including a light emitting element and for manufacturing a cover member,
the glass substrate is characterized in that,
the glass substrate is provided with a plate-shaped frame part and a plurality of protruding parts protruding from the frame part,
the protruding portion is provided with a base portion and a top portion,
the top portion has a thickness less than a thickness of the base portion.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020207619 | 2020-12-15 | ||
| JP2020-207619 | 2020-12-15 | ||
| PCT/JP2021/039851 WO2022130799A1 (en) | 2020-12-15 | 2021-10-28 | Lid member, package, and glass substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116438669A true CN116438669A (en) | 2023-07-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180074006.1A Pending CN116438669A (en) | 2020-12-15 | 2021-10-28 | Cover member, package, and glass substrate |
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| Country | Link |
|---|---|
| JP (1) | JPWO2022130799A1 (en) |
| KR (1) | KR20230119107A (en) |
| CN (1) | CN116438669A (en) |
| TW (1) | TW202226622A (en) |
| WO (1) | WO2022130799A1 (en) |
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| JP4350144B2 (en) * | 2007-08-09 | 2009-10-21 | シャープ株式会社 | LIGHT EMITTING DEVICE AND LIGHTING DEVICE EQUIPPED WITH THE SAME |
| JP2011066169A (en) | 2009-09-16 | 2011-03-31 | Toyoda Gosei Co Ltd | Led package |
| JP5470171B2 (en) * | 2010-06-21 | 2014-04-16 | 株式会社エンプラス | Light emitting device, surface light source device, display device, and light flux controlling member |
| CN103367609B (en) * | 2012-03-28 | 2016-05-18 | 中央大学 | The LED encapsulating structure of low spatial colour cast |
| JP2019046826A (en) * | 2017-08-29 | 2019-03-22 | クアーズテック株式会社 | Silica member and manufacturing method thereof |
| EP3599414A1 (en) * | 2018-07-23 | 2020-01-29 | Shin-Etsu Chemical Co., Ltd. | Synthetic quartz glass cavity member, synthetic quartz glass cavity lid, optical device package, and making methods |
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2021
- 2021-10-28 JP JP2022569754A patent/JPWO2022130799A1/ja active Pending
- 2021-10-28 CN CN202180074006.1A patent/CN116438669A/en active Pending
- 2021-10-28 KR KR1020237007804A patent/KR20230119107A/en active Search and Examination
- 2021-10-28 WO PCT/JP2021/039851 patent/WO2022130799A1/en active Application Filing
- 2021-10-29 TW TW110140307A patent/TW202226622A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022130799A1 (en) | 2022-06-23 |
| TW202226622A (en) | 2022-07-01 |
| JPWO2022130799A1 (en) | 2022-06-23 |
| KR20230119107A (en) | 2023-08-16 |
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