TWI840397B - Ultraviolet device package - Google Patents
Ultraviolet device package Download PDFInfo
- Publication number
- TWI840397B TWI840397B TW108129643A TW108129643A TWI840397B TW I840397 B TWI840397 B TW I840397B TW 108129643 A TW108129643 A TW 108129643A TW 108129643 A TW108129643 A TW 108129643A TW I840397 B TWI840397 B TW I840397B
- Authority
- TW
- Taiwan
- Prior art keywords
- optical component
- light
- ultraviolet
- glass
- base
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 106
- 239000011521 glass Substances 0.000 claims abstract description 66
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 27
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 19
- 238000002834 transmittance Methods 0.000 claims abstract description 11
- 238000007789 sealing Methods 0.000 abstract description 17
- 239000000919 ceramic Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 239000000463 material Substances 0.000 description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- 238000001465 metallisation Methods 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000011282 treatment Methods 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 229910000833 kovar Inorganic materials 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000001954 sterilising effect Effects 0.000 description 3
- 238000004659 sterilization and disinfection Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000003303 reheating Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- FUJCRWPEOMXPAD-UHFFFAOYSA-N Li2O Inorganic materials [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004887 air purification Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Inorganic materials [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum oxide Inorganic materials [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000013212 metal-organic material Substances 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- KTUFCUMIWABKDW-UHFFFAOYSA-N oxo(oxolanthaniooxy)lanthanum Chemical compound O=[La]O[La]=O KTUFCUMIWABKDW-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- NOTVAPJNGZMVSD-UHFFFAOYSA-N potassium monoxide Inorganic materials [K]O[K] NOTVAPJNGZMVSD-UHFFFAOYSA-N 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
Images
Abstract
[課題] 在紫外線元件套組中得到所欲形狀的光學構件,以較少的步驟將光學構件接合至陶瓷製的基板,並具有高的密封效能。 [解決手段] 紫外線元件套組1由發射紫外光的發光元件2與安裝該發光元件2的基板3以及設於前述發光元件2對向位置處的光學構件4所製備。前述光學構件4由軟化點在攝氏1000度以下,對於波長250~400nm 的光的平均穿透率在80%以上的玻璃所形成,其面對該基板3的面的外形形狀為圓形,且透過該光學構件4與密封接合的金屬製台座5接合至前述基板3。該台座5具有一嵌裝該光學構件4的平面視為圓形的上面開口部51。透過此結構,因台座5的上面開口部51的平面視為圓形,在構成光學構件4的玻璃熔化接合時,可均等拉伸放射狀延伸的玻璃,透過保持形成均一厚度的玻璃,因而可得到密封性能高的氣密玻璃封緘部。[Topic] Obtain an optical component of a desired shape in an ultraviolet component set, bond the optical component to a ceramic substrate with fewer steps, and have high sealing performance. [Solution] An ultraviolet component set 1 is prepared by a light-emitting element 2 that emits ultraviolet light, a substrate 3 on which the light-emitting element 2 is mounted, and an optical component 4 disposed at a position opposite to the light-emitting element 2. The optical component 4 is formed of glass having a softening point below 1000 degrees Celsius and an average transmittance of more than 80% for light with a wavelength of 250 to 400 nm. The outer shape of the surface facing the substrate 3 is circular, and the optical component 4 is bonded to the substrate 3 through a metal base 5 that is sealed and bonded. The base 5 has an upper opening 51 that is circular when viewed from a plane and in which the optical component 4 is embedded. With this structure, since the upper opening 51 of the pedestal 5 is circular when viewed in a plane, when the glass constituting the optical component 4 is melted and bonded, the radially extending glass can be evenly stretched, and by maintaining the glass with a uniform thickness, an airtight glass seal with high sealing performance can be obtained.
Description
本發明係關於一種紫外線元件套組,由包含例如紫外線殺菌、淨水、空氣淨化、又或者接著劑、樹脂等的硬化所用的深紫外線的近紫外線LED等發光元件,以及設在該發光元件對向位置處的光學構件所製備。 The present invention relates to an ultraviolet component kit, which is prepared by light-emitting components such as deep ultraviolet and near ultraviolet LEDs used for ultraviolet sterilization, water purification, air purification, or hardening of adhesives, resins, etc., and optical components arranged at positions opposite to the light-emitting components.
[發明背景] [Invention Background]
紫外線殺菌時向來廣泛使用汞燈,但從汞相關的水俁公約生效之後,2020開始將限制汞製品的製造、輸出入等。因此,期待以紫外線LED(發光二極體),尤其是波長280nm以下的深紫外線LED,來做為現在所使用的汞燈壽命終結之後的替代光源。 Mercury lamps have been widely used for ultraviolet sterilization, but since the Minamata Convention on mercury came into effect, the manufacture, import and export of mercury products will be restricted starting in 2020. Therefore, it is expected that ultraviolet LEDs (light-emitting diodes), especially deep ultraviolet LEDs with a wavelength of less than 280nm, will be used as alternative light sources after the current mercury lamps reach the end of their life.
輸出波長200nm~360nm的紫外光的發光模組用於此目的者已有揭示。此發光模組具有其有底凹部可安裝發光元件的基板,以及為了覆蓋有底凹部開口而裝設的窗構件。此發光模組具有透鏡部,用以控制從紫外線LED射出的光的配光。透鏡部係形成於和窗構件內發光元件相對向的部分中。透鏡部的周圍和透鏡部一體形成一凸緣部,用以和基板接合。 A light-emitting module that outputs ultraviolet light with a wavelength of 200nm to 360nm has been disclosed for this purpose. The light-emitting module has a substrate with a bottom recess on which a light-emitting element can be mounted, and a window member installed to cover the opening of the bottom recess. The light-emitting module has a lens portion for controlling the light distribution of light emitted from the ultraviolet LED. The lens portion is formed in a portion opposite to the light-emitting element in the window member. The periphery of the lens portion and the lens portion form a flange portion integrally for bonding with the substrate.
上述專利文獻1中,窗構件係由石英玻璃顆粒等作為材料,使熔融石英流入模具中而形成(參考0034段)。不過,石英玻璃的軟化點約攝氏1700
度,非常高溫,就算加熱到攝氏1900度也還非常硬,加工上有困難。此外,石英玻璃也有可能因為氣體的蒸氣壓很大而從固體直接轉成氣體,因而不形成熔融液體狀態。要從熔融石英製得所欲的透鏡形狀非常困難。因此,一般會供給錠塊石英玻璃去切削、研削成所設定的形狀,再將表面做鏡面研磨。使用傳統的玻璃透鏡製造方法會使得透鏡非常昂貴。
In the above-mentioned
另一方面,就可使波長300nm以下的深紫外線以高穿透率穿過的物質而言,向來使用石英玻璃,但也有開發可使波長300nm以下的深紫外線以高穿透率穿過的玻璃。此種玻璃的軟化點在攝氏1000度以下,可以透過上述傳統玻璃製造方法以外的製造方法來得到所欲的透鏡形狀(例如,參照專利文獻2)。 On the other hand, as for materials that can allow deep ultraviolet rays with a wavelength below 300nm to pass through with high transmittance, quartz glass has been used, but there is also glass that can allow deep ultraviolet rays with a wavelength below 300nm to pass through with high transmittance. The softening point of this glass is below 1000 degrees Celsius, and the desired lens shape can be obtained through a manufacturing method other than the above-mentioned traditional glass manufacturing method (for example, refer to patent document 2).
[習知技術文獻] [Learning Technology Literature]
[專利文獻] [Patent Literature]
[專利文獻1]日本專利公開公報第2017-59716號。 [Patent document 1] Japanese Patent Publication No. 2017-59716.
[專利文獻2]日本專利公開公報第2006-310375號。 [Patent Document 2] Japanese Patent Publication No. 2006-310375.
[發明概要] [Invention Summary]
順帶一提,上述專利文獻1的發光模組中,對窗構件內的透鏡部、凸緣部等預定部分施以遮罩,對於未施以遮罩的部分,利用真空蒸鍍、濺鍍等方法依序沉積鈦(Ti)、銅(Cu)、鎳(Ni)、金(Au)形成多層膜而施以金屬化處理。然而,對微細立體形狀的透鏡部、凸緣部等進行遮罩操作並不容易。只
是,如果不做好遮罩並施以適切的金屬化,基板和窗構件的接合以及密封就會有不完全之虞。因為紫外線,特別是短波長的深紫外線,會使樹脂材料明顯劣化,因此包含深紫外線發光元件的發光模組的封裝必須防止深紫外線外漏,套組的接合以及密封會大大影響製品的可靠性。
By the way, in the light-emitting module of the above-mentioned
為了解決上述課題而做出本發明,目的在於使用比石英玻璃的軟化點低且波長250nm~400nm以下的光平均穿透率高的玻璃,即便以價錢便宜且簡單的製程進行基板與光學構件的接合,也可提供密封性能高的紫外線元件套組。 This invention is made to solve the above-mentioned problem. The purpose is to use glass with a lower softening point than quartz glass and a high average transmittance of light with a wavelength below 250nm~400nm. Even if the substrate and optical components are joined by a cheap and simple process, a UV element kit with high sealing performance can be provided.
為達上述目的,本發明為由發射紫外光的發光元件與安裝該發光元件的基板以及設於前述發光元件對向位置處的光學構件所製備的紫外線元件套組。前述光學構件材料的軟化點在攝氏1000度以下,由對於波長250~400nm的光的平均穿透率在80%以上的玻璃所形成,其面對該基板的面的外形形狀為圓形,且透過該光學構件與密封接合的金屬製台座接合至前述基板。該台座的特徵在於具有一嵌裝該光學構件的平面視為圓形的上面開口部,以及收容該基板上安裝有該發光元件的發光構件的底面視略為矩形的下面開口部。 To achieve the above purpose, the present invention is an ultraviolet element kit prepared by a light-emitting element emitting ultraviolet light, a substrate on which the light-emitting element is mounted, and an optical component disposed at a position opposite to the light-emitting element. The softening point of the optical component material is below 1000 degrees Celsius, and is formed of glass with an average transmittance of more than 80% for light with a wavelength of 250 to 400nm. The outer shape of the surface facing the substrate is circular, and the optical component is bonded to the substrate through a metal pedestal sealed with the optical component. The pedestal is characterized in that it has an upper opening portion that is circular when viewed from a plane in which the optical component is embedded, and a lower opening portion that is slightly rectangular when viewed from the bottom surface of the light-emitting component on which the light-emitting element is mounted on the substrate.
上述紫外線元件套組中,該台座較佳由熱膨脹係數與該玻璃的熱膨脹係數約略相等的金屬所形成。 In the above-mentioned ultraviolet element kit, the base is preferably formed of a metal having a thermal expansion coefficient approximately equal to that of the glass.
上述紫外線元件套組中,該台座較佳透過其表面上所形成的氧化膜與該光學構件密封接合。 In the above-mentioned ultraviolet element kit, the base is preferably sealed and joined to the optical component through an oxide film formed on its surface.
上述紫外線元件套組中,該基板內和該台座接合的接合部中形成受金屬化處理的金屬化部,該台座與該金屬化部較佳透過金屬預製件(metal preform)接合。 In the above-mentioned ultraviolet element kit, a metallized portion that has been metallized is formed in the joint portion between the substrate and the base, and the base and the metallized portion are preferably joined through a metal preform.
上述紫外線元件套組中,該下面開口部的上面側周緣與該上面開口部的底面側周緣之間,較佳形成由與該台座上面與底面平行的平面所構成的用以保持該光學構件的保持部。 In the above-mentioned ultraviolet element kit, a holding portion for holding the optical component is preferably formed between the upper side periphery of the lower opening portion and the bottom side periphery of the upper opening portion, which is composed of a plane parallel to the upper and bottom surfaces of the base.
上述紫外線元件套組中,該光學構件較佳為光出射面突出的圓頂透鏡。 In the above-mentioned ultraviolet element kit, the optical component is preferably a dome lens with a protruding light emitting surface.
上述紫外線元件套組中,該光學構件較佳為光出射面平坦的平坦透鏡。 In the above-mentioned ultraviolet element kit, the optical component is preferably a flat lens with a flat light emitting surface.
根據本發明,因為光學構件係利用熔融或軟化的玻璃板所形成,比起切削、研磨切割石英玻璃錠塊的傳統玻璃透鏡製造方法而言,製程可更便宜且簡化。此外,該光學構件由於和基板相對面的外形形狀為圓形,嵌裝光學構件的台座的上面開口部的平面視為圓形,在構成光學構件的玻璃熔化接合時,可均等拉伸放射狀延伸的玻璃,透過保持形成均一厚度的玻璃,因而可得到密封性能高的氣密玻璃封緘部。此外,在光學構件成形的同時,該光學構件一體成形密封接合至台座的金屬上,因此不需要為了金屬化處理而進行遮罩、金屬濺鍍程序等。另外,和光學構件一體化的台座與金屬化處理後的基板的金屬化部以金屬預製件接合,可使基板和光學構件達成氣密性接合。如此,可提供低成本、高可靠度的紫外線元件套組。 According to the present invention, since the optical component is formed by using a molten or softened glass plate, the manufacturing process can be cheaper and simpler than the conventional glass lens manufacturing method of cutting, grinding and cutting a quartz glass ingot. In addition, since the outer shape of the optical component opposite to the substrate is circular, the plane of the upper opening of the base where the optical component is embedded is considered to be circular. When the glass constituting the optical component is melted and bonded, the radially extending glass can be evenly stretched, and by maintaining the glass of uniform thickness, an airtight glass sealing part with high sealing performance can be obtained. In addition, when the optical component is formed, the optical component is integrally formed and sealed to the metal of the base, so there is no need to perform a masking process, a metal sputtering process, etc. for metallization treatment. In addition, the base integrated with the optical component is joined to the metalized part of the metallized substrate with a metal preform, so that the substrate and the optical component can be airtightly joined. In this way, a low-cost, high-reliability UV component set can be provided.
1:紫外線元件套組 1: UV component kit
10:玻璃板 10: Glass plate
2:發光元件 2: Light-emitting element
20:治具 20: Fixture
21:凹坑 21: pits
22:凹坑 22: pits
23:治具 23: Fixture
3:基板 3: Substrate
31:基材 31: Base material
32:元件接合部 32: Component joint
33:金屬化部 33:Metalization Department
4:光學構件(圓頂透鏡、平面透鏡) 4: Optical components (dome lens, flat lens)
40:第一加熱爐 40: First heating furnace
41:光入射面 41: Light incident surface
42:光出射面 42: Light exit surface
5:台座 5: Pedestal
51:上面開口部 51: Upper opening
52:下面開口部 52: Opening below
53:保持部 53:Maintenance Department
6:金屬預製件 6:Metal prefabricated parts
【圖1】(a)為顯示關於本發明一實施型態的紫外線元件套組的構成示意圖。(b)為完成斜視圖。 [Figure 1] (a) is a schematic diagram showing the structure of the ultraviolet element set of an embodiment of the present invention. (b) is a completed oblique view.
【圖2】(a)為顯示關於上述實施型態的變化例的紫外線元件套組的分解斜視圖。(b)為完成斜視圖。 [Figure 2] (a) is an exploded perspective view of a UV element kit showing a variation of the above-mentioned embodiment. (b) is a completed perspective view.
【圖3】為顯示構成上述紫外線元件套組所用光學構件的玻璃的穿透率分布圖。 [Figure 3] is a diagram showing the transmittance distribution of the glass used to form the optical components of the above-mentioned UV element kit.
【圖4】(a)上述紫外線元件套組所用台座的斜視圖。(b)為平面圖。(c)為(b)的A-A線截面圖。 【Figure 4】(a) An oblique view of the base used in the above-mentioned UV element kit. (b) is a plan view. (c) is a cross-sectional view of (b) along the A-A line.
【圖5】(a)~(f)為顯示上述紫外線元件套組製造方法的工程圖,尤其顯示和台座一體化的光學構件的製程。 [Figure 5] (a) to (f) are engineering drawings showing the manufacturing method of the above-mentioned UV component set, especially showing the manufacturing process of the optical component integrated with the base.
【圖6】(a)為顯示上述紫外線元件套組製造方法的工程圖。(b)為特別顯示第二階段和基板及台座一體化的光學構件的接合程序示意圖。 [Figure 6] (a) is an engineering drawing showing the manufacturing method of the above-mentioned ultraviolet element set. (b) is a schematic diagram showing the bonding process of the optical components integrated with the substrate and the base in the second stage.
關於本發明的一實施型態的紫外線元件套組將參照圖式加以說明。圖1顯示關於本發明一實施型態的紫外線元件套組的構成示意圖。如圖1(a)(b)所示,紫外線元件套組1包括發出深紫外線的發光元件2、安裝發光元件2的基板3、以及設於發光元件2對向位置處的光學構件4。光學構件4透過和光學構件4密封接合的金屬製台座5與基板3接合。
The ultraviolet element set of one embodiment of the present invention will be described with reference to the drawings. FIG1 shows a schematic diagram of the structure of the ultraviolet element set of one embodiment of the present invention. As shown in FIG1(a)(b), the ultraviolet element set 1 includes a light-emitting
發光元件2為發射波長400nm以下紫外線的紫外線元件。較佳為波長280nm以下對紫外線殺菌有高效能的深紫外線元件。此外,發光元件2例如可為於藍寶石(sapphire)基板上形成單一LED構造的單一晶片,也可為於藍寶石基板上形成複數個LED構造的集積型晶片(圖例)。
The light-emitting
基板3在平面視圖中略呈正方形,例如,以基材31作為於氮化鋁上形成電路的散熱基板(submount),因應發光元件2的型態形成電路,例如覆晶型、打線接合型等例子。且,在圖例中顯示於基材31上進行金屬化處理形成元
件接合部32,發光元件2以跨接兩個元件接合部32進行配置的構造。此外,台座5接合至基板3周緣處,此接合部中,藉由金鍍物或金沉積物等形成施以金屬化處理的金屬化部33。元件接合部32與金屬化部33之間存在絕緣部分。
The
光學構件4在與基板3相對面的外型形狀為圓形,在圖1(a)(b)中所示的構成中,從發光元件2入射光的光入射面41為平坦的,出射光的光出射面42為突出的圓頂透鏡(也請參照下述的圖6(a))。在圖例中雖然顯示光出射面42為球面形狀的構造,但非球面亦可。且,只要與基板3相對面的光學構件4的外型形狀為圓形,例如圖2(a)(b)所示的變化例般,光學構件4的光出射面42為平坦的平面透鏡亦可。圓頂透鏡因為具有集光作用,使用此透鏡的紫外線元件套組適用於從發光元件2出射的光(深紫外線)的配光範圍窄的器具等。另一方面,平面透鏡因為不具有集光作用,使用此透鏡的紫外線元件套組適用於從發光元件2出射的光(深紫外線)的配光範圍廣的器具等。
The outer shape of the
光學構件4例如使用軟化點為攝氏1000度以下,如圖3所示對於波長250-400nm的光而言厚度0.4mm的資料中平均穿透率80%以上的玻璃所形成。此玻璃的成分中以SiO2以及B2O3為主體,此外包含例如Al2O3、Li2O、Na2O、K2O、CaO、BaO、ZnO、Y2O3、ZrO2、La2O3、Sb2O等。
The
如圖4(a)至(c)所示,台座5的外型形狀為平面視略為矩形,為具有特定厚度的板狀金屬構件,具有嵌裝光學構件4的平面視為圓形的上面開口部51、以及收容安裝於基板3上的發光元件2的底面視略為矩形的下面開口部52。台座5具有上面、底面以及四側面,鄰接的側面所形成的稜角部為帶有緩緩圓滑的倒角。
As shown in Figures 4(a) to (c), the
上面開口部51係從台座5的上表面刻出圓筒狀的孔而形成,下面開口部52係從台座5的下表面刻出略為角筒狀的孔而形成。上面開口部51與下
面開口部52在截面視圖中,在比台座5厚度約略中間位置處再靠近上面一點的位置處相連。此外,在平面視圖中,上面開口部51的開口徑與下面開口部52的開口的對角線長度約略相等,比下面開口部52的開口的對邊間隔短。因此,下面開口部52的上面側周緣和上面開口部51的底面側周緣間,形成和上面與底面平行的平面,成為保持該光學構件的保持部53,而光學構件4的光入射面41側的周緣受到此保持部53的支持(也請參照圖6(a))。
The
台座5由具有與構成光學構件4的玻璃的熱膨脹係數約略相等的熱膨脹係數的金屬所形成。玻璃與台座5的熱膨脹係數例如為常溫下4.5×10-6K-1左右,台座5的材料例如可使用厚度0.1-0.2mm左右的可伐合金(Kovar)。可伐合金為鐵、鎳及鈷等的合金,為用於硬質玻璃接著的一般材料。可伐合金的熔點為攝氏1450度左右,比玻璃的熔點高。基板3與光學構件4透過利用金屬預製件6使金屬台座5和基板3的周緣金屬化部33熔接而接合。金屬預製件6係由包含所謂金‧錫貴金屬的薄金屬(合金)成形為接合部分的形狀而得。
The
接著,參照圖5及圖6說明紫外線元件套組1的製造方法。圖5為紫外線元件套組1的製造方法的第一階段中,用於紫外線元件套組1的光學構件4的製造方法,顯示和台座5一體密封接合的光學構件4的製程。另外,圖6顯示在紫外線元件套組1的製造方法的第二階段中,基板3與光學構件4的接合程序。
Next, the manufacturing method of the ultraviolet element set 1 is described with reference to Figures 5 and 6. Figure 5 shows the manufacturing method of the
在紫外線元件套組1的製造方法中,對玻璃加熱,使其熔融或軟化後,以特定形狀(治具)壓縮成形。如圖5(a)所示,固定好的治具20上面形成對應台座5的下面開口部52的凹坑21。此凹坑21的周緣大幅刻入,以對應台座5的內緣周面,而中央部形成和台座5的保持部53同平面的平坦狀態,此中央部的平坦面模擬光學構件4的光入射面41的形狀。
In the manufacturing method of the ultraviolet element set 1, the glass is heated to melt or soften it, and then compressed into a specific shape (jig). As shown in Figure 5(a), a
然後,如圖5(b)所示,台座5嵌裝入凹坑21中。在此處對台座5進行氧化處理,於其表面形成氧化膜。治具20係由碳粉以例如圖中所示的特定形狀壓縮成形。接著,將棒狀供給的玻璃切斷成特定尺寸(特定體積或特定重量)的玻璃板,如圖5(c)所示,將玻璃板10載置於台座5的上面開口部51和治具20上,以使台座5的中心和玻璃板10的中心一致。
Then, as shown in FIG5(b), the
接著,如圖5(d)所示,將載置台座5的中心和玻璃板10的治具20與具有與應成形透鏡形狀相對應的曲面的凹坑22所形成的可動式治具23收納在第一加熱爐40內,在氮氣環境下加熱至比玻璃的軟化點更高的第一溫度(例如攝氏1000度)。另外,在圖5(d)中繪示玻璃熔融或軟化的狀態。治具23也是由碳粉以例如圖中所示的特定形狀壓縮成形,分別配置治具20和治具23以使治具20的凹坑21的中心和治具23的凹坑22的中心一致。
Next, as shown in FIG. 5(d), the center of the mounting
一旦玻璃板10熔融或軟化至可壓縮成形的程度,如圖5(e)所示,使可動式治具23朝向治具20緩緩下降,經由凹坑22的表面使玻璃板10加壓變形。藉此,使凹坑22的曲面拷貝至熔融玻璃板10的表面上,作為光學構件4的光出射面42(參照圖6(a))。此外,玻璃板10熔融時,透過形成於台座5的表面上的氧化膜,台座5和玻璃的可濕性(wettability)變好,玻璃.金屬界面的密著性提升,密封(hermetic)接合,這些邊界線成為氣密玻璃封緘部GS。且,氣密玻璃封緘部GS本身幾乎沒有厚度,圖6(a)中係為了說明而以誇張的圖式來顯示氣密玻璃封緘部GS。
Once the
接著,以特定時間特定壓力下將治具23押入治具20內壓縮形成光學構件4之後,降低第一加熱爐40內的溫度,如上所述,由於治具20、治具23、成形後的光學構件4、以及台座5冷卻下來。此時,如上所述,由於台座5的材料與光學構件4的熱膨脹係數約略相等,冷卻時光學構件4和台座5會以約略相同的比例收縮。因此,光學構件4和台座5不會分離,冷卻後光學構件4和
台座5仍可一體密封接合。而且,常溫冷卻後,從第一加熱爐40中將治具20、治具23、以及光學構件4與台座5取出,將治具23自治具20分離,如此一來,如圖5(f)所示,可得到密封接合的光學構件4與台座5。
Next, after the
此處,在本實施例型態的紫外線元件套組1中,光學構件4與基板3相對面的外形形狀為圓形,台座5中具有嵌裝光學構件4的平面視為圓形的上面開口部51。換言之,台座5和玻璃的邊界線所為的氣密玻璃封緘部GS成為圓形。因此,使圓盤狀(圓柱)的玻璃板氧化,安座在台座5(治具20)上,使玻璃熔化接合之際,若上面開口部51為圓形,可透過使放射狀散開的玻璃保持均等拉伸而形成均一厚度的玻璃。可以容易想像,這也是潛水艇、航空器等為了耐水壓、氣壓等而把本體設計成圓球狀的理由。假設上面開口部51不是圓形,例如若為四角形,用加工玻璃片做成例如斷面為四角形,因玻璃熔化時無法均一拉伸之故,玻璃厚度會無法均一,氣密玻璃封緘部可能會有洞。針對此,在本實施例型態中,因台座5的上面開口部51為圓形,可形成均一厚度的玻璃,得到無縫隙密封性能高的高氣密玻璃封緘部GS。
Here, in the
氣密玻璃封緘部GS形成於台座5的上面開口部51的內側面與和其接合的光學構件4的外側面的邊界處。此外,在本實施例型態中,由於在台座5的下面開口部52的上面側周緣與上面開口部51的底面側周緣間設有保持部53之故,氣密玻璃封緘部GS也會形成於此保持部53的上面與光學構件4的底面的邊界處。換言之,氣密玻璃封緘部GS不只是沿上面開口部51的內側面延伸的鉛直面,同時形成於沿保持部53延伸的水平面,因此可更進一步提升密封性能。此外,由於光學構件4受到保持部53的支持,即使光學構件4被從外部壓掣,光學構件4也不會被壓入發光元件2的側面,耐久性也可提升。
The airtight glass seal GS is formed at the boundary between the inner side surface of the
另外,光學構件4與台座5較佳收納於另外的加熱爐(圖式未示出)中,再加熱至含氧空氣環境下比玻璃軟化點高、比第一溫度(例如攝氏1000度)
低的第二溫度(例如攝氏800度)。透過此再加熱處理,使得因碳粉轉移所致表面紋理加工狀的光學構造4的表面再熔化或再軟化,如此一來,透過表面張力使熔融或軟化的玻璃的凸部往凹部移動,讓光學構造4的表面凹凸緩緩均一化、平滑化。亦即,透過簡單的再加熱處理,可對透鏡表面進行熱研磨,因而對透鏡表面進行鏡面拋光。
In addition, the
光學構件4與台座5接合後,將未和台座5內的玻璃接合的面上的氧化膜洗淨、去除。然後,為了防鏽,對由可伐合金所形成的台座5進行鍍鎳,此外,為了和基板3接合而進行鍍金。這些鍍膜處理係在台座5和光學構件4密封接合後進行,但因玻璃製的光學構件4為絕緣體,光學構件4的表面並未鍍覆。然而,由於光學構件4也會浸泡至鍍液中,構成光學構件4的玻璃較佳要有好的耐酸性等高藥劑耐受性。因台座5與被接合的光學構件4係各自獨立製造與交易,因此以下說明的和基板3的接合製程也可由不同於光學構件4的製造商進行。
After the
其次,如圖6(a)所示,使用安裝發光元件2的基板3,此基板3和上述製程所形成的台座5與密封接合的光學構件4之間配置一由含金.錫或金.鍺之所謂貴金屬的合金等所形成的金屬預製件6,使其位置對齊以使基板3側的金屬化部33與台座5下面略為密著。且,如圖6(b)所示,在第二加熱爐50內對基板3、金屬預製件6以及光學構件4加熱至至少金屬預製件6的熔融溫度(攝氏200-400度)以上的溫度,使其等熔接。接著冷卻至金屬預製件6的熔融溫度以下的溫度,金屬預製件6硬化而使和光學構件4一體的台座5與基板3周壁的金屬化部33透過無機材料(預製件)接合。
Next, as shown in FIG6(a), a
台座5係於光學構件4相對於基板3的一側的下面內一體密封接合至與基板3的金屬化部33接合的部分。因此,台座5的下面與基板3的金屬化部33一旦透過金屬預製件6密封接合,基板3、台座5的下面開口部52以及光學構
件4的光入射面41所形成的空間就會密閉而與外部遮斷。結果,從發光元件2輸出的深紫外線不會從基板3和光學構件4的縫隙漏出,也可防止氣體、水分等從外部入侵。此外,也不會對存在紫外線元件套組1中周圍的樹脂製品等造成不良影響。
The
另外,如圖5所示,在台座5和一體接合的光學構件4的製程中,治具20與治具23係使用分別利用碳粉壓縮形成者。因此,在圖5(f)中形成的光學構件4的表面上會有微小的碳粉形狀轉移所致的表面紋理加工狀,也就是沒有進行拋光處理的狀態。此外,光學構件4的表面上可能有附著剝離碳粉的情況。因此,在圖5(f)所示的製程之後,較佳設有將成形的光學構件4的表面洗淨,除去附著的碳粉的洗淨步驟。具體來說,使用鹽酸、氟化氫水、去離子水等清洗光學構件4的表面。洗淨後,再度加熱熔化表面,進行所欲的熱研磨(thermal polish),以研磨光學構件4的表面(圖式未示出)。
In addition, as shown in FIG5, in the process of forming the
再者,需要以從發光元件2出射的深紫外線擴散照射的狀況下,也有可能較佳有凹凸殘留在光學構件4的表面上。此時,藉由中止圖5(f)所示的熱研磨而於表面上殘留凹凸。
Furthermore, when it is necessary to diffusely irradiate the deep ultraviolet light emitted from the light-emitting
如以上說明,根據本發明,使用軟化點在攝氏1000度以下,對於波長250~400nm的光的平均穿透率在80%以上的玻璃,將治具23推入熔融或軟化的玻璃板10,加壓成形光學構件4,製程步驟少,且程序本身簡單。此外,因為在光學構件4成形同時台座5和光學構件4即一體接合,因此,不需要為了金屬化處理而進行遮罩、沉積等步驟。更進一步者,光學構件4和一體化的台座5與金屬化處理後的基板3的周壁的金屬化部33之間的互相接合面為金屬,可容易地利用金屬預製件6進行無機材料(預製件)接合,使製程更加簡單。因而,可提供低成本、可靠度高的高紫外線元件套組1。此外,玻璃材料不限
於上述例示者,對於短波長的深紫外線(例如265nm)等的平均穿透率比80%低,但實用上足夠的穿透率(例如70%以上)也可以。
As described above, according to the present invention, a glass having a softening point below 1000 degrees Celsius and an average transmittance of more than 80% for light of a wavelength of 250 to 400 nm is used, and the
1:紫外線元件套組 1: UV component kit
2:發光元件 2: Light-emitting element
3:基板 3: Substrate
31:基材 31: Base material
32:元件接合部 32: Component joint
33:金屬化部 33:Metalization Department
4:光學構件(圓頂透鏡、平面透鏡) 4: Optical components (dome lens, flat lens)
41:光入射面 41: Light incident surface
42:光出射面 42: Light exit surface
5:台座 5: Pedestal
51:上面開口部 51: Upper opening
52:下面開口部 52: Opening below
53:保持部 53:Maintenance Department
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-155798 | 2018-08-22 | ||
JP2018155798 | 2018-08-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202013773A TW202013773A (en) | 2020-04-01 |
TWI840397B true TWI840397B (en) | 2024-05-01 |
Family
ID=
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016185675A1 (en) | 2015-05-15 | 2016-11-24 | パナソニックIpマネジメント株式会社 | Interposer |
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016185675A1 (en) | 2015-05-15 | 2016-11-24 | パナソニックIpマネジメント株式会社 | Interposer |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4979299B2 (en) | Optical device and manufacturing method thereof | |
CN108140704B (en) | Light emitting module and method for manufacturing light emitting module | |
JP7356983B2 (en) | UV element package | |
US20210230041A1 (en) | Method for producing glass wafers for packaging electronic devices, and electronic component produced according to the method | |
EP1830417B1 (en) | Semiconductor device and its manufacturing method | |
JP2010510671A (en) | Optical adhesive composition for LED light source | |
JPH1154642A (en) | Hermetically sealed container for optical semiconductor and optical semiconductor module | |
TWI646693B (en) | Optical sensor device | |
US20220157684A1 (en) | Hermetically sealed glass enclosure | |
TWI840397B (en) | Ultraviolet device package | |
TWI743301B (en) | Synthetic quartz glass is covered with base material and synthetic quartz glass is covered and methods for manufacturing the same | |
US20220077369A1 (en) | Optoelectronic Component with a Transparent Bond Between Two Joining Partners and Method of Manufacturing the Same | |
WO2019039440A1 (en) | Transparent sealing member and optical component | |
JP6644745B2 (en) | Ultraviolet light element, package for ultraviolet light element, optical member used for ultraviolet light element, and method of manufacturing the optical member | |
CN109003971B (en) | Housing for optoelectronic device, method for producing same, and cover for housing | |
JP2019043836A (en) | Silica glass member, production method thereof and joint method of ceramic and silica glass | |
TWI597867B (en) | Led flip-chip packaging substrate and led package structure | |
JP2015032642A (en) | Light emitting device | |
WO2022130799A1 (en) | Lid member, package, and glass substrate | |
US20230148016A1 (en) | Window material for optical element, lid for optical element package, optical element package, and optical device | |
JP7495921B2 (en) | Transparent sealing materials | |
TW202209707A (en) | Packaged optoelectronic module and method for its production | |
CN215061395U (en) | Airtight packaging structure integrating plane optical window and spherical lens | |
WO2021014925A1 (en) | Lid material for light-emitting device and method for manufacturing lid material | |
KR101428021B1 (en) | Led package for manufacturing the same |