CN116352902A - Silicon wafer cutting equipment for manufacturing solar cell panel - Google Patents
Silicon wafer cutting equipment for manufacturing solar cell panel Download PDFInfo
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- CN116352902A CN116352902A CN202310515813.3A CN202310515813A CN116352902A CN 116352902 A CN116352902 A CN 116352902A CN 202310515813 A CN202310515813 A CN 202310515813A CN 116352902 A CN116352902 A CN 116352902A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention relates to the technical field of silicon wafer processing, in particular to silicon wafer cutting equipment for manufacturing a solar cell panel, which effectively improves the stress balance of a silicon rod and the flatness of a cutting end surface by adopting a combined cutting mode of a multidirectional synchronous cutting mode of the silicon rod and a autorotation cutting mode of the silicon rod, so that the cutting quality is improved, the multidirectional synchronous cutting mode greatly improves the cutting efficiency, simultaneously the silicon rod is matched with automatic rotation, the cutting lines on the left side and the right side of the silicon rod can be conveyed in the same direction by opposite rotation directions of conveying shafts on two U-shaped bed plates, one side of the cutting lines entering the silicon rod is a wire inlet end, one side of the cutting lines, which is conveyed out of the silicon rod, is a wire outlet end, and then is matched with the autorotation movement of the silicon rod, so that the wire inlet end on one side of the silicon rod can be used as the wire outlet end on the other side of the silicon rod, and the flatness of the cutting end surface can be greatly reduced by matching cutting lines on two sides of the U-shaped bed plates, so that the cutting quality is improved.
Description
Technical Field
The invention relates to the technical field of silicon wafer processing, in particular to silicon wafer cutting equipment for manufacturing a solar cell panel.
Background
The silicon element in the silicon chip is a crystal with a basically complete lattice structure, and different directions of the silicon element have different properties, so that the silicon element can be widely applied as a good semiconductor material in the fields of semiconductor device manufacture, solar panels and the like, the silicon chip is mainly processed by a silicon rod in a linear cutting mode when being processed, in the known cutting equipment, the silicon rod is actively close to a cutting line which is densely distributed and rotates at a high speed, the densely distributed cutting line can directly cut the silicon rod into a plurality of pieces, and thus the cutting is completed once.
Disclosure of Invention
In order to solve the technical problems, the invention provides silicon wafer cutting equipment for manufacturing a solar cell panel.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
the utility model provides a solar cell panel makes and uses silicon chip cutting equipment, includes two U type bed boards that set up relatively, the U type bed board is vertical, relative rotation in U type bed board has two carry the axle, carry the axis level of axle, two the transmission is densely covered between the carry the axle has a plurality of cutting lines, two be equipped with two turntables relatively between the U type bed board, the axis level of turntables, two of them the turntables can carry out the centre gripping to the silicon rod of placing between it, and the turntables can drive the silicon rod rotation.
Preferably, a plurality of first oil cylinders are fixed on the outer wall of one U-shaped bed board, a plurality of second oil cylinders are arranged on the outer side of the outer wall of the other U-shaped bed board, a sub-frame is arranged at the second oil cylinders towards the output end of the U-shaped bed board, sliding sleeves are respectively sleeved at two ends of the sub-frame in a sliding mode, the sliding direction of the sliding sleeves is parallel to the moving direction of the U-shaped bed board, the sliding sleeves are fixedly connected with the outer wall of the U-shaped bed board, a plurality of sliding ports are formed in the outer wall of each sliding sleeve, a plurality of protruding blocks are arranged on the outer wall of the sub-frame on the inner side of each sliding sleeve, the protruding blocks are clamped in the sliding ports in a sliding mode, and the sliding sleeves and the sub-frames are clamped through first leaf springs.
Preferably, two squeeze rollers are oppositely arranged between two conveying shafts on the U-shaped bed plate, the axes of the squeeze rollers are parallel to the axes of the conveying shafts, a first sliding block is fixed at the end part of each squeeze roller, the first sliding block is slidably arranged on the inner side wall of the U-shaped bed plate along the moving direction of the U-shaped bed plate, the first sliding block moves in a specified stroke, and the first sliding block is elastically connected with the U-shaped bed plate through a second plate spring;
wherein the squeeze roller is located inside the cutting line.
Preferably, the two end surfaces of the U-shaped bed board are provided with openings.
Preferably, a long hole is formed in the side wall of the U-shaped bed plate at the end part of the conveying shaft, the long hole is formed in the direction along the direction of a connecting line between the two conveying shafts on the U-shaped bed plate, a second sliding block slides in the long hole and is elastically connected with the U-shaped bed plate through a third plate spring, a worm wheel is rotated on the outer end face of the second sliding block on one side of the U-shaped bed plate and is in transmission connection with the conveying shafts, a first motor is fixed on the outer wall of the U-shaped bed plate, a worm is transmitted at the output end of the first motor, and the worm is in transmission connection with the two worm wheels on the U-shaped bed plate.
Preferably, the carousel orientation be equipped with the inserted block on the terminal surface of U type bed board, the shape of inserted block is the prism, the carousel deviates from be equipped with support ring on the terminal surface of U type bed board, and the carousel can rotate on the support ring, be fixed with first regulation cylinder on the support ring, the stiff end slip cap of first regulation cylinder is equipped with the supporting sleeve, be equipped with the link on the supporting sleeve outer wall, be fixed with the second motor on the link, and the output of second motor with the carousel transmission is connected.
Preferably, the device further comprises a supporting plate, wherein the supporting plate is located below the U-shaped bed plate, arc clamping grooves are densely distributed on the end faces of the U-shaped bed plate, T-shaped frames are arranged at two ends of the supporting plate, the T-shaped frames are of a T shape, and second adjusting cylinders are arranged at two outer ends of the T-shaped frames.
Preferably, a connecting disc is arranged at the end part of the supporting plate, the connecting disc is rotationally connected with the supporting plate, the connecting disc is fixed on the T-shaped frame, a third adjusting cylinder is eccentrically hinged on the side wall of the connecting disc, the third adjusting cylinder is inclined, and the fixed end of the third adjusting cylinder is hinged on the T-shaped frame;
the bottom of the supporting plate is provided with a U-shaped conveying belt for horizontal conveying.
Compared with the prior art, the invention has the beneficial effects that: the combined cutting mode of the multidirectional synchronous cutting mode of the silicon rod and the autorotation cutting mode of the silicon rod is adopted, so that the stress balance of the silicon rod can be effectively improved, the flatness of the cutting end face is improved, the cutting quality is improved, the multidirectional synchronous cutting mode can greatly improve the cutting efficiency, meanwhile, because the silicon rod is matched with automatic rotation, the rotation directions of the conveying shafts on the two U-shaped bed boards are opposite, the cutting lines on the left side and the right side of the silicon rod can be conveyed in the same direction, one side of the cutting lines entering the silicon rod is a wire inlet end, one side of the cutting lines, which is conveyed out, of the silicon rod is a wire outlet end, and then the autorotation movement of the silicon rod is matched, so that the wire inlet end on one side of the silicon rod can be used as the wire outlet end on the other side of the silicon rod, the generation of burrs of the cut of the silicon rod can be greatly reduced through the matching of the cutting lines on the two sides of the U-shaped bed boards, the flatness of the cutting end face is improved, and the cutting quality is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings may be obtained according to the drawings without inventive effort to those skilled in the art.
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic view of the structure of two U-shaped bed boards in FIG. 1;
FIG. 3 is a schematic view of the internal structure of the U-shaped bed board in FIG. 2;
FIG. 4 is a schematic view of the side fascia of FIG. 1 in a rear view in an enlarged configuration;
FIG. 5 is a schematic view of the rear face structure of the rotor of FIG. 4;
the reference numerals in the drawings: 1. a U-shaped bed board; 2. a conveying shaft; 3. cutting lines; 4. a turntable; 5. a first cylinder; 6. a second cylinder; 7. a sub-frame; 8. a sliding sleeve; 9. a bump; 10. a first leaf spring; 11. a squeeze roll; 12. a first slider; 13. a second leaf spring; 14. a notch; 15. a second slider; 16. a third leaf spring; 17. a worm wheel; 18. a first motor; 19. a worm; 20. inserting blocks; 21. a support ring; 22. a first adjusting cylinder; 23. a support sleeve; 24. a connecting frame; 25. a second motor; 26. a supporting plate; 27. a T-shaped frame; 28. a second adjusting cylinder; 29. a U-shaped conveyer belt; 30. a connecting disc; 31. a third adjusting cylinder; 32. a side substrate; 33. side coaming.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
In the description of the present invention, it should be noted that the directions or positional relationships indicated as being "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are directions or positional relationships based on the drawings are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements to be referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; the connection may be direct or indirect via an intermediate medium, or may be internal communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art. This example was written in a progressive manner.
As shown in fig. 1 to 4, the silicon wafer cutting device for manufacturing a solar cell panel comprises two oppositely arranged U-shaped bed boards 1, wherein the U-shaped bed boards 1 are vertical, two conveying shafts 2 are oppositely rotated in the U-shaped bed boards 1, the axes of the conveying shafts 2 are horizontal, a plurality of cutting lines 3 are densely distributed between the two conveying shafts 2 in a transmission manner, two turntables 4 are oppositely arranged between the two U-shaped bed boards 1, the axes of the turntables 4 are horizontal, the two turntables 4 can clamp silicon rods placed between the turntables, and the turntables 4 can drive the silicon rods to rotate.
Specifically, place the silicon rod between two turntables 4, two turntables 4 can carry out centre gripping fixed processing to the silicon rod, the silicon rod is located between two U type bed boards 1 this moment, rotatory conveying axle 2 makes a plurality of cutting lines 3 on the U type bed board 1 synchronous rotation, promote two U type bed boards 1 and be close to each other, two U type bed boards 1 drive its cutting line 3 removal, cutting line 3 on two U type bed boards 1 can carry out synchronous cutting to the silicon rod left and right sides and handle, thereby realize the multi-direction synchronous cutting work of silicon rod, the rotation of cooperation silicon rod again, can realize the circumference cutting mode to the silicon rod from outer wall to its axis.
When in actual use, the rotation directions of the conveying shafts 2 on the two U-shaped bed boards 1 are opposite, so that friction forces on the left side and the right side of the silicon rod are mutually offset, and the rotation speed of the silicon rod is slower than the conveying speed of the cutting line 3.
The combined cutting mode of the multidirectional synchronous cutting mode of the silicon rod and the autorotation cutting mode of the silicon rod is adopted, so that the stress balance of the silicon rod can be effectively improved, the flatness of the cutting end face is improved, the cutting quality is improved, the multidirectional synchronous cutting mode can greatly improve the cutting efficiency, meanwhile, because the silicon rod is matched with automatic rotation, the rotation directions of the conveying shafts 2 on the two U-shaped bed boards 1 are opposite, the cutting lines 3 on the left side and the right side of the silicon rod can be conveyed in the same direction, one side of the cutting lines 3 entering the silicon rod is a wire inlet end, one side of the cutting lines 3, which is conveyed out of the silicon rod, is a wire outlet end, and the autorotation movement of the silicon rod is matched, so that the wire inlet end on one side of the silicon rod can be used as the wire outlet end on the other side of the silicon rod, and the flatness of the cutting end face can be greatly reduced through the matching of the cutting lines 3 on the two sides of the U-shaped bed boards 1, and the cutting quality is improved.
Preferably, as shown in fig. 5, a plurality of first cylinders 5 are fixed on the outer wall of one U-shaped bed board 1 in the two U-shaped bed boards 1, a plurality of second cylinders 6 are arranged on the outer side of the outer wall of the other U-shaped bed board 1, a sub-frame 7 is arranged at the output end of the second cylinders 6 towards the U-shaped bed board 1, sliding sleeves 8 are sleeved at two ends of the sub-frame 7 in a sliding manner, the sliding direction of the sliding sleeves 8 is parallel to the moving direction of the U-shaped bed board 1, the sliding sleeves 8 are fixedly connected with the outer wall of the U-shaped bed board 1, a plurality of sliding ports are formed in the outer wall of the sliding sleeves 8, a plurality of protruding blocks 9 are arranged on the outer wall of the sub-frame 7 on the inner side of the sliding sleeves 8, the protruding blocks 9 are clamped in the sliding ports in a sliding manner, and the sliding sleeves 8 and the sub-frame 7 are elastically connected through first leaf springs 10.
Specifically, the outer ends of the first cylinders 5 and the outer ends of the second cylinders 6 are respectively provided with a side substrate 32, the side substrates 32 support the first cylinders 5 and the second cylinders 6, so that the U-shaped bed boards 1 are supported, in a natural state, the first plate springs 10 generate elastic thrust to the sliding sleeves 8, so that the convex blocks 9 are positioned at one ends of sliding ports, when the silicon rods need to be cut, the first cylinders 5 and the second cylinders 6 synchronously extend, so that the two U-shaped bed boards 1 are pushed to synchronously approach each other, cutting lines 3 on the U-shaped bed boards 1 cut the silicon rods, when the end surfaces of the two U-shaped bed boards 1 are contacted with each other, the cutting lines 3 on the two U-shaped bed boards 1 are mutually approached, only a small part of the silicon rods, which is close to the axis positions of the two U-shaped bed boards 1, is not cut, the first cylinders 5 continuously push the U-shaped bed boards 1 on the two U-shaped bed boards 1 to move, so that the elastic pushing force of the first plate springs 10 is overcome, the U-shaped bed boards 1 on the second cylinders 6 are pushed to reversely move, at the moment, the two U-shaped bed boards 1 synchronously move towards the small range of the direction of the second cylinders 6, so that the sliding sleeves 7 move in a small range, and the sliding sleeves 7 on the small range, so that the silicon rods can completely deviate from the axis 3 through the small range, and the cutting lines 3 can cut through the small axis of the silicon rods, and the silicon rods completely.
Preferably, as shown in fig. 3, two squeeze rollers 11 are oppositely arranged between two conveying shafts 2 on the U-shaped bed board 1, the axes of the squeeze rollers 11 are parallel to the axes of the conveying shafts 2, the end parts of the squeeze rollers 11 are fixed with first sliding blocks 12, the first sliding blocks 12 are slidably arranged on the inner side wall of the U-shaped bed board 1 along the moving direction of the U-shaped bed board 1, the first sliding blocks 12 move in a specified stroke, and the first sliding blocks 12 are elastically connected with the U-shaped bed board 1 through second leaf springs 13;
wherein the squeeze roller 11 is located inside the cutting line 3.
Specifically, when two U-shaped bed boards 1 are close to each other and cut the silicon rod, the part cutting line 3 in the cutting state enters the inner side of the silicon rod, at this time, the part silicon rod after cutting moves to the inner side of the cutting line 3 and approaches to the two squeeze rollers 11 in the U-shaped bed board 1, when the silicon rod at the inner side of the cutting line 3 contacts with the squeeze rollers 11, the squeeze rollers 11 squeeze the silicon rod after cutting, four squeeze rollers 11 on the two U-shaped bed boards 1 squeeze and fix the silicon rod after cutting in a clamping mode, and the first sliding block 12 is pushed by the squeeze rollers 11 to slide on the U-shaped bed boards 1, the second plate spring 13 elastically deforms, so that in the process of cutting the silicon rod by the cutting line 3, the squeezing and fixing work of the silicon rod after cutting can be performed, the silicon wafer is prevented from scattering randomly when the silicon rod is cut into a silicon wafer, the stability in the process of the silicon rod cutting is improved, the part silicon rod after cutting is prevented from random and leading to a clamping phenomenon is avoided, the silicon rod cutting gap is kept fixed all the time.
Preferably, as shown in fig. 3, the two end surfaces of the U-shaped bed board 1 are provided with openings 14.
Specifically, through opening 14, can provide the reserved space for carousel 4, avoid U type bed board 1 to collide with carousel 4 when cutting line 3 on the U type bed board 1 passes through the silicon rod axis and skew cutting.
Preferably, as shown in fig. 3, a long hole is formed in the side wall of the U-shaped bed board 1 at the end of the conveying shaft 2, the long hole direction is along the connecting line direction between the two conveying shafts 2 on the U-shaped bed board 1, a second sliding block 15 slides in the long hole, the second sliding block 15 is elastically connected with the U-shaped bed board 1 through a third plate spring 16, a worm wheel 17 rotates on the outer end face of the second sliding block 15 at one side of the U-shaped bed board 1, the worm wheel 17 is in transmission connection with the conveying shaft 2, a first motor 18 is fixed on the outer wall of the U-shaped bed board 1, a worm 19 is transmitted at the output end of the first motor 18, and the worm 19 is in transmission connection with the two worm wheels 17 on the U-shaped bed board 1.
Specifically, the third plate spring 16 can generate elastic thrust to the conveying shafts 2 through the second sliding blocks 15, so that the cutting line 3 between the two conveying shafts 2 is kept in a tight state, the first motor 18 can drive the two conveying shafts 2 to synchronously rotate through the worm 19 and the two worm gears 17, so that equipment is driven to operate, and the second sliding blocks 15 and the conveying shafts 2 at any positions can be continuously driven conveniently by adopting a transmission mode of the worm 19 and the worm gears 17.
Preferably, as shown in fig. 4 to 5, the end face of the turntable 4 facing the U-shaped bed board 1 is provided with an insert 20, the insert 20 is prismatic, the end face of the turntable 4 facing away from the U-shaped bed board 1 is provided with a supporting ring 21, the turntable 4 can rotate on the supporting ring 21, a first adjusting cylinder 22 is fixed on the supporting ring 21, a supporting sleeve 23 is sleeved on the fixed end sliding of the first adjusting cylinder 22, a connecting frame 24 is arranged on the outer wall of the supporting sleeve 23, a second motor 25 is fixed on the connecting frame 24, and the output end of the second motor 25 is in transmission connection with the turntable 4.
Specifically, both sides all are fixed with side wall plate 33 around between two side plates 32, the stiff end of first governing cylinder 22 is fixed on side wall plate 33, the silicon rod needs to offer the prismatic groove to the terminal surface of silicon rod before the centre gripping, when the silicon rod is placed between two turntables 4, first governing cylinder 22 extension and promote carousel 4 through holding ring 21 and remove, carousel 4 promotes the dog 20 card dress at the prismatic inslot, simultaneously carousel 4 extrudees the terminal surface of silicon rod, thereby make two turntables 4 realize centre gripping work effect to the silicon rod, and second motor 25 can drive carousel 4 rotation, carousel 4 can drive the silicon rod rotation through inserting the dog 20, thereby realize the autorotation motion of silicon rod, holding ring 21 carries out dynamic support to carousel 4.
When the first adjusting cylinder 22 stretches and contracts, the turntable 4 can drive the supporting sleeve 23 to slide on the fixed end of the first adjusting cylinder 22 through the second motor 25 and the connecting frame 24.
Preferably, as shown in fig. 5, the device further comprises a supporting plate 26, the supporting plate 26 is located below the two U-shaped bed plates 1, arc clamping grooves are densely distributed on the end faces of the supporting plate 26, two ends of the supporting plate 26 are respectively provided with a T-shaped frame 27, the T-shaped frames 27 are in a T shape, and two outer ends of the T-shaped frames 27 are respectively provided with a second adjusting cylinder 28.
Specifically, the fixed end of the second adjusting cylinder 28 is fixed on the side coaming 33, after the cutting lines 3 on the two U-shaped bed boards 1 cut silicon rods, the two U-shaped bed boards 1 are separated to a specified distance, at the moment, the squeeze rollers 11 in the U-shaped bed boards 1 still keep clamping work on the silicon wafers, the second adjusting cylinder 28 contracts and pushes the supporting plate 26 to move upwards through the T-shaped frame 27, the supporting plate 26 is close to the silicon wafers, the bottoms of the silicon wafers are clamped in the arc-shaped clamping grooves on the supporting plate 26, at the moment, the supporting plate 26 lifts the silicon wafers, the two U-shaped bed boards 1 are continuously separated, the second adjusting cylinder 28 stretches and drives the silicon wafers to move downwards through the supporting plate 26, and the silicon wafers are far away from the U-shaped bed boards 1, so that automatic unloading work of the silicon wafers is realized.
By using the T-shaped frame 27 and the two second adjusting cylinders 28 thereon, the second adjusting cylinders 28 are prevented from interfering with the first adjusting cylinders 22.
Preferably, as shown in fig. 5, the end of the supporting plate 26 is provided with a connecting disc 30, the connecting disc 30 is rotatably connected with the supporting plate 26, the connecting disc 30 is fixed on the T-shaped frame 27, a third adjusting cylinder 31 is eccentrically hinged on the side wall of the connecting disc 30, the third adjusting cylinder 31 is inclined, and the fixed end of the third adjusting cylinder 31 is hinged on the T-shaped frame 27;
the bottom of the supporting plate 26 is provided with a U-shaped conveying belt 29 for horizontal conveying.
Specifically, when the third adjusting cylinder 31 stretches and contracts, the third adjusting cylinder 31 can push the connecting disc 30 to rotate, so that the supporting plate 26 is driven to turn over, silicon wafers on the supporting plate 26 can naturally fall onto the U-shaped conveying belt 29, and then the silicon wafers are conveyed through the U-shaped conveying belt 29, so that a full-automatic processing process from silicon rod cutting to blanking conveying is realized.
The foregoing is merely a preferred embodiment of the present invention, and it should be noted that it will be apparent to those skilled in the art that modifications and variations can be made without departing from the technical principles of the present invention, and these modifications and variations should also be regarded as the scope of the invention.
Claims (8)
1. The utility model provides a silicon chip cutting equipment for solar cell panel makes, its characterized in that includes two U type bed boards (1) of relative setting, U type bed board (1) are vertical, relative rotation in U type bed board (1) has two conveying shaft (2), the axis level of conveying shaft (2), two the transmission is densely covered between conveying shaft (2) has a plurality of cutting lines (3), two be equipped with two carousel (4) relatively between U type bed board (1), the axis level of carousel (4), wherein two carousel (4) can carry out the centre gripping to the silicon rod of placing between it, and carousel (4) can drive the silicon rod rotation.
2. The silicon wafer cutting device for manufacturing the solar cell panel according to claim 1, wherein one of the two U-shaped bed boards (1) is fixedly provided with a plurality of first oil cylinders (5) on the outer wall of the U-shaped bed board (1), the outer side of the outer wall of the other U-shaped bed board (1) is provided with a plurality of second oil cylinders (6), the second oil cylinders (6) are provided with auxiliary frames (7) towards the output end of the U-shaped bed board (1), sliding sleeves at two ends of the auxiliary frames (7) are respectively provided with a sliding sleeve (8), the sliding direction of the sliding sleeve (8) is parallel to the moving direction of the U-shaped bed board (1), the sliding sleeve (8) is fixedly connected with the outer wall of the U-shaped bed board (1), the outer wall of the sliding sleeve (8) is provided with a plurality of sliding openings, the outer wall of the auxiliary frames (7) on the inner side of the sliding sleeve (8) is provided with a plurality of projections (9), the projections (9) are slidably clamped in the sliding openings, and accordingly the sliding sleeves (8) and the auxiliary frames (7) are connected with the leaf springs (10) through the sliding sleeves.
3. The silicon wafer cutting device for manufacturing the solar cell panel according to claim 2, wherein two squeeze rollers (11) are oppositely arranged between two conveying shafts (2) on the U-shaped bed plate (1), the axes of the squeeze rollers (11) are parallel to the axes of the conveying shafts (2), first sliding blocks (12) are fixed at the end parts of the squeeze rollers (11), the first sliding blocks (12) are slidably mounted on the inner side wall of the U-shaped bed plate (1) along the moving direction of the U-shaped bed plate (1), the first sliding blocks (12) move in a specified stroke, and the first sliding blocks (12) are elastically connected with the U-shaped bed plate (1) through second leaf springs (13);
wherein the squeeze roller (11) is located inside the cutting line (3).
4. The silicon wafer cutting equipment for manufacturing the solar panel according to claim 3, wherein the two end surfaces of the U-shaped bed plate (1) are provided with notches (14).
5. The silicon wafer cutting device for manufacturing the solar cell panel according to claim 4, wherein a long hole is formed in the side wall of the U-shaped bed plate (1) at the end part of the conveying shaft (2), the long hole direction is along the connecting line direction between the two conveying shafts (2) on the U-shaped bed plate (1), a second sliding block (15) slides in the long hole, the second sliding block (15) is elastically connected with the U-shaped bed plate (1) through a third plate spring (16), a worm wheel (17) is rotated on the outer end face of the second sliding block (15) on one side of the U-shaped bed plate (1), the worm wheel (17) is in transmission connection with the conveying shaft (2), a first motor (18) is fixed on the outer wall of the U-shaped bed plate (1), a worm (19) is transmitted at the output end of the first motor (18), and the worm (19) is in transmission connection with the two worm wheels (17) on the U-shaped bed plate (1).
6. The silicon wafer cutting device for manufacturing the solar cell panel according to claim 5, wherein an inserting block (20) is arranged on the end face of the rotary table (4) facing the U-shaped bed plate (1), the inserting block (20) is prismatic, a supporting ring (21) is arranged on the end face of the rotary table (4) facing away from the U-shaped bed plate (1), the rotary table (4) can rotate on the supporting ring (21), a first adjusting cylinder (22) is fixed on the supporting ring (21), a supporting sleeve (23) is arranged on the fixed end sliding sleeve of the first adjusting cylinder (22), a connecting frame (24) is arranged on the outer wall of the supporting sleeve (23), a second motor (25) is fixed on the connecting frame (24), and the output end of the second motor (25) is in transmission connection with the rotary table (4).
7. The silicon wafer cutting device for manufacturing the solar cell panel according to claim 6, further comprising a supporting plate (26), wherein the supporting plate (26) is located below between the two U-shaped bed plates (1), arc-shaped clamping grooves are densely distributed on the end faces of the supporting plate (26) towards the U-shaped bed plates (1), T-shaped frames (27) are arranged at two ends of the supporting plate (26), the T-shaped frames (27) are in a T-shaped shape, and second adjusting cylinders (28) are arranged at two outer ends of the T-shaped frames (27).
8. The silicon wafer cutting device for manufacturing the solar cell panel according to claim 7, wherein a connecting disc (30) is arranged at the end part of the supporting plate (26), the connecting disc (30) is rotationally connected with the supporting plate (26), the connecting disc (30) is fixed on the T-shaped frame (27), a third adjusting cylinder (31) is eccentrically hinged on the side wall of the connecting disc (30), the third adjusting cylinder (31) is inclined, and the fixed end of the third adjusting cylinder (31) is hinged on the T-shaped frame (27);
the bottom of the supporting plate (26) is provided with a U-shaped conveying belt (29) for horizontal conveying.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202310515813.3A CN116352902B (en) | 2023-05-09 | 2023-05-09 | Silicon wafer cutting equipment for manufacturing solar cell panel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202310515813.3A CN116352902B (en) | 2023-05-09 | 2023-05-09 | Silicon wafer cutting equipment for manufacturing solar cell panel |
Publications (2)
Publication Number | Publication Date |
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CN116352902A true CN116352902A (en) | 2023-06-30 |
CN116352902B CN116352902B (en) | 2023-08-08 |
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Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102267199A (en) * | 2011-06-28 | 2011-12-07 | 常州天泽光伏设备制造有限公司 | Self-centering synchronous clamping device for silicon rod |
CN103302754A (en) * | 2013-06-19 | 2013-09-18 | 中国有色桂林矿产地质研究院有限公司 | Diamond fretsaw cutting method and device |
CN103386522A (en) * | 2012-05-08 | 2013-11-13 | 无锡奥特维科技有限公司 | Solar silicon rod double-wire cutting method and device |
CN204249122U (en) * | 2014-11-27 | 2015-04-08 | 乐山新天源太阳能科技有限公司 | For circular silicon rod being cut into the cutter sweep of square silicon rod |
CN206066729U (en) * | 2016-10-14 | 2017-04-05 | 上海日进机床有限公司 | Squaring silicon bar equipment |
CN109176930A (en) * | 2018-09-30 | 2019-01-11 | 福州天瑞线锯科技有限公司 | A kind of crystalline silicon rod cutting machine |
CN111775353A (en) * | 2020-06-10 | 2020-10-16 | 浙江浦江中星有限公司 | High-efficient solar cell silicon chip cutterbar |
CN212498399U (en) * | 2020-03-30 | 2021-02-09 | 天通日进精密技术有限公司 | Silicon rod squaring machine |
CN114131769A (en) * | 2021-11-30 | 2022-03-04 | 青岛高测科技股份有限公司 | Cutting device and method |
CN115070970A (en) * | 2022-06-30 | 2022-09-20 | 青岛高测科技股份有限公司 | Workpiece clamping assembly and wire cutting machine |
-
2023
- 2023-05-09 CN CN202310515813.3A patent/CN116352902B/en active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102267199A (en) * | 2011-06-28 | 2011-12-07 | 常州天泽光伏设备制造有限公司 | Self-centering synchronous clamping device for silicon rod |
CN103386522A (en) * | 2012-05-08 | 2013-11-13 | 无锡奥特维科技有限公司 | Solar silicon rod double-wire cutting method and device |
CN103302754A (en) * | 2013-06-19 | 2013-09-18 | 中国有色桂林矿产地质研究院有限公司 | Diamond fretsaw cutting method and device |
CN204249122U (en) * | 2014-11-27 | 2015-04-08 | 乐山新天源太阳能科技有限公司 | For circular silicon rod being cut into the cutter sweep of square silicon rod |
CN206066729U (en) * | 2016-10-14 | 2017-04-05 | 上海日进机床有限公司 | Squaring silicon bar equipment |
CN109176930A (en) * | 2018-09-30 | 2019-01-11 | 福州天瑞线锯科技有限公司 | A kind of crystalline silicon rod cutting machine |
CN212498399U (en) * | 2020-03-30 | 2021-02-09 | 天通日进精密技术有限公司 | Silicon rod squaring machine |
CN111775353A (en) * | 2020-06-10 | 2020-10-16 | 浙江浦江中星有限公司 | High-efficient solar cell silicon chip cutterbar |
CN114131769A (en) * | 2021-11-30 | 2022-03-04 | 青岛高测科技股份有限公司 | Cutting device and method |
CN115070970A (en) * | 2022-06-30 | 2022-09-20 | 青岛高测科技股份有限公司 | Workpiece clamping assembly and wire cutting machine |
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