CN215667799U - Multilayer asymmetric conductive cloth adhesive - Google Patents
Multilayer asymmetric conductive cloth adhesive Download PDFInfo
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- CN215667799U CN215667799U CN202120415437.7U CN202120415437U CN215667799U CN 215667799 U CN215667799 U CN 215667799U CN 202120415437 U CN202120415437 U CN 202120415437U CN 215667799 U CN215667799 U CN 215667799U
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Abstract
The utility model discloses a multilayer asymmetric conductive cloth adhesive, which comprises an upper conductive adhesive layer, a conductive cloth layer and a lower conductive adhesive layer; the upper conductive adhesive layer is a heterodromous conductive adhesive layer; the lower conductive adhesive layer is a homodromous conductive adhesive layer; the upper conductive adhesive layer and the lower conductive adhesive layer both comprise metal conductive particles; the conductive cloth layer has micropores allowing the smallest metal conductive particles in the upper and lower conductive adhesive layers to pass through. According to the utility model, the conductive cloth adhesive and the steel sheet are attached to form a reinforcing component, and when the reinforcing component is attached to the position of an opening on the FPC, excellent conduction effect can be obtained under the condition that the grounding aperture in the FPC is very small through the upper and lower layers of the conductive adhesive layers in different directions; and through the combination of the homodromous type and the heterodromous type, a better small-aperture conduction effect can be obtained under the conditions of pressure transmission, general quick pressure and vacuum quick pressure.
Description
Technical Field
The utility model belongs to the technical field of printed circuit boards, and particularly relates to a multilayer asymmetric conductive adhesive tape.
Background
The development trend of electronic and communication products requires that FPC components develop towards light, thin, short and high integration, and new requirements are provided for the grounding reliability of circuit components in electronic products, the phenomenon that the resistance value is large when holes in FPC are designed to be small and the resistance value is increased after an SMT process can occur in the existing commonly used conductive adhesive products, meanwhile, as FPC needs to be attached with conductive adhesive and a reinforcing structure after multiple processes, the existing conductive adhesive products circulating in the market have the problems that the bonding force with FPC materials is insufficient due to strong bonding force with steel sheets or the bonding force with FPC materials is insufficient due to strong bonding force with steel sheets, the requirements on strong bonding force with FPC materials are hardly taken into consideration, and the risk that steel sheets are easy to fall off or the steel sheets and the conductive adhesive fall off from FPC together in downstream practical operation can occur, so that the whole FPC board reports waste.
In addition, in the existing market, the requirement on the grounding aperture in the FPC manufacturing process is smaller and smaller, the technical requirement on the downstream punching process is higher and higher, but due to the glue overflow fluidity of glue and the like, the conducting effect of the conductive glue material on the extremely small aperture is not ideal, and a new material is urgently needed to improve the grounding effect and stability of the extremely small aperture. At present, some new technologies and patents mention the use of the large-particle metal acne penetration effect to solve the problem and even avoid the open-hole design, but in practice, the material cost is high, the wide-range popularization is difficult, and the material is only suitable for some high-end products, and in addition, the product is required to be thin due to the large particle size of the conductive particles in the production process, and the actual production process and yield are difficult to guarantee.
Moreover, the conductive adhesive products popularized in the current market and the conductive adhesive industry are only suitable for the pressure transfer and general quick pressing process of the FPC factory, but the requirements of the FPC board on the size and the appearance are more and more strict at present, the general quick pressing can influence the appearance of the FPC board, the pressure transfer has a larger influence on the size stability of the FPC board, the vacuum quick pressing is popularized in various FPC factories at present, the influence on the appearance and the size in the pressing process can be reduced through the buffer effect of a vacuum air bag, but the vacuum quick pressing is limited by the pressure, so that the problem that the conductivity of the conductive adhesive products is unstable or insufficient when the pressing mode is used is caused.
SUMMERY OF THE UTILITY MODEL
The utility model mainly solves the technical problem of providing a multilayer asymmetric conductive cloth adhesive, wherein the conductive cloth adhesive is attached with a steel sheet and the like to form a reinforcing component, and when the reinforcing component is attached to an opening position on an FPC (flexible printed circuit), the grounding aperture in the FPC is very small by combining upper and lower layers of conductive adhesive layers in different directions and the combination effect of metal particles with different shapes and different particle sizes
The excellent conduction effect is obtained under the condition of (1), and meanwhile, the interference of external signals can be shielded; moreover, the reinforcing component formed after the reinforcing component is attached to the steel sheet and the like can also effectively prevent the deformation of the installation part, and meanwhile, the steel sheet has better stiffness and is beneficial to the operation of installation, transportation and the like of FPC parts; furthermore, through the combination of the homodromous type and the heterodromous type and the asymmetric structural design, the utility model can obtain better small aperture conduction effect under the conditions of pressure transmission, general fast pressure and vacuum fast pressure, and effectively solves the problem of unstable or insufficient vacuum fast pressure small aperture conduction.
In order to solve the technical problems, the utility model adopts a technical scheme that: a multilayer asymmetric conductive cloth adhesive comprises an upper conductive adhesive layer, a conductive cloth layer and a lower conductive adhesive layer, wherein the conductive cloth layer is formed between the upper conductive adhesive layer and the lower conductive adhesive layer;
the upper conductive adhesive layer is a heterodromous conductive adhesive layer;
the lower conductive adhesive layer is a homodromous conductive adhesive layer;
the upper conductive adhesive layer is an adhesive layer comprising metal conductive particles, and the lower conductive adhesive layer is an adhesive layer comprising metal conductive particles;
the conductive cloth layer has micropores allowing the smallest metal conductive particles in the upper and lower conductive adhesive layers to pass through.
The utility model adopts a further technical scheme for solving the technical problems that:
further, the particle diameter of the metal conductive particles in the upper conductive adhesive layer is larger than the particle diameter of the metal conductive particles in the lower conductive adhesive layer.
Further, the particle diameter of the metal conductive particles in the upper conductive adhesive layer is 25 to 55 μm;
the particle diameter of the metal conductive particles in the lower conductive adhesive layer is 10-15 μm.
Further, the upper conductive adhesive layer has a thickness greater than that of the lower conductive adhesive layer.
Further, the upper conductive adhesive layer has a thickness of 35 to 50 μm, and the lower conductive adhesive layer has a thickness of 10 to 25 μm.
Further, the thickness of the conductive cloth layer is 5-15 um;
one or both of the upper and lower surfaces of the conductive cloth layer is a metal plating layer.
Further, the metal coating on the surface of the conductive cloth layer is a copper-nickel coating, a copper-cobalt coating, a copper-tin coating, a copper-silver coating, a copper-iron-nickel coating, a copper-gold coating or a copper coating.
Further, the conductive fabric layer is a fiber fabric, the fiber fabric is a mesh fabric, a plain woven fabric or a non-woven fabric, and the size of the micropores of the fiber fabric allows the smallest metal conductive particles in the upper conductive adhesive layer and the lower conductive adhesive layer to pass through.
Further, a release film layer or a low-adhesion carrier film layer is respectively covered below the lower conductive adhesive layer and above the upper conductive adhesive layer, and the release film layer is a PET fluoroplastic release film layer, a PET silicone oil-containing release film layer, a PET matte release film layer, a PE release film layer or a PE laminating film paper layer; the release film layer is a double-sided release film layer or a single-sided release film layer.
Further, the thickness of the release film layer or the low adhesion carrier film layer is 25 to 100 μm.
The utility model has the following beneficial effects:
1. the adhesive layer with the metal conductive particles is subjected to FPC high-temperature pressing process, large-particle metal conductive particles in the upper conductive adhesive layer are contacted with metal conductive particles in the lower layer through gaps of the conductive cloth layer, and the metal conductive particles in the lower layer are contacted with the grounding hole, so that the grounding hole is very small
Has good conduction performance under the condition of (1); meanwhile, because the particle size of the metal conductive particles in the lower conductive adhesive layer is smaller, other material layers on the surface of the FPC panel cannot be damaged or particle points do not protrude after the pressing, and the FPC panel is protected;
2. the thickness of the upper conductive adhesive layer is 35-50um, the thickness of the lower conductive adhesive layer is 10-25um, the total thickness of the upper and lower conductive adhesive layers and the conductive cloth layer is preferably 45-60um, in actual production, the thickness of the formed product is only equal to the sum of the thicknesses of the upper and lower conductive adhesive layers after the upper and lower adhesives penetrate into the conductive cloth layer (because the carrier conductive cloth layer has a net-shaped or fibrous structure, after the upper and lower conductive adhesive layers are coated, the adhesive can penetrate into holes of the conductive cloth, the actual total thickness of the product is smaller than the sum of the thicknesses of the conductive cloth and the upper and lower conductive adhesive layers), and the thickness can be further reduced after lamination, for example, the thickness of the finished product conductive cloth adhesive is 60um, and the thickness after lamination is only about 42-45 um;
3. according to the utility model, through the combination of the homodromous conductive adhesive and the heterodromous conductive adhesive and the asymmetric structural design, a good small aperture conduction effect can be obtained no matter pressure transmission, general quick pressure or vacuum quick pressure condition is adopted in the downstream FPC manufacturing process, and the problem of unstable or insufficient vacuum quick pressure small aperture conduction is effectively solved;
4. when the conductive cloth adhesive of the utility model is used,because the carrier conductive cloth layer is thin and has good flexibility, after the conductive cloth adhesive is combined with the steel sheet, the downstream pressing process is carried out, on one hand, the metal conductive particles can realize the connection of the upper conductive particles, the lower conductive particles and the adhesive through holes in the conductive cloth, and because the lower metal conductive particles have higher proportion, the contact probability of the metal powder and the FPC surface is greatly increased, the problem that the minimum aperture is met in the FPC process can be effectively solved
The defects of insufficient conductivity and stability; on one hand, the upper layer and the lower layer can be combined with the steel sheet and the FPC respectively through the adjustment of the thickness of the upper layer and the lower layer and the production process parameters, the interface of the middle conductive cloth layer is damaged when the pel is tested after the FPC pressing and curing process, and the condition that the FPC reinforced parts fall off in the carrying, moving or transporting process due to the insufficient binding force of the single conductive adhesive layer and the FPC or the steel sheet can not occur;
5. the conductive cloth layer takes the fiber cloth as a base material, has good flexibility and wear resistance, is softer, does not have a pause point when being stripped, and is integrally and continuously damaged, and the design of the middle conductive layer greatly improves the problems that the traditional conductive adhesive on the market has a pel deficiency in the FPC manufacturing process and is easy to fall off when being attached to different FPCs;
6. the conductive cloth layer is favorable for the upper and lower conductive adhesive layers and the metal powder to be communicated through the holes in the upper and lower layers due to the fibrous or reticular structure, and meanwhile, due to good air permeability, the phenomenon of board explosion can not occur in the downstream processing procedure of the FPC through SMT, so that the problem of board explosion after SMT, which is encountered by conductive adhesive circulating in the current market, can be effectively solved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
the parts in the drawings are marked as follows:
an upper conductive adhesive layer 100, a conductive cloth layer 200, a lower conductive adhesive layer 300, and a release film layer or a low adhesion carrier film layer 400.
Detailed Description
The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the utility model easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the utility model.
Example (b): a multilayer asymmetric conductive cloth adhesive is shown in figure 1 and comprises an upper conductive adhesive layer 100, a conductive cloth layer 200 and a lower conductive adhesive layer 300, wherein the conductive cloth layer is formed between the upper conductive adhesive layer and the lower conductive adhesive layer;
the upper conductive adhesive layer is a heterodromous conductive adhesive layer;
the lower conductive adhesive layer is a homodromous conductive adhesive layer;
the upper conductive adhesive layer and the lower conductive adhesive layer both comprise metal conductive particles;
the conductive cloth layer has micropores allowing the smallest metal conductive particles in the upper and lower conductive adhesive layers to pass through.
The particle size of the metal conductive particles in the upper conductive adhesive layer is larger than that of the metal conductive particles in the lower conductive adhesive layer.
The particle size of the metal conductive particles in the upper conductive adhesive layer is 25-55 μm; if the particle size of the conductive particles is further increased (D90 is more than 55um), the problem of the coating head during the production and coating process is caused, and if the particle size of the conductive particles is further decreased (D90 is less than 25um), the upper layer and the lower layer are connected with small contact probability due to the small particle size of the conductive particles, and the stability of the conduction resistance is not good.
The particle diameter of the metal conductive particles in the lower conductive adhesive layer is 10-15 μm. If the particle size of the conductive particles is further increased (D90 is more than 15um), the problem of the blade coating head can be caused in the production process, and if the particle size of the conductive particles is further decreased (D90 is less than 10um), the upper layer and the lower layer are connected with small contact probability due to the small particle size of the conductive particles, and the stability of the conduction resistance is poor.
The thickness of the upper conductive adhesive layer is greater than the thickness of the lower conductive adhesive layer.
The thickness of the upper conductive adhesive layer is 35-50 μm, and the thickness of the lower conductive adhesive layer is 10-25 μm.
The thickness of the conductive cloth layer is 5-15 um; too thick conductive cloth layer can lead to the metal conductive particle in upper and lower adhesive layer can't contact, and upper and lower contact is bad, and too thin is unfavorable for production, increases manufacturing cost.
One or both of the upper and lower surfaces of the conductive cloth layer is a metal plating layer. The conductive cloth layer is also subjected to electroplating metal plating treatment, so that the conductive cloth layer has conductivity, and the conduction effect is further ensured.
The metal coating on the surface of the conductive cloth layer is a copper-nickel coating, a copper-cobalt coating, a copper-tin coating, a copper-silver coating, a copper-iron-nickel coating, a copper-gold coating or a copper coating. Preferably a copper-nickel plated layer and a copper-silver plated layer.
The conductive cloth layer is fiber cloth, the fiber cloth is grid cloth, plain woven cloth or non-woven cloth, and the size of micropores of the fiber cloth allows the smallest metal conductive particles in the upper conductive adhesion layer and the lower conductive adhesion layer to pass through. The conductive cloth layer is favorable for communicating large-particle conductive metal particles in the upper conductive adhesive layer and small-particle conductive metal particles in the lower conductive adhesive layer through holes in the conductive cloth layer due to the fibrous or net-shaped structure, and meanwhile due to good air permeability, the phenomenon of board explosion can not occur in the downstream processing procedure of the FPC through SMT, and the soldering resistance is good; the conductive cloth layer takes the ultrathin fiber cloth as a base material, has good flexibility and wear resistance, can improve the reliability and shielding performance of a product, has soft texture, does not have a pause point when being stripped, and is damaged integrally and continuously. The design of the middle conducting layer greatly solves the problems that the traditional conducting adhesive on the market has insufficient peel in the FPC manufacturing process and different FPCs are easy to fall off when being attached.
A release film layer or a low-adhesion carrier film layer 400 is respectively covered below the lower conductive adhesive layer and above the upper conductive adhesive layer, and the release film layer is a PET fluoroplastic release film layer, a PET silicone oil-containing release film layer, a PET matte release film layer, a PE release film layer or a PE laminating paper layer; the release film layer is a double-sided release film layer or a single-sided release film layer. A double-sided release film layer is preferred.
The thickness of the release film layer or the low-adhesion carrier film layer is 25-100 μm.
The release film (paper) is pure white, milky white or transparent, preferably pure white or milky white, and the white double-sided PET release film is preferred. When numerical control automation equipment sculpture circuit, infra red ray induction, white does not have the reverberation problem, can quick accurate location, the processing operation, and during manual work, white has the recognition effect, prevents that the manual work from leaking and tearing etc..
If the release paper is selected, the release paper and the adhesive layer of the product are required to be well attached and easy to peel, and the falling phenomenon cannot be generated in the transportation and carrying process.
The content of the metal conductive particles in the lower conductive adhesive layer is higher than the content of the metal conductive particles in the upper conductive adhesive layer.
The upper conductive adhesive layer is a thermosetting adhesive layer of adhesive resin and the metal conductive particles, and the weight ratio of the metal conductive particles in the upper conductive adhesive layer is 20-55%. Preferably, the weight ratio is 35-50%, too much powder can cause excessive powder, waste is generated, and too little powder has poor conduction effect.
The lower conductive adhesive layer is a thermosetting adhesive layer of adhesive resin and the metal conductive particles, and the weight ratio of the metal conductive particles in the lower conductive adhesive layer is 45-75%. The weight ratio is preferably 55-70%, and the conductive particles are different from the upper layer conductive particles in types, sizes and shapes, so that the conduction effect is enhanced.
The shape of the metal conductive particles of the upper conductive adhesive layer is at least one of dendritic metal powder, needle-shaped metal powder, flaky metal powder and spherical metal powder;
the shape of the metal conductive particles of the lower conductive adhesive layer is at least two of dendritic metal powder, needle-shaped metal powder, flaky metal powder and spherical metal powder.
The metal conductive particles of the upper conductive adhesive layer are dendritic metal powder; preferably dendritic, to ensure that the metal powder is conductive in the vertical direction.
The metal conductive particles of the lower conductive adhesive layer are sheet metal powder and dendritic metal powder, and the mixing ratio of the sheet metal powder to the dendritic metal powder (calculated by the inherent content of the main agent of the glue and the corresponding ratio in the actual calculation of the adding weight of the metal powder) is 1:2-1: 4. The metal powder is preferably flaky or dendritic, and ensures good conductivity of the metal powder in the vertical direction.
The metal conductive particles are at least one of gold, silver, copper, nickel, silver-plated copper, silver-plated nickel, gold-plated copper, gold-plated nickel and alloy, or at least one of conductive compounds such as graphite and the like and mixtures thereof.
The metal conductive particles of the upper conductive adhesive layer are nickel or silver-plated nickel.
The metal conductive particles of the lower conductive adhesive layer are silver-plated copper or gold-plated copper.
The adhesive resin is at least one selected from epoxy resin, acrylic resin, urethane resin, silicone rubber resin, poly-p-xylylene resin, bismaleimide resin, phenol resin, melamine resin and polyimide resin. Acrylic resins are preferred. The adhesive of the upper and lower conductive layers is the same adhesive, so that the problem of incompatibility caused by different adhesive systems is avoided.
Conducting conductivity analysis test on the conductive cloth adhesive with the upper and lower release films peeled off, wherein the test method comprises the following steps: conducting conductivity analysis and test by using a high bridge tester, respectively protecting the nickel-plated steel sheet and the FPC with the small conducting hole on the upper surface and the lower surface of the adhesive, and then testing the conductivity resistance value after general rapid pressing and vacuum rapid pressing, pressing and curing. The test conducted in the present invention was used as an example, the conductivity of a general product was tested in the same manner as a comparative example, and the results of the conductivity were recorded in table 1.
And (3) carrying out a peeling force analysis test on the conductive cloth adhesive after peeling the upper and lower release films, wherein the test method comprises the following steps: and (3) carrying out a peeling force analysis test by using a universal tensile machine, respectively laminating the nickel-plated steel sheet and the simple FPC on the upper surface and the lower surface of the adhesive layer, pressing, curing and taking out to test the Peel value. The test conducted in the present invention was used as an example, the peel force of a general product was measured in the same manner as a comparative example, and the results of the conductivity measured were recorded in table 1.
TABLE 1
As can be seen from the above table, compared with the common products, the asymmetric conductive adhesive of the present invention has small holes in the FPC
The conductive film has good conductive effect, stability and bonding strength under the condition. Generally, the conductivity of the conductive adhesive product is obviously poor or non-conductive under the condition of small aperture.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structural changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to other related technical fields, are included in the scope of the present invention.
Claims (9)
1. The utility model provides a multilayer asymmetric type electrically conductive cloth is glued which characterized in that: the conductive cloth layer is formed between the upper conductive adhesive layer and the lower conductive adhesive layer;
the upper conductive adhesive layer is a heterodromous conductive adhesive layer;
the lower conductive adhesive layer is a homodromous conductive adhesive layer;
the upper conductive adhesive layer is an adhesive layer comprising metal conductive particles, and the lower conductive adhesive layer is an adhesive layer comprising metal conductive particles;
the conductive cloth layer has micropores allowing the smallest metal conductive particles in the upper and lower conductive adhesive layers to pass through.
2. The multilayer asymmetric conductive adhesive tape of claim 1, wherein: the particle size of the metal conductive particles in the upper conductive adhesive layer is larger than that of the metal conductive particles in the lower conductive adhesive layer.
3. The multilayer asymmetric conductive adhesive tape of claim 2, wherein: the particle size of the metal conductive particles in the upper conductive adhesive layer is 25-55 μm; the particle diameter of the metal conductive particles in the lower conductive adhesive layer is 10-15 μm.
4. The multilayer asymmetric conductive adhesive tape of claim 1, wherein: the thickness of the upper conductive adhesive layer is greater than the thickness of the lower conductive adhesive layer.
5. The multilayer asymmetric conductive adhesive tape of claim 4, wherein: the thickness of the upper conductive adhesive layer is 35-50 μm, and the thickness of the lower conductive adhesive layer is 10-25 μm.
6. The multilayer asymmetric conductive adhesive tape of claim 1, wherein: the thickness of the conductive cloth layer is 5-15 um; one or both of the upper and lower surfaces of the conductive cloth layer is a metal plating layer.
7. The multilayer asymmetric conductive adhesive tape of claim 6, wherein: the metal coating on the surface of the conductive cloth layer is a copper-nickel coating, a copper-cobalt coating, a copper-tin coating, a copper-silver coating, a copper-iron-nickel coating, a copper-gold coating or a copper coating.
8. The multilayer asymmetric conductive adhesive tape of claim 1, wherein: the conductive cloth layer is fiber cloth, the fiber cloth is grid cloth, plain woven cloth or non-woven cloth, and the size of micropores of the fiber cloth allows the smallest metal conductive particles in the upper conductive adhesion layer and the lower conductive adhesion layer to pass through.
9. The multilayer asymmetric conductive adhesive tape of claim 1, wherein: a release film layer or a low-adhesion carrier film layer covers the lower part of the lower conductive adhesive layer and the upper part of the upper conductive adhesive layer respectively, and the release film layer is a PET fluoroplastic release film layer, a PET silicon-containing oil release film layer, a PET matte release film layer, a PE release film layer or a PE laminating film paper layer; the release film layer is a double-sided release film layer or a single-sided release film layer, and the thickness of the release film layer or the low-adhesion carrier film layer is 25-100 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120415437.7U CN215667799U (en) | 2021-02-25 | 2021-02-25 | Multilayer asymmetric conductive cloth adhesive |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120415437.7U CN215667799U (en) | 2021-02-25 | 2021-02-25 | Multilayer asymmetric conductive cloth adhesive |
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| Publication Number | Publication Date |
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| CN215667799U true CN215667799U (en) | 2022-01-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202120415437.7U Active CN215667799U (en) | 2021-02-25 | 2021-02-25 | Multilayer asymmetric conductive cloth adhesive |
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- 2021-02-25 CN CN202120415437.7U patent/CN215667799U/en active Active
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