CN1160177C - Method and device for isolating plate-like substrates - Google Patents

Method and device for isolating plate-like substrates Download PDF

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Publication number
CN1160177C
CN1160177C CNB008143714A CN00814371A CN1160177C CN 1160177 C CN1160177 C CN 1160177C CN B008143714 A CNB008143714 A CN B008143714A CN 00814371 A CN00814371 A CN 00814371A CN 1160177 C CN1160177 C CN 1160177C
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China
Prior art keywords
substrate
substrates
sheet
grabber
grabbing device
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Expired - Fee Related
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CNB008143714A
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Chinese (zh)
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CN1379708A (en
Inventor
Լɪ��������
约瑟夫·根蒂舍
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Schmid Technology Systems GmbH
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ACR Automation in Cleanroom GmbH
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Publication of CN1379708A publication Critical patent/CN1379708A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

The invention relates to a method for isolating and detaching thin, fragile, plate-like substrates (11). Said plate-like substrates (11) are cut from a substrate block (13), which is preferably mounted on a baseplate (12) by means of adhesive, are gripped at evenly distributed points on the free outer surface thereof (16) and are displaced in an oscillating manner, such that the plate-like substrates (11) are automatically and individually removed free of damage from the sawn substrate block and from the layer of adhesive.

Description

The method and apparatus of isolating plate-like substrate
Technical field
The present invention relates to a kind of method and device that makes easily cracked laminar substrate separate and take off, by cutting out on the substrate bulk, this substrate bulk preferably remains in by means of being adhesively fixed on the substrate these substrates.
Background technology
When making sheet-like substrates, for example be used for the substrate of solar cell, what people used is substrate bulk or the substrate post that is cut into the silicon of thin slice.For this reason, substrate bulk or substrate post are bonded on the substrate and thereby are fixed there.After finishing cutting, the substrate of each sheet all also adheres on the substrate with its bottom surface by bonding wire or cemented side seam.The upper surface of substrate is normally made by glass, and by the while sawing.Like this, after fully substrate bulk or substrate post being cut open, form a kind of product of comb shape, with hand very breakable sheet-like substrates is fractureed at bonding position by it.Because such sheet-like substrates is extremely thin, for example, in the scope of about 0.3mm, and the sawing slit equally can be not bigger than it yet.Thereby, in the process of peeling off with hand, there is a large amount of sheets to be damaged or fragmentation.In addition, because must be careful when peeling off, thereby the time of required cost for this reason is also quite a lot of.
Summary of the invention
The objective of the invention is, create a kind of method and device of type noted earlier, can be automatically and without damage the substrate bulk of these breakable laminar substrates after by sawing sewed on from adhesion and taken off by them.
According to an aspect of the present invention, a kind of method that makes frangible laminar substrate separate and take off is provided, these substrates remain in a substrate bulk on the substrate by one by means of being adhesively fixed and cut out, wherein, described sheet-like substrates is booked on one or more interval location on its outer surface that exposes, and by oscillating movement, it is characterized by: sheet-like substrates is swung round an axis vibration, this axis is in supporting place of substrate on substrate, and be parallel to bearing-surface, sheet-like substrates is held tensioning on the direction of leaving substrate when its oscillating movement.
According to a further aspect in the invention, providing a kind of is used for frangible laminar substrate separately and the device of taking off, these substrates cut out by remain in a substrate bulk on the substrate by means of being adhesively fixed, has a grabbing device, can on the adjacent a plurality of positions on the outer surface that exposes of substrate, catch this sheet-like substrates by means of it, and it can be driven and oscillating movement, it is characterized by: a plurality of grabber arms are holded up from a grabber plate of grabbing device rigidly, and this grabber plate can oscillatorily be swung round an axis, this parallel axes is in the outer surface of the sheet-like substrates that is booked, and on substrate, stretch in the support region of sheet-like substrates, and the grabber plate has an arc skateboard that is directed in a groove, and described slide plate can order about reciprocating motion by an eccentric that is rotated driving.
By measure of the present invention, easily cracked laminar substrate can be plane regional compartmentalization section ground basically by one and carry out grasping, from cemented side seam, get loose, and take out safely by this by vibration.According to this mode, carry out a vibration swing round cemented side seam or bonding wire, make this cemented side seam generation fatigue fracture.In addition, make also that thus acting on oneself active force on one's body of sheet-like substrates is limited on the minimum.
For can measure that sheet-like substrates fully takes off or lift from the cemented side seam that breaks in other words from the substrate that constantly, the grabber bracing or strutting arrangement is bias voltage ground support grabbing device on a direction that sheet-like substrates is lifted from substrate.By act on tensile force on the sheet-like substrates (in any case its size can prevent that sheet-like substrates from rupturing) along the direction of lifting from substrate, can be fast and record or pick out cemented side seam simply moment of rupturing has sufficiently taken place.Sheet-like substrates just can be taken off subsequently safely, is used for following process and/or stores.
Preferably, the grabber bracing or strutting arrangement has draw element and who is connected with a lifting drive unit can draw the flexibly supporting plate of relative motion of element with respect to this, is fixing grabbing device on this supporting plate.
Preferably, fixing a lever arm on relatively-movable supporting plate, it has the groove of the arc skateboard of the grabbing device that is used for leading.
Preferably, on the grabber bracing or strutting arrangement, be provided with a transducer, be used for detecting the relative motion of drawing between element and the supporting plate.
Preferably, each adjacent sheet-like substrates is preferably they be separated from each other by means of a pressure beam in the zone of substrate, and therefore takes off from substrate.If they are because inevitably moist and/or be in heeling condition and together adhered to one another at least in part in the course of processing.
What preferably, adjacent sheet-like substrates is carried out separately is to carry out the cutting slit between two adjacent sheet-like substrates of the flat beacon alignment of liquid between the sheet-like substrates to be booked and the substrate of closelying follow in the back.For the sheet-like substrates of different area, shape and size being separated and they being taken off, sheet-like substrates is booked by absorption with an array format relevant with specification.By this way, not only can handle different specifications, and can make the nubbin of cracked sheet-like substrates take off and take out.For those slice, thin pieces of having taken off when sawing substrate bulk or the substrate post, these are effective too.
Preferably, the suction nozzle array is divided into a plurality of control areas; Be each a suction nozzle vacuum generator of configuration and a transducer that is used for measuring the vacuum that applies.
Preferably, to separately and with suction type the extracting that related substrate carries out being carried out in time synchronously that adjacent sheet-like substrates is carried out; In order to grasp each sheet-like substrates, settling the substrate stepping of the substrate bulk of having cut to move, in the technical favourable mode of flow process, sheet-like substrates can be flowed to grabbing device, and reliably it be caught when separating at the same time by this grabbing device.Wherein, treat that crawled sheet-like substrates accurately measured by a position transducer to the conveying of grabbing device.
Description of drawings
Other details of the present invention is asked for an interview following explanation.Wherein the present invention is carried out detailed explanation and explanation by means of an embodiment who provides in the legend.Be illustrated as:
The end view that the part that Fig. 1 provides is in a schematic way dissectd has provided in the preferred embodiment of the present invention, the device that the substrate bulk of sheet-like substrates after the cutting separated and made it to take off,
Fig. 2 is the partial top view of direction shown in the arrow II in Fig. 1,
Fig. 3 is when direction looks shown in the arrow III in Fig. 2, has the end-view of the grabbing device of suction nozzle array in variant embodiment, and
The line configuring schematic diagram of Fig. 4 suction nozzle array as shown in Figure 3.
Embodiment
Device 10 shown in the accompanying drawing is used to make the thin substrate 11 of the sheet that is easy to fragmentation to separate and takes off.This substrate is by cutting out on the substrate bulk 13 that fixedly remains on the substrate 12.The substrate bulk of this class can be a silico briquette of being made by polysilicon, and it can be adhered on the sheet glass parts of substrate 12 by means of a bi-component bond.By means of parallel line of cut, under the situation of sending into the liquid cutting agent, this silico briquette cut into single, for example can be as the silicon chip of solar wafer.This substrate bulk 13 cutting or sawing are become the thin substrate of the single sheet process of wafer in other words, will proceed to always and be cut into till the sheet glass parts that are arranged in steel plate member upper substrate 12.Afterwards, all sheet-like substrates 11 is fixedly remaining in substrate 12 in other words on the sheet glass parts by the cemented side seam shown in Fig. 1 15 on its lower edge.Each sheet-like substrates 11 is especially sentenced a spacing that equals kerf 14 width at cemented side seam 15 and is being settled relatively.Owing to used liquid cutting agent, may make each adjacent sheet-like substrates 11 in parallel to each other or relative tilt adhere to each other.Sheet-like substrates 11 is approximately 0.7 to 0.8mm as the thickness of semiconductor wafer, and during as solar cell wafer, thickness is between 0.2 to 0.3mm.Sometimes, the thickness of substrate slice also may be in the 0.15mm scope.By device 10 of the present invention, such sheet thin layer substrate 11 can be separated with adjacent sheet-like substrates, and make its ground and generally take off with no damage of not rupturing from the substrate 12 with automated manner, store and/or proceed processing thereby flow to the back in simple mode.
Device 10 has a grabbing device 20, and it can carry out reciprocating vibration along the direction shown in the double-head arrow B when being driven, and its effect is that sheet-like substrates 11 is taken off from substrate 12 on the one hand, is on the other hand sheet-like substrates 11 to be taken off and continue to carry.For this reason and for along direction bias voltage shown in the arrow C 1, grabbing device 20 is fixed on the grabber bracing or strutting arrangement 30.
Grabbing device 20 has a grabber plate 21, and the grabber arm 22 of array configuration is vertically erected by it.The configuration of the array of grabber arm 22 can be as by device shown in Figure 1 shown in Figure 3 through after the modification.Grabber arm 22 is substantially equal at planar dimension on the grabber plate 21 of planar dimension of sheet-like substrates 11 and settles like this, makes their piecewises or point-like be distributed in substantially on the whole outer surface crawled on the sheet-like substrates 11 16.Grabber arm 22 has suction nozzle 23 on it deviates from the free end of grabber plate 21, the latter also will illustrate in the back as us, couples together with a vacuum plant 50.Grabber plate 21 deviates from the upper end of substrate 12 and it deviates from the back side of grabber arm 22 at it, is connected with an arc skateboard 24.The latter is held in the accommodation section 32 of the support 31 on the grabber bracing or strutting arrangement 30, is led along direction shown in the double-head arrow B.The rearward end 26 of slide plate 24 has a chute opening 25, wherein inserts an eccentric wheel 33, and it is supported on by an eccentric shaft 34 and is erectting on the flange 35 of settling on the support 31, and is subjected to the rotation driving by a not shown motor.By the rotation of eccentric wheel 33, slide plate 24 moves along circular arc to and fro along the direction shown in the double-head arrow B, thereby makes grabber plate 21 drive grabber arm 22 swing oscillatorily.Support 31 is intersected the imaginary extended line of its central shaft 36 and cemented side seam 15 by directed like this.Like this, by means of eccentric drive mechanism 33,34, make grabber plate 21 oscillatorily swing round the cemented side seam 15 between sheet-like substrates 11 and the substrate 12.
Support 31 is fixed on the supporting plate 37, and the latter can carry out straight line along direction shown in the double-head arrow C with respect to a support brace 38 and move.For this reason, bracing or strutting arrangement connector 38 is fixedlyed connected with the hitching post 39 of arrangement at regular intervals each other, and the latter axially movably passes supporting plate 37, and has a stop tab 41 on their end.Between the bottom surface of stop tab 41 and supporting plate 37, settling compression spring 40.Bracing or strutting arrangement connector 38 can lift along the direction of arrow C 1 is up mobile in other words by a kind of unshowned mode, and its lifter motion can be followed or not follow by the supporting plate 37 that is connected with support 31 (also will illustrate as following).Bracing or strutting arrangement connector 38 is connected with the angle-shaped piece 42 that hold up a side, and a mobile acquisition sensor 43 has been installed on the end that the latter stretches out downwards, and it is relative with a zone between the stop tab 41 of supporting plate 37 and hitching post 39.
According to Fig. 1 and 2, be provided with a position transducer 27 on the grabbing device 20.It is relative with each crawled sheet-like substrates 11.In addition, in a side regions of substrate 12, in a height zone that is higher than the cemented side seam 15 between sheet-like substrates 11 and the substrate 12 hardly, settling to fixed-site a spray nozzle 45, it links to each other with a liquid pressure container then in a not shown manner, and kerf 14 zones between two adjacent sheet-like substrates 11 of its slot-shaped jet hole 46 alignings.Relative with it, substrate 12 and the substrate bulk 13 that is cut can move and thereby move to grabbing device 20 directions of the swing of can vibrating along the direction shown in the arrow A.
Make be easy to the thin substrate 11 of broken sheet each other in other words from one remain in with being adhesively fixed on the substrate 12 substrate bulk 13 separately and the method for taking off and process in following description, described substrate bulk has been cut into sheet-like substrates 11.
Substrate 12 moves along the direction shown in the arrow A, confirmed that up to position transducer 27 its top sheet-like substrates 11 has arrived correct position for clinging on the grabbing device 20, wherein this position transducer 27 be set at cemented side seam 15 lower area not far from one another in.Feed liquid in this sprayer unit 45 simultaneously, thus by slit shower nozzle 46 give at first a substrate 11 and the kerf 14 between the next substrate 11 of its back in inject a flat liquid beam.Wherein, the liquid beam disassembles contingent adhesion between the adjacent sheet-like substrates 11, and/or make and treat that crawled sheet-like substrates (vertically) holds up.By connecting vacuum plant 50, a top crawled sheet-like substrates 11 is caught by the suction nozzle 23 that is installed on the grabber arm 22.
Afterwards, eccentric 33,34 brings into operation, thus the oscillating motion that grabbing device 20 is vibrated.Hunt has little amplitude, between 2 to 6 °, and preferably 3 °, this moment, the frequency range of swing was approximately 5 to 10Hz.This hunt is delivered on the sheet-like substrates 11 that crawled device 20 catches.The hunt of sheet-like substrates 11 is performed until and forms sufficiently long crack on the cemented side seam 15 between sheet-like substrates 11 and the substrate 12, and it makes it possible to no damage sheet-like substrates 11 be taken off.
Before the beginning hunt and in the process of carrying out, yet after grabbing device 20 has been caught relevant sheet-like substrates 11, the bracing or strutting arrangement connector 38 of grabber bracing or strutting arrangement 30 moves up along the direction shown in the arrow C 1, wherein, the support 37 that is fixed together with grabbing device 20 rests on its position.This means that on the direction shown in the arrow C 1 grabber bracing or strutting arrangement 30 has a bias voltage that equates with spring stress, thereby in cemented side seam 15, form tension stress that its size will guarantee sheet-like substrates 11 is carried out undamaged processing all the time.By means of relatively moving between bracing or strutting arrangement connector 38 and the supporting plate 37, compression spring 40 is compacted along arrow C 1 direction, and the mobile measuring transducer 43 that is moved mobile and/or stop tab 41 of spring coil records.
Under the effect of this tension stress, the vibration swing vibration in other words of sheet-like substrates 11 is proceeded, and to proceed to split long enough or fatigue rupture takes place of cemented side seam 15 always, make sheet-like substrates 11 under the described tensioning effect of pulling force in other words, take off and be removed from substrate 12 along the direction of arrow C 1.Supporting plate 37 moves up along direction shown in the arrow C, and compression spring 40 is relaxed.Such process is moved measuring transducer 43 and detects.
The sheet-like substrates 11 that has been separated and has taken off just can be carried by unshowned mode subsequently and be stored or carry out following process and handled.
According to Fig. 3 and 4, the grabber arm 22 array configuration of its suction nozzle 23 in other words is hinged with by certain mode.All suction nozzles 23 are connected with a vacuum generator 51 of for example jet blower form all the time.In addition, also whether for n the jet blower 51 corresponding with n suction nozzle 23 is provided with n transducer 52, can analyze by them has suction nozzle 23 and which suction nozzle 23 to catch a corresponding face of corresponding sheet-like substrates 11.Can to extrapolate relevant sheet-like substrates 11 again conversely be complete or only be broken by it, makes people can carry out/bad go-on-go thus.
According to Fig. 3, suction nozzle 23 is formed two zones 53,54 that (perhaps a plurality of) are relevant with specification, and correspondingly connects.The different outer surface sizes sheet-like substrates 11 of specification 16`, 16``, 16```, 16```` in other words can be handled by this way, and also them can be caught.Zone difference that also can these are relevant with specification is come and is applied vacuum, thereby the fragment of sheet-like substrates can be caught and it is got rid of.
According to a unshowned embodiment, can also only install one for grabbing device, the bigger suction nozzle of area when needing.

Claims (19)

1. the method that makes frangible laminar substrate separate and take off, these substrates remain in a substrate bulk on the substrate by one by means of being adhesively fixed and cut out, wherein, described sheet-like substrates is booked on one or more interval location on its outer surface that exposes, and by oscillating movement, it is characterized by: sheet-like substrates is swung round an axis vibration, this axis be in substrate on substrate supporting place and be parallel to bearing-surface, sheet-like substrates is held tensioning on the direction of leaving substrate when its oscillating movement.
2. the method for claim 1 is characterized by: each adjacent sheet-like substrates is separated from each other by means of a liquid beam near the zone of substrate at them.
3. method as claimed in claim 2 is characterized by: what adjacent sheet-like substrates was carried out separately is to carry out between the sheet-like substrates to be booked and the substrate of closelying follow in the back.
4. as claim 2 or 3 described methods, it is characterized by: the cutting slit between two adjacent sheet-like substrates of the flat beacon alignment of liquid.
5. the method for claim 1, it is characterized by: sheet-like substrates is booked by absorption with an array format relevant with specification.
6. as claim 2,3 or 5 described methods, it is characterized by: separately and with suction type the extracting that related substrate carries out being carried out in time synchronously that adjacent sheet-like substrates is carried out.
7. as claim 1,2,3 or 5 described methods, it is characterized by: for the substrate stepping that grasps each sheet-like substrates, settling the substrate bulk of having cut moves.
8. be used for separately and the device of taking off (10) frangible laminar substrate (11), these substrates are cut out by the substrate bulk (13) that remains in by means of being adhesively fixed on the substrate (12), has a grabbing device (20), can on the adjacent a plurality of positions on the outer surface that exposes (16) of substrate, catch this sheet-like substrates (11) by means of it, and it can be driven and oscillating movement, it is characterized by: a plurality of grabber arms (22) are holded up from a grabber plate (21) of grabbing device (20) rigidly, and this grabber plate (21) can oscillatorily be swung round an axis (15), this parallel axes is in the outer surface (16) of the sheet-like substrates that is booked (11), and in the support region of the last sheet-like substrates (11) of substrate (12), stretch, and grabber plate (21) has an arc skateboard (24) that is directed in a groove (32), described slide plate can order about reciprocating motion by an eccentric (33,34) that is rotated driving.
9. device as claimed in claim 8 is characterized by: grabber bracing or strutting arrangement (30) bias voltage ground on a direction that sheet-like substrates (11) is lifted from substrate (12) supports grabbing device (20).
10. device as claimed in claim 9, it is characterized by: grabber bracing or strutting arrangement (30) has draw element (38) and who is connected with a lifting drive unit can draw the flexibly supporting plate of relative motion (37) of element (38) with respect to this, is fixing grabbing device (20) on this supporting plate.
11. as claim 8 or 10 described devices, it is characterized by: fixing a lever arm (31) on relatively-movable supporting plate (37), it has the groove (32) of the arc skateboard (24) of grabbing device (20) that are used for leading.
12., it is characterized by: on grabber bracing or strutting arrangement (30), be provided with a transducer (43), be used for detecting the relative motion of drawing between element (38) and the supporting plate (37) as claim 9 or 10 described devices.
13. as claim 8,9 or 10 described devices, it is characterized by: be provided with a drive nozzle (45), it is placed on the side of substrate (12), approach the supporting position (15) of sheet-like substrates (11) on substrate (12), aim between adjacent two sheet-like substrates (11), wherein, drive nozzle (45) and substrate (12) can relatively move along the direction of substrate bulk (13).
14. device as claimed in claim 13 is characterized by: drive nozzle (45) has a slot-shaped outlet (46).
15. device as claimed in claim 8 is characterized by: be equipped with suction nozzle (23) on the grabber arm (22) of grabbing device (20), the latter settles by array and can control according to specification.
16. device as claimed in claim 15 is characterized by: the suction nozzle array is divided into a plurality of control areas.
17., it is characterized by: be each suction nozzle (23) configuration vacuum generator (51) and a transducer (52) that is used for measuring the vacuum that applies as claim 15 or 16 described devices.
18., it is characterized by as claim 8,9 or 10 described devices: drive nozzle (45) fixed-site, and substrate (12) can move to grabbing device (20) by step-by-step system.
19., it is characterized by: upward be provided with a position transducer (27) for substrate bulk (13) at grabbing device (20) as claim 8,9 or 10 described devices.
CNB008143714A 1999-10-16 2000-10-12 Method and device for isolating plate-like substrates Expired - Fee Related CN1160177C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19950068.1 1999-10-16
DE19950068A DE19950068B4 (en) 1999-10-16 1999-10-16 Method and device for separating and detaching substrate disks

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CN1379708A CN1379708A (en) 2002-11-13
CN1160177C true CN1160177C (en) 2004-08-04

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EP (1) EP1220739B1 (en)
JP (1) JP4731077B2 (en)
CN (1) CN1160177C (en)
AT (1) ATE294056T1 (en)
AU (1) AU777067B2 (en)
CA (1) CA2388730A1 (en)
DE (2) DE19950068B4 (en)
ES (1) ES2240189T3 (en)
WO (1) WO2001028745A1 (en)

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JP2003512196A (en) 2003-04-02
CN1379708A (en) 2002-11-13
ES2240189T3 (en) 2005-10-16
ATE294056T1 (en) 2005-05-15
EP1220739B1 (en) 2005-04-27
JP4731077B2 (en) 2011-07-20
AU777067B2 (en) 2004-09-30
DE19950068A1 (en) 2001-04-26
CA2388730A1 (en) 2001-04-26
AU1136801A (en) 2001-04-30
DE19950068B4 (en) 2006-03-02
DE50010186D1 (en) 2005-06-02
EP1220739A1 (en) 2002-07-10

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