ATE294056T1 - METHOD AND DEVICE FOR SEPARATING DISK-SHAPED SUBSTRATES - Google Patents
METHOD AND DEVICE FOR SEPARATING DISK-SHAPED SUBSTRATESInfo
- Publication number
- ATE294056T1 ATE294056T1 AT00972741T AT00972741T ATE294056T1 AT E294056 T1 ATE294056 T1 AT E294056T1 AT 00972741 T AT00972741 T AT 00972741T AT 00972741 T AT00972741 T AT 00972741T AT E294056 T1 ATE294056 T1 AT E294056T1
- Authority
- AT
- Austria
- Prior art keywords
- substrates
- plate
- shaped substrates
- separating disk
- adhesive
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Manipulator (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
Abstract
The invention relates to a method for isolating and detaching thin, fragile, plate-like substrates (11). Said plate-like substrates (11) are cut from a substrate block (13), which is preferably mounted on a baseplate (12) by means of adhesive, are gripped at evenly distributed points on the free outer surface thereof (16) and are displaced in an oscillating manner, such that the plate-like substrates (11) are automatically and individually removed free of damage from the sawn substrate block and from the layer of adhesive.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19950068A DE19950068B4 (en) | 1999-10-16 | 1999-10-16 | Method and device for separating and detaching substrate disks |
PCT/EP2000/010036 WO2001028745A1 (en) | 1999-10-16 | 2000-10-12 | Method and device for isolating plate-like substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE294056T1 true ATE294056T1 (en) | 2005-05-15 |
Family
ID=7925995
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT00972741T ATE294056T1 (en) | 1999-10-16 | 2000-10-12 | METHOD AND DEVICE FOR SEPARATING DISK-SHAPED SUBSTRATES |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP1220739B1 (en) |
JP (1) | JP4731077B2 (en) |
CN (1) | CN1160177C (en) |
AT (1) | ATE294056T1 (en) |
AU (1) | AU777067B2 (en) |
CA (1) | CA2388730A1 (en) |
DE (2) | DE19950068B4 (en) |
ES (1) | ES2240189T3 (en) |
WO (1) | WO2001028745A1 (en) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10108369A1 (en) * | 2001-02-21 | 2002-08-29 | B L E Lab Equipment Gmbh | Method and device for detaching a semiconductor wafer from a carrier |
CN1890074B (en) * | 2003-12-04 | 2011-03-30 | 三星钻石工业股份有限公司 | Substrate machining method, substrate machining device, substrate carrying method, and substrate carrying mechanism |
DE102004060040B3 (en) * | 2004-12-14 | 2006-06-14 | Richter, Uwe, Dr. | Device for separating and sorting of disc-form substrates has first module for separating of disc-form substrates from stack, and second module for measurement and evaluation of thickness and shape of uppermost substrate |
DE102005016518B3 (en) * | 2005-04-08 | 2006-11-02 | Rena Sondermaschinen Gmbh | Substrate replacing and separating device for e.g. wafers, has gripping and transfer mechanism that has gripping components for holding substrates chiseled from substrate block on carrier system, and tilting mechanism for held substrates |
DE102005016519B3 (en) * | 2005-04-08 | 2007-03-01 | Rena Sondermaschinen Gmbh | Device for individualizing separating and transporting break sensitive disc substrates arranged in a holder has movable splitter and carrier and a transporter for separated substrates |
DE102005023618B3 (en) * | 2005-05-21 | 2006-12-07 | Aci-Ecotec Gmbh & Co.Kg | Device for separating silicon wafers from a stack |
DE102005028112A1 (en) * | 2005-06-13 | 2006-12-21 | Schmid Technology Systems Gmbh | Method for positioning and maintaining the position of substrates, in particular of thin silicon wafers after wire sawing for their separation |
DE102006021647A1 (en) | 2005-11-09 | 2007-11-15 | Coenen, Wolfgang, Dipl.-Ing. | Method for separating disc-shaped substrates using adhesion forces |
US20080213079A1 (en) * | 2006-07-06 | 2008-09-04 | Richard Herter | Apparatus and Method for Separating and Transporting Substrates |
DE102006059809B4 (en) * | 2006-12-15 | 2008-08-21 | Rena Sondermaschinen Gmbh | Device and method for separating and transporting substrates |
DE502006001352D1 (en) * | 2006-12-15 | 2008-09-25 | Rena Sondermaschinen Gmbh | Device and method for separating and transporting substrates |
EP2122676B1 (en) * | 2006-12-19 | 2013-02-27 | REC Wafer Pte. Ltd. | Method and device for separation of silicon wafers |
DE102007020864A1 (en) * | 2007-05-02 | 2008-11-06 | Scolomatic Gmbh | Surface gripper unit |
DE102007021512A1 (en) | 2007-05-04 | 2008-11-13 | Rena Sondermaschinen Gmbh | Device for collecting flat objects in perpendicularly standing positioning and for fixing and conveying objects in a defined distance to each other, has two belts arranged parallel to each other |
DE502007002047D1 (en) | 2007-05-04 | 2009-12-31 | Rena Sondermaschinen Gmbh | Device and method for separating |
GB2465591B (en) * | 2008-11-21 | 2011-12-07 | Coreflow Ltd | Method and device for separating sliced wafers |
KR101066978B1 (en) * | 2009-03-16 | 2011-09-23 | 주식회사 에스에프에이 | Apparatus for transferring and separating wafer of solar battery |
KR101127655B1 (en) * | 2010-04-16 | 2012-07-16 | 금오공과대학교 산학협력단 | Water Jet Separation System for Ultra-thin Solar Cell Silicon Wafers and the method therewith |
CN101950778A (en) * | 2010-09-02 | 2011-01-19 | 董维来 | Solar silicon water wet-process automatic separating method |
DE102010045098A1 (en) | 2010-09-13 | 2012-03-15 | Rena Gmbh | Device and method for separating and transporting substrates |
CN102126616A (en) * | 2010-12-16 | 2011-07-20 | 尹青 | Traveling sucking disc assembling and disassembling bench |
JP2013004627A (en) * | 2011-06-14 | 2013-01-07 | Shinryo Corp | Wafer separation unit |
CN102633118A (en) * | 2012-04-25 | 2012-08-15 | 佛山市科利得机械有限公司 | Automatic ceramic tile sorting device |
JP5849201B2 (en) * | 2013-05-28 | 2016-01-27 | パナソニックIpマネジメント株式会社 | Uncut portion removal device |
JP6450637B2 (en) * | 2015-04-21 | 2019-01-09 | 株式会社ディスコ | Lift-off method and ultrasonic horn |
CN104986380B (en) * | 2015-05-20 | 2017-07-18 | 杭州厚达自动化***有限公司 | Hall door boxing mechanism |
JP6682907B2 (en) * | 2016-02-26 | 2020-04-15 | 三星ダイヤモンド工業株式会社 | Brittle substrate cutting method |
CN106345926B (en) * | 2016-11-01 | 2018-02-13 | 浙江大成智能装备股份有限公司 | A kind of automatic separation mechanism of aluminium flake punch forming automation loading and unloading |
CN107082277B (en) * | 2017-06-08 | 2023-10-27 | 江苏四达重工有限公司 | Cache feeding device |
KR102629528B1 (en) * | 2018-01-09 | 2024-01-25 | 도쿄엘렉트론가부시키가이샤 | Cleaning device, cleaning method, and computer storage medium |
CN109264416A (en) * | 2018-09-20 | 2019-01-25 | 上海西重所重型机械成套有限公司 | Metal plate straight sheet pile board separating device |
CN111099368B (en) * | 2020-01-13 | 2020-12-29 | 卢荣芳 | Constant transportation device for building base material transfer process |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3729206A (en) * | 1971-10-21 | 1973-04-24 | Ibm | Vacuum holding apparatus |
US4252497A (en) * | 1977-08-22 | 1981-02-24 | Heico Inc. | Article handling system |
US4420909B2 (en) * | 1981-11-10 | 1997-06-10 | Silicon Technology | Wafering system |
DE3338897A1 (en) * | 1983-10-27 | 1985-05-09 | Messwandler-Bau Gmbh, 8600 Bamberg | Laminate lifting device for forming layers of iron cores from individual laminates |
JPS6165750A (en) * | 1984-09-04 | 1986-04-04 | Osaka Titanium Seizo Kk | Take-off device of wafer sheet |
DE3609549A1 (en) * | 1986-03-21 | 1987-10-01 | Mabeg Maschinenbau Gmbh Nachf | Separating device |
JPH02139148A (en) * | 1988-11-14 | 1990-05-29 | Nippon Seiko Kk | Vacuum suction table |
JPH0851140A (en) * | 1994-08-05 | 1996-02-20 | Dowa Mining Co Ltd | Apparatus and method for preventing pick-up of two laminated thin plates |
US5950643A (en) * | 1995-09-06 | 1999-09-14 | Miyazaki; Takeshiro | Wafer processing system |
CH691169A5 (en) * | 1996-04-16 | 2001-05-15 | Hct Shaping Systems Sa | Device for storage element slices obtained by cutting a block. |
KR100471936B1 (en) * | 1996-06-04 | 2005-09-09 | 미쓰비시 마테리알 가부시키가이샤 | Wafer cleaning and peeling method and apparatus |
JPH1022238A (en) * | 1996-06-29 | 1998-01-23 | Komatsu Electron Metals Co Ltd | Air blower for semiconductor wafer |
JP3209116B2 (en) * | 1996-10-11 | 2001-09-17 | 株式会社東京精密 | Slice-based peeling device |
JP3870496B2 (en) * | 1997-08-04 | 2007-01-17 | 株式会社東京精密 | Slice-based peeling device |
JP4022672B2 (en) * | 1998-03-04 | 2007-12-19 | 株式会社東京精密 | Slice-based peeling device |
DE19900671C2 (en) * | 1999-01-11 | 2002-04-25 | Fraunhofer Ges Forschung | Method and device for separating disk-shaped substrates, in particular for wafer production |
-
1999
- 1999-10-16 DE DE19950068A patent/DE19950068B4/en not_active Expired - Fee Related
-
2000
- 2000-10-12 EP EP00972741A patent/EP1220739B1/en not_active Expired - Lifetime
- 2000-10-12 JP JP2001531562A patent/JP4731077B2/en not_active Expired - Fee Related
- 2000-10-12 WO PCT/EP2000/010036 patent/WO2001028745A1/en active IP Right Grant
- 2000-10-12 AT AT00972741T patent/ATE294056T1/en not_active IP Right Cessation
- 2000-10-12 ES ES00972741T patent/ES2240189T3/en not_active Expired - Lifetime
- 2000-10-12 AU AU11368/01A patent/AU777067B2/en not_active Ceased
- 2000-10-12 CN CNB008143714A patent/CN1160177C/en not_active Expired - Fee Related
- 2000-10-12 CA CA002388730A patent/CA2388730A1/en not_active Abandoned
- 2000-10-12 DE DE50010186T patent/DE50010186D1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP4731077B2 (en) | 2011-07-20 |
EP1220739A1 (en) | 2002-07-10 |
ES2240189T3 (en) | 2005-10-16 |
DE19950068B4 (en) | 2006-03-02 |
WO2001028745A1 (en) | 2001-04-26 |
EP1220739B1 (en) | 2005-04-27 |
JP2003512196A (en) | 2003-04-02 |
CN1160177C (en) | 2004-08-04 |
DE50010186D1 (en) | 2005-06-02 |
AU1136801A (en) | 2001-04-30 |
DE19950068A1 (en) | 2001-04-26 |
AU777067B2 (en) | 2004-09-30 |
CA2388730A1 (en) | 2001-04-26 |
CN1379708A (en) | 2002-11-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
REN | Ceased due to non-payment of the annual fee |