CN116013911A - Transparent LED display screen - Google Patents

Transparent LED display screen Download PDF

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Publication number
CN116013911A
CN116013911A CN202111234659.XA CN202111234659A CN116013911A CN 116013911 A CN116013911 A CN 116013911A CN 202111234659 A CN202111234659 A CN 202111234659A CN 116013911 A CN116013911 A CN 116013911A
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CN
China
Prior art keywords
power supply
led lamp
transparent
led
beads
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Pending
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CN202111234659.XA
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Chinese (zh)
Inventor
林谊
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Shenzhen Jinghong Technology Co ltd
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Shenzhen Jinghong Technology Co ltd
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Priority to CN202111234659.XA priority Critical patent/CN116013911A/en
Priority to PCT/CN2022/112735 priority patent/WO2023065795A1/en
Publication of CN116013911A publication Critical patent/CN116013911A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

In order to solve the problems that in the prior art, the lamp bead welding area is difficult to realize by printing on the transparent substrate and is easy to fall off, the invention provides a transparent LED display screen, which comprises the transparent substrate and LED lamp beads; a circuit pattern is arranged on the transparent substrate; the LED lamp beads are inversely adhered to the transparent substrate; the surface of the LED lamp bead, which emits light, is a front surface, and the front surface of the LED lamp bead is adhered to the transparent substrate; according to the transparent LED display screen disclosed by the invention, the LED lamp beads are fixed on the transparent substrate in a flip-chip bonding mode, then the LED lamp beads are directly or indirectly electrically connected to a power supply circuit by adopting a power jumper wire, the serial connection of the LED lamp beads is realized by adopting a signal jumper wire, and the mode of welding the LED lamp beads on a lamp bead welding area is replaced by the mode. Easy to implement, and the LED lamp bead is fixed firm, is difficult to drop.

Description

Transparent LED display screen
Technical Field
The invention relates to the field of LED displays, in particular to the field of transparent LED display screens.
Background
Transparent LED displays are increasingly being used in the marketplace and various product forms have evolved. A transparent LED display technology in which LED beads are arrayed on a transparent substrate is emerging. The prior proposal is that the transparent LED display screen as shown in fig. 1 and 2 comprises a transparent substrate 1', a printed circuit layer 3' is arranged on the transparent substrate 1', and an LED lamp bead 2' array packaged with a driving chip is arranged on the transparent substrate 1 '; then, glue is filled on the surface of the transparent substrate 1' provided with the LED lamp beads 2' to form a glue filling layer 5'; then the surface of the glue filling layer 5 'is covered with a protective cover plate 4'.
As shown in fig. 2, specifically, the printed circuit layer 3 'includes a bead bonding area 31', a power bonding pad 32', a signal bonding pad 33', and the like, wherein two signal bonding pads and two electrode bonding pads are disposed in each bead bonding area 31', the signal bonding pads are connected in series through a printed signal line, and the two electrode bonding pads with opposite polarities are respectively connected with the power bonding pad 32' through a metal grid 30 'printed on the transparent substrate 1'. Pins of the LED lamp beads 2' are welded on the signal pin bonding pad and the electrode pin bonding pad.
The method has the advantages that the metal grid 30 'for supplying power can be directly formed on the transparent substrate 1' through a printing process to serve as a power supply circuit; it is necessary to print a bead land thereon and then solder the LED bead 2' on the bead land 31' for electrical connection, however, it is difficult to form the bead land 31' on the transparent substrate 1' in terms of process, and the bead land 31' is easily detached. If the transparent substrate 1' is a PET (polyethylene terephthalate) substrate, the prior art needs to electrically connect the pins of the lamp beads 2' with the bonding pads on the bead bonding area 31', and the conventional method is to use a high temperature tin furnace or use silver paste for connection, and the high temperature is required to process the transparent substrate at a high temperature, and the high temperature can deform or even melt the PET.
Disclosure of Invention
The invention provides a transparent LED display screen, which aims to solve the problems that in the prior art, the lamp bead welding area is difficult to realize and is easy to fall off by printing on a transparent substrate.
The application discloses a transparent LED display screen, which comprises a transparent substrate and LED lamp beads; a circuit pattern is arranged on the transparent substrate; the LED lamp bead comprises a base bracket, a driving chip and a light-emitting wafer; the surface of the LED lamp bead, which emits light, is a front surface, and the front surface of the LED lamp bead is adhered to the transparent substrate;
the base bracket is provided with a chip mounting surface, the driving chip is mounted on the chip mounting surface, and the luminous wafer is mounted on the driving chip or the chip mounting surface and is controlled by the driving chip;
the chip mounting surface comprises an isolation river and binding pads mutually isolated through the isolation river, binding pins are arranged on the back surface of the base support, the binding pins are electrically connected with the binding pads, and the binding pins comprise electrode pins; the electrode pins comprise a first electrode pin and a second electrode pin which are opposite in polarity;
the circuit pattern comprises a power supply pad and a power supply line; the power supply circuit comprises a plurality of first power supply circuits and a plurality of second power supply circuits with opposite polarities; the power supply pad is connected with the first power supply line and the second power supply line;
the first electrode pin is directly or indirectly bound to the first power supply line through a power jumper, and the second electrode pin is directly or indirectly bound to the second power supply line through a power jumper;
according to the transparent LED display screen disclosed by the invention, only the power supply circuit is required to be formed on the transparent substrate, the lamp bead welding area is not required to be printed and formed as in the prior art, the LED lamp beads are fixed on the transparent substrate in a flip-chip manner by adopting a pasting manner, and then each LED lamp bead is directly or indirectly electrically connected to the power supply circuit by adopting a power jumper wire. By adopting the mode of flip-chip adhesion fixation of the LED lamp beads, electrical connection between the LED lamp beads and the transparent substrate is not required to be considered, the LED lamp beads can be realized only by using glue, the LED lamp beads are easy to implement in actual production, the LED lamp beads are fixed firmly and are not easy to fall off, the power supply of each lamp bead is realized by adopting a power jumper, and the process is easy to implement. Meanwhile, by adopting the mode, the transparency of the transparent LED display screen is greatly improved. The mode provides various choices for the material of the transparent substrate, and glass, plastic and film materials can be selected, so that the processing conditions are simple, and ideal effects are easy to realize.
Further, the binding pin further comprises an input/output pin, and the input/output pin comprises a signal input pin and a signal output pin;
the circuit pattern further includes a signal pad; the LED lamp beads are connected through signal jumper wire binding to form a lamp bead string, wherein signal input pins of the LED lamp beads in the lamp bead string are connected to the signal welding pad or signal output pins of the previous LED lamp bead through signal jumper wires; the signal output pins of the LED lamp beads are connected to the signal input pins of the following LED lamp beads through signal jumper wire binding.
Further, the first electrode pin on each LED lamp bead is connected to the first power supply line or the first electrode pin on the adjacent LED lamp bead through the power jumper wire in a binding mode; the second electrode pins on each LED lamp bead are connected to the second power supply line or the second electrode pins on the adjacent LED lamp beads through the power jumper wire in a binding mode; and each LED lamp bead can directly take electricity from the power supply circuit or take electricity from the adjacent LED lamp beads.
Further, the LED lamp bead is a CHIP type LED lamp bead, a base support in the CHIP type LED lamp bead is a circuit board, a copper foil on the front side of the circuit board is etched to form the CHIP mounting surface, a copper foil on the back side of the circuit board is etched to form the binding pin, and the binding pin is electrically connected with the CHIP mounting surface.
Further, a driving CHIP is arranged on the CHIP mounting surface of the CHIP type LED lamp bead, and the luminous wafer is mounted on the driving CHIP; the driving chip is encapsulated in a transparent sealing adhesive layer.
Further, the LED lamp beads are TOP type LED lamp beads; the TOP type LED lamp bead comprises a base bracket adopting a plastic bracket; the chip mounting surface is formed on the surface of the plastic support through a metal material belt, and binding pins extend out of the chip mounting surface and are bent towards the bottom of the plastic support.
Further, the light emitting chip is mounted on the driving chip by CSP or COC.
Further, the power supply circuit comprises a plurality of first power supply circuits and second power supply circuits which are arranged in rows or columns at intervals; a plurality of rows or columns of LED lamp beads are arranged between the first power supply circuit and the second power supply circuit; the LED lamp beads share the first power supply circuit and the second power supply circuit.
Further, the power supply circuit is a conductive grid, an ITO conductive film or a nano silver film.
Further, a glue filling layer is arranged on the transparent substrate provided with the LED lamp beads, and each LED lamp bead is packaged in the glue filling layer; the upper surface of the glue filling layer is provided with a protective cover plate.
Further, a plurality of transparent unit plates are arranged on the transparent substrate; the front faces of the LED lamp beads are stuck on the transparent unit plate; metal strips are arranged on two sides of each transparent unit plate and used as power supply lines; the LED lamp beads on the transparent unit boards are connected to the power supply circuit.
Drawings
FIG. 1 is a schematic cross-sectional view of a transparent LED display screen disclosed in the prior art;
FIG. 2 is a schematic top view of a transparent LED display screen disclosed in the prior art;
FIG. 3 is a schematic partial cross-sectional view of a transparent LED display screen employing CHIP type LED beads provided in an embodiment of the present application;
FIG. 4 is a schematic top view of a transparent LED display screen employing CHIP type LED beads provided in an embodiment of the present application;
FIG. 5a is a schematic cross-sectional view of the CHIP type LED lamp beads of FIGS. 3 and 4;
FIG. 5b is a schematic perspective view of a CHIP type LED light bead provided in the embodiments of the present application;
FIG. 5c is a schematic perspective view of the CHIP-type LED lamp bead of FIG. 5b with a transparent package added thereto;
FIG. 5d is a schematic bottom view of the CHIP type LED light beads of FIG. 5 c; FIG. 6 is a schematic top view of a further expanded transparent LED display screen using CHIP type LED beads provided in embodiments of the present application;
FIG. 7 is a schematic top view of another transparent LED display screen employing CHIP LED beads provided in embodiments of the present application;
FIG. 8 is a schematic view of a further variation of the transparent LED display screen of FIG. 7;
FIG. 9 is a schematic partial cross-sectional view of the transparent LED display screen of FIG. 8;
FIG. 10 is a further expanded transparent LED display provided in the embodiments of the present application;
FIG. 11 is a schematic cross-sectional view of a transparent display screen employing TOP LED beads in accordance with embodiments of the present application;
FIG. 12a is a partial cutaway perspective view of the TOP type LED light beads of FIG. 11;
FIG. 12b is a schematic bottom view of the TOP type LED light beads of FIG. 12 a;
fig. 12c is a schematic cross-sectional view of the TOP LED lamp beads of fig. 12 a.
The reference numerals in the background art are as follows: 1', a transparent substrate; 2', LED lamp beads; 3', a printed circuit layer; 4', a protective cover plate; 5', a glue filling layer; 31', a lamp bead land; 32', power pads; 33. a signal pad; 30', a metal mesh;
in the specific embodiments, reference numerals: 1. a transparent substrate; 2. LED lamp beads; 3. a circuit pattern; 4. a protective cover plate; 5. filling an adhesive layer; 6. a transparent unit plate; 20. a light emitting chip; 21. a driving chip; 22. a base bracket; 23. a chip mounting surface; 24. a transparent sealing adhesive layer; 231. binding the bonding pad; 232. isolating the river channel; 31. a power supply line; 31a, a first power supply line; 31b, a second power supply line; 32. a signal jumper; 33. a signal pad; 311. a power jumper; 2311. binding pins.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects solved by the invention more clear, the invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
In the description of the present invention, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships that are based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Examples
The transparent LED display screen disclosed in the present application will be specifically explained as follows, and as shown in fig. 3, the transparent LED display screen includes a transparent substrate 1 and LED lamp beads 2; a circuit pattern 3 is arranged on the transparent substrate 1; the LED lamp beads 2 are adhered to the transparent substrate 1; by affixing is meant fixing with glue, which may be various glues known to those skilled in the art, such as instant glue, epoxy adhesive, anaerobic glue, UV glue hot melt glue, pressure sensitive adhesive, etc.
A glue filling layer 5 is generally arranged on the transparent substrate 1 provided with the LED lamp beads 2, and each LED lamp bead 2 is packaged in the glue filling layer 5; the upper surface of the glue filling layer 5 is provided with a protective cover plate 4. As is well known to those skilled in the art.
As can be seen from fig. 1, the surface of the existing LED lamp bead 2' emitting light is the front surface, the existing LED lamp bead 2' is being mounted on the transparent substrate 1', i.e. the back surface of the LED lamp bead 2' is adhered to the transparent substrate 1', the front surface of the LED lamp bead 2' faces the protective cover plate 4', and the light emitted by the LED lamp bead 2' is emitted through the protective cover plate 4'.
As shown in fig. 5a, 5b, 5c, 5d, 12a, 12b, and 12c, the LED lamp bead 2 includes a base support 22, a driving chip 21, and a light emitting wafer 20; the surface of the LED lamp bead 2 from which light is emitted (the side surface of the light emitting wafer 20 is exposed) is a front surface, and the front surface of the LED lamp bead 2 is adhered to the transparent substrate 1. The LED lamp beads 2 in the embodiment are inversely adhered on the transparent substrate 1, the front faces of the LED lamp beads 2 face the transparent substrate 1, the back faces of the LED lamp beads 2 face the protection cover plate 4, and light rays emitted by the LED lamp beads 2 are emitted through the transparent substrate 1. The types of the LED lamp beads 2 generally include both CHIP type and TOP type structures. The LED lamp beads 2 shown in fig. 5a, 5b, 5c and 5d are CHIP type LED lamp beads, and fig. 12a, 12b and 12c are TOP type LED lamp beads.
Taking CHIP type LED lamp beads as an example, as shown in fig. 5b and 5c, a CHIP mounting surface 23 is formed on the base support 22, the driving CHIP 21 is mounted on the CHIP mounting surface 23, and the light emitting wafer 20 is mounted on the driving CHIP 21 (or may be that the light emitting wafer 20 is mounted on the CHIP mounting surface 23), and is controlled by the driving CHIP 21;
the chip mounting surface 23 includes an isolation channel 232 and a bonding pad 231 isolated from each other by the isolation channel 232, and the bonding pad 231 includes an electrode pad (not labeled in the figure) and an input/output pad (not labeled in the figure); the electrode pads include a first electrode pad (not labeled in the figure) and a second electrode pad (not labeled in the figure) of opposite polarities; the input-output pads include a signal input pad (not labeled in the figure) and a signal output pad (not labeled in the figure); the back of the base bracket 22 is provided with a binding pin 2311, and the binding pin 2311 is electrically connected with the binding pad 231; binding pin 2311 includes an electrode pin and an input/output pin; the electrode pins comprise a first electrode pin and a second electrode pin which are opposite in polarity; the input/output pins comprise signal input pins and signal output pins;
as shown in fig. 3 to 4, the circuit pattern 3 includes a power supply pad (not shown), a signal pad 33, and a power supply line 31; the power supply line 31 comprises a plurality of first power supply lines 31a and second power supply lines 31b with opposite polarities; the power supply pad connects the first power supply line 31a and the second power supply line 31b;
the first electrode pin is directly or indirectly bound to the first power supply line 31a through a power jumper 311, and the second electrode pin is directly or indirectly bound to the second power supply line 31b through the power jumper 311;
each LED lamp bead 2 is bound and connected through a signal jumper wire 32 to form a lamp bead string, wherein a signal input pin of each LED lamp bead 2 in the lamp bead string is connected to a signal pad 33 or a signal output pin of a previous LED lamp bead 2 through the signal jumper wire 32; the signal output pins of each LED lamp bead 2 are connected to the signal input pins of the following LED lamp bead 2 in a binding mode through signal jumpers 32. If no other LED lamp beads 2 exist behind the current LED lamp bead 2, the signal output pin is connected with the signal pad in a null or return mode.
As to the direct or indirect connection between the binding pin 2311 and the power supply line 31, as shown in fig. 3 and 4, the first electrode pin on each LED lamp bead 2 is bound and connected to the first power supply line 31a or the first electrode pin on the adjacent LED lamp bead 2 through the power jumper 311; the second electrode pin on each LED lamp bead 2 is connected to the second power supply line 31b or the second electrode pin on the adjacent LED lamp bead 2 through the power jumper 311 in a binding way; so that each LED lamp bead 2 can directly take electricity from the power supply circuit 31 or take electricity from the adjacent LED lamp beads 2.
The power jumper 311 and the signal jumper 32 in this example are binding wires or bonding wires as understood by those skilled in the art, and are only distinguishing devices, which are named respectively. The power jumper 311 and the signal jumper 32 are preferably gold wires, copper wires or alloy wires with the diameters of 15-70 μm, and the gold wires, the copper wires or the alloy wires are small in diameter and almost invisible to naked eyes, so that the blocking of the sight line is reduced and the transparency of the product is improved while ensuring that the working current of a plurality of connected LED lamp beads 2 is met.
Although the power jumper 311 and the signal jumper 32 are mutually crossed in the schematic diagram, in the actual production process, the power jumper 311 and the signal jumper 32 are wire-bonded at different heights and then fixed by glue filling, so that the situation of collapse short circuit does not occur.
The base support 22 in the CHIP type LED lamp bead is a circuit board, the copper foil on the front side of the circuit board is etched to form the CHIP mounting surface 23, that is, after the circuit board is etched, an isolation river 232 is formed at the etched place, and a binding pad 231 is formed at the unetched place; the copper foil on the back side of the circuit board is etched to form the bonding pin 2311, and the bonding pin 2311 is electrically connected with the chip mounting surface 23. The bonding pins 2311 on the back side of the circuit board are correspondingly connected (generally, the electrical connection is realized in a via connection manner) with the bonding pads 231 on the front side of the circuit board, that is, the first electrode pad is connected with the first electrode pin, the second electrode pad is connected with the second electrode pin, the signal input pad is connected with the signal input pin, and the signal output pad is connected with the signal output pin.
As a preferred embodiment, as shown in fig. 5c, the light emitting wafer 20 is mounted on the driving chip 21; the driving chip 21 is encapsulated in a transparent sealing glue layer 24. In this way, the light emitting wafer 20 and the driving chip 21 can be protected by packaging through the transparent sealing glue layer 24. Wherein the transparent sealing glue layer 24 fully covers the chip mounting surface 23.
In this example, it is preferable that the light emitting chip 20 is mounted on the driving chip 21 by a CSP (english full name: chip Scale Package, chinese full name: chip size package) method for mounting the light emitting chip 20. Or can be mounted On the driving Chip 21 by means of COC (english full name: chip On Chip, chinese full name: chip mounted On Chip). The light emitting die 20 generally includes light emitting dies 20 of three colors of red, green, and blue.
Preferably, the power supply line 31 includes a plurality of first power supply lines 31a and second power supply lines 31b arranged in rows or columns at intervals; a plurality of rows or columns of the LED lamp beads 2 are arranged between the first power supply line 31a and the second power supply line 31b; the LED lamp beads 2 share the first power supply line 31a and the second power supply line 31b. As shown in fig. 6, a first power supply line 31a, a second power supply line 31b, and a first power supply line 31a are provided at intervals; wherein, 4 rows and 4 columns of LED lamp beads 2 are arranged between the first power supply line 31a and the second power supply line 31b on the left side; the 4 rows and 4 columns of LED beads 2 share the first power supply line 31a and the second power supply line 31b. 4 rows and 4 columns of LED lamp beads 2 are also arranged between the first power supply line 31a and the second power supply line 31b on the right side; the 4 rows and 4 columns of LED beads 2 share the first power supply line 31a and the second power supply line 31b on the right side.
By adopting the mode, a plurality of columns or rows of LED lamp beads 2 share the power supply line 31 with the same polarity, and the LED lamp beads are circularly arranged, so that a large-area transparent LED display screen can be manufactured. The power supply lines 31 are shared by the LED lamp beads 2, so that the number of the power supply lines 31 can be reduced, the blocking of sight is reduced, and the transparency of the display screen is improved.
The present application is not limited to the embodiment of the power supply line 31, but is not limited to the core innovation of the present application, and an implementation manner well known to those skilled in the art may be adopted, and the number of the first power supply line 31a and the second power supply line 31b may be only one, or may be multiple, and the number of the first power supply line 31a and the second power supply line 31b may be the same, or may be different. The specific number of the LED lamp beads 2 is determined according to the power supply capacity of the power supply circuit 31 and the power consumption current requirement of the LED lamp beads 2 between the first power supply circuit 31a and the second power supply circuit 31b, and in general, the number of the LED lamp beads 2 is 3 to 8 columns, which are ideal.
The power supply line 31 may be linear, curved, or serpentine. As a preferred manner, each power supply line 31 is generally provided in a row or column manner, and the manner of implementation is not limited as long as it can supply power. For example, the metal layer etched on the transparent substrate 1 may be a metal mesh, a nano silver plating film or an ITO plating film, or a metal wire laid out in a patent filed by the applicant, a metal sheet buried in the transparent substrate 1, or the like.
Preferably, as shown in fig. 7, the power supply line 31 is preferably a conductive mesh. The conductive mesh may be a metal mesh or ITO, and dots in the figure are binding lines and binding points (electrical connection points) of the metal mesh or ITO. The sheet resistance of the metal grid or ITO is large, and the conductivity is small, so that a large area is required to meet the current demand. In this figure, conductive grids are provided on both sides of the columns of LED beads 2, and the LED beads 2 between first and second power supply lines 31a and 31b in the form of conductive grids share the above-mentioned first and second power supply lines 31a and 31b. At this time, the LED lamp beads 2 are only required to be adhered to the glass substrate.
As shown in fig. 8 and 9, in order to enhance the conductivity of the conductive mesh, the area of the conductive mesh may be expanded, and the LED beads 2 may be adhered to the conductive mesh in an insulating manner. For example, two rows of LED beads 2 on the left side in the drawing are arranged on the conductive mesh of the first power supply line 31a, and two rows of LED beads 2 on the right side in the drawing are arranged on the conductive mesh of the second power supply line 31b. Because the conductive grid material is transparent, the light-emitting barrier to the LED lamp beads is very small, and the good effect of the display picture can be ensured.
As for the design of the power supply line 31, other variants are also possible, for example, as shown in fig. 10, a plurality of transparent unit boards 6 are provided on the transparent substrate 1; the LED lamp beads 2 are arranged on the transparent unit plate 6; metal strips are arranged on two sides of each transparent unit plate 6 as power supply lines 31; the LED lamp beads 2 on each of the transparent unit boards 6 are connected to a power supply line 31. The power supply lines 31 on both sides are a first power supply line 31a and a second power supply line 31b, respectively. This way, the transparent substrate 1 has no power supply line 31 on its surface, but is embedded between two transparent unit plates 6. The transparent unit plates 6 are mutually independent glass plates, and each transparent unit plate 6 is fixed on the whole transparent substrate 1 below. The advantage of this kind of mode is that the cross-section area of metal strip is very little in the screen viewing direction, can guarantee a plurality of LED lamp pearl 2 between two power supply lines 31 that sufficient electric current supply polarity is opposite, has greatly reduced the barrier of conductive material to the sight, has promoted the transparency of screen.
As shown in fig. 11, alternatively, a TOP type LED bead may be attached to the transparent substrate 1, and as shown in fig. 12a, 12b, and 12c, a TOP type structure refers to a structure in which a PLCC (chinese full name: plastic chip carrier with leads; english full name: plastic Leaded Chip Carrier) plastic bracket is used as the base bracket 22 (english name housing, chinese also called base or bracket). The technology is known to the public and generally comprises the procedures of metal material strip punching, electroplating, PPA (polyphthalamide) injection molding, bending, five-sided three-dimensional ink jet and the like. The core is that a chip mounting surface 23 is formed on the surface of a plastic bracket through a metal material belt; and binding pins 2311 extend from the chip mounting surface 23. Binding pin 2311 in this example is no longer used for soldering, but rather is used for binding connections. It binds pins 2311 and bends towards the bottom of the plastic bracket. The binding pads 231 are metal sheets made of the same material as the binding pins 2311, the metal sheets are punched and formed, the empty places are filled by injection molding, and then the isolation river 232 is formed, the isolation river 232 is made of insulating plastic materials, the binding pins 2311 are respectively separated, and the fixing base support 22 is achieved. Specifically, the bonding pad 231 includes an electrode pad and an input-output pad.
As shown in fig. 12a, 12b, and 12c, the end of the binding pin 2311 is bent and attached to the back of the base support 22, so as to form a binding pin 2311 with a U-shaped structure as shown in the drawing.
The driving chip 21 is known, and generally, a driving circuit is integrated in the driving chip 21, and a passivation layer is provided on the driving chip 21, wherein the passivation layer is a surface insulation layer formed when the driving chip 21 is manufactured. The driving chip 21 is provided with a plurality of pins (or called terminals), and the pins on the driving chip 21 are electrically connected with the chip mounting surface 23 and the light emitting chip 20 through direct welding or bonding wires. Pins (english name: PAD) are typically provided on the passivation layer, the pins being terminals inside the chip.
According to the transparent LED display screen disclosed by the invention, only the power supply circuit is required to be formed on the transparent substrate 1, and the lamp bead welding area is not required to be printed as in the prior art, so that the manufacturing of the power supply circuit is simpler; in the case of using transparent conductive material (as in the embodiment of fig. 8), the shape of the circuit pattern is extremely simple, the resistance is greatly reduced, and the conductivity is enhanced; the LED lamp beads 2 are fixed on the transparent substrate 1 in a flip-chip manner by adopting a pasting manner, then each LED lamp bead 2 is directly or indirectly electrically connected to the power supply circuit 31 by adopting the power jumper 311, the serial connection of the LED lamp beads 2 is realized by adopting the signal jumper 32, and the manner of welding the lamp beads of the LED lamp beads 2 on a lamp bead welding area is replaced by adopting the manner. Adopt above-mentioned LED lamp pearl 2 flip-chip fixed mode of pasting, need not to consider the electric connection between LED lamp pearl 2 and the transparent substrate 1, only can realize with glue, implement easily in actual production, avoided the lamp pearl welding zone shortcoming of being difficult to the preparation on the transparent substrate, and LED lamp pearl 2 is fixed firm, be difficult to drop, adopts power jumper 311 to realize the power supply of each LED lamp pearl and adopts signal jumper 32 to realize the transmission of signal, also easy implementation in technology. By adopting the technical means, the LED lamp beads 2 can be firmly bonded at normal temperature, and binding and wire bonding are also carried out at normal temperature, so that a high-temperature environment is avoided, and a very good technical means is provided for manufacturing the flexible transparent screen with PET as a substrate. Meanwhile, by adopting the mode, the transparency of the transparent LED display screen is greatly improved. The mode provides various choices for the material of the transparent substrate 1, and glass, plastic and film materials can be selected, so that the processing conditions are simple, and ideal effects are easy to realize.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.

Claims (11)

1. The transparent LED display screen is characterized by comprising a transparent substrate and LED lamp beads; a circuit pattern is arranged on the transparent substrate; the LED lamp bead comprises a base bracket, a driving chip and a light-emitting wafer; the surface of the LED lamp bead, which emits light, is a front surface, and the front surface of the LED lamp bead is adhered to the transparent substrate;
the base bracket is provided with a chip mounting surface, the driving chip is mounted on the chip mounting surface, and the luminous wafer is mounted on the driving chip or the chip mounting surface and is controlled by the driving chip;
the chip mounting surface comprises an isolation river and binding pads mutually isolated through the isolation river, binding pins are arranged on the back surface of the base support, the binding pins are electrically connected with the binding pads, and the binding pins comprise electrode pins; the electrode pins comprise a first electrode pin and a second electrode pin which are opposite in polarity;
the circuit pattern comprises a power supply pad and a power supply line; the power supply circuit comprises a plurality of first power supply circuits and a plurality of second power supply circuits with opposite polarities; the power supply pad is connected with the first power supply line and the second power supply line;
the first electrode pin is directly or indirectly bound to the first power supply line through a power jumper, and the second electrode pin is directly or indirectly bound to the second power supply line through a power jumper.
2. The transparent LED display of claim 1, wherein the bonding pins further comprise input-output pins comprising a signal input pin and a signal output pin;
the circuit pattern further includes a signal pad; the LED lamp beads are connected through signal jumper wire binding to form a lamp bead string, wherein signal input pins of the LED lamp beads in the lamp bead string are connected to the signal welding pad or signal output pins of the previous LED lamp bead through signal jumper wires; the signal output pins of the LED lamp beads are connected to the signal input pins of the following LED lamp beads through signal jumper wire binding.
3. The transparent LED display of claim 1, wherein the first electrode pin on each LED light bead is tied to the first power supply line, or the first electrode pin on its adjacent LED light bead, by the power jumper; the second electrode pins on each LED lamp bead are connected to the second power supply line or the second electrode pins on the adjacent LED lamp beads through the power jumper wire in a binding mode; and each LED lamp bead can directly take electricity from the power supply circuit or take electricity from the adjacent LED lamp beads.
4. The transparent LED display of claim 1, wherein the LED light beads are CHIP-type LED light beads, the base support in the CHIP-type LED light beads is a circuit board, the copper foil on the front side of the circuit board is etched to form the CHIP mounting surface, the copper foil on the back side of the circuit board is etched to form the bonding pins, and the bonding pins are electrically connected with the CHIP mounting surface.
5. The transparent LED display of claim 4, wherein the CHIP mounting surface of the CHIP type LED beads is provided with a driving CHIP, and the light emitting CHIP is mounted on the driving CHIP; the driving chip is encapsulated in a transparent sealing adhesive layer.
6. The transparent LED display screen of claim 1, wherein the LED beads are TOP type LED beads; the TOP type LED lamp bead comprises a base bracket adopting a plastic bracket; the chip mounting surface is formed on the surface of the plastic support through a metal material belt, and the binding pins extend out of the chip mounting surface and are bent towards the bottom of the plastic support.
7. The transparent LED display of claim 1, wherein the light emitting die is mounted on the driver chip by CSP or COC.
8. The transparent LED display of claim 1, wherein the power supply lines comprise a plurality of the first power supply lines and the second power supply lines arranged in rows or columns at intervals; a plurality of rows or columns of LED lamp beads are arranged between the first power supply circuit and the second power supply circuit; the LED lamp beads share the first power supply circuit and the second power supply circuit.
9. The transparent LED display of claim 1, wherein the power supply lines are conductive grids or ITO conductive films or nano-silver films.
10. The transparent LED display screen of claim 1, wherein a glue layer is provided on the transparent substrate on which the LED beads are disposed, the glue layer encapsulating each of the LED beads therein; the upper surface of the glue filling layer is provided with a protective cover plate.
11. The transparent LED display screen of claim 10, wherein the transparent substrate has a plurality of transparent cell plates thereon; the front faces of the LED lamp beads are stuck on the transparent unit plate; metal strips are arranged on two sides of each transparent unit plate and used as power supply lines; the LED lamp beads on the transparent unit boards are connected to the power supply circuit.
CN202111234659.XA 2021-10-22 2021-10-22 Transparent LED display screen Pending CN116013911A (en)

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PCT/CN2022/112735 WO2023065795A1 (en) 2021-10-22 2022-08-16 Transparent led display screen

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KR101784406B1 (en) * 2015-02-25 2017-10-12 금호전기주식회사 Transparent light emitting apparatus
CN106898605B (en) * 2017-04-21 2019-06-18 武汉华尚绿能科技股份有限公司 A kind of IC implanted paster LED being exclusively used in transparent substrate
CN111933624A (en) * 2020-06-29 2020-11-13 深圳市晶泓科技有限公司 Preparation method of LED lamp bead with built-in driving IC
CN213093200U (en) * 2020-07-23 2021-04-30 泉州三安半导体科技有限公司 Light emitting package and pixel array
CN112735286A (en) * 2021-01-15 2021-04-30 深圳市晶泓科技有限公司 LED lamp bead
CN216213441U (en) * 2021-10-22 2022-04-05 深圳市晶泓科技有限公司 Transparent LED display screen

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