CN217562596U - LED transparent display screen - Google Patents

Abstract

In order to solve the problems that the LED transparent display screen in the prior art has lower reliability, high process requirement, is not friendly to the environment, is easy to cause the fracture of a power supply circuit due to thermal expansion and cold contraction, and causes low product yield and cost increase, the utility model provides an LED transparent display screen; the utility model provides a LED transparent display screen, through adopting the relay pad and realizing the mode of supplying power between the relay pad through thickening the binding line and replacing the existing power supply line; the power supply capacity of the LED transparent display screen is ensured by connecting the thickened binding lines in parallel, and the integral transparency of the LED transparent display screen is further improved. And a power supply circuit is not required to be formed on the transparent substrate, so that the problem of poor adhesion of the power supply circuit is not required to be considered, a complex chemical process is not required for treatment, the process requirement is lower, and the environment friendliness is realized. The stability of power supply capacity is guaranteed, the yield is improved, and the cost is reduced.

Description

LED transparent display screen

Technical Field

The utility model relates to a LED field especially indicates transparent LED display field.

Background

Transparent LED displays are increasingly used in the market and various product forms are developed. A LED transparent display screen technology in which LED beads are arrayed on a transparent substrate has begun to appear.

For example, as shown in fig. 1, an improved LED transparent display screen is provided in the prior art, which includes a transparent substrate 1', a printed circuit layer 3' is disposed on the transparent substrate 1', and an array of LED beads 2' encapsulating chips is mounted on the transparent substrate 1 '; then, forming a glue pouring layer 5' by pouring glue on the surface of the transparent substrate 1' on which the LED lamp beads 2' are arranged; then covering a protective cover plate 4' on the surface of the glue filling layer; as shown in fig. 2, the printed circuit layer 3 'includes bead lands 31', power pads 32', signal pads 33', and the like, each bead land 31 'is provided with two signal pin pads and two electrode pin pads, the signal pin pads are connected in series through a printed signal line, and the two electrode pin pads with opposite polarities are respectively connected to the power pad 32' through a metal mesh 30 'printed on the transparent substrate 1' for power supply. Pins of the LED lamp beads 2' are welded on the signal pin bonding pad and the electrode pin bonding pad.

This way has the advantage that the metal grid 30 'for power supply can be directly formed on the transparent substrate 1' as a power supply circuit by a printing process; however, since the thickness of the printed pattern layer 3' is generally only about 35 micrometers, and the current that can be carried by each metal wire on the formed metal grid 30' is very small, the area of the metal grid 30' has to be widened to meet the power supply requirement of the LED lamp beads 2', the space between the LED lamp beads 2' cannot be made small, and the resolution of the LED transparent display screen cannot be improved; and the metal mesh 30 'may reduce the transparency of the transparent substrate 1' to some extent.

As shown in fig. 3, there is another LED transparent display screen, in which LED lamp beads 2 'are directly connected to electrode pin pads of the lamp bead soldering area by using power lines 6' shown in the figure for power supply, and the LED lamp beads 2 'are connected in series by using signal lines 7' shown in the figure. Wherein the power supply line 6' is divided into a positive power supply line 6a ' and a negative power supply line 6b '. Two sides of each row of LED lamp beads 2' are respectively provided with a positive power circuit 6a ' and a negative power circuit 6b '. The clearance between LED lamp pearl 2' can be reduced to a certain extent to this kind of mode, but in the actual production process discovery, it is difficult to form power supply circuit on transparent substrate, especially under the transparent substrate is glass, and the adhesion is relatively weak, and the reliability is lower. The transparent substrate needs to be processed in a chemical process to form a power circuit, so that the process requirement is higher and the method is not environment-friendly. Meanwhile, due to the fact that the transparent substrate and the power circuit expand with heat and contract with cold, the power circuit is prone to being broken, the LED lamp beads lose power, the product yield is low, and the cost is increased.

SUMMERY OF THE UTILITY MODEL

For the reliability of overcoming among the prior art LED transparent display screen existence lower, the technological requirement is high, is unfriendly to the environment, leads to the circuit fracture because of expend with heat and contract with cold easily, leads to the product yield not high, problem with increased costs, the utility model provides a LED transparent display screen.

The utility model provides a LED transparent display screen, which comprises a transparent substrate and LED lamp beads arranged on the transparent substrate in an array manner; each LED lamp bead is powered through a power supply line;

the power supply circuit comprises a plurality of relay pads, and the relay pads comprise a first relay pad and a second relay pad which have opposite polarities; the first relay pads are connected in a binding mode through a plurality of thickening binding lines to form the first power supply circuit; the second relay pads are connected in a binding mode through a plurality of thickening binding lines to form a second power supply circuit;

the LED lamp beads are electrically connected to a first relay bonding pad on the first power supply circuit and a second relay bonding pad on the second power supply circuit, so that electricity can be taken from the first power supply circuit and the second power supply circuit.

The utility model provides a LED transparent display screen, through adopting the relay pad and realizing the mode of supplying power between the relay pad through thickening the binding line and replacing the existing power supply line; when the power supply capacity of the LED transparent display screen is ensured by the thickened binding line, the thickened binding line can not be seen by naked eyes, the influence on the sight is extremely small, and therefore the integral transparency of the LED transparent display screen is further improved. A power supply circuit does not need to be formed on the transparent substrate, so that the problem of poor bonding property of the power supply circuit does not need to be considered, a complex chemical process is not needed for treatment, the process requirement is lower, and the environment friendliness is higher. Because add thick binding line and be the arc when binding, possess certain deformation buffer capacity, even there is the condition of expend with heat and contract with cold in transparent substrate, can not lead to the fracture of adding thick binding line yet, guaranteed power supply capacity's stability, promote the yield, reduce cost.

Furthermore, the first relay pads on the same row or the same column are bound and connected through i thickened binding lines to form the first power supply circuit; second relay pads on the same row or the same column are connected in a binding mode through j thickened binding lines to form a second power supply line; wherein i is more than or equal to 3; j is more than or equal to 3.

Further, at least part of the LED lamp beads are directly or indirectly bound and connected to a first relay bonding pad on the first power supply circuit and a second relay bonding pad on the second power supply circuit through power supply jumpers.

Further, the LED lamp bead is of a TOP type structure or a CHIP type structure.

Furthermore, the transparent substrate is provided with circuit patterns; the circuit pattern comprises a power supply bonding pad, a signal bonding pad and lamp bead welding areas arranged in an array mode, and the LED lamp beads are welded on the lamp bead welding areas;

each lamp bead welding area is provided with a pin bonding pad corresponding to the pin of the LED lamp bead; the pin bonding pads comprise signal pin bonding pads and electrode pin bonding pads; the electrode pin bonding pads comprise a first electrode pin bonding pad and a second electrode pin bonding pad which have opposite polarities;

the signal pad is connected with the signal pin pad on the lamp bead welding area through a signal circuit so as to realize the serial connection of the LED lamp beads, so that control signals for controlling the on and off of the LED lamp beads can be input from the signal pad through the signal circuit and then are sequentially transmitted through the LED lamp beads connected in series;

a first electrode pin pad on the lamp bead welding area is directly or indirectly electrically connected to a first relay pad on the first power supply circuit; and a second electrode pin pad on the lamp bead welding area is directly or indirectly electrically connected to a second relay pad on the second power supply circuit.

Further, at least part of first electrode pin pads on the lamp bead welding areas are directly or indirectly bound and connected to the first relay pads corresponding to the lamp bead welding areas through power supply jumpers; and a second electrode pin pad on the lamp bead welding area is directly or indirectly bound and connected to the second relay pad corresponding to the lamp bead welding area through a power supply jumper.

Further, the diameter of the thickened binding line is 50-200 μm.

Further, the relay pad is a metal sheet adhered to the transparent substrate; the thickness of the metal sheet is 0.1-1mm; the area of the metal sheet is 0.25-10 square millimeters.

Further, the transparent substrate is a flexible transparent substrate.

Furthermore, the LED lamp beads are bare lamp beads without shells; the naked lamp bead without the outer shell comprises a driving chip and a light-emitting wafer; the light emitting chip is mounted on the driving chip.

Furthermore, N rows of M columns of lamp bead welding areas are arranged on the circuit pattern;

m signal pads are arranged on the circuit pattern; the M signal bonding pads and the signal pin bonding pads in the N lamp bead welding areas on the same column are sequentially connected in series through signal lines;

or N signal pads are arranged on the circuit pattern; and the N signal bonding pads are sequentially connected in series with the signal pin bonding pads in the M lamp bead welding areas on the same row through signal lines.

Further, 2M power supply pads or 2N power supply pads are arranged on the circuit pattern;

the first power supply circuit and the second power supply circuit are respectively and correspondingly arranged on two sides of the bead welding area of each row or each column;

a first electrode pin pad on the lamp bead welding area of each column or each row is bound and connected to a first relay pad on a corresponding first power supply circuit through a power supply jumper; and a second electrode pin bonding pad on the lamp bead welding area is bound and connected to a second relay bonding pad on a corresponding second power supply circuit through a power supply jumper.

Further, M +1 power supply pads or N +1 power supply pads are arranged on the circuit pattern;

the M +1 power supply bonding pads or the N +1 power supply bonding pads comprise first power supply bonding pads and second power supply bonding pads which are arranged at intervals and have opposite polarities;

the power supply circuits comprise a plurality of first power supply circuits and second power supply circuits which are arranged at intervals in rows or columns; each first power supply pad is electrically connected with the first power supply circuit, and each second power supply pad is electrically connected with the second power supply circuit;

the first power supply circuit and the second power supply circuit which are arranged in a row are arranged side by side at intervals with each row of LED lamp beads; or the first power supply circuit and the second power supply circuit which are arranged in rows are arranged side by side at intervals with the LED lamp beads in each row;

a first electrode pin bonding pad on the lamp bead welding area is bound and connected to a first relay bonding pad on a nearby first power supply circuit through a power supply jumper; and a second electrode pin bonding pad on the lamp bead welding area is bound and connected to a second relay bonding pad on a second nearby power supply circuit through a power supply jumper.

By adopting the mode, the transparency of the LED transparent display screen can be improved to a certain extent, meanwhile, each LED lamp bead can be bound to the relay bonding pad connected to the adjacent power supply line nearby, the binding connection process is simpler, and the efficiency is higher.

Furthermore, the positions of a first electrode pin pad and a second electrode pin pad on the bead welding areas in adjacent rows or adjacent columns are opposite;

the installation angles of the LED lamp beads on the lamp bead welding areas on the adjacent rows or the adjacent columns are different by 180 degrees. By adopting the mode, the first power supply line and the second power supply line can be arranged at intervals more uniformly.

Furthermore, the positions of a first electrode pin pad and a second electrode pin pad on the bead welding areas in adjacent rows or adjacent columns are opposite;

and the first lamp beads and the second lamp beads with the electrode pins arranged oppositely are respectively arranged on the lamp bead welding areas on the adjacent rows or the adjacent columns. The structure can relatively fix the positions of the light-emitting wafers in the first lamp bead and the second lamp bead which are specially designed, and the color difference of each LED lamp bead can not occur due to the change of the pins.

Further, the power supply lines include one row or one column of the first power supply lines and one row or one column of the second power supply lines;

at least part of the first electrode pin bonding pads on the lamp bead welding areas are bound and connected to first relay bonding pads on first power supply circuits through power supply jumpers, and part of the first electrode pin bonding pads on the lamp bead welding areas are bound and connected to first electrode pin bonding pads on adjacent lamp bead welding areas through power supply jumpers;

at least part of the second electrode pin pad on the lamp bead welding area is bound and connected to a second relay pad on a second power supply circuit through a power supply jumper, and part of the second electrode pin pad on the lamp bead welding area is bound and connected to a second electrode pin pad on an adjacent lamp bead welding area through the power supply jumper.

By adopting the optimized structure, the number of power supply circuits can be reduced as much as possible, the power supply jumper is increased to supply power to the LED lamp beads, and the transparency of the LED lamp beads can be further improved by the mode.

Furthermore, the signal circuit is a signal jumper wire, and the signal pin bonding pad and each LED lamp bead are bound and connected through the signal jumper wire. By adopting the mode, the signal circuit also adopts the mode of jumper wire, so that the transparency of the signal circuit can be further improved.

Furthermore, a glue filling layer is arranged on the transparent substrate on which the LED lamp beads are mounted, and the glue filling layer solidifies the LED lamp beads therein; and a protective cover plate is arranged on the upper surface of the glue filling layer.

Drawings

FIG. 1 is a schematic cross-sectional view of an LED transparent display screen provided in the prior art;

FIG. 2 is a schematic top view of a prior art LED transparent display screen;

FIG. 3 is a schematic top view of a second LED transparent display screen provided in the prior art;

fig. 4 is a schematic cross-sectional view of a first viewing angle of a first LED transparent display screen according to an embodiment of the present invention;

fig. 5 is a schematic cross-sectional view of a second viewing angle of a first LED transparent display screen according to an embodiment of the present invention;

fig. 6 is a schematic top view of a first LED transparent display screen (before LED lamp beads are mounted) provided in an embodiment of the present invention;

FIG. 7 is an enlarged schematic view at A in FIG. 6;

fig. 8 is a schematic top view of a first LED transparent display screen (after LED lamp beads are installed) provided in an embodiment of the present invention;

fig. 9 is a schematic perspective view of an LED lamp bead provided in the specific embodiment of the present invention;

fig. 10 is a schematic top view of a second LED transparent display screen (before LED lamp beads are mounted) provided in an embodiment of the present invention;

FIG. 11 is an enlarged schematic view at B of FIG. 10;

fig. 12 is a schematic top view of a second LED transparent display screen (after installation of LED lamp beads) provided in the embodiment of the present invention; fig. 13a is a schematic top view of a first lamp bead provided in an embodiment of the present invention;

fig. 13b is a schematic top view of a second lamp bead provided in an embodiment of the present invention;

fig. 14 is a schematic cross-sectional view of a third LED transparent display panel provided in an embodiment of the present invention;

fig. 15 is a schematic top view of a third LED transparent display screen provided in an embodiment of the present invention;

fig. 16 is a schematic top view of a fourth LED transparent display screen provided in an embodiment of the present invention.

Wherein, the reference numbers in the background art are as follows:

1', a transparent substrate; 2', LED lamp beads; 3', printing a circuit layer; 4', a protective cover plate; 5', filling a glue layer; 6', a power supply circuit; 7', a signal line; 6a', a positive power supply circuit; 6b', a positive power supply line;

30', a metal grid; 31', a lamp bead welding area; 32', a power supply pad; 33', signal pads;

the reference numbers in the detailed description are as follows:

1. a transparent substrate; 2. an LED lamp bead; 3. a circuit pattern; 4. a protective cover plate; 5. filling a glue layer; 2a, a first lamp bead; 2b, a second lamp bead; 20. a light emitting chip; 21. a driving chip; 22. a housing; 23. a pin; 20r, red light emitting chip; 20g, green light emitting chip; 20b, a blue light emitting wafer; 231. inputting a signal pin; 232. a signal output pin; 233. a first electrode pin; 234. a second electrode pin; 30. A lamp bead welding area; 30a, a first electrode pin pad; 30b, a second electrode pin pad; 30c, input signal pin pad; 30d, an output signal pin pad; 31. a power supply line; 31a, a first power supply line; 31b, a second power supply line; 32. a signal line; 33. a signal pad; 34. a power supply pad; 34a, a first power supply pad; 34b, a second power supply pad; 311. a power supply jumper; 312. thickening the binding line; 313. a relay pad; 313a, a first relay pad; 313b, a second relay pad; 321. and a signal jumper.

Detailed Description

In order to make the technical problem, technical solution and advantageous effects solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to further explain the present invention in detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In the description of the present invention, it is to be understood that the terms "longitudinal", "radial", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience of description and to simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

Examples

As will be understood with reference to fig. 4 to 8, the LED transparent display screen provided in this embodiment, which is the same as the prior art, also includes a transparent substrate 1 and LED lamp beads 2 arranged on the transparent substrate 1 in an array; each LED lamp bead 2 is powered through a power supply line 31;

the key point in this example lies in the design of the power supply line 31, in this example, the power supply line 31 includes several relay pads 313, and the relay pads 313 include a first relay pad 313a and a second relay pad 313b with opposite polarities; the first relay pads 313a are bound and connected through a plurality of thickened binding lines 312 to form the first power supply line 31a; the second relay pads 313b are bound and connected through a plurality of thickened binding lines 312 to form a second power supply line 31b;

the LED lamp bead 2 is electrically connected to a first relay pad 313a on the first power supply line 31a and a second relay pad 313b on the second power supply line 31b, so that electricity can be taken from the first power supply line and the second power supply line.

When the LED lamp beads 2 draw electricity from the first relay pad 313a and the second relay pad 313b, various methods known to those skilled in the art may be used, for example, as described in several patents that have been previously filed by the applicant, a circuit pattern may be formed on the transparent substrate 1 by etching, and then the LED lamp beads 2 are soldered on the circuit pattern to draw electricity. Or the power can be obtained through the jumper wire binding connection mode. The present embodiment is specifically exemplified below.

The LED lamp bead 2 may be a conventional LED lamp bead 2 known to those skilled in the art, such as a lamp bead having a common TOP-type structure or CHIP-type structure of the housing. The LED lamp also can be a bare lamp bead introduced in a patent previously applied by the applicant, wherein the bare lamp bead is not provided with a shell and only has a structure of a driving chip and a light-emitting wafer. Namely, the naked lamp bead without the outer shell comprises a driving chip and a light-emitting wafer; the light emitting chip is mounted on the driving chip.

Regular LED lamp beads 2 and bare lamp beads can also be fixed on the transparent substrate 1 in an adhesive mode, and then electricity is taken from the first relay bonding pad 313a and the second relay bonding pad 313b in a jumper binding mode. The LED lamp bead 2 can be welded on the mounting pad, and the mounting pad on the transparent substrate 1 is connected in a jumper wire binding mode.

Regarding the number of thickened binding lines 312, it is also possible to provide one thickened binding line 312 between the relay pads 313 if the power supply capability is sufficient. Preferably, the first relay pads 313a on the same row or the same column are bound and connected by i thickened binding lines 312 to form the first power supply line 31a; the second relay pads 313b on the same row or the same column are bound and connected through j thickened binding lines 312 to form the second power supply line 31b; wherein i is more than or equal to 3; j is more than or equal to 3.

The LED transparent display screen disclosed in the present invention will be further explained below by taking a conventional LED lamp bead as an example and combining with the accompanying drawings, as shown in fig. 4-8, including a transparent substrate 1 and an LED lamp bead 2; the transparent substrate 1 is provided with a circuit pattern 3; the circuit pattern 3 comprises a power supply pad 34, a signal pad 33 and a lamp bead welding area 30 which is arranged in an array and is used for installing the LED lamp beads 2;

the transparent substrate 1 with the LED lamp beads 2 is provided with a glue filling layer 5, and the glue filling layer 5 solidifies the LED lamp beads 2 therein; and a protective cover plate 4 is arranged on the upper surface of the glue filling layer 5. The above-mentioned encapsulating to form the encapsulating layer 5 and to provide the protective cover plate 4 is well known and will not be described further.

Each lamp bead welding area 30 is provided with a pin pad corresponding to the pin 23 of the LED lamp bead 2; the pin bonding pads comprise signal pin bonding pads and electrode pin bonding pads; the electrode pin pads include a first electrode pin pad 30a and a second electrode pin pad 30b having opposite polarities; the signal pin pads include an input signal pin pad 30c and an output signal pin pad 30d.

The circuit pattern 3 also comprises a plurality of power supply lines 31 and signal lines 32; the power supply pad 34 is also divided into a first power supply pad 34a and a second power supply pad 34b according to the division of the polarity; the power supply lines 31 include first power supply lines 31a and second power supply lines 31b of opposite polarities; the first power supply line 31a is connected to the first power supply pad 34a; the second power supply line 31b is connected to the second power supply pad 34b. That is, the first power supply line 31a and the first power supply pad 34a have the same polarity, and the second power supply line 31b and the second power supply pad 34b have the same polarity. If the polarities of the first power supply line 31a and the first power supply pad 34a are positive, the polarities of the second power supply line 31b and the second power supply pad 34b are negative. Conversely, the first power supply line 31a and the first power supply pad 34a have negative polarities, and the second power supply line 31b and the second power supply pad 34b have positive polarities.

The number of the first power supply line 31a and the number of the second power supply line 31b may be only one, or may be multiple, and the number of the first power supply line 31a and the number of the second power supply line 31b may be the same, or may be different. The number of the specific first power supply lines 31a and the specific second power supply lines 31b can also be determined according to the specific number of the LED lamp beads 2. The power supply wire 31 may be in the form of a straight line, a curved line, a serpentine line, or the like. As a preferred mode, each power supply line 31 is generally arranged in a row or column, and the implementation mode is not limited as long as it can provide power supply energy.

The signal pad 33 is connected in series with the signal pin pad on the lamp bead welding area 30 through the signal line 32, so that the LED lamp beads 2 are connected in series, and a control signal for controlling the on and off of each LED lamp bead 2 can be input from the signal pad 33 through the signal line 32 and then is sequentially transmitted through each LED lamp bead 2 connected in series;

in this example, specifically, the signal lines 32 are arranged between the signal pads 33 and the signal pin pads in the lamp bead welding areas 30 and between the signal pin pads in adjacent lamp bead welding areas 30 in the same row or the same column, and the signal lines 32 are used to realize the serial connection of the LED lamp beads 2, so that the control signals for controlling the on and off of each LED lamp bead 2 can be input from the signal pads 33 through the signal lines 32 and then sequentially transmitted through the serially connected LED lamp beads 2;

in this example, the signal line 32 may be provided in a publicly known manner, and the embodiment of the signal line 32 is not limited. In addition to the conventional signal line 32 implementation, the signal transmission may also be implemented in a jumper manner. For the sake of distinction, this jumper implementing the signal line 32 is referred to as a signal jumper 321, that is, the signal jumper 321 is used to implement the binding connection between the signal pin pad and each LED lamp bead 2. By adopting the mode, the signal line 32 also adopts a jumper wire mode, so that the transparency of the signal line can be further improved.

The power supply line 31 comprises a plurality of relay pads 313 corresponding to the lamp bead welding areas 30, and each relay pad 313 comprises a first relay pad 313a and a second relay pad 313b with opposite polarities; wherein, the first relay pads 313a on the same row or column are bound and connected through i thickened binding lines 312, and are electrically connected to the first power supply pads 34a to form first power supply lines 31a; the second relay pads 313b on the same row or the same column are connected in a binding manner through j thickened binding lines 312 and are electrically connected to the second power supply pads 34b to form second power supply lines 31a; wherein i is more than or equal to 3; j is more than or equal to 3; wherein i and j may be the same or different.

The relay pads 313 and the power pads 34 may be electrically connected by a printed circuit, or may be connected by the thickened bonding wires 312. In this example, the first power supply pad 34a and the first relay pad 313a are also electrically connected to each other by i thickening bonding lines 312, and the second power supply pad 34b and the second relay pad 313b are also electrically connected to each other by j thickening bonding lines 312.

A first electrode pin pad 30a on the lamp bead soldering zone 30 is directly or indirectly electrically connected to a first relay pad 313a on the first power supply line 31a; the second electrode pin pad 30b on the lamp bead land 30 is electrically connected to the second relay pad 313b on the second power supply line 31b directly or indirectly. The electric connection described here is electrically connected to the relay pad 313 as a final result, and the electric power is taken from the relay pad 313. The direct electrical connection means is directly electrically connected to the relay pad 313 through a line, and the indirect electrical connection means is not necessarily directly electrically connected to the relay pad 313 but is connected to electrode pin pads of the same polarity on other bead lands 30 nearby, so that power can be obtained.

The manner of electrical connection can be varied. The relay pads 313 may be connected to the lamp bead lands 30 by etched lines, or may be electrically connected by way of power supply jumpers 311. Preferably, at least part of the first electrode pin pads 30a on the lamp bead lands 30 are directly or indirectly bound and connected to the first relay pads 313a corresponding to the lamp bead lands 30 through power supply jumpers 311; and the second electrode pin pad 30b on the lamp bead welding area 30 is directly or indirectly bound and connected to the second relay pad 313b corresponding to the lamp bead welding area 30 through a power supply jumper 311.

Preferably, the relay pad 313 is a metal sheet adhered to the transparent substrate 1; the thickness of the metal sheet is 0.1-1mm; the area of the metal sheet is 0.25-10 square millimeters. The metal sheet can be a copper sheet, a nickel sheet or an aluminum sheet, or a metal sheet made of other alloy materials.

The transparent substrate 1 may be a transparent glass substrate 1, or may be a flexible transparent substrate, and the flexible transparent substrate may be a transparent substrate made of a transparent material such as PC (Polycarbonate, chinese name), PET (Polyethylene terephthalate, chinese name) PMMA (polymethyl methacrylate, chinese name), and the like. The effect that this application scheme was used on flexible transparent substrate is better.

For the sake of distinction, this jumper implementing the signal line 32 is referred to as a signal jumper 321, that is, the signal jumper 321 is used to implement binding connection between the signal pin pad and each LED lamp bead 2. By adopting the mode, the signal line 32 also adopts a jumper wire mode, so that the transparency of the signal line can be further improved.

The signal jumper 321, the power supply jumper 311 and the thickened binding line 312 are both binding lines or jumpers in nature, but have different parameters, and therefore have different diameters. The diameters of the power supply jumper 311 and the signal jumper 321 are typically relatively small, typically between 17.5-50 μm. While the diameter of the thickened binding line 312 in this application is preferably 50-200 μm. Regarding the mode of adopting the jumper wire to realize the binding connection, the mode of adopting the jumper wire to bind the connection in the LED lamp bead 2 can be used for reference, and the technical personnel in the field do not need to further pay creative labor. The jumper wires, which may also be referred to as bonding wires or binding wires, typically include gold wires, copper wires, palladium-plated copper wires, alloy wires, and the like.

As shown in fig. 4-8, the circuit pattern 3 is provided with N rows by M columns of bead lands 30; in this example, N =4 and m =4 are assumed. Certainly, the application is not limited to the regular arrangement mode of the LED lamp beads 2, and the LED lamp beads can also be an irregular LED transparent display screen.

M signal pads 33 are arranged on the circuit pattern 3; the M signal pads 33 and the signal pin pads in the N lamp bead welding areas 30 on the same column are sequentially connected in series through signal lines 32;

alternatively, N signal pads 33 are arranged on the circuit pattern 3; the N signal pads 33 are connected in series with the signal pin pads in the M lamp bead welding areas 30 on the same row in sequence through signal lines 32.

The signal pad 33 is independently applied to each row or each column, but the signal pad 33 can also be applied to a plurality of rows or a plurality of columns, and the LED beads 2 on the rows or the columns can be connected in a serpentine manner.

As shown in fig. 4 to 8, as an embodiment, 2M power supply pads (or 2N power supply pads) are arranged on the circuit pattern; in this example, the power supply line 31 includes 4 rows of the first power supply line 31a, and 4 rows of the second power supply line 31b as an example;

the first power supply line 31a and the second power supply line 31b are respectively and correspondingly arranged on two sides of the lamp bead welding area 30 in each column (or each row);

the first electrode pin pad 30a on each column (or each row) of the lamp bead welding area 30 is bound and connected to the corresponding first relay pad 313a on the first power supply line 31a through the power supply jumper 311; and the second electrode pin pad 30b on the lamp bead welding area 30 is bound and connected to the corresponding second relay pad 313b on the second power supply line 31b through the power supply jumper 311.

The LED lamp bead 2 is shown in fig. 9, and the LED lamp bead 2 generally includes a housing 22, a driving chip 21, and a light emitting wafer 20; wherein the light emitting chip 20 includes a first light emitting chip, a second light emitting chip, and a third light emitting chip;

a chip mounting surface is formed on the shell 22, and pins 23 are led out from the chip mounting surface; the driving chip 21 is mounted on the housing 22; the first light emitting chip, the second light emitting chip and the third light emitting chip are mounted on the driving chip 21; the first electrode pin 233 and the second electrode pin 234 are welded to an electrode pin pad on the lamp bead welding area 30; the input signal pin 231 and the output signal pin 232 are respectively welded to signal pin pads on the lamp bead welding area 30.

For example, in this example, the first light emitting chip is a red light emitting chip 20r, the second light emitting chip is a green light emitting chip 20g, and the third light emitting chip is a blue light emitting chip 20b. As shown in the drawing, a red light emitting wafer 20r, a green light emitting wafer 20g, and a blue light emitting wafer 20b are sequentially mounted on the driving chip 21. At this time, if the LED lamp beads 2 are rotated by 180 degrees, the sequence of the light emitting chips in the LED lamp beads 2 is changed to: a blue light emitting wafer 20b, a green light emitting wafer 20g, and a red light emitting wafer 20r. This way there will be a slight color difference.

The LED lamp bead 2 in this example is of a TOP structure, which is a structure that a PLCC (Plastic Leaded Chip Carrier, in the Chinese generic name) Plastic support is used as a shell (housing, in the Chinese generic name) 22, and pins 23 of the PLCC Plastic support packaging structure are bent inwards at the bottom. The process is known to the public and generally comprises the working procedures of punching, electroplating, PPA (polyphthalamide) injection molding, bending, five-sided three-dimensional ink jet and the like. The core of the method is that a chip mounting surface (not marked in the figure) is formed on the surface of a plastic support through a metal material belt; and the chip mounting surface extends to form a pin 23, the bottom of the pin is bent inwards and then the pin is attached to the bottom of the plastic support, so that the subsequent surface mounting welding can be carried out.

In this example, the chip mounting surface is used for mounting the driving chip 21 and the light emitting chip; the device comprises an isolation riverway and pads which are isolated from each other through the isolation riverway, wherein pins 23 are led out of the pads; in this example, the bonding pad is actually a metal sheet made of the same material as the pins 23, the metal sheet is formed by stamping, and the vacant places are filled by injection molding, so that the isolation river channel is formed, and the isolation river channel is actually an insulating plastic material, so that the pins 23 are respectively isolated, and the function of fixing the shell 22 is achieved. Specifically, the pads include electrode pads and input/output pads; the electrode pads comprise cathode pads and anode pads; the input and output pads comprise input pads and output pads; the pins 23 comprise electrode pins and signal pins, wherein the electrode pins comprise a positive electrode pin and a negative electrode pin; the signal pins comprise signal input pins and signal output pins; a positive pin is led out of the cathode bonding pad; and a negative pin is led out of the anode bonding pad. The input pad is led out with a signal input pin, and the output pad is led out with a signal output pin. The electrode pins are welded to the electrode pin pads, and the signal pins are welded to the signal pin pads, so that the LED lamp beads 2 are welded to the lamp bead welding areas 30.

The driving chip 21 is well known, and generally, the driving chip 21 has a driving circuit integrated therein, and a passivation layer is disposed on the driving chip 21, wherein the passivation layer is a surface insulating layer formed when the driving chip 21 is manufactured. The driving chip 21 is provided with a plurality of pins (or called terminals), and the pins on the driving chip 21 are electrically connected with the chip mounting surface and the light-emitting wafer through direct welding or bonding wires. Pins (english name: PAD) are generally provided on the passivation layer, which are terminals inside the chip.

The TOP package structure in this embodiment may be replaced with a CHIP package structure, in which the housing 22 is formed by a circuit board (PCB), and the copper foil on the front surface of the circuit board is etched to form a CHIP mounting surface, i.e., after the circuit board is etched, the etched portion forms an isolation channel, and the unetched portion forms a bonding pad. A pin 23 is formed on the back surface; the leads 23 are electrically connected to the chip mounting surface (i.e., pads thereon) through conductive holes. The circuit board generally uses an insulating material such as glass epoxy or polyimide as a substrate, and conductive patterns, printed wiring, and the like are formed on the surface and underside of the circuit board. CHIP type package structures are well known and will not be described in detail.

Fig. 6 is a schematic diagram illustrating the LED lamp bead 2 mounted on the bead soldering zone 30. When the power supply jumper 311 is bound and connected, the power supply jumper 311 can be bound firstly, and then the LED lamp beads 2 are fixedly installed. As an optimal mode, after the LED lamp bead 2 is installed first, the power jumper 311 is better bonded. When the power supply jumper 311 performs the binding wire bonding, the binding point is on the power supply line 31. Meanwhile, the binding points on the electrode pin bonding pad cannot be overlapped with the projection of the LED lamp beads 2, the binding foot falling points are exposed out of the electrode pin bonding pad, and the machine can bind and weld in an area with the side length of 0.1-0.5 mm.

As a preferable mode, the power supply wire 31 may be arranged in consideration of the interval setting. For example, a plurality of columns or rows of bead welding areas 30 (i.e., a plurality of columns or rows of LED beads 2) share one power supply line 31. It is specific according to the number of LED lamp pearl 2 that power supply line 31 can drive and decide.

As a preferable mode, as shown in fig. 10 to 12, M +1 power supply pads or N +1 power supply pads 34 are arranged on the circuit pattern 3; in this example, M =4, and 5 columns of power supply pads 34 are arranged in total.

The M +1 power supply pads 34 or the N +1 power supply pads include first power supply pads 34a and second power supply pads 34b arranged at intervals and having opposite polarities; in this example, 3 first power supply pads 34a and two second power supply pads 34b are provided.

The power supply lines 31 include a plurality of the first power supply lines 31a (e.g., 3 columns) and the second power supply lines 31b (e.g., 2 columns) arranged at column intervals; each first power supply pad 34a is electrically connected to the first power supply line 31a, and each second power supply pad 34b is electrically connected to the second power supply line 31b;

the first power supply lines 31a and the second power supply lines 31b which are arranged in rows are arranged side by side with the LED lamp beads 2 in each row at intervals; (the first power supply line 31a and the second power supply line 31b which can also be arranged in rows are arranged side by side with the LED lamp beads 2 in each row at intervals).

A first electrode pin pad on the lamp bead welding area 30 is bound and connected to a first relay pad 313a on a nearby first power supply line 31a through a power supply jumper 311; and a second electrode pin pad on the lamp bead welding area 30 is bound and connected to a second relay pad 313b on a nearby second power supply line 31b through a power supply jumper 311.

By adopting the mode, the transparency of the LED transparent display screen can be improved to a certain extent, meanwhile, each LED lamp bead 2 can be bound and connected to the adjacent power supply line 31 nearby, the binding and connecting process is simpler, and the efficiency is higher. Taking an LED transparent display screen with a pixel pitch of 10mm as an example, if the line width of the power supply line 31 is 1mm, if the original two power supply lines 31 (as shown in fig. 3) with opposite polarities of the LED beads 2 in one row are reduced to one power supply line 31, the transparency will be improved by 1/10, i.e. 10%, if the pixel pitch is smaller, e.g. 5mm, the transparency will be improved by 1/5, i.e. 20%, and the effect is very obvious.

For the above manner of arranging the power supply lines 31 at intervals, in order to make the thread as short as possible, it is preferable that the first electrode pin pad 30a and the second electrode pin pad 30b on the bead lands 30 on adjacent columns are arranged in opposite positions; and when the same LED lamp pearl 2 is being installed, need to differ 180 with the 2 installation angle of LED lamp pearl on the lamp pearl soldering zone 30 on the adjacent row. Namely, each LED lamp bead 2 is installed by rotating 180 degrees. In this way, the first power supply line 31a and the second power supply line 31b can be arranged at intervals more evenly. However, this method also has a slight disadvantage.

The applicant thinks of a way to solve the color difference of the LED lamp beads 2, and the first electrode pin pad 30a and the second electrode pin pad 30b on the bead welding areas 30 in adjacent rows or adjacent columns are opposite in position; meanwhile, the first lamp beads 2a and the second lamp beads 2b with the electrode pins arranged oppositely are respectively arranged on the lamp bead welding areas 30 on the adjacent rows or the adjacent columns. As shown in fig. 13a and fig. 13b, two LED lamp beads 2 are provided, and the difference between the two LED lamp beads 2 is that the electrode pins are oppositely arranged, but the positions of the first light emitting wafer, the second light emitting wafer and the third light emitting wafer thereon are not changed. As shown in fig. 13a, an input signal pin 231 and an output signal pin 232 are arranged above and below the paper surface, a first electrode pin 233 is arranged on the left side, and a second electrode pin 234 is arranged on the right side; the red light emitting chip 20r, the green light emitting chip 20g and the blue light emitting chip 20b are sequentially arranged from top to bottom. As shown in fig. 13b, the input signal pin 231 and the output signal pin 232 are disposed up and down on the paper, the second electrode pin 234 is disposed on the left side, and the first electrode pin 233 is disposed on the right side; the red light emitting chip 20r, the green light emitting chip 20g and the blue light emitting chip 20b are sequentially arranged from top to bottom. The structure can relatively fix the positions of the luminescent wafers in the first lamp bead 2a and the second lamp bead 2b which are specially designed, and the color difference of each LED lamp bead 2 can not occur due to the change of the pins.

As shown in fig. 14 and 15, the power supply line 31 preferably includes one row or one column of the first power supply line 31a and one row or one column of the second power supply line 31b;

part of the first electrode pin pads 30a on the lamp bead lands 30 are connected to the first relay pads 313a on the first power supply lines 31a in a binding manner through power supply jumpers 311, and part of the first electrode pin pads 30a on the lamp bead lands 30 are connected to the first electrode pin pads 30a on the adjacent lamp bead lands 30 in a binding manner through the power supply jumpers 311; for example, the first electrode pin pad 30a on the 1 st column in the 4 columns of lamp bead lands 30 shown in the figure is bound and connected to the first relay pad 313a on the first power supply line 31a through the power supply jumper 311, and the rest 2 nd to 4 th columns of lamp bead lands 30 are bound and connected with the first electrode pin pad 30a on the previous column of lamp bead lands 30 through the power supply jumper 311.

At least part of the second electrode pin pads 30b on the lamp bead lands 30 are bound and connected to the second relay pads 313b on the second power supply lines 31b through power supply jumpers 311, and part of the second electrode pin pads 30b on the lamp bead lands 30 are bound and connected to the second electrode pin pads 30b on the adjacent lamp bead lands 30 through power supply jumpers 311. For example, the second electrode pin pad 30b on the 4 th column in the 4 th column of the 4 columns of lamp bead lands 30 shown in the figure is bound and connected to the second relay pad 313b on the second power supply line 31b through the power supply jumper 311, and the rest 1 st to 3 rd columns of lamp bead lands 30 are bound and connected with the second electrode pin pad 30b on the next column of lamp bead lands 30 through the power supply jumper 311.

By adopting the optimized structure, the LED lamp beads 2 in a plurality of rows or a plurality of columns can share the power supply line 31, the number of the power supply line 31 can be reduced as much as possible, the power supply jumper 311 is added to supply power to the LED lamp beads 2, and the transparency of the LED lamp beads can be further improved by the mode.

As shown in the enlarged views of fig. 7 and 11, a specific connection method of the signal line 32 is described as follows, in which the input signal pin pad 30c of the first lamp bead land 30 is connected to the signal pad 33 through the signal line 32; an input signal pin pad 30c on a subsequent lamp bead soldering zone 30 of the adjacent lamp bead soldering zones 30 connected in series is connected with an output signal pin pad 30d on a previous lamp bead soldering zone 30.

As shown in fig. 16, as a preferable mode, the above process is repeated on the basis of fig. 15, and a plurality of rows of LED beads 2 share the power supply line 31 with the same polarity, and thus, the LED transparent display screen with a large area can be manufactured by the circular arrangement.

The LED transparent display screen provided by the embodiment replaces the existing power supply line 31 by adopting the relay pads 313 and realizing power supply between the relay pads 313 through thickening the binding line 312; while the power supply capacity of the LED transparent display screen is ensured by the thickened binding lines 312, the thickened binding lines 312 can not be seen by naked eyes, the influence on the sight is extremely small, and therefore the integral transparency of the LED transparent display screen is further improved. And a power supply circuit is not required to be formed on the transparent substrate, so that the problem of poor adhesion of the power supply circuit is not required to be considered, a complex chemical process is not required for treatment, the process requirement is lower, and the environment friendliness is realized. Because it is the arc to add thick binding line 312 when binding, possesses certain deformation buffer capacity, even there is the condition of expend with heat and contract with cold in the transparent substrate, can not lead to adding the fracture of thick binding line 312 yet, guaranteed power supply capacity's stability, promote the yield, reduce cost.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims (10)

1. An LED transparent display screen comprises a transparent substrate and LED lamp beads arranged on the transparent substrate in an array manner; each LED lamp bead is powered through a power supply line;

the power supply circuit is characterized by comprising a plurality of relay pads, wherein each relay pad comprises a first relay pad and a second relay pad with opposite polarities; the first relay pads are connected in a binding mode through a plurality of thickening binding lines to form a first power supply line; the second relay pads are connected in a binding mode through a plurality of thickening binding lines to form a second power supply circuit;

the LED lamp beads are electrically connected to a first relay bonding pad on the first power supply circuit and a second relay bonding pad on the second power supply circuit, so that electricity can be taken from the first power supply circuit and the second power supply circuit.

2. The LED transparent display screen of claim 1, wherein the first relay pads on the same row or column are bonded and connected by i thickened bonding lines to form the first power supply circuit; the second relay pads on the same row or the same column are connected in a binding mode through j thickening binding lines to form a second power supply line; wherein i is more than or equal to 3; j is more than or equal to 3.

3. The LED transparent display screen of claim 2, wherein at least part of the LED lamp beads are directly or indirectly bound and connected to a first relay pad on the first power supply circuit and a second relay pad on the second power supply circuit through power supply jumpers.

4. The LED transparent display screen of claim 3, wherein the LED lamp beads are of TOP type structure or CHIP type structure.

5. The LED transparent display screen of claim 4, wherein the transparent substrate is provided with a circuit pattern; the circuit pattern comprises a power supply bonding pad, a signal bonding pad and lamp bead welding areas arranged in an array mode, and the LED lamp beads are welded on the lamp bead welding areas;

each lamp bead welding area is provided with a pin bonding pad corresponding to a pin of the LED lamp bead; the pin bonding pads comprise signal pin bonding pads and electrode pin bonding pads; the electrode pin bonding pads comprise a first electrode pin bonding pad and a second electrode pin bonding pad which have opposite polarities;

the signal pad is connected with the signal pin pad on the lamp bead welding area through a signal circuit so as to realize the serial connection of the LED lamp beads, so that control signals for controlling the on and off of the LED lamp beads can be input from the signal pad through the signal circuit and then are sequentially transmitted through the LED lamp beads connected in series;

a first electrode pin pad on the lamp bead welding area is directly or indirectly electrically connected to a first relay pad on the first power supply circuit; and a second electrode pin pad on the lamp bead welding area is directly or indirectly electrically connected to a second relay pad on the second power supply circuit.

6. The LED transparent display screen of claim 5, wherein at least part of the first electrode pin pads on the lamp bead lands are directly or indirectly bound and connected to the first relay pads corresponding to the lamp bead lands through the power supply jumpers; and a second electrode pin pad on the lamp bead welding area is directly or indirectly bound and connected to the second relay pad corresponding to the lamp bead welding area through the power supply jumper.

7. The LED transparent display screen as claimed in claim 5, wherein the diameter of the thickened binding line is 50-200 μm.

8. The LED transparent display screen of claim 5, wherein the relay pads are metal sheets glued on the transparent substrate; the thickness of the metal sheet is 0.1-1mm; the area of the metal sheet is 0.25-10 square millimeters.

9. The LED transparent display screen of claim 1, wherein the transparent substrate is a flexible transparent substrate.

10. The LED transparent display screen of claim 3, wherein the LED lamp beads are bare lamp beads without an outer shell; the naked lamp bead without the outer shell comprises a driving chip and a light-emitting wafer; the light emitting chip is mounted on the driving chip.

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