CN207587722U - A kind of LED display of SMT all-colour LEDs module and its composition - Google Patents
A kind of LED display of SMT all-colour LEDs module and its composition Download PDFInfo
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- CN207587722U CN207587722U CN201721744027.7U CN201721744027U CN207587722U CN 207587722 U CN207587722 U CN 207587722U CN 201721744027 U CN201721744027 U CN 201721744027U CN 207587722 U CN207587722 U CN 207587722U
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Abstract
The utility model discloses a kind of SMT all-colour LEDs module and its LED displays of composition, belong to technical field of semiconductor encapsulation.All-colour LED module includes the all-colour LED units several again for being arranged on bilayer or multilayer PCB substrate 4, which includes red, green, blue LED chip；Substrate is equipped with several via holes, substrate front side is equipped with 3 Bei Ji islands of front pad and all-colour LED unit number, Ji Dao upper surfaces are respectively and fixedly connected with through bonding line the red, green, blue LED chip that connection is bonded with front pad, all-colour LED unit, insulating cement, conductive silver glue and bonding line outer cladding plastic-sealed body on substrate；Substrate back is equipped with backside pads with front pad relative position, backside pads are electrically connected with outer member, quantity ＜ 4 × all-colour LED unit numbers of front pad and backside pads, adjacent all-colour LED units shared partial elevational pad and backside pads.The utility model realizes the highly integrated of LED packagings, improves the SMT efficiency of LED, reduces assembly cost.
Description
Technical field
The utility model belongs to technical field of semiconductor encapsulation, and in particular to a kind of SMT all-colour LEDs module and its composition
The LED display of the SMT all-colour LEDs module and its composition of LED display more particularly to a kind of achievable high-density packages.
Background technology
With the high-resolution development trend of LED display, the all-colour LED packaging requirement for forming its pixel is lighter
Thinning, it is highly integrated, can be achieved High Density Packaging.In addition, in the commodity environment of current low priceization, it is desirable that the encapsulation of LED with
Assembly cost is cheaper.
At present, most all-colour LED packagings only includes one group of red, green, blue（R、G、B）The LED core of three single pixels
Piece, this packaged type require single led packaging that must include at least four pads with external connection, LED are caused to show
Pad density is excessively high in display screen so that the manufacture difficulty of LED support or substrate is promoted, and packaging cost increases.In addition, contain one group
Single product size of red, green, blue LED chip is small, and SMT processing procedures difficulty is caused to be promoted, and loss increase, yields declines, and increases
The assembly cost of LED display.
Utility model content
The purpose of this utility model is for above-mentioned technical problem, and it is full-color to provide a kind of SMT of achievable high-density packages
The LED display that LED module and high-density packages SMT all-colour LEDs module are formed.
In order to achieve the above objectives, the utility model uses following technical scheme：A kind of SMT all-colour LEDs module, including substrate
With the all-colour LED units several again for being disposed on the substrate 4, which includes a feux rouges being arranged in rows successively
LED chip, a green LED chip and a blue-light LED chip；Wherein, substrate be bilayer or multilayer PCB substrate, the substrate
Several via holes are equipped with, substrate front side is equipped with 3 Bei Ji islands of front pad and all-colour LED unit number, and Ji Dao upper surfaces lead to
The affixed green LED chip of insulating cement and blue-light LED chip are crossed, red LED chip, red-light LED core are electrically connected by conductive silver glue
Piece, green LED chip and blue-light LED chip are bonded connection with front pad by bonding line, all-colour LED unit on substrate,
Insulating cement, conductive silver glue and bonding line are coated with plastic-sealed body；Substrate back is equipped with the back side with front pad relative position
Pad, backside pads are electrically connected with outer member, quantity ＜ 4 × all-colour LED unit numbers of front pad and backside pads, phase
Adjacent all-colour LED units shared partial elevational pad and backside pads.
Above-mentioned every 4 all-colour LED units are distributed in matrix pattern, and pad shares rate highest at this time, and it is full-color to be advantageously implemented SMT
The High Density Packaging of LED module.
Grid is equipped between two neighboring all-colour LED unit, for each group all-colour LED unit to be isolated, avoids phase
The light of adjacent two groups of all-colour LED units interferes with each other.
The preferred gold thread of bonding line, silver alloy wire, copper wire, plating palladium copper wire or aluminum steel metal wire, with high conductivity and well
Antifatigue mechanical property.
Insulating cement is made of epoxy systems or organosilicon systems resin material, has high adhesiveness and good heat transfer energy
Power, conductive silver glue are made of silver metal particles and epoxide resin material, have high conductivity, high adhesiveness and good heat transfer
Ability, while adjusted by being formulated, after the completion of upper core can in 30min rapid curing.
The preferred epoxy systems of plastic-sealed body or organosilicon systems resin material have high light transmittance and high air-tightness.
The LED display that the utility model is made of above-specified high density packaging SMT all-colour LED module, it is full-color by several SMT
LED module array arrangement is formed.
This practicality has the advantages that relative to the prior art：
1st, multiple all-colour LED unit sets are packaged together by the utility model, pass through adjacent all-colour LED units shared portion
Divide the mode of pad, realize LED packagings highly integrated, provide smaller pixel spacing installation requirements, while cause LED
Number of pads reduce, SMT efficiency is substantially improved, and assembly cost reduces.
2nd, the outer pin pad of the utility model encapsulation module, that is, backside pads are located at plastic-sealed body bottom, occupy volume
Small, all-colour LED module can realize lightening, High Density Packaging.
3rd, bonding pad area and spacing increase so that the SMT difficulty of LED chip reduces, so as to reduce LED display
Assembly cost.
Description of the drawings
Fig. 1 is the front view of LED module being made of 4 groups of all-colour LED units；
Fig. 2 is the rearview of Fig. 1；
Reference numeral：1st, substrate；2nd, via hole；3rd, Ji Dao；4th, conductive silver glue；5th, insulating cement；6th, red LED chip；7、
Green LED chip；8th, blue-light LED chip；9th, bonding line；10th, plastic-sealed body；11st, grid；12nd, backside pads；13rd, face bonding
Disk.
Specific embodiment
The utility model is described in further detail with reference to the accompanying drawings and detailed description.
By taking the LED module of 4 all-colour LED unit compositions as an example, as shown in Figs. 1-2, a kind of SMT all-colour LEDs module, including
The 4 all-colour LED units of substrate 1 and setting on substrate 1,4 all-colour LED units are distributed in matrix pattern, two neighboring complete
Grid 11 is equipped between color LED unit, which includes the red LED chip 6, one being arranged in rows successively
Green LED chip 7 and a blue-light LED chip 8；Wherein, substrate 1 is double-deck PCB substrate, which is equipped with several conductings
Hole 2,1 front of substrate are equipped with 13 and 12 Ge Ji islands 3 of front pad, and 3 upper surface of base island passes through 5 affixed green light LED core of insulating cement
Piece 7 and blue-light LED chip 8 are electrically connected red LED chip 6, red LED chip 6,7 and of green LED chip by conductive silver glue 4
Blue-light LED chip 8 is bonded connection with front pad 13 by bonding line 9, all-colour LED unit on substrate 1, insulating cement 5, conductive
Elargol 4 and bonding line 9 are coated with plastic-sealed body 10；1 back side of substrate is equipped with backside pads with 13 relative position of front pad
12, backside pads 12 are electrically connected with outer member, adjacent all-colour LED units shared partial elevational pad 13 and backside pads 12.
LED display is may make up after above-mentioned several SMT all-colour LEDs module array arrangements.
The manufacturing method of the LED module of 4 all-colour LED units of the utility model composition is：Face passes sequentially through on substrate 1
Mechanical punching or laser opening, electroless copper plating, Electrocoppering method form multiple shared via holes 2；Then on substrate 1 successively
3,12,12 Ge Ji islands front pad 13 and 8 backside pads 12 are formed with the method for metal plating by etching, by green light LED
Chip 7 and blue-light LED chip 8 be utilized respectively insulating cement 5 by dispensing, dip in glue, the method for silk-screen printing is fixed on base island 3,
And by red LED chip 6 again by dispensing, dip in glue, the method for silk-screen printing is also secured on base island 3；Pass through ultrasonic bond
Method, using bonding line 9 by the metal electrode and face bonding of red LED chip 6, green LED chip 7 and blue-light LED chip 8
Disk 13 is bonded, and realizes electrical connection；Red LED chip 6, green light are sealed using plastic-sealed body 10 finally by the method for compression molding
LED chip 7, blue-light LED chip 8, conductive silver glue 4, insulating cement 5 and bonding line 9, and be molded by mold molding or plastic-sealed body 10
The mode being cut by laser after curing forms grid 11.
Claims (4)
1. a kind of SMT all-colour LEDs module, including substrate（1）Be arranged on substrate（1）On all-colour LED unit, it is described full-color
LED unit includes a red LED chip being arranged in rows successively（6）, a green LED chip（7）With a blue-ray LED core
Piece（8）, it is characterised in that：The SMT all-colour LEDs module includes 4 all-colour LED units several again；The substrate（1）For bilayer
Or multi-layer PCB substrate, the substrate（1）It is equipped with several via holes（2）, substrate（1）Front is equipped with front pad（13）It is and complete
The color several 3 Bei Ji islands of LED unit（3）, Ji Dao（3）Upper surface passes through insulating cement（5）Affixed green LED chip（7）And blue-ray LED
Chip（8）, and pass through conductive silver glue（4）It is electrically connected red LED chip（6）；The red LED chip（6）, green LED chip
（7）And blue-light LED chip（8）Pass through bonding line（9）With front pad（13）Bonding connection, substrate（1）Upper all-colour LED list
Member, insulating cement（5）, conductive silver glue（4）And bonding line（9）It is coated with plastic-sealed body（10）；The substrate（1）The back side with just
Face pad（13）Relative position is equipped with backside pads（12）, backside pads（12）It is electrically connected with outer member, the face bonding
Disk（13）With backside pads（12）Quantity ＜ 4 × all-colour LED unit numbers, the weldering of adjacent all-colour LED units shared partial elevational
Disk（13）With backside pads（12）.
2. a kind of SMT all-colour LEDs module according to claim 1, it is characterised in that：Every four all-colour LED units
It is distributed in matrix pattern.
3. a kind of SMT all-colour LEDs module according to claim 1, it is characterised in that：The two neighboring all-colour LED list
Grid is equipped between member（11）.
4. a kind of LED display formed such as claim 1-3 any one of them SMT all-colour LEDs module, it is characterised in that：
The LED display is made of the arrangement of several SMT all-colour LEDs module arrays.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721744027.7U CN207587722U (en) | 2017-12-14 | 2017-12-14 | A kind of LED display of SMT all-colour LEDs module and its composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721744027.7U CN207587722U (en) | 2017-12-14 | 2017-12-14 | A kind of LED display of SMT all-colour LEDs module and its composition |
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| Publication Number | Publication Date |
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| CN207587722U true CN207587722U (en) | 2018-07-06 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108511431A (en) * | 2018-05-21 | 2018-09-07 | 佛山市国星光电股份有限公司 | A kind of LED display unit group and display panel |
| CN110350073A (en) * | 2019-07-18 | 2019-10-18 | 浙江英特来光电科技有限公司 | One kind 4 closes 1 full-color SMD LED |
| CN113707636A (en) * | 2021-08-26 | 2021-11-26 | 天水华天科技股份有限公司 | RGBLED packaging substrate for display |
| CN114370890A (en) * | 2021-12-31 | 2022-04-19 | 佛山市国星光电股份有限公司 | Sensing device and manufacturing method thereof |
| CN115424947A (en) * | 2022-09-21 | 2022-12-02 | 深圳市三联盛科技股份有限公司 | Semiconductor chip mounting process and device |
-
2017
- 2017-12-14 CN CN201721744027.7U patent/CN207587722U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108511431A (en) * | 2018-05-21 | 2018-09-07 | 佛山市国星光电股份有限公司 | A kind of LED display unit group and display panel |
| CN110350073A (en) * | 2019-07-18 | 2019-10-18 | 浙江英特来光电科技有限公司 | One kind 4 closes 1 full-color SMD LED |
| CN113707636A (en) * | 2021-08-26 | 2021-11-26 | 天水华天科技股份有限公司 | RGBLED packaging substrate for display |
| CN114370890A (en) * | 2021-12-31 | 2022-04-19 | 佛山市国星光电股份有限公司 | Sensing device and manufacturing method thereof |
| CN115424947A (en) * | 2022-09-21 | 2022-12-02 | 深圳市三联盛科技股份有限公司 | Semiconductor chip mounting process and device |
| CN115424947B (en) * | 2022-09-21 | 2023-08-29 | 深圳市三联盛科技股份有限公司 | Semiconductor chip mounting technology and equipment |
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Effective date of registration: 20230113 Address after: 512029 No. 88, Shengqiang Road, Wujiang District, Shaoguan City, Guangdong Province Patentee after: Guangdong Shaohua Technology Co.,Ltd. Address before: 741000 Gansu province Tianshui District Shuangqiao Road No. 14 Patentee before: TIANSHUI HUATIAN TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |