CN115985609A - Laser resistance adjusting method and device - Google Patents

Laser resistance adjusting method and device Download PDF

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Publication number
CN115985609A
CN115985609A CN202211565851.1A CN202211565851A CN115985609A CN 115985609 A CN115985609 A CN 115985609A CN 202211565851 A CN202211565851 A CN 202211565851A CN 115985609 A CN115985609 A CN 115985609A
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cutting
cutting process
substrate
adjusted
resistance
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CN115985609B (en
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周峰
刘春雨
贺霖
张胜
孙明霞
宋宇
王凯
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Changchun Guanghua Micro Electronic Equipment Engineering Center Co ltd
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Changchun Guanghua Micro Electronic Equipment Engineering Center Co ltd
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Abstract

The application provides a laser resistance adjusting method and device. According to the method and the device, under the condition of no manual intervention, the resistance to be adjusted in one substrate to be processed can be adjusted by utilizing the multiple cutting process, and the flow-type resistance adjustment can be performed on the resistance to be adjusted in all the substrates to be processed which are produced in the same batch, so that the flow-type operation is realized. The problem of low production yield when a single cutting process is used for adjusting the resistance of some special resistors to be adjusted is solved.

Description

Laser resistance adjusting method and device
Technical Field
The application relates to the technical field of semiconductors, in particular to a laser resistance adjusting method and device.
Background
And the resistance adjustment is to adjust the resistance of a chip resistor, a passive circuit, an active circuit and an alloy resistor on the substrate by using laser. The method is characterized in that the resistance is measured in real time, and meanwhile, the resistance value is increased by changing the sectional area of the resistance through laser etching, so that the resistance smaller than the target resistance value reaches the target resistance value.
At present, single-time trimming process is adopted for resistors to be tuned arrayed on a substrate in a matrix manner, and batch tuning is carried out. On the basis of preset process parameters, etching each resistor to be adjusted line by line through laser once to achieve a target resistance value.
However, when a single cutting process is used to cut some special resistors to be adjusted, the longer the cutting time is, the longer the cutting length is, and the higher the temperature of the resistor to be adjusted is, and when the critical temperature is exceeded, the resistance value of the resistor to be adjusted is uncontrollable, which often results in a low production yield. For example, the resistors to be tuned for different processes, such as high resistance resistors, low resistance resistors, small size resistors, thermistors, resistors sensitive to laser (heat), resistors sensitive to cutting patterns, and resistors sensitive to cutting length.
Therefore, the present application provides a laser trimming method to solve one of the above technical problems.
Disclosure of Invention
The present application is directed to a laser trimming method and apparatus, which can solve at least one of the above-mentioned problems. The specific scheme is as follows:
according to a specific implementation manner of the present application, in a first aspect, the present application provides a laser trimming method, including:
respectively trimming the resistance of each resistance to be trimmed in at least one trial-debugging substrate by utilizing a single cutting process, and obtaining the production yield of the at least one trial-debugging substrate based on the resistance value of each resistance to be trimmed in the at least one trial-debugging substrate after trimming the resistance;
when the production yield of the at least one debugging substrate is lower than a preset yield threshold, respectively debugging each resistor to be debugged in the substrate to be processed by utilizing a multiple cutting process, so that the production yield of the substrate to be processed is greater than or equal to the preset yield threshold, wherein each resistor to be debugged in the substrate to be processed has the same characteristic as each resistor to be debugged in the at least one debugging substrate.
Optionally, the adjusting the resistance of each to-be-adjusted resistor in the substrate to be processed by using the multiple cutting process includes:
determining a cutting parameter value of each cutting process in the multiple cutting processes based on preset characteristic information shared by all resistors to be adjusted in the substrate to be processed;
and respectively adjusting the resistance of each resistance to be adjusted in the substrate to be processed based on the cutting parameter value of each cutting process in the multiple cutting processes.
Optionally, the determining, based on the preset characteristic information common to all resistors to be adjusted in the substrate to be processed, a cutting parameter value of each cutting process in the multiple cutting processes includes:
and determining the balance coefficient value of each cutting process in the multiple cutting processes based on preset characteristic information of the resistor to be adjusted in the substrate to be processed, wherein the sum of the balance coefficient values of all the cutting processes in the multiple cutting processes is equal to 1.
Optionally, the multiple cutting process includes a two-time cutting process, where the two-time cutting process includes a first cutting process and a second cutting process;
correspondingly, the adjusting the resistance of each to-be-adjusted resistor in the substrate to be processed based on the cutting parameter value of each cutting process in the multiple cutting processes comprises:
distributing a preset target resistance value based on the balance coefficient value of the first cutting process to obtain a first target resistance value of the first cutting process;
testing a first resistance value of any resistor to be adjusted in real time in the process of executing the first cutting process on any resistor to be adjusted in the substrate to be processed;
when the first resistance value of any one resistor to be regulated is equal to the first target resistance value, stopping executing the first cutting process;
when the measured temperature value of any resistor to be regulated is lower than a preset cooling temperature threshold value, executing the second cutting process on any resistor to be regulated, and testing a second resistance value of any resistor to be regulated in real time;
and when the second resistance value of any one of the resistors to be regulated is equal to a preset target resistance value, stopping executing the second cutting process.
Optionally, the cutting parameter value of the first cutting process further includes an initial cutting position and a cutting angle in a preset coordinate system;
the cutting parameter values of the second cutting process further comprise spacing values; the spacing value is greater than or equal to a preset process spacing threshold value;
correspondingly, the second cutting process is performed on any resistance to be adjusted, and the second cutting process comprises the following steps:
in a preset coordinate system, obtaining a first cutting straight line required by executing the first cutting process on any resistor to be adjusted based on the initial cutting position and the cutting angle;
obtaining a second cutting straight line parallel to the first cutting straight line based on the first cutting straight line and the distance value;
and executing the second cutting process on any resistor to be adjusted based on the second cutting straight line.
Optionally, the balance coefficient value of the first cutting process is 0.95-0.98.
Optionally, the substrate to be processed includes resistors to be adjusted arranged in an array;
correspondingly, the adjusting the resistance of each to-be-adjusted resistor in the substrate to be processed based on the cutting parameter value of each cutting process in the multiple cutting processes comprises:
respectively performing resistance adjustment tests on any row of resistors to be adjusted in the substrate to be processed based on cutting parameter values of each cutting process in the multiple cutting processes to obtain the production yield of any row of resistors to be adjusted;
and when the production yield of any row of resistors to be regulated is greater than or equal to a preset yield threshold, respectively regulating the resistors to be regulated in the substrate to be processed except the any row of resistors to be regulated based on the cutting parameter value of each cutting process in the multiple cutting processes.
According to a second aspect, there is provided a laser trimming apparatus, including:
the debugging unit is used for respectively debugging each resistor to be debugged in at least one debugging substrate by utilizing a single cutting process, and obtaining the production yield of the at least one debugging substrate based on the resistance value of each resistor to be debugged in the at least one debugging substrate after the resistor is debugged;
and the multi-time cutting unit is used for respectively trimming the resistors to be trimmed in the substrates to be processed by utilizing a multi-time cutting process when the production yield of the at least one trial-adjustment substrate is lower than a preset yield threshold value, so that the production yield of the substrates to be processed is greater than or equal to the preset yield threshold value, wherein the resistors to be trimmed in the substrates to be processed and the resistors to be trimmed in the at least one trial-adjustment substrate have the same characteristics.
Optionally, the multiple cutting unit includes:
the first determining subunit is used for determining the cutting parameter value of each cutting process in the multiple cutting processes based on preset characteristic information shared by all resistors to be adjusted in the substrate to be processed;
and the first resistance adjusting subunit is used for adjusting the resistance of each resistance to be adjusted in the substrate to be processed respectively based on the cutting parameter value of each cutting process in the multiple cutting processes.
Optionally, the first determining subunit includes:
and the second determining subunit is used for determining the balance coefficient value of each cutting process in the multiple cutting processes based on the preset characteristic information of the resistor to be adjusted in the substrate to be processed, wherein the sum of the balance coefficient values of all the cutting processes in the multiple cutting processes is equal to 1.
Optionally, the multiple cutting process includes a two-time cutting process, where the two-time cutting process includes a first cutting process and a second cutting process;
accordingly, the first resistance adjusting subunit comprises:
a first obtaining subunit, configured to distribute a preset target resistance value based on the balance coefficient value of the first cutting process to obtain a first target resistance value of the first cutting process;
the first execution subunit is used for testing a first resistance value of any resistor to be adjusted in real time in the process of executing the first cutting process on any resistor to be adjusted in the substrate to be processed;
the first terminator unit is used for terminating the execution of the first cutting process when the first resistance value of any one resistor to be adjusted is equal to the first target resistance value;
the second execution subunit is used for executing the second cutting process on any resistor to be adjusted when the measured temperature value of the resistor to be adjusted is lower than a preset cooling temperature threshold value, and testing a second resistance value of the resistor to be adjusted in real time;
and the second terminator unit is used for terminating the execution of the second cutting process when the second resistance value of any one of the resistors to be regulated is equal to a preset target resistance value.
Optionally, the cutting parameter value of the first cutting process further includes an initial cutting position and a cutting angle in a preset coordinate system;
the cutting parameter values of the second cutting process further comprise spacing values; the spacing value is greater than or equal to a preset process spacing threshold value;
accordingly, the second execution subunit includes:
the second obtaining subunit is used for obtaining a first cutting straight line required by executing the first cutting process on any one resistor to be adjusted based on the initial cutting position and the cutting angle in a preset coordinate system;
a third obtaining subunit operable to obtain a second cutting straight line parallel to the first cutting straight line based on the first cutting straight line and the pitch value;
and the third execution subunit is used for executing the second cutting process on any resistor to be adjusted based on the second cutting straight line and testing a second resistance value of any resistor to be adjusted in real time when the measured temperature value of any resistor to be adjusted is lower than a preset cooling temperature threshold value.
Optionally, the balance coefficient value of the first cutting process is 0.95-0.98.
Optionally, the substrate to be processed includes resistors to be adjusted arranged in an array;
correspondingly, the first resistance adjusting subunit further includes:
the fourth obtaining subunit is configured to perform resistance adjustment tests on any row of to-be-adjusted resistors in the substrate to be processed respectively based on the cutting parameter values of each cutting process in the multiple cutting processes, so as to obtain the production yield of any row of to-be-adjusted resistors;
and the second resistance adjusting subunit is configured to, when the production yield of the any line of resistors to be adjusted is greater than or equal to a preset yield threshold, respectively adjust the resistances of the other resistors to be adjusted in the substrate to be processed, except the any line of resistors to be adjusted, based on the cutting parameter value of each cutting process in the multiple cutting processes.
Compared with the prior art, the scheme of the embodiment of the application has at least the following beneficial effects:
the application provides a laser resistance adjusting method and device. The method comprises the following steps: respectively trimming the resistance of each resistance to be trimmed in at least one trial-debugging substrate by utilizing a single cutting process, and obtaining the production yield of the at least one trial-debugging substrate based on the resistance value of each resistance to be trimmed in the at least one trial-debugging substrate after trimming the resistance; when the production yield of the at least one debugging substrate is lower than a preset yield threshold, respectively debugging each resistor to be debugged in the substrate to be processed by utilizing a multiple cutting process, so that the production yield of the substrate to be processed is greater than or equal to the preset yield threshold, wherein each resistor to be debugged in the substrate to be processed has the same characteristic as each resistor to be debugged in the at least one debugging substrate. According to the method and the device, under the condition of no manual intervention, the resistance to be adjusted in one substrate to be processed can be adjusted by utilizing the multiple cutting process, and the flowing resistance adjustment can be carried out on the resistance to be adjusted in all the substrates to be processed which are produced in the same batch, so that the flowing operation is realized. The problem of low production yield when a single cutting process is used for adjusting the resistance of some special resistors to be adjusted is solved.
Drawings
Fig. 1 shows a flow chart of a laser trimming method according to an embodiment of the present application;
FIG. 2 shows a schematic diagram of a resistor to be tuned according to an embodiment of the application;
fig. 3 shows a block diagram of the elements of a laser trimming apparatus according to an embodiment of the present application;
description of the reference numerals
10-resistance to be adjusted, 11-initial cutting position, 12-first cutting straight line, 13-second cutting straight line and d-spacing value.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be described in further detail with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, and "a plurality" typically includes at least two.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
It should be understood that although the terms first, second, third, etc. may be used in the embodiments of the present application, these descriptions should not be limited to these terms. These terms are only used to distinguish one description from another. For example, a first may also be referred to as a second, and similarly, a second may also be referred to as a first, without departing from the scope of embodiments of the present application.
The words "if", as used herein, may be interpreted as "at ...when" or "when ...30, when" or "in response to a determination" or "in response to a detection", depending on the context. Similarly, the phrases "if determined" or "if detected (a stated condition or event)" may be interpreted as "when determined" or "in response to a determination" or "when detected (a stated condition or event)" or "in response to a detection (a stated condition or event)", depending on the context.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a good or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such good or apparatus. Without further limitation, an element defined by the phrases "comprising one of ..." does not exclude the presence of additional like elements in an article or device comprising the element.
It is to be noted that the symbols and/or numerals present in the description are not reference numerals if they are not labeled in the description of the figures.
Alternative embodiments of the present application are described in detail below with reference to the accompanying drawings.
Example 1
The embodiment provided by the application is an embodiment of a laser resistance trimming method.
The following describes embodiments of the present application in detail with reference to fig. 1.
Step S101, respectively trimming the resistance of each resistor 10 to be trimmed in at least one trial-debugging substrate by utilizing a single cutting process, and obtaining the production yield of the at least one trial-debugging substrate based on the resistance value of each resistor 10 to be trimmed in the at least one trial-debugging substrate after trimming.
The substrate is a basic material for producing the resistor. For the resistor 10 to be adjusted on the substrate, the manufacturing process comprises the following steps: and manufacturing slurry for producing the resistor, stirring the slurry, printing the resistor on the substrate by using the slurry, and sintering the resistor printed on the substrate to generate the resistor to be adjusted 10. After the resistance of the resistor 10 to be adjusted is adjusted, the resistor reaching the preset target resistance value can leave the factory.
The single-cut process refers to a process of trimming the resistance by etching each resistance to be trimmed 10 on the substrate once with laser, and the preset target resistance value is expected to be reached once.
The production yield, also called "pass rate", one of the product quality indexes, refers to the percentage of qualified products in the total processed products. In the resistance trimming process, the production yield represents the success probability after trimming the preset number of resistors 10 to be trimmed, that is, the probability that the preset number of resistors 10 to be trimmed reach the preset target resistance value after trimming.
In the manufacturing process, due to the resistor density, the material distribution, the resistor thickness and the like, the resistor 10 to be tuned is sensitive to the cutting length, the pattern, the heat and the like during the tuning. For example, the sensitive resistor 10 to be tuned includes: a high resistance resistor having a resistance value of more than 500k Ω, a low resistance resistor having a resistance value of less than 10 Ω, a small-sized resistance of 0201 or 01005 patches, and a thermistor having a resistance value that changes greatly when heated.
However, when the sensitive resistor 10 to be tuned is tuned by using the single-cut process, the production yield is low. Therefore, in the embodiment of the present application, one or several substrates are selected from the substrates with the resistors 10 to be tuned produced in the same batch as the debug substrates, and the resistors 10 to be tuned in the debug substrates are tested by using a single cutting process, so as to determine the effectiveness of the single cutting process for tuning the resistors 10 to be tuned on the batch of debug substrates, where the effectiveness is reflected by the production yield of the batch of debug substrates. Of course, if the substrate to be processed includes the resistors 10 to be tuned arranged in an array, one or more rows of the resistors 10 to be tuned in one substrate may be tested, and the production yield is obtained based on the tested resistors 10 to be tuned, but the test of the present application is not limited thereto. The larger the number of the resistors 10 to be regulated participating in the test is, the more the production yield accords with the actual situation, and the higher the reference value of the effectiveness is.
Step S102, when the production yield of the at least one debugging substrate is lower than a preset yield threshold, respectively debugging each resistor 10 to be debugged in the substrate to be processed by utilizing a multiple cutting process, so that the production yield of the substrate to be processed is greater than or equal to the preset yield threshold.
Wherein, each resistor 10 to be adjusted in the substrate to be processed and the trial adjustment substrate has the same characteristics. It is understood that the substrate to be processed and the debug substrate are produced in the same batch.
The multi-cutting process is to cut the resistor 10 to be adjusted for multiple times, wherein each time of cutting, the temperature value of the resistor 10 to be adjusted is within a preset safe temperature threshold, and finally the resistance value of the resistor 10 to be adjusted reaches a preset target resistance value.
According to the embodiment of the application, the resistance of the resistor 10 to be adjusted in one substrate to be processed can be adjusted by utilizing the multiple cutting process, and the flowing-type resistance adjustment of the resistor 10 to be adjusted in all substrates to be processed in the same batch can be performed, so that the flowing-type operation is realized.
In some embodiments, the performing resistance adjustment on each resistance to be adjusted 10 in the substrate to be processed by using the multiple cutting process includes the following steps:
step S102-1, determining a cutting parameter value of each cutting process in the multiple cutting processes based on preset characteristic information shared by all resistors 10 to be adjusted in the substrate to be processed.
The preset characteristic information includes: the method comprises the steps of presetting resistor density, presetting material distribution information and/or presetting resistor thickness information.
The cutting parameter value of each cutting process in the multiple cutting processes can be an empirical value, or a corresponding relation can be established between historical characteristic information and the cutting parameter value of each cutting process in the multiple cutting processes which are successful historically, and the corresponding relation is stored in a relation data set. When multiple cutting processes are required, cutting parameter values of each cutting process in the multiple cutting processes corresponding to the characteristic information can be obtained from the relation data set through the characteristic information of the resistor 10 to be adjusted.
In some embodiments, the cutting parameter values comprise equilibrium coefficient values.
The balance coefficient value is used to assign a phase target resistance value reached by each cutting process.
Correspondingly, the determining the cutting parameter value of each cutting process in the multiple cutting processes based on the preset characteristic information common to all the resistors 10 to be adjusted in the substrate to be processed includes the following steps:
step S102-1a, determining the balance coefficient value of each cutting process in the multiple cutting processes based on the preset characteristic information of the resistor 10 to be adjusted in the substrate to be processed.
Wherein the sum of the equilibrium coefficient values for all of the plurality of dicing processes is equal to 1. For example, the multiple cutting process includes a two-time cutting process, the two-time cutting process includes a first cutting process and a second cutting process, an equilibrium coefficient value of the first cutting process is 0.95, and an equilibrium coefficient value of the second cutting process is 0.05; the sum of the equilibrium coefficient value of the first cutting process and the equilibrium coefficient value of the second cutting process is 0.95+0.05=1.
And step S102-2, respectively trimming the resistors to be trimmed 10 in the substrate to be machined based on the cutting parameter value of each cutting process in the multiple cutting processes.
In some embodiments, the multiple cutting process comprises a double cutting process comprising a first cutting process and a second cutting process.
In some embodiments, the first cutting process has an equilibrium coefficient value of 0.95 to 0.98. Because the surface area of the resistor 10 to be adjusted is limited, the first cutting process can be as close as possible to the maximum effective cutting length and/or to the longest effective cutting duration, so that the second cutting process saves the effective cutting length, and the multiple cutting process saves space on the resistor 10 to be adjusted.
The maximum effective cutting length refers to the cutting length close to the critical temperature;
and the longest effective cutting length refers to the length of time cut near the critical temperature.
Of course, the embodiment of the present application is not limited to the double cutting process.
Correspondingly, the resistance adjustment of each resistance to be adjusted 10 in the substrate to be processed based on the cutting parameter value of each cutting process in the multiple cutting processes comprises the following steps:
step S102-2a-1, a preset target resistance value is distributed based on the balance coefficient value of the first cutting process, and a first target resistance value of the first cutting process is obtained.
For example, if the balance coefficient value of the first cutting process is 0.95 and the preset target resistance value is 100 Ω, the first target resistance value =100 Ω x 0.95=95 Ω.
Step S102-2a-2, in the process of executing the first cutting process to any resistor 10 to be adjusted in the substrate to be processed, testing a first resistance value of any resistor 10 to be adjusted in real time.
It can be understood that, during the first cutting process, the first resistance value of any one of the resistors 10 to be adjusted is tested in line.
Because each resistor 10 to be regulated has fine particularity, and the resistor 10 to be regulated which is controlled by the cutting length and the cutting time often cannot reach the target resistance value of the cutting process for one time by controlling the cutting process for one time, the method and the device accurately control each cutting process to reach the corresponding target resistance value by adopting a real-time testing mode.
Step S102-2a-3, when the first resistance value of any one of the resistors 10 to be adjusted is equal to the first target resistance value, terminating the execution of the first cutting process.
For example, continuing with the above example, the first target resistance value is 95 Ω, and when the first resistance value measured in real time is equal to 95 Ω, the first dicing process is stopped. At this time, the temperature value of any one of the resistors 10 to be regulated should be the highest temperature value in the process of performing the first cutting process.
Step S102-2a-4, when the measured temperature value of any one of the resistors 10 to be regulated is lower than a preset cooling temperature threshold value, the second cutting process is executed on any one of the resistors 10 to be regulated, and a second resistance value of any one of the resistors 10 to be regulated is tested in real time.
The preset cooling temperature threshold is used as a condition for limiting the execution of the second cutting process, and the second cutting process can be executed on any resistor 10 to be adjusted only when the temperature value of the resistor 10 to be adjusted is lower than the preset cooling temperature threshold. Otherwise, if any of the resistors 10 to be tuned performs the second cutting process when the temperature is too high, the thermal effect of the resistor is liable to cause the failure of tuning, and the yield of production is reduced.
After the first cutting process is executed for any resistor 10 to be adjusted, the second cutting process may be executed after the temperature value of any resistor 10 to be adjusted is lower than the preset cooling temperature threshold.
The time from the time point of executing the first cutting process to the time point of terminating executing the second cutting process for the same resistor 10 to be adjusted is called net resistance adjusting time.
The time from the point of time when the first cutting process is terminated to the point of time when the second cutting process is started for the same resistor 10 to be adjusted is called the net waiting time.
For each resistor 10 to be adjusted in the substrate to be processed produced in the same batch, a first cutting process may be performed on each resistor 10 to be adjusted in the substrate to be processed in batch. After the last resistor 10 to be adjusted in the substrate to be processed terminates executing the first cutting process, the temperature value of the resistor 10 to be adjusted, which executes the first cutting process first in the substrate to be processed, is lower than the preset cooling temperature threshold value. At this time, the second cutting process is performed in batch from the first resistor 10 to be adjusted performing the first cutting process. Compared with the resistance trimming process of performing the multiple trimming processes on one to-be-trimmed resistor 10 and then performing the multiple trimming processes on the next to-be-trimmed resistor 10, the resistance trimming process performs the first cutting process or the second cutting process on other to-be-trimmed resistors 10 within the net waiting time of each to-be-trimmed resistor 10 in the to-be-trimmed substrate, so that the total resistance trimming time of the to-be-trimmed substrate for performing the multiple trimming processes in batch is shortened, the average net resistance trimming time of each to-be-trimmed resistor 10 is reduced, and the average resistance trimming efficiency of each to-be-trimmed resistor 10 is improved.
In some embodiments, each substrate to be processed for resistance adjustment is placed in a predetermined coordinate system for position control and resistance adjustment.
The resistors 10 to be tuned (e.g., chip resistors) are of fixed dimensions and are printed by a screen of fixed dimensions during the processing of the resistors 10 to be tuned, because of the tension of the viscous paste and the relationship between the sintering process and the positioning accuracy of the printer itself, there is an overall deviation within a certain tolerance range. And in a preset coordinate system, automatically correcting each substrate to be processed for resistance adjustment according to the positions of the three points of the left lower point, the right lower point and the right upper point of the substrate to be processed. After correction, the fixed position of each resistor 10 to be adjusted can be obtained from the substrate to be processed, so that the relative uniformity of the initial cutting position 11 and the cutting angle of the laser of each resistor 10 to be adjusted is ensured.
The cutting parameter values of the first cutting process further comprise an initial cutting position 11 and a cutting angle in a preset coordinate system; the cutting parameter value of the second cutting process also comprises a spacing value d; the distance value d is larger than or equal to a preset process distance threshold value.
The distance value d is a distance value which enables the cutting line segment of the second cutting process and the cutting line segment of the first cutting process to keep a parallel relation. Because the chip resistors are all very small resistors, the purpose of resistance adjustment can be achieved by cutting the process for multiple times only when the distance value d is larger than or equal to the preset process distance threshold value.
Correspondingly, as shown in fig. 2, the second cutting process performed on any one of the resistors 10 to be adjusted includes the following steps:
step S102-2a-4-1, in a preset coordinate system, obtaining a first cutting straight line 12 required for executing the first cutting process on any one resistor 10 to be adjusted based on the initial cutting position 11 and the cutting angle.
And each substrate to be processed for resistance adjustment is placed in a preset coordinate system for position control and resistance adjustment. For example, as shown in fig. 2, the starting cutting position 11 (6, 17) of the first cutting process of the resistor 10 to be adjusted, i.e. a position on the left edge of the resistor 10 to be adjusted, the cutting angle of the first cutting process of the resistor 10 to be adjusted is zero, i.e. the first cutting straight line 12 passes through the starting cutting position 11 (6, 17), and the included angle between the first cutting straight line 12 and the X axis in the preset coordinate system is zero, i.e. the first cutting process starts from the starting cutting position 11 (6, 17) on the left edge of the resistor 10 to be adjusted, and cuts to the right parallel to the X axis.
Step S102-2a-4-2, a second cutting straight line 13 parallel to the first cutting straight line 12 is obtained based on the first cutting straight line 12 and the distance value d.
For example, continuing the above example, the distance d of the second cutting process of the resistor 10 to be adjusted is 7, the second cutting straight line 13 passes through the starting cutting position 11 (6, 10), and the included angle between the second cutting straight line 13 and the X axis in the preset coordinate system is also zero, that is, the second cutting straight line 13 is parallel to both the X axis and the first cutting straight line 12, that is, the second cutting process starts from the starting cutting position 11 (6, 10) at the left edge of the resistor 10 to be adjusted and cuts to the right parallel to the X axis.
And step S102-2a-4-3, performing the second cutting process on any one resistor 10 to be adjusted based on the second cutting straight line 13.
And S102-2a-5, when the second resistance value of any one of the resistors 10 to be adjusted is equal to a preset target resistance value, stopping executing the second cutting process.
The second resistance value of any one of the resistors 10 to be tuned is equal to the preset target resistance value, which indicates that the on-line resistance tuning is successful. However, the resistance value of the test performed during the on-line trimming may be affected by the trimming process. Therefore, after a batch of substrates to be processed are trimmed, the resistance value of the resistors in the batch of substrates to be processed needs to be tested again on line, so that the actual production yield of the batch of substrates to be processed can be obtained.
Optionally, the cutting parameter value of each cutting process in the multiple cutting processes further includes: the power of the etching laser, the knife type used for cutting, the cutting speed, and/or the frequency of the etching laser.
In other embodiments, the substrate to be processed includes resistors 10 to be tuned arranged in an array.
Correspondingly, the adjusting the resistance of each to-be-adjusted resistor 10 in the substrate to be processed based on the cutting parameter value of each cutting process in the multiple cutting processes comprises the following steps:
step S102-2b-1, resistance adjusting tests are respectively carried out on any row of resistors to be adjusted 10 in the substrate to be processed based on cutting parameter values of each cutting process in the multiple cutting processes, and the production yield of any row of resistors to be adjusted 10 is obtained.
Step S102-2b-2, when the production yield of any row of resistors to be tuned 10 is greater than or equal to a preset yield threshold, tuning resistors to be tuned 10 in the substrate to be processed, except for any row of resistors to be tuned 10, based on the cutting parameter value of each cutting process in the multiple cutting processes.
In the embodiment, after the cutting parameter value of each cutting process in the multiple cutting processes is determined, a small-scale resistance trimming test is performed on any row of resistors to be trimmed 10 in the substrate to be processed by using the cutting parameter value of each cutting process in the multiple cutting processes, and the production yield of the resistors to be trimmed 10 in any row is tested. When the production yield after the small-scale resistance trimming test meets the requirement, the cutting parameter values of each cutting process in the multiple cutting processes are used for trimming the resistance of the other to-be-trimmed resistors 10 in the to-be-machined substrate and the resistance of the to-be-trimmed resistors 10 in the other to-be-machined substrates produced in the same batch. The method avoids the distortion or the error of the cutting parameter value of each cutting process in multiple cutting processes caused by the distortion or the error of the preset characteristic information, ensures the resistance trimming quality after the resistance trimming in batches, and ensures the high-quality production yield.
According to the embodiment of the application, under the condition of no manual intervention, the resistance of the resistor 10 to be adjusted in one substrate to be processed can be adjusted by utilizing the multiple cutting process, and the flowing-type resistance adjustment can be performed on the resistors 10 to be adjusted in all substrates to be processed which are produced in the same batch, so that the flowing-type operation is realized. The problem of low production yield when a single cutting process is used for trimming the resistors 10 to be trimmed is solved.
Example 2
The present application further provides an apparatus embodiment adapted to the above embodiment, for implementing the method steps described in the above embodiment, and the explanation based on the same name and meaning is the same as that in the above embodiment, and has the same technical effect as that in the above embodiment, and details are not repeated here.
As shown in fig. 3, the present application provides a laser trimming apparatus 300, comprising:
the debugging unit 301 is configured to respectively debug the resistors to be debugged in the at least one debugging substrate by using a single cutting process, and obtain the production yield of the at least one debugging substrate based on the resistance values of the resistors to be debugged in the at least one debugging substrate after trimming;
a multi-cut unit 302, configured to, when the production yield of the at least one trial-tuned substrate is lower than a preset yield threshold, respectively trim resistors to be trimmed in the substrates to be processed by using a multi-cut process, so that the production yield of the substrates to be processed is greater than or equal to the preset yield threshold, where each of the resistors to be trimmed in the substrates to be processed has the same characteristics as each of the resistors to be trimmed in the at least one trial-tuned substrate.
Optionally, the multiple-cutting unit 302 includes:
the first determining subunit is used for determining the cutting parameter value of each cutting process in the multiple cutting processes based on preset characteristic information shared by all resistors to be adjusted in the substrate to be processed;
and the first resistance adjusting subunit is used for adjusting the resistance of each resistance to be adjusted in the substrate to be processed respectively based on the cutting parameter value of each cutting process in the multiple cutting processes.
Optionally, the first determining subunit includes:
and the second determining subunit is used for determining the balance coefficient value of each cutting process in the multiple cutting processes based on the preset characteristic information of the resistor to be adjusted in the substrate to be processed, wherein the sum of the balance coefficient values of all the cutting processes in the multiple cutting processes is equal to 1.
Optionally, the multiple cutting process includes a two-time cutting process, where the two-time cutting process includes a first cutting process and a second cutting process;
accordingly, the first resistance adjusting subunit comprises:
a first obtaining subunit, configured to distribute a preset target resistance value based on the balance coefficient value of the first cutting process to obtain a first target resistance value of the first cutting process;
the first execution subunit is used for testing a first resistance value of any resistor to be adjusted in real time in the process of executing the first cutting process on any resistor to be adjusted in the substrate to be processed;
the first terminator unit is used for terminating the execution of the first cutting process when the first resistance value of any one resistor to be adjusted is equal to the first target resistance value;
the second execution subunit is used for executing the second cutting process on any resistor to be adjusted when the measured temperature value of the resistor to be adjusted is lower than a preset cooling temperature threshold value, and testing a second resistance value of the resistor to be adjusted in real time;
and the second terminator unit is used for terminating the execution of the second cutting process when the second resistance value of any one of the resistors to be regulated is equal to a preset target resistance value.
Optionally, the cutting parameter value of the first cutting process further includes an initial cutting position and a cutting angle in a preset coordinate system;
the cutting parameter values of the second cutting process further comprise spacing values; the spacing value is greater than or equal to a preset process spacing threshold value;
accordingly, the second execution subunit comprises:
the second obtaining subunit is used for obtaining a first cutting straight line required by executing the first cutting process on any one resistor to be adjusted based on the initial cutting position and the cutting angle in a preset coordinate system;
a third obtaining subunit operable to obtain, based on the first cutting straight line and the pitch value, a second cutting straight line parallel to the first cutting straight line;
and the third execution subunit is used for executing the second cutting process on any resistor to be adjusted based on the second cutting straight line and testing a second resistance value of any resistor to be adjusted in real time when the measured temperature value of any resistor to be adjusted is lower than a preset cooling temperature threshold value.
Optionally, the balance coefficient value of the first cutting process is 0.95-0.98.
Optionally, the substrate to be processed includes resistors to be adjusted arranged in an array;
correspondingly, the first resistance adjusting subunit further includes:
a fourth obtaining subunit, configured to perform resistance trimming tests on any row of to-be-trimmed resistors in the substrate to be processed, respectively, based on the cutting parameter value of each cutting process in the multiple cutting processes, so as to obtain a production yield of the any row of to-be-trimmed resistors;
and the second resistance adjusting subunit is configured to, when the production yield of the any line of resistors to be adjusted is greater than or equal to a preset yield threshold, respectively adjust the resistances of the other resistors to be adjusted in the substrate to be processed, except the any line of resistors to be adjusted, based on the cutting parameter value of each cutting process in the multiple cutting processes.
According to the embodiment of the application, under the condition of no manual intervention, the resistance to be adjusted in one substrate to be processed can be adjusted by utilizing the multiple cutting process, and the flowing-type resistance adjustment can be performed on the resistance to be adjusted in all the substrates to be processed which are produced in the same batch, so that the flowing-type operation is realized. The problem of low production yield when a single cutting process is used for adjusting the resistance of some special resistors to be adjusted is solved.
Finally, it should be noted that: the embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The system or the device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present application.

Claims (10)

1. A laser resistance trimming method is characterized by comprising the following steps:
respectively trimming the resistance of each resistance to be trimmed in at least one trial-debugging substrate by utilizing a single cutting process, and obtaining the production yield of the at least one trial-debugging substrate based on the resistance value of each resistance to be trimmed in the at least one trial-debugging substrate after trimming the resistance;
when the production yield of the at least one debugging substrate is lower than a preset yield threshold, respectively debugging each resistor to be debugged in the substrate to be processed by utilizing a multiple cutting process, so that the production yield of the substrate to be processed is greater than or equal to the preset yield threshold, wherein each resistor to be debugged in the substrate to be processed has the same characteristic as each resistor to be debugged in the at least one debugging substrate.
2. The method according to claim 1, wherein the trimming the resistors to be trimmed in the substrate to be processed by using the multiple cutting process comprises:
determining a cutting parameter value of each cutting process in the multiple cutting processes based on preset characteristic information shared by all resistors to be adjusted in the substrate to be processed;
and respectively adjusting the resistance of each resistance to be adjusted in the substrate to be processed based on the cutting parameter value of each cutting process in the multiple cutting processes.
3. The method according to claim 2, wherein the determining the cutting parameter value of each cutting process in the multiple cutting processes based on the preset characteristic information common to all resistors to be adjusted in the substrate to be processed comprises:
and determining the balance coefficient value of each cutting process in the multiple cutting processes based on preset characteristic information of the resistor to be adjusted in the substrate to be processed, wherein the sum of the balance coefficient values of all the cutting processes in the multiple cutting processes is equal to 1.
4. The method of claim 3,
the multiple cutting process comprises a twice cutting process, wherein the twice cutting process comprises a first cutting process and a second cutting process;
correspondingly, the adjusting the resistance of each to-be-adjusted resistor in the substrate to be processed based on the cutting parameter value of each cutting process in the multiple cutting processes comprises:
distributing a preset target resistance value based on the balance coefficient value of the first cutting process to obtain a first target resistance value of the first cutting process;
in the process of executing the first cutting process on any resistor to be adjusted in the substrate to be processed, testing a first resistance value of any resistor to be adjusted in real time;
when the first resistance value of any one resistor to be adjusted is equal to the first target resistance value, stopping executing the first cutting process;
when the measured temperature value of any resistor to be regulated is lower than a preset cooling temperature threshold value, executing the second cutting process on any resistor to be regulated, and testing a second resistance value of any resistor to be regulated in real time;
and when the second resistance value of any one of the resistors to be regulated is equal to a preset target resistance value, stopping executing the second cutting process.
5. The method of claim 4,
the cutting parameter value of the first cutting process further comprises an initial cutting position and a cutting angle in a preset coordinate system;
the cutting parameter values of the second cutting process further comprise spacing values; the spacing value is greater than or equal to a preset process spacing threshold value;
correspondingly, the second cutting process is performed on any resistance to be adjusted, and the second cutting process comprises the following steps:
in a preset coordinate system, obtaining a first cutting straight line required by executing the first cutting process on any resistor to be adjusted based on the initial cutting position and the cutting angle;
obtaining a second cutting straight line parallel to the first cutting straight line based on the first cutting straight line and the distance value;
and executing the second cutting process on any resistor to be adjusted based on the second cutting straight line.
6. The method of claim 4, wherein the first cutting process has an equilibrium coefficient value of 0.95 to 0.98.
7. The method of claim 2,
the substrate to be processed comprises resistors to be adjusted which are arranged in an array manner;
correspondingly, the adjusting the resistance of each to-be-adjusted resistor in the substrate to be processed based on the cutting parameter value of each cutting process in the multiple cutting processes comprises:
respectively performing resistance adjustment tests on any row of resistors to be adjusted in the substrate to be processed based on cutting parameter values of each cutting process in the multiple cutting processes to obtain the production yield of any row of resistors to be adjusted;
and when the production yield of any row of resistors to be regulated is greater than or equal to a preset yield threshold, respectively regulating the resistors to be regulated in the substrate to be processed except the any row of resistors to be regulated based on the cutting parameter value of each cutting process in the multiple cutting processes.
8. A laser trimming apparatus, comprising:
the debugging unit is used for respectively debugging each resistor to be debugged in at least one debugging substrate by utilizing a single cutting process, and obtaining the production yield of the at least one debugging substrate based on the resistance value of each resistor to be debugged in the at least one debugging substrate after the resistor is debugged;
and the multiple cutting unit is used for respectively trimming the resistors to be trimmed in the substrates to be processed by utilizing a multiple cutting process when the production yield of the at least one trial-debugging substrate is lower than a preset yield threshold value, so that the production yield of the substrates to be processed is greater than or equal to the preset yield threshold value, wherein the resistors to be trimmed in the substrates to be processed and the resistors to be trimmed in the at least one trial-debugging substrate have the same characteristics.
9. The apparatus of claim 8, wherein the multiple cutting unit comprises:
the first determining subunit is used for determining the cutting parameter value of each cutting process in the multiple cutting processes based on preset characteristic information shared by all resistors to be adjusted in the substrate to be processed;
and the first resistance adjusting subunit is used for adjusting the resistance of each resistance to be adjusted in the substrate to be processed respectively based on the cutting parameter value of each cutting process in the multiple cutting processes.
10. The apparatus of claim 9, wherein the first determining subunit comprises:
and the second determining subunit is used for determining the balance coefficient value of each cutting process in the multiple cutting processes based on preset characteristic information of the resistance to be adjusted in the substrate to be processed, wherein the sum of the balance coefficient values of all the cutting processes in the multiple cutting processes is equal to 1.
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