CN115976608A - Electroplating apparatus and electroplating method - Google Patents
Electroplating apparatus and electroplating method Download PDFInfo
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- CN115976608A CN115976608A CN202210354578.1A CN202210354578A CN115976608A CN 115976608 A CN115976608 A CN 115976608A CN 202210354578 A CN202210354578 A CN 202210354578A CN 115976608 A CN115976608 A CN 115976608A
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Abstract
The invention provides electroplating equipment, which comprises an anode, a cathode, a power supply and a regulating plate. The power supply is electrically connected to the anode and the cathode. The regulating plate is arranged between the anode and the cathode. The regulation and control board includes insulating grid board and a plurality of magnetic assembly, and a plurality of magnetic assembly evenly set up at random on insulating grid board. An electroplating method is also provided.
Description
Technical Field
The present invention relates to an apparatus and a method, and more particularly, to an electroplating apparatus and an electroplating method.
Background
Electroplating has been widely used in various fields, and is also used in the manufacture of circuit boards, semiconductor chips, LED conductive substrates, and semiconductor packages, in addition to the conventional surface treatment method, and the electroplating often has a problem of uniformity of plating thickness of a metal plating layer.
For example, in the manufacturing process of a circuit board, when a power line between an anode and a cathode approaches a substrate to be plated, the power line is often influenced by the characteristics of a film layer thereon (e.g., insulation characteristics or other characteristics that influence power distribution), and the power line density distribution is not uniform.
Disclosure of Invention
The invention provides electroplating equipment and an electroplating method, which can solve the problem of poor electroplating thickness uniformity of a metal coating on a substrate to be plated.
The invention relates to electroplating equipment, which comprises an anode, a cathode, a power supply and a regulation plate. The power supply is electrically connected to the anode and the cathode. The regulating plate is arranged between the anode and the cathode. The regulation and control board includes insulating grid board and a plurality of magnetic assembly, and a plurality of magnetic assembly evenly set up at random on insulating grid board.
In an embodiment of the present invention, the uniform random arrangement of the plurality of magnetic elements is generated by a uniform random number generator.
In an embodiment of the invention, the magnetic elements are permanent magnets.
In an embodiment of the present invention, the magnetic strength and the disposition angle of each permanent magnet are generated by a uniform random number generator.
In an embodiment of the invention, the plurality of permanent magnets have at least two magnetic strengths.
In an embodiment of the invention, the plurality of permanent magnets are disposed on a surface of the insulating grid plate close to the anode.
In an embodiment of the invention, the plurality of magnetic assemblies are formed by disposing a set of magnetic materials in the meshes of the insulating grid plate.
In an embodiment of the invention, the set of magnetic materials is generated by a uniform random number generator.
In an embodiment of the invention, the cells are hexagonal cellular grids.
In an embodiment of the invention, the set of magnetic materials includes a first magnetic material and a second magnetic material, and the first magnetic material and the second magnetic material are respectively disposed on a pair of opposite sidewalls in the hexagonal honeycomb mesh to form a north-directing pole and a south-directing pole.
The electroplating method at least comprises the following steps. An electroplating device is provided, and the electroplating device comprises an anode, a cathode, a power supply and a regulation plate. The power supply is electrically connected to the anode and the cathode. The regulating plate is arranged between the anode and the cathode. The regulation and control board includes insulating grid board and a plurality of magnetic assembly, and a plurality of magnetic assembly evenly set up at random on insulating grid board. And fixing the substrate to be plated on the cathode, wherein the substrate to be plated comprises a dry film, the dry film at least comprises a first opening and a second opening, and the first opening is smaller than the second opening. The power supply supplies power to form a plurality of electric force lines moving from the anode to the cathode. The plurality of power lines passing through the regulating plate are divergently moved and have a plurality of incident angles, so that the number of the power lines entering the first opening is less than that of the power lines entering the second opening. And forming a metal coating on the substrate to be plated.
In an embodiment of the invention, the divergent moving is that the plurality of electric lines passing through the control board have different angular distributions with respect to the control board.
In an embodiment of the invention, the divergent moving includes at least two power line groups.
In an embodiment of the invention, the power line group is defined by magnetic strengths of the plurality of magnetic elements.
In an embodiment of the invention, the first opening has a first opening angle, the second opening has a second opening angle, the first opening angle is smaller than the second opening angle, the incident angles of the power lines entering the first opening are all smaller than or equal to the first opening angle, and the incident angles of the power lines entering the second opening are all smaller than or equal to the second opening angle.
In an embodiment of the invention, the power lines with the incident angles larger than the first opening angle do not enter the first opening, and the power lines with the incident angles larger than the second opening angle do not enter the second opening.
In an embodiment of the invention, the plurality of power lines linearly move before passing through the control board.
In an embodiment of the invention, the plurality of magnetic elements are a plurality of permanent magnets, and the plurality of permanent magnets are adhered to the insulating grid plate.
In an embodiment of the invention, the plurality of magnetic elements are formed by coating a magnetic material in the mesh holes of the insulating grid plate.
Based on the above, the electroplating apparatus of the present invention has a design of the control board between the anode and the cathode, and the plurality of magnetic components of the control board are uniformly and randomly disposed on the insulating grid board, so that under the action of Lorentz force (Lorentz force) generated between the power lines and the control board, the plurality of power lines can move in a divergent manner and have a plurality of incident angles after passing through the control board, so that the number of the power lines entering the opening with the smaller size is less than the number of the power lines entering the opening with the larger size, and since the number of the power lines (which can drive the metal ion concentration) is positively correlated with the thickness of the formed metal plating layer, the number of the power lines entering the opening can be effectively screened out, so that the portion of the substrate to be plated with the circuit has the same power line density, and the problem of poor uniformity of the plating thickness of the metal plating layer on the substrate to be plated is solved.
In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
FIG. 1A is a flow chart of an electroplating method according to an embodiment of the present invention;
FIG. 1B is a schematic side view of an electroplating apparatus according to an embodiment of the invention;
FIG. 1C is a schematic top view of a control board of a plating apparatus according to an embodiment of the present invention;
fig. 2 is a partial perspective view of a regulation plate of a plating apparatus according to another embodiment of the present invention.
Detailed Description
Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.
Exemplary embodiments of the present invention will now be described more fully hereinafter with reference to the accompanying drawings, but the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In the drawings, the size and thickness of regions, regions and layers may not be drawn to scale for clarity. For ease of understanding, like elements in the following description will be described with like reference numerals.
The present invention will be described more fully with reference to the accompanying drawings of this embodiment. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. The thickness, dimensions, or dimensions of layers or regions in the figures may be exaggerated for clarity. The same or similar reference numbers denote the same or similar elements, and the description thereof will not be repeated in the following paragraphs.
Directional phrases used herein (e.g., upper, lower, right, left, front, rear, top, bottom) are used only as referring to the drawings and are not intended to imply absolute orientation.
It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.
FIG. 1A is a flow chart of an electroplating method according to an embodiment of the invention. FIG. 1B is a schematic side view of an electroplating apparatus according to an embodiment of the invention. FIG. 1B is a schematic side view of a plating apparatus according to an embodiment of the invention. Fig. 1C is a schematic top view of a control board of an electroplating apparatus according to an embodiment of the present invention.
Referring to fig. 1A, fig. 1B and fig. 1C, a main flow of an electroplating method according to an embodiment of the present invention is described below with reference to the drawings. First, a plating apparatus 100 is provided (step S100), wherein the plating apparatus 100 includes an anode 110 and a cathode 120, a power supply 130, and a regulation plate 140. Further, the power supply 130 is electrically connected to the anode 110 and the cathode 120, the control plate 140 is disposed between the anode 110 and the cathode 120 (fig. 1B schematically shows that a piece of the control plate 140 is sandwiched between the cathode 120 and the anode 110), wherein the control plate 140 includes an insulating grid plate 142 and a plurality of magnetic elements 144, and the plurality of magnetic elements 144 are uniformly and randomly disposed on the insulating grid plate 142.
In addition, the electroplating apparatus 100 may further include an electroplating tank (not shown) containing an electrolyte (including the metal ions Y to be plated), and the anode 110 and the cathode 120 are disposed in the electroplating tank. Here, the materials and kinds of the electrolytic bath, the electrolyte, the anode 110 and the cathode 120 can be adjusted according to the kind of the metal to be plated (e.g., copper plating), and the invention is not limited thereto. It should be noted that other specific details of the electroplating apparatus 100 are further described below.
Next, the substrate S to be plated is fixed on the cathode 120, wherein the substrate S to be plated includes a dry film 40, and the dry film 40 at least has a first opening 42A and a second opening 42B, and the first opening 42A is smaller than the second opening 42B (step S200). Here, the material of the dry film 40 is, for example, an insulating material, and the thickness thereof may be determined according to the actual design requirement. Then, the power supplier 130 supplies power to form a plurality of electric lines L of force (which may be a moving direction of electrons liberated after the anode 110 is electrified) moving from the anode 110 toward the cathode 120 (step S300). Further, the plurality of electric lines of force L passing through the modulation board 140 exhibit divergent movement and have a plurality of incident angles (as shown in fig. 1B), such that the number of electric lines of force L entering the first opening 42A is less than the number of electric lines of force L entering the second opening 42B (step S400). Then, a metal plating layer 10 is formed on the substrate S to be plated (step S500).
Accordingly, the electroplating apparatus 100 of the embodiment has a design of the control board 140 between the anode 110 and the cathode 120, and the plurality of magnetic elements 144 of the control board 140 are uniformly and randomly disposed on the insulating grid board 142, so that under the action of the lorentz force generated between the power lines L and the control board 140, the plurality of power lines L can move in a divergent manner and have a plurality of incident angles after passing through the control board 140, so that the number of power lines entering the opening with a smaller size (e.g., the first opening 42A in fig. 1B) is less than the number of power lines entering the opening with a larger size (e.g., the first opening 42B in fig. 1B), and since the number of power lines (which can drive the concentration of the metal ions Y) is positively correlated with the thickness of the formed metal plating layer 10, the number of power lines L entering the opening can be effectively screened out, so that the portion of the substrate S to be plated with the circuit has a consistent power line density, and the problem of poor uniformity of the plating thickness of the metal plating layer on the substrate S to be plated is solved. It should be noted that the power lines L passing through the regulation board 140 in fig. 1B have the same divergence state, which is only schematically illustrated, and does not represent the divergence state of the actual power lines L.
Here, the lorentz force may be expressed by F = q (E + v × B), where F is the lorentz force, q is the charge amount of the charged particles, E is the electric field intensity, v is the velocity of the charged particles, and B is the magnetic induction intensity. In addition, the moving direction of the electric lines of force in the present invention can be regarded as the moving direction of the metal ions Y in the electrolyte. On the other hand, the size of the opening may be defined by the opening line width, for example, the line width of the first opening 42A may be 20 micrometers (micrometer), and the line width of the second opening 42B may be 40 micrometers, but the invention is not limited thereto.
In some embodiments, the plurality of electric lines L may move linearly before passing through the conditioning plate 140, and the plurality of electric lines L may move divergently after passing through the conditioning plate, since the divergently moving may mean that the plurality of electric lines L have substantially the same intensity of the electric lines L at each angle through the conditioning plate 140, in other words, the concentration of the metal ions Y driven by the electric lines L at each angle is substantially the same, so that the plurality of electric lines L may be scattered and the amount of plated metal per unit area in the opening tends to be balanced after passing through the conditioning plate. In addition, the plurality of power lines L passing through the control board 140 have a regular angular distribution (for example, one power line L per 1 degree) with respect to the control board 140, so that the number of the power lines L entering the opening can be effectively controlled by using the sizes of the first opening 42A and the second opening 42B as a screening condition without adding an additional controller, but the invention is not limited thereto.
In some embodiments, the divergent movement includes at least two groups of power lines (4 groups of power lines are schematically shown in fig. 1B), and the groups of power lines are defined by the magnetic strengths of the plurality of magnetic elements 144, but the invention is not limited thereto.
In the embodiment, the first opening 42A has a first opening angle θ, the second opening 42B has a second opening angle δ, the first opening angle θ is smaller than the second opening angle δ, the incident angles of the power lines L entering the first opening 42A are all smaller than or equal to the first opening angle θ, and the incident angles of the power lines L entering the second opening 42B are all smaller than or equal to the second opening angle δ, that is, the second opening angle δ is larger than the first opening angle θ, so that the power lines L with a larger incident angle range can be received, but the invention is not limited thereto.
Further, the corresponding electric line of force L of the plurality of incident angles larger than the first opening angle θ does not enter the first opening 42A, and the corresponding electric line of force L of the plurality of incident angles larger than the second opening angle δ does not enter the second opening 42B, so that the screening effect can be achieved, but the invention is not limited thereto.
In some embodiments, the openings 42 may further include a third opening 42C, a third opening 42C (corresponding to an opening angle)
) Is larger than the first aperture 42A (corresponding to the aperture angle θ) and the second aperture 42B (corresponding to the aperture angle δ), the number of electric lines L entering the third aperture 42C is larger than the number of electric lines L entering the first aperture 42A and the second aperture 42B (aperture angle ÷ er)>
Larger than the opening angle δ and the opening angle θ and thus can receive the power line L of the incident angle having a large range), but the present invention is not limited thereto. Furthermore, more than the third opening angle->
The corresponding power line L does not enter the third opening 42C, so that the screening function can be achieved, but the invention is not limited thereto. Here, the line width of the third opening 42C may be 120 micrometers, but the present invention is not limited thereto.
In some embodiments, the portion of the substrate S to be plated where the circuit is to be formed may include a circuit-dense region and a circuit-open region (not shown), and the problem of poor plating thickness uniformity of the metal plating layer in the circuit-dense region is more obvious, so the electroplating apparatus 100 of this embodiment can significantly improve the problem of poor plating thickness uniformity of the metal plating layer in the circuit-dense region of the substrate S to be plated, but the present invention is not limited thereto, and the circuit-open region may also have an improvement effect.
The specific details of the electroplating apparatus 100 are further described below. In the present embodiment, the insulating grid plate 142 has a surface 142a close to the anode 110, and the plurality of magnetic elements 144 are disposed on the surface 142 a. Further, the uniform random arrangement of the plurality of magnetic elements 144 can be generated by the uniform random number generator 150 (the uniform random number generator 150 is any suitable tool known to those skilled in the art for generating uniform random numbers), for example, in the embodiment, the plurality of magnetic elements 144 are a plurality of permanent magnets disposed on the surface 142a of the insulating grid plate 142 (for example, adhered to the insulating grid plate 142), as shown in fig. 1C, the magnetic strength and the placement angle of each permanent magnet can be generated by the uniform random number generator 150, and at least two of the plurality of permanent magnets have magnetic strengths, but the invention is not limited thereto, and in other embodiments, the magnetic elements can have other different implementations.
It should be noted that fig. 1C only schematically shows the randomly distributed permanent magnets, and is not intended to limit the installation embodiment of the present disclosure, and it is within the protection scope of the present invention as long as the power line passes through the control board provided with the uniformly and randomly distributed magnetic elements and then has a plurality of incident angles with respect to the substrate to be plated.
In some embodiments, the distance between the conditioning plate 140 and the substrate S to be plated may be between 2 millimeters (mm) and 8 centimeters (cm), but the present invention is not limited thereto.
In some embodiments, the substrate S to be plated may further include a seed layer (seed layer) 30, and thus the metal plating layer 10 may be plated on the seed layer 30, but the invention is not limited thereto.
It should be noted that, the following embodiments follow the reference numerals and parts of the contents of the above embodiments, wherein the same or similar reference numerals are used to indicate the same or similar components, and the descriptions of the same technical contents are omitted, and the descriptions of the omitted parts can refer to the foregoing embodiments, and the following embodiments are not repeated.
Fig. 2 is a partial perspective view of a regulation plate of an electroplating apparatus according to another embodiment of the present invention.
Referring to fig. 2, compared to the regulation plate 140 of fig. 1C, the magnetic elements 244 of the regulation plate 240 of the present embodiment are formed by disposing (e.g., coating) a set of magnetic materials in the meshes 242a of the insulating grid plate 242, wherein the disposed positions of the magnetic materials are generated by the uniform random number generator 150.
Further, a group of magnetic materials may include a first magnetic material 244a and a second magnetic material 244b, the mesh 242a may be a hexagonal honeycomb grid, and the first magnetic material 244a and the second magnetic material 244b are respectively disposed on a pair of opposite sidewalls within the hexagonal honeycomb grid to form a north-pointing pole (N pole) and a south-pointing pole (S pole) (forming a magnetic force direction), wherein the magnetic force direction formed within each mesh 242a may be different, but the present invention is not limited thereto.
In summary, the electroplating apparatus of the present invention has a design of the control board between the anode and the cathode, and the plurality of magnetic elements of the control board are uniformly and randomly disposed on the insulating grid board, so that under the action of the lorentz force generated between the power lines and the control board, the plurality of power lines can move in a divergent manner and have a plurality of incident angles after passing through the control board, so that the number of the power lines entering the opening with smaller size is less than the number of the power lines entering the opening with larger size, and since the number of the power lines (which can drive the metal ion concentration) is positively correlated with the thickness of the formed metal coating, the number of the power lines entering the opening can be effectively screened out, so that the portion of the substrate to be plated on which the circuit is to be formed has the same power line density, and the problem of poor uniformity of the electroplating thickness of the metal coating on the substrate to be plated is solved.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and these modifications or substitutions do not depart from the spirit of the corresponding technical solutions of the embodiments of the present invention.
Claims (19)
1. An electroplating apparatus, comprising:
an anode and a cathode;
a power supply electrically connected to the anode and the cathode; and
and the regulating plate is arranged between the anode and the cathode, wherein the regulating plate comprises an insulating grid plate and a plurality of magnetic assemblies, and the plurality of magnetic assemblies are uniformly and randomly arranged on the insulating grid plate.
2. The electroplating apparatus of claim 1, wherein the uniform random arrangement of the plurality of magnetic assemblies is generated by a uniform random number generator.
3. The electroplating apparatus of claim 2, wherein the plurality of magnetic assemblies are a plurality of permanent magnets.
4. The electroplating apparatus according to claim 3, wherein the magnetic strength and the angle of arrangement of each permanent magnet are generated by the uniform random number generator.
5. The plating apparatus as recited in claim 3, wherein said plurality of permanent magnets have at least two magnetic strengths.
6. The plating apparatus as recited in claim 3, wherein said plurality of permanent magnets are disposed on a surface of said insulating grid plate adjacent to said anode.
7. The electroplating apparatus of claim 2, wherein the plurality of magnetic assemblies are formed by disposing a set of magnetic materials within the meshes of the insulating grid plate.
8. The plating apparatus as recited in claim 7, wherein the set of magnetic material placement locations are generated by the uniform random number generator.
9. The plating apparatus as recited in claim 7, wherein said mesh is a hexagonal honeycomb grid.
10. The electroplating apparatus of claim 9, wherein the set of magnetic materials comprises a first magnetic material and a second magnetic material disposed on a pair of opposing sidewalls within the hexagonal honeycomb grid, respectively, to form a north and south-pointing pole.
11. An electroplating method, comprising:
providing an electroplating apparatus, wherein the electroplating apparatus comprises:
an anode and a cathode;
a power supply electrically connected to the anode and the cathode; and
the regulation and control plate is arranged between the anode and the cathode, and comprises an insulating grid plate and a plurality of magnetic components which are uniformly and randomly arranged on the insulating grid plate;
fixing a substrate to be plated on the cathode, wherein the substrate to be plated comprises a dry film, the dry film at least comprises a first opening and a second opening, and the first opening is smaller than the second opening;
the power supply supplies power to form a plurality of electric lines of force moving from the anode to the cathode;
the plurality of power lines passing through the regulating plate are divergently moved and have a plurality of incident angles, so that the number of the power lines entering the first opening is less than the number of the power lines entering the second opening; and
and forming a metal coating on the substrate to be plated.
12. The plating method as recited in claim 11, wherein said divergent movement is such that said plurality of electric lines of force passing through said regulation plate have respective distributions of different angles with respect to said regulation plate.
13. The electroplating method of claim 11, wherein the divergent movement comprises at least two groups of electric field lines.
14. The electroplating method of claim 13, wherein the groups of power lines are defined by magnetic strengths of the plurality of magnetic elements.
15. The plating method as recited in claim 11, wherein the first opening has a first opening angle, the second opening has a second opening angle, the first opening angle is smaller than the second opening angle, the incident angles of the electric lines of force entering the first opening are all equal to or smaller than the first opening angle, and the incident angles of the electric lines of force entering the second opening are all equal to or smaller than the second opening angle.
16. The plating method as recited in claim 15, wherein the respective power lines of the plurality of incident angles larger than the first opening angle do not enter the first opening, and the respective power lines of the plurality of incident angles larger than the second opening angle do not enter the second opening.
17. The plating method as recited in claim 11, wherein said plurality of power lines exhibit linear movement before passing through said regulation plate.
18. The electroplating method according to claim 11, wherein the plurality of magnetic elements are a plurality of permanent magnets, and the plurality of permanent magnets are adhered to the insulating grid plate.
19. The electroplating method of claim 11, wherein the plurality of magnetic elements are formed by applying a magnetic material to the apertures of the insulating grid plate.
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| US202163255438P | 2021-10-14 | 2021-10-14 | |
| US63/255,438 | 2021-10-14 |
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| CN115976608A true CN115976608A (en) | 2023-04-18 |
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| CN202210164120.XA Pending CN115976614A (en) | 2021-10-14 | 2022-02-22 | Electroplating apparatus and electroplating method |
| CN202210259976.5A Pending CN115976607A (en) | 2021-10-14 | 2022-03-16 | Electroplating apparatus and electroplating method |
| CN202210354578.1A Pending CN115976608A (en) | 2021-10-14 | 2022-04-06 | Electroplating apparatus and electroplating method |
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| CN202210259976.5A Pending CN115976607A (en) | 2021-10-14 | 2022-03-16 | Electroplating apparatus and electroplating method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6632335B2 (en) * | 1999-12-24 | 2003-10-14 | Ebara Corporation | Plating apparatus |
| US6802946B2 (en) * | 2000-12-21 | 2004-10-12 | Nutool Inc. | Apparatus for controlling thickness uniformity of electroplated and electroetched layers |
| JP2005023389A (en) * | 2003-07-04 | 2005-01-27 | Seiko Epson Corp | Electroplating method, and electroplating apparatus |
| CN1831204A (en) * | 2005-03-08 | 2006-09-13 | 上海艾比西材料科技有限公司 | Method and equipment for electroplating superthick and multiple-hole metals |
| CN101275267B (en) * | 2007-03-26 | 2011-05-25 | 旭明光电股份有限公司 | Thickness evenness-improved electroplating apparatus and electroplating method |
| JP7256708B2 (en) * | 2019-07-09 | 2023-04-12 | 株式会社荏原製作所 | Plating equipment |
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| TW202315988A (en) | 2023-04-16 |
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