CN115976614A - Electroplating apparatus and electroplating method - Google Patents
Electroplating apparatus and electroplating method Download PDFInfo
- Publication number
- CN115976614A CN115976614A CN202210164120.XA CN202210164120A CN115976614A CN 115976614 A CN115976614 A CN 115976614A CN 202210164120 A CN202210164120 A CN 202210164120A CN 115976614 A CN115976614 A CN 115976614A
- Authority
- CN
- China
- Prior art keywords
- metal
- cathode
- recited
- plating
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The invention provides electroplating equipment, which comprises an electroplating bath, an anode, a cathode, a power supply and a regulation and control plate. The plating bath contains an electrolyte. The anode and the cathode are both arranged in the electroplating bath. The power supply is electrically connected to the anode and the cathode. The regulating plate is arranged between the anode and the cathode. The regulating plate comprises a plurality of meshes and a plurality of metal sheets, and at least a part of the metal sheets are electrically connected with the cathode. An electroplating method is also provided.
Description
Technical Field
The present invention relates to an apparatus and a method, and more particularly, to an electroplating apparatus and an electroplating method.
Background
Electroplating has been widely used in various fields, and is also used in the manufacture of circuit boards, semiconductor chips, LED conductive substrates, and semiconductor packages, in addition to the conventional surface treatment method, and the electroplating often has a problem of uniformity of plating thickness of a metal plating layer.
For example, in the manufacturing process of a circuit board, when a power line between an anode and a cathode approaches a substrate to be plated, the power line is often influenced by the characteristics of a film layer thereon (e.g., insulation characteristics or other characteristics that influence power distribution), and the power line density distribution is not uniform.
Disclosure of Invention
The invention provides electroplating equipment and an electroplating method, which can solve the problem of poor electroplating thickness uniformity of a metal coating on a substrate to be plated.
The invention relates to electroplating equipment, which comprises an electroplating bath, an anode, a cathode, a power supply and a regulating plate. The plating bath contains an electrolyte. The anode and the cathode are both arranged in the electroplating bath. The power supply is electrically connected to the anode and the cathode. The regulating plate is arranged between the anode and the cathode. The regulating plate comprises a plurality of meshes and a plurality of metal sheets, and at least a part of the metal sheets are electrically connected with the cathode.
In an embodiment of the invention, the plurality of meshes are a part of an insulating grid plate, the plurality of metal sheets are disposed on the insulating grid plate, and the plurality of metal sheets are all electrically connected to the cathode.
In an embodiment of the present invention, only the plurality of meshes form the channels.
In an embodiment of the invention, the electroplating apparatus further includes a plurality of wires connecting the plurality of metal sheets in a one-to-one manner.
In an embodiment of the invention, the electroplating apparatus further includes a controller connected to the plurality of wires, wherein the current of the plurality of wires is converged to the cathode through the controller.
In an embodiment of the invention, the meshes are complementary to the metal sheets.
In an embodiment of the invention, the plurality of meshes are a part of an insulating grid plate, the plurality of metal sheets are arranged on the insulating grid plate in an array, a part of the metal sheets are electrically connected to the cathode, and another part of the metal sheets are not electrically connected to the cathode.
In an embodiment of the invention, each of the metal sheets includes at least one hole, and the at least one hole and the plurality of meshes form a channel.
In an embodiment of the invention, the electroplating apparatus further includes a plurality of wires connecting the plurality of metal sheets in a one-to-one manner.
In an embodiment of the invention, the electroplating apparatus further includes a controller connected to the plurality of wires, wherein the controller is configured to control an electrical connection state of the control board.
The electroplating method at least comprises the following steps. An electroplating apparatus is provided, wherein the electroplating apparatus comprises an electroplating bath, an anode, a cathode, a power supply and a control plate. The plating bath contains an electrolyte. The anode and the cathode are both arranged in the electroplating bath. The power supply is electrically connected to the anode and the cathode. The regulating plate is arranged between the anode and the cathode. The regulating plate comprises a plurality of meshes and a plurality of metal sheets, and at least a part of the metal sheets are electrically connected with the cathode. And fixing the substrate to be plated on the cathode. After the power supply supplies power, a plurality of electric lines of force are formed between the anode and the cathode, and the electric lines of force move from the anode to the cathode. And a part of the plurality of electric lines drives a part of a plurality of metal ions in the electrolyte to form a first metal coating on the substrate to be plated through the regulating and controlling plate. The other part of the plurality of electric lines drives the other part of the plurality of metal ions in the electrolyte to form a second metal coating on the regulating plate.
In an embodiment of the invention, the plurality of meshes are a part of an insulating grid plate, the plurality of metal sheets are disposed on the insulating grid plate, and the plurality of metal sheets are all electrically connected to the cathode, so that the plurality of metal sheets all have the second metal plating layer thereon.
In an embodiment of the invention, the meshes are complementary to the metal sheets.
In an embodiment of the invention, the electroplating apparatus further includes a plurality of wires connecting the plurality of metal sheets in a one-to-one manner.
In an embodiment of the invention, the electroplating apparatus further includes a controller connected to the plurality of wires, wherein the current of the plurality of wires is converged to the cathode through the controller.
In an embodiment of the invention, the substrate to be plated includes a dry film having a plurality of openings, and the mesh pairs are located in the openings.
In an embodiment of the invention, the plurality of meshes are a part of an insulating grid plate, the plurality of metal sheets are arranged on the insulating grid plate in an array, and only a part of the metal sheets are electrically connected to the cathode, so that the second metal plating layer is formed on only a part of the metal sheets.
In an embodiment of the invention, each of the metal sheets includes at least one hole, and the hole of the metal sheet without the second metal plating layer and the plurality of meshes form a channel.
In an embodiment of the invention, the electroplating apparatus further includes a plurality of wires connecting the plurality of metal sheets in a one-to-one manner.
In an embodiment of the invention, the electroplating apparatus further includes a controller connected to the plurality of wires, wherein the controller is configured to control an electrical connection state of the control board.
Based on the above, the electroplating apparatus of the present invention has the design of the control plate between the anode and the cathode, so that a part of the plurality of power lines moving from the anode to the cathode can drive a part of the metal ions in the electrolyte to form the metal coating on the substrate to be plated through the mesh of the control plate, and another part of the plurality of power lines can drive another part of the metal ions in the electrolyte to form the metal coating on the metal sheet on the control plate, so that the distribution of the power lines can be redistributed, the part of the substrate to be plated on which the circuit is to be formed has the same power line density, and the problem of poor uniformity of the electroplating thickness of the metal coating on the substrate to be plated can be further improved.
In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
FIG. 1A is a flow chart of an electroplating method according to an embodiment of the present invention;
FIG. 1B is a schematic side view of an electroplating apparatus according to an embodiment of the invention;
FIG. 1C is a schematic top view of a control board of a plating apparatus according to an embodiment of the present invention;
fig. 1D is a schematic top view of a regulating plate according to another embodiment of the present invention.
Detailed Description
Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.
Exemplary embodiments of the present invention will now be described more fully hereinafter with reference to the accompanying drawings, but the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In the drawings, the size and thickness of regions, regions and layers may not be drawn to scale for clarity. For ease of understanding, like elements in the following description will be described with like reference numerals.
The present invention will be described more fully with reference to the accompanying drawings of this embodiment. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. The thickness, dimensions, or dimensions of layers or regions in the figures may be exaggerated for clarity. The same or similar reference numbers refer to the same or similar elements, and the following paragraphs will not be repeated.
Directional phrases used herein (e.g., upper, lower, right, left, front, rear, top, bottom) are used only as referring to the drawings and are not intended to imply absolute orientation.
It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section.
Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.
FIG. 1A is a flow chart of an electroplating method according to an embodiment of the invention. FIG. 1B is a schematic side view of an electroplating apparatus according to an embodiment of the invention. Fig. 1C is a schematic top view of a control board of a plating apparatus according to an embodiment of the present invention. Fig. 1D is a schematic top view of a regulating plate according to another embodiment of the present invention.
Referring to fig. 1A, fig. 1B and fig. 1C, a main flow of an electroplating method according to an embodiment of the present invention is described below with reference to the drawings. First, an electroplating apparatus 100 is provided, wherein the electroplating apparatus 100 includes an electroplating tank 110, an anode 120, a cathode 130, a power supply 140, and a control board 150 (step S100). Further, the plating tank 110 contains the electrolyte 112, the anode 120 and the cathode 130 are disposed in the plating tank 110, the power supply 140 is electrically connected to the anode 120 and the cathode 130, and the control plate 150 is disposed between the anode 120 and the cathode 130 (fig. 1B schematically shows that one control plate 150 is sandwiched between the cathode 130 and two anodes 120), wherein the control plate 150 includes a plurality of meshes 152 and a plurality of metal sheets 154, and at least a portion of the metal sheets 154 is electrically connected to the cathode 130. Here, the materials and kinds of the electrolytic cell 110, the electrolyte 112, the anode 120, and the cathode 130 can be adjusted according to the kind of the metal to be plated (e.g., copper plating), and the invention is not limited thereto. In addition, the metal sheet 154 electrically connected to the cathode 130 may have the same mechanism of reducing metal as the cathode 130. It should be noted that other specific details of the electroplating apparatus 100 are further described below.
Next, the substrate S to be plated is fixed on the cathode 130 (step S200). Then, after the power supply 140 supplies power, a plurality of electric lines L (which may be a moving direction of electrons dissociated after the anode 120 is powered) are formed between the anode 120 and the cathode 130, and the plurality of electric lines L move from the anode 120 to the cathode 130 (step S300). Next, a portion of the plurality of electric flux lines L (e.g., the electric flux line L1 in fig. 1B) drives a portion of the plurality of metal ions Y in the electrolyte 112 to form a first metal plating layer 10 on the substrate S to be plated through the control board 150 (step S400). In addition, another part of the plurality of electric lines L (e.g., L2 in fig. 1B) drives another part of the plurality of metal ions Y in the electrolyte 112 to form the second metal plating layer 20 on the adjustment plate 150 (step S500). Here, a plurality of electric lines L may be parallel and uniformly emitted from the anode 120, and the electric lines L also parallel and uniformly reach the substrate S to be plated.
Accordingly, the electroplating apparatus 100 of the embodiment has the design of the control board 150 between the anode 120 and the cathode 130, so that a part of the plurality of power lines L (power lines L1) moving from the anode 120 toward the cathode 130 can drive a part of the metal ions Y in the electrolyte 112 to form the metal plating layer (the first metal plating layer 10) on the substrate S to be plated through the mesh 152 of the control board 150, and another part of the plurality of power lines L (power lines L2) can drive another part of the metal ions Y in the electrolyte 112 to form the metal plating layer (the second metal plating layer 20) on the metal sheet 154 of the control board 150, so that the distribution of the power lines L can be redistributed, the part of the substrate S to be plated to form the circuit has the same power line density, and the problem of poor uniformity of the plating thickness of the metal plating layer (the first metal plating layer 10) on the substrate S to be plated can be improved.
In some embodiments, the metal ions Y may be copper ions (Cu 2 +), and thus the first metal plating layer 10 on the substrate S to be plated and the second metal plating layer 20 on the control board 150 may be reduced copper, but the invention is not limited thereto.
In the present embodiment, the mesh 152 is a part of the insulating mesh plate 30, the metal sheets 154 are disposed on the insulating mesh plate 30, and the metal sheets 154 are all electrically connected to the cathode 130, so that the metal sheets 154 all have the second metal plating layer 20 thereon. Further, the manufacturing method of the adjustment plate 150 of the present embodiment includes the following steps, for example. First, an insulating grid plate 30 having substantially the same size as the substrate S to be plated is provided, wherein the insulating grid plate 30 includes grid lines 32 and mesh holes 152 defined by the grid lines 32. Next, a metal plate (e.g., a full copper plate) is attached to the insulating grid plate 30. The desired pattern is then etched, followed by a nickel-gold or nickel-palladium-gold or other metal resist (not shown) that is not attacked by the etchant, as is the subsequent Barrier layer (Stop Barrier) to copper strip (as in the pattern formed by the plurality of metal strips 154 in fig. 1C). Or the metal plate is directly made of metal (such as stainless steel) which can not be attacked by the etching solution, and the metal plate is firstly patterned and then adhered to the insulating grid plate 30, so that the metal protection layer is not needed.
Further, the substrate S to be plated may include a dry film 40 having a plurality of openings 42, and the metal corresponding to the positions of the openings 42 of the dry film 40 is etched away (a plurality of meshes 152 may be aligned to the plurality of openings 42), so that the electric lines of force L pass through, and the metal corresponding to the positions of the covering portions 44 of the dry film 40 is retained, so that the electric lines of force L are electrically connected to the cathode 130, so that the electric lines of force L drive the metal ions Y to plate upwards, and the electric lines of force L are terminated on the metal sheets 154, and thus the shapes of the plurality of meshes 152 and the plurality of metal sheets 154 may be complementary, but the invention is not limited thereto. Here, the material of the dry film 40 is, for example, an insulating material.
It should be noted that the present invention is not limited to the above-mentioned form of the regulating plate 150, please refer to fig. 1C and fig. 1D, the regulating plate can be replaced with a regulating plate 150A according to another embodiment, wherein the difference between the regulating plate 150A and the regulating plate 150 is as follows: the plurality of metal sheets 154A are arranged in an array on the insulating grid plate 30, a portion of the metal sheets 154A is electrically connected to the cathode 130, and another portion of the metal sheets 154A is not electrically connected to the cathode 130, in other words, only a portion of the metal sheets 154A is electrically connected to the cathode 130, so that only a portion of the metal sheets 154A has the second metal plating layer 20 formed thereon.
Further, in the embodiment of fig. 1C, only the plurality of meshes 152 may form channels so that the electric flux lines L and the metal ions Y pass through, in other words, the electric flux lines L and the metal ions Y do not pass through the metal sheets 154, and in the embodiment of fig. 1D, each metal sheet 154A includes at least one hole H, and the holes H of the metal sheet 154A on which the second metal plating layer 20 is not formed (the metal sheet 154A not electrically connected to the cathode 130) may form channels with the plurality of meshes 152 (some or all of the other meshes 152 may also form channels individually). Here, although the holes H in fig. 1D are shown as circular, the invention is not limited to the shape of the holes H, such as rectangular or polygonal, and the number of the holes H per one metal sheet 154A is not limited to one, and the number of the holes H can be determined according to the actual design requirement. In addition, in the embodiment of fig. 1D, the metal sheet 154A is, for example, a steel sheet or other metal that is less likely to be etched, and may be disposed in such a manner that one metal sheet 154A corresponds to a plurality of meshes 152, but the invention is not limited thereto.
In some embodiments, the electroplating apparatus 100 further comprises a plurality of wires 160, wherein the plurality of wires 160 connect the plurality of metal sheets 154/metal sheets 154A in a one-to-one manner. It should be noted that fig. 1C and 1D are only schematically illustrated as having a plurality of wires 160 for illustration, and the connection details of the wires 160 and the metal sheets 154/154A are not actually illustrated.
In addition, in the embodiment of fig. 1C, the electroplating apparatus 100 further includes a controller 170, wherein the controller 170 is connected to the plurality of wires 160, so that the current of the plurality of wires 160 can be converged to the cathode 130 through the controller 170, and in the embodiment of fig. 1D, the controller 170 can further be used to control the electrical connection state of the plurality of wires 160, for example, the controller 170 can only make a part of the wires 160 conductive (the metal piece 154A is electrically connected to the cathode 130), so that only a part of the metal piece 154A is formed with the second metal plating layer 20, in other words, the controller 170 can make another part of the wires 160 non-conductive (the metal piece 154A is not electrically connected to the cathode 130), so that the other part of the metal piece 154A is not formed with the second metal plating layer 20, and the power line L can pass through the hole H of the metal piece 154A, but the invention is not limited thereto.
In some embodiments, the portion of the substrate S to be plated where the circuit is to be formed may include a circuit-dense region and a circuit-open region (not shown), and the problem of poor plating thickness uniformity of the metal plating layer in the circuit-dense region is more obvious, so the electroplating apparatus 100 of this embodiment can significantly improve the problem of poor plating thickness uniformity of the metal plating layer in the circuit-dense region of the substrate S to be plated, but the present invention is not limited thereto, and the circuit-open region may also have an improvement effect.
In some embodiments, the substrate S to be plated may further include a seed layer (seed layer) 50, and thus the first metal plating layer 10 may be plated on the seed layer 50, but the invention is not limited thereto.
In some embodiments, the shape of the mesh 152 may also be determined according to actual design requirements, and the invention is not limited thereto.
In some embodiments, the distance between the conditioning plate 150 and the substrate S to be plated may be between 2 millimeters (mm) and 5 centimeters (cm), but the invention is not limited thereto.
In some embodiments, the electroplating apparatus 100 further comprises a chuck 180 and a nozzle (not shown), wherein the chuck 180 is configured to hold the substrate S to be plated and the nozzle is configured to improve the mass transfer of the metal ions, but the invention is not limited thereto.
In some embodiments, the metal plating layer formed on the control board may be stripped by using an etching solution after the electroplating is completed, so that the control board may be recycled, thereby reducing the overall electroplating cost, but the invention is not limited thereto.
In summary, the electroplating apparatus of the present invention has a design of the control plate between the anode and the cathode, so that a part of the plurality of power lines moving from the anode toward the cathode can drive a part of the metal ions in the electrolyte to form a metal coating on the substrate to be plated through the mesh of the control plate, and another part of the plurality of power lines can drive another part of the metal ions in the electrolyte to form a metal coating on the metal sheet on the control plate, thereby redistributing the distribution of the power lines, so that the part of the substrate to be plated on which the circuit is to be formed has a uniform power line density, and further improving the problem of poor uniformity of the electroplating thickness on the substrate to be plated.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (20)
1. An electroplating apparatus, comprising:
an electroplating bath containing an electrolyte;
an anode and a cathode both disposed within the plating bath;
a power supply electrically connected to the anode and the cathode; and
and the regulating plate is arranged between the anode and the cathode, wherein the regulating plate comprises a plurality of meshes and a plurality of metal sheets, and at least one part of the metal sheets is electrically connected with the cathode.
2. The plating apparatus as recited in claim 1, wherein the plurality of meshes are part of an insulating mesh plate, the plurality of metal pieces are disposed on the insulating mesh plate, and the plurality of metal pieces are all electrically connected to the cathode.
3. The plating apparatus as recited in claim 2, wherein only said plurality of meshes form channels.
4. The plating apparatus as recited in claim 2, further comprising a plurality of wires connecting said plurality of metal pieces in a one-to-one manner.
5. The plating apparatus as recited in claim 4, further comprising a controller connected to said plurality of wires, wherein a current of said plurality of wires is converged to said cathode through said controller.
6. The plating apparatus as recited in claim 2, wherein said plurality of mesh openings are complementary in shape to said plurality of metal sheets.
7. The plating apparatus as recited in claim 1, wherein said plurality of meshes are part of an insulating mesh plate, said plurality of metal pieces are arrayed on said insulating mesh plate, one part of said metal pieces is electrically connected to said cathode, and another part of said metal pieces is not electrically connected to said cathode.
8. The plating apparatus as recited in claim 7, wherein each of said metal sheets includes at least one hole, and said at least one hole and said plurality of mesh openings form a channel.
9. The plating apparatus as recited in claim 7, further comprising a plurality of wires connecting said plurality of metal pieces in a one-to-one manner.
10. The plating apparatus as recited in claim 9, further comprising a controller connected to the plurality of wires, wherein the controller is configured to control an electrical connection state of the conditioning plate.
11. An electroplating method, comprising:
providing an electroplating apparatus, wherein the electroplating apparatus comprises:
an electroplating bath containing an electrolyte;
an anode and a cathode both disposed within the plating bath;
a power supply electrically connected to the anode and the cathode;
the regulating plate is arranged between the anode and the cathode, wherein the regulating plate comprises a plurality of meshes and a plurality of metal sheets, and at least one part of the metal sheets is electrically connected with the cathode;
fixing a substrate to be plated on the cathode;
after the power supply supplies power, a plurality of electric lines of force are formed between the anode and the cathode, and move from the anode to the cathode;
a part of the plurality of power lines drives a part of a plurality of metal ions in the electrolyte to form a first metal coating on the substrate to be plated through the regulating plate; and
and driving another part of the plurality of metal ions in the electrolyte to form a second metal plating layer on the regulating plate by another part of the plurality of electric lines.
12. The electroplating method of claim 11, wherein the plurality of mesh openings are part of an insulating mesh plate, the plurality of metal sheets are disposed on the insulating mesh plate, and the plurality of metal sheets are all electrically connected to the cathode such that the plurality of metal sheets all have the second metal plating layer thereon.
13. The electroplating method of claim 12, wherein the plurality of mesh openings are complementary to the shape of the plurality of metal sheets.
14. The plating method as recited in claim 12, wherein said plating apparatus further comprises a plurality of wires connecting said plurality of metal pieces in a one-to-one manner.
15. The plating method as recited in claim 14, wherein said plating apparatus further comprises a controller connected to said plurality of wires, wherein the electric current of said plurality of wires is converged to said cathode through said controller.
16. The electroplating method according to claim 12, wherein the substrate to be plated comprises a dry film having a plurality of openings, and the mesh pairs are located at the openings.
17. The plating method as recited in claim 11, wherein the plurality of mesh openings are a portion of an insulating mesh plate, the plurality of metal pieces are arrayed on the insulating mesh plate, and only a portion of the metal pieces are electrically connected to the cathode, so that the second metal plating layer is formed on only a portion of the metal pieces.
18. The electroplating method of claim 17, wherein each metal sheet comprises at least one hole, and the holes and the plurality of mesh openings of the metal sheet without the second metal plating layer form channels.
19. The plating method as recited in claim 17, wherein the plating apparatus further comprises a plurality of wires, and the plurality of metal pieces are electrically connected to the plurality of wires in a one-to-one manner.
20. The plating method as recited in claim 19, wherein said plating apparatus further comprises a controller configured to control an electrical connection state of said plurality of wires.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163255438P | 2021-10-14 | 2021-10-14 | |
| US63/255,438 | 2021-10-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115976614A true CN115976614A (en) | 2023-04-18 |
Family
ID=85961140
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210164120.XA Pending CN115976614A (en) | 2021-10-14 | 2022-02-22 | Electroplating apparatus and electroplating method |
| CN202210259976.5A Pending CN115976607A (en) | 2021-10-14 | 2022-03-16 | Electroplating apparatus and electroplating method |
| CN202210354578.1A Pending CN115976608A (en) | 2021-10-14 | 2022-04-06 | Electroplating apparatus and electroplating method |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210259976.5A Pending CN115976607A (en) | 2021-10-14 | 2022-03-16 | Electroplating apparatus and electroplating method |
| CN202210354578.1A Pending CN115976608A (en) | 2021-10-14 | 2022-04-06 | Electroplating apparatus and electroplating method |
Country Status (2)
| Country | Link |
|---|---|
| CN (3) | CN115976614A (en) |
| TW (3) | TWI801144B (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6632335B2 (en) * | 1999-12-24 | 2003-10-14 | Ebara Corporation | Plating apparatus |
| US6802946B2 (en) * | 2000-12-21 | 2004-10-12 | Nutool Inc. | Apparatus for controlling thickness uniformity of electroplated and electroetched layers |
| JP2005023389A (en) * | 2003-07-04 | 2005-01-27 | Seiko Epson Corp | Electroplating method, and electroplating apparatus |
| CN1831204A (en) * | 2005-03-08 | 2006-09-13 | 上海艾比西材料科技有限公司 | Method and equipment for electroplating superthick and multiple-hole metals |
| CN101275267B (en) * | 2007-03-26 | 2011-05-25 | 旭明光电股份有限公司 | Thickness evenness-improved electroplating apparatus and electroplating method |
| JP7256708B2 (en) * | 2019-07-09 | 2023-04-12 | 株式会社荏原製作所 | Plating equipment |
-
2022
- 2022-02-22 CN CN202210164120.XA patent/CN115976614A/en active Pending
- 2022-02-22 TW TW111106298A patent/TWI801144B/en active
- 2022-03-16 CN CN202210259976.5A patent/CN115976607A/en active Pending
- 2022-03-16 TW TW111109527A patent/TWI826956B/en active
- 2022-04-06 TW TW111113003A patent/TWI816352B/en active
- 2022-04-06 CN CN202210354578.1A patent/CN115976608A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TWI816352B (en) | 2023-09-21 |
| TWI826956B (en) | 2023-12-21 |
| CN115976608A (en) | 2023-04-18 |
| CN115976607A (en) | 2023-04-18 |
| TW202315983A (en) | 2023-04-16 |
| TWI801144B (en) | 2023-05-01 |
| TW202315987A (en) | 2023-04-16 |
| TW202315988A (en) | 2023-04-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101743639B (en) | Contact structure for a semiconductor component and a method for production thereof | |
| US8252154B2 (en) | Electroplating apparatus | |
| US20120111610A1 (en) | Heat-radiating substrate and method for manufacturing the same | |
| KR20140130636A (en) | Anisotropic high resistance ionic current source | |
| US11665829B2 (en) | Method for manufacturing wiring board | |
| JP5652587B2 (en) | Method for producing copper-coated polyimide substrate and electroplating apparatus | |
| TWI383475B (en) | Plating apparatus | |
| JP2008088522A (en) | Pattern-plating method | |
| CN101720170A (en) | Flexible print wiring plate and its manufacturing method | |
| CN115976614A (en) | Electroplating apparatus and electroplating method | |
| KR102213335B1 (en) | A jig for electroplating | |
| US20230120741A1 (en) | Electroplating apparatus and electroplating method | |
| TW202233903A (en) | Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate | |
| JP2015086444A (en) | Electrolytic plating apparatus | |
| CN110892095B (en) | Method and apparatus for manufacturing printed wiring board | |
| CN101460017B (en) | Thru-hole electroplating method for printed circuit board | |
| CN101368284B (en) | Electroplating apparatus | |
| US11859302B2 (en) | Electroplating apparatus and electroplating method | |
| JP6156101B2 (en) | Substrate manufacturing jig and substrate manufacturing method | |
| US11686008B2 (en) | Electroplating apparatus and electroplating method | |
| KR101142323B1 (en) | Apparatus for plating substrate | |
| JP7316908B2 (en) | anode assembly | |
| CN113747675A (en) | Etching method of circuit board and circuit board manufactured by same | |
| KR20230160749A (en) | Half etching processing method using an external electric field as an external charged body | |
| JP2001237511A (en) | Substrate with plating bump and its manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |