CN115881605A - Pickup device and electronic component mounting device - Google Patents

Abstract

The invention provides a pickup device for picking up an electronic component and a mounting device for the electronic component, which can suppress the influence of generated particles. The pickup device of the embodiment includes: a pickup chuck that holds and picks up the electronic part; an arm part having a pickup chuck at one end and a space inside; and a reverse driving unit that has a support portion that supports the pickup chuck and a rotary shaft that protrudes from an inner space of the arm portion through a through hole provided in the arm portion and is connected to the support portion, and that rotates the support portion using the rotary shaft to reverse the pickup chuck, wherein the pickup device is provided with a suction hole that communicates with a space including the rotary shaft in the arm portion and an outer space of the arm portion, and that supplies negative pressure to a position facing the rotary shaft.

Description

Pickup device and electronic component mounting device

Technical Field

The present invention relates to a pickup device and an electronic component mounting device.

Background

As a method of mounting electronic components such as logic (logic), memory (memory), and image sensor on a substrate as a semiconductor chip (chip), there are methods called a face-up (front-up) method and a face-down (front-down) method. A surface (functional surface) of an electronic component on which a fine circuit is formed is referred to as a front surface (face). The method of mounting the electronic component with the front surface side directed upward (opposite to the substrate side) is a front surface-up type. For example, when electronic components are mounted on lead frames (lead frames) or the like and wiring is performed between electrodes and the frames by wires (wires), the mounting is performed in a front-up manner.

A method of mounting an electronic component with its front side facing downward (substrate side) is a front-side-down type. For example, when a flip chip (flip chip) connection for fixing and electrically connecting is performed by providing a bump electrode on the surface of a semiconductor layer and pressing the bump electrode against a wiring of a substrate, mounting is performed by a front-surface-down method.

When such an electronic component is mounted on a substrate, a wafer on which a semiconductor element is formed is cut and singulated to produce semiconductor chips (electronic components). The electronic component is attached to a wafer sheet which is an adhesive sheet. Then, the following operations are performed: the electronic components are picked up one by one from a wafer sheet and transferred to a substrate for mounting.

[ Prior art documents ]

[ patent document ]

[ patent document 1] Japanese patent application laid-open No. 2010-129913

Disclosure of Invention

[ problems to be solved by the invention ]

In a mounting apparatus for picking up electronic components one by one from a wafer sheet and transferring the electronic components to a substrate for mounting, in a pickup apparatus for picking up electronic components, a pickup chuck for holding the electronic components by suction is positioned so as to face the electronic component to be picked up, and is moved toward the electronic component, and is brought into contact with the electronic component and held by suction to move away from the wafer sheet, thereby picking up the electronic component. Thereafter, the picked-up electronic component is handed over to a mounting tool that mounts the electronic component on a substrate. Accordingly, the pick-up chuck holding the picked-up electronic part moves to a position where the electronic part is handed over to the mounting tool. Dust (hereinafter referred to as particles) is generated from each operating mechanism of the pickup device that picks up and delivers the electronic component to the mounting tool.

In particular, in order to mount the front-face down type, a reversing mechanism for reversing the functional surface is generally added to the pickup device, and therefore, the possibility of particle generation becomes further high. For example, when picking up an electronic part from a wafer sheet, particles are generated due to the operation of the reversing mechanism. If such particles adhere to electronic components before mounting, such as picked-up electronic components or electronic components attached to a chip sheet, adverse effects such as mounting failure and connection failure occur.

Embodiments of the present invention have been made to solve the above-described problems, and an object thereof is to provide a pickup device and an electronic component mounting apparatus capable of picking up an electronic component while suppressing the influence of generated particles.

[ means for solving the problems ]

The pickup device of the embodiment of the present invention includes: a pickup chuck that holds and picks up the electronic part; an arm portion having a space therein and having the pickup chuck at one end thereof; and a reverse driving unit that has a support portion that supports the pickup chuck and a rotary shaft that protrudes from an inner space of the arm portion through a through hole provided in the arm portion and is connected to the support portion, and that rotates the support portion by the rotary shaft to reverse the pickup chuck, wherein the pickup device is provided with an air intake hole that communicates with a space including the rotary shaft in the inner portion of the arm portion and an outer space of the arm portion, and that supplies a negative pressure to a position facing the rotary shaft.

A pickup device according to another embodiment of the present invention includes: a pickup chuck that holds and picks up the electronic part; an arm portion having a space therein and having the pickup chuck at one end thereof; and a reverse driving unit that has a support portion that supports the pickup chuck and a rotating shaft that protrudes from an inner space of the arm portion through a through hole provided in the arm portion and is connected to the support portion, and that reverses the pickup chuck by rotating the support portion using the rotating shaft, wherein the pickup device is provided with an air pressure circuit that supplies a negative pressure to the inner space of the arm portion.

An electronic component mounting apparatus according to an embodiment of the present invention includes: the pickup device; a supply unit configured to supply the electronic component to the pickup device; a mounting mechanism for mounting the electronic component on a substrate at a mounting position by a mounting head for holding the electronic component delivered from the pickup device; and a substrate support mechanism that supports the substrate on which the electronic component is mounted.

[ Effect of the invention ]

Embodiments of the present invention can provide a pickup apparatus that can pick up an electronic component while suppressing the influence of generated particles, and a mounting apparatus for an electronic component.

Drawings

Fig. 1 is a front view showing a schematic configuration of a mounting device according to an embodiment.

Fig. 2 is a plan view showing an electronic component and a substrate.

Fig. 3 (a) is a plan view of the mounting device, and fig. 3 (B) is an enlarged plan view of the mounting portion.

Fig. 4 (a) is a partial sectional plan view showing the arm portion and the inversion driving portion, fig. 4 (B) is a perspective view of the rotation shaft, and fig. 4 (C) is a sectional view of the rotation shaft.

Fig. 5 (a) and 5 (B) are enlarged views showing the reverse operation of the electronic component, with the left side being a front view and the right side being a plan view.

Fig. 6 (a) to 6 (D) are explanatory views showing a pickup operation of the electronic component.

Fig. 7 (a) to 7 (E) are explanatory views showing the transfer operation of the electronic component.

Fig. 8 (a) to 8 (C) are explanatory views showing the mounting operation of the mounting device.

Fig. 9 is a flowchart showing a procedure of the picking-up operation and the delivering operation of the electronic component.

Fig. 10 is a flowchart showing a mounting process of the electronic parts.

Fig. 11 is a partial cross-sectional plan view showing a modification of the arm portion.

[ description of symbols ]

1: mounting device

2: substrate supporting mechanism

3: mounting mechanism

4: first photographing part

5: second photographing part

6: supply part

7: pick-up device

8: control device

11: supporting table

11a: containing hole

21: carrying platform

22: driving mechanism

22a, 22b, 33a, 34a, 35a, 62b: guide rail

23: movable board

23a: through hole

31: mounting head

31a: hollow part

31b: holding part

32: driving mechanism

33. 34, 35: moving body

61: supporting mechanism

61a: ring support

62: driving mechanism

71: arm part

711: extension part

711a: the first through hole

711b: second through hole

711c: partition wall

711d: communicating hole

711e: opening of the container

712: pipe

713: base body part

72: pick-up chuck

73: reverse drive unit

730: shaft part

730a: rotating shaft

730b: support post

730c: a first opening part

730d: a second opening part

731: driving source

732: supporting part

733: rotating body

733a: air suction hole

734: buffer part

734a: bracket

734b: buffer member

734c: cable wire

735: detachable part

735a: connecting pipe

74: transfer mechanism

741: fixing body

742: a first drive part

742a: first driving source

742b: a first sliding part

743: moving body

744: second driving part

744a: second driving source

744b: second sliding part

B: mounting area

C: electronic component

d. w: width of

D: adsorption zone

F: carrying surface

h: spacer

H: size of

L: height position of the carrying surface

M, M: marking

OA: mounting location

O: center of axis

S: substrate

SL: sliding part

S101 to S105, S201 to S206: step (ii) of

t: thickness of

T: transmission region

X, Y, Z: coordinate axes

WS: wafer sheet

θ: center angle

Detailed Description

Embodiments of the present invention will be described below with reference to the drawings. As shown in fig. 1 and 2, the present embodiment is a mounting apparatus 1 for mounting an electronic component C on a substrate S. Fig. 1 is a front view showing a schematic configuration of a mounting device 1. Fig. 2 is a plan view showing the electronic component C and the substrate S. The drawings are schematic, and the specification (size) (hereinafter also referred to as size), shape, ratio of the specification of each portion, and the like may differ from the actual ones.

[ electronic Components ]

First, as the electronic component C to be mounted in the present embodiment, for example, a semiconductor chip including a semiconductor element such as an Integrated Circuit (IC) or a large-scale integrated circuit (LSI) is cited.

As shown in fig. 2, the present embodiment uses a semiconductor chip in a rectangular parallelepiped shape as the electronic component C. Each semiconductor chip is a bare chip (bare chip) that is singulated by dicing (dicing) the semiconductor wafer (wafer) into small pieces. The bare chip is mounted by flip chip connection in which bump (bump) or bump-less (bump) electrodes are provided on the exposed semiconductor and bonded to pads (pads) on the substrate S.

The electronic component C is provided with a plurality of marks m for positioning. In the present embodiment, two marks m are provided at each of a pair of corners that are diagonal corners of the rectangular electronic component C. The mark m is provided on the front surface of the electronic component C on which the electrode is formed. The present embodiment is an example of a device for performing front-down mounting in which the front surface is mounted to the substrate S.

[ base plate ]

In the present embodiment, as shown in fig. 2, the substrate S on which the electronic component C is mounted is a plate-like member made of resin or the like on which printed wiring or the like is formed, or a silicon substrate or the like on which a circuit pattern is formed. The substrate S is provided with a mounting area B, which is an area where the electronic component C is mounted, and a plurality of marks M for positioning are provided outside the mounting area B. In the present embodiment, the two marks M are provided at positions outside the mounting region B and corresponding to the marks M of the electronic component C.

[ mounting device ]

The mounting device 1 of the present embodiment is a mounting device 1 capable of mounting with high accuracy, for example, mounting accuracy of ± 0.2 μm or less, and includes, as shown in fig. 1, 3 (a), and 3 (B): the substrate support mechanism 2, the mounting mechanism 3, the first imaging unit 4, the second imaging unit 5, the supply unit 6, the pickup device 7, and the control device 8. Fig. 3 (a) is a plan view of the mounting device 1, and fig. 3 (B) is a plan view showing a mark M penetrating a mounting head 31 described later.

In the following description, the axis of movement of the mounting mechanism 3 for mounting the electronic component C on the substrate S is defined as the Z axis, and two axes orthogonal to each other in a plane orthogonal to the Z axis are defined as the X axis and the Y axis. In the present embodiment, the Z axis is vertical, the direction following the gravity is referred to as downward, the direction resisting the gravity is referred to as upward, and the position on the Z axis is referred to as height. The X axis and the Y axis are on the horizontal plane, and the X axis is the left-right direction and the Y axis is the depth direction as viewed from the front side of fig. 1. However, the present invention is not limited to the arrangement direction. Regardless of the installation direction, the side on which the electronic component C is mounted is referred to as an upper side and the opposite side is referred to as a lower side with respect to the substrate S or the substrate support mechanism 2.

The substrate support mechanism 2 is a mechanism for supporting a substrate S on which electronic components C are mounted, and is a so-called substrate stage (stage). The mounting mechanism 3 is a mechanism for mounting the electronic component C on the substrate S. The mounting mechanism 3 has a mounting head 31. The mounting head 31 has a transmission portion through which the mark M of the substrate S facing the electronic component C can be recognized in a state where the electronic component C is held.

The first imaging unit 4 is disposed below the substrate support mechanism 2 at a mounting position OA at which the mounting head 31 mounts the electronic component C on the substrate S, and images the mark m of the electronic component C held by the mounting head 31 from a position facing the electronic component C, that is, from below, in a state where the substrate S is retracted from the mounting position OA by the substrate support mechanism 2. The mounting position OA is a position where the electronic component C is mounted on the substrate S, and is indicated by a one-dot chain line in a direction along the Z axis passing through a point (for example, a center point) on the XY coordinate within a region where the electronic component C is to be mounted. As described later, the mounting position OA coincides with the optical axes of the cameras of the first and second imaging units 4 and 5. The second imaging unit 5 is arranged above the mounting head 31 at the mounting position OA, and images the mark M of the substrate S through the transparent part of the mounting head 31 (hereinafter, this is referred to as "imaging over the mounting head 31"). Based on the image thus captured, the detection of the mark M or the mark M, that is, the recognition of the mark M or the mark M can be performed.

The substrate support mechanism 2 and the mounting mechanism 3 each have a positioning mechanism. The positioning mechanism positions the substrate S and the electronic component C based on the positions of the substrate S and the electronic component C obtained from the images of the mark M and the mark M captured by the first imaging unit 4 and the second imaging unit 5. Each part of the mounting device 1 described above is mounted on a support base 11 provided on a mounting surface. The top surface of the support table 11 is a horizontal surface.

The supply unit 6 supplies the electronic component C. The pickup device 7 picks up and transfers the electronic component C from the supply section 6 to the mounting position OA. The pickup device 7 includes a pickup chuck 72 and a transfer mechanism 74. The pickup chuck 72 picks up the electronic component C from the supply part 6, inverts it, and gives it to the mounting head 31. The transfer mechanism 74 moves the pickup chuck 72 to a space formed by retracting the substrate S from the mounting position OA by the substrate support mechanism 2, and positions the pickup chuck at the mounting position OA.

The control device 8 controls the operation of the mounting device 1. The control device 8 includes, for example, an electronic circuit, a computer that operates with a predetermined program, or the like. That is, the control device 8 reads a program, data, and the like from the storage device by a Processing device such as a Programmable Logic Controller (PLC) or a Central Processing Unit (CPU), and controls the mounting device 1.

The following describes each part of the mounting device 1 in detail.

(substrate supporting mechanism)

As shown in fig. 1 and 3 (a), the substrate support mechanism 2 is disposed on the support base 11, and includes a stage 21 and a drive mechanism 22. The stage 21 is a plate-like member on which the substrate S is placed. The drive mechanism 22 is, for example, a biaxial movement mechanism having a guide rail 22a in the X-axis direction and a guide rail 22b in the Y-axis direction, and moving the stage 21 in a horizontal plane by a belt or a ball screw (ball screw) using a motor (not shown) as a drive source. The drive mechanism 22 functions as a positioning mechanism for positioning the substrate S. Although not shown, drive mechanism 22 includes a θ drive mechanism that rotates stage 21 in a horizontal plane.

The drive mechanism 22 includes a moving plate 23 that moves in the Y-axis direction along a guide rail 22 b. A through hole 23a is formed in the moving plate 23 so that the first imaging unit 4 can image the electronic component C.

Further, although not shown, a loader/unloader for supplying/storing the substrate S to the stage 21 is provided at one end (specifically, the right-hand moving end in the figure) of the moving ends of the stage 21 of the substrate support mechanism 2 in the X-axis direction. Therefore, the substrate support mechanism 2 receives the supply of the substrate S from the loader or delivers the substrate S to the unloader in a state where the stage 21 is moved to the moving end.

(mounting mechanism)

The mounting mechanism 3 has a mounting head 31 and a driving mechanism 32. The mounting head 31 has a substantially rectangular parallelepiped shape and has a hollow portion 31a and a holding portion 31b as transmission portions. The hollow portion 31a is a cylindrical through hole formed with the Z-axis direction as an axis. The holding portion 31b is a plate-like member that can transmit light for imaging, and is attached so as to close the opening of the hollow portion 31a toward the substrate S side. For example, a transparent glass plate is used as the holding portion 31b. The holding portion 31b is a so-called mounting tool, and holds the electronic component C.

As shown in fig. 3 (B), a suction region D for suction-holding the electronic component C is provided in the center of the holding portion 31B. Although not shown, suction holes are formed in the suction region D. The holding portion 31b is provided with a flow path for communicating the suction hole with a negative pressure source, and is provided so as to be capable of suction-holding the electronic component C by generating a negative pressure in the suction hole. The periphery of the suction area D of the holding portion 31b is a transmission area T through which the mark M of the substrate S can be transmitted and imaged even when the electronic component C is sucked. That is, the mounting head 31 has a transparent portion so that the mark M of the substrate S can be imaged by the second imaging part 5. The holding surface (suction surface) on which the electronic component C is held by the holding portion 31b is referred to as a lower end surface.

The drive mechanism 32 includes a movable body 33, a movable body 34, and a movable body 35, and is a mechanism for driving the mounting head 31. The movable body 33 is provided movably along a guide rail 33a in the Y-axis direction provided on the support base 11. The movable body 34 is provided movably along a guide rail 34a in the X-axis direction provided on the top surface of the movable body 33. The moving body 35 is provided movably along a guide rail 35a in the Z-axis direction provided on the front surface of the moving body 34. The moving member 35 is formed in a substantially concave shape in a plan view. The movable bodies 33, 34, and 35 are driven by a ball screw, a linear motor, an air cylinder, or the like using a motor as a drive source.

The mounting head 31 is provided at a lower portion of the moving body 35 that moves in the Z-axis direction. Therefore, the moving body 35 performs an operation for mounting the electronic component C held by the holding portion 31b holding the mounting head 31 on the substrate S. The moving body 35 provided with the mounting head 31 moves in the X-axis direction and the Y-axis direction by the movement of the moving body 33 and the moving body 34. Therefore, the driving mechanism 32 functions as a positioning mechanism for positioning the electronic component C held by the mounting head 31. Although not shown, the driving mechanism 32 includes a θ driving mechanism for rotationally moving the mounting head 31 in a horizontal plane.

In the present embodiment, it is preferable to set the movement amounts of the driving mechanism 32 in the X-axis direction, the Y-axis direction, and the Z-axis direction to be extremely short in order to prevent movement errors. For example, the moving amounts of the moving bodies 33 and 34 in the X-axis direction and the Y-axis direction are set to several mm to ten-odd mm, respectively. The amount of movement of the movable body 35 in the Z-axis direction is also set to about several mm to ten and several mm. That is, the mounting head 31 receives the electronic component C and images the mark m of the received electronic component C at a height position where the lower end surface of the holding portion 31b is at an opposing distance (a vertical separation distance) of several mm, for example, 1mm to 2mm, with respect to the upper surface of the substrate S placed on the stage 21. Therefore, the amount of movement of the movable body 35 in the Z-axis direction is only required to be a movement that can ensure that at least the electronic component C held by the holding portion 31b can be mounted on the substrate S with a predetermined pressing force applied from the height position.

(first imaging part)

The first imaging unit 4 includes a camera, a lens barrel, a light source, and the like, and is fixed in a housing hole 11a provided in the support base 11. The first imaging unit 4 is arranged with the optical axis of the camera in a direction in which the mark m of the electronic component C held by the mounting head 31 can be imaged. Specifically, the optical axis is arranged in a vertical direction. The first imaging unit 4 is fixed to the mounting position OA of the electronic component C. In the present embodiment, the first imaging unit 4 is disposed upward in the housing hole 11a of the support base 11 at a position below the substrate support mechanism 2 so that the optical axis of the camera coincides with the mounting position OA. The first imaging unit 4 is fixed to the support 11 in such a size and positional relationship that the two marks m do not deviate from the imaging field of view even if the electronic component C is moved to the maximum for positioning. That is, the imaging field of view of the first imaging unit 4 is set in consideration of a range in which the two marks m of the electronic component C can move to the maximum for positioning in a state where the optical axis is aligned with and fixed to the mounting position OA.

Here, the stationary state means that the first imaging unit 4 (the same applies to the second imaging unit 5 described later) does not move when the marks M and M are imaged. For example, the imaging units 4 and 5 include driving devices in the X-axis and Y-axis directions (horizontal directions) and driving devices in the Z-axis direction (vertical direction), and these driving devices are included in a configuration in which the horizontal direction positions and the vertical direction positions of the imaging units 4 and 5 are adjusted as operation preparation work of the apparatus, and the apparatus does not move during the subsequent operation of the apparatus.

(second imaging part)

The second imaging unit 5 includes a camera, a lens barrel, a light source, and the like, and is supported and fixed by a frame or the like, not shown, at a position above the support base 11, more specifically, above the mounting head 31. The second imaging unit 5 is arranged with the optical axis of the camera in a direction that can image the mark M around the mounting region B of the substrate S through the holding unit 31B of the mounting head 31. That is, in the present embodiment, the second imaging unit 5 is disposed downward at a position directly above the mounting head 31 in a state where the optical axis of the camera coincides with the mounting position OA. The second imaging unit 5 is fixed to the mounting position OA of the electronic component C, similarly to the first imaging unit 4. That is, the imaging field of view of the second imaging unit 5 is set in consideration of the range in which the two marks provided on the mounting region B of the substrate S can move to the maximum for positioning. Therefore, the size of the transmission portion of the mounting head 31 is set in accordance with the imaging field of view of the second imaging portion 5.

(supply part)

The supply unit 6 includes a support mechanism 61 and a drive mechanism 62. The support mechanism 61 is a device for supporting the wafer sheet WS to which the electronic components C are attached. The driving mechanism 62 moves the support mechanism 61 in the X-axis direction and the Y-axis direction. In the supply unit 6, a surface (area) on which the electronic component C is mounted is referred to as a mounting surface F. In the present embodiment, the electronic component C is a component in which a wafer attached to the wafer sheet WS is divided into individual pieces by dicing. Therefore, the surface (wafer surface) of the wafer sheet WS on which the electronic component C is attached is the mounting surface F. The wafer sheet WS is attached to a wafer ring not shown. The support mechanism 61 has a ring holder (ring holder) 61a on which a wafer ring is mounted. That is, the surface of the support mechanism 61 that supports the wafer sheet WS may be referred to as a mounting surface F.

Further, although not shown, a loader/unloader for supplying/storing wafer rings to the ring holder 61a is provided at one end (specifically, a moving end on the front side in the drawing) of the moving ends of the support mechanism 61 in the Y-axis direction. The support mechanism 61 receives supply of the wafer ring from the loader or transfers the wafer ring to the unloader in a state of being moved to the moving end.

The support mechanism 61 includes an expanding mechanism that expands the wafer sheet WS to leave a gap between the electronic components C, and a push-up mechanism that holds the elongated wafer sheet WS and pushes up the electronic components C individually to separate them, although not shown. Further, the support mechanism 61 includes a θ drive mechanism that rotates and moves the ring holder 61a in a horizontal plane. The push-up mechanism is fixedly disposed on the support base 11, and the electronic component C is received from the supply unit 6 by the pickup device 7, that is, the pickup is performed at this position (pickup position).

The driving mechanism 62 moves the support mechanism 61 in a predetermined direction. For example, the driving mechanism 62 has a guide rail 62a in the X-axis direction and a guide rail 62b in the Y-axis direction, and moves the support mechanism 61 in the X-axis direction and the Y-axis direction in the horizontal plane by using a belt or a ball screw using a motor, not shown, as a driving source. The drive mechanism 62 functions as a positioning mechanism for positioning the electronic component C with respect to the pickup chuck 72. The driving mechanism 62 is disposed at a position lower than the height position L (see fig. 6 a to 6D) of the mounting surface F.

(pickup device)

The pickup device 7 includes an arm 71, a pickup chuck 72, a reverse drive section 73, and a transfer mechanism 74. As shown in fig. 3 (a) and 4 (a), the arm portion 71 includes an extension portion 711, a tube 712, and a base portion 713.

The extending portion 711 is formed in an L shape by a rectangular parallelepiped member linearly extending in the Y axis direction and a rectangular parallelepiped member linearly extending in the X axis direction toward the mounting mechanism 3. As shown in fig. 4 (a), the extension 711 is a hollow member having a space inside, and has a square tubular shape. A first through hole 711a and a second through hole 711b facing the first through hole 711a are provided at the front end of the extension portion 711. A shaft portion 730 is provided to penetrate the first through hole 711a and the second through hole 711b, and the shaft portion 730 has a rotation shaft 730a for rotating the pickup chuck 72. That is, the rotation shaft 730a exists in the inner space of the extension 711. As for the shaft portion 730, it will be described later.

As shown in fig. 4 (a) and fig. 6 (a) to 6 (D), the pipe 712 is a hollow member through which gas can flow. The tube 712 is inserted into a space formed inside the extension 711 and is thereby housed in the arm 71. The built-in is covered by the outer package of the arm portion 71 and is not exposed to the outside. The tube 712 forms a ventilation path bent in an L-shape along the extension 711.

The base portion 713 is a plate-like body parallel to the X-axis direction, and is fixed to the other end of the extension portion 711 (see fig. 3 a). An air pressure circuit, not shown, is connected to the base portion 713 side of the tube 712, and suction force can be exerted on the extension portion 711 side of the tube 712 by negative pressure.

The internal space of the extension portion 711 is partitioned by a partition wall 711c into a space including the rotation shaft 730a and a space on the base portion 713 side. The partition wall 711c is provided with a communication hole 711d that communicates the two spaces, and negative pressure can be supplied from the communication hole 711d to the space including the rotating shaft 730a. For example, the end of the pipe 712 is connected to the communication hole 711d, and negative pressure is supplied to a space including the rotary shaft 730a through the communication hole 711d, thereby exerting a suction force.

The pickup chuck 72 is a member that holds and picks up the electronic part C. The pickup chuck 72 has an adsorption hole connected to an air pressure circuit, not shown, and adsorbs the electronic component C to the tip by negative pressure, and releases the electronic component C by releasing the negative pressure or releasing the positive pressure. The pickup chuck 72 is provided at the front end of the arm portion 71.

In the present embodiment, a reverse drive portion 73 described later is provided at one end of the extension portion 711 facing the mounting mechanism 3, and the pickup chuck 72 is provided in a reversible manner in the reverse drive portion 73. That is, as shown in fig. 5a and 5B, the pickup chuck 72 is rotatable between a lower side in the Z-axis direction (a direction in which the electronic component C faces the wafer sheet WS) and an upper side in the Z-axis direction (a direction toward the mounting head 31) by the inversion driving unit 73.

As shown in fig. 4 (a), 5 (a), and 5 (B), the inversion drive unit 73 includes a shaft 730, a drive source 731, and a support portion 732. The shaft portion 730 includes a rotation shaft 730a and a support 730b extending in the Z-axis direction. The rotating shaft 730a is a member having a space therein and has a cylindrical shape. One end of the rotation shaft 730a protrudes from the inner space of the extension part 711 through the first through hole 711a and is connected to a support part 732 described later.

The support 730b is a rod-shaped member that penetrates the second through hole 711b provided in the extension 711. The other end of the rotary shaft 730a is connected to a drive source 731 described later via a support 730b. A ball bearing is disposed between the second through hole 711b and the support column 730b, and the support portion 732 is rotated by the rotation of the rotary shaft 730a when the power of the driving source 731 is transmitted to the support column 730b. The axis center O of the rotation axis 730a is the rotation center of the rotation axis 730a and substantially coincides with the rotation center of the support 730b.

As shown in fig. 4 (B) and 4 (C), the rotation shaft 730a is provided with a first opening 730C and a second opening 730d. The first opening 730c is provided on the circumferential surface of the rotating shaft 730a and opens to the inner space of the extension 711. The first opening 730c is provided facing the base portion 713 side, and is an opening obtained by cutting out a circumferential surface of the center angle θ about the shaft center O of the rotation shaft 730a. The central angle θ is preferably set to 180 ° or more. Accordingly, as described later, in a state where the connection pipe 735a and the cable 734c are inserted into the first opening 730c, even if the rotation shaft 730a is rotated (reversed) by 180 °, interference with the connection pipe 735a and the cable 734c can be avoided. The first opening 730c has a rectangular shape in cross section as viewed from a direction (X-axis direction) orthogonal to the axial direction (Z-axis direction) of the rotation shaft 730a. The second opening 730d is provided at one end of the rotation shaft 730a, communicates with the first opening 730c, and faces the external space of the extension 711.

The driving source 731 is a motor that rotates the rotating shaft 730a via the support column 730b, and is provided at one end of the extension portion 711.

The support 732 supports the pickup collet 72. The support portion 732 includes a rotating body 733, a buffer portion 734, and a detachable portion 735. The rotating body 733 is an L-shaped plate-like member connected to the rotating shaft 730a. The rotating body 733 has a surface parallel to the XZ plane and a surface parallel to the YZ plane. The rotating body 733 is provided with an air intake hole 733a at a position facing the second opening 730d of the rotating shaft 730a on a plane parallel to the XZ plane. The air intake hole 733a communicates with the inside of the rotary shaft 730a via a second opening 730d.

As described above, the inner space of the rotation shaft 730a communicates with the inner space of the extension 711 via the first opening 730 c. The internal space of the extension 711 and the air intake hole 733a communicate with each other through the first opening 730c and the second opening 730d of the rotation shaft 730a. Therefore, the internal space of the extension part 711 and the internal space of the rotary shaft 730a are sucked by the air pressure circuit connected to the pipe 712, and ambient air can be sucked from the suction holes 733a communicating with these spaces. That is, the air suction hole 733a is provided at a position of the support portion 732 facing the second opening portion 730d of the rotary shaft 730a so that ambient air can be sucked by negative pressure. In other words, the air intake hole 733a communicates with a space including the rotation shaft 730a in the arm portion 71 and an external space of the arm portion 71, and supplies negative pressure to a position facing the rotation shaft 730a (see fig. 4a, 5a, and 5B). Further, by sucking the inner space of the extension part 711, the surrounding air may be sucked from the gap formed between the first through hole 711a and the rotation shaft 730a. That is, since the first through hole 711a also functions as an intake hole, the intake hole also includes the first through hole 711a.

The buffer portion 734 applies an appropriate load when the tip of the pickup chuck 72 comes into contact with the electronic component C, and absorbs the excessive load. The cushioning portion 734 includes a bracket 734a and a cushioning member 734b. The bracket 734a is an L-shaped plate-like member attached to a surface of the rotating body 733 parallel to the YZ plane. The buffer member 734b may have a buffer function of applying and absorbing a load to the pickup chuck 72, and may be supplied with power through a supply line (piping or wiring) connected to the controller 8. For example, when a voice coil motor (voice coil motor) is used as the buffer member 734b, the cable 734c that supplies electric power as motive power is connected to the control device 8, inserted into the extension portion 711 from the base portion 713 side, passed through the extension portion 711, drawn out from the air intake hole 733a through the first opening 730c and the second opening 730d of the rotation shaft 730a, and connected to the buffer member 734b.

The attaching/detaching portion 735 is a member that is attached to the drive shaft of the buffer member 734b and attaches and detaches the pickup collet 72. The attaching/detaching portion 735 of the present embodiment is provided so that the pickup cartridge 72 can be attached/detached by a magnet. Further, the detachable portion 735 is connected to an air pressure circuit that supplies negative pressure or positive pressure to the suction holes of the pickup chuck 72 as described above via the connection pipe 735 a. The connection pipe 735a is inserted into the extension part 711 from the base part 713 side, passes through the extension part 711, is drawn out from the air intake hole 733a through the first opening 730c and the second opening 730d of the rotation shaft 730a, and is connected to the pickup collet 72 through the detachable part 735.

The connection pipe 735a and the cable 734c are inserted into the extension portion 711 from the base portion 713 side, and pass through the opening 711e provided in the partition wall 711c, thereby being connected to the pickup collet 72. The diameter of the opening 711e is preferably set to a value such that the opening 711e is substantially filled by inserting the connection pipe 735a or the cable 734 c. This can prevent particles generated in the space including the rotation shaft 730a from passing through the partition wall 711c from the gap of the opening 711e and diffusing into other spaces.

As shown in fig. 3 (a), the transfer mechanism 74 drives the arm 71 to move the pickup chuck 72 between the supply unit 6 and the mounting position OA. The transfer mechanism 74 has a slide portion SL provided at a position not overlapping the placement surface F in a plan view. In other words, the slide portion SL of the transfer mechanism 74 is provided outside the movement range of the support mechanism 61. The transfer mechanism 74 drives the arm 71 in accordance with the sliding of the slide SL. The sliding portion SL described here is a structure portion in which members move while contacting each other. Such sliding portions SL serve as a particle generation source. As shown in fig. 6 (a) to 6 (D), the sliding portion SL according to the present embodiment includes a first sliding portion 742b and a second sliding portion 744b, which will be described later. The first and second sliding portions 742b and 744b are provided at positions lower than (below) the height position L of the mounting surface F.

As shown in fig. 6 (a) to 6 (D), the transfer mechanism 74 includes a fixed body 741, a first drive section 742, a movable body 743, and a second drive section 744. The fixed member 741 is a rectangular parallelepiped member fixed to the support base 11 (see fig. 3 a) and extending in the X-axis direction. The position of the fixing body 741 is fixed with respect to the mounting position OA.

The first driving portion 742 drives the arm portion 71 in the X-axis direction. The first driving portion 742 has a first driving source 742a and a first sliding portion 742b. The first drive source 742a is a linear motor extending in the X-axis direction, and is provided along the upper surface (surface parallel to the XY plane) of the fixed body 741. The first sliding portion 742b is a linear guide extending in the X-axis direction, and is provided on the front surface (surface parallel to the XZ plane) of the fixed body 741. In the linear motor, the first drive source 742a does not have the sliding portion SL because the mover moves without contacting the stator.

The moving body 743 is a rectangular parallelepiped block, and is provided to be slidable in the X axis direction in accordance with the operation of the first drive source 742a by a slider to which the first drive source 742a is attached and to which the first slide portion 742b is attached.

The second driving portion 744 drives the arm portion 71 in the Z-axis direction. The second driving portion 744 has a second driving source 744a and a second sliding portion 744b. The second drive source 744a is a linear motor extending in the Z-axis direction, and is provided to the movable body 743. The second slide portion 744b is a linear guide extending in the Z-axis direction, and is provided to the movable body 743.

The base portion 713 of the arm portion 71 is provided so as to be slidable in the Z-axis direction by a slider to which the second driving source 744a is attached and to which the second sliding portion 744b is attached. As described above, the sliding portion SL according to the present embodiment includes the first sliding portion 742b and the second sliding portion 744b that linearly slide along two orthogonal axes. The first sliding portion 742b and the second sliding portion 744b are disposed in a positional relationship of overlapping in the height direction on both front and back facing side surfaces of the common moving body 743. That is, the positions of the two orthogonal axes are close to each other. Further, it is preferable that the distance between both side surfaces of the moving body 743 is short, that is, the moving body 743 is thin.

(relationship between the interval between the substrate and the mounting head on the carrier and the size of the pickup head)

In the present embodiment, as shown in fig. 1, in order to move the pickup chuck 72 to the mounting position OA, the substrate S needs to be retracted, and the facing distance between the mounting head 31 and the substrate S located at the mounting position OA is set. In other words, since the retraction of the substrate S is required to move the pickup chuck 72 to the mounting position OA, the height position of the mounting head 31 when receiving the electronic component C at the mounting position OA is set to be adjacent to the height position of the upper surface of the substrate S supported by the substrate support mechanism 2. More specifically, the distance H between the height position of the upper surface of the substrate S placed on the stage 21 of the substrate support mechanism 2 at the mounting position OA and the lower end surface of the mounting head 31 when receiving the electronic component C is shorter than the dimension H of the pickup chuck 72 at the tip of the arm 71 in the height direction (H < H). Here, as described above, the distance from the lower end surface of the holding portion 31b to the height position of the upper surface of the substrate S is, for example, several mm.

(size of arm)

As shown in fig. 1, 3a, and 5a, the width w of the member linearly extending in the Y-axis direction and the width d of the member linearly extending in the X-axis direction of the extended portion 711 of the arm portion 71 are both longer than the thickness t in the Z-axis direction (w > t, d > t). This can ensure the rigidity of the relatively long arm portion 71 while suppressing the increase in the height dimension of the arm portion 71, thereby stabilizing the position of the electronic component C transferred by the pickup chuck 72. By suppressing the enlargement of the dimension of the arm portion 71 in the height direction, it is not necessary to raise the receiving position of the mounting head 31.

(control device)

The control device 8 controls the positioning mechanism based on the marks M and M imaged by the first imaging unit 4 and the second imaging unit 5 so as to position the substrate S and the electronic component C. That is, the control device 8 stores the position of the mark M of the electronic component C on design in XY coordinates and the position of the mark M of the substrate S on design in XY coordinates as respective reference positions in accordance with the position where the electronic component C is to be mounted accurately.

The reference position may be a position of the mark M or the mark M when an attempt is made to mount the electronic component C on the substrate S in advance, and the electronic component C is mounted accurately. The control device 8 obtains the deviation between the mark M imaged by the first imaging unit 4 and the mark M imaged by the second imaging unit 5 and the reference position, and controls the positioning mechanism (the driving mechanism 22 and the driving mechanism 32) so that the electronic component C and the substrate S move in the direction and by the amount of movement corrected for the deviation.

The control device 8 controls the transfer mechanism 74 of the pickup device 7 and the drive mechanism 62 of the supply unit 6 based on map information indicating the position coordinates of the electronic components C on the wafer sheet WS, thereby sequentially positioning the electronic components C to be picked at the pickup position. Further, the pickup here means that the electronic component C is received by being separated from a member on which the electronic component C is mounted, for example, the wafer sheet WS. Further, the control device 8 controls the following operations: the suction from the suction hole 733a, the holding of the electronic component C by the pickup chuck 72, the inversion of the pickup chuck 72 by the inversion driving unit 73, the movement of the pickup chuck 72 to the mounting head 31 by the transfer mechanism 74, the delivery of the electronic component C to the mounting head 31, and the like.

[ actions ]

The operation of the present embodiment as described above will be described with reference to the explanatory views of fig. 3 (a) to 8 (C) and the flowcharts of fig. 9 and 10. In the initial state, the substrate S is delivered from the loader to the stage 21 of the substrate support mechanism 2, but is retracted from the mounting position OA, which is a position facing the mounting head 31, together with the stage 21.

[ transfer of electronic parts ]

The transfer operation of the electronic component C will be described with reference to the explanatory views (a) to (E) of fig. 3 and the flowchart of fig. 9. The ring holder 61a of the support mechanism 61 in the supply unit 6 is attached with a wafer ring to which the wafer sheet WS is attached by an automatic loader (see fig. 3a and 3B). The electronic components C divided into individual pieces by dicing are attached to the wafer sheet WS. Note that, in fig. 6 (a) to 6 (D), illustration is omitted except for the electronic component C to be picked up. After the start of the operation, as indicated by white arrows in fig. 5 (a), 5 (B), and 6 (a) to 6 (D), a negative pressure is applied to the tube 712 by the air pressure circuit, and ambient air is sucked from the suction hole 733a.

First, as shown in fig. 6 (a) and 3 (a), the support mechanism 61 moves in the X-axis and Y-axis directions to position the electronic component C to be mounted at the pickup position. Further, the arm 71 is moved in the X-axis direction, whereby the pickup chuck 72 is positioned at a pickup position, which is a position directly above the electronic component C to be mounted (step S101).

The movement of the wafer sheet WS in the X-axis and Y-axis directions at this time is performed by the drive mechanism 62 of the supply unit 6. The movement of the arm portion 71 in the X-axis direction is performed as follows: the first driving source 742a of the first driving unit 742 operates to move the moving body 743 along the first sliding unit 742b.

As shown in fig. 6B, the electronic component C to be mounted is pushed up by a push-up mechanism (not shown). Then, the pickup chuck 72 picks up the electronic part C (step S102). That is, the arm 71 and the buffer portion 734 move in the direction approaching the wafer sheet WS, and after the electronic component C is sucked and held by the pickup chuck 72, the electronic component C is separated from the wafer sheet WS by moving in the direction away from the wafer sheet WS.

The movement of the arm 71 at this time is performed as follows: the second driving source 744a of the second driving portion 744 operates to move the base portion 713 along the second sliding portion 744b. Then, as shown in fig. 5a, 5B, 6C, and 6D, the reverse driving unit 73 rotates the pickup chuck 72 by 180 ° to reverse the electronic component C (step S103). At this time, particles generated by sliding between the members due to the rotation are sucked by the suction holes 733a, and thus adhesion to the electronic component C is reduced.

Next, as shown in fig. 7 a and 7B, the arm 71 is moved in the X-axis direction to position the pickup chuck 72 at the mounting position OA (step S104). That is, the electronic component C held by the pickup chuck 72 reaches a position in the mounting mechanism 3 that faces the holding portion 31b of the mounting head 31. The movement of the arm portion 71 in the X-axis direction at this time is performed as follows: the first driving source 742a of the first driving section 742 operates to move the moving body 743 along the first sliding section 742b by a distance from the pickup position to the mounting position OA. At this time, the mounting head 31 waits at a height position where the facing distance between the lower end surface of the holding portion 31b and the upper surface of the substrate S is several mm. The height position is maintained until the positioning of the electronic component C and the substrate S, which will be described later, is completed, i.e., immediately before the mounting head 31 is driven toward the substrate S.

As shown in fig. 7 (C), the arm portion 71 moves in a direction approaching the holding portion 31b, and presses the electronic component C against the holding portion 31b. As shown in fig. 7D, the holding portion 31b of the mounting head 31 receives the electronic component C by suction-holding the electronic component C by negative pressure (step S105). At the same time, the pickup chuck 72 releases the negative pressure, and the arm portion 71 moves in a direction away from the holding portion 31b, thereby releasing the electronic component C. The movement of the arm 71 at this time is performed as follows: the second driving source 744a of the second driving portion 744 operates to move the base portion 713 along the second sliding portion 744b.

Further, as shown in fig. 7 (E), the arm portion 71 moves toward the supply portion 6, and the pickup chuck 72 retracts from directly below the holding portion 31b. The movement of the arm 71 at this time is performed as follows: the first drive source 742a of the first drive section 742 operates to move the moving body 743 in the X-axis direction along the first slide section 742b. Since the delivery of the electronic component C to the holding portion 31b by the pickup device 7 is performed at the mounting position OA, the stage 21 is kept retracted to avoid interference with the transfer mechanism 74 at the time of delivery.

[ mounting of electronic component ]

Next, the mounting operation of the electronic component C will be described with reference to the explanatory views of fig. 8 (a) to 8 (C) and the flowchart of fig. 10. Here, as shown in fig. 8 (a), the holding portion 31b of the mounting head 31 which holds the electronic component C is located directly below the second imaging portion 5 as described above. The first imaging unit 4 images the mark m of the electronic component C held by the mounting head 31 (step S201). The control device 8 obtains a positional deviation amount between the position of the mark m imaged by the first imaging unit 4 and the reference position, and positions the electronic component C by operating the driving mechanism 32 so as to cancel the deviation amount (step S202).

Next, as shown in fig. 8B, the substrate support mechanism 2 moves the stage 21 so that the mounting region B of the substrate S (the mounting region B where the electronic component C is mounted at this time) reaches a position facing the electronic component C held by the mounting head 31, that is, the center of the mounting region B reaches the mounting position OA (step S203). As shown in fig. 3B, the second imaging unit 5 passes over the mounting head 31 and images the mark M of the substrate S visible in the transmission region T around the electronic component C (step S204).

The controller 8 obtains a positional deviation amount between the position of the mark M imaged by the second imaging unit 5 and the reference position, and positions the substrate S by operating the driving mechanism 22 so as to cancel the deviation amount (step S205). Further, as shown in fig. 8C, the mounting head 31 is driven toward the substrate S by the driving mechanism 32, and the electronic component C held by the mounting head 31 is mounted on the substrate S (step S206).

In this manner, the electronic components C are sequentially mounted on the mounting regions B of the substrate S by repeating the operations of transferring the electronic components C from the wafer sheet WS, transferring the electronic components C to the mounting head 31, and positioning and mounting the electronic components C and the substrate S. The substrate S on which the predetermined number of electronic components C are mounted is transported by the substrate support mechanism 2 and stored in the unloader.

[ Effect ]

(1) The pickup device 7 of the present embodiment includes: a pickup chuck 72 that holds and picks up the electronic part C; an arm portion 71 having a pickup chuck 72 at one end and a space inside; and a reverse driving portion 73 that has a support portion 732 that supports the pickup cartridge 72 and a rotating shaft 730a that rotates the support portion 732 by the rotating shaft 730a, wherein the reverse driving portion 73 rotates the pickup cartridge 72 by rotating the supporting portion 732 using the rotating shaft 730a, the rotating shaft 730a protrudes from an inner space of the arm portion 71 through a through hole (a first through hole 711 a) provided in the arm portion 71 and is connected to the support portion 732, and the pickup device 7 is provided with a suction hole 733a that communicates with a space including the rotating shaft 730a in the inner portion of the arm portion 71 and an outer space of the arm portion 71 and supplies negative pressure to a position facing the rotating shaft 730a.

The electronic component C mounting apparatus 1 according to the present embodiment includes: a supply unit 6 that supplies the electronic component C to the pickup device 7; a mounting mechanism 3 for mounting the electronic component C on the substrate S at a mounting position OA by a mounting head 31 holding the electronic component C delivered from the pickup device 7; and a substrate support mechanism 2 for supporting the substrate S on which the electronic component C is mounted.

Therefore, when the pickup chuck 72 is reversed, particles generated by the sliding between the members can be sucked from the suction holes 733a, and the adhesion of the particles to the electronic component C held by the pickup chuck 72 can be reduced. In addition, it is possible to reduce particles from falling onto the electronic parts C attached to the wafer sheet WS. That is, the particles can be suppressed from adhering to the electronic component C before mounting. This makes it possible to pick up the electronic component C while suppressing the influence of the generated particles.

(2) In the pickup device 7 of the embodiment, the rotary shaft 730a is a hollow member having a space therein, and has a first opening portion 730c and a second opening portion 730d, the first opening portion 730c facing the inner space of the arm portion 71, the second opening portion 730d communicating with the first opening portion 730c and facing the outer space of the arm portion 71, and the suction hole 733a is provided in the support portion 732 at a position facing the second opening portion 730d.

Therefore, the internal space of the arm portion 71 and the external space are communicated through the first opening portion 730c and the second opening portion 730d of the rotation shaft 730a, and the internal space of the arm portion 71 is sucked, whereby negative pressure can be generated in the internal space of the rotation shaft 730a and the suction hole 733a. Accordingly, when the pickup chuck 72 is reversed, particles are sucked particularly from a position facing the rotary shaft 730a of the support part 732 where the inter-member sliding occurs, and the adhesion of particles to the surrounding members can be reduced.

(3) In the pickup device 7 of the present embodiment, the through hole (the first through hole 711 a) functions as the suction hole 733a. In the above-described embodiment, the air inlet 733a includes a through hole (first through hole 711 a) through which the rotation shaft 730a protrudes from the inner space of the arm portion 71. Therefore, the particles near the first through hole 711a through which the rotation shaft 730a protrudes from the inner space of the arm portion 71 are also sucked into the arm portion 71, and the particles generated by the rotation are also left so as not to leak from the arm portion 71 to the outside.

(4) The pickup device 7 according to the present embodiment includes a tube 712, and the tube 712 is built in the arm portion 71 and supplies a negative pressure to a space including the rotation shaft 730a. Therefore, when the pickup chuck 72 is reversed, particles generated particularly in a space where sliding between the members occurs, that is, a space including the rotary shaft 730a are sucked by the tube 712. Further, since the tube 712 is built in the arm portion 71, even if particles are generated from the tube 712 and the inside thereof that deform along with the movement of the arm portion 71, the particles can remain inside the arm portion 71, and since the particles do not leak out from the arm portion 71, the adhesion of the particles to the surrounding members can be reduced.

(5) The pickup device 7 of the present embodiment includes a partition wall 711c that partitions an internal space of the arm portion 71 into a space including the rotation shaft 730a, and the partition wall 711c is provided with a communication hole 711d that sucks the space including the rotation shaft 730a by negative pressure. Therefore, when the pickup chuck 72 is reversed, particularly, the space where the sliding between the generating members is caused, that is, the space including the rotating shaft 730a is partitioned by the partition wall 711c, and the particles generated in the space can be left and sucked from the communication hole 711d. As a result, the exhaust capacity can be reduced as compared with the case of sucking the entire internal space of the arm portion 71, and therefore, even a small suction force can suck the particles.

(6) The pickup device 7 of the present embodiment includes a pipe 712, the pipe 712 is built in the arm portion 71 and supplies negative pressure to a space including the rotation shaft 730a, and the pipe 712 is connected to the communication hole 711d of the partition wall 711 c. Therefore, when the pickup chuck 72 is reversed, the space in which the sliding between the members occurs, that is, the space including the rotary shaft 730a is partitioned by the partition wall 711c, and the particles generated in the space can be left. Further, the particles remaining in the partitioned space are sucked by the tube 712. As a result, the exhaust capacity can be reduced as compared with the case of sucking the entire internal space of the arm portion 71, and therefore, even a small suction force can suck the particles. Further, since the tube 712 is incorporated in the arm portion 71, even if particles are generated from the tube 712 and the inside thereof, which are deformed in accordance with the movement of the arm portion 71, the particles can remain inside the arm portion 71, and since the particles do not leak from the arm portion 71 to the outside, the adhesion of the particles to the surrounding members can be reduced.

(7) In the above-described pickup device 7 according to the present embodiment, the connection pipe 735a for supplying negative pressure or positive pressure to the pickup collet 72 is drawn out from the suction hole 733a through the first opening 730c and the second opening 730d, and is connected to the pickup collet 72. That is, the connection pipe 735a is connected to the pickup chuck 72 through the inside of the rotation shaft 730a in which the negative pressure is generated and the suction hole 733a. Therefore, when the pickup collet 72 is reversed or the arm portion 71 is moved, particles generated by the sliding of the connection pipe 735a and the suction hole 733a are sucked into the inner space of the arm portion 71, and the adhesion of the particles to surrounding members can be reduced.

(8) The pickup chuck 72 of the pickup device 7 of the present embodiment is connected to the buffer member 734b, and the wiring or piping (cable 734 c) for supplying electric power to the buffer member 734b passes through the first opening 730c and the second opening 730d, is drawn out from the suction hole 733a, and is connected to the buffer member 734b. That is, the cable 734c is connected to the buffering member 734b through the suction hole 733a and the inside of the rotating shaft 730a in which the negative pressure is generated. Therefore, when the pickup chuck 72 is reversed or the arm 71 is moved, particles generated by the sliding of the wire 734c and the suction hole 733a are sucked into the inner space of the arm 71, and the adhesion of the particles to the surrounding members can be reduced.

(9) In the pickup device 7 of the present embodiment, the first opening 730c of the rotation shaft 730a is an opening formed by cutting out a circumferential surface having a central angle of 180 ° or more around the axial center of the rotation shaft 730a. Therefore, while the rotation shaft 730a is rotated (reversed) by 180 °, the connection pipe 735a or the cable 734c passing through the first opening 730c and the second opening 730d of the rotation shaft 730a does not contact the rotation shaft 730a at the periphery of the first opening 730c and does not slide unnecessarily. As a result, further generation of particles can be prevented.

(10) The method comprises the following steps: a pickup chuck 72 that holds and picks up the electronic part C; an arm portion 71 having a pickup chuck 72 at one end and a space inside; and a reverse driving unit 73 that has a support portion 732 that supports the pickup chuck and a rotary shaft 730a that supports the pickup chuck 72, rotates the support portion 732 by the rotary shaft 730a, and rotates the pickup chuck 72, wherein the rotary shaft 730a is connected to the support portion 732 and protrudes from an inner space of the arm portion 71 through a through hole provided in the arm portion 71, and an air pressure circuit that supplies a negative pressure to the inner space of the arm portion 71 is provided.

Therefore, by making the internal pressure of the arm portion 71 lower than the external pressure (negative pressure), particles generated inside the arm portion 71 can be left inside the arm portion 71. As a result, even if the arm portion 71 has a gap such as a joint or a through hole of the rotation shaft 730a, particles can be prevented from diffusing to the outside, and adhesion of particles to surrounding members can be reduced.

(11) The method comprises the following steps: a slide part SL (742 b, 744 b) provided at a position not overlapping with a mounting surface F on which an electronic component C to be picked up is mounted in a plan view; and a transfer mechanism 74 for transferring the pickup chuck 72 by driving the arm 71 in accordance with the sliding of the slide portion SL.

As described above, since the sliding portion SL is located at a position not overlapping the mounting surface F on which the electronic component C is mounted in a plan view, particles generated from the sliding portion SL are less likely to fall onto the mounting surface F when the arm portion 71 moves along with the sliding of the sliding portion SL, and poor bonding due to the particles adhering to the electronic component C can be suppressed.

(12) The sliding portion is provided at a position lower than the height position of the mounting surface F. Therefore, the particles generated from the sliding portion SL fall below the mounting surface F, and therefore hardly reach the mounting surface F, and the bonding failure can be further suppressed.

(13) The sliding section SL includes a first sliding section 742b and a second sliding section 744b which are disposed on the opposite side surfaces of the common moving body 743 and slide linearly along two orthogonal axes.

Therefore, the two axes of the first sliding portion 742b and the second sliding portion 744b are disposed at adjacent positions via a common member, and the positional deviation of the pickup head 72 due to the play of the first sliding portion 742b and the second sliding portion 744b can be prevented from being enlarged. Therefore, by providing the slide portion SL at a position not overlapping with the mounting surface F in a plan view, even if the arm portion 71 is long, the electronic component C can be accurately positioned and transferred.

(14) The pickup device 7 includes: a pick-up chuck 72 for picking up the electronic component C from the supply part 6, inverting the electronic component C, and delivering the electronic component C to the mounting head 31; and a transfer mechanism 74 for moving the pickup chuck 72 to a space formed by retracting the substrate S (stage 21) from the mounting position OA by the substrate support mechanism 2.

Therefore, the mounting head 31 does not need to move to receive the electronic component C from the transfer mechanism 74, and can fixedly maintain the position of the electronic component C at the mounting position OA, and can receive the electronic component C at a height position adjacent to the height position of the upper surface of the substrate S, and high mounting accuracy can be obtained. In this way, since the amount of movement of the mounting head 31 can be reduced, the amount of particles generated at the mounting position OA can also be reduced.

(15) In order to move the pickup chuck 72 to the mounting position OA, the substrate S needs to be retracted, and the distance between the mounting head 31 and the substrate S located at the mounting position OA is set. Therefore, the position of the mounting head 31 when receiving the electronic component C can be set to a position close to the substrate S when mounting. Thus, after the mounting head 31 receives the electronic component C, the distance that the mounting head 31 moves for mounting can be made very short, and positional displacement due to the movement of the mounting head 31 can be prevented, thereby improving mounting accuracy.

(16) The mounting head 31 has a transmission part that enables the mark M of the substrate S to be recognized through the transmission part in a state where the electronic component C is held, and the mounting device 1 includes: a first imaging unit 4 which is disposed below the substrate support mechanism 2 at the mounting position OA and which images a mark m of the electronic component C held by the mounting head 31 in a state where the substrate S is retracted from the mounting position OA; a second imaging unit 5 which is disposed above the mounting head 31 at the mounting position OA and which images the mark M of the substrate S through the transparent portion; and a positioning mechanism for positioning the substrate S and the electronic component C based on the positions of the substrate S and the electronic component C obtained from the images of the mark M and the mark M captured by the first imaging unit 4 and the second imaging unit 5.

According to this embodiment, in a state where the substrate S is retracted from the mounting position OA, the electronic component C held by the mounting head 31 is imaged by the first imaging unit 4 arranged below the substrate support mechanism 2 at the mounting position OA, and the substrate S supported by the substrate support mechanism 2 is imaged by the transparent unit of the mounting head 31 by the second imaging unit 5 arranged above the mounting head 31 at the mounting position OA, so that the mark M of the electronic component C and the mark M of the substrate S can be imaged in a state where the electronic component C and the substrate S are as close as possible.

Therefore, the amount of movement of the electronic component C (mounting head 31) and the substrate S (substrate support mechanism 2) when the mark M and the mark M are imaged and the amount of relative movement of the electronic component C (mounting head 31) and the substrate S (substrate support mechanism 2) after the mark M and the mark M are imaged can be reduced as much as possible. Therefore, it is possible to suppress the expansion of the error caused by moving the mounting head 31 or the substrate support mechanism 2 for a long distance. Further, the longer the moving distance of the mechanism, the more particles are generated, but in the present embodiment, since the moving distance can be suppressed, the deterioration of the cleanliness and the occurrence of poor bonding due to the particles can be prevented.

Here, when the mark M is not imaged beyond the mounting head 31 but imaged by a camera provided adjacent to the mounting head 31, it is not practically possible to achieve high required accuracy using a high-magnification camera. That is, the area of the substrate S to which the mark M is given is only a range of about several millimeters larger than the area to which the electronic component C is mounted, and the diameter of the mounting head 31 is also only a diameter of about several millimeters larger than the area to which the mark M is given. Therefore, even if the lens barrel of the camera is disposed adjacent to the mounting head 31, the plurality of marks M do not enter the visual field range of the camera, and the plurality of marks M cannot be simultaneously imaged by the camera.

Then, in order to photograph the plurality of (two) marks M of the substrate S, the mounting head 31 needs to be moved so that the camera (mounting head 31) moves by a distance greater than the separation distance of the two marks M, and an error occurs at the time of the movement. That is, after recognizing the mark M of the electronic component C and performing the alignment, the camera must be moved together with the mounting head 31 in order to recognize the mark M of the substrate S, and then the position of the electronic component C may be shifted even if it is returned to the original position.

In order to cope with this problem, if recognition and alignment of the mark M of the substrate S are first performed, the electronic component C cannot be recognized in a state where the substrate S is located at a position to be mounted, and therefore the substrate S after alignment needs to be moved, and a positional deviation of the substrate S occurs.

Further, it is also conceivable to prepare a template (template) to which marks corresponding to the marks M of the substrate S are marked at a position different from the position to be mounted, and perform positioning based on the relative positions of the marks of the template and the marks M of the substrate S. In this case, however, the mounting head 31 and the camera must be moved to recognize the mark of the stencil each time the electronic component C is mounted. Accordingly, time required for identifying the mark of the template and time required for positioning are additionally spent, and thus productivity is lowered. In addition, the moving distance of the mechanism increases, and therefore the amount of particles generated also increases.

In the present embodiment, since the moving distance of the electronic component C and the substrate S can be suppressed after the imaging of the mark M and the mark M, any of the positional shift, the reduction in productivity, and the generation amount of particles can be suppressed.

(17) The transmission section has a transparent plate-like member. Therefore, in a narrow area corresponding to the size of the minute electronic component C, it is possible to hold the electronic component C and secure the transparency imaging of the mark M of the substrate S.

(18) The first imaging unit 4 and the second imaging unit 5 are provided without being moved to the mounting position OA. Therefore, the imaging area of the first imaging unit 4 and the imaging area of the second imaging unit 5 do not deviate from each other, and the generation of particles due to movement can be prevented.

[ modified examples ]

(1) The opening 711e of the extension portion 711 in the arm portion 71 may be a member common to the communication hole 711d for supplying negative pressure, i.e., for performing suction, or may be a different member. When the opening 711e is made common to the communication hole 711d, for example, as shown in fig. 11, the connection pipe 735a or the cable 734c is inserted into the tube 712, passes through the tube 712, comes out of the communication hole 711d, and is then drawn out of the suction hole 733a to be connected to the pickup collet 72. When the connection pipe 735a or the cable 734c passes through the pipe 712 in this manner, particles generated by sliding of the connection pipe 735a, the suction hole 733a, and the pipe 712 are retained inside the pipe 712 when the pickup collet 72 is reversed or the arm 71 is moved. Therefore, even if the arm portion 71 has a seam, the particles are prevented from being diffused to the outside of the arm portion 71, and the particles can be reduced from adhering to surrounding members.

(2) The tube 712 may also be eliminated. In this case, the internal space of the extension portion 711 can be supplied with negative pressure by the air pressure circuit provided on the base portion 713 side instead of the tube 712, thereby exerting a suction force. For example, the suction force can be exerted by supplying a negative pressure from the space on the base portion 713 side to the space including the rotary shaft 730a through the communication hole 711d by the pneumatic circuit provided on the base portion 713 side.

(3) A fluid cylinder may also be used as the cushioning member 734b. In this case, a pipe for supplying a fluid (gas or liquid) serving as motive power may be connected to the buffer member 734b. Further, an elastic member such as a spring or rubber may be used as the cushioning member 734b. In this case, a supply line equivalent to the cable 734c for supplying power may be omitted.

(4) The position of the air intake hole 733a may be a position facing the rotation axis of the support portion 732 (the rotating body 733). Therefore, the axis of rotation does not need to be concentric with the center of the air intake hole 733a, and may be near the axis of rotation. Even if the support portion 732 rotates, as long as the air intake hole 733a and the connection pipe 735a and the cable 734c rotate without changing relative positions while maintaining contact with the air intake hole 733a, generation of particles due to sliding in the contact portion can be suppressed.

(5) The pickup chuck 72 may also be provided so as to be rotatable in a direction parallel to the XY plane, i.e., a direction (θ direction) parallel to the top surface of the electronic part C (the surface of the wafer sheet WS). In this case, the cable for supplying power to the motor for rotating the pickup chuck 72 in the θ direction is drawn out from the suction hole 733a through the tube 712, and is connected to the motor. Accordingly, when the pickup chuck 72 is reversed or the arm 71 is moved, particles generated by the sliding of the cable, the suction hole 733a, and the tube 712 do not leak to the outside of the arm 71, and thus do not affect the surroundings.

(6) The supply unit 6 is not limited to a device for supplying the electronic component C attached to the wafer sheet WS. For example, the supply device may be a device for supplying the electronic components C arranged on the tray. The transfer mechanism 74 may be configured to pick up and transfer the electronic component C from the supply unit 6 alone. Therefore, the arm 71 may be configured to move in the X-axis and Y-axis directions, or the support mechanism 61 may be configured to move in the X-axis and Y-axis directions.

(7) In the transfer mechanism 74, the driving unit for driving the arm 71 is not limited to a mechanism using a linear motor as a driving source. A mechanism using a ball screw or a belt may be used, in which a motor that rotates on a shaft is used as a drive source. In this mechanism, since the slide portion SL is included, it is preferably provided at a position not overlapping the mounting surface F in a plan view. Further, it is preferable that the slide portion SL is provided at a position lower than the height position of the mounting surface F. In addition, when there are a plurality of sliding portions SL, a part of the sliding portions SL may not be provided at a position not overlapping with the mounting surface F in a plan view. Further, a part of the slide portion SL may not be provided at a position lower than the height position of the mounting surface F. In this case, it is preferable to provide a shield such as an outer cover, a wall, or another structure between the slide portion SL and the mounting surface F. Further, the distance between the slide portion SL and the mounting surface F is preferably increased.

(8) The mounting head 31 may be configured such that the second imaging unit 5 can image the mark M of the substrate S. Therefore, even if the transparent part of the mounting head 31 is not formed of a transparent material, a through hole can be formed in a part corresponding to the mark M. More specifically, the holding portion 31b may be formed of an opaque member, and a through hole may be formed at a portion corresponding to the mark M, or the hollow portion 31a may be absent, and the holding portion 31b may be formed of an opaque member, and a through hole may be formed at a portion corresponding to the mark M of the mounting head 31 and the holding portion 31b. That is, such a through hole is also a through part of the mounting head 31.

(9) The first imaging unit 4 and the second imaging unit 5 may be provided to be movable with respect to a position (mounting position OA) where the electronic component C is mounted. That is, when the plurality of marks M of the electronic component C or the plurality of marks M of the substrate S cannot be collectively imaged, the first imaging unit 4 and the second imaging unit 5 may be configured to move between the marks M or between the marks M to perform imaging. That is, the first imaging unit 4 may be provided with a moving device for moving between the markers M, or the second imaging unit 5 may be provided with a moving device for moving between the markers M. In this case, since the moving distance is short and stays within the size range of the mounting region B of the electronic component C or the substrate S, the generation of errors or particles can be suppressed.

(10) Although the position of the mark M of the electronic component C and the position of the mark M of the mounting area B of the substrate S are respectively aligned with the reference positions, the present invention is not limited thereto, and the position of the mounting area B may be aligned with the position of the electronic component C or the position of the electronic component C may be aligned with the position of the mounting area B. In short, the position of the mounting region B of the substrate S and the position of the electronic component C may be aligned.

(11) The substrate S may be transferred to the stage 21 of the substrate support mechanism 2 at the mounting position OA. In this case, after the substrate S is supplied to the stage 21, the substrate S may be retracted from the mounting position OA before the mark m of the electronic component C is imaged by the first imaging unit 4.

[ other embodiments ]

While the embodiments and the modifications of the respective parts of the present invention have been described above, the embodiments and the modifications of the respective parts are presented as examples and are not intended to limit the scope of the present invention. These novel embodiments can be implemented in other various ways, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims.

Claims (11)

1. A pickup apparatus, comprising:

a pickup chuck that holds and picks up the electronic part;

an arm portion having a space therein and having the pickup chuck at one end thereof; and

a reverse driving unit having a support portion supporting the pickup cartridge and a rotating shaft connected to the support portion and protruding from an inner space of the arm portion through a through hole provided in the arm portion, the reverse driving unit reversing the pickup cartridge by rotating the support portion using the rotating shaft

The pickup device is provided with an air intake hole which communicates with a space including the rotating shaft in the inside of the arm portion and an outside space of the arm portion and supplies a negative pressure to a position facing the rotating shaft.

2. The pickup device according to claim 1, wherein the rotary shaft is a hollow member having a space inside, having a first opening portion facing the inner space of the arm portion and a second opening portion communicating with the first opening portion and facing the outer space of the arm portion,

the air intake hole is provided at a position facing the second opening portion in the support portion.

3. The pickup device according to claim 1 or 2, wherein the through hole functions as the suction hole.

4. A pickup device according to any one of claims 1 to 3, comprising a tube which is placed in the arm portion and supplies negative pressure to a space including the rotary shaft.

5. The pickup device according to any one of claims 1 to 3, comprising a partition wall that divides an inner space of the arm portion into a space including the rotation shaft,

the partition wall is provided with a communication hole for supplying negative pressure to a space including the rotary shaft.

6. The pickup device according to claim 5, comprising a tube which is placed in the arm portion and supplies negative pressure to a space including the rotation shaft, and which is connected to the communication hole.

7. The pickup device according to claim 2, wherein a connection pipe for supplying a negative pressure or a positive pressure to the pickup collet passes through the first opening portion and the second opening portion, is drawn out from the suction hole, and is connected to the pickup collet.

8. A pick up device according to claim 2, wherein the pick up collet is connected with a damping member,

the cable for supplying electric power to the shock-absorbing member is drawn out from the air intake hole through the first opening and the second opening and is connected to the shock-absorbing member.

9. The pickup device according to claim 7 or 8, wherein the first opening is an opening obtained by cutting out a circumferential surface having a central angle of 180 ° or more with respect to an axial center of the rotary shaft.

10. A pickup apparatus, comprising:

a pickup chuck that holds and picks up the electronic part;

an arm portion having a space therein and having the pickup chuck at one end thereof; and

a reverse driving unit having a support portion supporting the pickup chuck and a rotating shaft protruding from an inner space of the arm portion through a through hole provided in the arm portion and connected to the support portion, the reverse driving unit reversing the pickup chuck by rotating the support portion by the rotating shaft

The pickup device is provided with an air pressure circuit that supplies negative pressure to an internal space of the arm portion.

11. An electronic component mounting apparatus, comprising:

the pickup device of any one of claims 1 to 10;

a supply unit configured to supply the electronic component to the pickup device;

a mounting mechanism for mounting the electronic component on a substrate at a mounting position by a mounting head for holding the electronic component delivered from the pickup device; and

and a substrate support mechanism for supporting the substrate on which the electronic component is mounted.

Images