CN1158101A - 贴箔单取向半固化片及由其制成的印刷线路层压板 - Google Patents
贴箔单取向半固化片及由其制成的印刷线路层压板 Download PDFInfo
- Publication number
- CN1158101A CN1158101A CN95195145A CN95195145A CN1158101A CN 1158101 A CN1158101 A CN 1158101A CN 95195145 A CN95195145 A CN 95195145A CN 95195145 A CN95195145 A CN 95195145A CN 1158101 A CN1158101 A CN 1158101A
- Authority
- CN
- China
- Prior art keywords
- layer
- laminate
- prepreg
- semi
- pwb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/40—Shaping or impregnating by compression not applied
- B29C70/50—Shaping or impregnating by compression not applied for producing articles of indefinite length, e.g. prepregs, sheet moulding compounds [SMC] or cross moulding compounds [XMC]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/06—Fibrous reinforcements only
- B29C70/08—Fibrous reinforcements only comprising combinations of different forms of fibrous reinforcements incorporated in matrix material, forming one or more layers, and with or without non-reinforced layers
- B29C70/088—Fibrous reinforcements only comprising combinations of different forms of fibrous reinforcements incorporated in matrix material, forming one or more layers, and with or without non-reinforced layers and with one or more layers of non-plastics material or non-specified material, e.g. supports
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/095—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/08—Impregnating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/024—Woven fabric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/12—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer characterised by the relative arrangement of fibres or filaments of different layers, e.g. the fibres or filaments being parallel or perpendicular to each other
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/08—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of continuous length, e.g. cords, rovings, mats, fabrics, strands or yarns
- B29K2105/10—Cords, strands or rovings, e.g. oriented cords, strands or rovings
- B29K2105/101—Oriented
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/08—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of continuous length, e.g. cords, rovings, mats, fabrics, strands or yarns
- B29K2105/10—Cords, strands or rovings, e.g. oriented cords, strands or rovings
- B29K2105/101—Oriented
- B29K2105/108—Oriented arranged in parallel planes and crossing at substantial angles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/24—Condition, form or state of moulded material or of the material to be shaped crosslinked or vulcanised
- B29K2105/243—Partially cured
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/25—Solid
- B29K2105/253—Preform
- B29K2105/256—Sheets, plates, blanks or films
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0276—Polyester fibres
- B32B2262/0284—Polyethylene terephthalate [PET] or polybutylene terephthalate [PBT]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/514—Oriented
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2363/00—Epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0287—Unidirectional or parallel fibers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Textile Engineering (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
本发明涉及一种用于制造PWB层压板的基底材料,该层压板是一种贴箔的UD-半固化片,它含有一层导电金属箔和一层由一些被尚未完全固化的基质树脂浸透,平行而且单一取向,其直径小于30μm的增强纤维构成的层状物,上述的两层粘结在一起。该贴箔UD-半固化片可用于制造UD-交叉帘布PWB层压板,其方法是将贴箔的UD-半固化片与其他UD层按照UD层夹在中间的方式积叠并压合在一起,所说其他UD层可以是未贴箔的UD半固化层或非流动性UD复合层。
Description
本发明涉及一种用于制造PWB层压板的基底板料,所说PWB层压板包含至少一层由尚未完全固化的基质树脂浸透的,平行而且单一取向(UD)的增强纤维,也就是一种UD半固化层。本发明还涉及由这种UD半固化层制成的,用于印刷线路板(PWB)的层压板。
有一种用于制造PWB的UD半固化片材料公开在US 4,814,945上。其公开内容涉及一种含有以平行芳族聚酰胺纤维增强的基质树脂的PWB层压板。该层压板由多层单取向的芳族聚酰胺薄带按十字交叉的方式一层积叠在另一层上面而构成。该芳族聚酰胺薄带的制备方法是将单层芳族聚酰胺纤维平行地排列以形成一种纤维带材,然后以树脂涂覆该纤维带材并将所说树脂加热以使其达到一种半固化的或“B”-阶段(“B”-Stage)的状态。
在制备UD交叉帘布层压板时容易引起的一个问题是UD层的解取向作用。为了获得一种具有足够平坦度的层压板就必须保持适当的取向,而所说的平坦度是PWB层压板的一项特别重要的性能。特别是如果使用仍然处于可流动状态的基质树脂,例如B-阶段的物料,就很有可能发生解取向的危险,这是因为在层压过程中物料出现流动导致不能合适地控制物料的张力,并因此导致UD层的取向不能适当控制。
另外,人们希望在半固化片的基础上制造一种UD-强化的交叉帘布层复合层压板。用于以半固化片(通常为编织玻璃纤维织物半固化片)为基础制造层压板的技术是在PWB层压板领域中的常规技术,其优点是可以使用树脂体系以及在该领域中已被证明具有耐久性的层压技术。当然,由于编织纤维结构的优点,使得常规的半固化片不易产生解取向的问题。然而,使用一种UD-交叉帘布层结构来代替编织织物结构将能带来明显的优点,例如对表面质量的改进以及在x和y方向上具有较低的线性热膨胀系数(TCE),可以带来较高含量的纤维与更好的尺寸稳定性的最佳化。由于这些原因,使得UD-交叉帘布层压板十分适合用作PWB基板。当然,只有当用于制造这些层压板的方法能够保持适当的取向时才能获得所说的优点。
其中有一些方法在现有技术中是已知的,例如可以从EP 478051、WO 92/22191和US 4,943,334得知。但是这些方法中没有一种方法是基于半固化片层压技术的,因此本发明还涉及提供一种基于UD半固化片的UD交叉帘布层压板。
在DE 3542295中强调指出了一个与UD纤维取向有关的问题。该专利文件涉及一种以基质树脂中含有取向纤维的基底层为基础的光屏蔽材料。其中公开的一个事实是,通过在基底层上施加一层热收缩性合成箔可以消除在加压成型时平行纤维的位置偏差。使用热收缩性箔将引起UD半固化片在纤维方向上发生轻微弯曲。虽然这种情况在屏蔽材料的情况下可能符合要求,但是在PWB层压板的情况下却必须完全避免。
在利用UD半固化片时很可能引起的另一个问题是,如果需要制备薄的层压板,那么这种被仍可流动的树脂浸透的单层UD纤维将是难以加工的(即使该树脂在加工温度为固体状态也是如此)。由于UD层在纵向上容易撕裂,从而使得上述问题更为严重。这是由于UD层在与所说纤维垂直的方向上的强度低的缘故。
当所说尚未完全固化的基质树脂是一种热固性树脂时还会遇到另一个问题。与热塑性树脂相反,这种尚未完全固化的热固性树脂还未具有其最终的性能,也就是所有机械性能仍然是低劣的。由于这种半固化片容易损伤,因此在加工时可能引起其他的问题。
应予指出,其他关于使用UD半固化片的背景技术涉及成型为一种圆形的制品,例如高尔夫球棍柄等。JP-平-4-329,132公开了一种用于该目的的复合半固化片制品。该复合半固化片含有两种不同的平行纤维和一层厚度为5-100μm的金属层,在所说两种不同纤维中,粗纤维的直径为30-500μm,细纤维的直径为5-30μm。
对于那些应符合现代要求的PWB产品来说,很重要的一点是任何增强纤维都应是一种直径小于30μm,优选为3-15μm的长丝,因为为了获得满意的钻孔和理想的表面平坦度,必须禁止使用更粗的纤维。特别是对于具有细小增强纤维的薄半固化片来说,将会产生加工问题。
其他同类背景技术是JP-平-6-008,240。该专利文献公开了一种结构复合材料,其最外表面层被一层金属或金属化合物薄膜所覆盖。该复合物的芯体可由一种平行并且单一取向的纱增强,而其外层由玻璃布增强。该公开内容涉及已成型的,圆形的制品,例如高尔夫球棍柄或天线等。
日本专利申请公开No.201 699/1985公开了一种可热粘合的电屏蔽材料,该电屏蔽材料包含一块金属箔,在该金属箔上形成的可热粘合树脂层以及固定于该树脂层的许多平行的增强金属丝。这些导电金属丝的直径为0.03~0.5mm,它们相互的间距为10~15cm。该文献还公开了,如果要防止该金属箔产生皱褶,则所说的屏蔽材料必须与一种缓冲材料,例如聚氨酯泡沫片,缠绕在一起。
另一个关于PWB层压板的背景技术包括EP 0 372 505。该文献实际上公开了一种纤维增强的热塑性层压板。这种纤维增强作用可以是任何形式。这种热塑性层压板在其上面具有一层在树脂处于熔融状态时贴上去的金属箔。所说树脂通常是一种在高温时为热塑性而在室温时则为固态的物质。所公开的这种层压板并不是象本发明的目的产品那样用于制造PWB的基底材料,因为它本身就作为PWB层压板使用。因此,按照EP 372505制造的层压板是一种具有PWB基板最终性能的层压板。本发明的真正目的是一种可用于制造PWB的UD半固化片,但它们本身并不适合作为PWB层压板使用。因为很薄,并且仅在单一方向上具有纤维增强作用,所以它将仅仅在该方向上具有适合的性能。因此它是难以加工的并容易撕裂。如上所述,当使用一种尚未完全固化的热固性树脂时,上述问题更为明显。
本发明的目的是要提供这样一种UD半固化层,这种半固化层允许进一步加工,并且不会引起如上所述的问题,而且它是本身基本上适用于制造PWB层压板的类型。进而,本发明的另一个目的是要提供这样一种UD半固化层,这种半固化层允许使用一种尚未完全固化的热固性树脂而不会引起与上述有关的其他问题。
为了这一目的,本发明提供了一种用于制造PWB层压板的基底材料,该PWB层压板包含一层如上所述类型的UD半固化层,在该半固化层中的增强纤维的直径在30μm以下,以及包含一层导电的金属箔,例如铜箔,该导电金属箔粘合到所说的UD半固化层上。
该导电金属箔层能使UD半固化材料在垂直于纤维的方向上具有足够的强度,从而能防止在加工时引起的撕裂。如果在将UD半固化片切割成所需尺寸之前先将一层金属箔层压在其上面,那么一种薄铜箔的加工问题也就解决了。
如上所述,本发明涉及一种用于制造PWB层压板的基底材料。该基底材料包含一种由相邻两层相互粘合在一起的层状结构,它包含一层金属箔,例如铜箔,以及一层由尚未完全固化的基质树脂浸透的,平行而且单一取向的纤维层。
术语“半固化片”在本技术领域中是众所周知的,它通常是指一种用树脂浸透的增强材料并且其本身是(半)固化的。它通常仍处于一种发粘的阶段。术语“尚未完全固化的基质材料”是指该树脂还能进一步固化。在热固性树脂的情况下,它通常是指处于B阶段的基质树脂。某些基质材料(基质树脂)阶段通常在本技术领域中是指“A”、“B”和“C”阶段,A阶段是指未固化的树脂(也就是在热固性树脂的情况下;处于未固化的阶段);B阶段通常是指部分固化的阶段(在热固性树脂的情况下:该反应进行到形成更长分子链,但尚未形成完整的网),C阶段是指已完全固化的阶段。术语A阶段、B阶段和C阶段对于本领域的普通技术人员来说都是众所周知的,此处不需要作进一步的解释。
本发明的贴箔半固化片可以与其他半固化层或固化材料层层压在一起。当然,所说的其他层状物也可以含有编织增强纤维,但是,如果希望完全保持UD增强作用的优点,所说的其他层最好应具有UD平行纤维,也就是说,它应该是UD半固化层或者诸如在WO 92/22191中公开的固化(不能流动)UD复合层。
目前用于制造印刷线路板的标准基底材料通常可以按照例如在C.F,Coombs,Jr.的印刷电路手册(Printed Circuits Handbook)(McGraw-Hill)中描述的方法制造,该方法包括下列步骤:-用一种环氧树脂在MEK中的溶液浸渍编织玻璃纤维。-然后,使溶剂蒸发掉并让树脂部分地固化至一种所谓B-阶段。-将所获得的半固化片切割成适当的大小并将其在两张铜箔之间积叠在一起。-用一台多层压机在提高的温度下加压,使该组件固化。-然后通过蚀刻把按这种方法制得的在其两侧面覆盖有铜箔的层压板制成印刷线路板。
以本发明的UD半固化片为基础的PWB层压板可以按基本上相似的方法制造。当然,UD半固化基底材料的制备方法不同于浸渍和固化编织纤维的方法。UD半固化片通常可按下述方法制造,也就是用基质树脂涂覆在一张铜箔上以形成一种贴箔的树脂层,加热该贴箔的树脂层以保证该树脂具有足以能够浸透长丝纤维的流动性,然后将平行的长丝纤维贴附到树脂上以形成一种贴箔UD-强化树脂层。该浸透步骤也可以按相反的程序进行,也就是先将平行的长丝纤维贴附到没有足够流动性的树脂层上,然后加热该树脂层以使其具有足以浸透纤维丝的流动性。根据树脂的不同类型,将该贴箔的UD-增强树脂层,或者进一步加热,或者接受光化学照射,以使该树脂部分地固化(例如到达B-阶段),或者将其冷却以使该树脂固化(例如在使用一种在室温下固化的热塑性树脂时)。出乎意料地发现,所获得的贴箔UD半固化片要比裸露的铜箔和相应的未贴箔的UD半固化片二者都更容易加工。将该贴箔的半固化片切成适当的大小然后将其与其他未贴箔的UD层状物积叠和层压在一起。未贴箔的UD层将形成内层,使它夹持在两块贴箔的UD半固化片(使铜箔层处于外表面上)之间而形成一种夹心层。
在这方面,本发明还涉及一种PWB层压板的制造方法,在所说的层压板中,若干层包含在树脂基质中,平行而且单一取向的增强纤维的层状物被积叠并压合在一起。在该方法中,使一种由一层导电金属箔粘贴到UD-半固化层上而形成的贴箔UD-半固化层来形成该层压板的外表面层,并使该导电金属箔处于该层压板的外侧。在一种实施方案中,用于形成该PWB层压板内层的层状物是一种半固化层,其中含有由尚未完全固化的基质树脂浸透的,平行而单一取向的增强纤维,也就是一种未贴箔的UD半固化片。在另一实施方案中,用于形成该层压板内层的层状物由一些非流动性UD-复合物层或非流动性UD交叉帘布层压板构成。
术语“非流动性UD复合物”是指一种含有单一取向增强纤维的复合材料,所说的增强纤维介于一种已经固化到在后续加工程序中不能再流动的基质材料中。总的说来,它是指其贮存和加工时,所说的非流动性UD复合物处于一种低于其软化点(即低于其Tg或表观Tg)的压力和温度的条件下,或者已固化到一种不能再流动的阶段。为了便于贮存和加工,最好将非流动性UD复合物的固化进行到C阶段,或者使用那些含有刚性分子链的树脂,也就是它已达到一个仍然称为B阶段,但在正常的贮存和加工条件下属于非流动状态的阶段。然而很明显,当对层压区的加压是在等压条件下进行时,处于A阶段的材料也可以使用。
在一种由非流动性UD复合物形成内层的实施方案中,这些层状物可以按照WO 92/22191的方法制备。它也可以利用一种例如在WO92/22192中公开的,涂覆或未涂覆粘合剂的中间基底而与本发明的贴箔UD半固化片积叠并层压在一起。
早已公知,UD交叉帘布层压板优选是平衡的和对称的。术语“平衡的”是指在相互垂直的两个方向上具有相等的性能(例如在x和y两个方向上具有相等数量的长丝纤维),术语“对称的”是指在层压板的整个厚度上具有镜面对称,也就是说,该层压板为中心平面对称。通过该层压板的中心延伸并平行于该层压板外表面的对称面或者是两层UD层的边界面或者是通过一层UD层延伸的想象平面,这取决于在层压板的整个厚度内UD层的数目和次序。这种具有十字交叉UD增强层,平衡而且中心平面对称的层压板的主要优点是它在x和y两个方向上(即两个相互垂直的纤维方向)具有相同的性能。
特别优选的是该层压板具有如下所述的构成,也就是UD-增强层按照下述模式之一所规定的方式取向,使它们一直以0°和90°构成直角正交的取向并且在结构中的各层按照规定的相对厚度在给定的取向上重复,这些取向必须是0°/90°90°/0°;0°/90°90°/0°0°/90°90°/0°。
一般说,为了应用于PWB中,在本发明层压板中的UD-增强层每层的厚度在6~800μm的范围内,优选在约12.5~400μm的范围内。
交叉帘布层压板的外表两层均由本发明的贴箔UD半固化片,即一种具有一层金属箔(例如Cu)和一层UD层(例如0°)的层状物构成。在上述的例子中,内层UD层具有两倍于外层UD层的厚度,该内层可以由一块UD半固化片构成。当然,在此情况下可能产生上述解取向的危险,但两倍厚度的UD层不会引起象单层厚度UD层那样的加工问题(该问题可以按照本发明通过粘贴金属箔的方法来解决)。在该实施方案中,优选是该层压操作在等压条件下进行,以避免产生引起流动的推动力。但优选内部各层为上面规定的符合WO 92/22191的非流动性UD复合层。
从上文可以清楚地看出,优选是这种由未贴箔的UD层夹持在两块贴箔的UD半固化片之间(铜箔层处于外表面)的积叠方式使得UD-增强层的取向符合上述模式中之一种模式的规定,即Cu0°/90°90°/0°Cu或Cu0°/90° 90°/0° 0°/90°90°/0°Cu。
层压操作可以在多层压机、高压釜、真空压机、双带压机或者任何其他合适的设备中进行。
在本发明贴箔UD-半固化片的基础上制成的PWB层压板适用于多层PWB(MLB),例如在WO 92/22192中公开的产品。
用于本发明中的材料没有特别严格的要求。优选使用下文讨论的材料。
基质材料可以是热塑性或热固性的聚合物,优选是热固性树脂。更优选是使用基于环氧树脂的基质材料,但其他树脂在原理上也可以使用。实例包括:氰酸酯、不饱和聚酯(UP)树脂、乙烯基酯树脂、丙烯酸酯树脂、BT环氧树脂、双马来酰亚胺树脂(BMI)、聚酰亚胺(PI)、酚树脂、三嗪、聚氨酯、硅氧烷树脂、双柠康酸树脂(BCI)。另外,也可以将所说树脂组合使用,并且也可以将上述树脂与某些适合的热塑性材料,例如PPO、PES、PSU和PEI等混合使用。具有互穿聚合物网络(IPN)也适合使用。优选是将一些化合物,例如含磷或含卤素(特别是含溴)的化合物,掺合进基质材料中以赋予阻燃性。特别优选的是一种含有约100重量份Epikote828EL、约73重量份Epikote5050以及约4重量份三氟化硼和一乙胺的配合物的基质材料,因为这种基质材料具有良好的流动性能和固化性能。
虽然优选的增强材料由长丝纱组成,但是不连续的纤维也可以使用。根据本发明,该增强丝优选从下列物组选择:玻璃丝例如E-玻璃丝、A-玻璃丝、C-玻璃丝、D-玻璃丝、AR-玻璃丝、R-玻璃丝、S1-玻璃丝和S2-玻璃丝;以及各种陶瓷材料,例如氧化铝和碳化硅。适合使用的还有基于聚合物的纤维,特别是所谓液晶聚合物的物质,例如:对亚苯基对苯二酰胺(PPDT)、聚苯并双噁唑(PBO)、聚苯并双噻唑(PBT)和聚苯并咪唑(PBI);以及那些基于聚亚乙基萘二甲酸酯(PEN)(naphthalate)、聚对苯二甲酸乙二醇酯(PET)和聚亚苯基硫醚(PPS)的纤维。这些纤维(长丝)的直径应小于30μm,例如可为20μm。通常其直径较具体的范围是3~15μm,优选是5~13μm。
通常在基质中的纤维含量约为10~90vol%,优选在约40至约70vol%的范围内。以纤维体积百分率为约50vol%最为满意。
与编织纤维增强的层压板的情况相反,按本发明方法制造的复合层压板也适合用作软质板或软质层压板以及刚性-挠曲层压板。在用于软质板时,纺织物容易在经线和纬线纤维交接点发生断裂,其原因是,沿着弯曲方向取向的纤维与那些垂直于弯曲方向的纤维共同处于织物内部,由于在这些交接点处的高纤维密度而增大了这种不利影响,从而导致在相对较低弯曲度的情况下就产生裂纹。这些裂纹使得应力高度集中于软质层压板上的电路交点(conductive traces)处,并因此导致高度的断裂危险性,它将导致电路的断路。在软质层压板(或在刚性-挠曲层压板的软质部分)中,外层UD层的取向优选平行于所希望的弯曲方向。
另外,本发明的UD交叉帘布层压板十分适合作为带有各种不同集成电路(多片模件)的装置中使用的支持材料。这主要归功于有利的热膨胀系数(TCE),它主要是由于较大的纤维体积百分比所造成的,在使用交叉帘布的层压板时可以获得大的纤维体积百分比,而在此情况下的TCE可以接近于与PWB,尤其是与MLB连接的电子元件(芯片)的TCE。这类电子元件可以安装在MLB的表面上(芯片在底板上),或者将电子元件嵌入基底中例如WO 92/22192那样的中间基底中(芯片在底板中)。
下面根据附图进一步解释在本发明贴箔UD-半固化片的基础上制得的层压板组合件。
图1示出本发明的贴箔UD半固化片(1)。该图示出了x和y方向的截面视图,在该图中的各符号表示:铜箔(2),它贴合在UD半固化层(3)上,该半固化层(3)由一些平行而且单一取向的增强纤维(4)构成,增强纤维(4)被尚未完全固化的基质树脂(5)所浸透。
图2示出一种根据WO 92/22191的非流动性UD复合板(6)。在该图(x和y方向截面)中的各符号表示:由UD纤维(7)构成的两层,这些纤维层被非流动性的基质树脂(8)所浸透。
图3示出一种由非流动性UD复合板(6)与两层贴箔UD半固化片(1)积叠并层压而制成的Cu0°/90°90°/0°Cu PWB层压板。
Claims (7)
1.一种用于制备PWB层压板的基底材料,它包含一层由许多被尚未完全固化的基质树脂浸透的,平行而且单一取向的增强纤维构成的UD半固化层,其特征在于,该基底材料是一种贴箔的UD半固化片,它包含一层粘贴到UD半固化层上的导电金属箔和处于UD半固化层中,直径小于30μm的增强纤维。
2.如权利要求1所述的用于制备PWB层压板的基底材料,其特征在于,其中的金属箔是一种厚度在18μm以下的铜箔。
3.如权利要求1或2所述的用于制备PWB层压板的基底材料,其特征在于,其中的基质树脂是热固性树脂。
4.一种用于制备UD半固化层的方法,其中,一种纺织物形式的未粘合的长丝按平行而且单方向地排列,其特征在于,该平行的长丝被一种可流动的基质树脂浸透,而该基质树脂则粘结到一层导电金属箔上并由该金属箔所支持。
5.一种PWB层压板,它具有处于其两侧外表面上的导电金属箔层以及由许多层UD层构成的层压板,每一层UD层都含有由单一取向的平行纤维增强的树脂基质,这些UD层按交叉帘布层的方式排列,而所说的层压板具有对称地平行于两个外表面的平面,其特征在于,其中的导电金属箔和与其相邻的外层UD层由权利要求1~3中任一项所述的贴箔UD半固化片构成。
6.一种用于制造PWB层压板的方法,其中的若干层半固化层被积叠并压合在一起,这些半固化层含有被尚未完全固化的基质树脂浸透,平行而且单一取向的增强纤维,其特征在于,形成该层压板外表面的半固化层由一种贴箔的UD半固化片构成,该半固化片含有一层粘贴到UD半固化层上的导电金属箔,该导电金属箔处于该层压板的外侧。
7.一种用于制造PWB层压板的方法,其中,含有处于树脂基质中,平行而且单一取向的增强纤维的若干层被积叠并压合在一起,其特征在于,形成该层压板内层的各层由非流动性UD复合层构成,而形成该层压板外表面的两层由一种贴箔UD半固化片构成,所说的贴箔UD半固化片包含一层导电金属箔和一层含有被尚未完全固化的基质树脂浸透,平行而且单一取向的增强纤维的层状物,所述的导电金属箔粘贴到上述层状物上并处于该层压板的外侧。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP94202688.1 | 1994-09-19 | ||
EP94202688 | 1994-09-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1158101A true CN1158101A (zh) | 1997-08-27 |
Family
ID=8217206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN95195145A Pending CN1158101A (zh) | 1994-09-19 | 1995-09-18 | 贴箔单取向半固化片及由其制成的印刷线路层压板 |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP0782500A1 (zh) |
JP (1) | JPH10508720A (zh) |
KR (1) | KR970705465A (zh) |
CN (1) | CN1158101A (zh) |
AU (1) | AU694564B2 (zh) |
CA (1) | CA2200314A1 (zh) |
MX (1) | MX9702059A (zh) |
TW (1) | TW371285B (zh) |
WO (1) | WO1996009158A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109049891A (zh) * | 2018-06-13 | 2018-12-21 | 咸阳天华电子科技有限公司 | 一种高弹性覆铜单向纤维片的制备方法 |
CN109496076A (zh) * | 2018-12-19 | 2019-03-19 | 咸阳天华电子科技有限公司 | 一种单向纤维电路板的制造工艺 |
CN111448043A (zh) * | 2017-12-08 | 2020-07-24 | 日立化成株式会社 | 预浸渍体、层叠板和它们的制造方法、以及印刷线路板和半导体封装体 |
CN111688287A (zh) * | 2020-06-14 | 2020-09-22 | 湖南亿润新材料科技有限公司 | 一种环氧树脂半固化片及其生产工艺 |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0838977A1 (en) * | 1996-10-25 | 1998-04-29 | Gividi Italia S.P.A. | Laminates for printed circuits using unidirectional glass fabric |
WO2000072643A1 (en) * | 1999-05-26 | 2000-11-30 | Ppg Industries Ohio, Inc. | Fabrication of unidirectional laminate prepregs using tape casting methods and equipment |
JPWO2003009656A1 (ja) | 2001-07-18 | 2004-11-11 | 松下電器産業株式会社 | 回路形成基板の製造方法および回路形成基板 |
ITRM20040571A1 (it) * | 2004-11-22 | 2005-02-22 | Gen Services Srl | Rotore, relativo procedimento di fabbricazione, e macchina ad induzione impiegante il rotore. |
WO2007086568A1 (ja) | 2006-01-30 | 2007-08-02 | Kyocera Corporation | 樹脂フィルム、接着シート、配線基板および電子装置 |
JPWO2008093757A1 (ja) | 2007-01-31 | 2010-05-20 | 京セラ株式会社 | プリプレグシートの製造方法および製造装置ならびにプリプレグシート |
EP1970951A3 (en) | 2007-03-13 | 2009-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
EP2372756A1 (en) | 2007-03-13 | 2011-10-05 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device and manufacturing method thereof |
EP1976001A3 (en) | 2007-03-26 | 2012-08-22 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
EP1976000A3 (en) * | 2007-03-26 | 2009-05-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
WO2008117911A1 (en) | 2007-03-26 | 2008-10-02 | Lg Electronics Inc. | Reinforcing component for refrigerator |
CN101652406B (zh) | 2007-03-30 | 2012-09-26 | 京瓷株式会社 | 纤维强化树脂及其制造方法 |
EP2001047A1 (en) * | 2007-06-07 | 2008-12-10 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device |
JP2009045915A (ja) * | 2007-07-26 | 2009-03-05 | Kyocera Corp | 複合基板、配線基板および実装構造体、並びに複合基板の製造方法 |
WO2009051239A1 (ja) * | 2007-10-18 | 2009-04-23 | Kyocera Corporation | 配線基板、実装構造体、並びに配線基板の製造方法 |
JP5293075B2 (ja) * | 2007-10-24 | 2013-09-18 | 日立化成株式会社 | 金属箔張り積層板及びプリント配線板 |
JP2009205669A (ja) | 2008-01-31 | 2009-09-10 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
CN102067281B (zh) | 2008-04-25 | 2013-06-12 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
KR101582503B1 (ko) | 2008-05-12 | 2016-01-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작 방법 |
WO2009142310A1 (en) | 2008-05-23 | 2009-11-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
WO2009142309A1 (en) | 2008-05-23 | 2009-11-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US8053253B2 (en) | 2008-06-06 | 2011-11-08 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
JP5248412B2 (ja) | 2008-06-06 | 2013-07-31 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP5473413B2 (ja) | 2008-06-20 | 2014-04-16 | 株式会社半導体エネルギー研究所 | 配線基板の作製方法、アンテナの作製方法及び半導体装置の作製方法 |
JP2010041045A (ja) | 2008-07-09 | 2010-02-18 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
WO2010005064A1 (en) | 2008-07-10 | 2010-01-14 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and electronic device |
TWI475282B (zh) | 2008-07-10 | 2015-03-01 | Semiconductor Energy Lab | 液晶顯示裝置和其製造方法 |
JP5216716B2 (ja) | 2008-08-20 | 2013-06-19 | 株式会社半導体エネルギー研究所 | 発光装置及びその作製方法 |
CN102160179B (zh) | 2008-09-19 | 2014-05-14 | 株式会社半导体能源研究所 | 半导体装置及其制造方法 |
JP5583951B2 (ja) | 2008-11-11 | 2014-09-03 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
WO2010140539A1 (en) | 2009-06-05 | 2010-12-09 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and method for manufacturing the same |
TWI517268B (zh) | 2009-08-07 | 2016-01-11 | 半導體能源研究所股份有限公司 | 端子構造的製造方法和電子裝置的製造方法 |
JP5719560B2 (ja) | 2009-10-21 | 2015-05-20 | 株式会社半導体エネルギー研究所 | 端子構造の作製方法 |
KR20110114325A (ko) | 2010-04-13 | 2011-10-19 | 삼성모바일디스플레이주식회사 | 표시 장치 |
JP5594872B2 (ja) * | 2010-05-06 | 2014-09-24 | 日精株式会社 | 着色繊維強化複合材 |
JP5851875B2 (ja) * | 2012-02-14 | 2016-02-03 | 信越化学工業株式会社 | 光学半導体装置用パッケージの製造方法及び光学半導体装置の製造方法 |
NL2016357B1 (en) | 2016-03-03 | 2017-09-20 | Allotropica Tech Inc | Pre-preg and composite products |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51111879A (en) * | 1975-03-27 | 1976-10-02 | Mitsubishi Gas Chemical Co | Manufacture of metal foillclad preepreg |
FR2516441A1 (fr) * | 1981-11-18 | 1983-05-20 | Spie Batignolles | Procede de fabrication de profiles en resine thermoplastique chargee de fibres, installation pour la mise en oeuvre, profiles obtenus et leur utilisation |
KR900009265A (ko) * | 1988-12-07 | 1990-07-04 | 원본미기재 | 강화 열 가소성 복합체-금속박 적층품의 제조방법 |
JPH04329132A (ja) * | 1991-04-30 | 1992-11-17 | Tonen Corp | ハイブリッドプリプレグ |
TW244340B (zh) * | 1992-07-21 | 1995-04-01 | Akzo Nv |
-
1994
- 1994-11-02 TW TW083110086A patent/TW371285B/zh active
-
1995
- 1995-09-18 WO PCT/EP1995/003652 patent/WO1996009158A1/en not_active Application Discontinuation
- 1995-09-18 KR KR1019970701433A patent/KR970705465A/ko not_active Application Discontinuation
- 1995-09-18 CA CA002200314A patent/CA2200314A1/en not_active Abandoned
- 1995-09-18 MX MX9702059A patent/MX9702059A/es unknown
- 1995-09-18 CN CN95195145A patent/CN1158101A/zh active Pending
- 1995-09-18 AU AU35684/95A patent/AU694564B2/en not_active Ceased
- 1995-09-18 EP EP95932765A patent/EP0782500A1/en not_active Ceased
- 1995-09-18 JP JP8510579A patent/JPH10508720A/ja active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111448043A (zh) * | 2017-12-08 | 2020-07-24 | 日立化成株式会社 | 预浸渍体、层叠板和它们的制造方法、以及印刷线路板和半导体封装体 |
CN111448044A (zh) * | 2017-12-08 | 2020-07-24 | 日立化成株式会社 | 预浸渍体、层叠板、印刷线路板和半导体封装体 |
CN111448043B (zh) * | 2017-12-08 | 2022-05-13 | 昭和电工材料株式会社 | 预浸渍体、层叠板和它们的制造方法、以及印刷线路板和半导体封装体 |
CN109049891A (zh) * | 2018-06-13 | 2018-12-21 | 咸阳天华电子科技有限公司 | 一种高弹性覆铜单向纤维片的制备方法 |
CN109049891B (zh) * | 2018-06-13 | 2020-09-29 | 咸阳天华电子科技有限公司 | 一种高弹性覆铜单向纤维片的制备方法 |
CN109496076A (zh) * | 2018-12-19 | 2019-03-19 | 咸阳天华电子科技有限公司 | 一种单向纤维电路板的制造工艺 |
CN109496076B (zh) * | 2018-12-19 | 2020-12-15 | 咸阳天华电子科技有限公司 | 一种单向纤维电路板的制造工艺 |
CN111688287A (zh) * | 2020-06-14 | 2020-09-22 | 湖南亿润新材料科技有限公司 | 一种环氧树脂半固化片及其生产工艺 |
CN111688287B (zh) * | 2020-06-14 | 2022-06-10 | 湖南亿润新材料科技有限公司 | 一种环氧树脂半固化片及其生产工艺 |
Also Published As
Publication number | Publication date |
---|---|
JPH10508720A (ja) | 1998-08-25 |
MX9702059A (es) | 1997-06-28 |
CA2200314A1 (en) | 1996-03-28 |
EP0782500A1 (en) | 1997-07-09 |
AU3568495A (en) | 1996-04-09 |
AU694564B2 (en) | 1998-07-23 |
KR970705465A (ko) | 1997-10-09 |
TW371285B (en) | 1999-10-01 |
WO1996009158A1 (en) | 1996-03-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1158101A (zh) | 贴箔单取向半固化片及由其制成的印刷线路层压板 | |
AU660463B2 (en) | Method of manufacturing a multilayer printed wire board | |
MXPA97002059A (en) | Preimpregnado material unidirectionally oriented of thin thread and laminar unit for printed wiring board prepared from mi | |
US6016598A (en) | Method of manufacturing a multilayer printed wire board | |
KR100844233B1 (ko) | 이중 짜임 유리 섬유 직물, 및 이 유리 섬유 직물을 사용한프리프레그 및 인쇄 배선판용 기판 | |
US20080311358A1 (en) | Fluorine Resin Laminated Substrate | |
US5496613A (en) | Printed wire boards and method of making same | |
EP0751866B1 (en) | Method of making a ud crossply pwb laminate having one or more inner layers of metal | |
JPH06252555A (ja) | 多層配線基板 | |
EP0700237A1 (en) | Thin core printed wire boards | |
JP2650072B2 (ja) | 多層プリント配線板の製造方法 | |
KR20210012325A (ko) | 회로 기판 제조용 연속 시트의 제조 방법 및 이로부터 제조된 회로 기판 제조용 연속 시트 | |
JPH10303556A (ja) | プリント配線板の製造方法 | |
JP5179326B2 (ja) | フレックスリジッドプリント配線板 | |
KR102242544B1 (ko) | 회로 기판 제조용 연속 시트의 제조 방법 및 이로부터 제조된 회로 기판 제조용 연속 시트 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C01 | Deemed withdrawal of patent application (patent law 1993) | ||
WD01 | Invention patent application deemed withdrawn after publication |