CN115767908A - Manufacturing method of automobile electronic thick copper PCB coil board and PCB - Google Patents

Abstract

The invention relates to a manufacturing method of an automotive electronic thick copper PCB coil board, which comprises the following steps: cutting → inner layer pattern → acid etching → AOI → AOI → brown oxidation → press-fitting → punch hole → PTH → whole plate plating → outer layer pattern → pattern plating → alkali etching → outer layer AOI → light plate test → surface inspection → hole plugging → solder resist printing → character printing → surface treatment → electric measurement → molding → inductance test → voltage withstanding test → FQC → FQA → packaging. The above-mentioned scheme that this application provided provides the standard for the building preparation of multilayer coil board, guarantees to produce smoothly, has improved the coil board qualification rate, has ensured the delivery quality.

Description

Manufacturing method of automobile electronic thick copper PCB coil board and PCB

Technical Field

The invention relates to the technical field of coil plate manufacturing, in particular to a manufacturing method of an automotive electronic thick copper PCB coil plate and the PCB.

Background

With the development of electronic technology, multifunctional integration, light weight, thinness, shortness and smallness have become the mainstream of electronic design. The requirements on the circuit current conduction capability and the current carrying capability of the thick copper foil printed circuit board, namely a power supply PCB, are higher and higher, and meanwhile, new higher requirements on functions of current regulation, voltage transformation, voltage stabilization and the like are provided. The wireless charging plate is characterized in that the thickness of copper on the inner layer and the outer layer is more than or equal to 4oz, the wireless charging plate is mainly applied to products with high reliability, long service life, such as power supplies, automobile electronics and the like, and the wireless charging plate has the basic requirements on high voltage resistance, high current resistance, heat dissipation, voltage transformation, voltage stabilization, rectification and current stabilization. The thick copper plate also has the advantages of heat conduction, dimensional stability, electromagnetic shielding and high-frequency transmission, is different from the conventional PCB manufacturing mode based on the production and application characteristics of a thick copper PCB, and can meet the requirements of customers on high reliability, long service life and stable work of the product only by carrying out targeted control in the PCB design, production and test processes.

Although various thick copper PCB production processes exist in the prior art, the existing thick copper PCB production process has low qualification rate and is difficult to meet the production requirements.

Disclosure of Invention

Therefore, the manufacturing method of the automotive electronic thick copper PCB coil board is needed to solve the problem of low qualified rate of the existing thick copper PCB production process.

The invention provides a manufacturing method of an automotive electronic thick copper PCB coil board, which comprises the following steps:

cutting → inner layer pattern → acid etching → AOI → AOI → brown oxidation → press-fitting → punch hole → PTH → whole plate plating → outer layer pattern → pattern plating → alkali etching → outer layer AOI → light plate test → surface inspection → hole plugging → solder resist printing → character printing → surface treatment → electric measurement → molding → inductance test → voltage withstanding test → FQC → FQA → packaging.

In one embodiment, the cutting process comprises:

baking the plate:

cutting the substrate by using an automatic slitting machine;

and carrying out fillet and edge grinding treatment on the cut substrate, and simultaneously ensuring that the thickness of the substrate is less than 0.6mm.

In one embodiment, after the second AOI process, the steps further include: and punching out the pipe position hole of the drill rivet by using the CCD.

In one embodiment, in the pressing process, the basic thickness after pressing is not greater than a preset value.

In one embodiment, after the drilling process is completed, the method further comprises: and removing the hole wall and the residual drilling dirt by adopting a chemical degumming process.

In one embodiment, after the chemical glue removing process is completed, the method further comprises: and (4) processing the grooves and the spines generated by the degumming process by adopting ultrasonic waves.

In one embodiment, the via copper is ensured to be greater than 25.4um after substrate electroplating in the full-plate electroplating process.

In one embodiment, before the alkaline etching process, the step further comprises: and checking the line width and the line distance on the substrate to ensure that the line width and the line distance on the substrate meet the preset requirements.

In one embodiment, the alkaline etching process comprises: the lead was etched in an alkaline etchant under ammonium copper chloride.

The invention further provides a PCB which is manufactured by the manufacturing method of the automotive electronic thick copper PCB coil board according to any one of the description of the embodiment of the application.

The beneficial effects of the invention include:

the manufacturing method of the automotive electronic thick copper PCB coil board provided by the invention provides a standard for establishing and manufacturing a multilayer coil board, ensures smooth production, improves the qualification rate of the coil board and ensures the delivery quality.

Drawings

Fig. 1 is a schematic flow chart of a manufacturing method of an automotive electronic thick copper PCB coil board according to an embodiment of the present invention.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

As shown in fig. 1, the present application provides a method for manufacturing an automotive electronic thick copper PCB coil board, when the coil board is a multilayer board, the method includes the following steps:

cutting → inner layer pattern → acid etching → AOI → AOI → brown oxidation → press-fitting → punch hole → PTH → whole plate plating → outer layer pattern → pattern plating → alkali etching → outer layer AOI → light plate test → surface inspection → hole plugging → solder resist printing → character printing → surface treatment → electric measurement → molding → inductance test → voltage withstanding test → FQC → FQA → packaging.

When the double-sided board is used, the manufacturing steps are as follows: cutting material → drilling hole → PTH → whole plate electroplating plus plating → outer layer pattern → acid etching → AOI → AOI → optical plate test → surface inspection → plug hole → solder resist printing → character printing → surface treatment → electric measurement → molding → inductance test → FQC → FQA → packaging.

Specifically, the steps in the process specifically include:

cutting: the plate is baked before cutting, the conditions are high TG 180 ℃ 4H and medium TG170 ℃ 4H, an automatic slitting machine is used for cutting, fillets and edges are needed after cutting, and the flash is manually scraped with the plate thickness less than 0.6mm, so that the plate surface is kept clean.

Inner layer pattern: the inner layer must use the CCD film, if the film check does not return to the data room in advance the length data directly, the data of the tubes is measured by the data room before the film is delivered, the deviation with the optical drawing data is required to be within +/-2MIL, the production line can be delivered after the film is qualified, the A/B surface layer of the etched first plate is controlled within 2MIL, the problem of short circuit is solved, the first plate can be produced after OK, the inner layer process must wear gloves with both hands to hold the plate during each post operation, the inner layer process must lightly hold the plate, the plate cannot be held with one hand or bare hand, the core plate is prevented from being wrinkled, the core plate below 0.5mm needs to be connected with a film.

Acid etching: checking and confirming that each liquid medicine parameter and machine parameter can start to manufacture boards within a normal range, a first part must be manufactured firstly, the parameters are controlled through the first part, the line width and the line distance of the first part are +/-10%, the line width and the line distance are ensured to meet the requirements, no residual copper exists, the single side of etching burr control is smaller than 1.5mil, the etching factor is larger than or equal to 2.5, the etching speed is adjusted by the aid of a board edge etching line, a test line is preferably kept at 5-9mil, the copper thickness above 4oz is regulated and etched twice, the upper and lower surfaces are turned over for the second time, the etching speed is adjusted by the aid of the board edge etching line, the first board OK rear side can be developed in batches, all boards must be detected after etching, the film can be removed in batches after OK, the etching is prohibited from being removed after the film is removed, the line width and the line distance are measured by a 50-time mirror, the line width and the board edge etching line width are detected once every 50PNL are produced, a unit scrapped board cannot flow into a board with the requirements of a lower process, the board with a micro resistor, the line width is controlled by 15% or +/-3, and the line width of a large-distance test pattern circuit board is taken as a quasi-accurate distance test pattern for a large-distance test board.

AOI:100% of AOI is passed, the inner layer AOI is scanned twice, and the parameters are set as follows: line width within +/-15%; if all the inner core plates are scrapped, the inner core plates need to be picked out for treatment, and the inner core plates are allowed to go downwards only when the inner core plates are completely good; all plates are forbidden to be repaired, and poor PCS is directly scrapped; tearing off the corresponding layer line. When the overlapped layer exists, the circuit cannot be scrapped in a tearing mode, and the poor plates are matched together for pressing.

Three drilled rivet pipe position holes are drilled by a CCD, the layer deviation is set to be 2mil, the OK plate is fed into a drill room to be matched with the drilled rivet holes, all the rivet holes are drilled by a drilling machine according to data, and when the holes are punched, whether the punched holes enter the unit or not is noticed.

Browning: normally producing according to the browning speed of a thick copper plate, controlling rework, allowing the plate with DCR requirements to be reworked only once, recording rework, and not having poor browning such as scratch, copper exposure, inconsistent color and the like, baking the plate 120C 30min after browning, wearing gloves with two hands to hold the plate when operating at each station of a pressing procedure, not contacting with units in the plate, lightly holding and lightly holding, not allowing the plate to be held by one hand and bare hands, and preventing the core plate from being wrinkled.

And (3) laminating: PP drenches more than 4 hours, can use, need to inspect the quality condition such as brownification wiping before folding in advance, confirms that OK just can fold the board riveting, arranges the board according to the structure, rivets the board mode: two groups of rivets with opposite angles are used in sequence, the core plate layers and the types and the number of P sheets are required to be inspected completely during riveting, the rivets are punched after the requirements are met, and X-RAY is used for inspecting the deviation condition of a riveting layer after riveting (the inspection frequency is less than 20PNL for full inspection, and is more than 20PNL for each drawer, and the requirement is controlled within 3MIL (namely the butterfly PAD has no double image problem); NG board need unpack apart and rivet again, until inspection OK, the rivet requires that the blooming is even, the rivet does not have the deformation, does not have the piece, and the friction problem is noticed to inferior outer layer palmization layer, and the clamp plate form adopts the special form clamp plate of thick copper sheet, 100% roast board after the pressfitting, parameter: middle TG:170 ℃ 4H, high TG: sending 1PNL to each model of each furnace at 180 ℃ 4H to a physical experiment sample to perform thermal shock test, wherein the test conditions are as follows: 288 ℃ 10S 6 times, drilling target holes requires to use an X-ray double-shaft drilling target machine for production, actual target hole expansion and contraction data needs to be marked on one page of an MI drilling table, expansion and contraction values are extremely different from 5mil, and plates need to be grouped and marked obviously.

Drilling: the drilling holes are produced by using a drill bit within drilling and researching II, the quality of the drill bit needs to be fully inspected before the drill bit is used, a white base plate is used as a bottom plate, whether the target holes deviate from the holes or not and the pressing layer deviates from the holes or not is determined by X-ray spot inspection (the inspection frequency is less than 20PNL for full inspection and more than 20PNL for each batch of 20PNL for extraction), a first drilling plate and a first plate sample size are required before batch production: the number of the first plates is less than 12PNL, the number of the first plates is N-6PNL, the number of the first plates is more than or equal to 12PNL, the sample amount is 6PNL, the condition (without deviated holes) of target position holes needs to be fully inspected on the drill first plates, the alignment degree of the first plate inspection drill holes is controlled within +/-3.0mil, the plate edge four-corner slicing couton is used as the standard, the first plate inspection hole is coated with burrs, holes are burned, hole ring pull injury and other items (when semi-metallized holes and metal are coated, no burrs or burrs exist in the holes should be confirmed), the whole drilling belt expansion and contraction data does not exceed 5/10000, when in batch production, the first hand plate bottom plate is sliced to confirm the problems of drill hole thickness, copper ring pull and the like, in the production process, 1PNL is measured on every 4 hand plates according to the requirement of the first plates to inspect the drill hole quality, and the abrasive belt or abrasive paper is used for scraping and reusing.

Copper deposition: during production, all process parameters are required to be confirmed to be within a required range, copper removing and precipitating pretreatment is carried out twice, the plate placing direction for the second time is intersected with the first time, glue removing is carried out twice on the high TG plate, glue removing is carried out once on the common TG plate and the medium TG plate, and the diameter of the plate thickness is larger than 6:1 or the plate with the thickness more than 2.8mm, copper deposition must be carried out twice, backlight control is carried out by more than 9.5 grades, and frames are used for producing plates with the thickness less than 0.3 mm.

Electroplating the whole plate: plating the plate for two periods under the plating conditions: finding a process for determining when the card is produced for the first time. And (3) replacing the clamping position (clamping the opposite side of the first clamping position) in the second period, wherein the requirement of hole copper after the plate is electrified is greater than 25.4um (the requirement of copper thickness is 40um or a copper plate with thickness more than 8 layers is met), the plate needs to be electrified within two hours after copper deposition to be used as the plate, when the plate thickness is less than 0.5mm, edge strips with the height of 5cm are required to be added at the two ends and the middle of the flying bar, the width of the edge strips is required to be greater than 20cm, the PQC (quality control) is carried out after the plate is electrified, and the condition in the hole and triangular scratching are mainly inspected.

Outer layer circuit: the alignment precision is controlled within +/-2mil by using the 10-time mirror for alignment, the line width and line distance are controlled to meet MI requirements, the frames are inserted in the unified direction, the wired and wireless circuits are conveniently checked to be reversed, and the multilayer board is produced by using a CCD automatic exposure machine.

Pattern electroplating: the board plates twice, trades the clamp position (presss from both sides the opposite side of clamp position for the first time for the second time), and the hole copper is according to 40um (multiply wood), can not be less than 35um minimum, and when the thick board is less than 0.5mm board production, need fly to add at two ends of a crust and in the middle of the board height 5cm strake, strake width requirement is greater than 20cm.

And (2) drilling: and (3) drilling holes by using a slotting cutter, paying attention to control the tin surface of the board to be wiped, etching and removing tin of the two first drilling boards to confirm whether the half-edge metalized holes and the metal edge have defects such as excessive copper and defects, and informing the process treatment in time.

Alkaline etching: the method comprises the steps of firstly making a first piece, controlling the line width/line distance to meet the requirement, controlling the etching burr to be less than 1.5mil on a single side, drawing and testing 9 points in a plate to perform micro-resistance testing on the first piece, if the resistance exceeds the standard, etching after OK is confirmed, carrying out batch production after the first piece is qualified, detecting the line width and the line distance once by a 50-time mirror when 20PNL is produced, detecting the plate thickness, the aperture and the surface copper thickness of the first piece and marking the thickness at the corresponding position of MI, detecting whether a metal half hole and a metal edge cover have residual copper or a metal edge cover defect, detecting whether an electroplating clamping point clamps an opposite side, and removing tin after OK is completely detected before tin removal.

AOI: the AOI is required to be performed twice according to the requirement of an inner layer circuit; the method comprises the steps of scanning a board, repairing the board and repairing the board on another machine, wherein MI indicates AOI to perform two processes, the short circuit problem is not allowed to be repaired, and the problem board needs to be scrapped.

Testing a light plate: and (3) sampling 8PNL for each card, taking 8PNL when the sampling rate is less than one card, wherein the qualification rate is less than 90%, the test is completely tested, the test is cancelled more than 90%, the process is carried out by a clamp test, the test content comprises a layer deviation test, and the layer deviation test does not need to be carried out on an OK board, so that the slicing inspection is carried out.

Solder resist printing: the solder mask thickness is required according to MI, the solder mask thickness requirement needs to be clearly noted on MI, a machine is required to print an aluminum sheet for plugging a hole on a plate with the hole plugging requirement, the hole plugging requirement is full, a 20mm frictioning and pushing printing are required to be used on a plate with copper surface larger than 4OZ, oil is added for 50-80ml/kg of boiled oil water for the first time, oil is printed for two times after low-temperature curing, the standing time is controlled to be more than 90min after the first time of silk printing, air bubbles and green oil between lines are controlled to wrinkle, and high-temperature backwashing is avoided for the hole plugging plate as much as possible.

Surface treatment: the thickness of the treatment layer, such as a nickel-gold plate, is thick according to the requirements of customers, and when the surface process is gold immersion, attention needs to be paid to the effect (thick plate) of gold immersion in the hole.

And (3) inductance testing: the multilayer board is done little resistance test, and the resistance requires to be distinguished according to the grade, exceeds within 10% to little resistance, gong vacancy draws black circle in the board, to exceeding 10%, directly the processing of forking, to exceeding 10% and board within 10%, need use manual tester to verify, the test flow: and recording the test result of the first plate of the flying probe low resistance test correction test and comparing with the manual test OK, and then carrying out batch test, wherein in the test, 25PCS is extracted and tested from every 25PNL, and the comparison is carried out manually.

Molding: select the higher board production of fixed precision, adjust down the sword point and play the sword point position, furthest reduces protruding/sunken deviation, gong first gong SET board diagonal angle inside groove earlier during board, measure the harmomegathus data and change the gong area, add the apron gong board, when the gong board folds the board more than two, the board needs to separate white paper gong board between the board, gets rid of the dust behind the gong board, puts into gluey box or puts into the area and separates gluey box, the preface of changeing prevents to wipe the flower, forbids to use the inboard metallized hole to do the locating hole, the gong board mode: firstly routing a small circle at the center of the PCS, then routing semicircles at two sides, and then fixing a row of boards at four peripheral concave joints by using adhesive tapes or pins to finally route the upper and lower edges. And (5) normally milling, and paying attention to the offset control at 0.1mm.

In some embodiments, after the drilling process is complete, the method further comprises: and removing the hole wall and the residual drilling dirt by adopting a chemical degumming process.

In some embodiments, after the chemical degumming process is completed, the method further comprises: and (4) processing the grooves and the spines generated by the degumming process by adopting ultrasonic waves.

The invention also provides a PCB which is characterized by being manufactured by adopting the manufacturing method of the automotive electronic thick copper PCB coil board in any embodiment of the application.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A manufacturing method of an automotive electronic thick copper PCB coil board is characterized by comprising the following steps:

cutting → inner layer pattern → acid etching → AOI → AOI → brown oxidation → press-fitting → punch hole → PTH → whole plate plating → outer layer pattern → pattern plating → alkali etching → outer layer AOI → light plate test → surface inspection → hole plugging → solder resist printing → character printing → surface treatment → electric measurement → molding → inductance test → voltage withstanding test → FQC → FQA → packaging.

2. The manufacturing method of the automotive electronic thick copper PCB coil board according to claim 1, wherein the cutting process comprises the following steps:

baking the plate:

cutting the substrate by using an automatic slitting machine;

and carrying out fillet and edge grinding treatment on the cut substrate, and simultaneously ensuring that the thickness of the substrate is less than 0.6mm.

3. The method for manufacturing an automotive electronics thick copper PCB coil plate according to claim 1, wherein after the second AOI process, the steps further comprise:

and punching out the pipe position hole of the drill rivet by using the CCD.

4. The method for manufacturing an automotive electronic thick copper PCB coil board as claimed in claim 1, wherein in the pressing process, the basic thickness after pressing is ensured not to be larger than a preset value.

5. The method for manufacturing an automotive electronic thick copper PCB coil board according to claim 1, wherein after the drilling process is completed, the method further comprises: and removing the hole wall and the residual drilling dirt by adopting a chemical degumming process.

6. The method for manufacturing an automotive electronics thick copper PCB coil plate as defined in claim 5, wherein after the chemical glue removal process is completed, the method further comprises: and (4) processing the grooves and the spines generated by the degumming process by adopting ultrasonic waves.

7. The method for manufacturing the automotive electronics thick copper PCB coil board as recited in claim 1, wherein in the whole board electroplating process, the substrate electric back hole copper is ensured to be larger than 25.4um.

8. The method for manufacturing an automotive electronics thick copper PCB coil board of claim 1, wherein before the alkaline etching process, the step further comprises:

and checking the line width and the line distance on the substrate to ensure that the line width and the line distance on the substrate meet preset requirements.

9. The method for manufacturing the automotive electronic thick copper PCB coil board according to claim 1, wherein the alkaline etching process comprises: the lead was etched in an alkaline etchant under ammonium copper chloride.

10. A PCB board, wherein the PCB board is manufactured by the method for manufacturing the automotive electronic thick copper PCB coil board according to any one of claims 1 to 9.

Images