CN115003044A - Manufacturing method of PCB, PCB and terminal equipment - Google Patents
Manufacturing method of PCB, PCB and terminal equipment Download PDFInfo
- Publication number
- CN115003044A CN115003044A CN202210843366.XA CN202210843366A CN115003044A CN 115003044 A CN115003044 A CN 115003044A CN 202210843366 A CN202210843366 A CN 202210843366A CN 115003044 A CN115003044 A CN 115003044A
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- copper
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- pcb
- etching
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 64
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 43
- 229910052802 copper Inorganic materials 0.000 claims abstract description 42
- 239000010949 copper Substances 0.000 claims abstract description 42
- 238000005530 etching Methods 0.000 claims abstract description 25
- 238000009713 electroplating Methods 0.000 claims abstract description 18
- 238000004806 packaging method and process Methods 0.000 claims abstract description 15
- 238000007747 plating Methods 0.000 claims abstract description 14
- 238000005553 drilling Methods 0.000 claims abstract description 13
- 238000013461 design Methods 0.000 claims abstract description 12
- 238000005520 cutting process Methods 0.000 claims abstract description 9
- 230000008021 deposition Effects 0.000 claims abstract description 9
- 238000003825 pressing Methods 0.000 claims abstract description 8
- 238000010030 laminating Methods 0.000 claims abstract description 5
- 238000004080 punching Methods 0.000 claims abstract description 4
- 230000008569 process Effects 0.000 claims description 32
- 238000007689 inspection Methods 0.000 claims description 16
- 239000000126 substance Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 7
- 230000008439 repair process Effects 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 4
- 238000006087 Brown hydroboration reaction Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 239000000428 dust Substances 0.000 claims description 3
- 239000004745 nonwoven fabric Substances 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 238000012858 packaging process Methods 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 208000013715 atelosteogenesis type I Diseases 0.000 claims 3
- 238000005516 engineering process Methods 0.000 abstract description 10
- 239000010410 layer Substances 0.000 description 42
- 230000007547 defect Effects 0.000 description 6
- 238000003466 welding Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
- 238000012550 audit Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a manufacturing method of a PCB, the PCB and a terminal device, wherein the method comprises the following steps: cutting; inner layer: manufacturing an inner layer circuit according to design requirements; and (3) laminating: sequentially pressing the manufactured inner core plate and PP together to form a laminated plate; etching the whole plate: etching away surface copper on the laminated board; drilling: punching a laminated board with surface copper etched away according to design requirements; copper deposition and flash plating; outer layer pattern, electroplating and circuit etching; and (6) packaging. The above-mentioned scheme that this application provided, through whole board etching technology etching laminated board top layer basic copper, then adopt heavy copper and flash plating technology to form the electroplating plate that the hole switched on with laminated board layer to layer, whole technology adopts heavy copper again after the laminated board top layer basic copper is fallen in the etching, flash plating technology reduces the thick homogeneity error of copper, thereby the control accuracy that makes the impedance has obtained the promotion, make the outer circuit that can make more thin, more accurate simultaneously, in order to satisfy the outer circuit design demand of 5G product.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a manufacturing method of a PCB, the PCB and terminal equipment.
Background
A Printed Circuit Board (PCB), which is a support for electronic components, plays an important role in various industries, and meanwhile, the continuous progress of electronic information technology also puts higher demands on the performance of the PCB.
With the formal commercial popularization of the 5G network, as a core spare and accessory part PCB of the 5G industry, a great deal of requirements are met with the revolution and breakthrough of PCB factories, because the 5G product has extremely high requirements on the circuit precision of the PCB, the inner layer circuit precision of the conventional PCB manufacturing equipment can basically meet the design requirements, and because the outer layer is influenced by the copper thickness and the uniformity, the precise circuit matched with the equipment capacity is difficult to etch, the breakthrough of the etching capacity is not easy, which is also an imminent problem in the PCB factories.
Disclosure of Invention
Therefore, it is necessary to provide a method for manufacturing a PCB, a PCB and a terminal device, which are directed to the problem of large error in the thickness and uniformity of copper on the outer layer of the existing PCB.
The invention provides a method for manufacturing a PCB, which comprises the following steps:
cutting: cutting the copper-clad plate with double surfaces according to the required size;
inner layer: manufacturing an inner layer circuit according to design requirements;
and (3) laminating: sequentially pressing the manufactured inner core plate and the PP together to form a laminated plate;
etching the whole plate: etching away surface copper on the laminated board;
drilling: according to design requirements, punching holes in the laminated plate with the surface copper etched away;
copper deposition and flash plating: carrying out whole-plate deposition of chemical copper for the laminated plate with the punched hole and without surface copper, carrying out flash plating once to form protective copper, and forming an electroplating plate for communicating the hole with the laminated plate layer by layer;
outer layer pattern, electroplating and line etching: the positive film-feeding process is used for completing the electroplating of the outer layer pattern, and the required pattern is obtained by etching;
packaging: and packaging the finished board according to the packaging standard and warehousing.
In one embodiment, after the inner layer process is completed, the method further comprises: primary AOI; and carrying out automatic optical inspection and repair on the manufactured inner core plate.
In one embodiment, after the AOI process is completed, the method further comprises: browning: and performing brown oxidation treatment on the inner core plate after the inspection is qualified so as to improve the adhesive force of the inner core plate.
In one embodiment, after the drilling process is completed, the method further comprises: and removing the hole wall and the residual drilling dirt by adopting a chemical degumming process.
In one embodiment, after the chemical glue removal process is completed, the method further comprises: and (4) processing the grooves and the spines generated by the degumming process by adopting ultrasonic waves.
In one embodiment, in the pressing step, the surface of the gummosis PP resin layer is ground by using a non-woven fabric brush, so that the surface of the gummosis PP resin layer is flatly covered on the inner core plate.
In one embodiment, after the outer layer patterning, electroplating and line etching processes are completed, the method further comprises:
secondary AOI: and automatically and optically inspecting and repairing the circuit on the electroplating plate.
In one embodiment, prior to the packaging process, the method further comprises: cleaning: removing dust and oxidation on the surface;
and (3) appearance inspection: the substrate appearance was subjected to compliance checking against the customer's original drawing.
The invention further provides a PCB, and at least one circuit layer in the PCB is manufactured by the manufacturing method of the PCB according to any one of the embodiment descriptions of the application.
The invention further provides terminal equipment, and the terminal equipment comprises the PCB board in the embodiment of the application.
The beneficial effects of the invention include:
according to the manufacturing method of the PCB, the base copper on the surface layer of the laminated board is etched through the whole board etching process, then the copper deposition and flash plating process is adopted to form the electroplating board communicated with the laminated board layers, and the copper deposition and flash plating process is adopted to reduce the uniformity error of the copper thickness after the base copper on the surface layer of the laminated board is etched through the whole process, so that the control precision of impedance is improved, and meanwhile, the outer layer can be made into a thinner and more precise circuit to meet the design requirement of the outer layer circuit of a 5G product.
Drawings
Fig. 1 is a schematic flow chart illustrating a method for manufacturing a PCB according to an embodiment of the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless explicitly specified otherwise.
In the present invention, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being permanently connected, detachably connected, or integral; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
As shown in fig. 1, the present application provides a method for manufacturing a PCB, the method comprising the steps of:
step 11: cutting: cutting the double-sided copper-clad plate according to the required size;
step 12: inner layer: manufacturing an inner layer circuit according to design requirements;
step 13: and (3) laminating: sequentially pressing the manufactured inner core plate and the PP together to form a laminated plate;
step 14: etching the whole plate: etching away surface copper on the laminated board;
step 15: drilling: punching a laminated board with surface copper etched away according to design requirements;
step 16: copper deposition and flash plating: carrying out whole-plate chemical copper deposition on the laminated plate with punched holes and without surface copper, carrying out flash plating once to form protective copper, and forming a plated plate which is communicated with the laminated plate layer by layer;
and step 17: outer layer pattern, electroplating and line etching: the positive film-feeding process is used for completing the electroplating of the outer layer pattern, and the required pattern is obtained by etching;
step 18: packaging: and packaging the finished boards according to the packaging standard and warehousing.
Specifically, cutting refers to cutting a copper block, a copper-clad plate, a high-frequency substrate and a prepreg into sizes meeting the requirements; the inner layer is formed by manufacturing inner layer conductive pattern circuits on the copper-clad plate and the high-frequency substrate; the pressing is to press the copper-clad plate, the high-frequency substrate and the prepregs arranged at intervals at high temperature and high pressure to form a pressed plate; then after the full-automatic drilling machine receives the PCB, the production control system automatically guides the production parameters of the type into the equipment to complete the automatic drilling through hole operation of the PCB, the PCB which completes the automatic drilling through hole is transmitted to an X-RAY hole inspection machine, meanwhile, the type data is automatically guided in, the automatic hole inspection is carried out to detect the hole deviation, the hole diameter and the quality condition of the plugged hole, the qualified plate is automatically transmitted to an electroplating workshop, the unqualified product information is input into the production control system, the unqualified product is extracted and placed in an unqualified product area, and a person waiting for line tracing processes the unqualified product; the outer layer pattern refers to an outer layer conductive pattern circuit manufactured on an outer layer copper foil of a laminated board after the board is electrically connected.
The method needs FQC and OQC processes before packaging, wherein the FQC is used for checking whether the appearance, the hole wall copper thickness, the medium layer thickness, the green oil thickness, the inner layer copper thickness and the like of a finished plate meet the requirements of customers. OQC refers to quality inspection/quality audit and control of products before shipment. And the packaging refers to hermetically packaging the finished plates according to the packaging mode and the packaging quantity required by the customer, putting a drying agent and a humidity card, and then delivering.
Adopt above-mentioned technical scheme, etch through whole board etching process and fall pressboard top layer base copper, then adopt heavy copper and flash plating technology to form the electroplating plate that hole and pressboard layer switched on again, whole technology adopts heavy copper again after etching pressboard top layer base copper, flash plating technology reduces the thick homogeneity error of copper to the control accuracy who makes the impedance has obtained the promotion, make the outer circuit that can make more thin, more accurate simultaneously, in order to satisfy the outer circuit design demand of 5G product.
In some embodiments, after the inner layer process is completed, the method further includes: primary AOI; and carrying out automatic optical inspection and repair on the manufactured inner core plate.
AOI (Automated Optical Inspection) is called automatic Optical Inspection in Chinese, and is a device for inspecting common defects encountered in welding production based on Optical principles. AOI is a new emerging testing technology, but the development is rapid, and AOI testing equipment is released by many manufacturers. During automatic detection, the machine automatically scans the PCB through the camera, acquires images, compares the tested welding points with qualified parameters in the database, inspects defects on the PCB through image processing, and displays/marks the defects through a display or an automatic mark for repair personnel to repair. Various different mounting errors and welding defects on the PCB are automatically detected by using a high-speed high-precision vision processing technology. The PCB board can range from a fine pitch high density board to a low density large size board, and can provide an on-line inspection scheme to improve production efficiency, and soldering quality. By using AOI as a defect reduction tool, errors are located and eliminated early in the assembly process to achieve good process control. Early detection of defects will avoid sending a bad board to a subsequent assembly stage, AOI will reduce repair costs and will avoid scrapping an unrepairable circuit board.
In some embodiments, the method further comprises, after the AOI process is completed: browning: and performing brown oxidation treatment on the inner core plate which is qualified after inspection so as to improve the adhesive force of the inner core plate.
Browning in the PCB manufacturing process is to increase the bonding force between the original board and PP, and if browning is not good, the oxidized surface of the PCB is layered, the inner layer is not etched cleanly, and the problems of diffusion plating and the like can be caused. The browning effect has the following three aspects: grease, sundries and the like on the surface are removed, and the cleanness of the board surface is ensured; after the browning, a layer of uniform fluff is arranged on the copper surface of the substrate, so that the binding force between the substrate and PP is increased, and the problems of layering, board explosion and the like are avoided; pressing the brown oxide layer within a certain time to prevent the brown oxide layer from absorbing water to cause plate explosion.
In some embodiments, the method further comprises, after the drilling process is completed: and removing the hole wall and the residual drilling dirt by adopting a chemical degumming process.
In some embodiments, after the chemical glue removal process is completed, the method further comprises: and (4) processing the grooves and the sharp spines generated by the glue removing process by adopting ultrasonic waves.
In some embodiments, in the pressing step in the present application, the surface of the gummy PP resin layer is ground by using a non-woven fabric brush, so that the surface of the gummy PP resin layer is flatly covered on the inner core board.
In some embodiments, after the outer layer patterning, electroplating and line etching processes are completed, the method further comprises:
secondary AOI: and automatically and optically inspecting and repairing the circuit on the electroplating plate.
In some embodiments, the present application precedes the packaging process, the method further comprising: cleaning: removing dust and oxidation on the surface; and (3) appearance inspection: the substrate appearance was subjected to compliance checking against the customer's original drawing.
The application further provides a PCB, and at least one circuit layer in the PCB is manufactured by the manufacturing method of the PCB according to any one of the descriptions of the embodiment of the application.
The application also provides a terminal device comprising the PCB as in the application. Illustratively, the terminal device may be any of various types of computer system devices that are mobile or portable and that perform wireless communications. Specifically, the terminal device may be a mobile phone or a smart phone (e.g., an iPhone-based phone, an Android-based phone), a Portable game device (e.g., a Nintendo DS, a PlayStation Portable, a game Advance, an iPhone-based phone), a tablet computer, a Portable internet device, a data storage device, etc., and the terminal device may also be other wearable devices (e.g., a smart band, a smart watch, AR glasses, VR glasses, etc.).
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A manufacturing method of a PCB board is characterized by comprising the following steps:
cutting: cutting the copper-clad plate with double surfaces according to the required size;
inner layer: manufacturing an inner layer circuit according to design requirements;
and (3) laminating: sequentially pressing the manufactured inner core plate and PP together to form a laminated plate;
etching the whole plate: etching away surface copper on the laminated board;
drilling: punching a laminated board with surface copper etched away according to design requirements;
copper deposition and flash plating: carrying out whole-plate chemical copper deposition on the laminated plate with punched holes and without surface copper, carrying out flash plating once to form protective copper, and forming a plated plate which is communicated with the laminated plate layer by layer;
outer layer pattern, electroplating and line etching: the positive film-feeding process is used for completing the electroplating of the outer layer pattern, and the required pattern is obtained by etching;
and (3) packaging: and packaging the finished board according to the packaging standard and warehousing.
2. The method for fabricating a PCB panel according to claim 1, wherein after the inner layer process is completed, the method further comprises:
primary AOI; and carrying out automatic optical inspection and repair on the manufactured inner core plate.
3. The method of claim 2, wherein after the AOI process is completed, the method further comprises:
browning: and performing brown oxidation treatment on the inner core plate after the inspection is qualified so as to improve the adhesive force of the inner core plate.
4. The method of claim 1, wherein after the drilling process is completed, the method further comprises:
and removing the hole wall and the residual drilling dirt by adopting a chemical degumming process.
5. The method of claim 4, wherein after the chemical glue removal process is completed, the method further comprises:
and (4) processing the grooves and the spines generated by the degumming process by adopting ultrasonic waves.
6. The method for manufacturing a PCB of claim 1, wherein in the laminating step, the surface of the gummy PP resin layer is ground by a non-woven fabric brush, so that the surface of the gummy PP resin layer is flatly covered on the inner core board.
7. The method of claim 1, wherein after the outer layer patterning, electroplating and line etching processes are completed, the method further comprises:
and (3) secondary AOI: and (4) carrying out automatic optical inspection and repair on the circuit on the electroplating plate.
8. The method of claim 1, wherein prior to the packaging process, the method further comprises:
cleaning: removing dust and oxidation on the surface;
and (3) appearance inspection: the substrate appearance was subjected to compliance checking against the customer's original drawing.
9. A PCB board, characterized in that at least one circuit layer in the PCB board is manufactured by the manufacturing method of the PCB board according to any one of claims 1 to 8.
10. A terminal device characterized in that it comprises a PCB board according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210843366.XA CN115003044A (en) | 2022-07-18 | 2022-07-18 | Manufacturing method of PCB, PCB and terminal equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210843366.XA CN115003044A (en) | 2022-07-18 | 2022-07-18 | Manufacturing method of PCB, PCB and terminal equipment |
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| Publication Number | Publication Date |
|---|---|
| CN115003044A true CN115003044A (en) | 2022-09-02 |
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|---|---|---|---|
| CN202210843366.XA Pending CN115003044A (en) | 2022-07-18 | 2022-07-18 | Manufacturing method of PCB, PCB and terminal equipment |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103491732A (en) * | 2013-10-08 | 2014-01-01 | 华进半导体封装先导技术研发中心有限公司 | Method for manufacturing circuit board layer-adding structure |
| CN108718480A (en) * | 2018-06-07 | 2018-10-30 | 江门荣信电路板有限公司 | A kind of ectonexine 6OZ super-thick copper pcb boards and preparation method thereof |
| WO2021164203A1 (en) * | 2020-02-17 | 2021-08-26 | 广东科翔电子科技股份有限公司 | Preparation method for high-precision communication optical module printed circuit board |
-
2022
- 2022-07-18 CN CN202210843366.XA patent/CN115003044A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103491732A (en) * | 2013-10-08 | 2014-01-01 | 华进半导体封装先导技术研发中心有限公司 | Method for manufacturing circuit board layer-adding structure |
| CN108718480A (en) * | 2018-06-07 | 2018-10-30 | 江门荣信电路板有限公司 | A kind of ectonexine 6OZ super-thick copper pcb boards and preparation method thereof |
| WO2021164203A1 (en) * | 2020-02-17 | 2021-08-26 | 广东科翔电子科技股份有限公司 | Preparation method for high-precision communication optical module printed circuit board |
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